Rohm B90FCWFFJ-E2 35v withstand voltage 1a ldo regulator Datasheet

Datasheet
Single-Output LDO Regulators
35V Withstand Voltage
1A LDO Regulators
BDxxFC0 series
●Description
The BDxxFC0 series are low-saturation regulators. The
series’ output voltages are Variable, 3.0V, 3.3V, 5.0V, 6.0V,
7.0V, 8.0V, 9.0V, 10.0V, 12.0V and 15.0V and packages
are HTSOP-J8, TO252-3, and TO252-5. This series has a
built-in over-current protection circuit that prevents the
destruction of the IC due to output short circuits and a
thermal shutdown circuit that protects the IC from thermal
damage due to overloading.
(Typ)
(Typ)
(Max)
4.90mm x 6.00mm x 1.00mm
●Packages
HTSOP-J8
●Key Specifications
1) Output current capability: 1A
2) Output voltage: Variable, 3.0V, 3.3V, 5.0V, 6.0V, 7.0V,
8.0V, 9.0V, 10.0V, 12.0V and 15.0V
3) High output voltage accuracy (Ta=25℃): ±1%
4) Low saturation with PDMOS output
5) Built-in over-current protection circuit that prevents the
destruction of the IC due to output short circuits
6) Built-in thermal shutdown circuit for protecting the IC
from thermal damage due to overloading
7) Available Ceramic Capacitor to prevent oscillation
8) HTSOP-J8, TO252-3 and TO252-5 packages
TO252-3
6.50mm x 9.50mm x 2.50mm
TO252-5
6.50mm x 9.50mm x 2.50mm
●Features
・Output Voltage:
1.0V to 15.0V
・Output Voltage Precision(Ta=25℃):
±1%
VO+1.0V to 26.5V
・Supply Voltage(VO≧3.0V):
・Supply Voltage(VO＜3.0V):
4.0V to 26.5V
・Output Current:
1A
・Operating Temperature Range:
-25℃≦Ta≦+85℃
●Ordering part number
B
Part
Number
D
x
x
Output
voltage
00: Variable
30: 3.0V
33: 3.3V
50: 5.0V
60: 6.0V
70: 7.0V
80: 8.0V
90: 9.0V
J0: 10.0V
J2: 12.0V
J5: 15.0V
F
C
0
W
x
x
x
-
E2
Input
Output
Voltage Current
Shutdown
Mode
Package
Packaging and forming specification
F:35V
“W”: Included
shutdown mode
None: Without
shutdown mode
EFJ: HTSOP-J8
FP: TO252-3/5
E2: Emboss tape reel
C0:1.0A
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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Datasheet
BDxxFC0 Series
●Lineup
Articles
パッケージ
Variable
3.0
3.3
5.0
6.0
7.0
8.0
9.0
10.0
12.0
15.0
BDxxFC0WEFJ-E2
○
○
○
○
○
○
○
○
○
○
○
HTSOP-J8
Reel of 2500
BDxxFC0FP-E2
-
-
○
○
-
-
-
-
-
-
-
TO252-3
Reel of 2000
BDxxFC0WFP-E2(Note 1)
○
○
○
○
○
○
○
○
○
○
○
TO252-5
Reel of 2000
(Note 1) under development except for Variable
●Typical Application Circuits
〈Output Voltage Variable Type (With shutdown SW)〉
Vcc
Vcc
Vo
R1
CIN
EN
COUT
FB
GND
R2
Figure 1. Typical Application Circuit
Output Voltage Variable Type(With shutdown SW)
〈Output Voltage Fixed Type (With Shutdown SW)〉
Vcc
Vcc
Vo
CIN
COUT
EN
GND
Figure 2. Typical Application Circuit
Output Voltage Fixed Type(With shutdown SW)
〈Output Voltage Fixed Type (Without Shutdown SW)〉
Vcc
Vcc
Vo
CIN
COUT
GND
Figure 3. Typical Application Circuit
Output Voltage Fixed Type (Without Shutdown SW)
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Datasheet
BDxxFC0 Series
●Pin Configuration/Pin Description
HTSOP-J8
(TOP VIEW)
〈With Shutdown SW (HTSOP-J8)〉
Vo
1
8
Vcc
FB/N.C.
