Cypress CY29430FLQXIT Low-noise pll for high-performance clock application Datasheet

CY29430
High-Performance Clock Synthesizer
High-Performance Clock Synthesizer
Features
Functional Description
■
Low-noise PLL for high-performance clock applications
■
Differential Clock Output: Four frequencies selectable,
reconfigurable by I2C
■
Output frequency support from 15 MHz to 2.1 GHz
■
Fractional N PLL with fully integrated VCO
■
Works on third overtone (OT3) of a fixed frequency crystal, Low
frequency fundamental (LFF), High frequency fundamental
(HFF) mode crystal and Low Frequency Input
■
LVPECL, CML, HCSL, LVDS or LVCMOS output standards
available
■
Compatible with 3.3 V, 2.5 V, and 1.8 V supply
■
150 fs typical integrated jitter performance (12 kHz to 20 MHz
frequency offsets) for output greater than 150 MHz
The CY29430 is a Programmable PLL based crystal oscillator
solution with flexible output frequency options. It is field and
factory programmable for any output frequency between 15 MHz
and 2.1 GHz. Four frequencies are independently programmable
on the differential output with the frequency select (FS) pins.
Additionally, other frequency options can be configured with the
I2C interface. Using advanced design technology, it provides
excellent jitter performance across the entire output frequency
range working reliably at supply voltages from 1.8 V to 3.3 V for
ambient temperatures from –40 °C to +105 °C. This makes it
ideally suited for communications applications (for example,
OTN, SONET/SDH, xDSL, GbE, Networking, Wireless
Infrastructure), test and instrumentation applications, and high
speed data converters. Additionally, the VCXO function enables
the use of CY29430 in applications requiring a clock source with
voltage control and in discrete clocking solutions for
synchronous timing applications.
■
VCXO functionality provided with tunable Total Pull Range
(TPR) from +/- 50 ppm to +/- 275 ppm
The CY29430 device configuration can be created using
ClockWizard 2.1. For programming support, contact Cypress
technical support or send an email to [email protected].
■
16 pin QFN package: 3 × 3 × 0.6 mm
For a complete list of related documentation, click here.
Logic Block Diagram
VDD
GND
VDDO
CLK_P
XOUT
Crystal
Oscillator
Fractional - N
Output
Dividers
LC VCO Based PLL
Output
Drivers
CLK_N
CLK_SE
XIN
Digital Configuration and Control
I2C
Interface
NVM
SCL
FS[1:0]
Cypress Semiconductor Corporation
Document Number: 002-11000 Rev. *E
•
ADC + Digital Filtering Pathway
(for VCXO Function)
SDA
198 Champion Court
VC
•
OE
San Jose, CA 95134-1709
•
408-943-2600
Revised February 3, 2017
CY29430
Contents
Pin Diagram ....................................................................... 3
Pin Description ................................................................. 3
Functional Overview ........................................................ 4
Programmable Features .............................................. 4
Architecture Overview ................................................. 4
Internal State Diagram ................................................ 5
Small/Large Changes .................................................. 5
Programming Support ................................................. 5
Frequency Configurations ........................................... 5
Programmable OE Polarity .......................................... 5
Programmable VCXO .................................................. 5
Power Supply Sequencing .......................................... 5
I2C Interface ................................................................ 5
Memory Map ............................................................... 6
Absolute Maximum Ratings ............................................ 7
Recommended Operating Conditions ............................ 7
DC Electrical Specifications ............................................ 7
DC Specifications ............................................................. 8
DC Specifications ............................................................. 8
DC Specifications ............................................................. 8
DC Specifications ............................................................. 8
DC Specifications ............................................................. 9
VCXO Specific Parameters .............................................. 9
AC Electrical Specifications .......................................... 10
AC Electrical Specifications .......................................... 11
Document Number: 002-11000 Rev. *E
AC Electrical Specifications .......................................... 11
HFF Crystal Specifications ............................................ 12
OT3 Crystal Specifications ............................................ 12
LFF Crystal Specifications ............................................ 12
LF Low Frequency Reference ....................................... 13
Timing Parameters ......................................................... 13
Input Clock Measurement Point .................................... 13
Phase Jitter Characteristics .......................................... 14
I2C Bus Timing Specifications ...................................... 14
Voltage and Timing Definitions ..................................... 15
Phase Noise Plots .......................................................... 17
Ordering Information ...................................................... 20
Ordering Code Definitions ......................................... 20
Package Diagram ............................................................ 21
Acronyms ........................................................................ 22
Document Conventions ................................................. 22
Units of Measure ....................................................... 22
Document History Page ................................................. 23
Sales, Solutions, and Legal Information ...................... 24
Worldwide Sales and Design Support ....................... 24
Products .................................................................... 24
PSoC®Solutions ....................................................... 24
Cypress Developer Community ................................. 24
Technical Support ..................................................... 24
Page 2 of 24
CY29430
Pin Diagram
OE
3
NC1
4
XIN
GND
VDD
14
13
E-PAD
GND
12
GND
11
CLK_SE
10
CLK_P
9
CLK_N
5
6
7
8
VDDO
2
15
SCL
SDA
16
FS1
1
FS0
VC
XOUT
CY29430 PINOUT
Pin Description
Name
Pin Number
Description
[1]
VC
1
Input Voltage for VCXO
SDA
2
Serial Data input/output for I2C
OE
3
Output Enable input
NC1
4
No Connect
FS0
5
Frequency Select-0 (100 k pull-down)
FS1
6
Frequency Select-1 (100 k pull-down)
SCL
7
Serial Clock input for I2C
8
Power supply for output Driver
[2]
9
Complementary Clock Output
[2]
10
True Clock Output
CLK_SE
11
(Optional) LVCMOS clock output
GND
12
Supply Ground for Output Driver
VDD
13
Power supply for core
GND
14
Supply ground
VDDO
CLK_N
CLK_P
[2]
