dsPIC33FJ12GP201/202 Data Sheet High-Performance, 16-Bit Digital Signal Controllers © 2007 Microchip Technology Inc. Preliminary DS70264B Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS70264B-page ii Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 High-Performance, 16-Bit Digital Signal Controllers Operating Range: Digital I/O: • Up to 40 MIPS operation (at 3.0-3.6V): - Industrial temperature range (-40°C to +85°C) - Extended temperature range (-40°C to +125°C) • • • • • • • High-Performance DSC CPU: • • • • • • • • • • • • • • • Modified Harvard architecture C compiler optimized instruction set 16-bit wide data path 24-bit wide instructions Linear program memory addressing up to 4M instruction words Linear data memory addressing up to 64 Kbytes 83 base instructions, mostly 1 word/1 cycle Sixteen 16-bit general purpose registers Two 40-bit accumulators with rounding and saturation options Flexible and powerful addressing modes: - Indirect - Modulo - Bit-Reversed Software stack 16 x 16 fractional/integer multiply operations 32/16 and 16/16 divide operations Single-cycle multiply and accumulate: - Accumulator write back for DSP operations - Dual data fetch Up to ±16-bit shifts for up to 40-bit data Interrupt Controller: • • • • • • 5-cycle latency 118 interrupt vectors Up to 21 available interrupt sources Up to 3 external interrupts 7 programmable priority levels 4 processor exceptions Peripheral Pin Select Functionality Up to 21 programmable digital I/O pins Wake-up/interrupt-on-change for up to 21 pins Output pins can drive from 3.0V to 3.6V Up to 5V output with open drain configuration All digital input pins are 5V tolerant 4 mA sink on all I/O pins System Management: • Flexible clock options: - External, crystal, resonator, internal RC - Fully integrated Phase-Locked Loop (PLL) - Extremely low jitter PLL • Power-up Timer • Oscillator Start-up Timer/Stabilizer • Watchdog Timer with its own RC oscillator • Fail-Safe Clock Monitor • Reset by multiple sources Power Management: • On-chip 2.5V voltage regulator • Switch between clock sources in real time • Idle, Sleep and Doze modes with fast wake-up Timers/Capture/Compare: • Timer/Counters, up to three 16-bit timers: - Can pair up to make one 32-bit timer - 1 timer runs as Real-Time Clock with external 32.768 kHz oscillator - Programmable prescaler • Input Capture (up to 4 channels): - Capture on up, down or both edges - 16-bit capture input functions - 4-deep FIFO on each capture • Output Compare (up to 2 channels): - Single or Dual 16-Bit Compare mode - 16-bit Glitchless PWM Mode On-Chip Flash and SRAM: • Flash program memory (12 Kbytes) • Data SRAM (1024 bytes) • Boot and General Security for Program Flash © 2007 Microchip Technology Inc. Preliminary DS70264B-page 1 dsPIC33FJ12GP201/202 Communication Modules: Analog-to-Digital Converters (ADCs): • 4-wire SPI: - Framing supports I/O interface to simple codecs - Supports 8-bit and 16-bit data - Supports all serial clock formats and sampling modes • I2C™: - Full Multi-Master Slave mode support - 7-bit and 10-bit addressing - Bus collision detection and arbitration - Integrated signal conditioning - Slave address masking • UART: - Interrupt on address bit detect - Interrupt on UART error - Wake-up on Start bit from Sleep mode - 4 character TX and RX FIFO buffers - LIN bus support - IrDA® encoding and decoding in hardware - High-Speed Baud mode - Hardware Flow Control with CTS and RTS • 10-bit, 1.1 Msps or 12-bit, 500 Ksps conversion: - 2 and 4 simultaneous samples (10-bit ADC) - Up to 10 input channels with auto-scanning - Conversion start can be manual or synchronized with 1 of 4 trigger sources - Conversion possible in Sleep mode - ±2 LSb max integral nonlinearity - ±1 LSb max differential nonlinearity DS70264B-page 2 CMOS Flash Technology: • • • • • Low-power, high-speed Flash technology Fully static design 3.3V (±10%) operating voltage Industrial and extended temperature Low power consumption Packaging: • 18-pin SDIP/SOIC • 28-pin SDIP/SOIC/QFN Note: Preliminary See the device variant tables for exact peripheral features per device. © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 dsPIC33FJ12GP201/202 Product Families The device names, pin counts, memory sizes and peripheral availability of each family are listed below, followed by their pinout diagrams. dsPIC33FJ12GP201/202 CONTROLLER FAMILIES RAM (Kbyte) Remappable Pins 16-bit Timer Input Capture Output Compare Std. PWM UART SPI 10-Bit/12-Bit ADC I2C™ I/O Pins (Max) dsPIC33FJ12GP201 18 12 1 8 3(1) 4 2 1 1 1 ADC, 6 ch 1 13 SDIP SOIC dsPIC33FJ12GP202 28 12 1 16 3(1) 4 2 1 1 1 ADC, 10 ch 1 21 SDIP SOIC QFN Note 1: Packages Device Program Flash Memory (Kbyte) Remappable Peripherals Pins TABLE 1: Only 2 out of 3 timers are remappable. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 3 dsPIC33FJ12GP201/202 dsPIC33FJ12GP201 18-Pin SDIP/SOIC Package Diagram 18-PIN SDIP, SOIC 1 18 VDD PGD2/EMUD2/AN0/VREF+/CN2/RA0 2 17 VSS PGC2/EMUC2/AN1/VREF-/CN3/RA1 3 PGD1/EMUD1/AN2/RP0/CN4/RB0 4 PGC1/EMUC1/AN3/RP1/CN5/RB1 5 OSCI/CLKI/CN30/RA2 6 OSCO/CLKO/CN29/RA3 7 PGD3/EMUD3/SOSCI/RP4/CN1/RB4 8 PGC3/EMUC3/SOSCO/T1CK/CN0/RA4 9 dsPIC33FJ12GP201 MCLR 16 AN6/RP15/CN11/RB15 15 AN7/RP14/CN12/RB14 14 VDDCORE 13 VSS 12 SCL1/RP9/CN21/RB9 11 SDA1/RP8/CN22/RB8 10 INT0/RP7/CN23/RB7 Pin Diagrams dsPIC33FJ12GP202 28-Pin SDIP/SOIC Package Diagram 28-PIN SDIP, SOIC 28 AVDD 2 27 AV ss 3 26 AN6/RP15/CN11/RB15 PGD1/EMUD1/AN2/RP0/CN4/RB0 4 25 AN7/RP14/CN12/RB14 PGC1/EMUC1/AN3/RP1/CN5/RB1 5 24 AN8/RP13/CN13/RB13 AN4/RP2/CN6/RB2 6 MCLR PGC2/EMUC2/AN1/VREF-/CN3/RA1 1 AN5/RP3/CN7/RB3 7 Vss 8 OSCI/CLKI/CN30/RA2 9 dsPIC33FJ12GP202 DS70264B-page 4 PGD2/EMUD2/AN0/VREF+/CN2/RA0 23 AN9/RP12/CN14/RB12 22 TMS/RP11/CN15/RB11 21 TDI/RP10/CN16/RB10 20 VDDCORE OSCO/CLKO/CN29/RA3 10 19 Vss PGD3/EMUD3/SOSC/RP4/CN1/RB4 11 18 TDO/SDA1/RP9/CN21/RB9 PGC3/EMUC3/SOSCO/T1CK/CN0/RA4 12 17 TCK/SCL1/RP8/CN22/RB8 VDD 13 16 INT0/RP7/CN23/RB7 ASDA1/RP5/CN27/RB5 14 15 ASCL1/RP6/CN24/RB6 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 dsPIC33FJ12GP202 28-Pin QFN Package Diagram MCLR AVDD AVSS AN6/RP15/CN11/RB15 AN7/RP14/CN12/RB14 28 PGD2/EMUD2/AN0/VREF+/CN2/RA0 PGC2/EMUC2/AN1/VREF-/CN3/RA1 28-Pin QFN 6x6mm 27 26 25 24 23 22 PGD1/EMUD1/AN2/RP0/CN4/RB0 1 21 AN8/RP13/CN13/RB13 PGC1/EMUC1/AN3/RP1/CN5/RB1 2 20 AN9/RP12/CN14/RB12 AN4/RP2/CN6/RB2 3 19 TMS/RP11/CN15/RB11 AN5/RP3/CN7/RB3 4 18 TDI/RP10/CN16/RB10 dsPIC33FJ12GP202 VSS OSCO/CLKO/CN29/RA3 7 15 TDO/SDA1/RP9/CN21/RB9 © 2007 Microchip Technology Inc. 9 10 VDD 8 11 12 13 14 TCK/SCL1/RP8/CN22/RB8 16 INT0/RP7/CN23/RB7 6 ASCL1/RP6/CN24/RB6 VDDCORE ASDA1/RP5/CN27/RB5 17 PGC3/EMUC3/SOSCO/T1CK/CN0/RA4 5 OSCI/CLKI/CN30/RA2 PGD3/EMUD3/SOSCI/RP4/CN1/RB4 VSS Preliminary DS70264B-page 5 dsPIC33FJ12GP201/202 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 7 2.0 CPU ............................................................................................................................................................................................ 11 3.0 Memory Organization ................................................................................................................................................................. 23 4.0 Flash Program Memory .............................................................................................................................................................. 47 5.0 Resets ....................................................................................................................................................................................... 53 6.0 Interrupt Controller ..................................................................................................................................................................... 59 7.0 Oscillator Configuration .............................................................................................................................................................. 87 8.0 Power-Saving Features .............................................................................................................................................................. 97 9.0 I/O Ports ..................................................................................................................................................................................... 99 10.0 Timer1 ...................................................................................................................................................................................... 119 11.0 Timer2/3 Feature...................................................................................................................................................................... 121 12.0 Input Capture............................................................................................................................................................................ 127 13.0 Output Compare ....................................................................................................................................................................... 129 14.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 135 15.0 Inter-Integrated Circuit (I2C) ..................................................................................................................................................... 143 16.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 153 17.0 10-bit/12-bit Analog-to-Digital Converter (ADC) ....................................................................................................................... 161 18.0 Special Features ...................................................................................................................................................................... 173 19.0 Instruction Set Summary .......................................................................................................................................................... 179 20.0 Development Support............................................................................................................................................................... 187 21.0 Electrical Characteristics .......................................................................................................................................................... 191 22.0 Packaging Information.............................................................................................................................................................. 225 Appendix A: Revision History............................................................................................................................................................. 231 Index ................................................................................................................................................................................................. 233 The Microchip Web Site ..................................................................................................................................................................... 237 Customer Change Notification Service .............................................................................................................................................. 237 Customer Support .............................................................................................................................................................................. 237 Reader Response .............................................................................................................................................................................. 238 Product Identification System............................................................................................................................................................. 239 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS70264B-page 6 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 1.0 Note: DEVICE OVERVIEW This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. This document contains device specific information for the dsPIC33FJ12GP201/202 Digital Signal Controller (DSC) devices. The dsPIC33F devices contain extensive Digital Signal Processor (DSP) functionality with a high performance 16-bit microcontroller (MCU) architecture. Figure 1-1 shows a general block diagram of the core and peripheral modules in the dsPIC33FJ12GP201/202 family of devices. Table 1-1 lists the functions of the various pins shown in the pinout diagrams. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 7 dsPIC33FJ12GP201/202 FIGURE 1-1: dsPIC33FJ12GP201/202 BLOCK DIAGRAM PSV & Table Data Access Control Block Y Data Bus X Data Bus Interrupt Controller 16 8 PORTA 16 16 16 Data Latch Data Latch X RAM Y RAM Address Latch Address Latch 23 PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic 23 PORTB 16 23 16 16 Remappable Pins Address Generator Units Address Latch Program Memory EA MUX Address Bus Data Latch ROM Latch 24 Instruction Reg Control Signals to Various Blocks Timing Generation FRC/LPRC Oscillators Precision Band Gap Reference Voltage Regulator VDDCORE/VCAP 16 DSP Engine Power-up Timer Divide Support 16 x 16 W Register Array 16 Oscillator Start-up Timer Power-on Reset 16-bit ALU Watchdog Timer 16 Brown-out Reset VDD, VSS Timers 1-3 IC1,2,7,8 Note: Literal Data Instruction Decode & Control OSC2/CLKO OSC1/CLKI 16 16 MCLR UART1 ADC1 CNx I2C1 OC/ PWM1-2 Not all pins or features are implemented on all device pinout configurations. See pinout diagrams for the specific pins and features on each device. DS70264B-page 8 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 1-1: PINOUT I/O DESCRIPTIONS Pin Type Buffer Type AN0-AN9 I Analog CLKI CLKO I O ST/CMOS External clock source input. Always associated with OSC1 pin function. — Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always associated with OSC2 pin function. OSC1 OSC2 I I/O ST/CMOS Oscillator crystal input. ST buffer when configured in RC mode; CMOS — otherwise. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. SOSCI SOSCO I O ST/CMOS 32.768 kHz low-power oscillator crystal input; CMOS otherwise. — 32.768 kHz low-power oscillator crystal output. CN0-CN7 CN11-CN15 CN21-CN24 CN27 CN29-CN30 I ST Change notification inputs. Can be software programmed for internal weak pull-ups on all inputs. IC0-IC1 IC7-IC8 I ST Capture inputs 1/2 Capture inputs 7/8 OCFA OC1-OC2 I O ST — Compare Fault A input (for Compare Channels 1 and 2). Compare outputs 1 through 2. INT0 INT1 INT2 I I I ST ST ST External interrupt 0. External interrupt 1. External interrupt 2. RA0-RA4 I/O ST PORTA is a bidirectional I/O port. RB0-RB15 I/O ST PORTB is a bidirectional I/O port. T1CK T2CK T3CK I I I ST ST ST Timer1 external clock input. Timer2 external clock input. Timer3 external clock input. U1CTS U1RTS U1RX U1TX I O I O ST — ST — UART1 clear to send. UART1 ready to send. UART1 receive. UART1 transmit. SCK1 SDI1 SDO1 SS1 I/O I O I/O ST ST — ST Synchronous serial clock input/output for SPI1. SPI1 data in. SPI1 data out. SPI1 slave synchronization or frame pulse I/O. SCL1 SDA1 ASCL1 ASDA1 I/O I/O I/O I/O ST ST ST ST Synchronous serial clock input/output for I2C1. Synchronous serial data input/output for I2C1. Alternate synchronous serial clock input/output for I2C1. Alternate synchronous serial data input/output for I2C1. TMS TCK TDI TDO I I I O ST ST ST — JTAG Test mode select pin. JTAG test clock input pin. JTAG test data input pin. JTAG test data output pin. PGD1/EMUD1 PGC1/EMUC1 PGD2/EMUD2 PGC2/EMUC2 PGD3/EMUD3 PGC3/EMUC3 I/O I I/O I I/O I ST ST ST ST ST ST Data I/O pin for programming/debugging communication channel 1. Clock input pin for programming/debugging communication channel 1. Data I/O pin for programming/debugging communication channel 2. Clock input pin for programming/debugging communication channel 2. Data I/O pin for programming/debugging communication channel 3. Clock input pin for programming/debugging communication channel 3. Pin Name Description Analog input channels. Legend: CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels © 2007 Microchip Technology Inc. Analog = Analog input O = Output Preliminary P = Power I = Input DS70264B-page 9 dsPIC33FJ12GP201/202 TABLE 1-1: Pin Name PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Type Buffer Type Description VDDCORE P — CPU logic filter capacitor connection. VSS P — Ground reference for logic and I/O pins. VREF+ I Analog Analog voltage reference (high) input. VREF- I Analog Analog voltage reference (low) input. AVDD P P Positive supply for analog modules. MCLR I/P ST Master Clear (Reset) input. This pin is an active-low Reset to the device. AVSS P P Ground reference for analog modules. VDD P — Positive supply for peripheral logic and I/O pins. Legend: CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels DS70264B-page 10 Analog = Analog input O = Output Preliminary P = Power I = Input © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 2.0 Note: CPU This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The dsPIC33FJ12GP201/202 CPU module has a 16-bit (data) modified Harvard architecture with an enhanced instruction set, including significant support for DSP. The CPU has a 24-bit instruction word with a variable length opcode field. The Program Counter (PC) is 23 bits wide and addresses up to 4M x 24 bits of user program memory space. The actual amount of program memory implemented varies by device. A single-cycle instruction prefetch mechanism is used to help maintain throughput and provides predictable execution. All instructions execute in a single cycle, with the exception of instructions that change the program flow, the double-word move (MOV.D) instruction and the table instructions. Overhead-free program loop constructs are supported using the DO and REPEAT instructions, both of which are interruptible at any point. The dsPIC33FJ12GP201/202 devices have sixteen, 16-bit working registers in the programmer’s model. Each of the working registers can serve as a data, address or address offset register. The 16th working register (W15) operates as a software Stack Pointer (SP) for interrupts and calls. The dsPIC33FJ12GP201/202 instruction set has two classes of instructions: MCU and DSP. These two instruction classes are seamlessly integrated into a single CPU. The instruction set includes many addressing modes and is designed for optimum C compiler efficiency. For most instructions, the dsPIC33FJ12GP201/202 is capable of executing a data (or program data) memory read, a working register (data) read, a data memory write and a program (instruction) memory read per instruction cycle. As a result, three parameter instructions can be supported, allowing A + B = C operations to be executed in a single cycle. A block diagram of the CPU is shown in Figure 2-1. The programmer’s model for the dsPIC33FJ12GP201/202 is shown in Figure 2-2. 2.1 Data Addressing Overview The data space can be addressed as 32K words or 64 Kbytes and is split into two blocks, referred to as X and Y data memory. Each memory block has its own independent Address Generation Unit (AGU). The MCU class of instructions operates solely through the X memory AGU, which accesses the entire memory map as one linear data space. Certain DSP instructions operate © 2007 Microchip Technology Inc. through the X and Y AGUs to support dual operand reads, which splits the data address space into two parts. The X and Y data space boundary is device-specific. Overhead-free circular buffers (Modulo Addressing mode) are supported in both X and Y address spaces. The Modulo Addressing removes the software boundary checking overhead for DSP algorithms. Furthermore, the X AGU circular addressing can be used with any of the MCU class of instructions. The X AGU also supports Bit-Reversed Addressing to greatly simplify input or output data reordering for radix-2 FFT algorithms. The upper 32 Kbytes of the data space memory map can optionally be mapped into program space at any 16K program word boundary defined by the 8-bit Program Space Visibility Page (PSVPAG) register. The program to data space mapping feature lets any instruction access program space as if it were data space. 2.2 DSP Engine Overview The DSP engine features a high-speed 17-bit by 17-bit multiplier, a 40-bit ALU, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shifter. The barrel shifter is capable of shifting a 40-bit value up to 16 bits right or left, in a single cycle. The DSP instructions operate seamlessly with all other instructions and have been designed for optimal real-time performance. The MAC instruction and other associated instructions can concurrently fetch two data operands from memory while multiplying two W registers and accumulating and optionally saturating the result in the same cycle. This instruction functionality requires that the RAM data space be split for these instructions and linear for all others. Data space partitioning is achieved in a transparent and flexible manner through dedicating certain working registers to each address space. 2.3 Special MCU Features The dsPIC33FJ12GP201/202 features a 17-bit by 17-bit single-cycle multiplier that is shared by both the MCU ALU and DSP engine. The multiplier can perform signed, unsigned and mixed-sign multiplication. Using a 17-bit by 17-bit multiplier for 16-bit by 16-bit multiplication not only allows you to perform mixed-sign multiplication, it also achieves accurate results for special operations, such as (-1.0) x (-1.0). The dsPIC33FJ12GP201/202 supports 16/16 and 32/16 divide operations, both fractional and integer. All divide instructions are iterative operations. They must be executed within a REPEAT loop, resulting in a total execution time of 19 instruction cycles. The divide operation can be interrupted during any of those 19 cycles without loss of data. A 40-bit barrel shifter is used to perform up to a 16-bit left or right shift in a single cycle. The barrel shifter can be used by both MCU and DSP instructions. Preliminary DS70264B-page 11 dsPIC33FJ12GP201/202 FIGURE 2-1: dsPIC33FJ12GP201/202 CPU CORE BLOCK DIAGRAM PSV & Table Data Access Control Block Y Data Bus X Data Bus Interrupt Controller 8 16 23 23 PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic 16 16 16 Data Latch Data Latch X RAM Y RAM Address Latch Address Latch 23 16 16 16 Address Generator Units Address Latch Program Memory EA MUX Address Bus Data Latch ROM Latch 24 Control Signals to Various Blocks Instruction Reg Literal Data Instruction Decode & Control 16 16 16 DSP Engine Divide Support 16 x 16 W Register Array 16 16-bit ALU 16 To Peripheral Modules DS70264B-page 12 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 FIGURE 2-2: dsPIC33FJ12GP201/202 PROGRAMMER’S MODEL D15 D0 W0/WREG PUSH.S Shadow W1 DO Shadow W2 W3 Legend W4 DSP Operand Registers W5 W6 W7 Working Registers W8 W9 DSP Address Registers W10 W11 W12/DSP Offset W13/DSP Write Back W14/Frame Pointer W15/Stack Pointer SPLIM AD39 Stack Pointer Limit Register AD15 AD31 AD0 ACCA DSP Accumulators ACCB PC22 PC0 Program Counter 0 0 7 TBLPAG Data Table Page Address 7 0 PSVPAG Program Space Visibility Page Address 15 0 RCOUNT REPEAT Loop Counter 15 0 DCOUNT DO Loop Counter 22 0 DOSTART DO Loop Start Address DOEND DO Loop End Address 22 15 0 Core Configuration Register CORCON OA OB SA SB OAB SAB DA SRH © 2007 Microchip Technology Inc. DC IPL2 IPL1 IPL0 RA N OV Z C STATUS Register SRL Preliminary DS70264B-page 13 dsPIC33FJ12GP201/202 2.4 CPU Control Registers CPU control registers include: • SR: CPU Status Register • CORCON: CORE Control Register REGISTER 2-1: SR: CPU STATUS REGISTER R-0 R-0 R/C-0 R/C-0 R-0 R/C-0 R -0 R/W-0 OA OB SA(1) SB(1) OAB SAB DA DC bit 15 bit 8 R/W-0(2) R/W-0(3) R/W-0(3) IPL<2:0>(2) R-0 R/W-0 R/W-0 R/W-0 R/W-0 RA N OV Z C bit 7 bit 0 Legend: C = Clear only bit R = Readable bit U = Unimplemented bit, read as ‘0’ S = Set only bit W = Writable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 OA: Accumulator A Overflow Status bit 1 = Accumulator A overflowed 0 = Accumulator A has not overflowed bit 14 OB: Accumulator B Overflow Status bit 1 = Accumulator B overflowed 0 = Accumulator B has not overflowed bit 13 SA: Accumulator A Saturation ‘Sticky’ Status bit(1) 1 = Accumulator A is saturated or has been saturated at some time 0 = Accumulator A is not saturated bit 12 SB: Accumulator B Saturation ‘Sticky’ Status bit(1) 1 = Accumulator B is saturated or has been saturated at some time 0 = Accumulator B is not saturated bit 11 OAB: OA || OB Combined Accumulator Overflow Status bit 1 = Accumulators A or B have overflowed 0 = Neither Accumulators A or B have overflowed bit 10 SAB: SA || SB Combined Accumulator ‘Sticky’ Status bit 1 = Accumulators A or B are saturated or have been saturated at some time in the past 0 = Neither Accumulator A or B are saturated bit 9 DA: DO Loop Active bit 1 = DO loop in progress 0 = DO loop not in progress Note: Note 1: 2: 3: This bit can be read or cleared (not set). Clearing this bit will clear SA and SB. This bit can be read or cleared (not set). The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3> = 1. The IPL<2:0> Status bits are read only when NSTDIS = 1 (INTCON1<15>). DS70264B-page 14 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 2-1: SR: CPU STATUS REGISTER (CONTINUED) bit 8 DC: MCU ALU Half Carry/Borrow bit 1 = A carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized data) of the result occurred 0 = No carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized data) of the result occurred bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2) 111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled 110 = CPU Interrupt Priority Level is 6 (14) 101 = CPU Interrupt Priority Level is 5 (13) 100 = CPU Interrupt Priority Level is 4 (12) 011 = CPU Interrupt Priority Level is 3 (11) 010 = CPU Interrupt Priority Level is 2 (10) 001 = CPU Interrupt Priority Level is 1 (9) 000 = CPU Interrupt Priority Level is 0 (8) bit 4 RA: REPEAT Loop Active bit 1 = REPEAT loop in progress 0 = REPEAT loop not in progress bit 3 N: MCU ALU Negative bit 1 = Result was negative 0 = Result was non-negative (zero or positive) bit 2 OV: MCU ALU Overflow bit This bit is used for signed arithmetic (2’s complement). It indicates an overflow of a magnitude that causes the sign bit to change state. 1 = Overflow occurred for signed arithmetic (in this arithmetic operation) 0 = No overflow occurred bit 1 Z: MCU ALU Zero bit 1 = An operation that affects the Z bit has set it at some time in the past 0 = The most recent operation that affects the Z bit has cleared it (i.e., a non-zero result) bit 0 C: MCU ALU Carry/Borrow bit 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: 2: 3: This bit can be read or cleared (not set). The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3> = 1. The IPL<2:0> Status bits are read only when NSTDIS = 1 (INTCON1<15>). © 2007 Microchip Technology Inc. Preliminary DS70264B-page 15 dsPIC33FJ12GP201/202 REGISTER 2-2: CORCON: CORE CONTROL REGISTER U-0 — bit 15 U-0 — R/W-0 SATA bit 7 R/W-0 SATB bit 11 bit 10-8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 Note 1: 2: R/W-0 US R/W-0 EDT(1) R-0 R-0 DL<2:0> R-0 bit 8 Legend: R = Readable bit 0’ = Bit is cleared bit 15-13 bit 12 U-0 — R/W-1 SATDW R/W-0 ACCSAT C = Clear only bit W = Writable bit ‘x = Bit is unknown R/C-0 IPL3(2) R/W-0 PSV R/W-0 RND R/W-0 IF bit 0 -n = Value at POR ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ Unimplemented: Read as ‘0’ US: DSP Multiply Unsigned/Signed Control bit 1 = DSP engine multiplies are unsigned 0 = DSP engine multiplies are signed EDT: Early DO Loop Termination Control bit(1) 1 = Terminate executing DO loop at end of current loop iteration 0 = No effect DL<2:0>: DO Loop Nesting Level Status bits 111 = 7 DO loops active • • • 001 = 1 DO loop active 000 = 0 DO loops active SATA: ACCA Saturation Enable bit 1 = Accumulator A saturation enabled 0 = Accumulator A saturation disabled SATB: ACCB Saturation Enable bit 1 = Accumulator B saturation enabled 0 = Accumulator B saturation disabled SATDW: Data Space Write from DSP Engine Saturation Enable bit 1 = Data space write saturation enabled 0 = Data space write saturation disabled ACCSAT: Accumulator Saturation Mode Select bit 1 = 9.31 saturation (super saturation) 0 = 1.31 saturation (normal saturation) IPL3: CPU Interrupt Priority Level Status bit 3(2) 1 = CPU interrupt priority level is greater than 7 0 = CPU interrupt priority level is 7 or less PSV: Program Space Visibility in Data Space Enable bit 1 = Program space visible in data space 0 = Program space not visible in data space RND: Rounding Mode Select bit 1 = Biased (conventional) rounding enabled 0 = Unbiased (convergent) rounding enabled IF: Integer or Fractional Multiplier Mode Select bit 1 = Integer mode enabled for DSP multiply operations 0 = Fractional mode enabled for DSP multiply operations This bit will always read as ‘0’. The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level. DS70264B-page 16 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 2.5 Arithmetic Logic Unit (ALU) The dsPIC33FJ12GP201/202 ALU is 16 bits wide and is capable of addition, subtraction, bit shifts and logic operations. Unless otherwise mentioned, arithmetic operations are 2’s complement in nature. Depending on the operation, the ALU can affect the values of the Carry (C), Zero (Z), Negative (N), Overflow (OV) and Digit Carry (DC) Status bits in the SR register. The C and DC Status bits operate as Borrow and Digit Borrow bits, respectively, for subtraction operations. The ALU can perform 8-bit or 16-bit operations, depending on the mode of the instruction that is used. Data for the ALU operation can come from the W register array or data memory, depending on the addressing mode of the instruction. Likewise, output data from the ALU can be written to the W register array or a data memory location. The dsPIC33FJ12GP201/202 CPU incorporates hardware support for both multiplication and division. This includes a dedicated hardware multiplier and support hardware for 16-bit-divisor division. Refer to the “dsPIC30F/33F Programmer’s Reference Manual” (DS70157) for information on the SR bits affected by each instruction. 2.5.1 MULTIPLIER Using the high-speed 17-bit x 17-bit multiplier of the DSP engine, the ALU supports unsigned, signed or mixed-sign operation in several MCU multiplication modes: • • • • • • • 16-bit x 16-bit signed 16-bit x 16-bit unsigned 16-bit signed x 5-bit (literal) unsigned 16-bit unsigned x 16-bit unsigned 16-bit unsigned x 5-bit (literal) unsigned 16-bit unsigned x 16-bit signed 8-bit unsigned x 8-bit unsigned 2.5.2 32-bit signed/16-bit signed divide 32-bit unsigned/16-bit unsigned divide 16-bit signed/16-bit signed divide 16-bit unsigned/16-bit unsigned divide The quotient for all divide instructions ends up in W0 and the remainder in W1. 16-bit signed and unsigned DIV instructions can specify any W register for both the 16-bit divisor (Wn) and any W register (aligned) pair (W(m+1):Wm) for the 32-bit dividend. The divide algorithm takes one cycle per bit of divisor, so both 32-bit/16-bit and 16-bit/16-bit instructions take the same number of cycles to execute. 2.6 DSP Engine The DSP engine consists of a high-speed 17-bit x 17-bit multiplier, a barrel shifter and a 40-bit adder/subtracter (with two target accumulators, round and saturation logic). The dsPIC33FJ12GP201/202 is a single-cycle instruction flow architecture; therefore, concurrent operation of the DSP engine with MCU instruction flow is not possible. However, some MCU ALU and DSP engine resources can be used concurrently by the same instruction (e.g., ED, EDAC). The DSP engine can also perform accumulator-to-accumulator operations that require no additional data. These instructions are ADD, SUB and NEG. The DSP engine has options selected through bits in the CPU Core Control register (CORCON), as listed below: • • • • DIVIDER The divide block supports 32-bit/16-bit and 16-bit/16-bit signed and unsigned integer divide operations with the following data sizes: TABLE 2-1: 1. 2. 3. 4. Fractional or integer DSP multiply (IF) Signed or unsigned DSP multiply (US) Conventional or convergent rounding (RND) Automatic saturation on/off for ACCA (SATA), ACCB (SATB) and writes to data memory (SATDW) • Accumulator Saturation mode selection (ACCSAT) A block diagram of the DSP engine is shown in Figure 2-3. DSP INSTRUCTIONS SUMMARY Instruction CLR ED EDAC MAC MAC MOVSAC MPY MPY MPY.N MSC © 2007 Microchip Technology Inc. Algebraic Operation ACC Write Back A=0 A = (x – y)2 A = A + (x – y)2 A = A + (x * y) A = A + x2 No change in A A=x*y A=x2 A=–x*y A=A–x*y Yes No No Yes No Yes No No No Yes Preliminary DS70264B-page 17 dsPIC33FJ12GP201/202 FIGURE 2-3: DSP ENGINE BLOCK DIAGRAM 40 S a 40 Round t 16 u Logic r a t e 40-bit Accumulator A 40-bit Accumulator B Carry/Borrow Out Carry/Borrow In Saturate Adder Negate 40 40 40 16 X Data Bus Barrel Shifter 40 Y Data Bus Sign-Extend 32 Zero Backfill 16 32 33 17-bit Multiplier/Scaler 16 16 To/From W Array DS70264B-page 18 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 2.6.1 MULTIPLIER The 17-bit x 17-bit multiplier is capable of signed or unsigned operation and can multiplex its output using a scaler to support either 1.31 fractional (Q31) or 32-bit integer results. Unsigned operands are zero-extended into the 17th bit of the multiplier input value. Signed operands are sign-extended into the 17th bit of the multiplier input value. The output of the 17-bit x 17-bit multiplier/scaler is a 33-bit value that is sign-extended to 40 bits. Integer data is inherently represented as a signed 2’s complement value, where the Most Significant bit (MSb) is defined as a sign bit. • The range of an N-bit 2’s complement integer is -2N-1 to 2N-1 – 1. • For a 16-bit integer, the data range is -32768 (0x8000) to 32767 (0x7FFF) including ‘0’. • For a 32-bit integer, the data range is -2,147,483,648 (0x8000 0000) to 2,147,483,647 (0x7FFF FFFF). When the multiplier is configured for fractional multiplication, the data is represented as a 2’s complement fraction, where the MSb is defined as a sign bit and the radix point is implied to lie just after the sign bit (QX format). The range of an N-bit 2’s complement fraction with this implied radix point is -1.0 to (1 – 21-N). For a 16-bit fraction, the Q15 data range is -1.0 (0x8000) to 0.999969482 (0x7FFF) including ‘0’ and has a precision of 3.01518x10-5. In Fractional mode, the 16 x 16 multiply operation generates a 1.31 product that has a precision of 4.65661 x 10-10. The same multiplier is used to support the MCU multiply instructions which include integer 16-bit signed, unsigned and mixed sign multiply operations. The MUL instruction can be directed to use byte or word-sized operands. Byte operands will direct a 16-bit result, and word operands will direct a 32-bit result to the specified register(s) in the W array. 2.6.2 DATA ACCUMULATORS AND ADDER/SUBTRACTER The data accumulator consists of a 40-bit adder/subtracter with automatic sign extension logic. It can select one of two accumulators (A or B) as its pre-accumulation source and post-accumulation destination. For the ADD and LAC instructions, the data to be accumulated or loaded can be optionally scaled using the barrel shifter prior to accumulation. 2.6.2.1 Adder/Subtracter, Overflow and Saturation • In the case of addition, the Carry/Borrow input is active-high and the other input is true data (not complemented). • In the case of subtraction, the Carry/Borrow input is active-low and the other input is complemented. The adder/subtracter generates Overflow Status bits, SA/SB and OA/OB, which are latched and reflected in the STATUS register: • Overflow from bit 39: this is a catastrophic overflow in which the sign of the accumulator is destroyed. • Overflow into guard bits 32 through 39: this is a recoverable overflow. This bit is set whenever all the guard bits are not identical to each other. The adder has an additional saturation block that controls accumulator data saturation, if selected. It uses the result of the adder, the Overflow Status bits described previously and the SAT<A:B> (CORCON<7:6>) and ACCSAT (CORCON<4>) mode control bits to determine when and to what value to saturate. Six STATUS register bits have been provided to support saturation and overflow: • OA: ACCA overflowed into guard bits • OB: ACCB overflowed into guard bits • SA: ACCA saturated (bit 31 overflow and saturation) or ACCA overflowed into guard bits and saturated (bit 39 overflow and saturation) • SB: ACCB saturated (bit 31 overflow and saturation) or ACCB overflowed into guard bits and saturated (bit 39 overflow and saturation) • OAB: Logical OR of OA and OB • SAB: Logical OR of SA and SB The OA and OB bits are modified each time data passes through the adder/subtracter. When set, they indicate that the most recent operation has overflowed into the accumulator guard bits (bits 32 through 39). The OA and OB bits can also optionally generate an arithmetic warning trap when set and the corresponding Overflow Trap Flag Enable bits (OVATE, OVBTE) in the INTCON1 register are set (refer to Section 6.0 “Interrupt Controller”). This allows the user application to take immediate action, for example, to correct system gain. The adder/subtracter is a 40-bit adder with an optional zero input into one side, and either true or complement data into the other input. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 19 dsPIC33FJ12GP201/202 The SA and SB bits are modified each time data passes through the adder/subtracter, but can only be cleared by the user application. When set, they indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit saturation or bit 39 for 40-bit saturation) and will be saturated (if saturation is enabled). When saturation is not enabled, SA and SB default to bit 39 overflow and thus indicate that a catastrophic overflow has occurred. If the COVTE bit in the INTCON1 register is set, SA and SB bits will generate an arithmetic warning trap when saturation is disabled. The Overflow and Saturation Status bits can optionally be viewed in the STATUS Register (SR) as the logical OR of OA and OB (in bit OAB) and the logical OR of SA and SB (in bit SAB). Programs can check one bit in the STATUS register to determine if either accumulator has overflowed, or one bit to determine if either accumulator has saturated. This is useful for complex number arithmetic, which typically uses both accumulators. The device supports three Saturation and Overflow modes: • Bit 39 Overflow and Saturation: When bit 39 overflow and saturation occurs, the saturation logic loads the maximally positive 9.31 (0x7FFFFFFFFF) or maximally negative 9.31 value (0x8000000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user application. This condition is referred to as ‘super saturation’ and provides protection against erroneous data or unexpected algorithm problems (such as gain calculations). • Bit 31 Overflow and Saturation: When bit 31 overflow and saturation occurs, the saturation logic then loads the maximally positive 1.31 value (0x007FFFFFFF) or maximally negative 1.31 value (0x0080000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user application. When this Saturation mode is in effect, the guard bits are not used, so the OA, OB or OAB bits are never set. • Bit 39 Catastrophic Overflow: The bit 39 Overflow Status bit from the adder is used to set the SA or SB bit, which remains set until cleared by the user application. No saturation operation is performed and the accumulator is allowed to overflow, destroying its sign. If the COVTE bit in the INTCON1 register is set, a catastrophic overflow can initiate a trap exception. 2.6.2.2 Accumulator ‘Write Back’ The MAC class of instructions (with the exception of MPY, MPY.N, ED and EDAC) can optionally write a rounded version of the high word (bits 31 through 16) of the accumulator that is not targeted by the instruction into data space memory. The write is performed across the X bus into combined X and Y address space. The following addressing modes are supported: DS70264B-page 20 • W13, Register Direct: The rounded contents of the non-target accumulator are written into W13 as a 1.15 fraction. • [W13] + = 2, Register Indirect with Post-Increment: The rounded contents of the non-target accumulator are written into the address pointed to by W13 as a 1.15 fraction. W13 is then incremented by 2 (for a word write). 2.6.2.3 Round Logic The round logic is a combinational block that performs a conventional (biased) or convergent (unbiased) round function during an accumulator write (store). The Round mode is determined by the state of the RND bit in the CORCON register. It generates a 16-bit, 1.15 data value that is passed to the data space write saturation logic. If rounding is not indicated by the instruction, a truncated 1.15 data value is stored and the least significant word (lsw) is simply discarded. Conventional rounding zero-extends bit 15 of the accumulator and adds it to the ACCxH word (bits 16 through 31 of the accumulator). • If the ACCxL word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xFFFF (0x8000 included), ACCxH is incremented. • If ACCxL is between 0x0000 and 0x7FFF, ACCxH is left unchanged. A consequence of this algorithm is that over a succession of random rounding operations, the value tends to be biased slightly positive. Convergent (or unbiased) rounding operates in the same manner as conventional rounding, except when ACCxL equals 0x8000. In this case, the Least Significant bit (bit 16 of the accumulator) of ACCxH is examined. • If it is ‘1’, ACCxH is incremented. • If it is ‘0’, ACCxH is not modified. Assuming that bit 16 is effectively random in nature, this scheme removes any rounding bias that may accumulate. The SAC and SAC.R instructions store either a truncated (SAC), or rounded (SAC.R) version of the contents of the target accumulator to data memory via the X bus, subject to data saturation (see Section 2.6.2.4 “Data Space Write Saturation”). For the MAC class of instructions, the accumulator write-back operation functions in the same manner, addressing combined MCU (X and Y) data space though the X bus. For this class of instructions, the data is always subject to rounding. Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 2.6.2.4 Data Space Write Saturation 2.6.3 BARREL SHIFTER In addition to adder/subtracter saturation, writes to data space can also be saturated but without affecting the contents of the source accumulator. The data space write saturation logic block accepts a 16-bit, 1.15 fractional value from the round logic block as its input, together with overflow status from the original source (accumulator) and the 16-bit round adder. These inputs are combined and used to select the appropriate 1.15 fractional value as output to write to data space memory. The barrel shifter can perform up to 16-bit arithmetic or logic right shifts, or up to 16-bit left shifts in a single cycle. The source can be either of the two DSP accumulators or the X bus (to support multi-bit shifts of register or memory data). If the SATDW bit in the CORCON register is set, data (after rounding or truncation) is tested for overflow and adjusted accordingly: The barrel shifter is 40 bits wide, thereby obtaining a 40-bit result for DSP shift operations and a 16-bit result for MCU shift operations. Data from the X bus is presented to the barrel shifter between bit positions 16 and 31 for right shifts, and between bit positions 0 and 16 for left shifts. • For input data greater than 0x007FFF, data written to memory is forced to the maximum positive 1.15 value, 0x7FFF. • For input data less than 0xFF8000, data written to memory is forced to the maximum negative 1.15 value, 0x8000. The shifter requires a signed binary value to determine both the magnitude (number of bits) and direction of the shift operation. A positive value shifts the operand right. A negative value shifts the operand left. A value of ‘0’ does not modify the operand. The Most Significant bit of the source (bit 39) is used to determine the sign of the operand being tested. If the SATDW bit in the CORCON register is not set, the input data is always passed through unmodified under all conditions. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 21 dsPIC33FJ12GP201/202 NOTES: DS70264B-page 22 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 3.0 Note: MEMORY ORGANIZATION 3.1 The program address memory space of the dsPIC33FJ12GP201/202 devices is 4M instructions. The space is addressable by a 24-bit value derived either from the 23-bit PC during program execution, or from table operation or data space remapping as described in Section 3.6 “Interfacing Program and Data Memory Spaces”. This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The dsPIC33FJ12GP201/202 architecture features separate program and data memory spaces and buses. This architecture also allows the direct access of program memory from the data space during code execution. FIGURE 3-1: Program Address Space User application access to the program memory space is restricted to the lower half of the address range (0x000000 to 0x7FFFFF). The exception is the use of TBLRD/TBLWT operations, which use TBLPAG<7> to permit access to the Configuration bits and Device ID sections of the configuration memory space. The memory map for the dsPIC33FJ12GP201/202 device is shown in Figure 3-1. PROGRAM MEMORY FOR dsPIC33FJ12GP201/202 DEVICES User Memory Space dsPIC33FJ12GP201/202 GOTO Instruction Reset Address Interrupt Vector Table Reserved Alternate Vector Table User Program Flash Memory (4K instructions) 0x000000 0x000002 0x000004 0x0000FE 0x000100 0x000104 0x0001FE 0x000200 0x001FFE 0x002000 Unimplemented (Read ‘0’s) 0x7FFFFE 0x800000 Configuration Memory Space Reserved Device Configuration Registers Reserved DEVID (2) © 2007 Microchip Technology Inc. 0xF7FFFE 0xF80000 0xF80017 0xF80018 Preliminary 0xFEFFFE 0xFF0000 0xFFFFFE DS70264B-page 23 dsPIC33FJ12GP201/202 3.1.1 PROGRAM MEMORY ORGANIZATION 3.1.2 All dsPIC33FJ12GP201/202 devices reserve the addresses between 0x00000 and 0x000200 for hard-coded program execution vectors. A hardware Reset vector is provided to redirect code execution from the default value of the PC on device Reset to the actual start of code. A GOTO instruction is programmed by the user application at 0x000000, with the actual address for the start of code at 0x000002. The program memory space is organized in word-addressable blocks. Although it is treated as 24 bits wide, it is more appropriate to think of each address of the program memory as a lower and upper word, with the upper byte of the upper word being unimplemented. The lower word always has an even address, while the upper word has an odd address (Figure 3-2). dsPIC33FJ12GP201/202 devices also have two interrupt vector tables, located from 0x000004 to 0x0000FF and 0x000100 to 0x0001FF. These vector tables allow each of the many device interrupt sources to be handled by separate Interrupt Service Routines (ISRs). A more detailed discussion of the interrupt vector tables is provided in Section 6.1 “Interrupt Vector Table”. Program memory addresses are always word-aligned on the lower word, and addresses are incremented or decremented by two during code execution. This arrangement provides compatibility with data memory space addressing and makes data in the program memory space accessible. FIGURE 3-2: msw Address PROGRAM MEMORY ORGANIZATION 16 8 PC Address (lsw Address) 0 0x000000 0x000002 0x000004 0x000006 00000000 00000000 00000000 00000000 Program Memory ‘Phantom’ Byte (read as ‘0’) DS70264B-page 24 least significant word most significant word 23 0x000001 0x000003 0x000005 0x000007 INTERRUPT AND TRAP VECTORS Instruction Width Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 3.2 Data Address Space The dsPIC33FJ12GP201/202 CPU has a separate 16-bit-wide data memory space. The data space is accessed using separate Address Generation Units (AGUs) for read and write operations. The data memory maps is shown in Figure 3-3. All Effective Addresses (EAs) in the data memory space are 16 bits wide and point to bytes within the data space. This arrangement gives a data space address range of 64 Kbytes or 32K words. The lower half of the data memory space (that is, when EA<15> = 0) is used for implemented memory addresses, while the upper half (EA<15> = 1) is reserved for the Program Space Visibility area (see Section 3.6.3 “Reading Data From Program Memory Using Program Space Visibility”). dsPIC33FJ12GP201/202 devices implement up to 30 Kbytes of data memory. Should an EA point to a location outside of this area, an all-zero word or byte will be returned. 