2
7
N.C
GND
3
6
N.C
N.C
4
5
EN
Figure 4. Pin Configuration (With Shutdown SW)
Pin No.
1
2
3
4
5
6
7
8
Exposed
PAD
Pin name
Vo
FB
/ N.C. (Note 1)
GND
N.C. (Note 1)
EN
N.C. (Note 1)
N.C. (Note 1)
VCC
Pin Function
Output pin
Feedback pin (Variable Output Type)
No Connection (Fixed Output Type)
GND pin
No Connection (Connect to GND or leave OPEN)
Enable pin
No Connection (Connect to GND or leave OPEN)
No Connection (Connect to GND or leave OPEN)
Power supply pin
GND
Substrate(Connect to GND)
(Note 1) N.C. Pin can be open, because it is not connected to the IC.
〈Without Shutdown SW (TO252-3)〉
TO252-3
(TOP VIEW)
1
2
3
Figure 5. Pin Description (Without Shutdown SW)
Pin No.
Pin Name
Pin Function
1
Vcc
Power Supply Pin
2
N.C. (Note 1)
No Connection (leave OPEN)
3
Vo
Output Pin
FIN
GND
GND
(Note 1) N.C.Pin can be open since it is not connected inside of IC.
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Datasheet
BDxxFC0 Series
〈With Shutdown SW (TO252-5)〉
TO252-5
(TOP VIEW)
1 2
3 4 5
Figure 6. Pin Configuration (With Shutdown SW)
Pin No.
Pin Name
Pin Function
1
EN
Enable Pin
2
Vcc
Power Supply Pin
3
N.C. (Note 1)
No Connection (leave OPEN)
4
Vo
Output Pin
5
FB
N.C. (Note 1)
Variable Pin (Variable Output Type)
N.C. Pin (Fixed Output Type)
FIN
GND
GND
(Note 1) N.C.Pin can be open since it is not connected inside of IC.
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Datasheet
BDxxFC0 Series
●Block diagrams
■ HTSOP-J8 〈BD00FC0WEFJ (Output Voltage Variable Type) with Shutdown SW〉
VREF : Bandgap Reference
OCP : Over Current Protection Circuit
TSD : Thermal Shut Down Circuit
Driver : Power Transistor Driver
VREF
Driver
OCP
TSD
1
2
EN
Vcc
3
4
5
GND
Vo
FB
Figure 7. Block diagrams
BD00FC0WEFJ (Output Voltage Variable Type with Shutdown SW)
■ HTSOP-J8 〈BDxxFC0WEFJ (Output Voltage Fixed Type) with Shutdown SW〉
VREF :
OCP :
TSD :
Driver :
Bandgap Reference
Over Current Protection Circuit
Thermal Shut Down Circuit
Power Transistor Driver
VREF
Driver
OCP
TSD
1
2
3
4
5
EN
Vcc
GND
Vo
N.C.
Figure 8. Block diagrams
BxxFC0WEFJ (Output Voltage Variable Type with shutdown SW)
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Datasheet
BDxxFC0 Series
■TO252-3〈BDxxFC0FP (Output Voltage Fixed Type) without Shutdown SW〉
FIN
GND
VREF :
OCP :
TSD :
Driver :
VREF
Bandgap Reference
Over Current Protection Circuit
Thermal Shut Down Circuit
Power Transistor Driver
Driver
OCP
TSD
1
2
3
Vcc
N.C.