XIN
15
Crystal or Clock reference input
XOUT
16
Crystal reference output, leave floating in case clock input for XIN
E-PAD
Exposed Pad. Must be connected to ground
Note
1. If VC is unused, do not leave it floating; connect it to VDD or GND.
2. CLK_SE and (CLK_P, CLK_N) will not be available at the same time. VDD should be equal VDDO.
Document Number: 002-11000 Rev. *E
Page 3 of 24
CY29430
Functional Overview
Programmable Features
Figure 1. Conceptual Memory Structure
Table 1. Programmable Features
Feature
Program eFuse
Description
Frequency
Tuning
Frequency for the PLL
Function
OE Polarity
Power Supply
VDD (1.8, 2.5 or 3.3 V)
Reset
Oscillator tuning (load capacitance values)
Enable/Disable VCXO
VCXO
Function
Reference
“NVMCopy”
Volatile
M
U
X
I2C
FS[0‐1]
Chip
Settings
Kv Polarity
Total Pull Range
Modulation Bandwidth
Output
“eFuse”
Non‐Volatile
Output Standard (LVPECL, LVDS, HCSL, CML
or LVCMOS)
I2C address
4-/ 2-/ 1- Default Frequency
Figure 2. Memory structure for configurations
Crystal (HFF, OT3, LFF) or Clock input
FS0 Profile
FS1 Profile
FS2 Profile
FS3 Profile
VCXO Function
VDD
I2C
Output Standard
LOCK
Input Reference
Architecture Overview
The CY29430 is a high-performance programmable PLL crystal
oscillator supporting multiple functions and multiple output
standards. The device has internal one-time programmable
(OTP) nonvolatile memory (NVM) that can be partitioned into
Common Device Configurations and Output frequency-related
Information (see Figure 2). The Common Device Configurations
do not change with output frequency and consist of chip power
supply, OE polarity, I2C device address, input reference, output
standards, and VCXO. The
device also contains volatile
memory that stores an exact copy of the NVM at the release of
reset on Power ON. The Chip settings depend on the contents
of the volatile memory and the output frequency depends on the
configurations, as explained in Figure 1. The volatile memory
can be accessed through the I2C bus and modified.
Document Number: 002-11000 Rev. *E
Frequency
Information
Common
Device
Configurations
Description of Settings for the Memory Structure
■
Profile[FS0-3]: Frequency information
■
VCXO Function: VCXO enable/disable, TPR, modulation
bandwidth and Kv (Slope for VC vs. Frequency) information
■
VDD: 1.8-/2.5-/3.3V range information
■
I2C: enable/disable, I2C address information
■
Output Standards: LVPECL, LVDS, CML, HCSL or LVCMOS
■
LOCK pattern: 2-bit pattern to indicate eFuse lock
■
Input Reference: Crystal (OT3, HFF, LFF) or Clock
Page 4 of 24
CY29430
Internal State Diagram
Programming Support
The CY29430 contains a state machine which controls the
device behavior. The state machine loads the “eFuse” contents
to “NVMCopy” after reset as indicated in Figure 3. The state
machine enters one of the following states: “Command Wait
state” or “Active state” according to the value of LOCK. In the
“Command Wait state” state, user may access all the registers
and read/write the “NVMCopy” contents. The following
commands can be used in the “Command Wait state”:
The CY29430 is a software-configurable solution in which
Cypress provides a Programming Specification that defines all
necessary configuration bits. This information is used by the
customer to develop programming software for use with their
programmer hardware.
■
Program eFuse
❐ Selectively Program eFuse
■
Copy eFuse to NVMCopy
■
Copy NVMCopy to NVMRegister
■
Loop Lock
User may test the device functionality by issuing “Loop Lock”
command to enter the “Active state” without programming the
LOCK. The device will function according to the settings.
Figure 3. State Diagrams
Release Reset on Power
LOCK
= "10" or "01"
LOCK=“10”
LOCK=“00”
Loop Lock
Active state
Output Clock
Small Change
Large Change
When the LOCK is programmed to "10" or "01" the device goes
into the “Active state” and output clock is available after the
completion of the power ON cycle.
In the “Active state”, user may change the output frequency by
applying “Small Change” or “Large Change” commands.
Small/Large Changes
Small change refers to the case where the frequency is changing
within ±500 ppm. The frequency information will be loaded
through I2C and the output frequency will change without any
glitch from its original frequency to the new frequency. Note. the
small change functionality is not supported in the Integer mode
PLL. For more information, see AC Electrical Specifications for
LVPECL, LVDS, CML Outputs.
Large change refers to the case where the frequency is changing
more than ±500 ppm and is done through an I2C or FS state
change. The device will recalibrate and reconfigure the PLL and
the output will be unstable until this process is completed.
Document Number: 002-11000 Rev. *E
The FS[0-3] setting is done based on the logic levels on the FS0
and FS1 pins as indicated in the Table 5 on page 6. The
Frequency Configuration consists of the desired output
frequency corresponding to each of the FS[0–3] setting. The
Fractional-N PLL is loaded with values required to generate the
frequency for each of these settings based on the input crystal
frequency. The Frequency configuration for FS[0–3] is provided
in Table 3.