3.2.1 DATA SPACE WIDTH The data memory space is organized in byte addressable, 16-bit-wide blocks. Data is aligned in data memory and registers as 16-bit words, but all data space EAs resolve to bytes. The Least Significant Bytes (LSBs) of each word have even addresses, while the Most Significant Bytes (MSBs) have odd addresses. 3.2.2 DATA MEMORY ORGANIZATION AND ALIGNMENT To maintain backward compatibility with PIC® MCU devices and improve data space memory usage efficiency, the dsPIC33FJ12GP201/202 instruction set supports both word and byte operations. As a consequence of byte accessibility, all effective address calculations are internally scaled to step through word-aligned memory. For example, the core recognizes that Post-Modified Register Indirect Addressing mode [Ws++] will result in a value of Ws + 1 for byte operations and Ws + 2 for word operations. Data byte reads will read the complete word that contains the byte, using the LSB of any EA to determine which byte to select. The selected byte is placed onto the LSB of the data path. That is, data memory and registers are organized as two parallel byte-wide entities with shared (word) address decode but separate write lines. Data byte writes only write to the corresponding side of the array or register that matches the byte address. © 2007 Microchip Technology Inc. All word accesses must be aligned to an even address. Misaligned word data fetches are not supported, so care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. If a misaligned read or write is attempted, an address error trap is generated. If the error occurred on a read, the instruction underway is completed. If the instruction occurred on a write, the instruction is executed but the write does not occur. In either case, a trap is then executed, allowing the system and/or user application to examine the machine state prior to execution of the address Fault. All byte loads into any W register are loaded into the Least Significant Byte. The Most Significant Byte is not modified. A sign-extend instruction (SE) is provided to allow users to translate 8-bit signed data to 16-bit signed values. Alternatively, for 16-bit unsigned data, user applications can clear the MSB of any W register by executing a zero-extend (ZE) instruction on the appropriate address. 3.2.3 SFR SPACE The first 2 Kbytes of the near data space, from 0x0000 to 0x07FF, is primarily occupied by Special Function Registers (SFRs). These are used by the dsPIC33FJ12GP201/202 core and peripheral modules for controlling the operation of the device. SFRs are distributed among the modules that they control, and are generally grouped together by module. Much of the SFR space contains unused addresses; these are read as ‘0’. A complete listing of implemented SFRs, including their addresses, is shown in Table 3-1 through Table 3-21. Note: 3.2.4 The actual set of peripheral features and interrupts varies by the device. Refer to the corresponding device tables and pinout diagrams for device-specific information. NEAR DATA SPACE The 8-Kbyte area between 0x0000 and 0x1FFF is referred to as the near data space. Locations in this space are directly addressable via a 13-bit absolute address field within all memory direct instructions. Additionally, the whole data space is addressable using MOV instructions, which support Memory Direct Addressing mode with a 16-bit address field, or by using Indirect Addressing mode using a working register as an address pointer. Preliminary DS70264B-page 25 dsPIC33FJ12GP201/202 FIGURE 3-3: DATA MEMORY MAP FOR dsPIC33FJ12GP201/202 DEVICES WITH 1 KB RAM MSB Address MSb 2 Kbyte SFR Space 1 Kbyte SRAM Space LSB Address 16 bits LSb 0x0000 0x0001 SFR Space 0x07FF 0x0801 0x09FF 0x0A01 X Data RAM (X) Y Data RAM (Y) 0x0BFF 0x0C01 0x09FE 0x0A00 8-Kbyte Near Data Space 0x0BFE 0x0C00 0x1FFF 0x2001 0x1FFFF 0x2000 0x8001 0x8000 X Data Unimplemented (X) Optionally Mapped into Program Memory 0xFFFF DS70264B-page 26 0x07FE 0x0800 0xFFFE Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 3.2.5 X AND Y DATA SPACES The core has two data spaces, X and Y. These data spaces can be considered either separate (for some DSP instructions), or as one unified linear address range (for MCU instructions). The data spaces are accessed using two Address Generation Units (AGUs) and separate data paths. This feature allows certain instructions to concurrently fetch two words from RAM, thereby enabling efficient execution of DSP algorithms such as Finite Impulse Response (FIR) filtering and Fast Fourier Transform (FFT). The X data space is used by all instructions and supports all addressing modes. X data space has separate read and write data buses. The X read data bus is the read data path for all instructions that view data space as combined X and Y address space. It is also the X data prefetch path for the dual operand DSP instructions (MAC class). The Y data space is used in concert with the X data space by the MAC class of instructions (CLR, ED, EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide two concurrent data read paths. Both the X and Y data spaces support Modulo Addressing mode for all instructions, subject to addressing mode restrictions. Bit-Reversed Addressing mode is only supported for writes to X data space. All data memory writes, including in DSP instructions, view data space as combined X and Y address space. The boundary between the X and Y data spaces is device-dependent and is not user-programmable. All effective addresses are 16 bits wide and point to bytes within the data space. Therefore, the data space address range is 64 Kbytes, or 32K words, though the implemented memory locations vary by device. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 27 SFR Name CPU CORE REGISTERS MAP SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets Preliminary WREG0 0000 Working Register 0 0000 WREG1 0002 Working Register 1 0000 WREG2 0004 Working Register 2 0000 WREG3 0006 Working Register 3 0000 WREG4 0008 Working Register 4 0000 WREG5 000A Working Register 5 0000 WREG6 000C Working Register 6 0000 WREG7 000E Working Register 7 0000 WREG8 0010 Working Register 8 0000 WREG9 0012 Working Register 9 0000 WREG10 0014 Working Register 10 0000 WREG11 0016 Working Register 11 0000 WREG12 0018 Working Register 12 0000 WREG13 001A Working Register 13 0000 WREG14 001C Working Register 14 0000 WREG15 001E Working Register 15 0800 SPLIM 0020 Stack Pointer Limit Register xxxx PCL 002E Program Counter Low Word Register PCH 0030 — — — — — — — — Program Counter High Byte Register 0000 TBLPAG 0032 — — — — — — — — Table Page Address Pointer Register 0000 PSVPAG 0034 — — — — — — — — Program Memory Visibility Page Address Pointer Register 0000 RCOUNT 0036 Repeat Loop Counter Register xxxx DCOUNT 0038 DCOUNT<15:0> xxxx 0000 © 2007 Microchip Technology Inc. DOSTARTL 003A DOSTARTH 003C DOSTARTL<15:1> DOENDL 003E DOENDH 0040 — — — — — — — — — — SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C CORCON 0044 — — — US EDT SATA SATB SATDW ACCSAT IPL3 PSV RND IF MODCON 0046 XMODEN YMODEN — — — — — — — — — — — — BWM<3:0> xxxx 0 xxxx 00xx DOENDL<15:1> DL<2:0> 0 DOSTARTH<5:0> DOENDH YWM<3:0> 00xx XWM<3:0> 0000 0000 0000 XMODSRT 0048 XS<15:1> 0 XMODEND 004A XE<15:1> 1 xxxx YMODSRT 004C YS<15:1> 0 xxxx 1 xxxx YMODEND 004E XBREV 0050 BREN DISICNT 0052 — Legend: YE<15:1> XB<14:0> — Disable Interrupts Counter Register x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. xxxx xxxx xxxx dsPIC33FJ12GP201/202 DS70264B-page 28 TABLE 3-1: © 2007 Microchip Technology Inc. TABLE 3-2: CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ12GP202 SFR Name SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 CNEN1 0060 CN15IE CN14IE CN13IE CNEN2 0062 — CN30IE CN29IE CNPU1 0068 CNPU2 006A Legend: Bit 11 Bit 10 Bit 9 CN12IE CN11IE —- — — CN7IE — CN27IE — — CN24IE CN23IE — — — CN7PUE CN6PUE — — CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE — CN30PUE CN29PUE — CN27PUE Bit 8 Bit 7 Bit 6 Bit 0 All Resets CN1IE CN0IE 0000 — — CN16IE 0000 CN3PUE CN2PUE CN1PUE CN0PUE 0000 — — — CN16PUE 0000 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 CN6IE CN5IE CN4IE CN3IE CN2IE CN22IE CN21IE — — CN5PUE CN4PUE — CN24PUE CN23PUE CN22PUE CN21PUE x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 3-3: CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ12GP201 SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets CNEN1 0060 — — — CN12IE CN11IE — — — — — CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 CNEN2 0062 — CN30IE CN29IE — — — — — CN23IE CN22IE CN21IE — — — — — 0000 CNPU1 0068 — — — — — — — — CN5PUE CN4PUE CNPU2 006A — — — — Legend: CN30PUE CN29PUE CN12PUE CN11PUE — — CN23PUE CN22PUE CN21PUE x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. — CN3PUE CN2PUE CN1PUE CN0PUE — — — — 0000 0000 DS70264B-page 29 dsPIC33FJ12GP201/202 Preliminary SFR Name SFR Name SFR Addr INTERRUPT CONTROLLER REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 INTCON1 0080 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE INTCON2 0082 ALTIVT DISI IFS0 0084 — IFS1 0086 — IFS4 008C IEC0 Bit 8 OVBTE COVTE — — Bit 7 Bit 6 SFTACERR DIV0ERR Bit 5 — — — — T3IE T2IE OC2IE — — IC8IE — — — IC1IF INT0IF 0000 MI2C1IF SI2C1IF 0000 Preliminary — — — — — — — — — — 0094 — — AD1IE U1TXIE U1RXIE IEC1 0096 — — INT2IE — — — IEC4 009C — — — — — — IPC0 00A4 — IPC1 00A6 IPC2 00A8 IPC3 00AA — — — — — IPC4 00AC — CNIP<2:0> — — — — IPC5 00AE — IC8IP<2:0> — IPC7 00B2 — — — — — — — — — INT2IP<2:0> — — — — 4444 IPC16 00C4 — — — — — — — — — U1EIP<2:0> — — — — 4444 INTTREG 00E0 — — — — Legend: — 0000 U1RXIF — — 0000 INT0EP — — IC2IF IC7IF — INT1EP U1TXIF — OC2IF IC8IF OSCFAIL AD1IF SPI1IF SPI1EIF SPI1IE SPI1EIE OC1IP<2:0> — — OC2IP<2:0> — SPI1IP<2:0> IC7IP<2:0> ILR<3:0>> — All Resets INT2IF T2IP<2:0> T2IF — MATHERR ADDRERR STKERR Bit 0 — U1RXIP<2:0> T3IF Bit 1 — — — Bit 2 — — — Bit 3 — — — Bit 4 — T1IP<2:0> — Bit 9 — INT2EP — T1IF OC1IF INT1IF CNIF — — — — U1EIF — 0000 IC2IE — T1IE OC1IE IC1IE INT0IE 0000 IC7IE — INT1IE CNIE — — — — — — IC1IP<2:0> — — IC2IP<2:0> — — SPI1EIP<2:0> — — AD1IP<2:0> — MI2C1IP<2:0> — — x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. — — — MI2C1IE SI2C1IE U1EIE — INT0IP<2:0> — — 0000 0000 4444 — 4444 T3IP<2:0> 4444 — U1TXIP<2:0> 4444 — SI2C1IP<2:0> 4444 — INT1IP<2:0> VECNUM<6:0> 4444 4444 dsPIC33FJ12GP201/202 DS70264B-page 30 TABLE 3-4: © 2007 Microchip Technology Inc. © 2007 Microchip Technology Inc. TABLE 3-5: TIMER REGISTER MAP SFR Name SFR Addr TMR1 0100 Timer1 Register PR1 0102 Period Register 1 T1CON 0104 TMR2 0106 Timer2 Register xxxx TMR3HLD 0108 Timer3 Holding Register (for 32-bit timer operations only) xxxx TMR3 010A Timer3 Register xxxx PR2 010C Period Register 2 FFFF PR3 010E Period Register 3 T2CON 0110 TON — TSIDL — — — — — — TGATE TCKPS<1:0> T32 — TCS — 0000 T3CON 0112 TON — TSIDL — — — — — — TGATE TCKPS<1:0> — — TCS — 0000 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> Bit 4 Bit 3 Legend: — Bit 13 TSIDL Bit 12 — Bit 11 — Bit 10 — Bit 9 — Bit 8 — Bit 7 — Bit 6 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets xxxx FFFF TGATE TCKPS<1:0> — TSYNC TCS — 0000 FFFF IC1BUF 0140 IC1CON 0142 IC2BUF 0144 IC2CON 0146 IC7BUF 0158 IC7CON 015A IC8BUF 015C IC8CON 015E Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 — — ICSIDL — — — — Bit 8 Bit 7 Bit 6 Bit 5 Input 1 Capture Register — xxxx ICTMR 0000 Input 2 Capture Register — — ICSIDL — — — — — xxxx ICTMR 0000 Input 7 Capture Register — — ICSIDL — — — — — xxxx ICTMR 0000 Input 8Capture Register — — ICSIDL — — — — — xxxx ICTMR 0000 x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 3-7: OUTPUT COMPARE REGISTER MAP SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 DS70264B-page 31 OC1RS 0180 Output Compare 1 Secondary Register OC1R 0182 Output Compare 1 Register OC1CON 0184 OC2RS 0186 Output Compare 2 Secondary Register OC2R 0188 Output Compare 2 Register OC2CON 018A — — — — OCSIDL OCSIDL — — — — — — — — — — — — x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Bit 5 Bit 2 Bit 1 Bit 0 All Resets xxxx xxxx — — OCFLT OCTSEL OCM<2:0> 0000 xxxx xxxx — — OCFLT OCTSEL OCM<2:0> 0000 dsPIC33FJ12GP201/202 Preliminary SFR Addr Legend: Bit 5 INPUT CAPTURE REGISTER MAP SFR Name SFR Name TON Bit 14 x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 3-6: Legend: Bit 15 I2C1 REGISTER MAP SFR Name SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 I2C1RCV 0200 — — — — — — — — Receive Register 0000 I2C1TRN 0202 — — — — — — — — Transmit Register 00FF I2C1BRG 0204 — — — — — — — I2C1CON 0206 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000 I2C1STAT 0208 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 I2C1ADD 020A — — — — — — Address Register 0000 I2C1MSK 020C — — — — — — Address Mask Register 0000 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 3-9: Bit 7 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets 0000 UART1 REGISTER MAP Preliminary SFR Name U1MODE 0220 UARTEN U1STA 0222 UTXISEL1 U1TXREG 0224 — — U1RXREG 0226 — — U1BRG 0228 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. SFR Name Bit 5 Baud Rate Generator Register SFR Addr TABLE 3-10: Bit 6 Bit 15 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 UEN1 UEN0 WAKE LPBACK UTXBF TRMT Bit 4 Bit 3 ABAUD URXINV BRGH ADDEN RIDLE PERR Bit 2 Bit 1 STSEL 0000 URXDA 0110 Bit 12 — USIDL IREN RTSMD — — UTXBRK UTXEN — — — — — UART Transmit Register xxxx — — — — — UART Receive Register 0000 URXISEL<1:0> Bit 5 All Resets Bit 13 UTXINV UTXISEL0 Bit 11 Bit 0 Bit 14 PDSEL<1:0> FERR OERR Baud Rate Generator Prescaler 0000 SPI1 REGISTER MAP © 2007 Microchip Technology Inc. SFR Addr Bit 15 Bit 14 Bit 13 SPI1STAT 0240 SPIEN — SPISIDL — — — — SPI1CON1 0242 — — — DISSCK DISSDO MODE16 SMP SPI1CON2 0244 FRMEN SPIFSD FRMPOL — — — — — SPI1BUF 0248 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 — — CKE SSEN SPIROV — — CKP MSTEN — — — SPI1 Transmit and Receive Buffer Register Bit 3 Bit 2 Bit 1 Bit 0 All Resets — — SPITBF SPIRBF 0000 SPRE<2:0> — — PPRE<1:0> — FRMDLY — 0000 0000 0000 dsPIC33FJ12GP201/202 DS70264B-page 32 TABLE 3-8: © 2007 Microchip Technology Inc. TABLE 3-11: PERIPHERAL PIN SELECT INPUT REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 RPINR0 0680 — — — RPINR1 0682 — — — RPINR3 0686 — — — T3CKR<4:0> RPINR7 068E — — — RPINR10 0694 — — — RPINR11 0696 — — — RPINR18 06A4 — — — U1CTSR<4:0> RPINR20 06A8 — — — SCK1R<4:0> RPINR21 06AA — — — Legend: Bit 11 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets — — — — — — — — 1F00 — — — INT2R<4:0> 001F — — — T2CKR<4:0> 1F1F IC2R<4:0> — — — IC1R<4:0> 1F1F IC8R<4:0> — — — IC7R<4:0> 1F1F — — — OCFAR<4:0> 001F — — — U1RXR<4:0> 1F1F — — — SDI1R<4:0> 1F1F — — — SS1R<4:0> 001F Bit 10 Bit 9 Bit 8 INT1R<4:0> — — — — — — — — — — — — — — — x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 3-12: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ12GP202 Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets RPOR0 06C0 — — — RP1R<4:0> — — — RP0R<4:0> 0000 RPOR1 06C2 — — — RP3R<4:0> — — — RP2R<4:0> 0000 RPOR2 06C4 — — — RP5R<4:0> — — — RP4R<4:0> 0000 RPOR3 06C6 — — — RP7R<4:0> — — — RP6R<4:0> 0000 RPOR4 06C8 — — — RP9R<4:0> — — — RP8R<4:0> 0000 RPOR5 06CA — — — RP11R<4:0> — — — RP10R<4:0> 0000 RPOR6 06CC — — — RP13R<4:0> — — — RP12R<4:0> 0000 RPOR7 06CE — — — RP15R<4:0> — — — RP14R<4:0> 0000 Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 3-13: File Name PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ12GP201 Addr Bit 15 Bit 14 Bit 13 DS70264B-page 33 Bit 12 Bit 11 — — Bit 10 Bit 9 Bit 8 — — RP1R<4:0> Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 — — — RP0R<4:0> — — — RP4R<4:0> Bit 1 Bit 0 All Resets RPOR0 06C0 — — — RPOR2 06C4 — — — RPOR3 06C6 — — — RP7R<4:0> — — — RPOR4 06C8 — — — RP9R<4:0> — — — RP8R<4:0> 0000 RPOR7 Legend: — — — RP15R<4:0> — 06CE x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. — — RP14R<4:0> 0000 — — — — 0000 0000 — — 0000 dsPIC33FJ12GP201/202 Preliminary File Name Bit 12 ADC1 REGISTER MAP FOR dsPIC33FJ12GP201 Preliminary Addr ADC1BUF0 0300 ADC Data Buffer 0 xxxx ADC1BUF1 0302 ADC Data Buffer 1 xxxx ADC1BUF2 0304 ADC Data Buffer 2 xxxx ADC1BUF3 0306 ADC Data Buffer 3 xxxx ADC1BUF4 0308 ADC Data Buffer 4 xxxx ADC1BUF5 030A ADC Data Buffer 5 xxxx ADC1BUF6 030C ADC Data Buffer 6 xxxx ADC1BUF7 030E ADC Data Buffer 7 xxxx ADC1BUF8 0310 ADC Data Buffer 8 xxxx ADC1BUF9 0312 ADC Data Buffer 9 xxxx ADC1BUFA 0314 ADC Data Buffer 10 xxxx ADC1BUFB 0316 ADC Data Buffer 11 xxxx ADC1BUFC 0318 ADC Data Buffer 12 xxxx ADC1BUFD 031A ADC Data Buffer 13 xxxx ADC1BUFE 031C ADC Data Buffer 14 xxxx ADC1BUFE 031E AD1CON1 0320 AD1CON2 0322 AD1CON3 0324 ADRC — — AD1CHS123 0326 — — — AD1CHS0 0328 CH0NB — — AD1PCFGL 032C — — — — — — — AD1CSSL 0330 — — — — — — — Legend: Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets File Name ADC Data Buffer 15 ADON — ADSIDL VCFG<2:0> — — AD12B FORM<1:0> — — CSCNA CHPS<1:0> — CH123NB<1:0> — SIMSAM ASAM DONE 0000 BUFM ALTS 0000 — — — — — — CH0NA — — — — — PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 — — — CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 0000 CH123SB CH0SB<4:0> x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. SMPI<3:0> SAMP BUFS SAMC<4:0> — xxxx SSRC<2:0> ADCS<5:0> — — 0000 CH123NA<1:0> CH123SA CH0SA<4:0> 0000 0000 dsPIC33FJ12GP201/202 DS70264B-page 34 TABLE 3-14: © 2007 Microchip Technology Inc. © 2007 Microchip Technology Inc. TABLE 3-15: ADC1 REGISTER MAP FOR dsPIC33FJ12GP202 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets Addr ADC1BUF0 0300 ADC Data Buffer 0 xxxx ADC1BUF1 0302 ADC Data Buffer 1 xxxx ADC1BUF2 0304 ADC Data Buffer 2 xxxx ADC1BUF3 0306 ADC Data Buffer 3 xxxx ADC1BUF4 0308 ADC Data Buffer 4 xxxx ADC1BUF5 030A ADC Data Buffer 5 xxxx ADC1BUF6 030C ADC Data Buffer 6 xxxx ADC1BUF7 030E ADC Data Buffer 7 xxxx ADC1BUF8 0310 ADC Data Buffer 8 xxxx ADC1BUF9 0312 ADC Data Buffer 9 xxxx ADC1BUFA 0314 ADC Data Buffer 10 xxxx ADC1BUFB 0316 ADC Data Buffer 11 xxxx ADC1BUFC 0318 ADC Data Buffer 12 xxxx ADC1BUFD 031A ADC Data Buffer 13 xxxx ADC1BUFE 031C ADC Data Buffer 14 xxxx ADC1BUFF 031E AD1CON1 0320 AD1CON2 0322 AD1CON3 0324 ADRC — — AD1CHS123 0326 — — — AD1CHS0 0328 CH0NB — — AD1PCFGL 032C — — 0330 — — AD1CSSL Legend: ADC Data Buffer 15 ADON — ADSIDL xxxx — — AD12B FORM<1:0> — — CSCNA CHPS<1:0> — — CH0NA — — — — — — PCFG9 PCFG8 PCFG7 PCFG6 — — — — CSS9 CSS8 CSS7 CSS6 VCFG<2:0> SAMC<4:0> CH123NB<1:0> CH123SB CH0SB<4:0> SSRC<2:0> BUFS — — — — — x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. — SIMSAM ASAM SMPI<3:0> SAMP DONE 0000 BUFM ALTS 0000 CH123SA 0000 ADCS<5:0> — 0000 — — CH123NA<1:0> PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 0000 CH0SA<4:0> 0000 DS70264B-page 35 dsPIC33FJ12GP201/202 Preliminary File Name PORTA REGISTER MAP Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets TRISA 02C0 — — — — — — — — — — — TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 001F PORTA 02C2 — — — — — — — — — — — RA4 RA3 RA2 RA1 RA0 xxxx LATA 02C4 — — — — — — — — — — — LATA4 LATA3 LATA2 LATA1 LATA0 xxxx ODCA 02C6 — — — — — — — — — — — ODCA4 ODCA3 ODCA2 ODCA1 ODCA0 xxxx Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. File Name TABLE 3-17: PORTB REGISTER MAP FOR dsPIC33FJ12GP202 Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets TRISB 02C8 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 FFFF PORTB 02CA RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx LATB 02CC LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 xxxx ODCB 02CE ODCB15 ODCB14 ODCB13 ODCB12 ODCB11 ODCB10 ODCB9 ODCB8 ODCB7 ODCB6 ODCB5 ODCB4 ODCB3 ODCB2 ODCB1 ODCB0 xxxx Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. File Name Preliminary TABLE 3-18: File Name Addr PORTB REGISTER MAP FOR dsPIC33FJ12GP201 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets TRISB 02C8 — — — — TRISB9 TRISB8 TRISB7 — — TRISB4 — — TRISB1 TRISB0 C393 PORTB 02CA RB15 RB14 — — — — RB9 RB8 RB7 — — RB4 — — RB1 RB0 xxxx LATB 02CC LATB15 LATB14 — — — — LATB9 LATB8 LATB7 — — LATB4 — — LATB1 LATB0 xxxx ODCB 02CE ODCB15 ODCB14 — — — — ODCB9 ODCB8 ODCB7 — — ODCB4 — — ODCB1 ODCB0 xxxx Legend: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 3-19: TRISB15 TRISB14 SYSTEM CONTROL REGISTER MAP © 2007 Microchip Technology Inc. File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets RCON 0740 TRAPR IOPUWR — — — — CM VREGS EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR xxxx(1) OSCCON 0742 — — CF — LPOSCEN OSWEN 0300(2) COSC<2:0> — DOZE<2:0> DOZEN NOSC<2:0> CLKLOCK IOLOCK LOCK FRCDIV<2:0> PLLPOST<1:0> — CLKDIV 0744 ROI PLLFBD 0746 — — — — — — — OSCTUN 0748 — — — — — — — Legend: Note 1: 2: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. RCON register Reset values dependent on type of Reset. OSCCON register Reset values dependent on the FOSC Configuration bits and by type of Reset. PLLPRE<4:0> PLLDIV<8:0> — — — 0040 0030 TUN<5:0> 0000 dsPIC33FJ12GP201/202 DS70264B-page 36 TABLE 3-16: © 2007 Microchip Technology Inc. TABLE 3-20: File Name NVM REGISTER MAP Addr Bit 15 Bit 14 Bit 13 NVMCON 0760 WR WREN WRERR — — — NVMKEY 0766 — — — — — — Legend: Note 1: Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 — — — ERASE — — — Bit 4 Bit 3 — Bit 2 Bit 1 Bit 0 All Resets 0000(1) NVMOP<3:0> NVMKEY<7:0> 0000 x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset. TABLE 3-21: File Name Addr PMD1 0770 PMD2 0772 Legend: Bit 12 PMD REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 — — T3MD T2MD T1MD — IC8MD IC7MD — — — — Bit 9 Bit 1 Bit 0 All Resets Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 — — I2C1MD — U1MD — SPI1MD — — AD1MD 0000 IC2MD IC1MD — — — — — — OC2MD OC1MD 0000 x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. DS70264B-page 37 dsPIC33FJ12GP201/202 Preliminary dsPIC33FJ12GP201/202 3.2.6 3.2.7 SOFTWARE STACK In addition to its use as a working register, the W15 register in the dsPIC33FJ12GP201/202 devices is also used as a software Stack Pointer. The Stack Pointer always points to the first available free word and grows from lower to higher addresses. It pre-decrements for stack pops and post-increments for stack pushes, as shown in Figure 3-4. For a PC push during any CALL instruction, the MSB of the PC is zero-extended before the push, ensuring that the MSB is always clear. Note: A PC push during exception processing concatenates the SRL register to the MSB of the PC prior to the push. The Stack Pointer Limit register (SPLIM) associated with the Stack Pointer sets an upper address boundary for the stack. SPLIM is uninitialized at Reset. As is the case for the Stack Pointer, SPLIM<0> is forced to ‘0’ because all stack operations must be word-aligned. When an EA is generated using W15 as a source or destination pointer, the resulting address is compared with the value in SPLIM. If the contents of the Stack Pointer (W15) and the SPLIM register are equal and a push operation is performed, a stack error trap will not occur. The stack error trap will occur on a subsequent push operation. For example, to cause a stack error trap when the stack grows beyond address 0x2000 in RAM, initialize the SPLIM with the value 0x1FFE. Similarly, a Stack Pointer underflow (stack error) trap is generated when the Stack Pointer address is found to be less than 0x0800. This prevents the stack from interfering with the Special Function Register (SFR) space. DATA RAM PROTECTION FEATURE The dsPIC33F product family supports Data RAM protection features that enable segments of RAM to be protected when used in conjunction with Boot and Secure Code Segment Security. BSRAM (Secure RAM segment for BS) is accessible only from the Boot Segment Flash code when enabled. SSRAM (Secure RAM segment for RAM) is accessible only from the Secure Segment Flash code when enabled. See Table 3-1 for an overview of the BSRAM and SSRAM SFRs. 3.3 Instruction Addressing Modes The addressing modes shown in Table 3-22 form the basis of the addressing modes optimized to support the specific features of individual instructions. The addressing modes provided in the MAC class of instructions differ from those in the other instruction types. 3.3.1 FILE REGISTER INSTRUCTIONS Most file register instructions use a 13-bit address field (f) to directly address data present in the first 8192 bytes of data memory (near data space). Most file register instructions employ a working register, W0, which is denoted as WREG in these instructions. The destination is typically either the same file register or WREG (with the exception of the MUL instruction), which writes the result to a register or register pair. The MOV instruction allows additional flexibility and can access the entire data space. 3.3.2 MCU INSTRUCTIONS A write to the SPLIM register should not be immediately followed by an indirect read operation using W15. The three-operand MCU instructions are of the form: FIGURE 3-4: where Operand 1 is always a working register (that is, the addressing mode can only be register direct), which is referred to as Wb. Operand 2 can be a W register, fetched from data memory, or a 5-bit literal. The result location can be either a W register or a data memory location. The following addressing modes are supported by MCU instructions: Stack Grows Toward Higher Address 0x0000 15 CALL STACK FRAME 0 PC<15:0> 000000000 PC<22:16> <Free Word> W15 (before CALL) W15 (after CALL) POP : [--W15] PUSH : [W15++] Operand 3 = Operand 1 <function> Operand 2 • • • • • Register Direct Register Indirect Register Indirect Post-Modified Register Indirect Pre-Modified 5-bit or 10-bit Literal Note: DS70264B-page 38 Preliminary Not all instructions support all the addressing modes given above. Individual instructions can support different subsets of these addressing modes. © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 3-22: FUNDAMENTAL ADDRESSING MODES SUPPORTED Addressing Mode Description File Register Direct The address of the file register is specified explicitly. Register Direct The contents of a register are accessed directly. Register Indirect The contents of Wn forms the Effective Address (EA.) Register Indirect Post-Modified The contents of Wn forms the EA. Wn is post-modified (incremented or decremented) by a constant value. Register Indirect Pre-Modified Wn is pre-modified (incremented or decremented) by a signed constant value to form the EA. Register Indirect with Register Offset The sum of Wn and Wb forms the EA. (Register Indexed) Register Indirect with Literal Offset 3.3.3 The sum of Wn and a literal forms the EA. MOVE AND ACCUMULATOR INSTRUCTIONS Move instructions and the DSP accumulator class of instructions provide a greater degree of addressing flexibility than other instructions. In addition to the addressing modes supported by most MCU instructions, move and accumulator instructions also support Register Indirect with Register Offset Addressing mode, also referred to as Register Indexed mode. Note: For the MOV instructions, the addressing mode specified in the instruction can differ for the source and destination EA. However, the 4-bit Wb (Register Offset) field is shared by both source and destination (but typically only used by one). In summary, the following addressing modes are supported by move and accumulator instructions: • • • • • • • • Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified Register Indirect with Register Offset (Indexed) Register Indirect with Literal Offset 8-bit Literal 16-bit Literal Note: 3.3.4 The two-source operand prefetch registers must be members of the set {W8, W9, W10, W11}. For data reads, W8 and W9 are always directed to the X RAGU, and W10 and W11 are always directed to the Y AGU. The effective addresses generated (before and after modification) must, therefore, be valid addresses within X data space for W8 and W9 and Y data space for W10 and W11. Note: In summary, the following addressing modes are supported by the MAC class of instructions: • • • • • Register Indirect Register Indirect Post-Modified by 2 Register Indirect Post-Modified by 4 Register Indirect Post-Modified by 6 Register Indirect with Register Offset (Indexed) 3.3.5 Not all instructions support all the addressing modes given above. Individual instructions may support different subsets of these addressing modes. Register Indirect with Register Offset Addressing mode is available only for W9 (in X space) and W11 (in Y space). OTHER INSTRUCTIONS Besides the addressing modes outlined previously, some instructions use literal constants of various sizes. For example, BRA (branch) instructions use 16-bit signed literals to specify the branch destination directly, whereas the DISI instruction uses a 14-bit unsigned literal field. In some instructions, such as ADD Acc, the source of an operand or result is implied by the opcode itself. Certain operations, such as NOP, do not have any operands. MAC INSTRUCTIONS The dual source operand DSP instructions (CLR, ED, EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred to as MAC instructions, use a simplified set of addressing modes to allow the user application to effectively manipulate the data pointers through register indirect tables. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 39 dsPIC33FJ12GP201/202 3.4 Modulo Addressing 3.4.1 Modulo Addressing mode is a method of providing an automated means to support circular data buffers using hardware. The objective is to remove the need for software to perform data address boundary checks when executing tightly looped code, as is typical in many DSP algorithms. Modulo Addressing can operate in either data or program space (since the data pointer mechanism is essentially the same for both). One circular buffer can be supported in each of the X (which also provides the pointers into program space) and Y data spaces. Modulo Addressing can operate on any W register pointer. However, it is not advisable to use W14 or W15 for Modulo Addressing since these two registers are used as the Stack Frame Pointer and Stack Pointer, respectively. In general, any particular circular buffer can be configured to operate in only one direction, as there are certain restrictions on the buffer start address (for incrementing buffers), or end address (for decrementing buffers), based upon the direction of the buffer. The only exception to the usage restrictions is for buffers that have a power-of-two length. As these buffers satisfy the start and end address criteria, they can operate in a bidirectional mode (that is, address boundary checks are performed on both the lower and upper address boundaries). FIGURE 3-5: START AND END ADDRESS The Modulo Addressing scheme requires that a starting and ending address be specified and loaded into the 16-bit Modulo Buffer Address registers: XMODSRT, XMODEND, YMODSRT and YMODEND (see Table 3-1). Note: Y space Modulo Addressing EA calculations assume word-sized data (LSB of every EA is always clear). The length of a circular buffer is not directly specified. It is determined by the difference between the corresponding start and end addresses. The maximum possible length of the circular buffer is 32K words (64 Kbytes). 3.4.2 W ADDRESS REGISTER SELECTION The Modulo and Bit-Reversed Addressing Control register, MODCON<15:0>, contains enable flags as well as a W register field to specify the W Address registers. The XWM and YWM fields select the registers that will operate with Modulo Addressing: • If XWM = 15, X RAGU and X WAGU Modulo Addressing is disabled. • If YWM = 15, Y AGU Modulo Addressing is disabled. MODULO ADDRESSING OPERATION EXAMPLE Byte Address 0x1100 MOV MOV MOV MOV MOV MOV #0x1100, W0 W0, XMODSRT #0x1163, W0 W0, MODEND #0x8001, W0 W0, MODCON MOV #0x0000, W0 ;W0 holds buffer fill value MOV #0x1110, W1 ;point W1 to buffer DO AGAIN, #0x31 MOV W0, [W1++] AGAIN: INC W0, W0 ;set modulo start address ;set modulo end address ;enable W1, X AGU for modulo ;fill the 50 buffer locations ;fill the next location ;increment the fill value 0x1163 Start Addr = 0x1100 End Addr = 0x1163 Length = 0x0032 words DS70264B-page 40 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 3.4.3 MODULO ADDRESSING APPLICABILITY 3.5.1 BIT-REVERSED ADDRESSING IMPLEMENTATION Modulo Addressing can be applied to the EA calculation associated with any W register. Bit-Reversed Addressing mode is enabled in any of these situations: Address boundaries check for addresses equal to: • BWM bits (W register selection) in the MODCON register are any value other than ‘15’ (the stack cannot be accessed using Bit-Reversed Addressing) • The BREN bit is set in the XBREV register • The addressing mode used is Register Indirect with Pre-Increment or Post-Increment • The upper boundary addresses for incrementing buffers • The lower boundary addresses for decrementing buffers It is important to realize that the address boundaries also check for addresses less than or greater than these addresses. Address changes can, therefore, jump beyond boundaries and still be adjusted correctly. Note: 3.5 The modulo corrected effective address is written back to the register only when Pre-Modify or Post-Modify Addressing mode is used to compute the effective address. When an address offset (such as [W7+W2]) is used, Modulo Address correction is performed but the contents of the register remain unchanged. If the length of a bit-reversed buffer is M = 2N bytes, the last ‘N’ bits of the data buffer start address must be zeros. XB<14:0> is the Bit-Reversed Address modifier, or ‘pivot point,’ which is typically a constant. In the case of an FFT computation, its value is equal to half of the FFT data buffer size. Note: Bit-Reversed Addressing Bit-Reversed Addressing mode is intended to simplify data re-ordering for radix-2 FFT algorithms. It is supported by the X AGU for data writes only. The modifier, which can be a constant value or register contents, is regarded as having its bit order reversed. The address source and destination are kept in normal order. Thus, the only operand requiring reversal is the modifier. All bit-reversed EA calculations assume word-sized data (LSB of every EA is always clear). The XB value is scaled accordingly to generate compatible (byte) addresses. When enabled, Bit-Reversed Addressing is executed only for Register Indirect with Pre-Increment or Post-Increment Addressing and word-sized data writes. It will not function for any other addressing mode or for byte-sized data, and normal addresses are generated instead. When Bit-Reversed Addressing is active, the W Address Pointer is always added to the address modifier (XB), and the offset associated with the Register Indirect Addressing mode is ignored. In addition, as word-sized data is a requirement, the LSb of the EA is ignored (and always clear). Note: Modulo Addressing and Bit-Reversed Addressing should not be enabled together. If an application attempts to do so, Bit-Reversed Addressing will assume priority when active for the X WAGU and X WAGU Modulo Addressing will be disabled. However, Modulo Addressing will continue to function in the X RAGU. If Bit-Reversed Addressing has already been enabled by setting the BREN (XBREV<15>) bit, a write to the XBREV register should not be immediately followed by an indirect read operation using the W register that has been designated as the bit-reversed pointer. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 41 dsPIC33FJ12GP201/202 FIGURE 3-6: BIT-REVERSED ADDRESS EXAMPLE Sequential Address b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 0 Bit Locations Swapped Left-to-Right Around Center of Binary Value b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4 0 Bit-Reversed Address Pivot Point XB = 0x0008 for a 16-Word Bit-Reversed Buffer TABLE 3-23: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY) Normal Address Bit-Reversed Address A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 0 0 8 0 0 1 0 2 0 1 0 0 4 0 0 1 1 3 1 1 0 0 12 0 1 0 0 4 0 0 1 0 2 0 1 0 1 5 1 0 1 0 10 0 1 1 0 6 0 1 1 0 6 0 1 1 1 7 1 1 1 0 14 1 0 0 0 8 0 0 0 1 1 1 0 0 1 9 1 0 0 1 9 1 0 1 0 10 0 1 0 1 5 1 0 1 1 11 1 1 0 1 13 1 1 0 0 12 0 0 1 1 3 1 1 0 1 13 1 0 1 1 11 1 1 1 0 14 0 1 1 1 7 1 1 1 1 15 1 1 1 1 15 DS70264B-page 42 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 3.6 Interfacing Program and Data Memory Spaces 3.6.1 Since the address ranges for the data and program spaces are 16 and 24 bits, respectively, a method is needed to create a 23-bit or 24-bit program address from 16-bit data registers. The solution depends on the interface method to be used. The dsPIC33FJ12GP201/202 architecture uses a 24-bit-wide program space and a 16-bit-wide data space. The architecture is also a modified Harvard scheme, meaning that data can also be present in the program space. To use this data successfully, it must be accessed in a way that preserves the alignment of information in both spaces. For table operations, the 8-bit Table Page register (TBLPAG) is used to define a 32K word region within the program space. This is concatenated with a 16-bit EA to arrive at a full 24-bit program space address. In this format, the Most Significant bit of TBLPAG is used to determine if the operation occurs in the user memory (TBLPAG<7> = 0) or the configuration memory (TBLPAG<7> = 1). Aside from normal execution, the dsPIC33FJ12GP201/202 architecture provides two methods by which program space can be accessed during operation: • Using table instructions to access individual bytes or words anywhere in the program space • Remapping a portion of the program space into the data space (Program Space Visibility) For remapping operations, the 8-bit Program Space Visibility register (PSVPAG) is used to define a 16K word page in the program space. When the Most Significant bit of the EA is ‘1’, PSVPAG is concatenated with the lower 15 bits of the EA to form a 23-bit program space address. Unlike table operations, this limits remapping operations strictly to the user memory area. Table instructions allow an application to read or write to small areas of the program memory. This capability makes the method ideal for accessing data tables that need to be updated periodically. It also allows access to all bytes of the program word. The remapping method allows an application to access a large block of data on a read-only basis, which is ideal for look ups from a large table of static data. The application can only access the least significant word of the program word. TABLE 3-24: ADDRESSING PROGRAM SPACE Table 3-24 and Figure 3-7 show how the program EA is created for table operations and remapping accesses from the data EA. Here, P<23:0> refers to a program space word, and D<15:0> refers to a data space word. PROGRAM SPACE ADDRESS CONSTRUCTION Access Space Access Type Program Space Address <23> <22:16> <15> <14:1> Instruction Access (Code Execution) User TBLRD/TBLWT (Byte/Word Read/Write) User TBLPAG<7:0> Configuration TBLPAG<7:0> Data EA<15:0> 1xxx xxxx xxxx xxxx xxxx xxxx Program Space Visibility (Block Remap/Read) Note 1: PC<22:1> 0 0xx xxxx 0xxx xxxx User xxxx <0> 0 xxxx xxxx xxx0 Data EA<15:0> xxxx xxxx xxxx xxxx 0 PSVPAG<7:0> 0 xxxx xxxx Data EA<14:0>(1) xxx xxxx xxxx xxxx Data EA<15> is always ‘1’ in this case, but is not used in calculating the program space address. Bit 15 of the address is PSVPAG<0>. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 43 dsPIC33FJ12GP201/202 FIGURE 3-7: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION Program Counter(1) Program Counter 0 0 23 bits EA Table Operations(2) 1/0 1/0 TBLPAG 8 bits 16 bits 24 bits Select Program Space Visibility(1) (Remapping) 0 1 EA 0 PSVPAG 8 bits 15 bits 23 bits User/Configuration Space Select Byte Select Note 1: The Least Significant bit (LSb) of program space addresses is always fixed as ‘0’ to maintain word alignment of data in the program and data spaces. 2: Table operations are not required to be word-aligned. Table read operations are permitted in the configuration memory space. DS70264B-page 44 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 3.6.2 DATA ACCESS FROM PROGRAM MEMORY USING TABLE INSTRUCTIONS The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the lower word of any address within the program space without going through data space. The TBLRDH and TBLWTH instructions are the only method to read or write the upper 8 bits of a program space word as data. The PC is incremented by two for each successive 24-bit program word. This allows program memory addresses to directly map to data space addresses. Program memory can thus be regarded as two 16-bit-wide word address spaces, residing side by side, each with the same address range. TBLRDL and TBLWTL access the space that contains the least significant data word. TBLRDH and TBLWTH access the space that contains the upper data byte. Two table instructions are provided to move byte or word-sized (16-bit) data to and from program space. Both function as either byte or word operations. • TBLRDL (Table Read Low): In Word mode, this instruction maps the lower word of the program space location (P<15:0>) to a data address (D<15:0>). FIGURE 3-8: In Byte mode, either the upper or lower byte of the lower program word is mapped to the lower byte of a data address. The upper byte is selected when Byte Select is ‘1’; the lower byte is selected when it is ‘0’. • TBLRDH (Table Read High): In Word mode, this instruction maps the entire upper word of a program address (P<23:16>) to a data address. Note that D<15:8>, the ‘phantom byte’, will always be ‘0’. In Byte mode, this instruction maps the upper or lower byte of the program word to D<7:0> of the data address, as in the TBLRDL instruction. Note that the data will always be ‘0’ when the upper ‘phantom’ byte is selected (Byte Select = 1). In a similar fashion, two table instructions, TBLWTH and TBLWTL, are used to write individual bytes or words to a program space address. The details of their operation are explained in Section 4.0 “Flash Program Memory”. For all table operations, the area of program memory space to be accessed is determined by the Table Page register (TBLPAG). TBLPAG covers the entire program memory space of the device, including user and configuration spaces. When TBLPAG<7> = 0, the table page is located in the user memory space. When TBLPAG<7> = 1, the page is located in configuration space. ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS Program Space TBLPAG 02 23 15 0 0x000000 23 16 8 0 00000000 0x020000 0x030000 00000000 00000000 00000000 ‘Phantom’ Byte TBLRDH.B (Wn<0> = 0) TBLRDL.B (Wn<0> = 1) TBLRDL.B (Wn<0> = 0) TBLRDL.W 0x800000 © 2007 Microchip Technology Inc. The address for the table operation is determined by the data EA within the page defined by the TBLPAG register. Only read operations are shown; write operations are also valid in the user memory area. Preliminary DS70264B-page 45 dsPIC33FJ12GP201/202 3.6.3 READING DATA FROM PROGRAM MEMORY USING PROGRAM SPACE VISIBILITY The upper 32 Kbytes of data space may optionally be mapped into any 16K word page of the program space. This option provides transparent access to stored constant data from the data space without the need to use special instructions (such as TBLRDL/H). Program space access through the data space occurs if the Most Significant bit of the data space EA is ‘1’ and program space visibility is enabled by setting the PSV bit in the Core Control register (CORCON<2>). The location of the program memory space to be mapped into the data space is determined by the Program Space Visibility Page register (PSVPAG). This 8-bit register defines any one of 256 possible pages of 16K words in program space. In effect, PSVPAG functions as the upper 8 bits of the program memory address, with the 15 bits of the EA functioning as the lower bits. By incrementing the PC by 2 for each program memory word, the lower 15 bits of data space addresses directly map to the lower 15 bits in the corresponding program space addresses. Data reads to this area add a cycle to the instruction being executed, since two program memory fetches are required. Although each data space address 8000h and higher maps directly into a corresponding program memory address (see Figure 3-9), only the lower 16 bits of the FIGURE 3-9: 24-bit program word are used to contain the data. The upper 8 bits of any program space location used as data should be programmed with ‘1111 1111’ or ‘0000 0000’ to force a NOP. This prevents possible issues should the area of code ever be accidentally executed. Note: PSV access is temporarily disabled during table reads/writes. For operations that use PSV and are executed outside a REPEAT loop, the MOV and MOV.D instructions require one instruction cycle in addition to the specified execution time. All other instructions require two instruction cycles in addition to the specified execution time. For operations that use PSV, and are executed inside a REPEAT loop, these instances require two instruction cycles in addition to the specified execution time of the instruction: • Execution in the first iteration • Execution in the last iteration • Execution prior to exiting the loop due to an interrupt • Execution upon re-entering the loop after an interrupt is serviced Any other iteration of the REPEAT loop will allow the instruction using PSV to access data to execute in a single cycle. PROGRAM SPACE VISIBILITY OPERATION When CORCON<2> = 1 and EA<15> = 1: Program Space PSVPAG 02 23 15 Data Space 0 0x000000 0x0000 Data EA<14:0> 0x010000 0x018000 The data in the page designated by PSVPAG is mapped into the upper half of the data memory space... 