Vo
Figure 9. Block diagrams
BDxxFC0FP (Output Voltage Fixed Type, without Shutdown SW)
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Datasheet
BDxxFC0 Series
■ TO252-5 〈BD00FC0WFP (Output Voltage Variable Type) With Shutdown SW〉
FIN
GND
VREF :
OCP :
TSD :
Driver :
Bandgap Reference
Over Current Protection Circuit
Thermal Shut Down Circuit
Power Transistor Driver
VREF
Driver
OCP
TSD
1
2
EN
Vcc
3
4
5
N.C.
Vo
FB
Figure 10. Block diagram
BD00FC0WFP (Output Voltage Variable Type, with Shutdown SW)
■TO252-5〈BDxxFC0WFP (Output Voltage Fixed Type) With Shutdown SW〉
FIN
GND
VREF :
OCP :
TSD :
Driver :
Bandgap Reference
Over Current Protection Circuit
Thermal Shut Down Circuit
Power Transistor Driver
VREF
Driver
OCP
TSD
1
2
EN
Vcc
3
4
5
N.C.
Vo
N.C.
Figure 11. Block diagram
BDxxFC0WFP (Output Voltage Fixed Type, with Shutdown SW)
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Datasheet
BDxxFC0 Series
●Absolute Maximum Ratings (Ta= 25℃)
Parameter
Supply Voltage *1
EN Voltage *2
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Symbol
Vcc
VEN
Ta
Tstg
Tjmax
Ratings
-0.3 to +35.0
-0.3 to +35.0
-25 to +85
-55 to +150
150
Unit
V
V
℃
℃
℃
*1 Do not exceed Tjmax.
*2 Power Supply (Vcc) and EN pin startup sequence does not matter provided they are operated within the power supply voltage range.
●Operating Conditions (-25℃≦Ta≦+85℃)
Parameter
Supply Voltage (VO≧3.0V)
Supply Voltage (VO<3.0V)
Startup Voltage (IO=0mA)
EN Voltage (with shutdown SW)
Output Current
Output Voltage *3 (BD00FC0)
Symbol
Vcc
Vcc
Vcc
VEN
IO
VO
Min
VO+1
4.0
0
0
1.0
Max
26.5
26.5
3.8
26.5
1.0
15.0
Unit
V
V
V
V
A
V
*3 Please refer to Notes when using BD00FC0 at output voltage of 1.0V to 3.0V.
●Electrical Characteristics
Unless otherwise specified, Ta=25°C, Vcc=13.5V, IO=0mA, VEN=5.0V
The resistor between FB and OUT =56.7kΩ, FB and GND =10kΩ (BD00FC0)
Guaranteed Limit
Parameter
Symbol
Min
Typ
Max
Circuit Current at shutdown mode
ISD
0
5
Circuit Current
Icc
0.5
2.5
Output Reference Voltage (BD00FC0)
VFB
0.742
0.750
0.758
Output Voltage
VO×0.99
VO
VO×1.01
VO
(BD30/33/50FC0)
Output Voltage
VO×0.99
VO
VO×1.01
VO
(BD60/70/80/90/J0/J2/J5FC0)
Minimum dropout voltage
Minimum dropout voltage
(BD00/50/60/70/80/90/J0/J2/J5FC0)
Line Regulation
Load Regulation
EN High Voltage (with shutdown SW)
EN Low Voltage (with shutdown SW)
EN Bias Current
Unit
Conditions
µA
mA
V
IO =50mA
V
IO =200mA
V
IO =500mA *4
∆Vd
-
0.4
0.7
V
∆Vd
-
0.3
0.5
V
Reg.I
Reg.IO
VEN(High)
VEN(Low)
IEN
2.0
-
20
VO×0.010
25
80
VO×0.020
0.8
50
mV
V
V
V
μA
Vcc=4.0V
IO =500mA *５
Vcc= VO×0.95,
IO =500mA
Vcc=VO+1.0V→26.5V
IO =5mA→1A *4
ACTIVE MODE
OFF MODE
*4 In case of J0, J2 and J5, Vcc=Vo+4.5V
*5 In case of Vo ≧ 4.0V
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Datasheet
BDxxFC0 Series
●Thermal Resistance
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
θJA
206.4
45.2
°C/W
ΨJT
21
13
°C/W
θJA
115.3
20.8
°C/W
ΨJT
14
3
°C/W
HTSOP-J8
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
TO252-5 / TO252-3
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Thermal Via (Note 5)
Pitch
Diameter
1.20mm