Programmable OE Polarity
The CY29430 contains a bit for OE polarity setting (default is
active-low). User can choose active-high or active-low polarity
for the OE function. The output will be disabled when OE is
deasserted
Programmable VCXO
Copy “eFuse” to “NVMCopy”
Command Wait State
Frequency Configurations
The device incorporates a proprietary technique for modulating
frequency by modifying VCO frequency according to the VC
control voltage. The pull profile is linear and accurate comparing
with pulling the OT3/HFF reference. Also, the VCXO
characteristics are very stable and do not vary over temperature,
supply voltage or process variations.
Kv (Slope for frequency vs. VC), TPR VC bandwidth and VCXO
on/off are all programmable.Note. the VCXO functionality is not
supported in the Integer mode PLL.
Power Supply Sequencing
The CY29430 does not require any specific sequencing for
startup. Startup requires a monotonic VDD ramp specified in the
datasheet. After the ramp up, VDD has to be maintained within
the limits specified for it in the Recommended Operating
Conditions. Brownout detection and protection has to be
implemented elsewhere in the system.
Other input signals, VC, FS0 or FS1, can power up earlier or later
than VDD, there are no timing requirement for those input signals
with reference to VDD. The device will operate normally when all
of the input signals are settled in the configured state.
If a TCXO or external clock is fed into the XIN/XOUT inputs, a
stable input has to be present before start of the VDD ramp up to
the specified level. This is because the on-chip frequency
calibration process starts at Power ON and requires a stable
reference input to be available at the start of the process.
I2C Interface
The CY29430 supports two-wire serial interface and I2C in Fast
Mode (400 kbits/s) and 7-bit addressing. The device address is
programmable and is 55h by default. It supports single-byte
access only. The first I2C access to the device has to be 5 ms
(minimum) after VDD reaches its minimum specified voltage.
Page 5 of 24
CY29430
Memory Map
The user must write all the contents created by the Configuration
tool. Partial updates to the device is not allowed.
Table 2. Common Configurations
Memory Address
50h–57h
Description
Device configurations
Table 3. FS[0-3]: Frequency Configurations
Memory Address
Description
10h, 20h, 30h, 40h
DIVO
11h, 21h, 31h, 41h
DIVO, DIVN_INT
12h, 22h, 32h, 42h
ICP,DIVN_INT, PLL_MODE
13h, 23h, 33h, 43h
DIVN_FRAC_L
14h, 24h, 34h, 44h
DIVN_FRAC_M
15h, 25h, 35h, 45h
DIVN_FRAC_H
1xh = FS0, 2xh = FS1,
3xh = FS2, 4xh = FS3
Access to locations other than those described here may cause
fatal error in device operation.
Table 5. FS Setting
FS1
FS0
FS Setting
0
0
FS0
0
1
FS1
1
0
FS2
1
1
FS3
–
Table 4. Miscellaneous Information
Memory Address
Description
00h (Read only)
Device ID (= 51h)
D4h–D6h
User configurable information
Document Number: 002-11000 Rev. *E
Page 6 of 24
CY29430
Absolute Maximum Ratings
Exceeding maximum ratings [3] may shorten the useful life of the
device. User guidelines are not tested.
Supply voltage to ground potential .............–0.5 V to + 3.8 V
Input voltage ...............................................–0.5 V to + 3.8 V
Storage temperature (non-condensing) ... –55 C to +150 C
Junction temperature ............................... –40 C to +125 C
Programming temperature ....................... +25 C to +125 C
Programming voltage .......................................2.5 V ± 0.1 V
Supply Current for eFuse Programming ..................... 50 mA
Data retention at TJ = 125 C ...............................> 10 years
Maximum programming cycles ............................................1
ESD HBM (JEDEC JS-001-2012) ............................ 2000 V
ESD MM (JEDEC JESD22-A115B) ............................. 200 V
ESD CDM (JEDEC JESD22-C101E) ........................... 500V
Latch up current ...................................................... ±140 mA
Recommended Operating Conditions
Parameter
VDD, VDDO
TA
fRES
TPLLHOLD
Description
Supply voltage, 1.8 V operating range, 1.8 V ± 5%
Supply voltage, 2.5 V operating range, 2.5 V ± 10%
Supply voltage, 3.3 V operating range, 3.3 V ± 10%
Ambient temperature
Frequency resolution
PLL Hold Temperature Range
Min
1.71
2.25
2.97
–40
–
–
Max
1.89
2.75
3.63
+105
2
125
Unit
V
Min
–
Typ
93
Max
106
Unit
mA
–
81
94
–
69
81
–
80
93
–
73
86
–
58
70
–
66
78
–
–
–
0.7 × VDD
–
–0.5
–
–
–
59
30
30
–
–
–
200
200
100
70
50
50
–
0.3 × VDD
3.8
–
–
–
C
ppb
C
DC Electrical Specifications
Parameter
IDD[4]
Description
Supply current, LVPECL
Supply current, LVPECL
Supply current, LVDS
Supply current, HCSL
Supply current, CML
Supply current, CMOS
Supply current, CMOS
IIH
IIL
VIH[6]
VIL[6]
VIN
RP
RD
Supply current, PLL only
Input high current
Input low current
Input high voltage
Input low voltage
Input voltage level
Internal pull-up resistance
Internal pull-down resistance
Test Conditions
VDD = 3.3 V/2.5 V,
50  to VTT (VDDO – 2.0 V), with
common mode current
VDD = 3.3 V/2.5 V,
50  to VTT (VDDO – 2.0 V), without
common mode current[5]
VDD = 3.3 V/2.5 V/1.8 V,
100  between CLKP and CLKN
VDD = 3.3 V/2.5 V/1.8 V,
33  and 49.9  to GND
VDD = 3.3 V/2.5 V/1.8 V,
50  to VDDO
VDD = 3.3 V/2.5 V/1.8 V, 0-pF load,
33.33 MHz
VDD = 3.3 V/2.5 V/1.8 V, 10-pF load,
33.33 MHz
VDD = 3.3 V/2.5 V/1.8 V
Logic input, Input = VDD
Logic input, Input = GND
OE, FS, SCL, SDA logic level = 1
OE, FS, SCL, SDA logic level = 0
All input, relative to GND
OE, configured active High
OE, configured active Low
FS0, FS1 pins
µA
µA
V
V
V
k
k
k
Notes
3. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation
of the device at these or at any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to
Absolute-Maximum-Rated conditions for extended periods may affect device reliability or cause permanent device damage.