0x8000 PSV Area 0x800000 DS70264B-page 46 Preliminary ...while the lower 15 bits of the EA specify an exact address within 0xFFFF the PSV area. This corresponds exactly to the same lower 15 bits of the actual program space address. © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 4.0 Note: FLASH PROGRAM MEMORY then program the digital signal controller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. RTSP is accomplished using TBLRD (table read) and TBLWT (table write) instructions. With RTSP, the user application can write program memory data either in blocks or ‘rows’ of 64 instructions (192 bytes) at a time or a single program memory word, and erase program memory in blocks or ‘pages’ of 512 instructions (1536 bytes) at a time. 4.1 The dsPIC33FJ12GP201/202 devices contain internal Flash program memory for storing and executing application code. The memory is readable, writable and erasable during normal operation over the entire VDD range. Flash memory can be programmed in two ways: • In-Circuit Serial Programming™ (ICSP™) programming capability • Run-Time Self-Programming (RTSP) ICSP allows a dsPIC33FJ12GP201/202 device to be serially programmed while in the end application circuit. This is done with two lines for programming clock and programming data (one of the alternate programming pin pairs: PGC1/PGD1, PGC2/PGD2 or PGC3/PGD3), and three other lines for power (VDD), ground (VSS) and Master Clear (MCLR). This allows customers to manufacture boards with unprogrammed devices and FIGURE 4-1: Table Instructions and Flash Programming Regardless of the method used, all programming of Flash memory is done with the table read and table write instructions. These allow direct read and write access to the program memory space from the data memory while the device is in normal operating mode. The 24-bit target address in the program memory is formed using bits <7:0> of the TBLPAG register and the Effective Address (EA) from a W register specified in the table instruction, as shown in Figure 4-1. The TBLRDL and the TBLWTL instructions are used to read or write to bits<15:0> of program memory. TBLRDL and TBLWTL can access program memory in both Word and Byte modes. The TBLRDH and TBLWTH instructions are used to read or write to bits<23:16> of program memory. TBLRDH and TBLWTH can also access program memory in Word or Byte mode. ADDRESSING FOR TABLE REGISTERS 24 bits Using Program Counter Program Counter 0 0 Working Reg EA Using Table Instruction 1/0 TBLPAG Reg 8 bits User/Configuration Space Select © 2007 Microchip Technology Inc. 16 bits 24-bit EA Preliminary Byte Select DS70264B-page 47 dsPIC33FJ12GP201/202 4.2 RTSP Operation 4.3 The dsPIC33FJ12GP201/202 Flash program memory array is organized into rows of 64 instructions or 192 bytes. RTSP allows the user application to erase a page of memory, which consists of eight rows (512 instructions) at a time, and to program one row or one word at a time. The 8-row erase pages and single row write rows are edge-aligned from the beginning of program memory, on boundaries of 1536 bytes and 192 bytes, respectively. The program memory implements holding buffers that can contain 64 instructions of programming data. Prior to the actual programming operation, the write data must be loaded into the buffers sequentially. The instruction words loaded must always be from a group of 64 boundary. The basic sequence for RTSP programming is to set up a Table Pointer, then do a series of TBLWT instructions to load the buffers. Programming is performed by setting the control bits in the NVMCON register. A total of 64 TBLWTL and TBLWTH instructions are required to load the instructions. All of the table write operations are single-word writes (two instruction cycles) because only the buffers are written. A programming cycle is required for programming each row. DS70264B-page 48 Control Registers Two SFRs are used to read and write the program Flash memory: • NVMCON: Flash Memory Control Register • NVMKEY: NonVolatile Memory Key Register The NVMCON register (Register 4-1) controls which blocks are to be erased, which memory type is to be programmed and the start of the programming cycle. NVMKEY (Register 4-2) is a write-only register that is used for write protection. To start a programming or erase sequence, the user application must consecutively write 55h and AAh to the NVMKEY register. Refer to Section 4.4 “Programming Operations” for further details. 4.4 Programming Operations A complete programming sequence is necessary for programming or erasing the internal Flash in RTSP mode. A programming operation is nominally 4 ms in duration and the processor stalls (waits) until the operation is finished. Setting the WR bit (NVMCON<15>) starts the operation, and the WR bit is automatically cleared when the operation is finished. Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 4-1: NVMCON: FLASH MEMORY CONTROL REGISTER R/SO-0(1) R/W-0(1) R/W-0(1) U-0 U-0 U-0 U-0 U-0 WR WREN WRERR — — — — — bit 15 U-0 bit 8 R/W-0(1) — ERASE U-0 — U-0 R/W-0(1) R/W-0(1) — R/W-0(1) NVMOP<3:0> R/W-0(1) (2) bit 7 bit 0 Legend: SO = Satiable only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 WR: Write Control bit 1 = Initiates a Flash memory program or erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete. 0 = Program or erase operation is complete and inactive bit 14 WREN: Write Enable bit 1 = Enable Flash program/erase operations 0 = Inhibit Flash program/erase operations bit 13 WRERR: Write Sequence Error Flag bit 1 = An improper program or erase sequence attempt or termination has occurred (bit is set automatically on any set attempt of the WR bit) 0 = The program or erase operation completed normally bit 12-7 Unimplemented: Read as ‘0’ bit 6 ERASE: Erase/Program Enable bit 1 = Perform the erase operation specified by NVMOP<3:0> on the next WR command 0 = Perform the program operation specified by NVMOP<3:0> on the next WR command bit 5-4 Unimplemented: Read as ‘0’ bit 3-0 NVMOP<3:0>: NVM Operation Select bits(2) If ERASE = 1: 1111 = Memory bulk erase operation 1101 = Erase General Segment 1100 = Erase Secure Segment 0011 = No operation 0010 = Memory page erase operation 0001 = No operation 0000 = Erase a single Configuration register byte If ERASE = 0: 1111 = No operation 1101 = No operation 1100 = No operation 0011 = Memory word program operation 0010 = No operation 0001 = Memory row program operation 0000 = Program a single Configuration register byte Note 1: 2: These bits can only be Reset on POR. All other combinations of NVMOP<3:0> are unimplemented. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 49 dsPIC33FJ12GP201/202 REGISTER 4-2: NVMKEY: NONVOLATILE MEMORY KEY REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0 NVMKEY<7:0> bit 7 bit 0 Legend: SO = Satiable only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-8 Unimplemented: Read as ‘0’ bit 7-0 NVMKEY<7:0>: Key Register (write-only) bits DS70264B-page 50 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 4.4.1 PROGRAMMING ALGORITHM FOR FLASH PROGRAM MEMORY 4. 5. Programmers can program one row of program Flash memory at a time. To do this, it is necessary to erase the 8-row erase page that contains the desired row. The general process is: 1. 2. 3. Read eight rows of program memory (512 instructions) and store in data RAM. Update the program data in RAM with the desired new data. Erase the block (see Example 4-1): a) Set the NVMOP bits (NVMCON<3:0>) to ‘0010’ to configure for block erase. Set the ERASE (NVMCON<6>) and WREN (NVMCON<14>) bits. b) Write the starting address of the page to be erased into the TBLPAG and W registers. c) Write 55h to NVMKEY. d) Write AAh to NVMKEY. e) Set the WR bit (NVMCON<15>). The erase cycle begins and the CPU stalls for the duration of the erase cycle. When the erase is done, the WR bit is cleared automatically. EXAMPLE 4-1: For protection against accidental operations, the write initiate sequence for NVMKEY must be used to allow any erase or program operation to proceed. After the programming command has been executed, the user application must wait for the programming time until programming is complete. The two instructions following the start of the programming sequence should be NOPs, as shown in Example 4-3. ERASING A PROGRAM MEMORY PAGE ; Set up NVMCON for block erase operation MOV #0x4042, W0 MOV W0, NVMCON ; Init pointer to row to be ERASED MOV #tblpage(PROG_ADDR), W0 MOV W0, TBLPAG MOV #tbloffset(PROG_ADDR), W0 TBLWTL W0, [W0] DISI #5 MOV MOV MOV MOV BSET NOP NOP 6. Write the first 64 instructions from data RAM into the program memory buffers (see Example 4-2). Write the program block to Flash memory: a) Set the NVMOP bits to ‘0001’ to configure for row programming. Clear the ERASE bit and set the WREN bit. b) Write 55h to NVMKEY. c) Write AAh to NVMKEY. d) Set the WR bit. The programming cycle begins and the CPU stalls for the duration of the write cycle. When the write to Flash memory is done, the WR bit is cleared automatically. Repeat steps 4 and 5, using the next available 64 instructions from the block in data RAM by incrementing the value in TBLPAG, until all 512 instructions are written back to Flash memory. #0x55, W0 W0, NVMKEY #0xAA, W1 W1, NVMKEY NVMCON, #WR © 2007 Microchip Technology Inc. ; ; Initialize NVMCON ; ; ; ; ; ; ; ; ; ; ; ; Initialize PM Page Boundary SFR Initialize in-page EA[15:0] pointer Set base address of erase block Block all interrupts with priority <7 for next 5 instructions Write the 55 key Write the AA key Start the erase sequence Insert two NOPs after the erase command is asserted Preliminary DS70264B-page 51 dsPIC33FJ12GP201/202 EXAMPLE 4-2: LOADING THE WRITE BUFFERS ; Set up NVMCON for row programming operations MOV #0x4001, W0 ; MOV W0, NVMCON ; Initialize NVMCON ; Set up a pointer to the first program memory location to be written ; program memory selected, and writes enabled MOV #0x0000, W0 ; MOV W0, TBLPAG ; Initialize PM Page Boundary SFR MOV #0x6000, W0 ; An example program memory address ; Perform the TBLWT instructions to write the latches ; 0th_program_word MOV #LOW_WORD_0, W2 ; MOV #HIGH_BYTE_0, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch ; 1st_program_word MOV #LOW_WORD_1, W2 ; MOV #HIGH_BYTE_1, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch ; 2nd_program_word MOV #LOW_WORD_2, W2 ; MOV #HIGH_BYTE_2, W3 ; ; Write PM low word into program latch TBLWTL W2, [W0] ; Write PM high byte into program latch TBLWTH W3, [W0++] • • • ; 63rd_program_word MOV #LOW_WORD_31, W2 ; MOV #HIGH_BYTE_31, W3 ; ; Write PM low word into program latch TBLWTL W2, [W0] ; Write PM high byte into program latch TBLWTH W3, [W0++] EXAMPLE 4-3: INITIATING A PROGRAMMING SEQUENCE DISI #5 MOV MOV MOV MOV BSET NOP NOP #0x55, W0 W0, NVMKEY #0xAA, W1 W1, NVMKEY NVMCON, #WR DS70264B-page 52 ; Block all interrupts with priority <7 ; for next 5 instructions ; ; ; ; ; ; Write the 55 key Write the AA key Start the erase sequence Insert two NOPs after the erase command is asserted Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 5.0 Note: RESETS This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The Reset module combines all Reset sources and controls the device Master Reset Signal, SYSRST. The following is a list of device Reset sources: • • • • • • • POR: Power-on Reset BOR: Brown-out Reset MCLR: Master Clear Pin Reset SWR: RESET Instruction WDTO: Watchdog Timer Reset TRAPR: Trap Conflict Reset IOPUWR: Illegal Opcode and Uninitialized W Register Reset and Security Reset • CM: Configuration Mismatch Reset Any active source of Reset makes the SYSRST signal active. Many registers associated with the CPU and peripherals are forced to a known Reset state. Most registers are unaffected by a Reset; their status is unknown on POR and unchanged by all other Resets. Note: Refer to the specific peripheral or CPU section of this manual for register Reset states. All types of device Reset will set a corresponding status bit in the RCON register to indicate the type of Reset (see Register 5-1). A POR will clear all bits, except for the POR bit (RCON<0>), that are set. The user application can set or clear any bit at any time during code execution. The RCON bits only serve as status bits. Setting a particular Reset status bit in software does not cause a device Reset to occur. The RCON register also has other bits associated with the Watchdog Timer and device power-saving states. The function of these bits is discussed in other sections of this manual. Note: The status bits in the RCON register should be cleared after they are read so that the next RCON register value after a device Reset will be meaningful. A simplified block diagram of the Reset module is shown in Figure 5-1. FIGURE 5-1: RESET SYSTEM BLOCK DIAGRAM RESET Instruction Glitch Filter MCLR WDT Module Sleep or Idle VDD BOR Internal Regulator SYSRST VDD Rise Detect POR Trap Conflict Illegal Opcode Uninitialized W Register Configuration Mismatch © 2007 Microchip Technology Inc. Preliminary DS70264B-page 53 dsPIC33FJ12GP201/202 RCON: RESET CONTROL REGISTER(1) REGISTER 5-1: R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 TRAPR IOPUWR — — — — CM VREGS bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 EXTR SWR SWDTEN(2) WDTO SLEEP IDLE BOR POR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 TRAPR: Trap Reset Flag bit 1 = A Trap Conflict Reset has occurred 0 = A Trap Conflict Reset has not occurred bit 14 IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit 1 = An illegal opcode detection, an illegal address mode or uninitialized W register used as an Address Pointer caused a Reset 0 = An illegal opcode or uninitialized W Reset has not occurred bit 13-10 Unimplemented: Read as ‘0’ bit 9 CM: Configuration Mismatch Flag bit 1 = A configuration mismatch Reset has occurred. 0 = A configuration mismatch Reset has NOT occurred. bit 8 VREGS: Voltage Regulator Standby During Sleep bit 1 = Voltage regulator is active during Sleep 0 = Voltage regulator goes into Standby mode during Sleep bit 7 EXTR: External Reset (MCLR) Pin bit 1 = A Master Clear (pin) Reset has occurred 0 = A Master Clear (pin) Reset has not occurred bit 6 SWR: Software Reset (Instruction) Flag bit 1 = A RESET instruction has been executed 0 = A RESET instruction has not been executed bit 5 SWDTEN: Software Enable/Disable of WDT bit(2) 1 = WDT is enabled 0 = WDT is disabled bit 4 WDTO: Watchdog Timer Time-out Flag bit 1 = WDT time-out has occurred 0 = WDT time-out has not occurred bit 3 SLEEP: Wake-up from Sleep Flag bit 1 = Device has been in Sleep mode 0 = Device has not been in Sleep mode bit 2 IDLE: Wake-up from Idle Flag bit 1 = Device was in Idle mode 0 = Device was not in Idle mode Note 1: 2: All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not cause a device Reset. If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the SWDTEN bit setting. DS70264B-page 54 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 RCON: RESET CONTROL REGISTER(1) (CONTINUED) REGISTER 5-1: bit 1 BOR: Brown-out Reset Flag bit 1 = A Brown-out Reset has occurred 0 = A Brown-out Reset has not occurred bit 0 POR: Power-on Reset Flag bit 1 = A Power-up Reset has occurred 0 = A Power-up Reset has not occurred Note 1: 2: All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not cause a device Reset. If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the SWDTEN bit setting. RESET FLAG BIT OPERATION(1) TABLE 5-1: Flag Bit Setting Event Clearing Event TRAPR (RCON<15>) Trap conflict event POR, BOR IOPUWR (RCON<14>) Illegal opcode or uninitialized W register access POR, BOR CM (RCON<9>) Configuration mismatch POR, BOR EXTR (RCON<7>) MCLR Reset POR SWR (RCON<6>) RESET instruction POR, BOR WDTO (RCON<4>) WDT time-out PWRSAV instruction, POR, BOR, CLRWDT instruction SLEEP (RCON<3>) PWRSAV #SLEEP instruction POR, BOR IDLE (RCON<2>) PWRSAV #IDLE instruction POR, BOR BOR (RCON<1>) BOR — POR (RCON<0>) POR — Note 1: All Reset flag bits may be set or cleared by the user software. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 55 dsPIC33FJ12GP201/202 5.1 Clock Source Selection at Reset 5.2 If clock switching is enabled, the system clock source at device Reset is chosen as shown in Table 5-2. If clock switching is disabled, the system clock source is always selected according to the oscillator Configuration bits. Refer to Section 7.0 “Oscillator Configuration” for further details. TABLE 5-2: OSCILLATOR SELECTION vs. TYPE OF RESET (CLOCK SWITCHING ENABLED) Reset Type POR Clock Source Determinant Oscillator Configuration bits (FNOSC<2:0>) BOR MCLR Device Reset Times The Reset times for various types of device Reset are summarized in Table 5-3. The system Reset signal, SYSRST, is released after the POR and PWRT delay times expire. The time at which the device actually begins to execute code also depends on the system oscillator delays, which include the Oscillator Start-up Timer (OST) and the PLL lock time. The OST and PLL lock times occur in parallel with the applicable SYSRST delay times. The FSCM delay determines the time at which the FSCM begins to monitor the system clock source after the SYSRST signal is released. COSC Control bits (OSCCON<14:12>) WDTR SWR TABLE 5-3: Reset Type POR BOR RESET DELAY TIMES FOR VARIOUS DEVICE RESETS SYSRST Delay System Clock Delay FSCM Delay EC, FRC, LPRC TPOR + TSTARTUP + TRST — — Clock Source Notes 1, 2, 3 ECPLL, FRCPLL TPOR + TSTARTUP + TRST TLOCK TFSCM 1, 2, 3, 5, 6 XT, HS, SOSC TPOR + TSTARTUP + TRST TOST TFSCM 1, 2, 3, 4, 6 XTPLL, HSPLL TPOR + TSTARTUP + TRST TOST + TLOCK TFSCM 1, 2, 3, 4, 5, 6 EC, FRC, LPRC TSTARTUP + TRST — — ECPLL, FRCPLL TSTARTUP + TRST TLOCK TFSCM 3, 5, 6 3 XT, HS, SOSC TSTARTUP + TRST TOST TFSCM 3, 4, 6 XTPLL, HSPLL TSTARTUP + TRST TOST + TLOCK TFSCM 3, 4, 5, 6 MCLR Any Clock TRST — — 3 WDT Any Clock TRST — — 3 Software Any Clock TRST — — 3 Illegal Opcode Any Clock TRST — — 3 Uninitialized W Any Clock TRST — — 3 Trap Conflict Any Clock TRST — — 3 Note 1: 2: 3: 4: 5: 6: TPOR = Power-on Reset delay (10 μs nominal). TSTARTUP = Conditional POR delay of 20 μs nominal (if on-chip regulator is enabled) or 64 ms nominal Power-up Timer delay (if regulator is disabled). TSTARTUP is also applied to all returns from powered-down states, including waking from Sleep mode, only if the regulator is enabled. TRST = Internal state Reset time (20 μs nominal). TOST = Oscillator Start-up Timer. A 10-bit counter counts 1024 oscillator periods before releasing the oscillator clock to the system. TLOCK = PLL lock time (20 μs nominal). TFSCM = Fail-Safe Clock Monitor delay (100 μs nominal). DS70264B-page 56 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 5.2.1 POR AND LONG OSCILLATOR START-UP TIMES 5.2.2.1 The oscillator start-up circuitry and its associated delay timers are not linked to the device Reset delays that occur at power-up. Some crystal circuits (especially low-frequency crystals) have a relatively long start-up time. Therefore, one or more of the following conditions is possible after SYSRST is released: • The oscillator circuit has not begun to oscillate. • The Oscillator Start-up Timer has not expired (if a crystal oscillator is used). • The PLL has not achieved a lock (if PLL is used). The device will not begin to execute code until a valid clock source has been released to the system. Therefore, the oscillator and PLL start-up delays must be considered when the Reset delay time must be known. 5.2.2 FAIL-SAFE CLOCK MONITOR (FSCM) AND DEVICE RESETS If the FSCM is enabled, it begins to monitor the system clock source when SYSRST is released. If a valid clock source is not available at this time, the device automatically switches to the FRC oscillator and the user application can switch to the desired crystal oscillator in the Trap Service Routine (TSR). © 2007 Microchip Technology Inc. FSCM Delay for Crystal and PLL Clock Sources When the system clock source is provided by a crystal oscillator and/or the PLL, a short delay, TFSCM, is automatically inserted after the POR and PWRT delay times. The FSCM does not begin to monitor the system clock source until this delay expires. The FSCM delay time is nominally 500 μs and provides additional time for the oscillator and/or PLL to stabilize. In most cases, the FSCM delay prevents an oscillator failure trap at a device Reset when the PWRT is disabled. 5.3 Special Function Register Reset States Most of the Special Function Registers (SFRs) associated with the CPU and peripherals are reset to a particular value at a device Reset. The SFRs are grouped by their peripheral or CPU function, and their Reset values are specified in each section of this manual. The Reset value for each SFR does not depend on the type of Reset, with the exception of two registers: • The Reset value for the Reset Control register, RCON, depends on the type of device Reset. • The Reset value for the Oscillator Control register, OSCCON, depends on the type of Reset and the programmed values of the Oscillator Configuration bits in the FOSC Configuration register. Preliminary DS70264B-page 57 dsPIC33FJ12GP201/202 NOTES: DS70264B-page 58 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 6.0 Note: INTERRUPT CONTROLLER 6.1.1 This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The dsPIC33FJ12GP201/202 interrupt controller reduces the numerous peripheral interrupt request signals to a single interrupt request signal to the dsPIC33FJ12GP201/202 CPU. It has the following features: • • • • Up to 8 processor exceptions and software traps 7 user-selectable priority levels Interrupt Vector Table (IVT) with up to 118 vectors A unique vector for each interrupt or exception source • Fixed priority within a specified user priority level • Alternate Interrupt Vector Table (AIVT) for debug support • Fixed interrupt entry and return latencies 6.1 Interrupt Vector Table The Interrupt Vector Table is shown in Figure 6-1. The IVT resides in program memory, starting at location 000004h. The IVT contains 126 vectors consisting of 8 nonmaskable trap vectors plus up to 118 sources of interrupt. In general, each interrupt source has its own vector. Each interrupt vector contains a 24-bit wide address. The value programmed into each interrupt vector location is the starting address of the associated Interrupt Service Routine (ISR). ALTERNATE INTERRUPT VECTOR TABLE The Alternate Interrupt Vector Table (AIVT) is located after the IVT, as shown in Figure 6-1. Access to the AIVT is provided by the ALTIVT control bit (INTCON2<15>). If the ALTIVT bit is set, all interrupt and exception processes use the alternate vectors instead of the default vectors. The alternate vectors are organized in the same manner as the default vectors. The AIVT supports debugging by providing a means to switch between an application and a support environment without requiring the interrupt vectors to be reprogrammed. This feature also enables switching between applications for evaluation of different software algorithms at run time. If the AIVT is not needed, the AIVT should be programmed with the same addresses used in the IVT. 6.2 Reset Sequence A device Reset is not a true exception because the interrupt controller is not involved in the Reset process. The dsPIC33FJ12GP201/202 device clears its registers in response to a Reset, which forces the PC to zero. The digital signal controller then begins program execution at location 0x000000. The user application can use a GOTO instruction at the Reset address which redirects program execution to the appropriate start-up routine. Note: Any unimplemented or unused vector locations in the IVT and AIVT should be programmed with the address of a default interrupt handler routine that contains a RESET instruction. Interrupt vectors are prioritized in terms of their natural priority; this priority is linked to their position in the vector table. Lower addresses generally have a higher natural priority. For example, the interrupt associated with vector 0 will take priority over interrupts at any other vector address. dsPIC33FJ12GP201/202 devices implement up to 21 unique interrupts and 4 nonmaskable traps. These are summarized in Table 6-1 and Table 6-2. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 59 dsPIC33FJ12GP201/202 Decreasing Natural Order Priority FIGURE 6-1: Note 1: DS70264B-page 60 dsPIC33FJ12GP201/202 INTERRUPT VECTOR TABLE Reset – GOTO Instruction Reset – GOTO Address Reserved Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Reserved Reserved Interrupt Vector 0 Interrupt Vector 1 ~ ~ ~ Interrupt Vector 52 Interrupt Vector 53 Interrupt Vector 54 ~ ~ ~ Interrupt Vector 116 Interrupt Vector 117 Reserved Reserved Reserved Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Reserved Reserved Interrupt Vector 0 Interrupt Vector 1 ~ ~ ~ Interrupt Vector 52 Interrupt Vector 53 Interrupt Vector 54 ~ ~ ~ Interrupt Vector 116 Interrupt Vector 117 Start of Code 0x000000 0x000002 0x000004 0x000014 0x00007C 0x00007E 0x000080 Interrupt Vector Table (IVT)(1) 0x0000FC 0x0000FE 0x000100 0x000102 0x000114 Alternate Interrupt Vector Table (AIVT)(1) 0x00017C 0x00017E 0x000180 0x0001FE 0x000200 See Table 6-1 for the list of implemented interrupt vectors. Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 6-1: INTERRUPT VECTORS Vector Number Interrupt Request (IRQ) Number IVT Address AIVT Address 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 0x000014 0x000016 0x000018 0x00001A 0x00001C 0x00001E 0x000020 0x000022 0x000024 0x000026 0x000028 0x00002A 0x00002C 0x00002E 0x000030 0x000032 0x000034 0x000036 0x000038 0x00003A 0x00003C 0x00003E 0x000040 0x000042 0x000044 0x000046 0x000048 0x00004A 0x00004C 0x00004E 0x000050 0x000052 0x000054 0x000056 0x000058 0x00005A 0x00005C 0x00005E 0x000060 0x000062 0x000064 0x000066 0x000068 0x00006A 0x00006C 0x00006E 0x000114 0x000116 0x000118 0x00011A 0x00011C 0x00011E 0x000120 0x000122 0x000124 0x000126 0x000128 0x00012A 0x00012C 0x00012E 0x000130 0x000132 0x000134 0x000136 0x000138 0x00013A 0x00013C 0x00013E 0x000140 0x000142 0x000144 0x000146 0x000148 0x00014A 0x00014C 0x00014E 0x000150 0x000152 0x000154 0x000156 0x000158 0x00015A 0x00015C 0x00015E 0x000160 0x000162 0x000164 0x000166 0x000168 0x00016A 0x00016C 0x00016E © 2007 Microchip Technology Inc. Preliminary Interrupt Source INT0 – External Interrupt 0 IC1 – Input Compare 1 OC1 – Output Compare 1 T1 – Timer1 Reserved IC2 – Input Capture 2 OC2 – Output Compare 2 T2 – Timer2 T3 – Timer3 SPI1E – SPI1 Error SPI1 – SPI1 Transfer Done U1RX – UART1 Receiver U1TX – UART1 Transmitter ADC1 – ADC 1 Reserved Reserved SI2C1 – I2C1 Slave Events MI2C1 – I2C1 Master Events Reserved Change Notification Interrupt INT1 – External Interrupt 1 Reserved IC7 – Input Capture 7 IC8 – Input Capture 8 Reserved Reserved Reserved Reserved Reserved INT2 – External Interrupt 2 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved DS70264B-page 61 dsPIC33FJ12GP201/202 TABLE 6-1: INTERRUPT VECTORS (CONTINUED) Vector Number Interrupt Request (IRQ) Number 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80-125 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72-117 TABLE 6-2: IVT Address AIVT Address 0x000070 0x000072 0x000074 0x000076 0x000078 0x00007A 0x00007C 0x00007E 0x000080 0x000082 0x000084 0x000086 0x000088 0x00008A 0x00008C 0x00008E 0x000090 0x000092 0x000094 0x000096 0x000098 0x00009A 0x00009C 0x00009E 0x0000A0 0x0000A2 0x0000A40x0000FE 0x000170 0x000172 0x000174 0x000176 0x000178 0x00017A 0x00017C 0x00017E 0x000180 0x000182 0x000184 0x000186 0x000188 0x00018A 0x00018C 0x00018E 0x000190 0x000192 0x000194 0x000196 0x000198 0x00019A 0x00019C 0x00019E 0x0001A0 0x0001A2 0x0001A40x0001FE Interrupt Source Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved U1E – UART1 Error Reserved Reserved Reserved Reserved Reserved Reserved Reserved TRAP VECTORS Vector Number IVT Address AIVT Address Trap Source 0 0x000004 0x000104 Reserved 1 0x000006 0x000106 Oscillator Failure 2 0x000008 0x000108 Address Error 3 0x00000A 0x00010A Stack Error 4 0x00000C 0x00010C Math Error 5 0x00000E 0x00010E Reserved 6 0x000010 0x000110 Reserved 7 0x000012 0x000112 Reserved DS70264B-page 62 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 6.3 Interrupt Control and Status Registers 6.3.4 dsPIC33FJ12GP201/202 devices implement a total of 17 registers for the interrupt controller: • • • • • • Interrupt Control Register 1 (INTCON1) Interrupt Control Register 2 (INTCON2) Interrupt Flag Status Registers (IFSx) Interrupt Enable Control Registers (IECx) Interrupt Priority Control Registers (IPCx) Interrupt Control and Status Register (INTTREG) 6.3.1 INTCON1 AND INTCON2 Global interrupt control functions are controlled from INTCON1 and INTCON2. INTCON1 contains the Interrupt Nesting Disable (NSTDIS) bit as well as the control and status flags for the processor trap sources. The INTCON2 register controls the external interrupt request signal behavior and the use of the Alternate Interrupt Vector Table. 6.3.2 IFSx The IFS registers maintain all of the interrupt request flags. Each source of interrupt has a status bit, which is set by the respective peripherals or external signal and is cleared via software. 6.3.3 IECx The IEC registers maintain all of the interrupt enable bits. These control bits are used to individually enable interrupts from the peripherals or external signals. IPCx The IPC registers are used to set the interrupt priority level for each source of interrupt. Each user interrupt source can be assigned to one of eight priority levels. 6.3.5 INTTREG The INTTREG register contains the associated interrupt vector number and the new CPU interrupt priority level, which are latched into vector number (VECNUM<6:0>) and Interrupt level (ILR<3:0>) bit fields in the INTTREG register. The new interrupt priority level is the priority of the pending interrupt. The interrupt sources are assigned to the IFSx, IECx and IPCx registers in the same sequence that they are listed in Table 6-1. For example, the INT0 (External Interrupt 0) is shown as having vector number 8 and a natural order priority of 0. Thus, the INT0IF bit is found in IFS0<0>, the INT0IE bit in IEC0<0>, and the INT0IP bits in the first position of IPC0 (IPC0<2:0>). 6.3.6 STATUS REGISTERS Although they are not specifically part of the interrupt control hardware, two of the CPU Control registers contain bits that control interrupt functionality: • The CPU STATUS register, SR, contains the IPL<2:0> bits (SR<7:5>). These bits indicate the current CPU interrupt priority level. The user can change the current CPU priority level by writing to the IPL bits. • The CORCON register contains the IPL3 bit which, together with IPL<2:0>, also indicates the current CPU priority level. IPL3 is a read-only bit, so that trap events cannot be masked by the user software. All Interrupt registers are described in Register 6-1 through Register 6-19 in the following pages. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 63 dsPIC33FJ12GP201/202 REGISTER 6-1: SR: CPU STATUS REGISTER(1) R-0 R-0 R/C-0 R/C-0 R-0 R/C-0 R -0 R/W-0 OA OB SA SB OAB SAB DA DC bit 15 bit 8 R/W-0(3) R/W-0(3) IPL2(2) IPL1 (2) R/W-0(3) R-0 R/W-0 R/W-0 R/W-0 R/W-0 IPL0(2) RA N OV Z C bit 7 bit 0 Legend: C = Clear only bit R = Readable bit U = Unimplemented bit, read as ‘0’ S = Set only bit W = Writable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown IPL<2:0>: CPU Interrupt Priority Level Status bits(1) 111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled 110 = CPU Interrupt Priority Level is 6 (14) 101 = CPU Interrupt Priority Level is 5 (13) 100 = CPU Interrupt Priority Level is 4 (12) 011 = CPU Interrupt Priority Level is 3 (11) 010 = CPU Interrupt Priority Level is 2 (10) 001 = CPU Interrupt Priority Level is 1 (9) 000 = CPU Interrupt Priority Level is 0 (8) bit 7-5 Note 1: 2: 3: For complete register details, see Register 2-1: “SR: CPU Status Register”. The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3> = 1. The IPL<2:0> Status bits are read-only when NSTDIS (INTCON1<15>) = 1. REGISTER 6-2: CORCON: CORE CONTROL REGISTER(1) U-0 — bit 15 U-0 — R/W-0 SATA bit 7 R/W-0 SATB Note 1: 2: R/W-0 US R/W-0 EDT R-0 R-0 DL<2:0> R-0 bit 8 Legend: R = Readable bit 0’ = Bit is cleared bit 3 U-0 — R/W-1 SATDW R/W-0 ACCSAT C = Clear only bit W = Writable bit ‘x = Bit is unknown R/C-0 IPL3(2) R/W-0 PSV R/W-0 RND R/W-0 IF bit 0 -n = Value at POR ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ IPL3: CPU Interrupt Priority Level Status bit 3(2) 1 = CPU interrupt priority level is greater than 7 0 = CPU interrupt priority level is 7 or less For complete register details, see Register 2-2: “CORCON: CORE Control Register”. The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level. DS70264B-page 64 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 6-3: INTCON1: INTERRUPT CONTROL REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE bit 15 bit 8 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 SFTACERR DIV0ERR — MATHERR ADDRERR STKERR OSCFAIL — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 NSTDIS: Interrupt Nesting Disable bit 1 = Interrupt nesting is disabled 0 = Interrupt nesting is enabled bit 14 OVAERR: Accumulator A Overflow Trap Flag bit 1 = Trap was caused by overflow of Accumulator A 0 = Trap was not caused by overflow of Accumulator A bit 13 OVBERR: Accumulator B Overflow Trap Flag bit 1 = Trap was caused by overflow of Accumulator B 0 = Trap was not caused by overflow of Accumulator B bit 12 COVAERR: Accumulator A Catastrophic Overflow Trap Enable bit 1 = Trap was caused by catastrophic overflow of Accumulator A 0 = Trap was not caused by catastrophic overflow of Accumulator A bit 11 COVBERR: Accumulator B Catastrophic Overflow Trap Enable bit 1 = Trap was caused by catastrophic overflow of Accumulator B 0 = Trap was not caused by catastrophic overflow of Accumulator B bit 10 OVATE: Accumulator A Overflow Trap Enable bit 1 = Trap overflow of Accumulator A 0 = Trap disabled bit 9 OVBTE: Accumulator B Overflow Trap Enable bit 1 = Trap overflow of Accumulator B 0 = Trap disabled bit 8 COVTE: Catastrophic Overflow Trap Enable bit 1 = Trap on catastrophic overflow of Accumulator A or B enabled 0 = Trap disabled bit 7 SFTACERR: Shift Accumulator Error Status bit 1 = Math error trap was caused by an invalid accumulator shift 0 = Math error trap was not caused by an invalid accumulator shift bit 6 DIV0ERR: Arithmetic Error Status bit 1 = Math error trap was caused by a divide by zero 0 = Math error trap was not caused by a divide by zero bit 5 Unimplemented: Read as ‘0’ bit 4 MATHERR: Arithmetic Error Status bit 1 = Math error trap has occurred 0 = Math error trap has not occurred bit 3 ADDRERR: Address Error Trap Status bit 1 = Address error trap has occurred 0 = Address error trap has not occurred © 2007 Microchip Technology Inc. Preliminary x = Bit is unknown DS70264B-page 65 dsPIC33FJ12GP201/202 REGISTER 6-3: INTCON1: INTERRUPT CONTROL REGISTER 1 (CONTINUED) bit 2 STKERR: Stack Error Trap Status bit 1 = Stack error trap has occurred 0 = Stack error trap has not occurred bit 1 OSCFAIL: Oscillator Failure Trap Status bit 1 = Oscillator failure trap has occurred 0 = Oscillator failure trap has not occurred bit 0 Unimplemented: Read as ‘0’ DS70264B-page 66 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 6-4: INTCON2: INTERRUPT CONTROL REGISTER 2 R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0 ALTIVT DISI — — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 — — — — — INT2EP INT1EP INT0EP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 ALTIVT: Enable Alternate Interrupt Vector Table bit 1 = Use alternate vector table 0 = Use standard (default) vector table bit 14 DISI: DISI Instruction Status bit 1 = DISI instruction is active 0 = DISI instruction is not active bit 13-3 Unimplemented: Read as ‘0’ bit 2 INT2EP: External Interrupt 2 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 1 INT1EP: External Interrupt 1 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 0 INT0EP: External Interrupt 0 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge © 2007 Microchip Technology Inc. Preliminary x = Bit is unknown DS70264B-page 67 dsPIC33FJ12GP201/202 REGISTER 6-5: IFS0: INTERRUPT FLAG STATUS REGISTER 0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — AD1IF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 T2IF OC2IF IC2IF — T1IF OC1IF IC1IF INT0IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-14 Unimplemented: Read as ‘0’ bit 13 AD1IF: ADC1 Conversion Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 U1TXIF: UART1 Transmitter Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 U1RXIF: UART1 Receiver Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 SPI1IF: SPI1 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 SPI1EIF: SPI1 Fault Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 T3IF: Timer3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 T2IF: Timer2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 OC2IF: Output Compare Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 IC2IF: Input Capture Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 Unimplemented: Read as ‘0’ bit 3 T1IF: Timer1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 OC1IF: Output Compare Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred DS70264B-page 68 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 6-5: IFS0: INTERRUPT FLAG STATUS REGISTER 0 (CONTINUED) bit 1 IC1IF: Input Capture Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 INT0IF: External Interrupt 0 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred © 2007 Microchip Technology Inc. Preliminary DS70264B-page 69 dsPIC33FJ12GP201/202 REGISTER 6-6: IFS1: INTERRUPT FLAG STATUS REGISTER 1 U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 — — INT2IF — — — — — bit 15 bit 8 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 IC8IF IC7IF — INT1IF CNIF — MI2C1IF SI2C1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-14 Unimplemented: Read as ‘0’ bit 13 INT2IF: External Interrupt 2 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12-8 Unimplemented: Read as ‘0’ bit 7 IC8IF: Input Capture Channel 8 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 IC7IF: Input Capture Channel 7 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 Unimplemented: Read as ‘0’ bit 4 INT1IF: External Interrupt 1 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 CNIF: Input Change Notification Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 Unimplemented: Read as ‘0’ bit 1 MI2C1IF: I2C1 Master Events Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 SI2C1IF: I2C1 Slave Events Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred DS70264B-page 70 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 6-7: IFS4: INTERRUPT FLAG STATUS REGISTER 4 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — U1EIF — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-2 Unimplemented: Read as ‘0’ bit 1 U1EIF: UART1 Error Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 Unimplemented: Read as ‘0’ © 2007 Microchip Technology Inc. Preliminary x = Bit is unknown DS70264B-page 71 dsPIC33FJ12GP201/202 REGISTER 6-8: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — AD1IE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 T2IE OC2IE IC2IE — T1IE OC1IE IC1IE INT0IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-14 Unimplemented: Read as ‘0’ bit 13 AD1IE: ADC1 Conversion Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 U1TXIE: UART1 Transmitter Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 U1RXIE: UART1 Receiver Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 SPI1IE: SPI1 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 SPI1EIE: SPI1 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 T3IE: Timer3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 T2IE: Timer2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 OC2IE: Output Compare Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 IC2IE: Input Capture Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 Unimplemented: Read as ‘0’ bit 3 T1IE: Timer1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 OC1IE: Output Compare Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled DS70264B-page 72 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 6-8: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 (CONTINUED) bit 1 IC1IE: Input Capture Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 INT0IE: External Interrupt 0 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled © 2007 Microchip Technology Inc. Preliminary DS70264B-page 73 dsPIC33FJ12GP201/202 REGISTER 6-9: IEC1: INTERRUPT ENABLE CONTROL REGISTER 0 U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 — — INT2IE — — — — — bit 15 bit 8 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 IC8IE IC7IE — INT1IE CNIE — MI2C1IE SI2C1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-14 Unimplemented: Read as ‘0’ bit 13 INT2IE: External Interrupt 2 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12-8 Unimplemented: Read as ‘0’ bit 7 IC8IE: Input Capture Channel 8 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 IC7IE: Input Capture Channel 7 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 Unimplemented: Read as ‘0’ bit 4 INT1IE: External Interrupt 1 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 3 CNIE: Input Change Notification Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 Unimplemented: Read as ‘0’ bit 1 MI2C1IE: I2C1 Master Events Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 SI2C1IE: I2C1 Slave Events Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled DS70264B-page 74 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 6-10: IEC4: INTERRUPT ENABLE CONTROL REGISTER 0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0 — — — — — — U1EIE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-2 Unimplemented: Read as ‘0’ bit 1 U1EIE: UART1 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 Unimplemented: Read as ‘0’ © 2007 Microchip Technology Inc. Preliminary x = Bit is unknown DS70264B-page 75 dsPIC33FJ12GP201/202 REGISTER 6-11: U-0 IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0 R/W-1 — R/W-0 R/W-0 T1IP<2:0> U-0 R/W-1 — R/W-0 R/W-0 OC1IP<2:0> bit 15 bit 8 U-0 R/W-1 — R/W-0 IC1IP<2:0> R/W-0 U-0 R/W-1 — R/W-0 R/W-0 INT0IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 Unimplemented: Read as ‘0’ bit 14-12 T1IP<2:0>: Timer1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 INT0IP<2:0>: External Interrupt 0 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70264B-page 76 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 6-12: U-0 IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1 R/W-1 — R/W-0 R/W-0 T2IP<2:0> U-0 R/W-1 — R/W-0 R/W-0 OC2IP<2:0> bit 15 bit 8 U-0 R/W-1 — R/W-0 IC2IP<2:0> R/W-0 U-0 U-0 U-0 U-0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 Unimplemented: Read as ‘0’ bit 14-12 T2IP<2:0>: Timer2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’ © 2007 Microchip Technology Inc. Preliminary x = Bit is unknown DS70264B-page 77 dsPIC33FJ12GP201/202 REGISTER 6-13: U-0 IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2 R/W-1 — R/W-0 R/W-0 U1RXIP<2:0> U-0 R/W-1 — R/W-0 R/W-0 SPI1IP<2:0> bit 15 bit 8 U-0 R/W-1 — R/W-0 SPI1EIP<2:0> R/W-0 U-0 — R/W-1 R/W-0 R/W-0 T3IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 Unimplemented: Read as ‘0’ bit 14-12 U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 SPI1IP<2:0>: SPI1 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 SPI1EIP<2:0>: SPI1 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 T3IP<2:0>: Timer3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70264B-page 78 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 6-14: IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 R/W-1 — R/W-0 AD1IP<2:0> R/W-0 U-0 R/W-1 — R/W-0 R/W-0 U1TXIP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-7 Unimplemented: Read as ‘0’ bit 6-4 AD1IP<2:0>: ADC1 Conversion Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled © 2007 Microchip Technology Inc. Preliminary x = Bit is unknown DS70264B-page 79 dsPIC33FJ12GP201/202 REGISTER 6-15: U-0 IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4 R/W-1 — R/W-0 R/W-0 CNIP<2:0> U-0 U-0 U-0 U-0 — — — — bit 15 bit 8 U-0 R/W-1 — R/W-0 MI2C1IP<2:0> R/W-0 U-0 — R/W-1 R/W-0 R/W-0 SI2C1IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 Unimplemented: Read as ‘0’ bit 14-12 CNIP<2:0>: Change Notification Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11-7 Unimplemented: Read as ‘0’ bit 6-4 MI2C1IP<2:0>: I2C1 Master Events Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 SI2C1IP<2:0>: I2C1 Slave Events Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70264B-page 80 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 6-16: U-0 IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5 R/W-1 — R/W-0 R/W-0 IC8IP<2:0> U-0 R/W-1 — R/W-0 R/W-0 IC7IP<2:0> bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 — — — — — R/W-1 R/W-0 R/W-0 INT1IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 Unimplemented: Read as ‘0’ bit 14-12 IC8IP<2:0>: Input Capture Channel 8 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 IC7IP<2:0>: Input Capture Channel 7 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 INT1IP<2:0>: External Interrupt 1 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled © 2007 Microchip Technology Inc. Preliminary x = Bit is unknown DS70264B-page 81 dsPIC33FJ12GP201/202 REGISTER 6-17: IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 R/W-1 — R/W-0 INT2IP<2:0> R/W-0 U-0 U-0 U-0 U-0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-7 Unimplemented: Read as ‘0’ bit 6-4 INT2IP<2:0>: External Interrupt 2 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’ DS70264B-page 82 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 6-18: IPC16: INTERRUPT PRIORITY CONTROL REGISTER 16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 R/W-1 — R/W-0 U1EIP<2:0> R/W-0 U-0 U-0 U-0 U-0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-7 Unimplemented: Read as ‘0’ bit 6-4 U1EIP<2:0>: UART1 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as ‘0’ © 2007 Microchip Technology Inc. Preliminary x = Bit is unknown DS70264B-page 83 dsPIC33FJ12GP201/202 REGISTER 6-19: INTTREG: INTERRUPT CONTROL AND STATUS REGISTER U-0 U-0 U-0 U-0 — — — — R-0 R-0 R-0 R-0 ILR<3:0> bit 15 bit 8 U-0 R-0 R-0 R-0 — R-0 R-0 R-0 R-0 VECNUM<6:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-12 Unimplemented: Read as ‘0’ bit 11-8 ILR: New CPU Interrupt Priority Level bits 1111 = CPU Interrupt Priority Level is 15 • • • 0001 = CPU Interrupt Priority Level is 1 0000 = CPU Interrupt Priority Level is 0 bit 7 Unimplemented: Read as ‘0’ bit 6-0 VECNUM: Vector Number of Pending Interrupt bits 0111111 = Interrupt Vector pending is number 135 • • • 0000001 = Interrupt Vector pending is number 9 0000000 = Interrupt Vector pending is number 8 DS70264B-page 84 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 6.4 Interrupt Setup Procedures 6.4.1 6.4.3 A Trap Service Routine is coded like an ISR, except that the appropriate trap status flag in the INTCON1 register must be cleared to avoid re-entry into the TSR. INITIALIZATION To configure an interrupt source at initialization: 1. 2. Set the NSTDIS bit (INTCON1<15>) if nested interrupts are not desired. Select the user-assigned priority level for the interrupt source by writing the control bits in the appropriate IPCx register. The priority level will depend on the specific application and type of interrupt source. If multiple priority levels are not desired, the IPCx register control bits for all enabled interrupt sources can be programmed to the same non-zero value. Note: 3. 4. At a device Reset, the IPCx registers are initialized such that all user interrupt sources are assigned to priority level 4. Clear the interrupt flag status bit associated with the peripheral in the associated IFSx register. Enable the interrupt source by setting the interrupt enable control bit associated with the source in the appropriate IECx register. 6.4.2 TRAP SERVICE ROUTINE 6.4.4 INTERRUPT DISABLE All user interrupts can be disabled using this procedure: 1. Push the current SR value onto the software stack using the PUSH instruction. Force the CPU to priority level 7 by inclusive ORing the value OEh with SRL. 2. To enable user interrupts, the POP instruction can be used to restore the previous SR value. Note: Only user interrupts with a priority level of 7 or lower can be disabled. Trap sources (level 8-level 15) cannot be disabled. The DISI instruction provides a convenient way to disable interrupts of priority levels 1-6 for a fixed period of time. Level 7 interrupt sources are not disabled by the DISI instruction. INTERRUPT SERVICE ROUTINE The method used to declare an ISR and initialize IVT with the correct vector address depends on programming language (C or Assembler) and language development toolsuite used to develop application. the the the the In general, the user application must clear the interrupt flag in the appropriate IFSx register for the source of interrupt that the ISR handles. Otherwise, the program will re-enter the ISR immediately after exiting the routine. If the ISR is coded in assembly language, it must be terminated using a RETFIE instruction to unstack the saved PC value, SRL value and old CPU priority level. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 85 dsPIC33FJ12GP201/202 NOTES: DS70264B-page 86 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 7.0 OSCILLATOR CONFIGURATION Note: This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The dsPIC33FJ12GP201/202 provides: oscillator system A simplified diagram of the oscillator system is shown in Figure 7-1. • External and internal oscillator options as clock sources FIGURE 7-1: • An on-chip PLL to scale the internal operating frequency to the required system clock frequency • An internal FRC oscillator that can also be used with the PLL, thereby allowing full-speed operation without any external clock generation hardware • Clock switching between various clock sources • Programmable clock postscaler for system power savings • A Fail-Safe Clock Monitor (FSCM) that detects clock failure and takes fail-safe measures • A Clock Control register (OSCCON) • Nonvolatile Configuration bits for main oscillator selection. dsPIC33FJ12GP201/202 OSCILLATOR SYSTEM DIAGRAM dsPIC33F Primary Oscillator S3 OSCI PLL S1 (1) XTPLL, HSPLL, ECPLL, FRCPLL DOZE<2:0> S2 DOZE XT, HS, EC OSCO S1/S3 FCY ÷ 2 FRCDIV FOSC FRC Oscillator FRCDIVN S7 FRCDIV<2:0> TUN<5:0> ÷ 16 FRCDIV16 FRC LPRC LPRC Oscillator Secondary Oscillator SOSC SOSCO S6 S0 S5 S4 LPOSCEN SOSCI Clock Fail S7 Clock Switch Reset NOSC<2:0> FNOSC<2:0> WDT, PWRT, FSCM Timer 1 Note 1: See Figure 7-2 for PLL details. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 87 dsPIC33FJ12GP201/202 7.1 CPU Clocking System 7.1.2 The dsPIC33FJ12GP201/202 device provides seven system clock options: • • • • • • • Fast RC (FRC) Oscillator FRC Oscillator with PLL Primary (XT, HS or EC) Oscillator Primary Oscillator with PLL Secondary (LP) Oscillator Low-Power RC (LPRC) Oscillator FRC Oscillator with postscaler 7.1.1 7.1.1.1 SYSTEM CLOCK SOURCES SYSTEM CLOCK SELECTION The oscillator source used at a device Power-on Reset event is selected using Configuration bit settings. The oscillator Configuration bit settings are located in the Configuration registers in the program memory. (Refer to Section 18.1 “Configuration Bits” for further details.) The Initial Oscillator Selection Configuration bits, FNOSC<2:0> (FOSCSEL<2:0>), and the Primary Oscillator Mode Select Configuration bits, POSCMD<1:0> (FOSC<1:0>), select the oscillator source that is used at a Power-on Reset. The FRC primary oscillator is the default (unprogrammed) selection. The Configuration bits allow users to choose among 12 different clock modes, shown in Table 7-1. Fast RC The Fast RC (FRC) internal oscillator runs at a nominal frequency of 7.37 MHz. User software can tune the FRC frequency. User software can optionally specify a factor (ranging from 1:2 to 1:256) by which the FRC clock frequency is divided. This factor is selected using the FRCDIV<2:0> (CLKDIV<10:8>) bits. The output of the oscillator (or the output of the PLL if a PLL mode has been selected) FOSC is divided by 2 to generate the device instruction clock (FCY). FCY defines the operating speed of the device, and speeds up to 40 MHz are supported by the dsPIC33FJ12GP201/202 architecture. 7.1.1.2 Instruction execution speed or device operating frequency, FCY, is given by: Primary The primary oscillator can use one of the following as its clock source: • XT (Crystal): Crystals and ceramic resonators in the range of 3 MHz to 10 MHz. The crystal is connected to the OSC1 and OSC2 pins. • HS (High-Speed Crystal): Crystals in the range of 10 MHz to 40 MHz. The crystal is connected to the OSC1 and OSC2 pins. • EC (External Clock): External clock signal in the range of 0.8 MHz to 64 MHz. The external clock signal is directly applied to the OSC1 pin. 7.1.1.3 Secondary The secondary (LP) oscillator is designed for low power and uses a 32.768 kHz crystal or ceramic resonator. The LP oscillator uses the SOSCI and SOSCO pins. 7.1.1.4 Low-Power RC The Low-Power RC (LPRC) internal oscIllator runs at a nominal frequency of 32.768 kHz. It is also used as a reference clock by the Watchdog Timer (WDT) and Fail-Safe Clock Monitor (FSCM). 7.1.1.5 FRC The clock signals generated by the FRC and primary oscillators can be optionally applied to an on-chip Phase Locked Loop (PLL) to provide a wide range of output frequencies for device operation. PLL configuration is described in Section 7.1.3 “PLL Configuration”. DS70264B-page 88 EQUATION 7-1: DEVICE OPERATING FREQUENCY FCY = FOSC/2 7.1.3 PLL CONFIGURATION The primary oscillator and internal FRC oscillator can optionally use an on-chip PLL to obtain higher speeds of operation. The PLL provides significant flexibility in selecting the device operating speed. A block diagram of the PLL is shown in Figure 7-2. The output of the primary oscillator or FRC, denoted as ‘FIN’, is divided down by a prescale factor (N1) of 2, 3,... or 33 before being provided to the PLL’s Voltage Controlled Oscillator (VCO). The input to the VCO must be selected in the range of 0.8 MHz to 8 MHz. The prescale factor ‘N1’ is selected using the PLLPRE<4:0> bits (CLKDIV<4:0>). The PLL Feedback Divisor, selected using the PLLDIV<8:0> bits (PLLFBD<8:0>), provides a factor ‘M,’ by which the input to the VCO is multiplied. This factor must be selected such that the resulting VCO output frequency is in the range of 100 MHz to 200 MHz. The VCO output is further divided by a postscale factor ‘N2.’ This factor is selected using the PLLPOST<1:0> bits (CLKDIV<7:6>). ‘N2’ can be either 2, 4 or 8, and must be selected such that the PLL output frequency (FOSC) is in the range of 12.5 MHz to 80 MHz, which generates device operating speeds of 6.25-40 MIPS. Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 For a primary oscillator or FRC oscillator, output ‘FIN’, the PLL output ‘FOSC’ is given by: EQUATION 7-2: • If PLLDIV<8:0> = 0x1E, then M = 32. This yields a VCO output of 5 x 32 = 160 MHz, which is within the 100-200 MHz ranged needed. • If PLLPOST<1:0> = 0, then N2 = 2. This provides a Fosc of 160/2 = 80 MHz. The resultant device operating speed is 80/2 = 40 MIPS. FOSC CALCULATION M ( N1*N2 ) FOSC = FIN* For example, suppose a 10 MHz crystal is being used, with “XT with PLL” being the selected oscillator mode. EQUATION 7-3: • If PLLPRE<4:0> = 0, then N1 = 2. This yields a VCO input of 10/2 = 5 MHz, which is within the acceptable range of 0.8-8 MHz. FIGURE 7-2: FCY = XT WITH PLL MODE EXAMPLE ( ) FOSC 1 10000000*32 = = 40 MIPS 2 2 2*2 dsPIC33FJ12GP201/202 PLL BLOCK DIAGRAM 0.8-8.0 MHz Here Source (Crystal, External Clock or Internal RC) PLLPRE 100-200 MHz Here VCO X 12.5-80 MHz Here FOSC PLLPOST PLLDIV Divide by 2-33 Divide by 2-513 TABLE 7-1: Divide by 2, 4, 8 CONFIGURATION BIT VALUES FOR CLOCK SELECTION Oscillator Mode Oscillator Source POSCMD<1:0> FNOSC<2:0> Note Fast RC Oscillator with Divide-by-N (FRCDIVN) Internal xx 111 1, 2 Fast RC Oscillator with Divide-by-16 (FRCDIV16) Internal xx 110 1 Low-Power RC Oscillator (LPRC) Internal xx 101 1 Secondary xx 100 1 Primary Oscillator (HS) with PLL (HSPLL) Primary 10 011 Primary Oscillator (XT) with PLL (XTPLL) Primary 01 011 Primary Oscillator (EC) with PLL (ECPLL) Primary 00 011 Primary Oscillator (HS) Primary 10 010 Primary Oscillator (XT) Primary 01 010 Primary Oscillator (EC) Primary 00 010 1 Fast RC Oscillator with PLL (FRCPLL) Internal xx 001 1 Fast RC Oscillator (FRC) Internal xx 000 1 Secondary (Timer1) Oscillator (SOSC) Note 1: 2: 1 OSC2 pin function is determined by the OSCIOFNC Configuration bit. This is the default oscillator mode for an unprogrammed (erased) device. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 89 dsPIC33FJ12GP201/202 REGISTER 7-1: OSCCON: OSCILLATOR CONTROL REGISTER U-0 R-0 — R-0 R-0 COSC<2:0> U-0 R/W-y — R/W-y R/W-y NOSC<2:0> bit 15 bit 8 R/W-0 R/W-0 R-0 U-0 R/C-0 U-0 R/W-0 R/W-0 CLKLOCK IOLOCK LOCK — CF — LPOSCEN OSWEN bit 7 bit 0 Legend: y = Value set from Configuration bits on POR R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as ‘0’ bit 14-12 COSC<2:0>: Current Oscillator Selection bits (read-only) 000 = Fast RC oscillator (FRC) 001 = Fast RC oscillator (FRC) with PLL 010 = Primary oscillator (XT, HS, EC) 011 = Primary oscillator (XT, HS, EC) with PLL 100 = Secondary oscillator (SOSC) 101 = Low-Power RC oscillator (LPRC) 110 = Fast RC oscillator (FRC) with Divide-by-16 111 = Fast RC oscillator (FRC) with Divide-by-n bit 11 Unimplemented: Read as ‘0’ bit 10-8 NOSC<2:0>: New Oscillator Selection bits 000 = Fast RC oscillator (FRC) 001 = Fast RC oscillator (FRC) with PLL 010 = Primary oscillator (XT, HS, EC) 011 = Primary oscillator (XT, HS, EC) with PLL 100 = Secondary oscillator (SOSC) 101 = Low-Power RC oscillator (LPRC) 110 = Fast RC oscillator (FRC) with Divide-by-16 111 = Fast RC oscillator (FRC) with Divide-by-n bit 7 CLKLOCK: Clock Lock Enable bit If clock switching is enabled and FSCM is disabled (FOSC<FCKSM> = 0b01) 1 = Clock switching is disabled, system clock source is locked 0 = Clock switching is enabled, system clock source can be modified by clock switching bit 6 IOLOCK: Peripheral Pin Select Lock bit 1 = Peripherial Pin Select is locked, write to peripheral pin select register is not allowed 0 = Peripherial Pin Select is unlocked, write to peripheral pin select register is allowed bit 5 LOCK: PLL Lock Status bit (read-only) 1 = Indicates that PLL is in lock, or PLL start-up timer is satisfied 0 = Indicates that PLL is out of lock, start-up timer is in progress or PLL is disabled bit 4 Unimplemented: Read as ‘0’ bit 3 CF: Clock Fail Detect bit (read/clear by application) 1 = FSCM has detected clock failure 0 = FSCM has not detected clock failure bit 2 Unimplemented: Read as ‘0’ DS70264B-page 90 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 7-1: OSCCON: OSCILLATOR CONTROL REGISTER (CONTINUED) bit 1 LPOSCEN: Secondary (LP) Oscillator Enable bit 1 = Enable secondary oscillator 0 = Disable secondary oscillator bit 0 OSWEN: Oscillator Switch Enable bit 1 = Request oscillator switch to selection specified by NOSC<2:0> bits 0 = Oscillator switch is complete © 2007 Microchip Technology Inc. Preliminary DS70264B-page 91 dsPIC33FJ12GP201/202 REGISTER 7-2: R/W-0 CLKDIV: CLOCK DIVISOR REGISTER R/W-0 ROI R/W-0 R/W-0 R/W-0 R/W-1 DOZEN(1) DOZE<2:0> R/W-0 R/W-0 FRCDIV<2:0> bit 15 bit 8 R/W-0 R/W-1 PLLPOST<1:0> U-0 R/W-0 R/W-0 — R/W-0 R/W-0 R/W-0 PLLPRE<4:0> bit 7 bit 0 Legend: y = Value set from Configuration bits on POR R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ROI: Recover on Interrupt bit 1 = Interrupts will clear the DOZEN bit and the processor clock/peripheral clock ratio is set to 1:1 0 = Interrupts have no effect on the DOZEN bit bit 14-12 DOZE<2:0>: Processor Clock Reduction Select bits 000 = FCY/1 001 = FCY/2 010 = FCY/4 011 = FCY/8 (default) 100 = FCY/16 101 = FCY/32 110 = FCY/64 111 = FCY/128 bit 11 DOZEN: DOZE Mode Enable bit(1) 1 = DOZE<2:0> field specifies the ratio between the peripheral clocks and the processor clocks 0 = Processor clock/peripheral clock ratio forced to 1:1 bit 10-8 FRCDIV<2:0>: Internal Fast RC Oscillator Postscaler bits 000 = FRC divide by 1 (default) 001 = FRC divide by 2 010 = FRC divide by 4 011 = FRC divide by 8 100 = FRC divide by 16 101 = FRC divide by 32 110 = FRC divide by 64 111 = FRC divide by 256 bit 7-6 PLLPOST<1:0>: PLL VCO Output Divider Select bits (also denoted as ‘N2’, PLL postscaler) 00 = Output/2 01 = Output/4 (default) 10 = Reserved 11 = Output/8 bit 5 Unimplemented: Read as ‘0’ bit 4-0 PLLPRE<4:0>: PLL Phase Detector Input Divider bits (also denoted as ‘N1’, PLL prescaler) 00000 = Input/2 (default) 00001 = Input/3 ••• 11111 = Input/33 Note 1: This bit is cleared when the ROI bit is set and an interrupt occurs. DS70264B-page 92 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 7-3: PLLFBD: PLL FEEDBACK DIVISOR REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0(1) — — — — — — — PLLDIV<8> bit 15 bit 8 R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 PLLDIV<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-9 Unimplemented: Read as ‘0’ bit 8-0 PLLDIV<8:0>: PLL Feedback Divisor bits (also denoted as ‘M’, PLL multiplier) 000000000 = 2 000000001 = 3 000000010 = 4 • • • 000110000 = 50 (default) • • • 111111111 = 513 © 2007 Microchip Technology Inc. Preliminary DS70264B-page 93 dsPIC33FJ12GP201/202 REGISTER 7-4: OSCTUN: FRC OSCILLATOR TUNING REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 TUN<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-6 Unimplemented: Read as ‘0’ bit 5-0 TUN<5:0>: FRC Oscillator Tuning bits 011111 = Center frequency + 11.625% 011110 = Center frequency + 11.25% (8.23 MHz) • • • 000001 = Center frequency + 0.375% (7.40 MHz) 000000 = Center frequency (7.37 MHz nominal) 111111 = Center frequency -0.375% (7.345 MHz) • • • 100001 = Center frequency -11.625% (6.52 MHz) 100000 = Center frequency -12% (6.49 MHz) DS70264B-page 94 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 7.2 Clock Switching Operation 1. Applications are free to switch among any of the four clock sources (Primary, LP, FRC and LPRC) under software control at any time. To limit the possible side effects of this flexibility, dsPIC33FJ12GP201/202 devices have a safeguard lock built into the switch process. Note: 7.2.1 Primary Oscillator mode has three different submodes (XT, HS and EC), which are determined by the POSCMD<1:0> Configuration bits. While an application can switch to and from Primary Oscillator mode in software, it cannot switch among the different primary submodes without reprogramming the device. The clock switching hardware compares the COSC status bits with the new value of the NOSC control bits. If they are the same, the clock switch is a redundant operation. In this case, the OSWEN bit is cleared automatically and the clock switch is aborted. If a valid clock switch has been initiated, the LOCK (OSCCON<5>) and the CF (OSCCON<3>) status bits are cleared. The new oscillator is turned on by the hardware if it is not currently running. If a crystal oscillator must be turned on, the hardware waits until the Oscillator Start-up Timer (OST) expires. If the new source is using the PLL, the hardware waits until a PLL lock is detected (LOCK = 1). The hardware waits for 10 clock cycles from the new clock source and then performs the clock switch. The hardware clears the OSWEN bit to indicate a successful clock transition. In addition, the NOSC bit values are transferred to the COSC status bits. The old clock source is turned off at this time, with the exception of LPRC (if WDT or FSCM are enabled) or LP (if LPOSCEN remains set). 2. 3. 4. ENABLING CLOCK SWITCHING To enable clock switching, the FCKSM1 Configuration bit in the Configuration register must be programmed to ‘0’. (Refer to Section 18.1 “Configuration Bits” for further details.) If the FCKSM1 Configuration bit is unprogrammed (‘1’), the clock switching function and Fail-Safe Clock Monitor function are disabled. This is the default setting. The NOSC control bits (OSCCON<10:8>) do not control the clock selection when clock switching is disabled. However, the COSC bits (OSCCON<14:12>) reflect the clock source selected by the FNOSC Configuration bits. 5. 6. Note 1: The processor continues to execute code throughout the clock switching sequence. Timing-sensitive code should not be executed during this time. 2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted. This applies to clock switches in either direction. In these instances, the application must switch to FRC mode as a transition clock source between the two PLL modes. The OSWEN control bit (OSCCON<0>) has no effect when clock switching is disabled. It is held at ‘0’ at all times. 7.2.2 Performing sequence: 1. 2. 3. 4. 5. OSCILLATOR SWITCHING SEQUENCE a clock switch requires this basic If desired, read the COSC bits (OSCCON<14:12>) to determine the current oscillator source. Perform the unlock sequence to allow a write to the OSCCON register high byte. Write the appropriate value to the NOSC control bits (OSCCON<10:8>) for the new oscillator source. Perform the unlock sequence to allow a write to the OSCCON register low byte. Set the OSWEN bit to initiate the oscillator switch. Once the basic sequence is completed, the system clock hardware responds automatically as follows: © 2007 Microchip Technology Inc. 7.3 Fail-Safe Clock Monitor (FSCM) The Fail-Safe Clock Monitor (FSCM) allows the device to continue to operate even in the event of an oscillator failure. The FSCM function is enabled by programming. If the FSCM function is enabled, the LPRC internal oscillator runs at all times (except during Sleep mode) and is not subject to control by the Watchdog Timer. In the event of an oscillator failure, the FSCM generates a clock failure trap event and switches the system clock over to the FRC oscillator. Then the application program can either attempt to restart the oscillator or execute a controlled shutdown. The trap can be treated as a warm Reset by simply loading the Reset address into the oscillator fail trap vector. If the PLL multiplier is used to scale the system clock, the internal FRC is also multiplied by the same factor on clock failure. Essentially, the device switches to FRC with PLL on a clock failure. Preliminary DS70264B-page 95 dsPIC33FJ12GP201/202 NOTES: DS70264B-page 96 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 8.0 Note: POWER-SAVING FEATURES 8.2 This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The dsPIC33FJ12GP201/202 devices provide the ability to manage power consumption by selectively managing clocking to the CPU and the peripherals. In general, a lower clock frequency and a reduction in the number of circuits being clocked constitutes lower consumed power. dsPIC33FJ12GP201/202 devices can manage power consumption in four different ways: • • • • Clock frequency Instruction-based Sleep and Idle modes Software-controlled Doze mode Selective peripheral control in software dsPIC33FJ12GP201/202 devices have two special power-saving modes that are entered through the execution of a special PWRSAV instruction. Sleep mode stops clock operation and halts all code execution. Idle mode halts the CPU and code execution, but allows peripheral modules to continue operation. The Assembler syntax of the PWRSAV instruction is shown in Example 8-1. Note: SLEEP_MODE and IDLE_MODE are constants defined in the assembler include file for the selected device. Sleep and Idle modes can be exited as a result of an enabled interrupt, WDT time-out or a device Reset. When the device exits these modes, it is said to wake-up. 8.2.1 SLEEP MODE The following occur in Sleep mode: Combinations of these methods can be used to selectively tailor an application’s power consumption while still maintaining critical application features, such as timing-sensitive communications. 8.1 Instruction-Based Power-Saving Modes Clock Frequency and Clock Switching dsPIC33FJ12GP201/202 devices allow a wide range of clock frequencies to be selected under application control. If the system clock configuration is not locked, users can choose low-power or high-precision oscillators by simply changing the NOSC bits (OSCCON<10:8>). The process of changing a system clock during operation, as well as limitations to the process, are discussed in more detail in Section 7.0 “Oscillator Configuration”. • The system clock source is shut down. If an on-chip oscillator is used, it is turned off. • The device current consumption is reduced to a minimum, provided that no I/O pin is sourcing current. • The Fail-Safe Clock Monitor does not operate, since the system clock source is disabled. • The LPRC clock continues to run if the WDT is enabled. • The WDT, if enabled, is automatically cleared prior to entering Sleep mode. • Some device features or peripherals may continue to operate. This includes items such as the input change notification on the I/O ports, or peripherals that use an external clock input. • Any peripheral that requires the system clock source for its operation is disabled. The device will wake-up from Sleep mode on any of the these events: • Any interrupt source that is individually enabled • Any form of device Reset • A WDT time-out On wake-up from Sleep mode, the processor restarts with the same clock source that was active when Sleep mode was entered. EXAMPLE 8-1: PWRSAV INSTRUCTION SYNTAX PWRSAV #SLEEP_MODE PWRSAV #IDLE_MODE ; Put the device into SLEEP mode ; Put the device into IDLE mode © 2007 Microchip Technology Inc. Preliminary DS70264B-page 97 dsPIC33FJ12GP201/202 8.2.2 IDLE MODE The following occur in Idle mode: • The CPU stops executing instructions. • The WDT is automatically cleared. • The system clock source remains active. By default, all peripheral modules continue to operate normally from the system clock source, but can also be selectively disabled (see Section 8.4 “Peripheral Module Disable”). • If the WDT or FSCM is enabled, the LPRC also remains active. The device will wake from Idle mode on any of these events: • Any interrupt that is individually enabled. • Any device Reset • A WDT time-out Doze mode is enabled by setting the DOZEN bit (CLKDIV<11>). The ratio between peripheral and core clock speed is determined by the DOZE<2:0> bits (CLKDIV<14:12>). There are eight possible configurations, from 1:1 to 1:128, with 1:1 being the default setting. Programs can use Doze mode to selectively reduce power consumption in event-driven applications. This allows clock-sensitive functions, such as synchronous communications, to continue without interruption while the CPU idles, waiting for something to invoke an interrupt routine. An automatic return to full-speed CPU operation on interrupts can be enabled by setting the ROI bit (CLKDIV<15>). By default, interrupt events have no effect on Doze mode operation. On wake-up from Idle mode, the clock is reapplied to the CPU and instruction execution begins immediately, starting with the instruction following the PWRSAV instruction, or the first instruction in the ISR. For example, suppose the device is operating at 20 MIPS and the CAN module has been configured for 500 kbps based on this device operating speed. If the device is placed in Doze mode with a clock frequency ratio of 1:4, the CAN module continues to communicate at the required bit rate of 500 kbps, but the CPU now starts executing instructions at a frequency of 5 MIPS. 8.2.3 8.4 INTERRUPTS COINCIDENT WITH POWER SAVE INSTRUCTIONS Any interrupt that coincides with the execution of a PWRSAV instruction is held off until entry into Sleep or Idle mode has completed. The device then wakes up from Sleep or Idle mode. 8.3 Doze Mode The preferred strategies for reducing power consumption are changing clock speed and invoking one of the power-saving modes. In some circumstances, however, these are not practical. For example, it may be necessary for an application to maintain uninterrupted synchronous communication, even while it is doing nothing else. Reducing system clock speed can introduce communication errors, while using a power-saving mode can stop communications completely. The Peripheral Module Disable (PMD) registers provide a method to disable a peripheral module by stopping all clock sources supplied to that module. When a peripheral is disabled using the appropriate PMD control bit, the peripheral is in a minimum power consumption state. The control and status registers associated with the peripheral are also disabled, so writes to those registers will have no effect and read values will be invalid. A peripheral module is enabled only if both the associated bit in the PMD register is cleared and the peripheral is supported by the specific dsPIC® DSC variant. If the peripheral is present in the device, it is enabled in the PMD register by default. Note: Doze mode is a simple and effective alternative method to reduce power consumption while the device is still executing code. In this mode, the system clock continues to operate from the same source and at the same speed. Peripheral modules continue to be clocked at the same speed, while the CPU clock speed is reduced. Synchronization between the two clock domains is maintained, allowing the peripherals to access the SFRs while the CPU executes code at a slower rate. DS70264B-page 98 Peripheral Module Disable Preliminary If a PMD bit is set, the corresponding module is disabled after a delay of one instruction cycle. Similarly, if a PMD bit is cleared, the corresponding module is enabled after a delay of one instruction cycle (assuming the module control registers are already configured to enable module operation). © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 9.0 Note: I/O PORTS This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. All of the device pins (except VDD, VSS, MCLR and OSC1/CLKI) are shared among the peripherals and the parallel I/O ports. All I/O input ports feature Schmitt Trigger inputs for improved noise immunity. 9.1 Parallel I/O (PIO) Ports A parallel I/O port that shares a pin with a peripheral is generally subservient to the peripheral. The peripheral’s output buffer data and control signals are provided to a pair of multiplexers. The multiplexers select whether the peripheral or the associated port has ownership of the output data and control signals of the I/O pin. The logic also prevents “loop through,” in which a port’s digital output can drive the input of a peripheral that shares the same pin. Figure 9-1 shows how ports are shared with other peripherals and the associated I/O pin to which they are connected. FIGURE 9-1: When a peripheral is enabled and the peripheral is actively driving an associated pin, the use of the pin as a general purpose output pin is disabled. The I/O pin can be read, but the output driver for the parallel port bit is disabled. If a peripheral is enabled, but the peripheral is not actively driving a pin, that pin can be driven by a port. All port pins have three registers directly associated with their operation as digital I/O. The data direction register (TRISx) determines whether the pin is an input or an output. If the data direction bit is a ‘1’, then the pin is an input. All port pins are defined as inputs after a Reset. Reads from the latch (LATx) read the latch. Writes to the latch, write the latch. Reads from the port (PORTx) read the port pins, while writes to the port pins write the latch. Any bit and its associated data and control registers that are not valid for a particular device will be disabled. That means the corresponding LATx and TRISx registers and the port pin will read as zeros. When a pin is shared with another peripheral or function that is defined as an input only, it is nevertheless regarded as a dedicated port because there is no other competing source of outputs. BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE Peripheral Module Output Multiplexers Peripheral Input Data Peripheral Module Enable Peripheral Output Enable Peripheral Output Data PIO Module WR TRIS Output Enable 0 1 Output Data 0 Read TRIS Data Bus I/O 1 D Q I/O Pin CK TRIS Latch D WR LAT + WR Port Q CK Data Latch Read LAT Input Data Read Port © 2007 Microchip Technology Inc. Preliminary DS70264B-page 99 dsPIC33FJ12GP201/202 9.1.1 9.3 OPEN-DRAIN CONFIGURATION In addition to the PORT, LAT and TRIS registers for data control, each port pin can also be individually configured for either digital or open-drain output. This is controlled by the Open-Drain Control register, ODCx, associated with each port. Setting any of the bits configures the corresponding pin to act as an open-drain output. The open-drain feature allows the generation of outputs higher than VDD (e.g., 5V) on any desired digital-only pins by using external pull-up resistors. The maximum open-drain voltage allowed is the same as the maximum VIH specification. 9.2 Configuring Analog Port Pins The AD1PCFG and TRIS registers control the operation of the Analog-to-Digital (A/D) port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. When the PORT register is read, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins) can cause the input buffer to consume current that exceeds the device specifications. 9.2.1 Input Change Notification The input change notification function of the I/O ports allows the dsPIC33FJ12GP201/202 devices to generate interrupt requests to the processor in response to a change-of-state on selected input pins. This feature can detect input change-of-states even in Sleep mode, when the clocks are disabled. Depending on the device pin count, up to 21 external signals (CNx pin) can be selected (enabled) for generating an interrupt request on a change-of-state. Four control registers are associated with the CN module. The CNEN1 and CNEN2 registers contain the interrupt enable control bits for each of the CN input pins. Setting any of these bits enables a CN interrupt for the corresponding pins. Each CN pin also has a weak pull-up connected to it. The pull-ups act as a current source connected to the pin, and eliminate the need for external resistors when push button or keypad devices are connected. The pull-ups are enabled separately using the CNPU1 and CNPU2 registers, which contain the control bits for each of the CN pins. Setting any of the control bits enables the weak pull-ups for the corresponding pins. Note: Pull-ups on change notification pins should always be disabled when the port pin is configured as a digital output. I/O PORT WRITE/READ TIMING One instruction cycle is required between a port direction change or port write operation and a read operation of the same port. Typically this instruction would be a NOP. An example is shown in Example 9-1. EXAMPLE 9-1: MOV MOV NOP btss 0xFF00, W0 W0, TRISBB PORTB, #13 DS70264B-page 100 PORT WRITE/READ EXAMPLE ; ; ; ; Configure PORTB<15:8> as inputs and PORTB<7:0> as outputs Delay 1 cycle Next Instruction Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 9.4 Peripheral Pin Select A major challenge in general purpose devices is providing the largest possible set of peripheral features while minimizing the conflict of features on I/O pins. The challenge is even greater on low-pin count devices. In an application where more than one peripheral must be assigned to a single pin, inconvenient workarounds in application code or a complete redesign may be the only option. Peripheral pin select configuration enables peripheral set selection and placement on a wide range of I/O pins. By increasing the pinout options available on a particular device, programmers can better tailor the microcontroller to their entire application, rather than trimming the application to fit the device. Remappable peripherals are not associated with a default I/O pin. The peripheral must always be assigned to a specific I/O pin before it can be used. In contrast, non remappable peripherals are always available on a default pin, assuming that the peripheral is active and not conflicting with another peripheral. 9.4.2.1 Peripheral Pin Select Function Priority When a remappable peripheral is active on a given I/O pin, it takes priority over all other digital I/O and digital communication peripherals associated with the pin. Priority is given regardless of the type of peripheral that is mapped. Remappable peripherals never take priority over any analog functions associated with the pin. The peripheral pin select configuration feature operates over a fixed subset of digital I/O pins. Programmers can independently map the input and/or output of most digital peripherals to any one of these I/O pins. Peripheral pin select is performed in software, and generally does not require the device to be reprogrammed. Hardware safeguards are included that prevent accidental or spurious changes to the peripheral mapping, once it has been established. 9.4.3 9.4.1 The association of a peripheral to a peripheral selectable pin is handled in two different ways, depending on whether an input or output is being mapped. AVAILABLE PINS The peripheral pin select feature is used with a range of up to 16 pins. The number of available pins depends on the particular device and its pin count. Pins that support the peripheral pin select feature include the designation “RPn” in their full pin designation, where “RP” designates a remappable peripheral and “n” is the remappable pin number. 9.4.2 AVAILABLE PERIPHERALS The peripherals managed by the peripheral pin select feature are all digital-only peripherals. These include: • General serial communications (UART and SPI) • General purpose timer clock inputs • Timer-related peripherals (input capture and output compare) • Interrupt-on-change inputs In comparison, some digital-only peripheral modules are never included in the peripheral pin select feature. This is because the peripheral’s function requires special I/O circuitry on a specific port and cannot be easily connected to multiple pins. These modules include I2C. A similar requirement excludes all modules with analog inputs, such as the Analog-to-Digital Converter (ADC). © 2007 Microchip Technology Inc. CONTROLLING PERIPHERAL PIN SELECT Peripheral pin select features are controlled through two sets of special function registers: one to map peripheral inputs, and one to map outputs. Because they are separately controlled, a particular peripheral’s input and output (if the peripheral has both) can be placed on any selectable function pin without constraint. 9.4.3.1 Input Mapping The inputs of the peripheral pin select options are mapped on the basis of the peripheral. A control register associated with a peripheral dictates the pin it will be mapped to. The RPINRx registers are used to configure peripheral input mapping (see Register 9-1 through Register 9-9). Each register contains sets of 5-bit fields, with each set associated with one of the remappable peripherals. Programming a given peripheral’s bit field with an appropriate 5-bit value maps the RPn pin with that value to that peripheral. For any given device, the valid range of values for any bit field corresponds to the maximum number of peripheral pin selections supported by the device. Figure 9-2 Illustrates remappable pin selection for U1RX input. Preliminary DS70264B-page 101 dsPIC33FJ12GP201/202 FIGURE 9-2: REMAPPABLE MUX INPUT FOR U1RX U1RXR<4:0> 0 RP0 1 RP1 2 U1RX input to peripheral RP2 15 RP15 SELECTABLE INPUT SOURCES (MAPS INPUT TO FUNCTION)(1) TABLE 9-1: Function Name Register Configuration Bits External Interrupt 1 INT1 RPINR0 INT1R<4:0> External Interrupt 2 INT2 RPINR1 INT2R<4:0> Timer 2 External Clock T2CK RPINR3 T2CKR<4:0> Timer 3 External Clock T3CK RPINR3 T3CKR<4:0> Input Capture 1 IC1 RPINR7 IC1R<4:0> Input Capture 2 IC2 RPINR7 IC2R<4:0> Input Capture 7 IC7 RPINR10 IC7R<4:0> Input Capture 8 IC8 RPINR10 IC8R<4:0> Input Name Output Compare Fault A OCFA RPINR11 OCFAR<4:0> UART 1 Receive U1RX RPINR18 U1RXR<4:0> U1CTS RPINR18 U1CTSR<4:0> SPI 1 Data Input SDI1 RPINR20 SDI1R<4:0> SPI 1 Clock Input SCK1IN RPINR20 SCK1R<4:0> SS1IN RPINR21 SS1R<4:0> UART 1 Clear To Send SPI 1 Slave Select Input Note 1: Unless otherwise noted, all inputs use the Schmitt input buffers. DS70264B-page 102 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 9.4.3.2 Output Mapping through Register 9-17). The value of the bit field corresponds to one of the peripherals, and that peripheral’s output is mapped to the pin (see Table 9-2 and Figure 9-3). In contrast to inputs, the outputs of the peripheral pin select options are mapped on the basis of the pin. In this case, a control register associated with a particular pin dictates the peripheral output to be mapped. The RPORx registers are used to control output mapping. Like the RPINRx registers, each register contains sets of 5-bit fields, with each set associated with one RPn pin (see Register 9-10 FIGURE 9-3: The list of peripherals for output mapping also includes a null value of 00000 because of the mapping technique. This permits any given pin to remain unconnected from the output of any of the pin selectable peripherals. MULTIPLEXING OF REMAPPABLE OUTPUT FOR RPn RPnR<4:0> Default U1TX Output Enable 0 3 U1RTS Output Enable 4 Output Enable OC1 Output Enable OC2 Output Enable Default U1TX Output U1RTS Output 18 19 0 3 4 RPn Output Data OC1 Output OC2 Output TABLE 9-2: 18 19 OUTPUT SELECTION FOR REMAPPABLE PIN (RPn) Function NULL RPnR<4:0> 00000 Output Name RPn tied to default port pin U1TX 00011 RPn tied to UART 1 Transmit U1RTS 00100 RPn tied to UART 1 Ready To Send SDO1 00111 RPn tied to SPI 1 Data Output SCK1OUT 01000 RPn tied to SPI 1 Clock Output SS1OUT 01001 RPn tied to SPI 1 Slave Select Output OC1 10010 RPn tied to Output Compare 1 OC2 10011 RPn tied to Output Compare 2 © 2007 Microchip Technology Inc. Preliminary DS70264B-page 103 dsPIC33FJ12GP201/202 9.4.3.3 Mapping 9.4.4.2 The control schema of peripheral select pins is not limited to a small range of fixed peripheral configurations. There are no mutual or hardware-enforced lockouts between any of the peripheral mapping SFRs. Literally any combination of peripheral mappings across any or all of the RPn pins is possible. This includes both many-to-one and one-to-many mappings of peripheral inputs and outputs to pins. While such mappings may be technically possible from a configuration point of view, they may not be supportable electrically. 9.4.4 CONTROLLING CONFIGURATION CHANGES Because peripheral remapping can be changed during run time, some restrictions on peripheral remapping are needed to prevent accidental configuration changes. dsPIC33F devices include three features to prevent alterations to the peripheral map: • Control register lock sequence • Continuous state monitoring • Configuration bit pin select lock 9.4.4.1 Under normal operation, writes to the RPINRx and RPORx registers are not allowed. Attempted writes appear to execute normally, but the contents of the registers remain unchanged. To change these registers, they must be unlocked in hardware. The register lock is controlled by the IOLOCK bit (OSCCON<6>). Setting IOLOCK prevents writes to the control registers; clearing IOLOCK allows writes. To set or clear IOLOCK, a specific command sequence must be executed: 1. 2. 3. Write 0x46 to OSCCON<7:0>. Write 0x57 to OSCCON<7:0>. Clear (or set) IOLOCK as a single operation. Note: MPLAB® C30 provides built-in C language functions for unlocking the OSCCON register: __builtin_write_OSCCONL(value) __builtin_write_OSCCONH(value) See MPLAB information. IDE Help for more Unlike the similar sequence with the oscillator’s LOCK bit, IOLOCK remains in one state until changed. This allows all of the peripheral pin selects to be configured with a single unlock sequence followed by an update to all control registers, then locked with a second lock sequence. DS70264B-page 104 In addition to being protected from direct writes, the contents of the RPINRx and RPORx registers are constantly monitored in hardware by shadow registers. If an unexpected change in any of the registers occurs (such as cell disturbances caused by ESD or other external events), a configuration mismatch Reset will be triggered. 9.4.4.3 Configuration Bit Pin Select Lock As an additional level of safety, the device can be configured to prevent more than one write session to the RPINRx and RPORx registers. The IOL1WAY (FOSC<IOL1WAY>) configuration bit blocks the IOLOCK bit from being cleared after it has been set once. In the default (unprogrammed) state, IOL1WAY is set, restricting users to one write session. Programming IOL1WAY allows user applications unlimited access (with the proper use of the unlock sequence) to the peripheral pin select registers. 9.4.5 Control Register Lock Continuous State Monitoring CONSIDERATIONS FOR PERIPHERAL PIN SELECTION The ability to control peripheral pin selection introduces several considerations into application design, including several common peripherals that are only available as remappable peripherals. 9.4.5.1 Configuration The peripheral pin selects are not available on default pins in the device’s default (Reset) state. More specifically, since all RPINRx and RPORx registers reset to 0000h, this means all peripheral pin select inputs are tied to RP0, while all peripheral pin select outputs are disconnected. This means that before any other application code is executed, the user application must initialize the device with the proper peripheral configuration. Since the IOLOCK bit resets in the unlocked state, it is not necessary to execute the unlock sequence after the device has come out of Reset. For the sake of application safety, however, it is always a good idea to set IOLOCK and lock the configuration after writing to the control registers. Because the unlock sequence is timing-critical, it must be executed as an assembly language routine, in the same manner as changes to the oscillator configuration. If the bulk of the application is written in C or another high-level language, the unlock sequence should be performed by writing inline assembly. Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 9.4.5.2 Changing the Configuration EXAMPLE 9-2: Choosing the configuration requires review of all peripheral pin selects and their pin assignments, especially those that will not be used in the application. In all cases, unused pin selectable peripherals should be disabled completely. Unused peripherals should have their inputs assigned to an unused RPn pin function. I/O pins with unused RPn functions should be configured with the null peripheral output. The assignment of a peripheral to a particular pin does not automatically perform any other configuration of the pin’s I/O circuitry. This means adding a pin selectable output to a pin can inadvertently drive an existing peripheral input when the output is driven. Programmers must be familiar with the behavior of other fixed peripherals that share a remappable pin, and know when to enable or disable them. To be safe, fixed digital peripherals that share the same pin should be disabled when not in use. 9.4.5.3 9.4.5.4 Analog Function A final consideration is that peripheral pin select functions neither override analog inputs nor reconfigure pins with analog functions for digital I/O. If a pin is configured as an analog input on device Reset, it must be explicitly reconfigured as digital I/O when used with a peripheral pin select. 9.4.5.5 //************************************* // Unlock Registers //************************************* asm volatile ( "mov #OSCCONL, w1 \n" "mov #0x46, w2 \n" "mov #0x57, w3 \n" "mov.b w2, [w1] \n" "mov.b w3, [w1] \n" "bclr OSCCON, 6"); //*************************** // Configure Input Functions // (See Table 9-1) //*************************** //*************************** // Assign U1Rx To Pin RP0 //*************************** RPINR18bits.U1RXR = 0; Pin Operation Configuring a remappable pin for a specific peripheral does not automatically turn that feature on. The peripheral must be specifically configured for operation and enabled, as if it were tied to a fixed pin. Where this happens in the application code (immediately following device Reset and peripheral configuration, or inside the main application routine) depends on the peripheral and its use in the application. Configuration Example Example 9-2 shows a configuration for bidirectional communication with flow control using UART1. The following input and output functions are used: • Input Functions: U1RX, U1CTS • Output Functions: U1TX, U1RTS © 2007 Microchip Technology Inc. CONFIGURING UART1 INPUT AND OUTPUT FUNCTIONS //*************************** // Assign U1CTS To Pin RP1 //*************************** RPINR18bits.U1CTSR = 1; //*************************** // Configure Output Functions // (See Table 9-2) //*************************** //*************************** // Assign U1Tx To Pin RP2 //*************************** RPOR1bits.RP2R = 3; //*************************** // Assign U1RTS To Pin RP3 //*************************** RPOR1bits.RP3R = 4; //************************************* // Lock Registers //************************************* asm volatile ( "mov #OSCCONL, w1 \n" "mov #0x46, w2 \n" "mov #0x57, w3 \n" "mov.b w2, [w1] \n" "mov.b w3, [w1] \n" "bset OSCCON, 6"); Preliminary DS70264B-page 105 dsPIC33FJ12GP201/202 9.5 Peripheral Pin Select Registers The dsPIC33FJ12GP201/202 devices implement 17 registers for remappable peripheral configuration: • Input Remappable Peripheral Registers (9) • Output Remappable Peripheral Registers (8) Note: Input and Output Register values can only be changed if OSCCON<IOLOCK> = 0. See Section 9.4.4.1 “Control Register Lock” for a specific command sequence. REGISTER 9-1: RPINR0: PERIPHERAL PIN SELECT INPUT REGISTER 0 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 INT1R<4:0> bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 INT1R<4:0>: Assign External Interrupt 1 (INTR1) to the corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-0 Unimplemented: Read as ‘0’ DS70264B-page 106 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 9-2: RPINR1: PERIPHERAL PIN SELECT INPUT REGISTER 1 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 INT2R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-5 Unimplemented: Read as ‘0’ bit 4-0 INT2R<4:0>: Assign External Interrupt 2 (INTR2) to the corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 © 2007 Microchip Technology Inc. Preliminary DS70264B-page 107 dsPIC33FJ12GP201/202 REGISTER 9-3: RPINR3: PERIPHERAL PIN SELECT INPUT REGISTER 3 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 T3CKR<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 T2CKR<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 T3CKR<4:0>: Assign Timer3 External Clock (T3CK) to the Corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 T2CKR<4:0>: Assign Timer2 External Clock (T2CK) to the Corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 DS70264B-page 108 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 9-4: RPINR7: PERIPHERAL PIN SELECT INPUT REGISTER 7 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 IC2R<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 IC1R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 IC2R<4:0>: Assign Input Capture 2 (IC2) to the corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 IC1R<4:0>: Assign Input Capture 1 (IC1) to the corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 © 2007 Microchip Technology Inc. Preliminary DS70264B-page 109 dsPIC33FJ12GP201/202 REGISTER 9-5: RPINR10: PERIPHERAL PIN SELECT INPUT REGISTERS 10 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 IC8R<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 IC7R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 IC8R<4:0>: Assign Input Capture 8 (IC8) to the corresponding pin RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 IC7R<4:0>: Assign Input Capture 7 (IC7) to the corresponding pin RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 DS70264B-page 110 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 9-6: RPINR11: PERIPHERAL PIN SELECT INPUT REGISTER 11 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 OCFAR<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-5 Unimplemented: Read as ‘0’ bit 4-0 OCFAR<4:0>: Assign Output Capture A (OCFA) to the corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 © 2007 Microchip Technology Inc. Preliminary DS70264B-page 111 dsPIC33FJ12GP201/202 REGISTER 9-7: RPINR18: PERIPHERAL PIN SELECT INPUT REGISTER 18 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 U1CTSR<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 U1RXR<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 U1CTSR<4:0>: Assign UART 1 Clear to Send (U1CTS) to the corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 U1RXR<4:0>: Assign UART 1 Receive (U1RX) to the corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 DS70264B-page 112 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 9-8: RPINR20: PERIPHERAL PIN SELECT INPUT REGISTER 20 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 SCK1R<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 SDI1R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 SCK1R<4:0>: Assign SPI 1 Clock Input (SCK1IN) to the corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 SDI1R<4:0>: Assign SPI 1 Data Input (SDI1) to the corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 © 2007 Microchip Technology Inc. Preliminary DS70264B-page 113 dsPIC33FJ12GP201/202 REGISTER 9-9: RPINR21: PERIPHERAL PIN SELECT INPUT REGISTER 21 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 U-0 U-0 U-0 — — — R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 SS1R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-5 Unimplemented: Read as ‘0’ bit 4-0 SS1R<4:0>: Assign SPI1 Slave Select Input (SS1IN) to the Corresponding RPn pin bits 11111 = Input tied to VSS 01111 = Input tied to RP15 • • • 00001 = Input tied to RP1 00000 = Input tied to RP0 DS70264B-page 114 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 9-10: RPOR0: PERIPHERAL PIN SELECT OUTPUT REGISTERS 0 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP1R<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP0R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 RP1R<4:0>: Peripheral Output Function is Assigned to RP1 Output Pin bits (see Table 9-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 RP0R<4:0>: Peripheral Output Function is Assigned to RP0 Output Pin bits (see Table 9-2 for peripheral function numbers) REGISTER 9-11: RPOR1: PERIPHERAL PIN SELECT OUTPUT REGISTERS 1 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP3R<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP2R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 RP3R<4:0>: Peripheral Output Function is Assigned to RP3 Output Pin bits (see Table 9-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 RP2R<4:0>: Peripheral Output Function is Assigned to RP2 Output Pin bits (see Table 9-2 for peripheral function numbers) © 2007 Microchip Technology Inc. Preliminary DS70264B-page 115 dsPIC33FJ12GP201/202 REGISTER 9-12: RPOR2: PERIPHERAL PIN SELECT OUTPUT REGISTERS 2 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP5R<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP4R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 RP5R<4:0>: Peripheral Output Function is Assigned to RP5 Output Pin bits (see Table 9-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 RP4R<4:0>: Peripheral Output Function is Assigned to RP4 Output Pin bits (see Table 9-2 for peripheral function numbers) REGISTER 9-13: RPOR3: PERIPHERAL PIN SELECT OUTPUT REGISTERS 3 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP7R<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP6R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 RP7R<4:0>: Peripheral Output Function is Assigned to RP7 Output Pin bits (see Table 9-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 RP6R<4:0>: Peripheral Output Function is Assigned to RP6 Output Pin bits (see Table 9-2 for peripheral function numbers) DS70264B-page 116 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 9-14: RPOR4: PERIPHERAL PIN SELECT OUTPUT REGISTERS 0 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP9R<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP8R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 RP9R<4:0>: Peripheral Output Function is Assigned to RP9 Output Pin bits (see Table 9-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 RP8R<4:0>: Peripheral Output Function is Assigned to RP8 Output Pin bits (see Table 9-2 for peripheral function numbers) REGISTER 9-15: RPOR5: PERIPHERAL PIN SELECT OUTPUT REGISTERS 5 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP11R<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP10R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 RP11R<4:0>: Peripheral Output Function is Assigned to RP11 Output Pin bits (see Table 9-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 RP10R<4:0>: Peripheral Output Function is Assigned to RP10 Output Pin bits (see Table 9-2 for peripheral function numbers) © 2007 Microchip Technology Inc. Preliminary DS70264B-page 117 dsPIC33FJ12GP201/202 REGISTER 9-16: RPOR6: PERIPHERAL PIN SELECT OUTPUT REGISTERS 6 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP13R<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP12R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 RP13R<4:0>: Peripheral Output Function is Assigned to RP13 Output Pin bits (see Table 9-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 RP12R<4:0>: Peripheral Output Function is Assigned to RP12 Output Pin bits (see Table 9-2 for peripheral function numbers) REGISTER 9-17: RPOR7: PERIPHERAL PIN SELECT OUTPUT REGISTERS 7 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP15R<4:0> bit 15 bit 8 U-0 U-0 U-0 — — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP14R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 RP15R<4:0>: Peripheral Output Function is Assigned to RP15 Output Pin bits (see Table 9-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 RP14R<4:0>: Peripheral Output Function is Assigned to RP14 Output Pin bits (see Table 9-2 for peripheral function numbers) DS70264B-page 118 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 10.0 Note: TIMER1 Figure 10-1 presents a block diagram of the 16-bit timer module. This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. To configure Timer1 for operation: 1. 