Φ0.30mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
(Note 5) This thermal via connects with the copper pattern of all layers
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Datasheet
BDxxFC0 Series
●Reference Data
■BD00FC0 series (5.0V Output Setting)
Unless otherwise specified, Ta=25°C, Vcc=13.5V, VEN=5.0V, IO=0mA, VO=5.0V
(The resistor between FB and Vo =56.7kΩ, FB and GND =10kΩ)
18
15
0.8
Shutdown Current:ISD [μA]
Circuit Current:Icc+IFEEDBACK_R [mA]
1.0
0.6
0.4
0.2
0.0
0
2
4
6
12
9
6
3
0
8 10 12 14 16 18 20 22 24 26
0
2
4
Supply Voltage:Vcc [V]
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Figure 12. Circuit Current
(IFEEDBACK_R≒75µA)
Figure 13. Shutdown Current
6
6
5
5
Output Voltage:VO[V]
Output Voltage:VO[V]
6
4
3
2
1
4
3
2
1
0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
0
Supply Voltage:Vcc [V]
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Figure 14. Line Regulation
(IO=0mA)
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Figure 15. Line Regulation
(IO=500mA)
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Datasheet
BDxxFC0 Series
●Reference Data - Continued
6
1,000
900
Dropout Voltage : ∆Vd[mV]
Output Voltage:VO[V]
5
4
3
2
1
800
700
600
500
400
300
200
100
0
0
400
800
1200
1600
2000
0
2400
0
Output Current:IO[mA]
400
600
800
1000
Output Current:IO[mA]
Figure 17. Dropout Voltage
(Vcc=4.75V)
(lO=0mA→1000mA)
Figure 16. Load Regulation
80
5.15
70
5.10
Output Voltage: Vo [V]
Ripple Rejection:R.R. [dB]
200
60
50
40
30
20
5.05
5.00
4.95
4.90
10
0
10
100
1000
10000
100000 1000000
Frequency: f [Hz]
-25
-5
15
35
55
75
Ambient Temperature: [℃ ]
Figure 18. Ripple Rejection
(IO =100mA)
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Figure 19. Output Voltage
Temperature Characteristic
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Datasheet
BDxxFC0 Series
●Reference Data - Continued
1.0
160
0.8
EN Bias Current:IEN [μA]
Circuit Current:Icc+IFEEDBACK_R [mA]
140
0.6
0.4
0.2
120
100
80
60
40
20
0.0
0
0
200
400
600
800
1000
0
2
4
Output Current:IO[mA]
8 10 12 14 16 18 20 22 24 26
Enable Voltage: VEN [V]
Figure 20. Circuit Current
(IO =0mA→1000 mA)
(IFEEDBACK_R≒75µA)
Figure 21. EN Voltage vs EN Current
6
6
5
5
Output Voltage:VO[V]
Output Voltage:VO[V]
6
4
3
2
1
4
3
2
1
0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
130
Enable Voltage: VEN [V]
150
160
170
180
190
Ambient Temperature:Ta [℃]
Figure 23. Thermal Shutdown
Circuit Characteristic
Figure 22. EN Voltage vs Output Voltage
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Datasheet
BDxxFC0 Series
●Measurement setup for reference data
■BD00FC0 series（5.0V Output Setting）
Measurement setup for Figure 12
Measurement setup for Figure 15
Measurement setup for Figure 13
Measurement setup for Figure 16
Measurement setup for Figure 14
Measurement setup for Figure 17
Vcc
Vo
56.7kΩ
1µF
EN
13.5V
FB
GND
5V
Measurement setup for Figure 18
Measurement setup for Figure 21
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Measurement setup for Figure 19
Measurement setup for Figure 22
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1µF
