FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products tm Features General Description 1.2 to 5.5V Input Voltage Range The FPF1005 & FPF1006 are low RDS P-Channel MOSFET load switches with CMOS controlled turn-on targeting small package load switch applications. The input voltage range operates from 1.2V to 5.5V. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signals. Optional on-chip load resistor is added for output quick discharge when switch is turned off. Typical RDS(ON) = 50mΩ @ VIN = 5.5V Typical RDS(ON) = 55mΩ @ VIN = 3.3V ESD Protected, above 2000V HBM Applications PDAs Both FPF1005 & FPF1006 are available in a small 2X2 MLP-6 pin plastic package. Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Hot Swap Supplies RoHS Compliant PIN 1 TOP BOTTOM Typical Application Circuit TO LOAD VOUT VIN FPF1005/6 OFF ON ON - COUT GND CIN Ordering Information Part Switch Input Buffer FPF1005 55mΩ, PMOS FPF1006 55mΩ, PMOS ©2006 Fairchild Semiconductor Corporation FPF1005-FPF1006 Rev. E Output Discharge ON Pin Activity Schmitt NA Active HI Schmitt 120Ω Active HI 1 www.fairchildsemi.com FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products December 2006 FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products Functional Block Diagram VIN Turn-On Slew Rate Controlled Driver CONTROL LOGIC ON ESD protection VOUT FPF1005/6 Output Discharge (Optional) GND Pin Configuration GND 6 1 ON VOUT 5 2 VIN VOUT 4 3 VIN MLP 2x2 6L BOTTOM VIEW Pin Description Pin Name 4, 5 VOUT 2, 3 VIN 6 GND 1 ON FPF1005-FPF1006 Rev. E Function Switch Output: Output of the power switch Supply Input: Input to the power switch and the supply voltage for the IC Ground ON/OFF Control Input 2 www.fairchildsemi.com Parameter Min VIN, VOUT, ON to GND -0.3 Maximum Continuous Switch Current Power Dissipation @ TA = 25°C (Note 1) Max Unit 6 V 1.5 A 1.2 W Operating Temperature Range -40 85 °C Storage Temperature -65 150 °C 86 °C/W Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM 2000 V MM 200 V Recommended Operating Range Parameter Min Max Unit VIN 1.2 5.5 V Ambient Operating Temperature, TA -40 85 °C Electrical Characteristics VIN = 1.2 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C. Parameter Conditions Symbol Min Typ Max Unit Basic Operation Operating Voltage VIN 5.5 V Quiescent Current IQ IOUT = 0mA, VIN = VON 1 uA Off Supply Current IQ(off) VON = GND, OUT = open 1 uA Off Switch Current ISD(off) VON = GND, VOUT= 0V 1 uA On-Resistance Output Pull Down Resistance ON Input Logic Low Voltage ON Input Logic High Voltage RON RPD VIL VIH 1.2 VIN = 5.5V, TA = 25°C 50 70 VIN = 3.3V, TA = 25°C 55 80 VIN = 1.5V, TA = 25°C 95 135 VIN = 1.2V, TA = 25°C 165 250 VIN = 3.3V, VON = 0V, TA = 25°C, FPF1006 75 1.25 VIN = 4.5V 1.10 VIN = 1.5V 0.50 VIN = 5.5V 2.00 VIN = 4.5V 1.75 VIN = 1.5V 0.75 VON = VIN or GND ON Input Leakage 120 VIN = 5.5V mΩ Ω V V -1 1 uA Dynamic Turn on delay Turn off delay VOUT Rise Time VOUT Fall Time tON tOFF tR tF VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C 10 us VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C, FPF1005 50 us VIN = 3.3V, RL=500Ω, CL=0.1uF, RL_CHIP=120Ω, TA = 25°C, FPF1006 10 us VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C 10 us VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C, FPF1005 100 us VIN = 3.3V, RL=500Ω, CL=0.1uF, RL_CHIP=120Ω, TA = 25°C, FPF1006 10 us Note 1: Package power dissipation on 1square inch pad, 2 oz. copper board FPF1005-FPF1006 Rev. E 3 www.fairchildsemi.com FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products Absolute Maximum Ratings 2.5 8 2.0 ON THRESHOLD (V) SUPPLY CURRENT (nA) 10 6 VON = VIN 4 MAX LIMIT 1.5 TYPICAL 1.0 0.5 2 VON = 0V 0.0 0 1 2 3 4 5 6 7 SUPPLY VOLTAGE (V) 8 9 1 10 Figure 1. Quiescent Current vs.VIN 2 3 4 SUPPLY VOLTAGE (V) 5 6 Figure 2. ON Threshold vs. VIN 10 16 SUPPLY CURRENT (nA) SUPPLY CURRENT (nA) 14 12 10 8 VIN = 5.5V 6 4 8 6 VIN = 5.5V 4 2 2 VIN = 3.3V VIN = 3.3V 0 0 -40 -15 10 35 60 o TJ, JUNCTION TEMPERATURE ( C) -40 85 Figure 3. Quiescent Current vs. Temperature 10 35 60 o TJ, JUNCTION TEMPERATURE ( C) 85 Figure 4. Quiescent Current (off) vs. Temperature 800 100 90 700 VIN = 5.5V 600 SUPPLY CURRENT (nA) SUPPLY CURRENT (nA) -15 500 400 300 200 80 70 60 50 40 30 20 100 VIN = 3.3V 10 0 0 -50 -25 0 25 50 75 o TJ, JUNCTION TEMPERATURE ( C) 100 1 Figure 5. ISWITCH-OFF Current vs. Temperature FPF1005-FPF1006 Rev. E 2 3 4 SUPPLY VOLTAGE (V) 5 6 