2. 3. 4. 5. The Timer1 module is a 16-bit timer, which can serve as the time counter for the real-time clock, or operate as a free-running interval timer/counter. Timer1 can operate in three modes: 6. Set the TON bit (= 1) in the T1CON register. Select the timer prescaler ratio using the TCKPS<1:0> bits in the T1CON register. Set the Clock and Gating modes using the TCS and TGATE bits in the T1CON register. Set or clear the TSYNC bit in T1CON to select synchronous or asynchronous operation. Load the timer period value into the PR1 register. If interrupts are required, set the interrupt enable bit, T1IE. Use the priority bits, T1IP<2:0>, to set the interrupt priority. • 16-bit Timer • 16-bit Synchronous Counter • 16-bit Asynchronous Counter Timer1 also supports these features: • Timer gate operation • Selectable prescaler settings • Timer operation during CPU Idle and Sleep modes • Interrupt on 16-bit Period register match or falling edge of external gate signal FIGURE 10-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM TCKPS<1:0> SOSCO/ T1CK 1x SOSCEN SOSCI Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 TGATE TCS TGATE Set T1IF 2 TON 1 Q D 0 Q CK Reset 0 TMR1 1 Equal Comparator Sync TSYNC PR1 © 2007 Microchip Technology Inc. Preliminary DS70264B-page 119 dsPIC33FJ12GP201/202 REGISTER 10-1: T1CON: TIMER1 CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON — TSIDL — — — — — bit 15 bit 8 U-0 R/W-0 — TGATE R/W-0 R/W-0 TCKPS<1:0> U-0 R/W-0 R/W-0 U-0 — TSYNC TCS — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 TON: Timer1 On bit 1 = Starts 16-bit Timer1 0 = Stops 16-bit Timer1 bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timer1 Gated Time Accumulation Enable bit When T1CS = 1: This bit is ignored. When T1CS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0> Timer1 Input Clock Prescale Select bits 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 bit 3 Unimplemented: Read as ‘0’ bit 2 TSYNC: Timer1 External Clock Input Synchronization Select bit When TCS = 1: 1 = Synchronize external clock input 0 = Do not synchronize external clock input When TCS = 0: This bit is ignored. bit 1 TCS: Timer1 Clock Source Select bit 1 = External clock from pin T1CK (on the rising edge) 0 = Internal clock (FCY) bit 0 Unimplemented: Read as ‘0’ DS70264B-page 120 Preliminary x = Bit is unknown © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 11.0 Note: TIMER2/3 FEATURE 11.1 This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The Timer2/3 feature has 32-bit timers that can also be configured as two independent 16-bit timers with selectable operating modes. As a 32-bit timer, the Timer2/3 feature permits operation in three modes: To configure the Timer2/3 feature for 32-bit operation: 1. 2. 3. 4. 5. 6. • Two Independent 16-bit timers (Timer2 and Timer3) with all 16-bit operating modes (except Asynchronous Counter mode) • Single 32-bit timer (Timer2/3) • Single 32-bit synchronous counter (Timer2/3) 32-bit Operation Set the corresponding T32 control bit. Select the prescaler ratio for Timer2 using the TCKPS<1:0> bits. Set the Clock and Gating modes using the corresponding TCS and TGATE bits. Load the timer period value. PR3 contains the most significant word of the value, while PR2 contains the least significant word. If interrupts are required, set the interrupt enable bit, T3IE. Use the priority bits T3IP<2:0> to set the interrupt priority. While Timer2 controls the timer, the interrupt appears as a Timer3 interrupt. Set the corresponding TON bit. The timer value at any point is stored in the register pair TMR3:TMR2. TMR3 always contains the most significant word of the count, while TMR2 contains the least significant word. To configure any of the timers for individual 16-bit operation: The Timer2/3 feature also supports: • • • • • Timer gate operation Selectable Prescaler Settings Timer operation during Idle and Sleep modes Interrupt on a 32-bit Period Register Match Time Base for Input Capture and Output Compare Modules (Timer2 and Timer3 only) • ADC1 Event Trigger (Timer2/3 only) Individually, all eight of the 16-bit timers can function as synchronous timers or counters. They also offer the features listed above, except for the event trigger. The operating modes and enabled features are determined by setting the appropriate bit(s) in the T2CON and T3CON registers. T2CON registers are shown in generic form in Register 11-1. T3CON registers are shown in Register 11-2. 1. 2. 3. 4. 5. 6. Clear the T32 bit corresponding to that timer. Select the timer prescaler ratio using the TCKPS<1:0> bits. Set the Clock and Gating modes using the TCS and TGATE bits. Load the timer period value into the PRx register. If interrupts are required, set the interrupt enable bit, TxIE. Use the priority bits, TxIP<2:0>, to set the interrupt priority. Set the TON bit. For 32-bit timer/counter operation, Timer2 is the least significant word, and Timer3 is the most significant word of the 32-bit timers. Note: For 32-bit operation, T3CON control bits are ignored. Only T2CON control bit is used for setup and control. Timer2 clock and gate inputs are used for the 32-bit timer modules, but an interrupt is generated with the Timer3 interrupt flags. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 121 dsPIC33FJ12GP201/202 TIMER2/3 (32-BIT) BLOCK DIAGRAM(1) FIGURE 11-1: 1x T2CK Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 TGATE TCS TGATE Q 1 Set T3IF Q 0 Equal D CK PR2 PR3 ADC Event Trigger(2) TCKPS<1:0> 2 TON Comparator MSb LSb TMR3 Reset TMR2 Sync 16 Read TMR2 Write TMR2 16 TMR3HLD 16 16 Data Bus<15:0> Note 1: 2: The 32-bit timer control bit, T32, must be set for 32-bit timer/counter operation. All control bits are respective to the T2CON register. The ADC event trigger is available only on Timer2/3. DS70264B-page 122 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 FIGURE 11-2: TIMER2 (16-BIT) BLOCK DIAGRAM T2CK 1x Gate Sync TON TCKPS<1:0> 2 Prescaler 1, 8, 64, 256 01 00 TGATE TCS TCY 1 Set T2IF 0 Reset Equal Q D Q CK TGATE Sync TMR2 Comparator PR2 © 2007 Microchip Technology Inc. Preliminary DS70264B-page 123 dsPIC33FJ12GP201/202 REGISTER 11-1: T2CON CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON — TSIDL — — — — — bit 15 bit 8 U-0 R/W-0 — TGATE R/W-0 R/W-0 TCKPS<1:0> R/W-0 U-0 R/W-0 U-0 T32(1) — TCS — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 TON: Timer2 On bit When T32 = 1: 1 = Starts 32-bit Timer2/3 0 = Stops 32-bit Timer2/3 When T32 = 0: 1 = Starts 16-bit Timer2 0 = Stops 16-bit Timer2 bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timer2 Gated Time Accumulation Enable bit When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0>: Timer2 Input Clock Prescale Select bits 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 bit 3 T32: 32-bit Timer Mode Select bit(1) 1 = Timer2 and Timer3 form a single 32-bit timer 0 = Timer2 and Timer3 act as two 16-bit timers bit 2 Unimplemented: Read as ‘0’ bit 1 TCS: Timer2 Clock Source Select bit 1 = External clock from pin T2CK (on the rising edge) 0 = Internal clock (FCY) bit 0 Unimplemented: Read as ‘0’ Note 1: x = Bit is unknown In 32-bit mode, T3CON control bits do not affect 32-bit timer operation. DS70264B-page 124 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 11-2: T3CON CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON(1) — TSIDL(1) — — — — — bit 15 bit 8 U-0 R/W-0 — TGATE(1) R/W-0 R/W-0 TCKPS<1:0>(1) U-0 U-0 R/W-0 U-0 — — TCS(1) — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 TON: Timer3 On bit(1) 1 = Starts 16-bit Timer3 0 = Stops 16-bit Timer3 bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit(1) 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timer3 Gated Time Accumulation Enable bit(1) When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0>: Timer3 Input Clock Prescale Select bits(1) 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 bit 3-2 Unimplemented: Read as ‘0’ bit 1 TCS: Timer3 Clock Source Select bit(1) 1 = External clock from pin T3CK (on the rising edge) 0 = Internal clock (FCY) bit 0 Unimplemented: Read as ‘0’ Note 1: x = Bit is unknown When 32-bit operation is enabled (T2CON<3> = 1), these bits have no effect on Timer3 operation; all timer functions are set through T2CON. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 125 dsPIC33FJ12GP201/202 NOTES: DS70264B-page 126 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 12.0 INPUT CAPTURE Note: This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The input capture module is useful in applications requiring frequency (period) and pulse measurement. The dsPIC33FJ12GP201/202 devices support up to eight input capture channels. The input capture module captures the 16-bit value of the selected Time Base register when an event occurs at the ICx pin. The events that cause a capture event are listed below in three categories: • Simple Capture Event modes: - Capture timer value on every falling edge of input at ICx pin - Capture timer value on every rising edge of input at ICx pin FIGURE 12-1: • Capture timer value on every edge (rising and falling) • Prescaler Capture Event modes: - Capture timer value on every 4th rising edge of input at ICx pin -Capture timer value on every 16th rising edge of input at ICx pin Each input capture channel can select one of two 16-bit timers (Timer2 or Timer3) for the time base. The selected timer can use either an internal or external clock. Other operational features include: • Device wake-up from capture pin during CPU Sleep and Idle modes • Interrupt on input capture event • 4-word FIFO buffer for capture values - Interrupt optionally generated after 1, 2, 3 or 4 buffer locations are filled • Use of input capture to provide additional sources of external interrupts INPUT CAPTURE BLOCK DIAGRAM From 16-bit Timers TMR2 TMR3 16 16 1 Edge Detection Logic and Clock Synchronizer Prescaler Counter (1, 4, 16) ICx Pin ICM<2:0> (ICxCON<2:0>) Mode Select ICTMR (ICxCON<7>) FIFO 3 0 FIFO R/W Logic ICOV, ICBNE (ICxCON<4:3>) ICxBUF ICxI<1:0> ICxCON System Bus Interrupt Logic Set Flag ICxIF (in IFSn Register) Note: An ‘x’ in a signal, register or bit name denotes the number of the capture channel. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 127 dsPIC33FJ12GP201/202 12.1 Input Capture Registers REGISTER 12-1: ICxCON: INPUT CAPTURE x CONTROL REGISTER U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 — — ICSIDL — — — — — bit 15 bit 8 R/W-0 R/W-0 ICTMR R/W-0 ICI<1:0> R-0, HC R-0, HC ICOV ICBNE R/W-0 R/W-0 R/W-0 ICM<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 ICSIDL: Input Capture Module Stop in Idle Control bit 1 = Input capture module will halt in CPU Idle mode 0 = Input capture module will continue to operate in CPU Idle mode bit 12-8 Unimplemented: Read as ‘0’ bit 7 ICTMR: Input Capture Timer Select bits 1 = TMR2 contents are captured on capture event 0 = TMR3 contents are captured on capture event bit 6-5 ICI<1:0>: Select Number of Captures per Interrupt bits 11 = Interrupt on every fourth capture event 10 = Interrupt on every third capture event 01 = Interrupt on every second capture event 00 = Interrupt on every capture event bit 4 ICOV: Input Capture Overflow Status Flag bit (read-only) 1 = Input capture overflow occurred 0 = No input capture overflow occurred bit 3 ICBNE: Input Capture Buffer Empty Status bit (read-only) 1 = Input capture buffer is not empty, at least one more capture value can be read 0 = Input capture buffer is empty bit 2-0 ICM<2:0>: Input Capture Mode Select bits 111 =Input capture functions as interrupt pin only when device is in Sleep or Idle mode (Rising edge detect only, all other control bits are not applicable.) 110 = Unused (module disabled) 101 = Capture mode, every 16th rising edge 100 = Capture mode, every 4th rising edge 011 = Capture mode, every rising edge 010 = Capture mode, every falling edge 001 = Capture mode, every edge (rising and falling) (ICI<1:0> bits do not control interrupt generation for this mode.) 000 =Input capture module turned off DS70264B-page 128 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 13.0 Note: 13.1 OUTPUT COMPARE This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. 8. To initiate another single pulse output, change the Timer and Compare register settings, if needed, and then issue a write to set the OCM bits to ‘100’. Disabling and re-enabling the timer, and clearing the TMRy register, are not required, but may be advantageous for defining a pulse from a known event time boundary. The output compare module does not have to be disabled after the falling edge of the output pulse. Another pulse can be initiated by rewriting the value of the OCxCON register. 13.2 Setup for Single Output Pulse Generation Setup for Continuous Output Pulse Generation When the OCM control bits (OCxCON<2:0>) are set to ‘100’, the selected output compare channel initializes the OCx pin to the low state and generates a single output pulse. When the OCM control bits (OCxCON<2:0>) are set to ‘101’, the selected output compare channel initializes the OCx pin to the low state and generates output pulses on each and every compare match event. To generate a single output pulse, the following steps are required. These steps assume timer source is initially turned off but this is not a requirement for the module operation. To configure the module for generation of a continuous stream of output pulses, the following steps are required. These steps assume timer source is initially turned off but this is not a requirement for the module operation. 1. Determine the instruction clock cycle time. Take into account the frequency of the external clock to the timer source (if one is used) and the timer prescaler settings. 2. Calculate time to the rising edge of the output pulse relative to the TMRy start value (0000h). 3. Calculate the time to the falling edge of the pulse based on the desired pulse width and the time to the rising edge of the pulse. 4. Write the value computed in step 2 into the Output Compare register, OCxR, and the value computed in step 3 into the Output Compare Secondary register, OCxRS. 5. Set Timer Period register, PRy, to a value equal to or greater than value in OCxRS, the Output Compare Secondary register. 6. Set the OCM bits to ‘100’ and the OCTSEL (OCxCON<3>) bit to the desired timer source. The OCx pin state will now be driven low. 7. Set the TON (TyCON<15>) bit to ‘1’, which enables the compare time base to count. Upon the first match between TMRy and OCxR, the OCx pin will be driven high. When the incrementing timer, TMRy, matches the Output Compare Secondary register, OCxRS, the second and trailing edge (high-to-low) of the pulse is driven onto the OCx pin. No additional pulses are driven onto the OCx pin and it remains at low. As a result of the second compare match event, the OCxIF interrupt flag bit is set. This will result in an interrupt if it is enabled by setting the OCxIE bit. For further information on peripheral interrupts, refer to Section 6.0 “Interrupt Controller”. © 2007 Microchip Technology Inc. 1. Determine the instruction clock cycle time. Take into account the frequency of the external clock to the timer source (if one is used) and the timer prescaler settings. 2. Calculate time to the rising edge of the output pulse relative to the TMRy start value (0000h). 3. Calculate the time to the falling edge of the pulse, based on the desired pulse width and the time to the rising edge of the pulse. 4. Write the values computed in step 2 into the Output Compare register, OCxR, and value computed in step 3 into the Output Compare Secondary register, OCxRS. 5. Set Timer Period register, PRy, to a value equal to or greater than value in OCxRS, the Output Compare Secondary Register. 6. Set the OCM bits to ‘101’ and the OCTSEL bit to the desired timer source. The OCx pin state will now be driven low. 7. Enable the compare time base by setting the TON (TyCON<15>) bit to ‘1’. Upon the first match between TMRy and OCxR, the OCx pin will be driven high. When the compare time base, TMRy, matches the Output Compare Secondary register, OCxRS, the second and trailing edge (high-to-low) of the pulse is driven onto the OCx pin. Preliminary DS70264B-page 129 dsPIC33FJ12GP201/202 8. As a result of the second compare match event, the OCxIF interrupt flag bit is set. When the compare time base and the value in its respective Timer Period register match, the TMRy register resets to 0x0000 and resumes counting. 9. Steps 8 through 11 are repeated and a continuous stream of pulses is generated, indefinitely. The OCxIF flag is set on each OCxRS-TMRy compare match event. 13.3 13.3.1 The PWM period is specified by writing to PRy, the Timer Period register. The PWM period can be calculated using Equation 13-1: EQUATION 13-1: Pulse-Width Modulation Mode 2. 3. 4. 5. Set the PWM period by writing to the selected Timer Period register (PRy). Set the PWM duty cycle by writing to the OCxRS register. Write the OxCR register with the initial duty cycle. Enable interrupts, if required, for the timer and output compare modules. The output compare interrupt is required for PWM Fault pin utilization. Configure the output compare module for one of two PWM operation modes by writing to the Output Compare Mode bits, OCM<2:0> and (OCxCON<2:0>). Set the TMRy prescale value and enable the time base by setting TON = 1 (TxCON<15>) Note: The OCxR register should be initialized before the output compare module is first enabled. The OCxR register becomes a read-only duty cycle register when the module is operated in the PWM modes. The value held in OCxR will become the PWM duty cycle for the first PWM period. The contents of the Output Compare Secondary register, OCxRS, will not be transferred into OCxR until a time base period match occurs. EQUATION 13-2: Note: 13.3.2 A PRy value of N will produce a PWM period of N + 1 time base count cycles. For example, a value of 7 written into the PRy register will yield a period consisting of eight time base cycles. PWM DUTY CYCLE Specify the PWM duty cycle is specified by writing to the OCxRS register. The OCxRS register can be written to at any time, but the duty cycle value is not latched into OCxR until a match between PRy and TMRy occurs (i.e., the period is complete). This provides a double buffer for the PWM duty cycle and is essential for glitchless PWM operation. In the PWM mode, OCxR is a read-only register. Some important boundary parameters of the PWM duty cycle include: • If the Output Compare register, OCxR, is loaded with 0000h, the OCx pin will remain low (0% duty cycle). • If OCxR is greater than PRy (Timer Period register), the pin will remain high (100% duty cycle). • If OCxR is equal to PRy, the OCx pin will be low for one time base count value and high for all other count values. See Example 13-1 for PWM mode timing details. Table 13-1 shows example PWM frequencies and resolutions for a device operating at 10 MIPS. CALCULATION FOR MAXIMUM PWM RESOLUTION log10 Maximum PWM Resolution (bits) = DS70264B-page 130 CALCULATING THE PWM PERIOD PWM Period = [(PRy) + 1] • TCY • (Timer Prescale Value) where: PWM Frequency = 1/[PWM Period] Use the following steps when configuring the output compare module for PWM operation: 1. PWM PERIOD Preliminary ( FF ) CY PWM log10(2) bits © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 EXAMPLE 13-1: 1. 2. PWM PERIOD AND DUTY CYCLE CALCULATIONS Find the Timer Period register value for a desired PWM frequency that is 52.08 kHz, where FCY = 16 MHz and a Timer2 prescaler setting of 1:1. TCY = 62.5 ns PWM Period = 1/PWM Frequency = 1/52.08 kHz = 19.2 ms PWM Period = (PR2 + 1) • TCY • (Timer2 Prescale Value) 19.2 ms = (PR2 + 1) • 62.5 ns • 1 PR2 = 306 Find the maximum resolution of the duty cycle that can be used with a 52.08 kHz frequency and a 32 MHz device clock rate: PWM Resolution = log10 (FCY/FPWM)/log102) bits = (log10 (16 MHz/52.08 kHz)/log102) bits = 8.3 bits TABLE 13-1: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 4 MIPS (FCY = 4 MHz) PWM Frequency 7.6 Hz 61 Hz 122 Hz 977 Hz 3.9 kHz 31.3 kHz 125 kHz Timer Prescaler Ratio 8 1 1 1 1 1 1 Period Register Value FFFFh FFFFh 7FFFh 0FFFh 03FFh 007Fh 001Fh 16 16 15 12 10 7 5 Resolution (bits) TABLE 13-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 16 MIPS (FCY = 16 MHz) PWM Frequency 30.5 Hz 244 Hz 488 Hz 3.9 kHz 15.6 kHz 125 kHz 500 kHz Timer Prescaler Ratio 8 1 1 1 1 1 1 Period Register Value FFFFh FFFFh 7FFFh 0FFFh 03FFh 007Fh 001Fh 16 16 15 12 10 7 5 Resolution (bits) TABLE 13-3: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MIPS (FCY = 40 MHz) PWM Frequency 76 Hz 610 Hz 1.22 Hz 9.77 kHz 39 kHz 313 kHz 1.25 MHz Timer Prescaler Ratio 8 1 1 1 1 1 1 Period Register Value FFFFh FFFFh 7FFFh 0FFFh 03FFh 007Fh 001Fh 16 16 15 12 10 7 5 Resolution (bits) © 2007 Microchip Technology Inc. Preliminary DS70264B-page 131 dsPIC33FJ12GP201/202 FIGURE 13-1: OUTPUT COMPARE MODULE BLOCK DIAGRAM Set Flag bit OCxIF(1) OCxRS(1) Output Logic OCxR(1) 3 OCM2:OCM0 Mode Select Comparator 0 16 OCTSEL 1 0 S Q R OCx(1) Output Enable OCFA(2) 1 16 TMR register inputs from time bases(3) Period match signals from time bases(3) Note 1: Where ‘x’ is shown, reference is made to the registers associated with the respective output compare channels 1 through 8. 2: OCFA pin controls OC1-OC2 channels. 3: TMR2/TMR3 can be selected via OCTSEL(OCxOCN<3>) bit. DS70264B-page 132 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 13.4 Output Compare Register REGISTER 13-1: OCxCON: OUTPUT COMPARE x CONTROL REGISTER U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 — — OCSIDL — — — — — bit 15 bit 8 U-0 U-0 U-0 R-0 HC R/W-0 — — — OCFLT OCTSEL R/W-0 R/W-0 R/W-0 OCM<2:0> bit 7 bit 0 Legend: HC = Cleared in Hardware HS = Set in Hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as ‘0’ bit 13 OCSIDL: Stop Output Compare in Idle Mode Control bit 1 = Output Compare x will halt in CPU Idle mode 0 = Output Compare x will continue to operate in CPU Idle mode bit 12-5 Unimplemented: Read as ‘0’ bit 4 OCFLT: PWM Fault Condition Status bit 1 = PWM Fault condition has occurred (cleared in hardware only) 0 = No PWM Fault condition has occurred (This bit is only used when OCM<2:0> = 111.) bit 3 OCTSEL: Output Compare Timer Select bit 1 = Timer3 is the clock source for Compare x 0 = Timer2 is the clock source for Compare x bit 2-0 OCM<2:0>: Output Compare Mode Select bits 111 = PWM mode on OCx, Fault pin enabled 110 = PWM mode on OCx, Fault pin disabled 101 = Initialize OCx pin low, generate continuous output pulses on OCx pin 100 = Initialize OCx pin low, generate single output pulse on OCx pin 011 = Compare event toggles OCx pin 010 = Initialize OCx pin high, compare event forces OCx pin low 001 = Initialize OCx pin low, compare event forces OCx pin high 000 = Output compare channel is disabled © 2007 Microchip Technology Inc. Preliminary DS70264B-page 133 dsPIC33FJ12GP201/202 NOTES: DS70264B-page 134 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 14.0 Note: SERIAL PERIPHERAL INTERFACE (SPI) 14.3 This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The Serial Peripheral Interface (SPI) module is a synchronous serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices can be serial EEPROMs, shift registers, display drivers, analog-to-digital (A/D) converters, etc. The SPI module is compatible with SPI and SIOP from Motorola®. Each SPI module consists of a 16-bit shift register, SPIxSR (where x = 1 or 2), used for shifting data in and out, and a buffer register, SPIxBUF. A control register, SPIxCON, configures the module. Additionally, a status register, SPIxSTAT, indicates status conditions. Transmit writes are also double-buffered. The user application writes to SPIxBUF. When the Master or Slave transfer is completed, the contents of the shift register (SPIxSR) are moved to the receive buffer. If any transmit data has been written to the buffer register, the contents of the transmit buffer are moved to SPIxSR. The received data is thus placed in SPIxBUF and the transmit data in SPIxSR is ready for the next transfer. Note: 14.4 SDIx (serial data input) SDOx (serial data output) SCKx (shift clock input or output) SSx (active low slave select). 1. 2. In Master mode operation, SCK is a clock output. In Slave mode, it is a clock input. 14.1 A series of 8 or 16 clock pulses shift out bits from the SPIxSR to SDOx pin and simultaneously shift in data from the SDIx pin. An interrupt is generated when the transfer is complete and the corresponding interrupt flag bit (SPI1IF) is set. This interrupt can be disabled through an interrupt enable bit (SPI1IE). 14.2 3. 4. 5. Interrupts If the receive buffer is full when new data is being transferred from SPIxSR to SPIxBUF, the module sets the SPIROV bit, indicating an overflow condition. The transfer of the data from SPIxSR to SPIxBUF is not completed, and the new data is lost. The module will not respond to SCL transitions while SPIROV is ‘1’, effectively disabling the module until SPIxBUF is read by user software. © 2007 Microchip Technology Inc. SPI Setup If using interrupts: a) Clear the SPIxIF bit in the respective IFSn register. b) Set the SPIxIE bit in the respective IECn register. c) Write the SPIxIP bits in the respective IPCn register to set the interrupt priority. Write the desired settings to the SPIxCON register with MSTEN (SPIxCON1<5>) = 1. Clear the SPIROV bit (SPIxSTAT<6>). Enable SPI operation by setting the SPIEN bit (SPIxSTAT<15>). Write the data to be transmitted to the SPIxBUF register. Transmission (and reception) will start as soon as data is written to the SPIxBUF register. To set up the SPI module for the Slave mode of operation: 1. 2. Receive Operations The receive operation is double-buffered. When a complete byte is received, it is transferred from SPIxSR to SPIxBUF. Both the transmit buffer (SPIxTXB) and the receive buffer (SPIxRXB) are mapped to the same register address, SPIxBUF. Do not perform read-modify-write operations (such as bit-oriented instructions) on the SPIxBUF register. To set up the SPI module for the Master mode of operation: The serial interface consists of 4 pins: • • • • Transmit Operations 3. 4. 5. 6. 7. Preliminary Clear the SPIxBUF register. If using interrupts: a) Clear the SPIxIF bit in the respective IFSn register. b) Set the SPIxIE bit in the respective IECn register. c) Write the SPIxIP bits in the respective IPCn register to set the interrupt priority. Write the desired settings to the SPIxCON1 and SPIxCON2 registers with MSTEN (SPIxCON1<5>) = 0. Clear the SMP bit. If the CKE bit is set, then set the SSEN bit (SPIxCON1<7>) to enable the SSx pin. Clear the SPIROV bit (SPIxSTAT<6>). Enable SPI operation by setting the SPIEN bit (SPIxSTAT<15>). DS70264B-page 135 dsPIC33FJ12GP201/202 The SPI module generates an interrupt indicating completion of a byte or word transfer, as well as a separate interrupt for all SPI error conditions. FIGURE 14-1: SPI MODULE BLOCK DIAGRAM SCKx SSx 1:1 to 1:8 Secondary Prescaler Sync Control 1:1/4/16/64 Primary Prescaler Select Edge Control Clock SPIxCON1<1:0> Shift Control SPIxCON1<4:2> SDOx Enable Master Clock bit 0 SDIx FCY SPIxSR Transfer Transfer SPIxRXB SPIxTXB SPIxBUF Read SPIxBUF Write SPIxBUF 16 Internal Data Bus DS70264B-page 136 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 FIGURE 14-2: SPI MASTER/SLAVE CONNECTION PROCESSOR 1 (SPI Master) PROCESSOR 2 (SPI Slave) SDOx SDIx Serial Receive Buffer (SPIxRXB) Serial Receive Buffer (SPIxRXB) SDIx Shift Register (SPIxSR) SDOx LSb MSb MSb LSb Serial Transmit Buffer (SPIxTXB) Serial Transmit Buffer (SPIxTXB) SPI Buffer (SPIxBUF)(2) Shift Register (SPIxSR) Serial Clock SCKx SCKx SPI Buffer (SPIxBUF)(2) SSx(1) (MSTEN (SPIxCON1<5>) = 1) Note 1: 2: FIGURE 14-3: (SSEN (SPIxCON1<7>) = 1 and MSTEN (SPIxCON1<5>) = 0) Using the SSx pin in Slave mode of operation is optional. User application must write transmit data to read received data from SPIxBUF. The SPIxTXB and SPIxRXB registers are memory mapped to SPIxBUF. SPI MASTER, FRAME MASTER CONNECTION DIAGRAM PROCESSOR 2 dsPIC33F SDOx SDIx SDIx SDOx Serial Clock SCKx SSx FIGURE 14-4: Frame Sync Pulse SCKx SSx SPI MASTER, FRAME SLAVE CONNECTION DIAGRAM PROCESSOR 2 dsPIC33F SDIx SDOx SDOx SDIx SCKx SSx © 2007 Microchip Technology Inc. Serial Clock Frame Sync Pulse Preliminary SCKx SSx DS70264B-page 137 dsPIC33FJ12GP201/202 FIGURE 14-5: SPI SLAVE, FRAME MASTER CONNECTION DIAGRAM PROCESSOR 2 dsPIC33F SDIx SDOx SDOx SDIx Serial Clock SCKx SSx FIGURE 14-6: SCKx SSx Frame Sync Pulse SPI SLAVE, FRAME SLAVE CONNECTION DIAGRAM PROCESSOR 2 dsPIC33F SDIx SDOx SDOx SDIx Serial Clock SCKx SSx EQUATION 14-1: SSx Frame Sync Pulse RELATIONSHIP BETWEEN DEVICE AND SPI CLOCK SPEED FSCK = TABLE 14-1: SCKx FCY Primary Prescaler * Secondary Prescaler SAMPLE SCKx FREQUENCIES Secondary Prescaler Settings FCY = 40 MHz Primary Prescaler Settings 1:1 2:1 4:1 6:1 8:1 1:1 Invalid Invalid 10000 6666.67 5000 4:1 10000 5000 2500 1666.67 1250 16:1 2500 1250 625 416.67 312.50 64:1 625 312.5 156.25 104.17 78.125 1:1 5000 2500 1250 833 625 FCY = 5 MHz Primary Prescaler Settings Note: 4:1 1250 625 313 208 156 16:1 313 156 78 52 39 64:1 78 39 20 13 10 SCKx frequencies shown in kHz. DS70264B-page 138 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 14-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 SPIEN — SPISIDL — — — — — bit 15 bit 8 U-0 R/C-0 U-0 U-0 U-0 U-0 R-0 R-0 — SPIROV — — — — SPITBF SPIRBF bit 7 bit 0 Legend: C = Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 SPIEN: SPIx Enable bit 1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins 0 = Disables module bit 14 Unimplemented: Read as ‘0’ bit 13 SPISIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 SPIROV: Receive Overflow Flag bit 1 = A new byte/word is completely received and discarded. The user software has not read the previous data in the SPIxBUF register. 0 = No overflow has occurred. bit 5-2 Unimplemented: Read as ‘0’ bit 1 SPITBF: SPIx Transmit Buffer Full Status bit 1 = Transmit not yet started, SPIxTXB is full 0 = Transmit started, SPIxTXB is empty Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR bit 0 SPIRBF: SPIx Receive Buffer Full Status bit 1 = Receive complete, SPIxRXB is full 0 = Receive is not complete, SPIxRXB is empty Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB © 2007 Microchip Technology Inc. Preliminary DS70264B-page 139 dsPIC33FJ12GP201/202 REGISTER 14-2: SPIXCON1: SPIx CONTROL REGISTER 1 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — DISSCK DISSDO MODE16 SMP CKE(1) bit 15 bit 8 R/W-0 R/W-0 R/W-0 SSEN CKP MSTEN R/W-0 R/W-0 R/W-0 R/W-0 SPRE<2:0> R/W-0 PPRE<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as ‘0’ bit 12 DISSCK: Disable SCKx pin bit (SPI Master modes only) 1 = Internal SPI clock is disabled, pin functions as I/O 0 = Internal SPI clock is enabled bit 11 DISSDO: Disable SDOx pin bit 1 = SDOx pin is not used by module; pin functions as I/O 0 = SDOx pin is controlled by the module bit 10 MODE16: Word/Byte Communication Select bit 1 = Communication is word-wide (16 bits) 0 = Communication is byte-wide (8 bits) bit 9 SMP: SPIx Data Input Sample Phase bit Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time Slave mode: SMP must be cleared when SPIx is used in Slave mode. bit 8 CKE: SPIx Clock Edge Select bit(1) 1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6) 0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6) bit 7 SSEN: Slave Select Enable bit (Slave mode) 1 = SSx pin used for Slave mode 0 = SSx pin not used by module. Pin controlled by port function. bit 6 CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level; active state is a low level 0 = Idle state for clock is a low level; active state is a high level bit 5 MSTEN: Master Mode Enable bit 1 = Master mode 0 = Slave mode Note 1: The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes (FRMEN = 1). DS70264B-page 140 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 14-2: SPIXCON1: SPIx CONTROL REGISTER 1 (CONTINUED) bit 4-2 SPRE<2:0>: Secondary Prescale bits (Master mode) 111 = Secondary prescale 1:1 110 = Secondary prescale 2:1 • • • 000 = Secondary prescale 8:1 bit 1-0 PPRE<1:0>: Primary Prescale bits (Master mode) 11 = Primary prescale 1:1 10 = Primary prescale 4:1 01 = Primary prescale 16:1 00 = Primary prescale 64:1 Note 1: The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes (FRMEN = 1). © 2007 Microchip Technology Inc. Preliminary DS70264B-page 141 dsPIC33FJ12GP201/202 REGISTER 14-3: SPIxCON2: SPIx CONTROL REGISTER 2 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 FRMEN SPIFSD FRMPOL — — — — — bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0 — — — — — — FRMDLY — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 FRMEN: Framed SPIx Support bit 1 = Framed SPIx support enabled (SSx pin used as frame sync pulse input/output) 0 = Framed SPIx support disabled bit 14 SPIFSD: Frame Sync Pulse Direction Control bit 1 = Frame sync pulse input (slave) 0 = Frame sync pulse output (master) bit 13 FRMPOL: Frame Sync Pulse Polarity bit 1 = Frame sync pulse is active-high 0 = Frame sync pulse is active-low bit 12-2 Unimplemented: Read as ‘0’ bit 1 FRMDLY: Frame Sync Pulse Edge Select bit 1 = Frame sync pulse coincides with first bit clock 0 = Frame sync pulse precedes first bit clock bit 0 Unimplemented: This bit must not be set to ‘1’ by the user application. DS70264B-page 142 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 15.0 Note: INTER-INTEGRATED CIRCUIT (I2C) This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The Inter-Integrated Circuit (I2C) module provides complete hardware support for both Slave and MultiMaster modes of the I2C serial communication standard, with a 16-bit interface. The I2C module has a 2-pin interface: • The SCLx pin is clock • The SDAx pin is data The I2C module offers the following key features: • I2C interface supporting both Master and Slave modes of operation • I2C Slave mode supports 7 and 10-bit address • I2C Master mode supports 7 and 10-bit address • I2C port allows bidirectional transfers between master and slaves • Serial clock synchronization for I2C port can be used as a handshake mechanism to suspend and resume serial transfer (SCLREL control) • I2C supports multi-master operation, detects bus collision and arbitrates accordingly 15.1 Operating Modes The hardware fully implements all the master and slave functions of the I2C Standard and Fast mode specifications, as well as 7 and 10-bit addressing. The I2C module can operate either as a slave or a master on an I2C bus. The following types of I2C operation are supported: • • • I2C slave operation with 7-bit address I2C slave operation with 10-bit address I2C master operation with 7 or 10-bit address 15.2 I2CxCON and I2CxSTAT are control and status registers, respectively. The I2CxCON register is readable and writable. The lower six bits of I2CxSTAT are read-only. The remaining bits of the I2CSTAT are read/write. • I2CxRSR is the shift register used for shifting data • I2CxRCV is the receive buffer and the register to which data bytes are written, or from which data bytes are read • I2CxTRN is the transmit register to which bytes are written during a transmit operation • The I2CxADD register holds the slave address • A status bit, ADD10, indicates 10-bit Address mode • I2CxBRG acts as the Baud Rate Generator (BRG) reload value. In receive operations, I2CxRSR and I2CxRCV together form a double-buffered receiver. When I2CxRSR receives a complete byte, it is transferred to I2CxRCV, and an interrupt pulse is generated. 15.3 I2C Interrupts The I2C module generates two interrupt flags: • MI2CxIF (I2C Master Events Interrupt flag) • SI2CxIF (I2C Slave Events Interrupt flag) A separate interrupt is generated for all I2C error conditions. 15.4 Baud Rate Generator In I2C Master mode, the reload value for the Baud Rate Generator (BRG) is located in the I2CxBRG register. When the BRG is loaded with this value, the BRG counts down to zero and stops until another reload has taken place. If clock arbitration is taking place, for example, the BRG is reloaded when the SCLx pin is sampled high. As per the I2C standard, FSCL can be 100 kHz or 400 kHz. However, the user application can specify any baud rate up to 1 MHz. I2CxBRG values of ‘0’ or ‘1’ are illegal. EQUATION 15-1: For details about the communication sequence in each of these modes, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. © 2007 Microchip Technology Inc. I2C Registers Preliminary I2CxBRG = SERIAL CLOCK RATE CY ( FFSCL – ) FCY –1 10,000,000 DS70264B-page 143 dsPIC33FJ12GP201/202 FIGURE 15-1: I2C™ BLOCK DIAGRAM (X = 1) Internal Data Bus I2CxRCV SCLx Read Shift Clock I2CxRSR LSb SDAx Address Match Match Detect Write I2CxMSK Write Read I2CxADD Read Start and Stop Bit Detect Write Start and Stop Bit Generation Control Logic I2CxSTAT Collision Detect Read Write I2CxCON Acknowledge Generation Read Clock Stretching Write I2CxTRN LSb Read Shift Clock Reload Control Write BRG Down Counter I2CxBRG Read TCY/2 DS70264B-page 144 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 15.5 I2C Module Addresses 15.8 The 10-bit I2CxADD register contains the Slave mode addresses. If the A10M bit (I2CxCON<10>) is ‘0’, the address is interpreted by the module as a 7-bit address. When an address is received, it is compared to the 7 Least Significant bits of the I2CxADD register. If the A10M bit is ‘1’, the address is assumed to be a 10-bit address. When an address is received, it is compared with the binary value, ‘11110 A9 A8’ (where ‘A9’ and ‘A8’ are two Most Significant bits of I2CxADD). If that value matches, the next address will be compared with the Least Significant 8 bits of I2CxADD, as specified in the 10-bit addressing protocol. TABLE 15-1: 7-BIT I2C™ SLAVE ADDRESSES SUPPORTED BY dsPIC33FJ12GP201/202 0x00 General call address or Start byte 0x01-0x03 Reserved 0x04-0x07 Hs mode Master codes 0x08-0x77 Valid 7-bit addresses 0x78-0x7b Valid 10-bit addresses (lower 7 bits) 0x7c-0x7f Reserved 15.6 Slave Address Masking The I2CxMSK register (Register 15-3) designates address bit positions as “don’t care” for both 7-bit and 10-bit Address modes. Setting a particular bit location (= 1) in the I2CxMSK register causes the slave module to respond, whether the corresponding address bit value is a ‘0’ or ‘1’. For example, when I2CxMSK is set to ‘00100000’, the Slave module will detect both addresses, ‘0000000’ and ‘00100000’. To enable address masking, the IPMI (Intelligent Peripheral Management Interface) must be disabled by clearing the IPMIEN bit (I2CxCON<11>). 15.7 IPMI Support The control bit IPMIEN enables the module to support the Intelligent Peripheral Management Interface (IPMI). When this bit is set, the module accepts and acts upon all addresses. General Call Address Support The general call address can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledgement. The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all ‘0’s with R_W = 0. The general call address is recognized when the General Call Enable (GCEN) bit is set (I2CxCON<7> = 1). When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the I2CxRCV to determine if the address was device-specific or a general call address. 15.9 Automatic Clock Stretch In Slave modes, the module can synchronize buffer reads and write to the master device by clock stretching. 15.9.1 TRANSMIT CLOCK STRETCHING Both 10-bit and 7-bit Transmit modes implement clock stretching by asserting the SCLREL bit after the falling edge of the ninth clock, if the TBF bit is cleared, indicating the buffer is empty. In Slave Transmit modes, clock stretching is always performed, irrespective of the STREN bit. The user’s ISR must set the SCLREL bit before transmission is allowed to continue. By holding the SCLx line low, the user application has time to service the ISR and load the contents of the I2CxTRN before the master device can initiate another transmit sequence. 15.9.2 RECEIVE CLOCK STRETCHING The STREN bit in the I2CxCON register can be used to enable clock stretching in Slave Receive mode. When the STREN bit is set, the SCLx pin will be held low at the end of each data receive sequence. The user’s ISR must set the SCLREL bit before reception is allowed to continue. By holding the SCLx line low, the user application has time to service the ISR and read the contents of the I2CxRCV before the master device can initiate another receive sequence. This prevents buffer overruns. 15.10 Software Controlled Clock Stretching (STREN = 1) When the STREN bit is ‘1’, the software can clear the SCLREL bit to allow software to control the clock stretching. If the STREN bit is ‘0’, a software write to the SCLREL bit is disregarded and has no effect on the SCLREL bit. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 145 dsPIC33FJ12GP201/202 15.11 Slope Control 2 The I C standard requires slope control on the SDAx and SCLx signals for Fast mode (400 kHz). The control bit, DISSLW, enables the user application to disable slew rate control if desired. It is necessary to disable the slew rate control for 1 MHz mode. 15.12 Clock Arbitration Clock arbitration occurs when the master deasserts the SCLx pin (SCLx allowed to float high) during any receive, transmit or Restart/Stop condition. When the SCLx pin is allowed to float high, the BRG is suspended from counting until the SCLx pin is actually sampled high. When the SCLx pin is sampled high, the BRG is reloaded with the contents of I2CxBRG and begins counting. This process ensures that the SCLx high time will always be at least one BRG rollover count in the event that the clock is held low by an external device. DS70264B-page 146 15.13 Multi-Master Communication, Bus Collision and Bus Arbitration Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto the SDAx pin, arbitration takes place when the master outputs a ‘1’ on SDAx by letting SDAx float high while another master asserts a ‘0’. When the SCLx pin floats high, data should be stable. If the expected data on SDAx is a ‘1’ and the data sampled on the SDAx pin = 0, then a bus collision has taken place. The master will set the I2C master events interrupt flag and reset the master portion of the I2C port to its Idle state. 15.14 Peripheral Pin Select Limitations The I2C module has limited peripheral pin select functionality. When the ACTI2C bit in the FPOR configuration register is set to ‘1‘, the module uses the SDAx/ SCLx pins. If the ALTI2C bit is ‘0‘, the module uses the ASDAx/ASCLx pins. Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 15-1: I2CxCON: I2Cx CONTROL REGISTER R/W-0 U-0 R/W-0 R/W-1 HC R/W-0 R/W-0 R/W-0 R/W-0 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit W = Writable bit HS = Set in hardware HC = Cleared in hardware -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 I2CEN: I2Cx Enable bit 1 = Enables the I2Cx module and configures the SDAx and SCLx pins as serial port pins 0 = Disables the I2Cx module. All I2C pins are controlled by port functions bit 14 Unimplemented: Read as ‘0’ bit 13 I2CSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters an Idle mode 0 = Continue module operation in Idle mode bit 12 SCLREL: SCLx Release Control bit (when operating as I2C slave) 1 = Release SCLx clock 0 = Hold SCLx clock low (clock stretch) If STREN = 1: Bit is R/W (i.e., software can write ‘0’ to initiate stretch and write ‘1’ to release clock). Hardware clear at beginning of slave transmission. Hardware clear at end of slave reception. If STREN = 0: Bit is R/S (i.e., software can only write ‘1’ to release clock). Hardware clear at beginning of slave transmission. bit 11 IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit 1 = IPMI mode is enabled; all addresses Acknowledged 0 = IPMI mode disabled bit 10 A10M: 10-bit Slave Address bit 1 = I2CxADD is a 10-bit slave address 0 = I2CxADD is a 7-bit slave address bit 9 DISSLW: Disable Slew Rate Control bit 1 = Slew rate control disabled 0 = Slew rate control enabled bit 8 SMEN: SMbus Input Levels bit 1 = Enable I/O pin thresholds compliant with SMbus specification 0 = Disable SMbus input thresholds bit 7 GCEN: General Call Enable bit (when operating as I2C slave) 1 = Enable interrupt when a general call address is received in the I2CxRSR (module is enabled for reception) 0 = General call address disabled bit 6 STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave) Used in conjunction with SCLREL bit. 1 = Enable software or receive clock stretching 0 = Disable software or receive clock stretching © 2007 Microchip Technology Inc. Preliminary DS70264B-page 147 dsPIC33FJ12GP201/202 REGISTER 15-1: I2CxCON: I2Cx CONTROL REGISTER (CONTINUED) bit 5 ACKDT: Acknowledge Data bit (when operating as I2C master, applicable during master receive) Value that will be transmitted when the software initiates an Acknowledge sequence. 1 = Send NACK during Acknowledge 0 = Send ACK during Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (when operating as I2C master, applicable during master receive) 1 = Initiate Acknowledge sequence on SDAx and SCLx pins and transmit ACKDT data bit. Hardware clear at end of master Acknowledge sequence 0 = Acknowledge sequence not in progress bit 3 RCEN: Receive Enable bit (when operating as I2C master) 1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of master receive data byte 0 = Receive sequence not in progress bit 2 PEN: Stop Condition Enable bit (when operating as I2C master) 1 = Initiate Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence 0 = Stop condition not in progress bit 1 RSEN: Repeated Start Condition Enable bit (when operating as I2C master) 1 = Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of master Repeated Start sequence 0 = Repeated Start condition not in progress bit 0 SEN: Start Condition Enable bit (when operating as I2C master) 1 = Initiate Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence 0 = Start condition not in progress DS70264B-page 148 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 15-2: I2CxSTAT: I2Cx STATUS REGISTER R-0 HSC R-0 HSC U-0 U-0 U-0 R/C-0 HS R-0 HSC R-0 HSC ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 bit 15 bit 8 R/C-0 HS R/C-0 HS R-0 HSC R/C-0 HSC R/C-0 HSC R-0 HSC R-0 HSC R-0 HSC IWCOL I2COV D_A P S R_W RBF TBF bit 7 bit 0 Legend: U = Unimplemented bit, read as ‘0’ R = Readable bit W = Writable bit HS = Set in hardware HSC = Hardware set/cleared -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ACKSTAT: Acknowledge Status bit (when operating as I2C master, applicable to master transmit operation) 1 = NACK received from slave 0 = ACK received from slave Hardware set or clear at end of slave Acknowledge. bit 14 TRSTAT: Transmit Status bit (when operating as I2C master, applicable to master transmit operation) 1 = Master transmit is in progress (8 bits + ACK) 0 = Master transmit is not in progress Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge. bit 13-11 Unimplemented: Read as ‘0’ bit 10 BCL: Master Bus Collision Detect bit 1 = A bus collision has been detected during a master operation 0 = No collision Hardware set at detection of bus collision. bit 9 GCSTAT: General Call Status bit 1 = General call address was received 0 = General call address was not received Hardware set when address matches general call address. Hardware clear at Stop detection. bit 8 ADD10: 10-bit Address Status bit 1 = 10-bit address was matched 0 = 10-bit address was not matched Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection. bit 7 IWCOL: Write Collision Detect bit 1 = An attempt to write the I2CxTRN register failed because the I2C module is busy 0 = No collision Hardware set at occurrence of write to I2CxTRN while busy (cleared by software). bit 6 I2COV: Receive Overflow Flag bit 1 = A byte was received while the I2CxRCV register is still holding the previous byte 0 = No overflow Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software). bit 5 D_A: Data/Address bit (when operating as I2C slave) 1 = Indicates that the last byte received was data 0 = Indicates that the last byte received was device address Hardware clear at device address match. Hardware set by reception of slave byte. bit 4 P: Stop bit 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 149 dsPIC33FJ12GP201/202 REGISTER 15-2: I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED) bit 3 S: Start bit 1 = Indicates that a Start (or Repeated Start) bit has been detected last 0 = Start bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. bit 2 R_W: Read/Write Information bit (when operating as I2C slave) 1 = Read – indicates data transfer is output from slave 0 = Write – indicates data transfer is input to slave Hardware set or clear after reception of I 2C device address byte. bit 1 RBF: Receive Buffer Full Status bit 1 = Receive complete, I2CxRCV is full 0 = Receive not complete, I2CxRCV is empty Hardware set when I2CxRCV is written with received byte. Hardware clear when software reads I2CxRCV. bit 0 TBF: Transmit Buffer Full Status bit 1 = Transmit in progress, I2CxTRN is full 0 = Transmit complete, I2CxTRN is empty Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission. DS70264B-page 150 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 15-3: I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — AMSK9 AMSK8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 AMSK7 AMSK6 AMSK5 AMSK4 AMSK3 AMSK2 AMSK1 AMSK0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-10 Unimplemented: Read as ‘0’ bit 9-0 AMSKx: Mask for Address bit x Select bit 1 = Enable masking for bit x of incoming message address; bit match not required in this position 0 = Disable masking for bit x; bit match required in this position © 2007 Microchip Technology Inc. Preliminary DS70264B-page 151 dsPIC33FJ12GP201/202 NOTES: DS70264B-page 152 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 16.0 Note: UNIVERSAL ASYNCHRONOUS RECEIVER TRANSMITTER (UART) This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The Universal Asynchronous Receiver Transmitter (UART) module is one of the serial I/O modules available in the dsPIC33FJ12GP201/202 device family. The UART is a full-duplex asynchronous system that can communicate with peripheral devices, such as personal computers, LIN, RS-232 and RS-485 interfaces. The module also supports a hardware flow control option with the UxCTS and UxRTS pins and also includes an IrDA® encoder and decoder. The primary features of the UART module are: • Full-Duplex, 8- or 9-bit Data Transmission through the UxTX and UxRX pins • Even, odd or no parity options (for 8-bit data) • One or two stop bits FIGURE 16-1: • Hardware Flow Control Option with UxCTS and UxRTS pins • Fully Integrated Baud Rate Generator with 16-bit prescaler • Baud rates ranging from 1 Mbps to 15 Mbps at 16 MIPS • 4-deep First-In First-Out (FIFO) Transmit Data Buffer • 4-Deep FIFO Receive Data Buffer • Parity, framing and buffer overrun error detection • Support for 9-bit mode with Address Detect (9th bit = 1) • Transmit and Receive interrupts • A separate interrupt for all UART error conditions • Loopback mode for diagnostic support • Support for Sync and Break characters • Support for automatic baud rate detection • IrDA encoder and decoder logic • 16x baud clock output for IrDA support A simplified block diagram of the UART module is shown in Figure 16-1. The UART module consists of these key hardware elements: • Baud Rate Generator • Asynchronous Transmitter • Asynchronous Receiver UART SIMPLIFIED BLOCK DIAGRAM Baud Rate Generator IrDA® BCLK Hardware Flow Control UxRTS UxCTS © 2007 Microchip Technology Inc. UART Receiver UxRX UART Transmitter UxTX Preliminary DS70264B-page 153 dsPIC33FJ12GP201/202 16.1 UART Baud Rate Generator The UART module includes a dedicated 16-bit BRG. The BRGx register controls the period of a free-running 16-bit timer. Equation 16-1 shows the formula for computation of the baud rate with BRGH = 0. EQUATION 16-1: Note: EQUATION 16-2: FCY 16 • (BRGx + 1) BRGx = Note: FCY –1 16 • Baud Rate FCY denotes the instruction cycle clock frequency (FOSC/2). Example 16-1 shows the calculation of the baud rate error for the following conditions: • FCY = 4 MHz • Desired Baud Rate = 9600 UART BAUD RATE WITH BRGH = 1 Baud Rate = UART BAUD RATE WITH BRGH = 0 Baud Rate = BRGx = Equation 16-2 shows the formula for computation of the baud rate with BRGH = 1. FCY 4 • (BRGx + 1) FCY –1 4 • Baud Rate FCY denotes the instruction cycle clock frequency (FOSC/2). The maximum baud rate (BRGH = 1) possible is FCY/4 (for BRGx = 0), and the minimum baud rate possible is FCY/(4 * 65536). Writing a new value to the BRGx register causes the BRG timer to be reset (cleared). This ensures the BRG does not wait for a timer overflow before generating the new baud rate. The maximum baud rate (BRGH = 0) possible is FCY/16 (for BRGx = 0), and the minimum baud rate possible is FCY/(16 * 65536). EXAMPLE 16-1: BAUD RATE ERROR CALCULATION (BRGH = 0) Desired Baud Rate = FCY/(16 (BRGx + 1)) = = = ((FCY/Desired Baud Rate)/16) – 1 ((4000000/9600)/16) – 1 25 Calculated Baud Rate = = 4000000/(16 (25 + 1)) 9615 Error = (Calculated Baud Rate – Desired Baud Rate) Desired Baud Rate (9615 – 9600)/9600 0.16% Solving for BRGx Value: BRGx BRGx BRGx = = DS70264B-page 154 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 16.2 1. 2. 3. 4. Transmitting in 8-bit Data Mode 16.5 Set up the UART: a) Write appropriate values for data, parity and Stop bits. b) Write appropriate baud rate value to the BRGx register. c) Set up transmit and receive interrupt enable and priority bits. Enable the UART. Set the UTXEN bit (causes a transmit interrupt). Write data byte to lower byte of UxTXREG word. The value will be immediately transferred to the Transmit Shift Register (TSR) and the serial bit stream will start shifting out with the next rising edge of the baud clock. Alternately, the data byte can be transferred while UTXEN = 0, and the user application can set UTXEN. This causes the serial bit stream to begin immediately, because the baud clock starts from a cleared state. A transmit interrupt will be generated as per interrupt control bits, UTXISEL<1:0>. 16.3 1. 2. 3. 4. 5. Transmitting in 9-bit Data Mode Set up the UART (as described in Section 16.2 “Transmitting in 8-bit Data Mode”). Enable the UART. Set the UTXEN bit (causes a transmit interrupt). Write UxTXREG as a 16-bit value only. A word write to UxTXREG triggers the transfer of the 9-bit data to the TSR. The serial bit stream will start shifting out with the first rising edge of the baud clock. A transmit interrupt will be generated as per the setting of control bits, UTXISEL<1:0>. 16.4 3. 4. Configure the UART for the desired mode. Set UTXEN and UTXBRK, which sets up the Break character. Load the UxTXREG register with a dummy character to initiate transmission (value is ignored). Write 0x55 to UxTXREG, which loads the Sync character into the transmit FIFO. After the Break has been sent, the UTXBRK bit is reset by hardware. The Sync character now transmits. © 2007 Microchip Technology Inc. 2. 3. 4. Set up the UART (as described in Section 16.2 “Transmitting in 8-bit Data Mode”). Enable the UART. A receive interrupt will be generated when one or more data characters have been received as per interrupt control bits, URXISEL<1:0>. Read the OERR bit to determine if an overrun error has occurred. The OERR bit must be reset in software. Read UxRXREG. The act of reading the UxRXREG character will move the next character to the top of the receive FIFO, including a new set of PERR and FERR values. 16.6 Flow Control Using UxCTS and UxRTS Pins UARTx Clear to Send (UxCTS) and Request to Send (UxRTS) are the two hardware controlled active-low pins associated with the UART module. The UEN<1:0> bits in the UxMODE register configure these pins. These two pins allow the UART to operate in Simplex and Flow Control modes. They are implemented to control the transmission and the reception between the Data Terminal Equipment (DTE). 16.7 Infrared Support The UART module provides two types of infrared UART support: • IrDA clock output to support external IrDA encoder and decoder device (legacy module support) • Full implementation of the IrDA encoder and decoder. 16.7.1 Break and Sync Transmit Sequence The following sequence will send a message frame header made up of a Break, followed by an auto-baud Sync byte. 1. 2. 1. Receiving in 8-bit or 9-bit Data Mode EXTERNAL IrDA SUPPORT – IrDA CLOCK OUTPUT To support external IrDA encoder and decoder devices, the BCLK pin can be configured to generate the 16x baud clock. With UEN<1:0> = 11, the BCLK pin will output the 16x baud clock if the UART module is enabled. The pin can be used to support the IrDA codec chip. 16.7.2 BUILT-IN IrDA ENCODER AND DECODER The UART module includes full implementation of the IrDA encoder and decoder. The built-in IrDA encoder and decoder functionality is enabled using the IREN bit (UxMODE<12>). When enabled (IREN = 1), the receive pin (UxRX) acts as the input from the infrared receiver. The transmit pin (UxTX) acts as the output to the infrared transmitter. Preliminary DS70264B-page 155 dsPIC33FJ12GP201/202 REGISTER 16-1: UxMODE: UARTx MODE REGISTER R/W-0 U-0 R/W-0 R/W-0 R/W-0 U-0 UARTEN — USIDL IREN(1) RTSMD — R/W-0 R/W-0 UEN<1:0> bit 15 bit 8 R/W-0 HC R/W-0 R/W-0 HC R/W-0 R/W-0 WAKE LPBACK ABAUD URXINV BRGH R/W-0 R/W-0 PDSEL<1:0> R/W-0 STSEL bit 7 bit 0 Legend: HC = Hardware cleared R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 UARTEN: UARTx Enable bit 1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0> 0 = UARTx is disabled; all UARTx pins are controlled by port latches; UARTx power consumption minimal bit 14 Unimplemented: Read as ‘0’ bit 13 USIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12 IREN: IrDA Encoder and Decoder Enable bit(1) 1 = IrDA encoder and decoder enabled 0 = IrDA encoder and decoder disabled bit 11 RTSMD: Mode Selection for UxRTS Pin bit 1 = UxRTS pin in Simplex mode 0 = UxRTS pin in Flow Control mode bit 10 Unimplemented: Read as ‘0’ bit 9-8 UEN<1:0>: UARTx Enable bits 11 = UxTX, UxRX and BCLK pins are enabled and used; UxCTS pin controlled by port latches 10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used 01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches 00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLK pins controlled by port latches bit 7 WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit 1 = UARTx will continue to sample the UxRX pin; interrupt generated on falling edge; bit cleared in hardware on following rising edge 0 = No wake-up enabled bit 6 LPBACK: UARTx Loopback Mode Select bit 1 = Enable Loopback mode 0 = Loopback mode is disabled bit 5 ABAUD: Auto-Baud Enable bit 1 = Enable baud rate measurement on the next character – requires reception of a Sync field (55h) before other data; cleared in hardware upon completion 0 = Baud rate measurement disabled or completed bit 4 URXINV: Receive Polarity Inversion bit 1 = UxRX Idle state is ‘0’ 0 = UxRX Idle state is ‘1’ Note 1: This feature is only available for the 16x BRG mode (BRGH = 0). DS70264B-page 156 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 16-1: UxMODE: UARTx MODE REGISTER (CONTINUED) bit 3 BRGH: High Baud Rate Enable bit 1 = BRG generates 4 clocks per bit period (4x baud clock, High-Speed mode) 0 = BRG generates 16 clocks per bit period (16x baud clock, Standard mode) bit 2-1 PDSEL<1:0>: Parity and Data Selection bits 11 = 9-bit data, no parity 10 = 8-bit data, odd parity 01 = 8-bit data, even parity 00 = 8-bit data, no parity bit 0 STSEL: Stop Bit Selection bit 1 = Two Stop bits 0 = One Stop bit Note 1: This feature is only available for the 16x BRG mode (BRGH = 0). © 2007 Microchip Technology Inc. Preliminary DS70264B-page 157 dsPIC33FJ12GP201/202 REGISTER 16-2: UxSTA: UARTx STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 U-0 R/W-0 HC R/W-0 R-0 R-1 UTXISEL1 UTXINV(1) UTXISEL0 — UTXBRK UTXEN UTXBF TRMT bit 15 bit 8 R/W-0 R/W-0 URXISEL<1:0> R/W-0 R-1 R-0 R-0 R/C-0 R-0 ADDEN RIDLE PERR FERR OERR URXDA bit 7 bit 0 Legend: HC = Hardware cleared R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15,13 UTXISEL<1:0>: Transmission Interrupt Mode Selection bits 11 = Reserved; do not use 10 = Interrupt when a character is transferred to the Transmit Shift Register, and as a result, the transmit buffer becomes empty 01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit operations are completed 00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is at least one character open in the transmit buffer) bit 14 UTXINV: IrDA Encoder Transmit Polarity Inversion bit(1) 1 = IrDA encoded, UxTX Idle state is ‘1’ 0 = IrDA encoded, UxTX Idle state is ‘0’ bit 12 Unimplemented: Read as ‘0’ bit 11 UTXBRK: Transmit Break bit 1 = Send Sync Break on next transmission – Start bit, followed by twelve ‘0’ bits, followed by Stop bit; cleared by hardware upon completion 0 = Sync Break transmission disabled or completed bit 10 UTXEN: Transmit Enable bit 1 = Transmit enabled, UxTX pin controlled by UARTx 0 = Transmit disabled, any pending transmission is aborted and buffer is reset. UxTX pin controlled by port bit 9 UTXBF: Transmit Buffer Full Status bit (read-only) 1 = Transmit buffer is full 0 = Transmit buffer is not full, at least one more character can be written bit 8 TRMT: Transmit Shift Register Empty bit (read-only) 1 = Transmit Shift Register is empty and transmit buffer is empty (the last transmission has completed) 0 = Transmit Shift Register is not empty, a transmission is in progress or queued bit 7-6 URXISEL<1:0>: Receive Interrupt Mode Selection bits 11 = Interrupt is set on UxRSR transfer making the receive buffer full (i.e., has 4 data characters) 10 = Interrupt is set on UxRSR transfer making the receive buffer 3/4 full (i.e., has 3 data characters) 0x = Interrupt is set when any character is received and transferred from the UxRSR to the receive buffer. Receive buffer has one or more characters bit 5 ADDEN: Address Character Detect bit (bit 8 of received data = 1) 1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect 0 = Address Detect mode disabled Note 1: Value of bit only affects the transmit properties of the module when the IrDA encoder is enabled (IREN = 1). DS70264B-page 158 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 16-2: UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED) bit 4 RIDLE: Receiver Idle bit (read-only) 1 = Receiver is Idle 0 = Receiver is active bit 3 PERR: Parity Error Status bit (read-only) 1 = Parity error has been detected for the current character (character at the top of the receive FIFO) 0 = Parity error has not been detected bit 2 FERR: Framing Error Status bit (read-only) 1 = Framing error has been detected for the current character (character at the top of the receive FIFO) 0 = Framing error has not been detected bit 1 OERR: Receive Buffer Overrun Error Status bit (read/clear only) 1 = Receive buffer has overflowed 0 = Receive buffer has not overflowed. Clearing a previously set OERR bit (1 → 0 transition) will reset the receiver buffer and the UxRSR to the empty state bit 0 URXDA: Receive Buffer Data Available bit (read-only) 1 = Receive buffer has data, at least one more character can be read 0 = Receive buffer is empty Note 1: Value of bit only affects the transmit properties of the module when the IrDA encoder is enabled (IREN = 1). © 2007 Microchip Technology Inc. Preliminary DS70264B-page 159 dsPIC33FJ12GP201/202 NOTES: DS70264B-page 160 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 17.0 Note: 10-BIT/12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. Depending on the particular device pinout, the ADC can have up to 10 analog input pins, designated AN0 through AN9. In addition, there are two analog input pins for external voltage reference connections. These voltage reference inputs can be shared with other analog input pins. The actual number of analog input pins and external voltage reference input configuration depend on the specific device. A block diagram of the ADC is shown in Figure 17-1. 17.2 To configure the ADC module: The dsPIC33FJ12GP201/202 devices have up to 10 ADC module input channels. 1. The AD12B bit (AD1CON1<10>) allows each of the ADC modules to be configured as either a 10-bit, 4-sample-and-hold ADC (default configuration) or a 12-bit, 1-sample-and-hold ADC. 2. Note: 17.1 The ADC module must be disabled before the AD12B bit can be modified. • • • • • • • • • • • 3. 4. Key Features The 10-bit ADC configuration has the following key features: Successive Approximation (SAR) conversion Conversion speeds of up to 1.1 Msps Up to 10 analog input pins External voltage reference input pins Simultaneous sampling of up to four analog input pins Automatic Channel Scan mode Selectable conversion trigger source Selectable Buffer Fill modes Four result alignment options (signed/unsigned, fractional/integer) Operation during CPU Sleep and Idle modes 16-word bit conversion result buffer ADC Initialization 5. 6. 7. Select port pins as analog inputs (AD1PCFGH<15:0> or AD1PCFGL<15:0>). Select voltage reference source to match expected range on analog inputs (AD1CON2<15:13>). Select the analog conversion clock to match desired data rate with processor clock (AD1CON3<5:0>). Determine how many sample-and-hold channels will be used (AD1CON2<9:8> and AD1PCFGH<15:0> or AD1PCFGL<15:0>). Select the appropriate sample/conversion sequence (AD1CON1<7:5> and AD1CON3<12:8>). Select the way conversion results are presented in the buffer (AD1CON1<9:8>). a) Turn on the ADC module (AD1CON1<15>). Configure ADC interrupt (if required): a) Clear the AD1IF bit. b) Select ADC interrupt priority. The 12-bit ADC configuration supports all the above features, except: • In the 12-bit configuration, conversion speeds of up to 500 ksps are supported • There is only 1 sample-and-hold amplifier in the 12-bit configuration, so simultaneous sampling of multiple channels is not supported. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 161 dsPIC33FJ12GP201/202 FIGURE 17-1: ADC1 MODULE BLOCK DIAGRAM AVDD VREF+(1) AVSS AN1 AN4 + AN7(3) - VREFAN2 AN5 AN2 S/H - AN9(3) VREFAN1 + AN6(3) AN8(3) AN3 AN4 00100 AN5 00101 AN6(3) 00110 AN7(3) 00111 AN8(3) 01000 AN9(3) 01001 CH2(2) Note 1: 2: 3: Conversion Result Conversion Logic 16-bit ADC Output Buffer + - S/H CH3(2) CH1,CH2, CH3,CH0 Sample Input Switches + VREFAN1 ADC1 S/H VREF00000 00001 00010 00011 CH1(2) - Sample/Sequence Control Bus Interface AN0 AN3 AN0 Data Format VREF-(1) Input MUX Control CH0 S/H VREF+, VREF- inputs can be multiplexed with other analog inputs. Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation. AN6 through AN9 are not applicable to dsPIC33FJ12GP201 devices. DS70264B-page 162 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 EQUATION 17-1: ADC CONVERSION CLOCK PERIOD TAD = TCY(ADCS + 1) ADCS = FIGURE 17-2: TAD –1 TCY ADC TRANSFER FUNCTION (10-BIT EXAMPLE) Output Code 11 1111 1111 (= 1023) 11 1111 1110 (= 1022) 10 0000 0011 (= 515) 10 0000 0010 (= 514) 10 0000 0001 (= 513) 10 0000 0000 (= 512) 01 1111 1111 (= 511) 01 1111 1110 (= 510) 01 1111 1101 (= 509) 00 0000 0001 (= 1) 00 0000 0000 (= 0) VREFL VREFL + VREFH – VREFL VREFL + 1024 512 * (VREFH – VREFL) 1024 VREFL + 1023 * (VREFH – VREFL) VREFH 1024 (VINH – VINL) FIGURE 17-3: ADC CONVERSION CLOCK PERIOD BLOCK DIAGRAM AD1CON3<15> ADC Internal RC Clock 0 TAD AD1CON3<5:0> 1 6 TOSC(1) X2 TCY ADC Conversion Clock Multiplier 1, 2, 3, 4, 5,..., 64 Note: Refer to Figure 7-2 for the derivation of FOSC when the PLL is enabled. If the PLL is not used, FOSC is equal to the clock frequency. TOSC = 1/FOSC. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 163 dsPIC33FJ12GP201/202 REGISTER 17-1: AD1CON1: ADC1 CONTROL REGISTER 1 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 ADON — ADSIDL — — AD12B R/W-0 R/W-0 FORM<1:0> bit 15 bit 8 R/W-0 R/W-0 R/W-0 SSRC<2:0> U-0 R/W-0 R/W-0 R/W-0 HC,HS R/C-0 HC, HS — SIMSAM ASAM SAMP DONE bit 7 bit 0 Legend: HC = Cleared by hardware HS = Set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15 ADON: ADC Operating Mode bit 1 = ADC module is operating 0 = ADC is off bit 14 Unimplemented: Read as ‘0’ bit 13 ADSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-11 Unimplemented: Read as ‘0’ bit 10 AD12B: 10-bit or 12-bit Operation Mode bit 1 = 12-bit, 1-channel ADC operation 0 = 10-bit, 4-channel ADC operation bit 9-8 FORM<1:0>: Data Output Format bits For 10-bit operation: 11 = Signed fractional (DOUT = sddd dddd dd00 0000, where s = .NOT.d<9>) 10 = Fractional (DOUT = dddd dddd dd00 0000) 01 = Signed integer (DOUT = ssss sssd dddd dddd, where s = .NOT.d<9>) 00 = Integer (DOUT = 0000 00dd dddd dddd) For 12-bit operation: 11 = Signed fractional (DOUT = sddd dddd dddd 0000, where s = .NOT.d<11>) 10 = Fractional (DOUT = dddd dddd dddd 0000) 01 = Signed Integer (DOUT = ssss sddd dddd dddd, where s = .NOT.d<11>) 00 = Integer (DOUT = 0000 dddd dddd dddd) bit 7-5 SSRC<2:0>: Sample Clock Source Select bits 111 = Internal counter ends sampling and starts conversion (auto-convert) 110 = Reserved 101 = Motor Control PWM2 interval ends sampling and starts conversion 100 = Reserved 011 = Motor Control PWM1 interval ends sampling and starts conversion 010 = GP timer 3 compare ends sampling and starts conversion 001 = Active transition on INT0 pin ends sampling and starts conversion 000 = Clearing sample bit ends sampling and starts conversion bit 4 Unimplemented: Read as ‘0’ bit 3 SIMSAM: Simultaneous Sample Select bit (applicable only when CHPS<1:0> = 01 or 1x) When AD12B = 1, SIMSAM is: U-0, Unimplemented, Read as ‘0’ 1 = Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS<1:0> = 1x); or Samples CH0 and CH1 simultaneously (when CHPS<1:0> = 01) 0 = Samples multiple channels individually in sequence DS70264B-page 164 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 17-1: AD1CON1: ADC1 CONTROL REGISTER 1 (CONTINUED) bit 2 ASAM: ADC Sample Auto-Start bit 1 = Sampling begins immediately after last conversion. SAMP bit is auto-set 0 = Sampling begins when SAMP bit is set bit 1 SAMP: ADC Sample Enable bit 1 = ADC sample-and-hold amplifiers are sampling 0 = ADC sample-and-hold amplifiers are holding If ASAM = 0, software can write ‘1’ to begin sampling. Automatically set by hardware if ASAM = 1. If SSRC = 000, software can write ‘0’ to end sampling and start conversion. If SSRC ≠ 000, automatically cleared by hardware to end sampling and start conversion. bit 0 DONE: ADC Conversion Status bit 1 = ADC conversion cycle is completed 0 = ADC conversion not started or in progress Automatically set by hardware when ADC conversion is complete. Software can write ‘0’ to clear DONE status (software not allowed to write ‘1’). Clearing this bit will NOT affect any operation in progress. Automatically cleared by hardware at start of a new conversion. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 165 dsPIC33FJ12GP201/202 REGISTER 17-2: R/W-0 AD1CON2: ADC1 CONTROL REGISTER 2 R/W-0 R/W-0 VCFG<2:0> U-0 U-0 R/W-0 — — CSCNA R/W-0 R/W-0 CHPS<1:0> bit 15 bit 8 R-0 U-0 BUFS — R/W-0 R/W-0 R/W-0 R/W-0 SMPI<3:0> R/W-0 R/W-0 BUFM ALTS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-13 x = Bit is unknown VCFG<2:0>: Converter Voltage Reference Configuration bits 000 001 010 011 1xx ADREF+ ADREF- AVDD External VREF+ AVDD External VREF+ AVDD AVSS AVSS External VREFExternal VREFAvss bit 12-11 Unimplemented: Read as ‘0’ bit 10 CSCNA: Scan Input Selections for CH0+ during Sample A bit 1 = Scan inputs 0 = Do not scan inputs bit 9-8 CHPS<1:0>: Select Channels Utilized bits When AD12B = 1, CHPS<1:0> is: U-0, Unimplemented, Read as ‘0’ 1x = Converts CH0, CH1, CH2 and CH3 01 = Converts CH0 and CH1 00 = Converts CH0 bit 7 BUFS: Buffer Fill Status bit (valid only when BUFM = 1) 1 = ADC is currently filling second half of buffer, user application should access data in the first half 0 = ADC is currently filling first half of buffer, user application should access data in the second half bit 6 Unimplemented: Read as ‘0’ bit 5-2 SMPI<3:0>: Sample/Convert Sequences Per Interrupt Selection bits 1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence 1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence • • • 0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence 0000 = Interrupts at the completion of conversion for each sample/convert sequence bit 1 BUFM: Buffer Fill Mode Select bit 1 = Starts filling first half of buffer on first interrupt and the second half of buffer on next interrupt 0 = Always starts filling buffer from the beginning bit 0 ALTS: Alternate Input Sample Mode Select bit 1 = Uses channel input selects for Sample A on first sample and Sample B on next sample 0 = Always uses channel input selects for Sample A DS70264B-page 166 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 17-3: AD1CON3: ADC1 CONTROL REGISTER 3 R/W-0 U-0 U-0 ADRC — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SAMC<4:0> bit 15 bit 8 U-0 U-0 — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADCS<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 ADRC: ADC Conversion Clock Source bit 1 = ADC internal RC clock 0 = Clock derived from system clock bit 14-13 Unimplemented: Read as ‘0’ bit 12-8 SAMC<4:0>: Auto Sample Time bits 11111 = 31 TAD • • • 00001 = 1 TAD 00000 = 0 TAD bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 ADCS<5:0>: ADC Conversion Clock Select bits 111111 = TCY · (ADCS<7:0> + 1) = 64 · TCY = TAD • • • 000010 = TCY · (ADCS<7:0> + 1) = 3 · TCY = TAD 000001 = TCY · (ADCS<7:0> + 1) = 2 · TCY = TAD 000000 = TCY · (ADCS<7:0> + 1) = 1 · TCY = TAD © 2007 Microchip Technology Inc. Preliminary x = Bit is unknown DS70264B-page 167 dsPIC33FJ12GP201/202 REGISTER 17-4: AD1CHS123: ADC1 INPUT CHANNEL 1, 2, 3 SELECT REGISTER U-0 U-0 U-0 U-0 U-0 — — — — — R/W-0 R/W-0 CH123NB<1:0> R/W-0 CH123SB bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 — — — — — R/W-0 R/W-0 CH123NA<1:0> R/W-0 CH123SA bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-11 Unimplemented: Read as ‘0’ bit 10-9 CH123NB<1:0>: Channel 1, 2, 3 Negative Input Select for Sample B bits dsPIC33FJ12GP201 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved If AD12B = 0: 11 = Reserved 10 = Reserved 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREFdsPIC33FJ12GP202 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved If AD12B = 0: 11 = CH1 negative input is AN9, CH2 and CH3 negative inputs are not connected 10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREF- bit 8 CH123SB: Channel 1, 2, 3 Positive Input Select for Sample B bit If AD12B = 1: 1 = Reserved 0 = Reserved If AD12B = 0: 1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5 0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2 bit 7-3 Unimplemented: Read as ‘0’ DS70264B-page 168 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 17-4: bit 2-1 AD1CHS123: ADC1 INPUT CHANNEL 1, 2, 3 SELECT REGISTER (CONTINUED) CH123NA<1:0>: Channel 1, 2, 3 Negative Input Select for Sample A bits dsPIC33FJ12GP201 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved If AD12B = 0: 11 = Reserved 10 = Reserved 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREFdsPIC33FJ12GP202 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved If AD12B = 0: 11 = CH1 negative input is AN9, CH2 and CH3 negative inputs are not connected 10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREF- bit 0 CH123SA: Channel 1, 2, 3 Positive Input Select for Sample A bit If AD12B = 1: 1 = Reserved 0 = Reserved If AD12B = 0: 1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5 0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2 © 2007 Microchip Technology Inc. Preliminary DS70264B-page 169 dsPIC33FJ12GP201/202 REGISTER 17-5: AD1CHS0: ADC1 INPUT CHANNEL 0 SELECT REGISTER R/W-0 U-0 U-0 CH0NB — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CH0SB<4:0> bit 15 bit 8 R/W-0 U-0 U-0 CH0NA — — R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CH0SA<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15 CH0NB: Channel 0 Negative Input Select for Sample B bit 1 = Channel 0 negative input is AN1 0 = Channel 0 negative input is VREF- bit 14-13 Unimplemented: Read as ‘0’ bit 12-8 CH0SB<4:0>: Channel 0 Positive Input Select for Sample B bits 11111 = Channel 0 positive input is AN31 11110 = Channel 0 positive input is AN30 • • • 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 bit 7 CH0NA: Channel 0 Negative Input Select for Sample A bit 1 = Channel 0 negative input is AN1 0 = Channel 0 negative input is VREF- bit 6-5 Unimplemented: Read as ‘0’ bit 4-0 CH0SA<4:0>: Channel 0 Positive Input Select for Sample A bits dsPIC33FJ12GP201 devices only: 00101 = Channel 0 positive input is AN5 • • • 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 x = Bit is unknown dsPIC33FJ12GP202 devices only: 01001 = Channel 0 positive input is AN9 • • • 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 DS70264B-page 170 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 REGISTER 17-6: AD1CSSL: ADC1 INPUT SCAN SELECT REGISTER LOW(1,2) U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — CSS9 CSS8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSS7 CSS6 CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-10 Unimplemented: Read as ‘0’ bit 9-0 CSS<9:0>: ADC Input Scan Selection bits 1 = Select ANx for input scan 0 = Skip ANx for input scan Note 1: 2: x = Bit is unknown On devices without nine analog inputs, all AD1CSSL bits can be selected. However, inputs selected for scan without a corresponding input on device will convert ADREF-. dsPIC33FJ12GP201 devices support only six channels (CSS0-CSS5). REGISTER 17-7: AD1PCFGL: ADC1 PORT CONFIGURATION REGISTER LOW(1,2) U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — PCFG9 PCFG8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 15-10 Unimplemented: Read as ‘0’ bit 9-0 CSS<9:0>: ADC Input Scan Selection bits 1 = Select ANx for input scan 0 = Skip ANx for input scan Note 1: 2: x = Bit is unknown On devices without nine analog inputs, all PCFG bits are R/W. However, PCFG bits are ignored on ports without a corresponding input on device. dsPIC33FJ12GP201 devices support only six channels (CSS0-CSS5). © 2007 Microchip Technology Inc. Preliminary DS70264B-page 171 dsPIC33FJ12GP201/202 NOTES: DS70264B-page 172 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 18.0 SPECIAL FEATURES Note: 18.1 The Configuration bits can be programmed (read as ‘0’), or left unprogrammed (read as ‘1’), to select various device configurations. These bits are mapped starting at program memory location 0xF80000. This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The Device Configuration register map is shown in Table 18-1. The individual Configuration bit descriptions for the FBS, FGS, FOSCSEL, FOSC, FWDT, FPOR and FICD Configuration registers are shown in Table 18-2. dsPIC33FJ12GP201/202 devices include several features intended to maximize application flexibility and reliability, and minimize cost through elimination of external components. These are: • • • • • Flexible configuration Watchdog Timer (WDT) Code Protection and CodeGuard™ Security JTAG Boundary Scan Interface In-Circuit Serial Programming™ (ICSP™) programming capability • In-Circuit emulation TABLE 18-1: Address 0xF80000 Configuration Bits Note that address 0xF80000 is beyond the user program memory space. It belongs to the configuration memory space (0x800000-0xFFFFFF), which can only be accessed using table reads and table writes. The upper byte of all device Configuration registers should always be ‘1111 1111’. This makes them appear to be NOP instructions in the remote event that their locations are ever executed by accident. Since Configuration bits are not implemented in the corresponding locations, writing ‘1’s to these locations has no effect on device operation. To prevent inadvertent configuration changes during code execution, all programmable Configuration bits are write-once. After a bit is initially programmed during a power cycle, it cannot be written to again. Changing a device configuration requires that power to the device be cycled. DEVICE CONFIGURATION REGISTER MAP Name Bit 7 Bit 6 Bit 5 Bit 4 — — — — FBS 0xF80002 Reserved 0xF80004 FGS 0xF80006 FOSCSEL 0xF80008 FOSC 0xF8000A FWDT Bit 3 — — IESO — — FCKSM<1:0> — — — FWDTEN WINDIS — WDTPRE — — — ALTI2C 0xF8000C FPOR — GSS<1:0> GWRP OSCIOFNC POSCMD<1:0> WDTPOST<3:0> — FPWRT<2:0> Reserved(1) Reserved 0xF80010 FUID0 User Unit ID Byte 0 0xF80012 FUID1 User Unit ID Byte 1 0xF80014 FUID2 User Unit ID Byte 2 FUID3 User Unit ID Byte 3 Note 1: BWRP FNOSC<2:0> 0xF8000E 0xF80016 Bit 0 (1) — IOL1WAY Bit 1 BSS<2:0> Reserved — Bit 2 These reserved bits read as ‘1’ and must be programmed as ‘1’. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 173 dsPIC33FJ12GP201/202 TABLE 18-2: dsPIC33FJ12GP201/202 CONFIGURATION BITS DESCRIPTION Bit Field Register Description BWRP FBS Boot Segment Program Flash Write Protection 1 = Boot segment may be written 0 = Boot segment is write-protected BSS<2:0> FBS Boot Segment Program Flash Code Protection Size X11 = No Boot program Flash segment Boot space is 256 Instruction Words (except interrupt vectors) 110 = Standard security; boot program Flash segment ends at 0x0003FE 010 = High security; boot program Flash segment ends at 0x0003FE Boot space is 768 Instruction Words (except interrupt vectors) 101 = Standard security; boot program Flash segment, ends at 0x0007FE 001 = High security; boot program Flash segment ends at 0x0007FE Boot space is 1792 Instruction Words (except interrupt vectors) 100 = Standard security; boot program Flash segment ends at 0x000FFE 000 = High security; boot program Flash segment ends at 0x000FFE GSS<1:0> FGS General Segment Code-Protect bit 11 = User program memory is not code-protected 10 = Standard security 0x = High security GWRP FGS General Segment Write-Protect bit 1 = User program memory is not write-protected 0 = User program memory is write-protected IESO FOSCSEL Two-speed Oscillator Start-up Enable bit 1 = Start-up device with FRC, then automatically switch to the user-selected oscillator source when ready 0 = Start-up device with user-selected oscillator source FNOSC<2:0> FOSCSEL Initial Oscillator Source Selection bits 111 = Internal Fast RC (FRC) oscillator with postscaler 110 = Internal Fast RC (FRC) oscillator with divide-by-16 101 = LPRC oscillator 100 = Secondary (LP) oscillator 011 = Primary (XT, HS, EC) oscillator with PLL 010 = Primary (XT, HS, EC) oscillator 001 = Internal Fast RC (FRC) oscillator with PLL 000 = FRC oscillator FCKSM<1:0> FOSC Clock Switching Mode bits 1x = Clock switching is disabled, fail-safe clock monitor is disabled 01 = Clock switching is enabled, fail-safe clock monitor is disabled 00 = Clock switching is enabled, fail-safe clock monitor is enabled IOL1WAY FOSC Peripheral Pin Select Configuration 1 = Allow only one reconfiguration 0 = Allow multiple reconfigurations OSCIOFNC FOSC OSC2 Pin Function bit (except in XT and HS modes) 1 = OSC2 is clock output 0 = OSC2 is general purpose digital I/O pin POSCMD<1:0> FOSC Primary Oscillator Mode Select bits 11 = Primary oscillator disabled 10 = HS Crystal Oscillator mode 01 = XT Crystal Oscillator mode 00 = EC (External Clock) mode DS70264B-page 174 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 18-2: dsPIC33FJ12GP201/202 CONFIGURATION BITS DESCRIPTION (CONTINUED) Bit Field Register Description FWDTEN FWDT Watchdog Timer Enable bit 1 = Watchdog Timer always enabled (LPRC oscillator cannot be disabled. Clearing the SWDTEN bit in the RCON register will have no effect.) 0 = Watchdog Timer enabled/disabled by user software (LPRC can be disabled by clearing the SWDTEN bit in the RCON register) WINDIS FWDT Watchdog Timer Window Enable bit 1 = Watchdog Timer in Non-Window mode 0 = Watchdog Timer in Window mode WDTPRE FWDT Watchdog Timer Prescaler bit 1 = 1:128 0 = 1:32 WDTPOST<3:0> FWDT Watchdog Timer Postscaler bits 1111 = 1:32,768 1110 = 1:16,384 . . . 0001 = 1:2 0000 = 1:1 ALTI2C FPOR Alternate I2C™ pins 1 = I2C mapped to SDA1/SCL1 pins 0 = I2C mapped to ASDA1/ASCL1 pins FPWRT<2:0> FPOR Power-on Reset Timer Value Select bits 111 = PWRT = 128 ms 110 = PWRT = 64 ms 101 = PWRT = 32 ms 100 = PWRT = 16 ms 011 = PWRT = 8 ms 010 = PWRT = 4 ms 001 = PWRT = 2 ms 000 = PWRT = Disabled © 2007 Microchip Technology Inc. Preliminary DS70264B-page 175 dsPIC33FJ12GP201/202 18.2 On-Chip Voltage Regulator 18.3 All of the dsPIC33FJ12GP201/202 devices power their core digital logic at a nominal 2.5V. This can create a conflict for designs that are required to operate at a higher typical voltage, such as 3.3V. To simplify system design, all devices in the dsPIC33FJ12GP201/202 family incorporate an on-chip regulator that allows the device to run its core logic from VDD. The regulator provides power to the core from the other VDD pins. When the regulator is enabled, a low ESR (less than 5 ohms) capacitor (such as tantalum or ceramic) must be connected to the VDDCORE/VCAP pin (Figure 18-1). This helps to maintain the stability of the regulator. The recommended value for the filter capacitor is provided in Table 21-13 located in Section 21.1 “DC Characteristics”. On a POR, it takes approximately 20 μs for the on-chip voltage regulator to generate an output voltage. During this time, designated as TSTARTUP, code execution is disabled. TSTARTUP is applied every time the device resumes operation after any power-down. FIGURE 18-1: CONNECTIONS FOR THE ON-CHIP VOLTAGE REGULATOR(1) 3.3V dsPIC33F BOR: Brown-Out Reset The Brown-out Reset (BOR) module is based on an internal voltage reference circuit that monitors the regulated voltage VDDCORE. The main purpose of the BOR module is to generate a device Reset when a brown-out condition occurs. Brown-out conditions are generally caused by glitches on the AC mains (for example, missing portions of the AC cycle waveform due to bad power transmission lines, or voltage sags due to excessive current draw when a large inductive load is turned on). A BOR generates a Reset pulse, which resets the device. The BOR selects the clock source, based on the device Configuration bit values (FNOSC<2:0> and POSCMD<1:0>). If an oscillator mode is selected, the BOR activates the Oscillator Start-up Timer (OST). The system clock is held until OST expires. If the PLL is used, the clock is held until the LOCK bit (OSCCON<5>) is ‘1’. Concurrently, the PWRT time-out (TPWRT) will be applied before the internal Reset is released. If TPWRT = 0 and a crystal oscillator is being used, a nominal delay of TFSCM = 100 is applied. The total delay in this case is TFSCM. The BOR Status bit (RCON<1>) is set to indicate that a BOR has occurred. The BOR circuit, if enabled, continues to operate while in Sleep or Idle modes and resets the device should VDD fall below the BOR threshold voltage. VDD VDDCORE/VCAP CF Note 1: VSS These are typical operating voltages. Refer to Table 21-13 located in Section 21.1 “DC Characteristics” for the full operating ranges of VDD and VDDCORE. DS70264B-page 176 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 18.4 Watchdog Timer (WDT) 18.4.2 For dsPIC33FJ12GP201/202 devices, the WDT is driven by the LPRC oscillator. When the WDT is enabled, the clock source is also enabled. 18.4.1 PRESCALER/POSTSCALER The nominal WDT clock source from LPRC is 32 kHz. This feeds a prescaler than can be configured for either 5-bit (divide-by-32) or 7-bit (divide-by-128) operation. The prescaler is set by the WDTPRE Configuration bit. With a 32 kHz input, the prescaler yields a nominal WDT time-out period (TWDT) of 1 ms in 5-bit mode, or 4 ms in 7-bit mode. A variable postscaler divides down the WDT prescaler output and allows for a wide range of time-out periods. The postscaler is controlled by the WDTPOST<3:0> Configuration bits (FWDT<3:0>), which allow the selection of 16 settings, from 1:1 to 1:32,768. Using the prescaler and postscaler, time-out periods ranging from 1 ms to 131 seconds can be achieved. The WDT, prescaler and postscaler are reset: • On any device Reset • On the completion of a clock switch, whether invoked by software (i.e., setting the OSWEN bit after changing the NOSC bits) or by hardware (i.e., fail-safe clock monitor) • When a PWRSAV instruction is executed (i.e., Sleep or Idle mode is entered) • When the device exits Sleep or Idle mode to resume normal operation • By a CLRWDT instruction during normal execution Note: If the WDT is enabled, it will continue to run during Sleep or Idle modes. When the WDT time-out occurs, the device will wake the device and code execution will continue from where the PWRSAV instruction was executed. The corresponding SLEEP or IDLE bits (RCON<3,2>) will need to be cleared in software after the device wakes up. 18.4.3 ENABLING WDT The WDT is enabled or disabled by the FWDTEN Configuration bit in the FWDT Configuration register. When the FWDTEN Configuration bit is set, the WDT is always enabled. The WDT flag bit, WDTO (RCON<4>), is not automatically cleared following a WDT time-out. To detect subsequent WDT events, the flag must be cleared in software. The WDT can be optionally controlled in software when the FWDTEN Configuration bit has been programmed to ‘0’. The WDT is enabled in software by setting the SWDTEN control bit (RCON<5>). The SWDTEN control bit is cleared on any device Reset. The software WDT option allows the user application to enable the WDT for critical code segments and disable the WDT during non-critical segments for maximum power savings. Note: The CLRWDT and PWRSAV instructions clear the prescaler and postscaler counts when executed. FIGURE 18-2: SLEEP AND IDLE MODES If the WINDIS bit (FWDT<6>) is cleared, the CLRWDT instruction should be executed by the application software only during the last 1/4 of the WDT period. This CLRWDT window can be determined by using a timer. If a CLRWDT instruction is executed before this window, a WDT Reset occurs. WDT BLOCK DIAGRAM All Device Resets Transition to New Clock Source Exit Sleep or Idle Mode PWRSAV Instruction CLRWDT Instruction Watchdog Timer Sleep/Idle WDTPRE SWDTEN FWDTEN WDTPOST<3:0> RS Prescaler (divide by N1) LPRC Clock WDT Wake-up 1 RS Postscaler (divide by N2) 0 WINDIS WDT Reset WDT Window Select CLRWDT Instruction © 2007 Microchip Technology Inc. Preliminary DS70264B-page 177 dsPIC33FJ12GP201/202 18.5 JTAG Interface 18.8 The dsPIC33FJ12GP201/202 devices implement a JTAG interface, which supports boundary scan device testing, as well as in-circuit programming. Detailed information on this interface will be provided in future revisions of the document. 