10kΩ
IFEEDBACK_R
Measurement setup for Figure 20
Measurement setup for Figure 23
TSZ02201-0G2G0A600040-1-2
16.May.2016 Rev.004
Datasheet
BDxxFC0 Series
●Reference Data
■BD33FC0 series
Unless otherwise specified Ta = 25°C, Vcc=13.5V, VEN=5.0V, Io=0mA
18
15
0.8
Shutdown Current:ISD [μA]
Circuit Current:Icc [mA]
1.0
0.6
0.4
0.2
12
9
6
3
0
0.0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
2
4
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 25. Shutdown Current
Figure 24. Circuit Current
6
6
5
5
Output Voltage:Vo [V]
Output Voltage:Vo [V]
6
4
3
2
1
4
3
2
1
0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
0
Supply Voltage:Vcc [V]
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Figure 26. Line Regulation
(Io=0mA)
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Figure 27. Line Regulation
(Io=500mA)
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Datasheet
BDxxFC0 Series
●Reference Data - Continued
80
6
70
Ripple Rejection:R.R. [dB]
Output Voltage:Vo [V]
5
4
3
2
1
60
50
40
30
20
10
0
0
0
400
800
1200
1600
2000
10
2400
100
1000
10000
100000 1000000
Frequency: f [Hz]
Output Current:Io [mA]
Figure 29. Ripple Rejection
(lo=100mA)
Figure 28. Load Regulation
3.38
0.9
3.36
0.8
Circuit Current:Icc [mA]
Output Voltage: Vo [V]
1.0
3.34
3.32
3.30
3.28
3.26
0.7
0.6
0.5
0.4
0.3
0.2
3.24
0.1
3.22
-25
-5
15
35
55
0.0
75
0
400
600
800
1000
Output Current:Io [mA]
Figure 31. Circuit Current
Ambient Temperature: [℃ ]
Figure 30. Output Voltage Temperature Characteristic
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Datasheet
BDxxFC0 Series
●Reference Data - Continued
6
160
5
Output Voltage:Vo [V]
EN Bias Current:IEN [μA]
140
120
100
80
60
4
3
2
40
1
20
0
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
0
2
4
6
8 10 12 14 16 18 20 22 24 26
Enable Voltage: VEN [V]
Enablel Voltage: VEN [V]
Figure 33. EN Voltage vs Output Voltage
Figure 32. EN Voltage vs EN Current
6
Output Voltage:Vo [V]
5
4
3
2
1
0
130
140
150
160
170
180
190
Ambient Temperature:Ta [℃]
Figure 34. Thermal Shutdown Circuit Characteristic
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Datasheet
BDxxFC0 Series
●Reference Data
■BD50FC0 series
Unless otherwise specified, Ta = 25°C, Vcc=13.5V, VEN=5.0V, Io=0mA
18
15
0.8
Shutdown Current:ISD [μA]
Circuit Current:Icc [mA]
1.0
0.6
0.4
0.2
0.0
0
2
4
6
12
9
6
3
0
8 10 12 14 16 18 20 22 24 26
0
2
4
Supply Voltage:Vcc [V]
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Figure 36. Shutdown Current
Figure 35. Circuit Current
6
6
5
5
Output Voltage:Vo [V]
Output Voltage:Vo [V]
6
4
3
2
1
4
3
2
1
0
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
0
Supply Voltage:Vcc [V]
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Figure 37. Line Regulation
(Io=0mA)
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TSZ22111・15・001
2
Figure 38. Line Regulation
(Io=500mA)
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16.May.2016 Rev.004
Datasheet
BDxxFC0 Series
●Reference Data - Continued
6
1,000
900
Dropout Voltage : ∆Vd [mV]
Output Voltage:Vo [V]
5
4
3
2
1
800
700
600