4. IDD is the total supply current and is measured with VDD and VDDO shorted together.
5. In ClockWizard 2.1, setting the output standard to LVPECL2 configures the output to "LVPECL without common mode current". Refer to AN210253 for LVPECL
terminations for different use case configurations.
6. I2C operation applicable for VDD of 1.8 V and 2.5 V only.
Document Number: 002-11000 Rev. *E
Page 7 of 24
CY29430
DC Specifications for LVDS Output
(VDDO = 1.8-V, 2.5-V, or 3.3-V range)
Parameter
Description
VOCM[7]
Output common-mode voltage
VOCM
Change in VOCM between
complementary output states
IOZ
Output leakage current
Conditions
Min
Typ
Max
Units
1.125
1.200
1.375
V
–
–
–
50
mV
Output off, VOUT = 0.75 V to 1.75 V
–20
–
20
A
VDDO = 2.5-V or 3.3-V range
DC Specifications for LVPECL Output
(VDDO = 2.5-V or 3.3-V range, with common mode current)
Parameter
Description
Conditions
Min
Typ
Max
Units
VOH
Output high voltage
R-term = 50  to VTT
(VDDO – 2.0 V)
VDDO – 1.165
–
VDDO – 0.800
V
VOL
Output low voltage
R-term = 50  to VTT
(VDDO – 2.0 V)
VDDO – 2.0
–
VDDO – 1.55
V
Min
Typ
Max
Units
DC Specifications For CML Output
(VDDO = 1.8-V, 2.5-V, or 3.3-V range)
Parameter
Description
Conditions
VOH
Output high voltage
R-term = 50  to VDDO
VOL
Output low voltage
R-term = 50  to VDDO
VDDO – 0.085 VDDO – 0.01
VDDO – 0.6
VDDO – 0.4
VDDO
V
VDDO – 0.32
V
DC Specifications for HCSL Output
(VDDO = 1.8-V, 2.5-V or 3.3-V range)
Parameter
Description
Min
Typ
Max
Units
Measurement taken from
single-ended waveform
–
–
1150
mV
Min output low voltage
Measurement taken from
single-ended waveform
–300
–
–
mV
VOHDIFF
Differential output high voltage
Measurement taken from differential
waveform
150
–
–
mV
VOLDIFF
Differential output low voltage
Measurement taken from differential
waveform
–
–
–150
mV
VCROSS[8]
Absolute crossing point voltage
Measurement taken from
single-ended waveform
250
–
600
mV
–
–
140
mV
VMAX[8]
Max output high voltage
VMIN[8]
Conditions
VCROSSDELTA[8] Variation of VCROSS over all rising Measurement taken from
clock edges
single-ended waveform
Notes
7. Requires external AC coupling for VDDO = 1.8-V range, as indicated in Figure 9. The common-mode voltage of 1.2V has to be generated and applied externally.
8. Parameters are guaranteed by design and characterization. Not 100% tested in production.
Document Number: 002-11000 Rev. *E
Page 8 of 24
CY29430
DC Specifications for LVCMOS Output
Parameter
Description
Output high voltage
VOH
Output low voltage
VOL
Conditions
Min
Typ
Max
Units
VDDO – 0.2
–
–
V
4 mA load, VDD = 3.3 V
VDDO – 0.3
–
–
4 mA load, VDD = 1.8 V and 2.5 V
VDDO – 0.4
–
–
100 A load
–
–
0.2
4 mA load
–
–
0.3
Min
Typ
Max
Units
100 A load
V
VCXO Specific Parameters
Parameter[9]
Description
Condition
TPR
Total Pull Range
VC range 0.1 × VDD to 0.9 × VDD
+50
–
+275
ppm
KBSL
Best-fit Straight Line (BSL)
linearity
Deviation from BSL line
–5
–
5
%
KINC
Incremental linearity
Kv slope deviation
–10
–
10
%
KBW
Bandwidth of Kv modulation
Programmable
5
10
20
kHz
KRANGE
voltage range on the control port –
permissible
0
–
VDD
V
VCTYP
Nominal center voltage
–
0.5 × VDD
–
V
RVCIN
[10]
VRANGE
VC control voltage
Input resistance for VC
–
Input voltage range
range of input possible at control
port
5
–
–
M
0.1 × VDD
–
0.9 × VDD
V
Notes
9. Parameters are guaranteed by design and characterization. Not 100% tested in production.
10. RVCIN is 100% tested.
Document Number: 002-11000 Rev. *E
Page 9 of 24
CY29430
AC Electrical Specifications for LVPECL, LVDS, CML Outputs
(VDD = 3.3 V and 2.5 V for LVPECL, with common mode current, and VDD = 3.3 V, 2.5 V, and 1.8 V for LVDS and CML outputs)
Parameter[10]
Description
Details/Conditions
Min
Typ
Max
Unit
fOUT
Clock Output Frequency
LVPECL, CML, LVDS output
standards
15
–
2100
MHz
tRF
LVPECL Output Rise/Fall Time
20% to 80% of AC levels.