18.6 In-Circuit Serial Programming The dsPIC33FJ12GP201/202 devices can be serially programmed while in the end application circuit. This is done with two lines for clock and data and three other lines for power, ground and the programming sequence. Serial programming allows customers to manufacture boards with unprogrammed devices and then program the digital signal controller just before shipping the product. Serial programming also allows the most recent firmware or a custom firmware to be programmed. Refer to the “dsPIC33F Flash Programming Specification” (DS70152) document for details about In-Circuit Serial Programming (ICSP). Any of the three pairs of programming clock/data pins can be used: • PGC1/EMUC1 and PGD1/EMUD1 • PGC2/EMUC2 and PGD2/EMUD2 • PGC3/EMUC3 and PGD3/EMUD3 18.7 Code Protection and CodeGuard™ Security The dsPIC33FJ12GP201/202 devices offer the intermediate implementation of CodeGuard Security. CodeGuard Security enables multiple parties to securely share resources (memory, interrupts and peripherals) on a single chip. This feature helps protect individual Intellectual Property in collaborative system designs. When coupled with software encryption libraries, CodeGuard Security can be used to securely update Flash even when multiple IPs reside on the single chip. The code protection features are controlled by the Configuration registers: FBS and FGS. The Secure Segment and RAM is not implemented. TABLE 18-3: CODE FLASH SECURITY SEGMENT SIZES FOR 12K BYTE DEVICES CONFIG BITS VS = 256 IW BSS<2:0> = x11 0K GS = 3840 IW In-Circuit Debugger 000000h 0001FEh 000200h 0003FEh 000400h 0007FEh 000800h 000FFEh 001000h 001FFEh ® When MPLAB ICD 2 is selected as a debugger, the in-circuit debugging functionality is enabled. This function allows simple debugging functions when used with MPLAB IDE. Debugging functionality is controlled through the EMUCx (Emulation/Debug Clock) and EMUDx (Emulation/Debug Data) pin functions. VS = 256 IW BSS<2:0> = x10 256 GS = 3584 IW Any of the three pairs of debugging clock/data pins can be used: • PGC1/EMUC1 and PGD1/EMUD1 • PGC2/EMUC2 and PGD2/EMUD2 • PGC3/EMUC3 and PGD3/EMUD3 001FFEh VS = 256 IW BSS<2:0> = x01 To use the in-circuit debugger function of the device, the design must implement ICSP connections to MCLR, VDD, VSS, PGC, PGD and the EMUDx/EMUCx pin pair. In addition, when the feature is enabled, some of the resources are not available for general use. These resources include the first 80 bytes of data RAM and two I/O pins. BS = 256 IW 000000h 0001FEh 000200h 0003FEh 000400h 0007FEh 000800h 000FFEh 001000h BS = 768 IW 768 GS = 3072 IW 000000h 0001FEh 000200h 0003FEh 000400h 0007FEh 000800h 000FFEh 001000h 001FFEh VS = 256 IW BSS<2:0> = x00 BS = 1792 IW 1792 GS = 2048 IW 000000h 0001FEh 000200h 0003FEh 000400h 0007FEh 000800h 000FFEh 001000h 001FFEh Note: DS70264B-page 178 Preliminary Refer to Section 23. “CodeGuard™ Security” (DS70199) of the dsPIC33F Family Reference Manual for further information on usage, configuration and operation of CodeGuard Security. © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 19.0 Note: INSTRUCTION SET SUMMARY This data sheet summarizes the features of the dsPIC33FJ12GP201/202 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. The dsPIC33F instruction set is identical to that of the dsPIC30F. Most instructions are a single program memory word (24 bits). Only three instructions require two program memory locations. Each single-word instruction is a 24-bit word, divided into an 8-bit opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into five basic categories: • • • • • Word or byte-oriented operations Bit-oriented operations Literal operations DSP operations Control operations • The W register (with or without an address modifier) or file register (specified by the value of ‘Ws’ or ‘f’) • The bit in the W register or file register (specified by a literal value or indirectly by the contents of register ‘Wb’) The literal instructions that involve data movement can use some of the following operands: • A literal value to be loaded into a W register or file register (specified by ‘k’) • The W register or file register where the literal value is to be loaded (specified by ‘Wb’ or ‘f’) However, literal instructions that involve arithmetic or logical operations use some of the following operands: • The first source operand, which is a register ‘Wb’ without any address modifier • The second source operand, which is a literal value • The destination of the result (only if not the same as the first source operand), which is typically a register ‘Wd’ with or without an address modifier The MAC class of DSP instructions can use some of the following operands: Table 19-1 shows the general symbols used in describing the instructions. The dsPIC33F instruction set summary in Table 19-2 lists all the instructions, along with the status flags affected by each instruction. Most word or byte-oriented W register instructions (including barrel shift instructions) have three operands: • The first source operand, which is typically a register ‘Wb’ without any address modifier • The second source operand, which is typically a register ‘Ws’ with or without an address modifier • The destination of the result, which is typically a register ‘Wd’ with or without an address modifier • The accumulator (A or B) to be used (required operand) • The W registers to be used as the two operands • The X and Y address space prefetch operations • The X and Y address space prefetch destinations • The accumulator write back destination The other DSP instructions do not involve any multiplication and can include: • The accumulator to be used (required) • The source or destination operand (designated as Wso or Wdo, respectively) with or without an address modifier • The amount of shift specified by a W register ‘Wn’ or a literal value The control instructions can use some of the following operands: However, word or byte-oriented file register instructions have two operands: • The file register specified by the value ‘f’ • The destination, which could be either the file register ‘f’ or the W0 register, which is denoted as ‘WREG’ © 2007 Microchip Technology Inc. Most bit-oriented instructions (including simple rotate/ shift instructions) have two operands: • A program memory address • The mode of the table read and table write instructions Preliminary DS70264B-page 179 dsPIC33FJ12GP201/202 Most instructions are a single word. Certain doubleword instructions, which were designed to provide all of the required information in these 48 bits. In the second word, the 8 MSbs are ‘0’s. If this second word is executed as an instruction (by itself), it will execute as a NOP. The double-word instructions execute in two instruction cycles. Most single-word instructions are executed in a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles with the additional instruction cycle(s) executed as a NOP. Notable exceptions are the BRA TABLE 19-1: (unconditional/computed branch), indirect CALL/GOTO, all table reads and writes and RETURN/RETFIE instructions, which are single-word instructions but take two or three cycles. Certain instructions that involve skipping over the subsequent instruction require either two or three cycles if the skip is performed, depending on whether the instruction being skipped is a single-word or two-word instruction. Moreover, double-word moves require two cycles. Note: For more details on the instruction set, refer to the “dsPIC30F/33F Programmer’s Reference Manual” (DS70157). SYMBOLS USED IN OPCODE DESCRIPTIONS Field #text Description Means literal defined by “text” (text) Means “content of text” [text] Means “the location addressed by text” { } Optional field or operation <n:m> Register bit field .b Byte mode selection .d Double-Word mode selection .S Shadow register select .w Word mode selection (default) Acc One of two accumulators {A, B} AWB Accumulator write back destination address register ∈ {W13, [W13] + = 2} bit4 4-bit bit selection field (used in word addressed instructions) ∈ {0...15} C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero Expr Absolute address, label or expression (resolved by the linker) f File register address ∈ {0x0000...0x1FFF} lit1 1-bit unsigned literal ∈ {0,1} lit4 4-bit unsigned literal ∈ {0...15} lit5 5-bit unsigned literal ∈ {0...31} lit8 8-bit unsigned literal ∈ {0...255} lit10 10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode lit14 14-bit unsigned literal ∈ {0...16384} lit16 16-bit unsigned literal ∈ {0...65535} lit23 23-bit unsigned literal ∈ {0...8388608}; LSb must be ‘0’ None Field does not require an entry, may be blank OA, OB, SA, SB DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate PC Program Counter Slit10 10-bit signed literal ∈ {-512...511} Slit16 16-bit signed literal ∈ {-32768...32767} Slit6 6-bit signed literal ∈ {-16...16} Wb Base W register ∈ {W0..W15} Wd Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] } Wdo Destination W register ∈ { Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] } Wm,Wn Dividend, Divisor working register pair (direct addressing) DS70264B-page 180 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 19-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED) Field Description Wm*Wm Multiplicand and Multiplier working register pair for Square instructions ∈ {W4 * W4,W5 * W5,W6 * W6,W7 * W7} Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions ∈ {W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7} Wn One of 16 working registers ∈ {W0..W15} Wnd One of 16 destination working registers ∈ {W0..W15} Wns One of 16 source working registers ∈ {W0..W15} WREG W0 (working register used in file register instructions) Ws Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] } Wso Source W register ∈ { Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] } Wx X data space prefetch address register for DSP instructions ∈ {[W8] + = 6, [W8] + = 4, [W8] + = 2, [W8], [W8] - = 6, [W8] - = 4, [W8] - = 2, [W9] + = 6, [W9] + = 4, [W9] + = 2, [W9], [W9] - = 6, [W9] - = 4, [W9] - = 2, [W9 + W12], none} Wxd X data space prefetch destination register for DSP instructions ∈ {W4..W7} Wy Y data space prefetch address register for DSP instructions ∈ {[W10] + = 6, [W10] + = 4, [W10] + = 2, [W10], [W10] - = 6, [W10] - = 4, [W10] - = 2, [W11] + = 6, [W11] + = 4, [W11] + = 2, [W11], [W11] - = 6, [W11] - = 4, [W11] - = 2, [W11 + W12], none} Wyd Y data space prefetch destination register for DSP instructions ∈ {W4..W7} © 2007 Microchip Technology Inc. Preliminary DS70264B-page 181 dsPIC33FJ12GP201/202 TABLE 19-2: Base Instr # 1 2 3 4 5 6 7 8 9 INSTRUCTION SET OVERVIEW Assembly Mnemonic ADD ADDC AND ASR BCLR BRA BSET BSW BTG Assembly Syntax Description # of # of Words Cycles Status Flags Affected ADD Acc Add Accumulators 1 1 ADD f f = f + WREG 1 1 C,DC,N,OV,Z ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z AND f f = f .AND. WREG 1 1 N,Z AND f,WREG WREG = f .AND. WREG 1 1 N,Z AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z BCLR f,#bit4 Bit Clear f 1 1 None BCLR Ws,#bit4 Bit Clear Ws 1 1 None BRA C,Expr Branch if Carry 1 1 (2) None BRA GE,Expr Branch if greater than or equal 1 1 (2) None BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None BRA GT,Expr Branch if greater than 1 1 (2) None BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None BRA LE,Expr Branch if less than or equal 1 1 (2) None BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None BRA LT,Expr Branch if less than 1 1 (2) None BRA LTU,Expr Branch if unsigned less than 1 1 (2) None BRA N,Expr Branch if Negative 1 1 (2) None BRA NC,Expr Branch if Not Carry 1 1 (2) None BRA NN,Expr Branch if Not Negative 1 1 (2) None BRA NOV,Expr Branch if Not Overflow 1 1 (2) None BRA NZ,Expr Branch if Not Zero 1 1 (2) None BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None BRA OV,Expr Branch if Overflow 1 1 (2) None BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None BRA Expr Branch Unconditionally 1 2 None BRA Z,Expr Branch if Zero 1 1 (2) None BRA Wn Computed Branch 1 2 None BSET f,#bit4 Bit Set f 1 1 None BSET Ws,#bit4 Bit Set Ws 1 1 None BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None BTG f,#bit4 Bit Toggle f 1 1 None BTG Ws,#bit4 Bit Toggle Ws 1 1 None DS70264B-page 182 Preliminary OA,OB,SA,SB © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 19-2: Base Instr # 10 11 12 13 Assembly Mnemonic BTSC BTSS BTST BTSTS 14 CALL 15 CLR 16 CLRWDT 17 COM 18 19 20 INSTRUCTION SET OVERVIEW (CONTINUED) CP CP0 CPB Assembly Syntax Description # of # of Words Cycles Status Flags Affected BTSC f,#bit4 Bit Test f, Skip if Clear 1 1 (2 or 3) None BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1 (2 or 3) None BTSS f,#bit4 Bit Test f, Skip if Set 1 1 (2 or 3) None BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1 (2 or 3) None BTST f,#bit4 Bit Test f 1 1 Z BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z BTSTS f,#bit4 Bit Test then Set f 1 1 Z BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z CALL lit23 Call subroutine 2 2 None CALL Wn Call indirect subroutine 1 2 None CLR f f = 0x0000 1 1 None CLR WREG WREG = 0x0000 1 1 None CLR Ws Ws = 0x0000 1 1 None CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB Clear Watchdog Timer 1 1 WDTO,Sleep CLRWDT COM f f=f 1 1 N,Z COM f,WREG WREG = f 1 1 N,Z COM Ws,Wd Wd = Ws 1 1 N,Z CP f Compare f with WREG 1 1 C,DC,N,OV,Z CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C,DC,N,OV,Z CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,Ws Compare Wb with Ws, with Borrow (Wb – Ws – C) 1 1 C,DC,N,OV,Z 21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1 (2 or 3) None 22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1 (2 or 3) None 23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1 (2 or 3) None 24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if ≠ 1 1 (2 or 3) None 25 DAW DAW Wn Wn = decimal adjust Wn 1 1 C 26 DEC DEC f f=f–1 1 1 C,DC,N,OV,Z DEC f,WREG WREG = f – 1 1 1 C,DC,N,OV,Z DEC Ws,Wd Wd = Ws – 1 1 1 C,DC,N,OV,Z DEC2 f f=f–2 1 1 C,DC,N,OV,Z DEC2 f,WREG WREG = f – 2 1 1 C,DC,N,OV,Z DEC2 Ws,Wd Wd = Ws – 2 1 1 C,DC,N,OV,Z DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None 27 28 DEC2 DISI © 2007 Microchip Technology Inc. Preliminary DS70264B-page 183 dsPIC33FJ12GP201/202 TABLE 19-2: Base Instr # 29 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic DIV Assembly Syntax # of # of Words Cycles Description Status Flags Affected DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV Signed 16/16-bit Fractional Divide 1 18 N,Z,C,OV None 30 DIVF DIVF 31 DO DO #lit14,Expr Do code to PC + Expr, lit14 + 1 times 2 2 DO Wn,Expr Do code to PC + Expr, (Wn) + 1 times 2 2 None Wm,Wn 32 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB, SA,SB,SAB 33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB, SA,SB,SAB 34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None 35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C 36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C 37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C 38 GOTO GOTO Expr Go to address 2 2 None GOTO Wn Go to indirect 1 2 None INC f f=f+1 1 1 C,DC,N,OV,Z INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z INC2 f f=f+2 1 1 C,DC,N,OV,Z INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z IOR f f = f .IOR. WREG 1 1 N,Z IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z 39 40 41 INC INC2 IOR IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 43 LNK LNK #lit14 Link Frame Pointer 1 1 None 44 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd , AWB Multiply and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB MOV f,Wn Move f to Wn 1 1 None MOV f Move f to f 1 1 N,Z MOV f,WREG Move f to WREG 1 1 N,Z MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None MOV Wn,f Move Wn to f 1 1 None MOV Wso,Wdo Move Ws to Wd 1 1 None MOV WREG,f Move WREG to f 1 1 N,Z Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None Prefetch and store accumulator 1 1 None 42 45 46 MAC MOV MOV.D MOV.D 47 MOVSAC MOVSAC DS70264B-page 184 Acc,Wx,Wxd,Wy,Wyd,AWB Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 19-2: Base Instr # 48 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic MPY Assembly Syntax Description # of # of Words Cycles Status Flags Affected MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 49 MPY.N MPY.N Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator 1 1 None 50 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd , AWB Multiply and Subtract from Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 51 MUL MUL.SS Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * signed(Ws) 1 1 None MUL.SU Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None MUL.US Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None MUL.UU Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * unsigned(Ws) 1 1 None MUL.SU Wb,#lit5,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None MUL.UU Wb,#lit5,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * unsigned(lit5) 1 1 None MUL f W3:W2 = f * WREG 1 1 None NEG Acc Negate Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 52 53 54 NEG NOP POP NEG f f=f+1 1 1 C,DC,N,OV,Z NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z NOP No Operation 1 1 None NOPR No Operation 1 1 None None POP f Pop f from Top-of-Stack (TOS) 1 1 POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None POP.D Wnd Pop from Top-of-Stack (TOS) to W(nd):W(nd + 1) 1 2 None Pop Shadow Registers 1 1 All f Push f to Top-of-Stack (TOS) 1 1 None PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None PUSH.D Wns Push W(ns):W(ns + 1) to Top-of-Stack (TOS) 1 2 None Push Shadow Registers 1 1 None Go into Sleep or Idle mode 1 1 WDTO,Sleep POP.S 55 PUSH PUSH PUSH.S 56 PWRSAV PWRSAV 57 RCALL RCALL Expr Relative Call 1 2 None RCALL Wn Computed Call 1 2 None REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None REPEAT Wn Repeat Next Instruction (Wn) + 1 times 1 1 None None 58 REPEAT #lit1 59 RESET RESET Software device Reset 1 1 60 RETFIE RETFIE Return from interrupt 1 3 (2) None 61 RETLW RETLW Return with literal in Wn 1 3 (2) None 62 RETURN RETURN Return from Subroutine 1 3 (2) None 63 RLC RLC f f = Rotate Left through Carry f 1 1 C,N,Z RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z RLNC f f = Rotate Left (No Carry) f 1 1 N,Z RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z RRC f f = Rotate Right through Carry f 1 1 C,N,Z RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z 64 65 RLNC RRC #lit10,Wn © 2007 Microchip Technology Inc. Preliminary DS70264B-page 185 dsPIC33FJ12GP201/202 TABLE 19-2: Base Instr # 66 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic RRNC Assembly Syntax Description # of # of Words Cycles Status Flags Affected RRNC f f = Rotate Right (No Carry) f 1 1 N,Z RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None 67 SAC SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None 68 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z 69 SETM SETM f f = 0xFFFF 1 1 None SETM WREG WREG = 0xFFFF 1 1 None SETM Ws Ws = 0xFFFF 1 1 None SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB, SA,SB,SAB SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB, SA,SB,SAB SL f f = Left Shift f 1 1 C,N,OV,Z SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z SUB Acc Subtract Accumulators 1 1 OA,OB,OAB, SA,SB,SAB SUB f f = f – WREG 1 1 C,DC,N,OV,Z SUB f,WREG WREG = f – WREG 1 1 C,DC,N,OV,Z SUB #lit10,Wn Wn = Wn – lit10 1 1 C,DC,N,OV,Z SUB Wb,Ws,Wd Wd = Wb – Ws 1 1 C,DC,N,OV,Z SUB Wb,#lit5,Wd Wd = Wb – lit5 1 1 C,DC,N,OV,Z C,DC,N,OV,Z 70 71 72 73 74 75 76 SFTAC SL SUB SUBB SUBR SUBBR SWAP SUBB f f = f – WREG – (C) 1 1 SUBB f,WREG WREG = f – WREG – (C) 1 1 C,DC,N,OV,Z SUBB #lit10,Wn Wn = Wn – lit10 – (C) 1 1 C,DC,N,OV,Z SUBB Wb,Ws,Wd Wd = Wb – Ws – (C) 1 1 C,DC,N,OV,Z SUBB Wb,#lit5,Wd Wd = Wb – lit5 – (C) 1 1 SUBR f f = WREG – f 1 1 C,DC,N,OV,Z SUBR f,WREG WREG = WREG – f 1 1 C,DC,N,OV,Z SUBR Wb,Ws,Wd Wd = Ws – Wb 1 1 C,DC,N,OV,Z SUBR Wb,#lit5,Wd Wd = lit5 – Wb 1 1 C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z SUBBR f f = WREG – f – (C) 1 1 SUBBR f,WREG WREG = WREG – f – (C) 1 1 C,DC,N,OV,Z SUBBR Wb,Ws,Wd Wd = Ws – Wb – (C) 1 1 C,DC,N,OV,Z SUBBR Wb,#lit5,Wd Wd = lit5 – Wb – (C) 1 1 C,DC,N,OV,Z SWAP.b Wn Wn = nibble swap Wn 1 1 None SWAP Wn Wn = byte swap Wn 1 1 None None 77 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 78 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None 79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None 80 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None 81 ULNK ULNK Unlink Frame Pointer 1 1 None 82 XOR XOR f f = f .XOR. WREG 1 1 N,Z XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z ZE Ws,Wnd Wnd = Zero-extend Ws 1 1 C,Z,N 83 ZE DS70264B-page 186 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 20.0 DEVELOPMENT SUPPORT 20.1 The PIC® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C18 and MPLAB C30 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PICSTART® Plus Development Programmer - MPLAB PM3 Device Programmer - PICkit™ 2 Development Programmer • Low-Cost Demonstration and Development Boards and Evaluation Kits MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Visual device initializer for easy register initialization • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as HI-TECH Software C Compilers and IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (assembly or C) - Mixed assembly and C - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 187 dsPIC33FJ12GP201/202 20.2 MPASM Assembler 20.5 The MPASM Assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: 20.3 Support for the entire dsPIC30F instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility 20.6 MPLAB C18 and MPLAB C30 C Compilers The MPLAB C18 and MPLAB C30 Code Development Systems are complete ANSI C compilers for Microchip’s PIC18 and PIC24 families of microcontrollers and the dsPIC30 and dsPIC33 family of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 20.4 MPLAB ASM30 Assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. MPLAB ASM30 Assembler, Linker and Librarian MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C18 and MPLAB C30 C Compilers, and the MPASM and MPLAB ASM30 Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction DS70264B-page 188 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 20.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator 20.9 The MPLAB ICE 2000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 In-Circuit Emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The architecture of the MPLAB ICE 2000 In-Circuit Emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows® 32-bit operating system were chosen to best make these features available in a simple, unified application. 20.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC® and MCU devices. It debugs and programs PIC® and dsPIC® Flash microcontrollers with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The MPLAB REAL ICE probe is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with the popular MPLAB ICD 2 system (RJ11) or with the new high speed, noise tolerant, lowvoltage differential signal (LVDS) interconnection (CAT5). MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers costeffective, in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single stepping and watching variables, and CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 20.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an SD/MMC card for file storage and secure data applications. MPLAB REAL ICE is field upgradeable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added, such as software breakpoints and assembly code trace. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, real-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 189 dsPIC33FJ12GP201/202 20.11 PICSTART Plus Development Programmer 20.13 Demonstration, Development and Evaluation Boards The PICSTART Plus Development Programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus Development Programmer supports most PIC devices in DIP packages up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus Development Programmer is CE compliant. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. 20.12 PICkit 2 Development Programmer The PICkit™ 2 Development Programmer is a low-cost programmer and selected Flash device debugger with an easy-to-use interface for programming many of Microchip’s baseline, mid-range and PIC18F families of Flash memory microcontrollers. The PICkit 2 Starter Kit includes a prototyping development board, twelve sequential lessons, software and HI-TECH’s PICC™ Lite C compiler, and is designed to help get up to speed quickly using PIC® microcontrollers. The kit provides everything needed to program, evaluate and develop applications using Microchip’s powerful, mid-range Flash memory family of microcontrollers. DS70264B-page 190 The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart® battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Check the Microchip web page (www.microchip.com) and the latest “Product Selector Guide” (DS00148) for the complete list of demonstration, development and evaluation kits. Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 21.0 ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC33FJ12GP201/202 electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the dsPIC33FJ12GP201/202 family are listed below. Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings(1) Ambient temperature under bias.............................................................................................................-40°C to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V Voltage on any combined analog and digital pin and MCLR, with respect to VSS ......................... -0.3V to (VDD + 0.3V) Voltage on any digital-only pin with respect to VSS .................................................................................. -0.3V to +5.6V Voltage on VDDCORE with respect to VSS ................................................................................................ 2.25V to 2.75V Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin(2) ...........................................................................................................................250 mA Maximum output current sunk by any I/O pin(3) ........................................................................................................4 mA Maximum output current sourced by any I/O pin(3) ...................................................................................................4 mA Maximum current sunk by all ports .......................................................................................................................200 mA Maximum current sourced by all ports(2) ...............................................................................................................200 mA Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods can affect device reliability. 2: Maximum allowable current is a function of device maximum power dissipation (see Table 21-2). 3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGCx and PGDx pins, which are able to sink/source 12 mA. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 191 dsPIC33FJ12GP201/202 21.1 DC Characteristics TABLE 21-1: OPERATING MIPS VS. VOLTAGE VDD Range (in Volts) Characteristic TABLE 21-2: Max MIPS Temp Range (in °C) dsPIC33FJ12GP201/202 3.0-3.6V -40°C to +85°C 40 3.0-3.6V -40°C to +125°C 35 THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit Operating Junction Temperature Range TJ -40 — +125 °C Operating Ambient Temperature Range TA -40 — +85 °C Operating Junction Temperature Range TJ -40 — +140 °C Operating Ambient Temperature Range TA -40 — +125 °C Industrial Temperature Devices Extended Temperature Devices Power Dissipation: Internal chip power dissipation: PINT = VDD x (IDD – Σ IOH) PD PINT + PI/O W PDMAX (TJ – TA)/θJA W I/O Pin Power Dissipation: I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL) Maximum Allowed Power Dissipation TABLE 21-3: THERMAL PACKAGING CHARACTERISTICS Characteristic Package Thermal Resistance, 18-pin PDIP Package Thermal Resistance, 28-pin SPDIP Package Thermal Resistance, 18-pin SOIC Package Thermal Resistance, 28-pin SOIC Package Thermal Resistance, 28-pin QFN Note 1: Symbol Typ Max Unit Notes θJA θJA θJA θJA θJA 66 — °C/W 1 60 — °C/W 1 63.6 — °C/W 1 80.2 — °C/W 1 32 — °C/W 1 Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations. DS70264B-page 192 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 21-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. Characteristic Min Typ(1) Max Units 3.0 — 3.6 V Conditions Operating Voltage DC10 Supply Voltage VDD (2) DC12 VDR RAM Data Retention Voltage 1.1 1.3 1.8 V DC16 VPOR VDD Start Voltage to ensure internal Power-on Reset signal — — VSS V DC17 SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.03 — — DC18 VCORE VDD Core(3) Internal regulator voltage 2.25 — 2.75 Note 1: 2: 3: Industrial and Extended V/ms 0-3.0V in 0.1s V Voltage is dependent on load, temperature and VDD Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. This is the limit to which VDD can be lowered without losing RAM data. These parameters are characterized but not tested in manufacturing. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 193 dsPIC33FJ12GP201/202 TABLE 21-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Operating Current (IDD)(2) DC20d 24 30 mA -40°C DC20a 27 30 mA +25°C DC20b 27 30 mA +85°C DC20c 27 35 mA +125°C DC21d 30 40 mA -40°C DC21a 31 40 mA +25°C DC21b 32 45 mA +85°C DC21c 33 45 mA +125°C DC22d 35 50 mA -40°C DC22a 38 50 mA +25°C DC22b 38 55 mA +85°C DC22c 39 55 mA +125°C DC23d 47 70 mA -40°C DC23a 48 70 mA +25°C DC23b 48 70 mA +85°C DC23c 48 70 mA +125°C DC24d 56 90 mA -40°C DC24a 56 90 mA +25°C DC24b 54 90 mA +85°C DC24c 54 80 mA +125°C Note 1: 2: 3.3V 10 MIPS 3.3V 16 MIPS 3.3V 20 MIPS 3.3V 30 MIPS 3.3V 40 MIPS 3.3V 35 MIPS Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1 driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VSS. MCLR = VDD, WDT and FSCM are disabled. CPU, SRAM, program memory and data memory are operational. No peripheral modules are operating; however, every peripheral is being clocked (PMD bits are all zeroed). DS70264B-page 194 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 21-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Idle Current (IIDLE): Core OFF Clock ON Base Current(2) DC40d 3 25 mA -40°C DC40a 3 25 mA +25°C DC40b 3 25 mA +85°C DC40c 3 25 mA +125°C DC41d 4 25 mA -40°C DC41a 4 25 mA +25°C DC41b 5 25 mA +85°C DC41c 5 25 mA 125°C DC42d 6 25 mA -40°C DC42a 6 25 mA +25°C DC42b 7 25 mA +85°C DC42c 7 25 mA +125°C DC43d 9 25 mA -40°C DC43a 9 25 mA +25°C DC43b 9 25 mA +85°C DC43c 9 25 mA +125°C DC44d 10 25 mA -40°C DC44a 10 25 mA +25°C DC44b 10 25 mA +85°C DC44c 10 25 mA +125°C Note 1: 2: 3.3V 10 MIPS 3.3V 16 MIPS 3.3V 20 MIPS 3.3V 30 MIPS 3.3V 40 MIPS 3.3V 35 MIPS Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Base IIDLE current is measured with core off, clock on and all modules turned off. Peripheral Module Disable SFR registers are zeroed. All I/O pins are configured as inputs and pulled to VSS. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 195 dsPIC33FJ12GP201/202 TABLE 21-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units μA Conditions Power-Down Current (IPD)(2) DC60d 55 500 -40°C DC60a 63 500 μA +25°C DC60b 85 500 μA +85°C DC60c 146 1 mA +125°C DC61d 8 13 μA -40°C DC61a 10 15 μA +25°C DC61b 12 20 μA +85°C 13 25 μA +125°C DC61c Note 1: 2: 3: 4: Base Power-Down Current(3,4) 3.3V Watchdog Timer Current: ΔIWDT(3) Data in the Typical column is at 3.3V, 25°C unless otherwise stated. Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled to VSS. WDT, etc., are all switched off. The Δ current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. These currents are measured on the device containing the most memory in this family. TABLE 21-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Doze Ratio Units 35 1:2 mA 30 1:64 mA 11 30 1:128 mA 11 50 1:2 mA Parameter No. Typical(1) Max DC73a 11 DC73f 11 DC73g DC70a DC70f 11 30 1:64 mA DC70g 11 30 1:128 mA DC71a 12 50 1:2 mA DC71f 12 30 1:64 mA DC71g 12 30 1:128 mA DC72a 12 50 1:2 mA DC72f 12 30 1:64 mA DC72g 12 30 1:128 mA Note 1: 3.3V Conditions -40°C 3.3V 40 MIPS +25°C 3.3V 40 MIPS +85°C 3.3V 40 MIPS +125°C 3.3V 35 MIPS Data in the Typical column is at 3.3V, 25°C unless otherwise stated. DS70264B-page 196 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 21-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. VIL Characteristic Min Typ(1) Max Units Conditions Input Low Voltage DI10 I/O pins VSS — 0.2 VDD V DI15 MCLR VSS — 0.2 VDD V DI16 OSC1 (XT mode) VSS — 0.2 VDD V DI17 OSC1 (HS mode) VSS — 0.2 VDD V DI18 SDAx, SCLx VSS — 0.3 VDD V SMbus disabled DI19 SDAx, SCLx VSS — 0.2 VDD V SMbus enabled I/O pins: with analog functions digital-only 0.8 VDD 0.8 VDD — — VDD 5.5 V V DI25 MCLR 0.8 VDD — VDD V DI26 OSC1 (XT mode) 0.7 VDD — VDD V DI27 OSC1 (HS mode) 0.7 VDD — VDD V DI28 SDAx, SCLx 0.7 VDD — VDD V SMbus disabled SDAx, SCLx 0.8 VDD — VDD V SMbus enabled 50 250 400 μA VDD = 3.3V, VPIN = VSS VIH DI20 DI29 Input High Voltage ICNPU CNx Pull-up Current IIL Input Leakage Current(2)(3) DI30 DI50 I/O ports — — ±2 μA VSS ≤ VPIN ≤ VDD, Pin at high-impedance DI51 Analog Input Pins — — ±2 μA VSS ≤ VPIN ≤ VDD, Pin at high-impedance DI51a Analog Input Pins — — ±2 μA Analog pins shared with external reference pins DI51b Analog Input Pins — — ±3.5 μA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, -40°C ≤ TA ≤ +125°C DI51c Analog Input Pins — — ±8 μA Analog pins shared with external reference pins, -40°C ≤ TA ≤ +125°C DI55 MCLR — — ±2 μA VSS ≤ VPIN ≤ VDD DI56 OSC1 — — ±2 μA VSS ≤ VPIN ≤ VDD, XT and HS modes Note 1: 2: 3: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 197 dsPIC33FJ12GP201/202 TABLE 21-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. VOL DO10 DO16 VOH Characteristic Min Typ Max Units Conditions I/O ports — — 0.4 V IOL = 2mA, VDD = 3.3V OSC2/CLKO — — 0.4 V IOL = 2mA, VDD = 3.3V Output Low Voltage Output High Voltage DO20 I/O ports 2.40 — — V IOH = -2.3 mA, VDD = 3.3V DO26 OSC2/CLKO 2.41 — — V IOH = -1.3 mA, VDD = 3.3V TABLE 21-11: ELECTRICAL CHARACTERISTICS: BOR DC CHARACTERISTICS Param No. Symbol Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Min Typ Max Units BOR Event on VDD transition high-to-low BOR event is tied to VDD core voltage decrease 2.40 — 2.55 V BO10 VBOR Note 1: Parameters are for design guidance only and are not tested in manufacturing. DS70264B-page 198 Preliminary Conditions © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 21-12: DC CHARACTERISTICS: PROGRAM MEMORY Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. Characteristic Min Typ(1) Max 10,000 — — Units Conditions Program Flash Memory D130 EP Cell Endurance D131 VPR VDD for Read VMIN — 3.6 V VMIN = Minimum operating voltage D132B VPEW VDD for Self-Timed Write VMIN — 3.6 V VMIN = Minimum operating voltage D134 TRETD Characteristic Retention 20 — — Year Provided no other specifications are violated (-40°C to +125°C) D135 IDDP Supply Current during Programming — 10 — mA D136 TRW Row Write Time — 1.6 — ms D137 TPE Page Erase Time — 20 — ms D138 TWW Word Write Cycle Time 20 — 40 μs Note 1: E/W -40°C to +125°C Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. TABLE 21-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS Operating Conditions: -40°C < TA < +85°C (unless otherwise stated) Param No. Symbol CEFC Characteristics External Filter Capacitor Value © 2007 Microchip Technology Inc. Min Typ Max Units 1 10 — μF Preliminary Comments Capacitor must be low series resistance (< 5 ohms) DS70264B-page 199 dsPIC33FJ12GP201/202 21.2 AC Characteristics and Timing Parameters The information contained in this section defines dsPIC33FJ12GP201/202 AC characteristics and timing parameters. TABLE 21-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Operating voltage VDD range as described in Section 21.0 “Electrical Characteristics”. AC CHARACTERISTICS FIGURE 21-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2 VDD/2 CL Pin RL VSS CL Pin RL = 464Ω CL = 50 pF for all pins except OSC2 15 pF for OSC2 output VSS TABLE 21-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS Param Symbol No. Characteristic Min Typ Max Units Conditions DO50 COSC2 OSC2/SOSC2 pin — — 15 pF In XT and HS modes when external clock is used to drive OSC1 DO56 CIO All I/O pins and OSC2 — — 50 pF EC mode DO58 CB SCLx, SDAx — — 400 pF In I2C™ mode DS70264B-page 200 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 FIGURE 21-2: EXTERNAL CLOCK TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 OS20 OS30 OS25 OS30 OS31 OS31 CLKO OS41 OS40 TABLE 21-16: EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. OS10 Symb FIN Min Typ(1) Max Units External CLKI Frequency (External clocks allowed only in EC and ECPLL modes) DC — 40 MHz EC Oscillator Crystal Frequency 3.5 10 — — — — 10 40 33 MHz MHz kHz XT HS SOSC Characteristic Conditions OS20 TOSC TOSC = 1/FOSC 12.5 — DC ns OS25 TCY Instruction Cycle Time(2) 25 — DC ns OS30 TosL, TosH External Clock in (OSC1) High or Low Time 0.375 x TOSC — 0.625 x TOSC ns EC OS31 TosR, TosF External Clock in (OSC1) Rise or Fall Time — — 20 ns EC OS40 TckR CLKO Rise Time(3) — 5.2 — ns — 5.2 — ns OS41 TckF Note 1: 2: 3: (3) CLKO Fall Time Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Instruction cycle period (TCY) equals two times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits can result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “max.” cycle time limit is “DC” (no clock) for all devices. Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 201 dsPIC33FJ12GP201/202 TABLE 21-17: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min Typ(1) Max Units Conditions ECPLL and XTPLL modes OS50 FPLLI PLL Voltage Controlled Oscillator (VCO) Input Frequency Range 0.8 — 8 MHz OS51 FSYS On-Chip VCO System Frequency 100 — 200 MHz OS52 TLOCK PLL Start-up Time (Lock Time) 0.9 1.5 3.1 ms OS53 DCLK CLKO Stability (Jitter) -3 0.5 3 % Note 1: Measured over 100 ms period Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. TABLE 21-18: AC CHARACTERISTICS: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Characteristic Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ Max Units Conditions Internal FRC Accuracy @ 7.3728 MHz(1,2) F20 Note 1: 2: FRC -2 — +2 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V FRC -5 — +5 % -40°C ≤ TA ≤ +125°C VDD = 3.0-3.6V Frequency calibrated at 25°C and 3.3V. TUN bits can be used to compensate for temperature drift. FRC is set to initial frequency of 7.37 MHz (±2%) at 25°C. TABLE 21-19: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Characteristic Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ Max Units Conditions LPRC -20 ±6 +20 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V LPRC -70 — +20 % -40°C ≤ TA ≤ +125°C VDD = 3.0-3.6V LPRC @ 32.768 kHz(1) F21 Note 1: Change of LPRC frequency as VDD changes. DS70264B-page 202 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 FIGURE 21-3: CLKO AND I/O TIMING CHARACTERISTICS I/O Pin (Input) DI35 DI40 I/O Pin (Output) New Value Old Value DO31 DO32 Note: Refer to Figure 21-1 for load conditions. TABLE 21-20: I/O TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min Typ(1) Max Units Conditions — 10 25 ns — DO31 TIOR DO32 TIOF Port Output Fall Time — 10 25 ns — DI35 TINP INTx Pin High or Low Time (output) 20 — — ns — TRBP CNx High or Low Time (input) 2 — — TCY — DI40 Note 1: Port Output Rise Time Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 203 dsPIC33FJ12GP201/202 FIGURE 21-4: VDD RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING CHARACTERISTICS SY12 MCLR SY10 Internal POR PWRT Time-out OSC Time-out SY11 SY30 Internal Reset Watchdog Timer Reset SY13 SY20 SY13 I/O Pins SY35 FSCM Delay Note: Refer to Figure 21-1 for load conditions. DS70264B-page 204 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 21-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic(1) Min Typ(2) Max Units Conditions SY10 TMCL MCLR Pulse Width (low) 2 — — μs -40°C to +85°C SY11 TPWRT Power-up Timer Period — 2 4 8 16 32 64 128 — ms -40°C to +85°C User programmable SY12 TPOR Power-on Reset Delay 3 10 30 μs -40°C to +85°C SY13 TIOZ I/O High-Impedance from MCLR Low or Watchdog Timer Reset 0.68 0.72 1.2 μs SY20 TWDT1 Watchdog Timer Time-out Period (No Prescaler) 1.7 2.1 2.6 ms SY30 TOST Oscillator Start-up Time — 1024 TOSC — — TOSC = OSC1 period SY35 TFSCM Fail-Safe Clock Monitor Delay — 500 900 μs -40°C to +85°C Note 1: 2: VDD = 3V, -40°C to +85°C These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 205 dsPIC33FJ12GP201/202 FIGURE 21-5: TIMER1, 2 AND 3 EXTERNAL CLOCK TIMING CHARACTERISTICS TxCK Tx11 Tx10 Tx15 OS60 Tx20 TMRx Note: Refer to Figure 21-1 for load conditions. TABLE 21-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. TA10 TA11 TA15 Symbol TTXH TTXL TTXP Characteristic TxCK High Time TxCK Low Time Min Typ Max Units Conditions Synchronous, no prescaler 0.5 TCY + 20 — — ns Must also meet parameter TA15 Synchronous, with prescaler 10 — — ns Asynchronous 10 — — ns Synchronous, no prescaler 0.5 TCY + 20 — — ns Synchronous, with prescaler 10 — — ns Asynchronous 10 — — ns TCY + 40 — — ns Synchronous, with prescaler Greater of: 20 ns or (TCY + 40)/N — — — Asynchronous 20 — — ns DC — 50 kHz 1.5 TCY — TxCK Input Period Synchronous, no prescaler OS60 Ft1 TA20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment Note 1: SOSC1/T1CK Oscillator Input frequency Range (oscillator enabled by setting bit TCS (T1CON<1>)) 0.5 TCY Must also meet parameter TA15 N = prescale value (1, 8, 64, 256) Timer1 is a Type A. DS70264B-page 206 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 21-23: TIMER2 EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. TB10 TB11 TB15 TB20 Symbol TtxH TtxL TtxP TCKEXTMRL Characteristic TxCK High Time TxCK Low Time TxCK Input Period Min Typ Max Units Conditions Synchronous, no prescaler 0.5 TCY + 20 — — ns Must also meet parameter TB15 Synchronous, with prescaler 10 — — ns Synchronous, no prescaler 0.5 TCY + 20 — — ns Synchronous, with prescaler 10 — — ns Synchronous, no prescaler TCY + 40 — — ns Synchronous, with prescaler Greater of: 20 ns or (TCY + 40)/N — 1.5 TCY — Delay from External TxCK Clock Edge to Timer Increment 0.5 TCY Must also meet parameter TB15 N = prescale value (1, 8, 64, 256) TABLE 21-24: TIMER3 EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min Typ Max Units Conditions TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 — — ns Must also meet parameter TC15 TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 — — ns Must also meet parameter TC15 TC15 TtxP TxCK Input Period Synchronous, no prescaler TCY + 40 — — ns N = prescale value (1, 8, 64, 256) — 1.5 TCY — Synchronous, with prescaler TC20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment © 2007 Microchip Technology Inc. Greater of: 20 ns or (TCY + 40)/N 0.5 TCY Preliminary DS70264B-page 207 dsPIC33FJ12GP201/202 FIGURE 21-6: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS ICx IC10 IC11 IC15 Note: Refer to Figure 21-1 for load conditions. TABLE 21-25: INPUT CAPTURE TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol IC10 TccL ICx Input Low Time IC11 TccH ICx Input High Time IC15 TccP ICx Input Period Characteristic(1) No Prescaler Min Max Units 0.5 TCY + 20 — ns With Prescaler No Prescaler 10 — ns 0.5 TCY + 20 — ns With Prescaler Note 1: 10 — ns (TCY + 40)/N — ns Conditions N = prescale value (1, 4, 16) These parameters are characterized but not tested in manufacturing. FIGURE 21-7: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS OCx (Output Compare or PWM Mode) OC10 OC11 Note: Refer to Figure 21-1 for load conditions. TABLE 21-26: OUTPUT COMPARE MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol No. Characteristic(1) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ Max Units Conditions OC10 TccF OCx Output Fall Time — — — ns See parameter D032 OC11 TccR OCx Output Rise Time — — — ns See parameter D031 Note 1: These parameters are characterized but not tested in manufacturing. DS70264B-page 208 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 FIGURE 21-8: OC/PWM MODULE TIMING CHARACTERISTICS OC20 OCFA/OCFB OC15 OCx TABLE 21-27: SIMPLE OC/PWM MODE TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ Max Units Conditions OC15 TFD Fault Input to PWM I/O Change — — 50 ns — OC20 TFLT Fault Input Pulse Width 50 — — ns — Note 1: These parameters are characterized but not tested in manufacturing. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 209 dsPIC33FJ12GP201/202 FIGURE 21-9: SPIx MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS SCKx (CKP = 0) SP11 SP10 SP21 SP20 SP20 SP21 SCKx (CKP = 1) SP35 Bit 14 - - - - - -1 MSb SDOx SP31 SDIx LSb SP30 MSb In LSb In Bit 14 - - - -1 SP40 SP41 Note: Refer to Figure 21-1 for load conditions. TABLE 21-28: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions — — ns — TscL SCKx Output Low Time(3) TCY/2 SP11 TscH SCKx Output High Time (3) TCY/2 — — ns SP20 TscF SCKx Output Fall Time(4) — — — ns See parameter D032 SP21 TscR SCKx Output Rise Time(4) — — — ns See parameter D031 SP30 TdoF SDOx Data Output Fall Time(4) — — — ns See parameter D032 See parameter D031 SP10 Time(4) — SP31 TdoR SDOx Data Output Rise — — — ns SP35 TscH2doV, TscL2doV SDOx Data Output Valid after SCKx Edge — 6 20 ns — SP40 TdiV2scH, TdiV2scL Setup Time of SDIx Data Input to SCKx Edge 23 — — ns — SP41 TscH2diL, TscL2diL Hold Time of SDIx Data Input to SCKx Edge 30 — — ns — Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The minimum clock period for SCKx is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. DS70264B-page 210 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 FIGURE 21-10: SPIx MODULE MASTER MODE (CKE = 1) TIMING CHARACTERISTICS SP36 SCKX (CKP = 0) SP11 SCKX (CKP = 1) SP10 SP21 SP20 SP20 SP21 SP35 SP40 SDIX LSb Bit 14 - - - - - -1 MSb SDOX SP30,SP31 MSb In Bit 14 - - - -1 LSb In SP41 Note: Refer to Figure 21-1 for load conditions. TABLE 21-29: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP10 TscL SCKx Output Low Time TCY/2 — — ns See Note 3 SP11 TscH SCKx Output High Time TCY/2 — — ns See Note 3 SP20 TscF SCKx Output Fall Time — — — ns See parameter D032 and Note 4 SP21 TscR SCKx Output Rise Time — — — ns See parameter D031 and Note 4 SP30 TdoF SDOx Data Output Fall Time — — — ns See parameter D032 and Note 4 SP31 TdoR SDOx Data Output Rise Time — — — ns See parameter D031 and Note 4 SP35 TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge — 6 20 ns — SP36 TdoV2sc, SDOx Data Output Setup to TdoV2scL First SCKx Edge 30 — — ns — SP40 TdiV2scH, Setup Time of SDIx Data TdiV2scL Input to SCKx Edge 23 — — ns — Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 211 dsPIC33FJ12GP201/202 Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. SP41 Characteristic(1) Min Typ(2) Max Units Conditions Hold Time of SDIx Data Input to SCKx Edge 30 — — ns — Symbol TscH2diL, TscL2diL Note 1: 2: 3: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. 