500
400
300
200
100
0
0
400
800
1200
1600
2000
0
2400
0
Output Current:Io [mA]
400
600
800
1000
Output Current:Io [mA]
Figure 39. Load Regulation
Figure 40. Dropout Voltage
(Vcc=Vo×0.95V)
5.15
80
70
5.10
Output Voltage: Vo [V]
Ripple Rejection:R.R. [dB]
200
60
50
40
30
20
5.05
5.00
4.95
4.90
10
0
10
100
1000
10000
100000 1000000
Frequency: f [Hz]
-25
-5
15
35
55
75
Ambient Temperature: [℃]
Figure 41. Ripple Rejection
(lo=100mA)
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TSZ22111・15・001
4.85
Figure 42. Output Voltage
Temperature Characteristic
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16.May.2016 Rev.004
Datasheet
BDxxFC0 Series
●Reference Data - Continued
1.0
160
140
EN Bias Current:IEN [μA]
Circuit Current:Icc [mA]
0.8
0.6
0.4
0.2
120
100
80
60
40
20
0
0.0
0
200
400
600
800
0
1000
2
6
8 10 12 14 16 18 20 22 24 26
Enable Voltage: VEN [V]
Figure 44. EN Voltage vs EN Current
Output Current:Io [mA]
Figure 43. Circuit Current
6
6
5
5
Output Voltage:Vo [V]
Output Voltage:Vo [V]
4
4
3
2
1
4
3
2
1
0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
130
Enable Voltage: VEN [V]
150
160
170
180
190
Ambient Temperature:Ta [℃]
Figure 46. Thermal Shutdown Circuit Characteristic
Figure 45. EN Voltage vs Output Voltage
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Datasheet
BDxxFC0 Series
1.2
18
1.0
15
Shutdown Current:ISD [μA]
Circuit Current:Icc [mA]
●Reference Data
■BD80FC0 series
Unless otherwise specified, Ta = 25°C, Vcc=13.5V, VEN=5.0V, Io=0mA
0.8
0.6
0.4
0.2
0.0
12
9
6
3
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
0
2
4
6
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 47. Circuit Current
Figure 48. Shutdown Current
10
10
9
9
8
8
Output Voltage:Vo [V]
Output Voltage:Vo [V]
8 10 12 14 16 18 20 22 24 26
7
6
5
4
3
7
6
5
4
3
2
2
1
1
0
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
0
Figure 49. Line Regulation
(Io=0mA)
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TSZ22111・15・001
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 50. Line Regulation
(Io=500mA)
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16.May.2016 Rev.004
Datasheet
BDxxFC0 Series
10
1,000
9
900
8
800
Dropout Voltage : ∆Vd [mV]
Output Voltage:Vo [V]
●Reference Data - Continued
7
6
5
4
3
2
700
600
500
400
300
200
1
100
0
0
0
400
800
1200
1600
2000
0
2400
200
400
600
800
1000
Output Current:Io [mA]
Output Current:Io [mA]
Figure 52. Dropout Voltage
(Vcc=Vo×0.95V)
Figure 51. Load Regulation
80
8.21
8.16
Output Voltage: Vo [V]
Ripple Rejection:R.R. [dB]
70
60
50
40
30
20
10
8.11
8.06
8.01
7.96
7.91
7.86
7.81
7.76
0
10
100
1000
10000
100000 1000000
Frequency: f [Hz]
-5
15
35
55
75
Ambient Temperature: [℃]
Figure 53. Ripple Rejection
(lo=100mA)
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-25
Figure 54. Output Voltage Temperature Characteristic
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16.May.2016 Rev.004
Datasheet
BDxxFC0 Series
●Reference Data - Continued
160
1.0
140
EN Bias Current:IEN [μA]
Circuit Current:Icc [mA]
0.8
0.6
0.4
120
100
80
60
40
0.2
20
0.0
0
200
400
600
800
0
1000