Figure 6. ISWITCH-OFF Current vs. VIN 4 www.fairchildsemi.com FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products Typical Characteristics 1.5 400 IOUT = 1A VIN = 3.3V IOUT = 1A 1.3 300 RON NORMALIZED ON RESISTANCE (mOhms) 350 250 200 150 1.1 0.9 100 0.7 50 0 0.5 0 1 2 3 4 5 SUPPLY VOLTAGE (V) 6 7 -50 Figure 7. RON vs. VIN 100 0 25 50 75 TJ, JUNCTION TEMPERATURE (oC) 100 Figure 8. RON vs. Temperature 1000 VIN = 3.3V RL = 500Ω VIN = 3.3V RL = 500Ω RL_CHIP = 120Ω, FPF1006 CL = 0.1uF FPF1005 TFALL CL = 0.1uF RISE / FALL TIME (uS) RL_CHIP = 120Ω, FPF1006 TURN ON/OFF TIME (uS) -25 FPF1005 TOFF FPF1006 TOFF TON 100 TRISE 10 FPF1006 TFALL 10 1 -50 -25 0 25 50 75 o TJ, JUNCTION TEMPERATURE ( C) 100 -50 Figure 9. TON/TOff vs. Temperature VON 2V/DIV 0 25 50 75 o TJ, JUNCTION TEMPERATURE ( C) 100 Figure 10. TRISE/TFALL vs. Temperature VIN=3.3V CIN=1uF COUT=0.1uF RL=500Ω VON 2V/DIV IOUT 10mA/DIV IOUT 10mA/DIV VOUT 2V/DIV VOUT 2V/DIV 50us/DIV Figure 11. FPF1005 TON Response FPF1005-FPF1006 Rev.E -25 VIN=3.3V CIN=1uF COUT=0.1uF RL=500Ω 50us/DIV Figure 12. FPF1005 TOFF Response 5 www.fairchildsemi.com FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products Typical Characteristics VON 2V/DIV VON 2V/DIV IOUT 200mA/DIV IOUT 200mA/DIV VOUT 2V/DIV VIN=3.3V CIN=1uF COUT=0.1uF RL=10Ω VOUT 2V/DIV 5us/DIV Figure 14. FPF1005 TOFF Response 50us/DIV Figure 13. FPF1005 TON Response VON 2V/DIV VIN=3.3V CIN=1uF COUT=0.1uF RL=500Ω VON 2V/DIV IOUT 10mA/DIV VOUT 2V/DIV 50us/DIV Figure 15. FPF1006 TON Response 50us/DIV Figure 16. FPF1006 TOFF Response VON 2V/DIV VON 2V/DIV IOUT 200mA/DIV IOUT 200mA/DIV VIN=3.3V CIN=1uF COUT=0.1uF RL=10Ω VOUT 2V/DIV 50us/DIV Figure 17. FPF1006 TON Response FPF1005-FPF1006 Rev.E VIN=3.3V CIN=1uF COUT=0.1uF RL=500Ω IOUT 10mA/DIV VOUT 2V/DIV VOUT 2V/DIV VIN=3.3V CIN=1uF COUT=0.1uF RL=10Ω VIN=3.3V CIN=1uF COUT=0.1uF RL=10Ω 5us/DIV Figure 18. FPF1006 TOFF Response 6 www.fairchildsemi.com FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products Typical Characteristics The FPF1005 & FPF1006 are low RDS(ON) P-Channel load switches with controlled turn-on. The core of each device is a 55mΩ P-Channel MOSFET and a controller capable of functioning over a wide input operating range of 1.2-5.5V. The ON pin, an active HI TTL compatible input, controls the state of the switch. The FPF1006 contains a 120Ω on-chip load resistor for quick output discharge when the switch is turned off. However, VOUT pin of FPF1006 should not be connected directly to the battery source due to the discharge mechanism of the load switch. Application Information Typical Application VOUT VIN FPF1005/6 CIN VIN = 3.3V OFF ON ON - RL COUT GND VON = 3.3V Input Capacitor To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1uF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop during higher current application. Output Capacitor A 0.1uF capacitor, COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductance from forcing VOUT below GND when the switch turns-off. Due to the integral body diode in the PMOS switch, a CIN greater than COUT is highly recommended. A COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces or large copper planes for all pins (VIN, VOUT, ON and GND) will help minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. FPF1005-FPF1006 Rev.E 7 www.fairchildsemi.com FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products Description of Operation FPF1005/6 Demo board has the components and circuitry to demonstrate the load switch functions. Thermal performance of the load switch can be improved significantly by connecting the middle pad (pin 7) to the GND area of the PCB. Figure 19. Demo board silk screen top and component assembly drawing. Figure 20. Demo board top layer view. Figure 21. Demo board bottom layer view. Dimensional Outline and Pad Layout NOTES: A. NON-CONFORMS TO JEDEC REGISTRATION. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 FPF1005-FPF1006 Rev.E 8 www.fairchildsemi.com FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products Evaluation Board Layout The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet Series™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ Across the board. 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THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I22 FPF1005-FPF1006 Rev. E 9 www.fairchildsemi.com FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products TRADEMARKS