Measured at 156.25 MHz for PECL
outputs.
–
–
350
ps
CML Output Rise/Fall Time
20% to 80% of AC levels.
Measured at 156.25 MHz for CML
outputs.
–
–
350
ps
LVDS Output Rise/Fall Time
20% to 80% of AC levels.
Measured at 156.25 MHz for LVDS
outputs.
–
–
350
ps
tODC
Output Duty Cycle
Measured at differential 50% level,
156.25 MHz.
45
50
55
%
VP
LVDS output differential peak
15 MHz to 700 MHz
247
–
454
mV
VP
LVDS output differential peak
700 MHz to 2100 MHz
150
–
454
mV
VP
Change in VP between
complementary output states
–
–
50
mV
VP
LVPECL output differential peak fOUT = 15 MHz to 325 MHz
450
–
–
mV
–
VP
fOUT = 325 MHz to 700 MHz
350
–
–
mV
VP
fOUT = 700 MHz to 2100 MHz
250
–
–
mv
VP
CML output differential peak
fOUT = 15 MHz to 700 MHz
250
–
600
mV
VP
CML output differential peak
fOUT = 700 MHz to 2100 MHz
200
–
600
mV
tCCJ
Cycle to Cycle Jitter
pk, measured at differential signal,
156.25 MHz, over 10k cycles,
100 MHz–130 MHz crystal
–
–
50
ps
tPJ
Period Jitter
pk-pk, measured at differential
signal, 156.25 MHz, over 10k
cycles, 100 MHz–130 MHz crystal
–
–
50
ps
JRMS
RMS Phase Jitter
fOUT = 156.25 MHz,
12 kHz–20 MHz offset, non-VCXO
mode
–
150
250
fs
Non-VCXO Mode
PN1k
Phase Noise, 1 kHz Offset
100 MHz–130 MHz crystal
reference, fOUT = 156.25 MHz
–
–
-113
dBc/Hz
PN10k
Phase Noise, 10 kHz Offset
100 MHz–130 MHz crystal
reference, fOUT = 156.25 MHz
–
–
-127
dBc/Hz
PN100k
Phase Noise, 100 kHz Offset
100 MHz–130 MHz crystal
reference, fOUT = 156.25 MHz
–
–
-135
dBc/Hz
PN1M
Phase Noise, 1MHz Offset
100 MHz–130 MHz crystal
reference, fOUT = 156.25 MHz
–
–
-144
dBc/Hz
PN10M
Phase Noise, 10 MHz Offset
100 MHz–130 MHz crystal
reference, fOUT = 156.25 MHz
–
–
–152
dBc/Hz
PN-SPUR
Spur
At frequency offsets equal to and
greater than the update rate of the
PLL
–
–
–65
dBc/Hz
Note
11. Parameters are guaranteed by design and characterization. Not 100% tested in production.
Document Number: 002-11000 Rev. *E
Page 10 of 24
CY29430
AC Electrical Specifications for HCSL Output
Parameter [12]
fOUT
Description
Output frequency
Test Conditions
HCSL
Min
Typ
Max
Units
15
–
700
MHz
[13]
V/ns
ER
Rising edge rate
Measured taken from differential
waveform, –150 mV to +150 mV
0.6
–
5.7
EF
Falling edge rate
Measured taken from differential
waveform, –150 mV to +150 mV
0.6
–
5.7 [13]
V/ns
tSTABLE
Time before voltage ring back
(VRB) is allowed
Measured taken from differential
waveform, –150 mV to +150 mV
500
–
–
ps
R-F_MATCHING Rise-Fall matching
Measured taken from
single-ended waveform, rising
edge rate to falling edge rate
matching, 100 MHz
–100
–
100
ps
tDC
Output duty cycle
Measured taken from differential
waveform, fOUT = 100 MHz
45
–
55
%
tCCJ
Cycle to cycle Jitter
Measured taken from differential
waveform, 100 MHz
–
–
50
ps
JRMSPCIE
Random jitter, PCIE Specification 100 MHz–130 MHz crystal
3.0
–
–
1
ps
(RMS)
Min
Typ
Max
Unit
15
–
250
MHz
Measured at 1/2 VDDO, loaded,
fOUT < 100 MHz
45
–
55
%
Measured at 1/2 VDDO, loaded,
fOUT > 100 MHz
40
–
60
%
VDDO = 1.8 V, 20%–80%
–
–
2
ns
VDDO = 2.5 V, 20%–80%
–
–
1.5
ns
AC Electrical Specifications for LVCMOS Output
(Load: 10 pF < 100 MHz, 7.5 pF < 150 MHz, 5 pF > 150 MHz)
Parameter[12]