0
2
4
6
Output Current:Io [mA]
Figure 55. Circuit Current
Figure 56. EN Voltage vs EN Current
10
10
9
9
8
8
Output Voltage:Vo [V]
Output Voltage:Vo [V]
8 10 12 14 16 18 20 22 24 26
Enable Voltage: VEN [V]
7
6
5
4
3
7
6
5
4
3
2
2
1
1
0
0
0
2
4
6
130
8 10 12 14 16 18 20 22 24 26
150
160
170
180
190
Figure 58. Thermal Shutdown Circuit Characteristic
Figure 57. EN Voltage vs Output Voltage
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Ambient Temperature:Ta [℃]
Enable Voltage: VEN [V]
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Datasheet
BDxxFC0 Series
1.2
18
1.0
15
Shutdown Current:ISD [μA]
Circuit Current:Icc[mA]
●Reference Data
■BD90FC0 series
Unless otherwise specified, Ta = 25°C, Vcc=13.5V, VEN=5.0V, Io=0mA
0.8
0.6
0.4
0.2
0.0
0
2
4
6
12
9
6
3
0
8 10 12 14 16 18 20 22 24 26
0
2
4
Supply Voltage:Vcc [V]
10
9
9
8
8
Output Voltage:Vo [V]
Output Voltage:Vo [V]
Figure 60. Shutdown Current
10
7
6
5
4
3
7
6
5
4
3
2
2
1
1
0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
2
4
6
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
Figure 61. Line Regulation
(Io=0mA)
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TSZ22111・15・001
8 10 12 14 16 18 20 22 24 26
Supply Voltage:Vcc [V]
Figure 59. Circuit Current
0
6
Figure 62. Line Regulation
(Io=500mA)
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Datasheet
BDxxFC0 series
10
1,000
9
900
8
800
Dropout Voltage : ∆Vd [mV]
Output Voltage:Vo [V]
●Reference Data - Continued
7
6
5
4
3
2
700
600
500
400
300
200
1
100
0
0
0
400
800
1200
1600
2000
0
2400
200
400
600
800
1000
Output Current:Io [mA]
Output Current:Io [mA]
Figure 63. Load Regulation
Figure 64. Dropout Voltage
(Vcc=Vo×0.95V)
80
9.23
Output Voltage: Vo [V]
Ripple Rejection:R.R. [dB]
70
60
50
40
30
20
9.13
9.03
8.93
8.83
10
0
10
100
1000
10000 100000 1000000
Frequency: f [Hz]
-25
-5
15
35
55
75
Ambient Temperature: [℃]
Figure 65. Ripple Rejection
(Io =100mA)
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TSZ22111・15・001
8.73
Figure 66. Output Voltage
Temperature Characteristic
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16.May.2016 Rev.004
Datasheet
BDxxFC0 series
●Reference Data - Continued
160
1.0
0.8
EN Bias Current:IEN [μA]
Circuit Current:Icc [mA]
140
0.6
0.4
0.2
120
100
80
60
40
20
0
0.0
0
200
400
600
800
0
1000
2
4
6
Enable Voltage: VEN [V]
Output Current:Io [mA]
Figure 68. EN Voltage vs EN Current
Figure 67. Circuit Current
10
10
9
9
8
8
Output Voltage:Vo [V]
Output Voltage:Vo [V]
8 10 12 14 16 18 20 22 24 26
7
6
5
4
3
7
6
5
4
3
2
2
1
1
0
0
0
2
4
6
130
8 10 12 14 16 18 20 22 24 26
150
160
170
180
190
Figure 70. Thermal Shutdown
Circuit Characteristic
Figure 69. EN Voltage vs Output Voltage
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140
Ambient Temperature:Ta [℃]
Enable Voltage: VEN [V]
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16.May.2016 Rev.004
Datasheet
BDxxFC0 series
●Measurement setup for reference data
■BDxxFC0 series(Output Voltage FixedType)
Measurement setup for
Figure 24, 35, 47 and 59
Measurement setup for
Figure 25, 36, 48 and 60
Vcc
Vo
EN
N.C.
