LIGITEK LUR9S53 Surface mount tape and reel Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SURFACE MOUNT TAPE AND REEL
Pb
Lead-Free Parts
LUR9S53
DATA SHEET
DOC. NO
: QW0905-LUR9S53
REV.
:
DATE
: 25 - Dec. - 2006
A
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR9S53
Page 1/6
Package Dimensions
1.3
3.0
1.4
2.0
2.7
1.3
0.7
+
0.7
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
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Page 2/6
PART NO. LUR9S53
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
UR
Forward Current
IF
40
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
120
mA
Power Dissipation
PD
120
mW
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
COLOR
PART NO
MATERIAL
Emitted
LUR9S53
GaAlAs
Red
Peak
wave
length
λPnm
Spectral Forward
voltage
halfwidth
@20mA(V)
△λ nm
@20mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Min. Max. Min. Typ.
Lens
Water Clear
Luminous
intensity
660
20
1.5
2.4
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
80
140
130
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Page3/6
PART NO. LUR9S53
Typical Electro-Optical Characteristics Curve
UR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1
01
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
1.2
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
650
700
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
600
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
750
100
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PART NO. LUR9S53
Page 4/6
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245± 5℃ within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
3. LEAD Reflow Solder
Temp.
(℃)
240
Rising
+5℃/sec
Cooling
-5℃ /sec
Preheat
150
120
60 ~ 120 sec
Time
5sec
4. PB-Free Reflow Solder
1~5° C/sec
Preheat
180~200 ° C
1~5° C/sec
260°C MaX.
10sec.Max
Above 220 ° C
60 sec.Max.
120 sec.Max.
Note: 1.Wave solder and reflow soldering should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
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PART NO. LUR9S53
Page 5/6
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%,
they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR9S53
Page 6/6
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.IR-Reflow In-Board, 2 Times
2.Ta=65 ℃±5℃
3.RH=90 %~95%
4.t=1000hrs ±2hrs
MIL-STD-202F:103B
JIS C 7021: B-11
Endurance
Test
Thermal Shock Test
Solderability Test
Environmental
Test
Temperature
Cycling
Solderability Test
1.IR-Reflow In-Board,2 times
2.Ta=105 ℃±5 ℃&
-40 ℃±5 ℃
(10min) (10min)
3.total 10 cycles
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Immersion rate 25 ±2.5mm/sec
4.Immersion rate 25 ±2.5mm/sec
5.Coverage ≧95% of the dipped surface
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
1.105 ℃ ~ 25 ℃ ~ 55 ℃ ~ 25℃
30mins 5mins 30mins 5mins
2.10 Cyeles
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
Ramp-up rate(183 ℃ to Peak) +3 ℃ second max
Temp. maintain at 125( ±25) ℃ 120 seconds max
Temp. maintain above 183 ℃ 60-150 seconds
Peak temperature range 235 ℃+5-0 ℃
Time within 5 ℃ of actual Peak Temperature(tp)
10-30 seconds
Ramp-down rate +6 ℃/second max
MIL-STD-750D:2031.2
J-STD-020
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