Description
fOUT
Output frequency
tDC
Output duty cycle
tRFCMOS
Rise/Fall time
Test Conditions
VDDO = 3.3 V, 20%–80%
–
–
1.2
ns
tCCJ
Cycle to cycle Jitter
pk, Measured at 1/2VDDO
over 10k cycle, fOUT = 156.25 MHz
–
–
50
ps
tPJ
Period Jitter
pk, Measured at 1/2VDDO
over 10k cycle, fOUT = 156.25 MHz
–
–
100
ps
Notes
12. Parameters are guaranteed by design and characterization. Not 100% tested in production.
13. Edge rates are higher than 4 V/ns due to jitter performance requirements.
Document Number: 002-11000 Rev. *E
Page 11 of 24
CY29430
HFF Crystal Specifications
Parameter[14]
fXTAL
Description
Crystal frequency range
Test Conditions
Min
Typ
Max
Unit
–
100
–
130
MHz
C0
Crystal shunt capacitance
–
–
–
2
pF
CL
Crystal load capacitance
–
–
5
–
pF
ESR
Crystal equivalent series
resistance
–
20
–

DL
Drive level
–
–
–
200
W
Test Conditions
Min
Typ
Max
Units
ESR = Rm (1 + C0/CL) ^ 2
Rm = Crystal motional resistance
OT3 Crystal Specifications
Parameter[14]
Description
fXTAL
Crystal frequency range
–
100
–
130
MHz
C0
Crystal shunt capacitance
–
–
–
2
pF
–
–
5
–
pF
–
60
90

–
–
–
200
W
Test Conditions
Min
Typ
Max
Units
CL
Crystal load capacitance
ESR
Crystal equivalent series
resistance
DL
Drive level
ESR = Rm (1 + C0/CL) ^ 2
Rm = Crystal motional resistance
LFF Crystal Specifications
Parameter[14]
Description
fXTAL
Crystal frequency range
–
50
–
60
MHz
C0
Crystal shunt capacitance
–
–
–
2
pF
–
–
–
8
pF
–
–
90
W
–
–
200
W
CL
Crystal load capacitance
ESR
Crystal equivalent series
resistance
DL
Drive level
ESR = Rm (1 + C0/CL) ^ 2
Rm = Crystal motional resistance
–
Note
14. Parameters are guaranteed by design and characterization. Not 100% tested in production.
Document Number: 002-11000 Rev. *E
Page 12 of 24
CY29430
LF Low Frequency Reference
(TCXO reference input)
Parameter[15]
Description
Test Conditions
Min
Typ
Max
Units
–
50
–
60
MHz
fIN
Input frequency
tDC
Input duty cycle
Measured at 1/2 input swing
40
–
60
%
VPP
pk-pk input swing
AC coupled input
0.8
–
1.2
V
VIL
Input low voltage
DC coupled input
–
–
0.2
V
VIH[16]
Input high voltage
DC coupled input
0.8
–
1.2
V
tR
Input rise time
20%–80% of input
–
–
1.5
ns
tF
Input fall time
20%–80% of input
–
–
1.5
ns
PN10K
Input phase noise
10 kHz offset
–
–
–151
dBc/Hz
PN100K
Input phase noise
100 kHz offset
–
–
–155
dBc/Hz
PN1M
Input phase noise
1 MHz offset
–
–
–156
dBc/Hz
Timing Parameters
Parameter[15]
Description
Min
Max
Unit
0.01
3000
ms
Time from minimum specified power supply to <+ 0.1 ppm accurate output
frequency clock, programmable (Clock stable within 2.2 ms (max) from VDDX Level,
refer to Input Clock Measurement Point)
–
10
ms
Time from minimum specified power supply to <+ 0.1 ppm accurate output
frequency clock, programmable (Clock stable within 5.8 ms (max) from VDDX Level,
refer to Input Clock Measurement Point)
–
15
tOEEN
Time from OE edge to output enable
–
2.5
ms
tOEDIS
Time for OE edge to output disable
–
10
s
tFS
Time form FS change to new frequency
–
2.5
ms
tFSAMLL
Frequency change time for small trigger ( ±500ppm)
–
400
s
tFLARGE
Frequency change time for large trigger (> ±500ppm)
–
2.5
ms
tCLOCK
Clock stable time delay from VDD ramp (see Figure 5), normal configuration
–
2.2
ms
Clock stable time delay from VDD ramp (see Figure 5), delay programmed
–
5.8
tPU
Supply ramp time (0.5 V to VDD(min)).
tWAKEUP[16]
Input Clock Measurement Point
Parameter
VDDX[15, 17]