4: FIGURE 21-11: SPIx MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS SSX SP52 SP50 SCKX (CKP = 0) SP71 SP70 SP73 SP72 SP72 SP73 SCKX (CKP = 1) SP35 MSb SDOX LSb Bit 14 - - - - - -1 SP51 SP30,SP31 SDIX MSb In Bit 14 - - - -1 LSb In SP41 SP40 Note: Refer to Figure 21-1 for load conditions. TABLE 21-30: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. SP70 Symbol TscL Characteristic(1) Min Typ(2) Max Units Conditions SCKx Input Low Time 30 — — ns — SP71 TscH SCKx Input High Time 30 — — ns — SP72 TscF SCKx Input Fall Time(3) — 10 25 ns — SP73 TscR SCKx Input Rise Time(3) — 10 25 ns — Note 1: 2: 3: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Assumes 50 pF load on all SPIx pins. DS70264B-page 212 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 21-30: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS (CONTINUED) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP30 TdoF SDOx Data Output Fall Time(3) — — — ns See parameter D032 SP31 TdoR SDOx Data Output Rise Time(3) — — — ns See parameter D031 SP35 TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge — — 30 ns — SP40 TdiV2scH, Setup Time of SDIx Data Input TdiV2scL to SCKx Edge 20 — — ns — SP41 TscH2diL, TscL2diL 20 — — ns — SP50 TssL2scH, SSx ↓ to SCKx ↑ or SCKx Input TssL2scL 120 — — ns — SP51 TssH2doZ SSx ↑ to SDOx Output High-Impedance(3) 10 — 50 ns — SP52 TscH2ssH SSx after SCKx Edge TscL2ssH 1.5 TCY +40 — — ns — Note 1: 2: 3: Hold Time of SDIx Data Input to SCKx Edge These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Assumes 50 pF load on all SPIx pins. FIGURE 21-12: SPIx MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS SP60 SSx SP52 SP50 SCKx (CKP = 0) SP71 SP70 SP73 SP72 SP72 SP73 SCKx (CKP = 1) SP35 SP52 MSb SDOx Bit 14 - - - - - -1 LSb SP30,SP31 SDIx SDI MSb In SP51 Bit 14 - - - -1 LSb In SP41 SP40 Note: Refer to Figure 21-1 for load conditions. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 213 dsPIC33FJ12GP201/202 TABLE 21-31: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP70 TscL SCKx Input Low Time 30 — — ns — SP71 TscH SCKx Input High Time 30 — — ns — SP72 TscF SCKx Input Fall Time(3) — 10 25 ns — SP73 TscR SCKx Input Rise Time(3) — 10 25 ns — — — — ns See parameter D032 — — — ns See parameter D031 Time(3) SP30 TdoF SDOx Data Output Fall SP31 TdoR SDOx Data Output Rise Time(3) SP35 TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge — — 30 ns — SP40 TdiV2scH, Setup Time of SDIx Data Input TdiV2scL to SCKx Edge 20 — — ns — SP41 TscH2diL, Hold Time of SDIx Data Input TscL2diL to SCKx Edge 20 — — ns — SP50 TssL2scH, SSx ↓ to SCKx ↓ or SCKx ↑ TssL2scL Input 120 — — ns — SP51 TssH2doZ SSx ↑ to SDOX Output High-Impedance(4) 10 — 50 ns — SP52 TscH2ssH SSx ↑ after SCKx Edge TscL2ssH 1.5 TCY + 40 — — ns — SP60 TssL2doV SDOx Data Output Valid after SSx Edge — — 50 ns — Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. DS70264B-page 214 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 FIGURE 21-13: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE) SCLx IM31 IM34 IM30 IM33 SDAx Stop Condition Start Condition Note: Refer to Figure 21-1 for load conditions. FIGURE 21-14: I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE) IM20 IM21 IM11 IM10 SCLx IM11 IM26 IM10 IM25 IM33 SDAx In IM40 IM40 IM45 SDAx Out Note: Refer to Figure 21-1 for load conditions. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 215 dsPIC33FJ12GP201/202 TABLE 21-32: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. IM10 Min(1) Max Units Conditions TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1) — μs — 400 kHz mode TCY/2 (BRG + 1) — μs — mode(2) TCY/2 (BRG + 1) — μs — Clock High Time 100 kHz mode TCY/2 (BRG + 1) — μs — 400 kHz mode TCY/2 (BRG + 1) — μs — 1 MHz mode(2) TCY/2 (BRG + 1) — μs — — 300 ns 20 + 0.1 CB 300 ns Characteristic 1 MHz IM11 THI:SCL IM20 TF:SCL IM21 TR:SCL IM25 SDAx and SCLx 100 kHz mode Fall Time 400 kHz mode 1 MHz mode(2) — 100 ns SDAx and SCLx 100 kHz mode Rise Time 400 kHz mode — 1000 ns TSU:DAT Data Input Setup Time IM26 THD:DAT Data Input Hold Time IM30 TSU:STA IM31 Start Condition Setup Time THD:STA Start Condition Hold Time IM33 TSU:STO Stop Condition Setup Time IM34 THD:STO Stop Condition Hold Time IM40 TAA:SCL Output Valid From Clock TBF:SDA Bus Free Time IM50 CB Note 1: 2: CB is specified to be from 10 to 400 pF 20 + 0.1 CB 300 ns 1 MHz mode(2) — 300 ns 100 kHz mode 250 — ns 400 kHz mode 100 — ns 1 MHz mode(2) 40 — ns 100 kHz mode 0 — μs 400 kHz mode 0 0.9 μs 1 MHz mode(2) 0.2 — μs 100 kHz mode TCY/2 (BRG + 1) — μs 400 kHz mode TCY/2 (BRG + 1) — μs 1 MHz mode(2) TCY/2 (BRG + 1) — μs 100 kHz mode TCY/2 (BRG + 1) — μs 400 kHz mode TCY/2 (BRG + 1) — μs 1 MHz mode(2) TCY/2 (BRG + 1) — μs 100 kHz mode TCY/2 (BRG + 1) — μs 400 kHz mode TCY/2 (BRG + 1) — μs 1 MHz mode(2) TCY/2 (BRG + 1) — μs 100 kHz mode TCY/2 (BRG + 1) — ns 400 kHz mode TCY/2 (BRG + 1) — ns 1 MHz mode(2) TCY/2 (BRG + 1) — ns 100 kHz mode — 3500 ns — 400 kHz mode — 1000 ns — (2) — 400 ns — 100 kHz mode 4.7 — μs 400 kHz mode 1.3 — μs 1 MHz mode(2) 0.5 — μs Time the bus must be free before a new transmission can start — 400 pF 1 MHz mode IM45 CB is specified to be from 10 to 400 pF Bus Capacitive Loading — — Only relevant for Repeated Start condition After this period the first clock pulse is generated — — BRG is the value of the I2C Baud Rate Generator. Refer to Section 19. “Inter-Integrated Circuit (I2C™)” in the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F Family Reference Manual sections. Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only). DS70264B-page 216 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 FIGURE 21-15: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) SCLx IS34 IS31 IS30 IS33 SDAx Stop Condition Start Condition FIGURE 21-16: I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) IS20 IS21 IS11 IS10 SCLx IS30 IS26 IS31 IS25 IS33 SDAx In IS40 IS40 IS45 SDAx Out © 2007 Microchip Technology Inc. Preliminary DS70264B-page 217 dsPIC33FJ12GP201/202 TABLE 21-33: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol IS10 IS11 IS20 Characteristic TLO:SCL Clock Low Time THI:SCL TF:SCL Clock High Time SDAx and SCLx Fall Time Min Max Units 100 kHz mode 4.7 — μs Device must operate at a minimum of 1.5 MHz 400 kHz mode 1.3 — μs Device must operate at a minimum of 10 MHz 1 MHz mode(1) 0.5 — μs 100 kHz mode 4.0 — μs Device must operate at a minimum of 1.5 MHz 400 kHz mode 0.6 — μs Device must operate at a minimum of 10 MHz 1 MHz mode(1) 0.5 — μs 100 kHz mode — 300 ns 400 kHz mode 20 + 0.1 CB 300 ns — 100 ns 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(1) — 300 ns 100 kHz mode 250 — ns 400 kHz mode 100 — ns 1 MHz mode(1) 100 — ns 1 MHz IS21 IS25 IS26 IS30 IS31 IS33 IS34 TR:SCL TSU:DAT Data Input Setup Time THD:DAT Data Input Hold Time TSU:STA Start Condition Setup Time THD:STA Start Condition Hold Time TSU:STO Stop Condition Setup Time THD:ST O IS40 IS45 IS50 Note 1: SDAx and SCLx Rise Time Stop Condition Hold Time TAA:SCL Output Valid From Clock TBF:SDA Bus Free Time CB Conditions mode(1) 100 kHz mode 0 0 μs 400 kHz mode 0 0.9 μs 1 MHz mode(1) 0 0.3 μs 100 kHz mode 4.7 — μs 400 kHz mode 0.6 — μs 1 MHz mode(1) 0.25 — μs 100 kHz mode 4.0 — μs 400 kHz mode 0.6 — μs 1 MHz mode(1) 0.25 — μs 100 kHz mode 4.7 — μs 400 kHz mode 0.6 — μs 1 MHz mode(1) 0.6 — μs 100 kHz mode 4000 — ns 400 kHz mode 600 — ns 1 MHz mode(1) 250 100 kHz mode 0 3500 ns 400 kHz mode 0 1000 ns 1 MHz mode(1) 0 350 ns — CB is specified to be from 10 to 400 pF CB is specified to be from 10 to 400 pF — — Only relevant for Repeated Start condition After this period, the first clock pulse is generated — — ns 100 kHz mode 4.7 — μs 400 kHz mode 1.3 — μs 1 MHz mode(1) 0.5 — μs — 400 pF Bus Capacitive Loading — — Time the bus must be free before a new transmission can start — Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only). DS70264B-page 218 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 21-34: ADC MODULE SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic Min. Typ Max. Units Conditions Device Supply AD01 AVDD Module VDD Supply Greater of VDD – 0.3 or 3.0 — Lesser of VDD + 0.3 or 3.6 V — AD02 AVSS Module VSS Supply VSS – 0.3 — VSS + 0.3 V — AD05 VREFH Reference Voltage High Reference Inputs AD05a AD06 VREFL Reference Voltage Low AD06a AVSS + 2.7 — AVDD V See Note 2 3.0 — 3.6 V VREFH = AVDD VREFL = AVSS = 0 AVSS — AVDD – 2.7 V See Note 2 0 — 0 V VREFH = AVDD VREFL = AVSS = 0 AD07 VREF Absolute Reference Voltage 3.0 — 3.6 V VREF = VREFH - VREFL AD08 IREF Current Drain — 389 .001 549 1 μA μA ADC operating ADC off AD10 VINHVINL Full-Scale Input Span Analog Input VREFL — VREFH V VREFL = 0, VREFH = 3.6V See Note 1 AVSS — AVDD V AVSS = 0, AVDD = 3.6V See Note 1 AD12 VINH Input Voltage Range VINH VINL — VREFH V This voltage reflects Sample and Hold Channels 0, 1, 2, and 3 (CH0-CH3), positive input AD13 VINL Input Voltage Range VINL VREFL — AVSS + 1V V This voltage reflects Sample and Hold Channels 0, 1, 2, and 3 (CH0-CH3), negative input AD17 RIN Recommended Impedance of Analog Voltage Source — — 200 200 Ω Ω 10-bit 12-bit Note 1: 2: The ADC conversion result never decreases with an increase in the input voltage, and has no missing codes. These parameters are not characterized or tested in manufacturing. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 219 dsPIC33FJ12GP201/202 TABLE 21-35: ADC MODULE SPECIFICATIONS (12-BIT MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREFAD20a Nr Resolution 12 data bits AD21a INL Integral Nonlinearity AD22a DNL bits -1 — +1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD23a GERR Gain Error 1.25 1.5 3 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24a EOFF Offset Error -2 -1.5 -1.25 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD25a — Monotonicity(1) — — — — Guaranteed ADC Accuracy (12-bit Mode) – Measurements with internal VREF+/VREFAD20a Nr Resolution AD21a INL Integral Nonlinearity 12 data bits AD22a DNL Differential Nonlinearity AD23a GERR bits -1 — +1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V >-1 — <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V Gain Error 2 3 7 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24a EOFF Offset Error 2 3 5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD25a — Monotonicity(1) — — — — AD30a THD Total Harmonic Distortion -77 -69 -61 dB — AD31a SINAD Signal to Noise and Distortion 59 63 64 dB — AD32a SFDR Spurious Free Dynamic Range 63 72 79 dB — AD33a FNYQ Input Signal Bandwidth — — 250 kHz — AD34a ENOB Effective Number of Bits 10.95 11.1 — bits — Guaranteed Dynamic Performance (12-bit Mode) Note 1: The ADC conversion result never decreases with an increase in the input voltage, and has no missing codes. DS70264B-page 220 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 TABLE 21-36: ADC MODULE SPECIFICATIONS (10-BIT MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions ADC Accuracy (10-bit Mode) – Measurements with external VREF+/VREFAD20b Nr Resolution 10 data bits AD21b INL Integral Nonlinearity AD22b DNL Differential Nonlinearity AD23b GERR bits -1 — +1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V >-1 — <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V Gain Error 1 3 6 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24b EOFF Offset Error 1 2 5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD25b — Monotonicity(1) — — — — Guaranteed ADC Accuracy (10-bit Mode) – Measurements with internal VREF+/VREFAD20b Nr Resolution AD21b INL Integral Nonlinearity 10 data bits AD22b DNL bits -1 — +1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V Differential Nonlinearity >-1 — <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD23b GERR Gain Error ±1 ±5 ±6 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24b EOFF Offset Error ±1 ±2 ±3 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD25b — Monotonicity(1) — — — — AD30b THD Total Harmonic Distortion — -64 -67 dB — AD31b SINAD Signal to Noise and Distortion — 57 58 dB — AD32b SFDR Spurious Free Dynamic Range — 67 71 dB — AD33b FNYQ Input Signal Bandwidth — — 550 kHz — AD34b ENOB Effective Number of Bits 9.1 9.7 9.8 bits — Guaranteed Dynamic Performance (10-bit Mode) Note 1: The ADC conversion result never decreases with an increase in the input voltage, and has no missing codes. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 221 dsPIC33FJ12GP201/202 FIGURE 21-17: ADC CONVERSION (12-BIT MODE) TIMING CHARACTERISTICS (ASAM = 0, SSRC<2:0> = 000) AD50 ADCLK Instruction Execution Set SAMP Clear SAMP SAMP AD61 AD60 TSAMP AD55 DONE AD1IF 1 2 3 4 5 6 7 8 9 1 – Software sets AD1CON. SAMP to start sampling. 5 – Convert bit 11. 2 – Sampling starts after discharge period. TSAMP is described in Section 28. “10/12-bit ADC without DMA” in the “dsPIC33F Family Reference Manual”. Please see the Microchip web site for the latest dsPIC33F Family Reference Manual sections. 6 – Convert bit 10. 3 – Software clears AD1CON. SAMP to start conversion. 9 – One TAD for end of conversion. 7 – Convert bit 1. 8 – Convert bit 0. 4 – Sampling ends, conversion sequence starts. TABLE 21-37: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions Clock Parameters(1) AD50 TAD ADC Clock Period AD51 tRC ADC Internal RC Oscillator Period AD55 tCONV Conversion Time AD56 FCNV Throughput Rate AD57 TSAMP Sample Time AD60 tPCS Conversion Start from Sample Trigger(2) AD61 tPSS Sample Start from Setting Sample (SAMP) bit(2) AD62 tCSS Conversion Completion to Sample Start (ASAM = 1)(2) AD63 tDPU 117.6 — — ns — 250 — ns Conversion Rate — 14 TAD ns — — 500 Ksps 3 TAD — — — Timing Parameters Note 1: 2: Time to Stabilize Analog Stage from ADC Off to ADC On(2) — 1.0 TAD — — Auto Convert Trigger not selected 0.5 TAD — 1.5 TAD — — — 0.5 TAD — — — 1 — 5 μs — Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. These parameters are characterized but not tested in manufacturing. DS70264B-page 222 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 FIGURE 21-18: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000) AD50 ADCLK Instruction Execution Set SAMP Clear SAMP SAMP AD61 AD60 AD55 TSAMP AD55 DONE AD1IF Buffer(0) Buffer(1) 1 2 3 4 5 6 7 8 5 6 7 8 1 – Software sets AD1CON. SAMP to start sampling. 2 – Sampling starts after discharge period. TSAMP is described in Section 28. “10/12-bit ADC without DMA” in the “dsPIC33F Family Reference Manual”. Please see the Microchip web site for the latest dsPIC33F Family Reference Manual sections. 3 – Software clears AD1CON. SAMP to start conversion. 4 – Sampling ends, conversion sequence starts. 5 – Convert bit 9. 6 – Convert bit 8. 7 – Convert bit 0. 8 – One TAD for end of conversion. FIGURE 21-19: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001) AD50 ADCLK Instruction Set ADON Execution SAMP TSAMP AD55 TSAMP AD55 AD55 AD1IF DONE 1 2 3 4 5 6 7 1 – Software sets ADxCON. ADON to start AD operation. 3 Preliminary 5 6 8 4 – Convert bit 8. 2 – Sampling starts after discharge period. 5 TSAMP is described in Section 28. “10/12-bit ADC without DMA” 6 in the “dsPIC33F Family Reference Manual”. Please refer to the Microchip web site for the latest dsPIC33F Family 7 Reference Manual sections. – Convert bit 9. 3 8 © 2007 Microchip Technology Inc. 4 – Convert bit 0. – One TAD for end of conversion. – Begin conversion of next channel. – Sample for time specified by SAMC<4:0>. DS70264B-page 223 dsPIC33FJ12GP201/202 TABLE 21-38: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic Min. Typ(1) Max. Units Conditions Clock Parameters(2) AD50 TAD ADC Clock Period 65 — — ns AD51 tRC ADC Internal RC Oscillator Period — 250 — ns AD55 tCONV Conversion Time AD56 FCNV Throughput Rate AD57 TSAMP Sample Time AD60 tPCS Conversion Start from Sample Trigger(1) AD61 tPSS Sample Start from Setting Sample (SAMP) bit(1) AD62 tCSS AD63 tDPU Conversion Rate — 12 TAD — — — — 1.1 Msps 2 TAD — — — Timing Parameters Note 1: 2: — 1.0 TAD — — Auto-Convert Trigger (SSRC<2:0> = 111) not selected 0.5 TAD — 1.5 TAD — — Conversion Completion to Sample Start (ASAM = 1)(1) — 0.5 TAD — — — Time to Stabilize Analog Stage from ADC Off to ADC On(1) 1 — 5 μs — These parameters are characterized but not tested in manufacturing. Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. DS70264B-page 224 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 22.0 PACKAGING INFORMATION 22.1 Package Marking Information 18-Lead PDIP Example XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN dsPIC33FJ12GP 201-E/P e3 0730235 28-Lead SPDIP Example dsPIC33FJ12GP 202-E/SP e3 0730235 XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN 18-Lead SOIC Example XXXXXXXXXXXX XXXXXXXXXXXX XXXXXXXXXXXX dsPIC33FJ12 GP201-E/SO e3 0730235 YYWWNNN 28-Lead SOIC (.300”) Example XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN dsPIC33FJ12GP 202-E/SO e3 0730235 28-Lead QFN Example XXXXXXXX XXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: 33FJ12GP 202EML e3 0730235 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. If the full Microchip part number cannot be marked on one line, it is carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 225 dsPIC33FJ12GP201/202 22.2 Package Details 18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 2 3 D E A2 A L c A1 b1 b e eB Units Dimension Limits Number of Pins INCHES MIN N NOM MAX 18 Pitch e Top to Seating Plane A – – .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 – – Shoulder to Shoulder Width E .300 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .880 .900 .920 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .014 b1 .045 .060 .070 b .014 .018 .022 eB – – Upper Lead Width Lower Lead Width Overall Row Spacing § .100 BSC .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-007B DS70264B-page 226 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 2 3 D E A2 A L c b1 A1 b e eB Units Dimension Limits Number of Pins INCHES MIN N NOM MAX 28 Pitch e Top to Seating Plane A – – .200 Molded Package Thickness A2 .120 .135 .150 Base to Seating Plane A1 .015 – – Shoulder to Shoulder Width E .290 .310 .335 Molded Package Width E1 .240 .285 .295 Overall Length D 1.345 1.365 1.400 Tip to Seating Plane L .110 .130 .150 Lead Thickness c .008 .010 .015 b1 .040 .050 .070 b .014 .018 .022 eB – – Upper Lead Width Lower Lead Width Overall Row Spacing § .100 BSC .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-070B © 2007 Microchip Technology Inc. Preliminary DS70264B-page 227 dsPIC33FJ12GP201/202 18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 3 e b α h h c φ A2 A A1 β L L1 Units Dimension Limits Number of Pins MILLMETERS MIN N NOM MAX 18 Pitch e Overall Height A – 1.27 BSC – Molded Package Thickness A2 2.05 – – Standoff § A1 0.10 – 0.30 2.65 Overall Width E Molded Package Width E1 10.30 BSC 7.50 BSC Overall Length D 11.55 BSC Chamfer (optional) h 0.25 – 0.75 Foot Length L 0.40 – 1.27 Footprint L1 1.40 REF Foot Angle φ 0° – 8° Lead Thickness c 0.20 – 0.33 Lead Width b 0.31 – 0.51 Mold Draft Angle Top α 5° – 15° Mold Draft Angle Bottom β 5° – 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-051B DS70264B-page 228 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 3 e b h α A2 A h c φ L A1 Units Dimension Limits Number of Pins β L1 MILLIMETERS MIN N NOM MAX 28 Pitch e Overall Height A – 1.27 BSC – Molded Package Thickness A2 2.05 – – Standoff § A1 0.10 – 0.30 Overall Width E Molded Package Width E1 7.50 BSC Overall Length D 17.90 BSC 2.65 10.30 BSC Chamfer (optional) h 0.25 – 0.75 Foot Length L 0.40 – 1.27 Footprint L1 1.40 REF Foot Angle Top φ 0° – 8° Lead Thickness c 0.18 – 0.33 Lead Width b 0.31 – 0.51 Mold Draft Angle Top α 5° – 15° Mold Draft Angle Bottom β 5° – 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-052B © 2007 Microchip Technology Inc. Preliminary DS70264B-page 229 dsPIC33FJ12GP201/202 28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN] with 0.55 mm Contact Length Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D2 EXPOSED PAD e E b E2 2 2 1 1 K N N NOTE 1 L BOTTOM VIEW TOP VIEW A A3 A1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 28 Pitch e Overall Height A 0.80 0.65 BSC 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Width E Exposed Pad Width E2 Overall Length D Exposed Pad Length D2 3.65 3.70 4.20 b 0.23 0.30 0.35 Contact Length L 0.50 0.55 0.70 Contact-to-Exposed Pad K 0.20 – – Contact Width 6.00 BSC 3.65 3.70 4.20 6.00 BSC Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-105B DS70264B-page 230 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 APPENDIX A: REVISION HISTORY Revision A (January 2007) Initial release of this document. Revision B (May 2007) This revision includes the following corrections and updates: • Minor typographical and formatting corrections throughout the data sheet text. • New content: - Addition of bullet item (16-word conversion result buffer) (see Section 17.1 “Key Features”) • Figure update: - Oscillator System Diagram (see Figure 7-1) - WDT Block Diagram (see Figure 18-2) • Equation update: - Serial Clock Rate (see Equation 15-1) • Register updates: - Clock Divisor Register (see Register 7-2) - PLL Feedback Divisor Register (see Register 7-3) - Peripheral Pin Select Input Registers (see Register 9-1 through Register 9-9) - ADC1 Input Channel 1, 2, 3 Select Register (see Register 17-4) - ADC1 Input Channel 0 Select Register (see Register 17-5) • Table updates: - CNEN2 (see Table 3-2 and Table 3-3) - Reset Flag Bit Operation (see Table 5-1) - Configuration Bit Values for Clock Operation (see Table 7-1) • Operation value update: - IOLOCK set/clear operation (see Section 9.4.4.1 “Control Register Lock”) • The following tables in Section 21.0 “Electrical Characteristics” have been updated with preliminary values: - Updated Max MIPS for -40°C to +125°C Temp Range (see Table 21-1) - Added new parameters for +125°C, and updated Typical and Max values for most parameters (see Table 21-5) - Added new parameters for +125°C, and updated Typical and Max values for most parameters (see Table 21-6) © 2007 Microchip Technology Inc. - Added new parameters for +125°C, and updated Typical and Max values for most parameters (see Table 21-7) - Added new parameters for +125°C, and updated Typical and Max values for most parameters (see Table 21-8) - Updated parameter DI51, added parameter DI51a (see Table 21-9) - Added Note 1 (see Table 21-11) - Updated parameter OS30 (see Table 21-16) - Updated parameter OS52 (see Table 21-17) - Updated parameter F20, added Note 2 (see Table 21-18) - Updated parameter F21 (see Table 21-19) - Updated parameter TA15 (see Table 21-22) - Updated parameter TB15 (see Table 21-23) - Updated parameter TC15 (see Table 21-24) - Updated parameter IC15 (see Table 21-25) - Updated parameters AD05, AD06, AD07, AD08, AD10, and AD11; added parameters AD05a and AD06a; added Note 2; modified ADC Accuracy headings to include measurement information (see Table 21-34) - Separated the ADC Module Specifications table into three tables (see Table 21-34, Table 21-35, and Table 21-36) - Updated parameter AD50 (see Table 21-37) - Updated parameters AD50 and AD57 (see Table 21-38) Preliminary DS70264B-page 231 dsPIC33FJ12GP201/202 NOTES: DS70264B-page 232 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 INDEX A A/D Converter ................................................................... 161 Initialization ............................................................... 161 Key Features............................................................. 161 AC Characteristics ............................................................ 200 Internal RC Accuracy ................................................ 202 Load Conditions ........................................................ 200 ADC Module ADC1 Register Map .............................................. 34, 35 Alternate Vector Table (AIVT) ............................................. 59 Arithmetic Logic Unit (ALU)................................................. 17 Assembler MPASM Assembler................................................... 188 Automatic Clock Stretch.................................................... 145 Receive Mode ........................................................... 145 Transmit Mode .......................................................... 145 B Barrel Shifter ....................................................................... 21 Bit-Reversed Addressing .................................................... 41 Example ...................................................................... 42 Implementation ........................................................... 41 Sequence Table (16-Entry)......................................... 42 Block Diagrams 16-bit Timer1 Module ................................................ 119 A/D Module ............................................................... 162 Connections for On-Chip Voltage Regulator............. 176 DSP Engine ................................................................ 18 dsPIC33FJ12GP201/202 .............................................. 8 dsPIC33FJ12GP201/202 CPU Core........................... 12 dsPIC33FJ12GP201/202 Oscillator System ............... 87 dsPIC33FJ12GP201/202 PLL..................................... 89 Input Capture ............................................................ 127 Output Compare ....................................................... 132 PLL.............................................................................. 89 Reset System.............................................................. 53 Shared Port Structure ................................................. 99 SPI ............................................................................ 136 Timer2 (16-bit) .......................................................... 123 Timer2/3 (32-bit) ....................................................... 122 UART ........................................................................ 153 Watchdog Timer (WDT) ............................................ 177 C C Compilers MPLAB C18 .............................................................. 188 MPLAB C30 .............................................................. 188 Clock Switching................................................................... 95 Enabling ...................................................................... 95 Sequence.................................................................... 95 Code Examples Erasing a Program Memory Page............................... 51 Initiating a Programming Sequence............................ 52 Loading Write Buffers ................................................. 52 Port Write/Read ........................................................ 100 PWRSAV Instruction Syntax....................................... 97 Code Protection ........................................................ 173, 178 Configuration Bits.............................................................. 173 Description (Table).................................................... 174 Configuration Register Map .............................................. 173 Configuring Analog Port Pins ............................................ 100 CPU Control Register .......................................................... 14 © 2007 Microchip Technology Inc. CPU Clocking System ........................................................ 88 Options ....................................................................... 88 Selection..................................................................... 88 Customer Change Notification Service............................. 237 Customer Notification Service .......................................... 237 Customer Support............................................................. 237 D Data Accumulators and Adder/Subtracter .......................... 19 Data Space Write Saturation ...................................... 21 Overflow and Saturation ............................................. 19 Round Logic ............................................................... 20 Write Back .................................................................. 20 Data Address Space........................................................... 25 Alignment.................................................................... 25 Memory Map for dsPIC33FJ12GP201/202 Devices with 1 KB RAM...................................... 26 Near Data Space ........................................................ 25 Software Stack ........................................................... 38 Width .......................................................................... 25 DC Characteristics............................................................ 192 I/O Pin Input Specifications ...................................... 197 I/O Pin Output Specifications.................................... 198 Idle Current (IDOZE) .................................................. 196 Idle Current (IIDLE) .................................................... 195 Operating Current (IDD) ............................................ 194 Power-Down Current (IPD)........................................ 196 Program Memory...................................................... 199 Temperature and Voltage Specifications.................. 193 Development Support ....................................................... 187 DSP Engine ........................................................................ 17 Multiplier ..................................................................... 19 E Electrical Characteristics .................................................. 191 AC............................................................................. 200 Equations A/D Conversion Clock Period ................................... 163 Calculating the PWM Period..................................... 130 Calculation for Maximum PWM Resolution .............. 130 Device Operating Frequency...................................... 88 Relationship Between Device and SPI Clock Speed ............................................................... 138 Serial Clock Rate...................................................... 143 UART Baud Rate with BRGH = 0 ............................. 154 UART Baud Rate with BRGH = 1 ............................. 154 Errata .................................................................................... 6 F Flash Program Memory ...................................................... 47 Control Registers........................................................ 48 Operations .................................................................. 48 Programming Algorithm .............................................. 51 RTSP Operation ......................................................... 48 Table Instructions ....................................................... 47 Flexible Configuration ....................................................... 173 FSCM Delay for Crystal and PLL Clock Sources .................. 57 Device Resets ............................................................ 57 Preliminary DS70264B-page 233 dsPIC33FJ12GP201/202 I M I/O Ports .............................................................................. 99 Parallel I/O (PIO)......................................................... 99 Write/Read Timing .................................................... 100 I2C Addresses ................................................................. 145 Baud Rate Generator ................................................ 143 General Call Address Support .................................. 145 Interrupts ................................................................... 143 IPMI Support ............................................................. 145 Master Mode Operation Clock Arbitration................................................ 146 Multi-Master Communication, Bus Collision and Bus Arbitration ................................... 146 Operating Modes ...................................................... 143 Registers ................................................................... 143 Slave Address Masking ............................................ 145 Slope Control ............................................................ 146 Software Controlled Clock Stretching (STREN = 1).. 145 I2C Module I2C1 Register Map ...................................................... 32 In-Circuit Debugger ........................................................... 178 In-Circuit Emulation........................................................... 173 In-Circuit Serial Programming (ICSP) ....................... 173, 178 Infrared Support Built-in IrDA Encoder and Decoder ........................... 155 External IrDA, IrDA Clock Output.............................. 155 Input Capture Registers ................................................................... 128 Input Change Notification.................................................. 100 Instruction Addressing Modes............................................. 38 File Register Instructions ............................................ 38 Fundamental Modes Supported.................................. 39 MAC Instructions......................................................... 39 MCU Instructions ........................................................ 38 Move and Accumulator Instructions ............................ 39 Other Instructions........................................................ 39 Instruction Set Overview ................................................................... 182 Summary................................................................... 179 Instruction-Based Power-Saving Modes ............................. 97 Idle .............................................................................. 98 Sleep ........................................................................... 97 Internal RC Oscillator Use with WDT ........................................................... 177 Internet Address................................................................ 237 Interrupt Control and Status Registers................................ 63 IECx ............................................................................ 63 IFSx............................................................................. 63 INTCON1 .................................................................... 63 INTCON2 .................................................................... 63 IPCx ............................................................................ 63 Interrupt Setup Procedures ................................................. 85 Initialization ................................................................. 85 Interrupt Disable.......................................................... 85 Interrupt Service Routine ............................................ 85 Trap Service Routine .................................................. 85 Interrupt Vector Table (IVT) ................................................ 59 Interrupts Coincident with Power Save Instructions............ 98 Memory Organization ......................................................... 23 Microchip Internet Web Site.............................................. 237 Modulo Addressing ............................................................. 40 Applicability................................................................. 41 Operation Example ..................................................... 40 Start and End Address ............................................... 40 W Address Register Selection .................................... 40 MPLAB ASM30 Assembler, Linker, Librarian ................... 188 MPLAB ICD 2 In-Circuit Debugger ................................... 189 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator .................................................... 189 MPLAB Integrated Development Environment Software.. 187 MPLAB PM3 Device Programmer .................................... 189 MPLAB REAL ICE In-Circuit Emulator System ................ 189 MPLINK Object Linker/MPLIB Object Librarian ................ 188 J JTAG Boundary Scan Interface ........................................ 173 DS70264B-page 234 N NVM Module Register Map .............................................................. 37 O Open-Drain Configuration................................................. 100 Output Compare ............................................................... 129 Registers .................................................................. 133 P Packaging ......................................................................... 225 Details....................................................................... 226 Marking ..................................................................... 225 Peripheral Module Disable (PMD) ...................................... 98 Peripheral Pin Select Input Register Map ..................................................... 33 PICSTART Plus Development Programmer..................... 190 Pinout I/O Descriptions (table).............................................. 9 PMD Module Register Map .............................................................. 37 POR and Long Oscillator Start-up Times ........................... 57 PORTA Register Map .............................................................. 36 PORTB Register Map .............................................................. 36 Power-Saving Features ...................................................... 97 Clock Frequency and Switching ................................. 97 Program Address Space..................................................... 23 Construction ............................................................... 43 Data Access from Program Memory Using Program Space Visibility..................................... 46 Data Access from Program Memory Using Table Instructions ......................................................... 45 Data Access from, Address Generation ..................... 44 Memory Map............................................................... 23 Table Read Instructions TBLRDH ............................................................. 45 TBLRDL.............................................................. 45 Visibility Operation ...................................................... 46 Program Memory Interrupt Vector ........................................................... 24 Organization ............................................................... 24 Reset Vector ............................................................... 24 Pulse-Width Modulation Mode.......................................... 130 PWM Duty Cycle ................................................................ 130 Period ....................................................................... 130 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 R S Reader Response ............................................................. 238 Registers AD1CHS0 (ADC1 Input Channel 0 Select ................ 170 AD1CHS123 (ADC1 Input Channel 1, 2, 3 Select) ... 168 AD1CON1 (ADC1 Control 1) .................................... 164 AD1CON2 (ADC1 Control 2) .................................... 166 AD1CON3 (ADC1 Control 3) .................................... 167 AD1CSSL (ADC1 Input Scan Select Low)................ 171 AD1PCFGL (ADC1 Port Configuration Low) ............ 171 CLKDIV (Clock Divisor)............................................... 92 CORCON (Core Control) ...................................... 16, 64 I2CxCON (I2Cx Control) ........................................... 147 I2CxMSK (I2Cx Slave Mode Address Mask) ............ 151 I2CxSTAT (I2Cx Status) ........................................... 149 ICxCON (Input Capture x Control) ............................ 128 IEC0 (Interrupt Enable Control 0) ............................... 72 IEC1 (Interrupt Enable Control 0) ............................... 74 IEC4 (Interrupt Enable Control 0) ............................... 75 IFS0 (Interrupt Flag Status 0) ..................................... 68 IFS1 (Interrupt Flag Status 1) ..................................... 70 IFS4 (Interrupt Flag Status 4) ..................................... 71 INTCON1 (Interrupt Control 1).................................... 65 INTCON2 (Interrupt Control 2).................................... 67 INTTREG Interrupt Control and Status Register......... 84 IPC0 (Interrupt Priority Control 0) ............................... 76 IPC1 (Interrupt Priority Control 1) ............................... 77 IPC16 (Interrupt Priority Control 16) ........................... 83 IPC2 (Interrupt Priority Control 2) ............................... 78 IPC3 (Interrupt Priority Control 3) ............................... 79 IPC4 (Interrupt Priority Control 4) ............................... 80 IPC5 (Interrupt Priority Control 5) ............................... 81 IPC7 (Interrupt Priority Control 7) ............................... 82 NVMCON (Flash Memory Control) ............................. 49 NVMCON (Nonvolatile Memory Key).......................... 50 OCxCON (Output Compare x Control) ..................... 133 OSCCON (Oscillator Control) ..................................... 90 OSCTUN (FRC Oscillator Tuning) .............................. 94 PLLFBD (PLL Feedback Divisor)................................ 93 RCON (Reset Control) ................................................ 54 SPIxCON1 (SPIx Control 1)...................................... 140 SPIxCON2 (SPIx Control 2)...................................... 142 SPIxSTAT (SPIx Status and Control) ....................... 139 SR (CPU Status)................................................... 14, 64 T1CON (Timer1 Control)........................................... 120 T2CON Control ......................................................... 124 T3CON Control ......................................................... 125 UxMODE (UARTx Mode).......................................... 156 UxSTA (UARTx Status and Control)......................... 158 Reset Clock Source Selection............................................... 56 Special Function Register Reset States ..................... 57 Times .......................................................................... 56 Reset Sequence ................................................................. 59 Resets ................................................................................. 53 Serial Peripheral Interface (SPI) ....................................... 135 Setup for Continuous Output Pulse Generation ............... 129 Setup for Single Output Pulse Generation........................ 129 Software Simulator (MPLAB SIM) .................................... 188 Software Stack Pointer, Frame Pointer CALL Stack Frame ..................................................... 38 Special Features of the CPU ............................................ 173 SPI Master, Frame Master Connection ........................... 137 Master/Slave Connection ......................................... 137 Slave, Frame Master Connection ............................. 138 Slave, Frame Slave Connection ............................... 138 SPI Module SPI1 Register Map ..................................................... 32 Symbols Used in Opcode Descriptions ............................ 180 System Control Register Map .............................................................. 36 © 2007 Microchip Technology Inc. T Temperature and Voltage Specifications AC............................................................................. 200 Timer1 .............................................................................. 119 Timer2/3 ........................................................................... 121 Timing Characteristics CLKO and I/O ........................................................... 203 Timing Diagrams 10-bit A/D Conversion .............................................. 223 10-bit A/D Conversion (CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000) .................................. 223 12-bit A/D Conversion (ASAM = 0, SSRC = 000)..... 222 External Clock .......................................................... 201 I2Cx Bus Data (Master Mode) .................................. 215 I2Cx Bus Data (Slave Mode) .................................... 217 I2Cx Bus Start/Stop Bits (Master Mode)................... 215 I2Cx Bus Start/Stop Bits (Slave Mode)..................... 217 Input Capture (CAPx) ............................................... 208 OC/PWM .................................................................. 209 Output Compare (OCx) ............................................ 208 Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer............................... 204 SPIx Master Mode (CKE = 0) ................................... 210 SPIx Master Mode (CKE = 1) ................................... 211 SPIx Slave Mode (CKE = 0) ..................................... 212 SPIx Slave Mode (CKE = 1) ..................................... 213 Timer1, 2 and 3 External Clock ................................ 206 Timing Requirements CLKO and I/O ........................................................... 203 DCI AC-Link Mode.................................................... 219 DCI Multi-Channel, I2S Modes ................................. 219 External Clock .......................................................... 201 Input Capture............................................................ 208 Timing Specifications 10-bit A/D Conversion Requirements ....................... 224 12-bit A/D Conversion Requirements ....................... 222 I2Cx Bus Data Requirements (Master Mode)........... 216 I2Cx Bus Data Requirements (Slave Mode)............. 218 Output Compare Requirements................................ 208 PLL Clock ................................................................. 202 Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements ................................................... 205 Simple OC/PWM Mode Requirements ..................... 209 SPIx Master Mode (CKE = 0) Requirements............ 210 SPIx Master Mode (CKE = 1) Requirements............ 211 Preliminary DS70264B-page 235 dsPIC33FJ12GP201/202 SPIx Slave Mode (CKE = 0) Requirements .............. 212 SPIx Slave Mode (CKE = 1) Requirements .............. 214 Timer1 External Clock Requirements ....................... 206 Timer2 External Clock Requirements ....................... 207 Timer3 External Clock Requirements ....................... 207 U UART Baud Rate Generator (BRG)............................................... 154 Break and Sync Transmit Sequence ........................ 155 Flow Control Using UxCTS and UxRTS Pins............ 155 Receiving in 8-bit or 9-bit Data Mode........................ 155 Transmitting in 8-bit Data Mode ................................ 155 Transmitting in 9-bit Data Mode ................................ 155 UART Module UART1 Register Map .................................................. 32 V Voltage Regulator (On-Chip)............................................. 176 W Watchdog Timer (WDT) ............................................ 173, 177 Programming Considerations ................................... 177 WWW Address.................................................................. 237 WWW, On-Line Support........................................................ 6 DS70264B-page 236 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2007 Microchip Technology Inc. Preliminary DS70264B-page 237 dsPIC33FJ12GP201/202 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y Device: dsPIC33FJ12GP201/202 N Literature Number: DS70264B Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70264B-page 238 Preliminary © 2007 Microchip Technology Inc. dsPIC33FJ12GP201/202 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. dsPIC 33 FJ 12 GP2 02 T E / SP - XXX Examples: a) Microchip Trademark Architecture dsPIC33FJ12GP202-E/SP: General purpose dsPIC33, 12 KB program memory, 28-pin, Extended temp., SPDIP package. Flash Memory Family Program Memory Size (KB) Product Group Pin Count Tape and Reel Flag (if applicable) Temperature Range Package Pattern Architecture: 33 = 16-bit Digital Signal Controller Flash Memory Family: FJ = Flash program memory, 3.3V Product Group: GP2 = General purpose family Pin Count: 01 02 = = 18-pin 28-pin Temperature Range: I E = = -40°C to +85°C (Industrial) -40°C to +125°C (Extended) Package: P SP SO ML = = = = Plastic Dual In-Line - 300 mil body (PDIP) Skinny Plastic Dual In-Line - 300 mil body (SPDIP) Plastic Small Outline - Wide, 300 mil body (SOIC) Plastic Quad, No Lead Package - 6x6 mm body (QFN) © 2007 Microchip Technology Inc. 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