HBL1015, HBL1025 Series LED Shunt The HBL1015/25 Series are electronic shunts which provide a current bypass in the case of LEDs going into open circuit. LEDs are by nature quite fragile when subjected to transients and surge conditions. There are also many cases where high reliability of the LED lighting must be maintained such as in headlights, lighthouses, bridges, aircraft, runways and so forth. In these cases the low cost addition of the HBL device will provide full assurance that an entire string of LEDs will not extinguish should one LED fail open. The HBL device is also applicable to other loads where circuit continuity is required. The devices can be used with LED string currents from 140 to 500 mA. www.onsemi.com Anode Control Circuit Features • • • • • A Bidirectional Device Automatically Resets Itself if the LED Heals Itself or is Replaced ON−State Voltage Typically 1.8 V OFF−State Current less than 0.5 mA These are Pb−Free Devices Cathode 5 Typical Applications • • • • • 1 LEDs where Preventive Maintenance is Impractical LED Headlights LEDs with High Reliability Requirements Crowbar Protection for Open Circuit Conditions Overvoltage Protection for Sensitive Circuits TSOP−5 CASE 483 MARKING DIAGRAM 5 xxx MG G 1 xxx M G 1. Device is bidirectional. Either configuration shown is acceptable. 2. Pin 2 must be electrically floating Figure 1. Pin Connections = Specific Device Code (015 or 025) = Date Code = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2015 June, 2015 − Rev. 4 1 Publication Order Number: HBL1015/D HBL1015, HBL1025 Series MAXIMUM RATINGS Rating Symbol On−State Current, (TA = 25°C) (Note 1) (Note 2) (Note 3) Value Unit IT(AVG) mA 500 425 250 °C/W Thermal Resistance, Junction−to−Air (Note 1) (Note 2) (Note 3) qJA Operating Temperature Range TJ −40 to 150 °C Non−Operating Temperature Range TJ 150 °C Lead Temperature, Soldering (10 Sec) TL 260 °C 140 150 255 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Mounted onto a 1500 mm2, Denka K1, 1.5 mm AI, 2 kV thermally conductive dielectric, 2 oz. Cu, or equivalent board. Heat sinking should be spread equally among all pins (caution: pin 2 must be electrically isolated). 2. Mounted onto a 2−layer, 1000 mm2 per layer, 3 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must be electrically isolated). 3. Mounted onto a 2−layer, 50 mm2 per layer, 1 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must be electrically isolated). NOTE: Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open, then the HBL shunt would now dissipate the power using the same copper heat sink. Since the HBL has a voltage that is lower than that of the LED(s), then the power dissipation would be easily handled by the same heat sink as the LED. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: TA = 25°C) Symbol Characteristics Min Min V(BR) Breakdown Voltage: The minimum voltage across the device in or at the breakdown region. Measured at IBR = 1 mA. HBL1015 8.0 HBL1025 11.5 Holding Current: The minimum current required to maintain the device in the on-state. HBL1015 125 HBL1025 125 Breakover Voltage: The voltage across the device in the breakover region. Measured at IBO = 10 mA. HBL1015 14.0 HBL1025 16.0 Off−State Current: The dc value of current that results from the application of the off-state voltage. This is measured at 8.0 V for HBL1015 and 11.5 V for HBL1025. HBL1015 0.5 HBL1025 0.5 On−State Voltage HBL1015 1.2 1.8 2.4 HBL1025 1.2 1.8 2.4 IH VBO IR VT Typ Max Unit V mA V mA V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2 HBL1015, HBL1025 Series TYPICAL PERFORMANCE CURVES (TA = 25°C unless otherwise noted) 20 19 120 HBL1025 Cd, CAPACITANCE (pF) IH, HOLDING CURRENT (mA) 140 100 80 HBL1015 60 40 20 0 −50 HBL1015 17 16 15 14 HBL1025 13 12 11 −25 0 25 50 75 100 125 10 150 0 1 2 3 4 5 6 TA, AMBIENT TEMPERATURE (°C) VOLTS (V) Figure 2. Holding Current vs Temperature Figure 3. Capacitance vs Voltage 15 7 8 2.5 14.5 14 VT, ON−STATE VOLTAGE (V) VBR, BREAKDOWN VOLTAGE (V) 18 HBL1025 13.5 13 12.5 12 HBL1015 11.5 11 2.0 HBL1015/25 @ 350 mA 1.5 1.0 0.5 10.5 10 −50 −25 0 25 50 75 100 125 150 0 −50 −25 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 4. Breakover Voltage vs Temperature Figure 5. On−State Voltage vs Temperature Current On−state Current Holding Current Latching Current Voltage Off−state Current Breakdown Voltage Breakover Voltage Figure 6. I−V Characteristics www.onsemi.com 3 150 HBL1015, HBL1025 Series TYPICAL APPLICATION CIRCUIT Typical Application Circuit for HBL1015 Typical Application Circuit for HBL1025 Current Source Current Source HBL1015 HBL1025 Control Circuit Control Circuit HBL1015 HBL1025 Control Circuit Control Circuit HBL1015 HBL1025 Control Circuit Control Circuit HBL1015 HBL1025 Control Circuit Control Circuit Figure 7. Typical Application Circuit DEVICE ORDERING INFORMATION Marking Package Shipping† HBL1015T1G 015 TSOP−5 (Pb−Free) 3000 / Tape & Reel HBL1025T1G 025 TSOP−5 (Pb−Free) 3000 / Tape & Reel Device †For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 4 HBL1015, HBL1025 Series PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE K NOTE 5 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X 0.20 C A B 0.10 T M 2X 0.20 T B 5 1 4 2 S 3 K B DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H SIDE VIEW C SEATING PLANE END VIEW MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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