Description
tCLOCK Measurement Point
Test Conditions
Min
Typ
Max
Unit
Supply voltage 1.8 V
1.4
–
–
V
Supply voltage 2.5 V
1.8
–
–
Supply voltage 3.3 V
2.3
–
–
Notes
15. Parameters are guaranteed by design and characterization. Not 100% tested in production.
16. VIH should not to exceed 0.5V when VDD = 0V.
17. Applies to TCXO/External Clock Input.
Document Number: 002-11000 Rev. *E
Page 13 of 24
CY29430
Phase Jitter Characteristics
(12 kHz to 20 MHz Integration Bandwidth)
Parameter[18]
Description
Condition
Min
Typ
Max
Units
Non VCXO functionality
JRMS
RMS jitter
fOUT = 644.53 MHz
–
110
–
fs
JRMS
RMS jitter
fOUT = 622.08 MHz
–
120
–
fs
JRMS
RMS jitter
fOUT = 156.25 MHz
–
145
–
fs
JRMS
RMS jitter
fOUT = 2.105 GHz
–
145
–
fs
Modulation bandwidth = 10 kHz, VDD = 3.3V, fOUT = 622.08 MHz
JRMS
RMS jitter
TPR = 50 ppm, Kv = 37.9 ppm/V
–
151
–
fs
JRMS
RMS jitter
TPR = 155 ppm, Kv = 117.4 ppm/V
–
158
–
fs
JRMS
RMS jitter
TPR = 275 ppm, Kv = 208.3 ppm/V
–
170
–
fs
Modulation bandwidth = 10 kHz, VDD = 2.5V, fOUT = 622.08 MHz
JRMS
RMS jitter
TPR = 50 ppm, Kv = 50 ppm/V
–
152
–
fs
JRMS
RMS jitter
TPR = 155 ppm, Kv = 155 ppm/V
–
160
–
fs
JRMS
RMS jitter
TPR = 275 ppm, Kv = 275 ppm/V
–
175
–
fs
Modulation bandwidth = 10 kHz, VDD = 1.8V, fOUT = 622.08 MHz
JRMS
RMS jitter
TPR = 50 ppm, Kv = 69.4 ppm/V
–
153
–
fs
JRMS
RMS jitter
TPR = 155 ppm, Kv = 215.3 ppm/V
–
166
–
fs
JRMS
RMS jitter
TPR = 275 ppm, Kv = 381.9 ppm/V
–
190
–
fs
Min
Typ
Max
Units
–
–
400
kHz
I2C Bus Timing Specifications
Parameter [18, 19]
Description
fSCL
SCL clock frequency
tHD:STA
Hold time START condition
0.6
–
–
s
tLOW
Low period of SCL
1.3
–
–
s
tHIGH
High period of SCL
0.6
–
–
s
tSU:STA
Setup time for a repeated START condition
0.6
–
–
s
tHD:DAT
Data hold time
0
–
–
s
tSU:DAT
Data setup time
100
–
–
ns
tR
Rise time
–
–
300
ns
tF
Fall time
–
–
300
ns
tSU:STO
Setup time for STOP condition
0.6
–
–
s
tBUF
Bus-free time between STOP and START conditions
1.3
–
–
s
Notes
18. Parameters are guaranteed by design and characterization. Not 100% tested in production.
19. I2C operation applicable for VDD of 1.8 V and 2.5 V only.
Document Number: 002-11000 Rev. *E
Page 14 of 24
CY29430
Voltage and Timing Definitions
Figure 4. Differential Output Definitions
tDC = tPW / tPERIOD
Figure 8. Output Termination Circuit
VOCM = (VA + VB) / 2
50 
tPW
VPP
OUT-N
80%
20%
20%
tR
50 
VA
80%
VB
BUF
OUT-P
VDDO – 2 V
VDDO
tPERIOD
tF
50 
TP
50 
TP
LVPECL
Figure 5. Input Clock Stable time
VDDO
VDDO
50 
BUF
VDDX
VDD
50 
50 
TP
50 
TP
50 
100 
TP
50 
TP
Stable Clock
CML
tCLOCK
VDDO
BUF
Clock Input
Figure 6. Output Enable/Disable/Frequency Select Timing
Original Clock
New Clock
LVDS
Clock
VDDO
FSx
OE
5”
33 
BUF
tOEDISt
FS
tOEEN
New Clock
TP
2 pF
33 
49.9 
Original Clock
50 
50 
49.9 
P
2 pF
HCSL
Clock
Figure 9. LVDS Termination for 1.8 V[20]
FSx
VDDO
tFS
VDD
0.1 µF
50 
50
?
Figure 7. Power Ramp and PLL Lock Time
50 
50
?
Supply
Voltage
tPU
Transmitter
VDD(min)
VOCM
Receiver
50 
50
?
0.5 V
50 
50
?
twakeup
Stable Output
0.1 µF
Output
Note
20. The termination circuit shown in this figure is specific to the LVDS output standard for VDD =1.8-V operation. This needs AC coupling (100-nF series capacitor). The
50-ohm termination resistors along with the bias voltage (VOCM) is required to be set at the destination circuit as shown in the figure.
Document Number: 002-11000 Rev. *E
Page 15 of 24
CY29430
Figure 10. HCSL: Single-ended Measurement Points for
Absolute Crossing Point
Figure 12. HCSL: Differential Measurement Points for Rise
and Fall Time
Rising Edge Rate
VMAX = 1.15 V
REFCLK ‐
VCROSS MAX = 550 mV
Falling Edge Rate
VIH = +150 mV
0.0 V
VIL = ‐150 mV
VCROSS MIN = 250 mV
REFCLK +
VMIN = ‐0.30 V
REFCLK +
minus
Figure 11. HCSL: Single-ended Measurement Points for
Delta Crossing Point
Figure 13. HCSL: Differential Measurement Points for
Ringback
REFCLK ‐
TSTABLE
VRB
VCROSS DELTA = 140 mV
VIH = +150 mV
VRB = +100 mV
REFCLK +
VRB = ‐100 mV
VIL = ‐150 mV
REFCLK +
minus
VRB
TSTABLE
Figure 14. I2C Bus Timing Specifications
SDAT
tf
tLOW
tr
tSU;DAT
tf
tHD;STA
tr
tBUF
SCLK
tHD;STA
S
tHD;DAT
Document Number: 002-11000 Rev. *E
tHIGH
tSU;STA
tSU;STO
Sr
P
S
Page 16 of 24
CY29430
Phase Noise Plots
Figure 15. Typical Phase Noise at 156.25 MHz (12 kHz–20 MHz)
Document Number: 002-11000 Rev. *E
Page 17 of 24
CY29430
Figure 16. Typical Phase Noise at 622.08 MHz (12 kHz–20 MHz)
Document Number: 002-11000 Rev. *E
Page 18 of 24
CY29430
Figure 17. Typical Phase Noise at 644.53 MHz (12 kHz–20 MHz)
Document Number: 002-11000 Rev. *E
Page 19 of 24
CY29430
Ordering Information
Ordering Code
Configuration
Package Description
Product Flow
CY29430FLQXIT
Field-programmable
16-pin QFN – Tape and Reel
Industrial, –40 C to +105 C
CY29430LQXIxxxT
Factory-configured[21]
16-pin QFN – Tape and Reel
Industrial, –40 C to +105 C
Ordering Code Definitions
CY 29430 X - LQXI
xxx
T
T = Tape and Reel, Blank = Bulk
Customer Part Configuration Code:
Package Type: LQ(QFN), Pb-free: X, Industrial: I
Configuration: F = Field programmable, Blank = Factory Configured
Part Identifier
Company ID: CY = Cypress
Note
21. These are factory-programmed customer-specific part numbers. Contact your local Cypress FAE or sales representative for more information.
Document Number: 002-11000 Rev. *E
Page 20 of 24
CY29430
Package Diagram
Figure 18. 16-pin QFN (3 × 3 × 0.6 mm) LQ16A 1.7 × 1.7 E-Pad (Sawn) Package Outline, 001-87187
001-87187 *A
Document Number: 002-11000 Rev. *E
Page 21 of 24
CY29430
Acronyms
Document Conventions
Acronym
Description
Units of Measure
AC
alternating current
ADC
analog-to-digital converter
°C
Degrees Celsius
BSL
best-fit straight line
fs
femtoseconds
CML
current mode logic
GHz
gigahertz
DC
direct current
k
kilohms
ESD
electrostatic discharge
kHz
kilohertz
MHz
megahertz
M
megaohms
µA
microamperes
FS
frequency select
HCSL
high-speed current steering logic
I2C
inter-integrated circuit
JEDEC
Joint Electron Device Engineering Council
LDO
low dropout (regulator)
LVCMOS
low voltage complementary metal oxide
semiconductor
LVDS
low-voltage differential signals
LVPECL
low-voltage positive emitter-coupled logic
NV
non-volatile
OE
Symbol
Unit of Measure
µm
micrometers
µs
microseconds
µW
microwatts
mA
milliamperes
mm
millimeters
m
milliohms
ms
milliseconds
mV
millivolts
output enable
nH
nanohenrys
PLL
phase-locked loop
ns
nanoseconds
POR
power-on reset

ohms
PSoC®
Programmable Sytem-on-Chip
ppm
parts per million
QFN
quad flat no-lead
ppb
parts per billion
RMS
root mean square
%
percent
SCL
serial I2C clock
pF
picofarads
SDA
serial
I2C
ps
picoseconds
VRB
voltage ring back
V
volts
VCXO
voltage controlled crystal oscillator
XTAL
crystal
data
Document Number: 002-11000 Rev. *E
Page 22 of 24
CY29430
Document History Page
Document Title: CY29430, High-Performance Clock Synthesizer
Document Number: 002-11000
Rev.
ECN No.
Submission
Date
Orig. of
Change
*B
5320399
07/18/2016
MGPL
Changed status from Preliminary to Final.
*C
5429121
09/07/2016
MGPL
Updated Absolute Maximum Ratings:
Added “Supply Current for eFuse Programming”.
Replaced “> 2000 V” with “2000 V” in value corresponding to “ESD HBM”.
Replaced “> 200 V” with “200 V” in value corresponding to “ESD MM”.
Added “ESD CDM (JEDEC JESD22-C101E)”.
Updated to new template.
*D
5518357
11/15/2016
MGPL/
PSR
Added Table 5 and reference to Table 5 in Frequency Configurations.
Added Figure 9.
*E
5613574
02/03/2017
PSR
Document Number: 002-11000 Rev. *E
Description of Change
Added links to ClockWizard 2.1 and technical support, and added reference to
related documentation in Functional Description.
Updated LVPECL specs in DC Electrical Specifications.
Added note clarifying voltage range in AC Electrical Specifications for LVPECL,
LVDS, CML Outputs.
Added a note for factory-configured parts in Ordering Information.
Page 23 of 24
CY29430
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
PSoC® Solutions
Products
ARM® Cortex® Microcontrollers
Automotive
cypress.com/arm
cypress.com/automotive
Clocks & Buffers
Interface
cypress.com/clocks
cypress.com/interface
Internet of Things
Memory
cypress.com/iot
cypress.com/memory
Microcontrollers
cypress.com/mcu
PSoC
cypress.com/psoc
Power Management ICs
Cypress Developer Community
Forums | WICED IOT Forums | Projects | Video | Blogs | Training
| Components
Technical Support
cypress.com/support
cypress.com/pmic
Touch Sensing
cypress.com/touch
USB Controllers
Wireless Connectivity
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP
cypress.com/usb
cypress.com/wireless
© Cypress Semiconductor Corporation, 2016-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation
of the Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 002-11000 Rev. *E
Revised February 3, 2017
Page 24 of 24