(1.0µF)
2.2µF
Measurement setup for
Figure 26, 37, 49 and 61
1µF
13.5V
GND
5V
Measurement setup for
Figure 27, 38, 50 and 62
Measurement setup for
Figure 29, 41, 53 and 65
Measurement setup for
Figure 32, 44, 56 and 68
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TSZ22111・15・001
Measurement setup for
Figure 28, 39, 51 and 63
Measurement setup for
Figure 40, 52 and 64
Measurement setup for
Figure 30, 42, 54 and 66
Measurement setup for
Figure 31, 43, 55 and 67
Measurement setup for
Figure 33, 45, 57 and 69
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Measurement setup for
Figure 34, 46, 58 and 70
TSZ02201-0G2G0A600040-1-2
16.May.2016 Rev.004
Datasheet
BDxxFC0 series
●Application Examples
・Applying positive surge to the Vcc pin
If there is a possibility that surges higher than 35.0V will be applied to the Vcc pin, a Zener diode should be placed
between the Vcc pin and GND pin, as shown in the Figure below.
Vcc
GND
Figure 71.
・Applying negative surge to the Vcc pin
If there is a possibility that negative surges lower than the GND are applied to the Vcc pin, a Schottky diode should be
place between the Vcc pin and GND pin, as shown in the Figure below.
Vcc
GND
Figure 72.
・Implementing a protection diode
If there is a possibility that a large inductive load is connected to the output pin resulting in back-EMF at time of startup
and Shutdown, a protection diode should be placed as shown in the Figure below.
Vo
Vo
Figure 73.
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Datasheet
BDxxFC0 series
●Thermal Design
■HTSOP-J8
IC mounted on ROHM standard board based on JEDEC.
Board material: FR4
Board size
1s
114.3 mm x 76.2 mm x 1.57 mmt
2s2p 114.3 mm x 76.2 mm x 1.6 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: The footprint ROHM recommend.
+ wiring to measure.
3.5
Power Dissipation: Pd[W]
3
②2.8 W
2.5
2
1.5
①: 1-layer PCB (Copper foil area on the reverse side of
PCB: 0 mm x 0 mm)
②: 4-layer PCB (2 inner layers and copper foil area on the
reverse side of PCB: 74.2mm x 74.2 mm)
1
①0.6W
0.5
0
0
25
50
75
100
125
Condition①: θja = 206.4 °C/W, ΨJT = 21°C/W
Condition②: θja = 45.2 °C/W, ΨJT = 13°C/W
150
Ambient Temperature: Ta[°C]
Figure 74.
■TO252-3/5
IC mounted on ROHM standard board based on JEDEC.
Board material: FR4
Board size
1s
114.3 mm x 76.2 mm x 1.57 mmt
2s2p 114.3 mm x 76.2 mm x 1.6 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: The footprint ROHM recommend.
+ wiring to measure.
8
Power Dissipation: Pd [W]
②6 W
6
4
①: 1-layer PCB (Copper foil area on the reverse side of
PCB: 0 mm x 0 mm)
②: 4-layer PCB (2 inner layers and copper foil area on the
reverse side of PCB: 74.2mm x 74.2 mm)
2
①1.1 W
0
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Condition①: θja = 115.3 °C/W, ΨJT = 14°C/W
Condition②: θja = 20.8 °C/W, ΨJT = 3°C/W
Figure 75.
When operating at temperature more than Ta=25°C, please refer to the power dissipation characteristic curve shown in Figure
74 and 75.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature Tjmax.
Figure 74 and 75 show the acceptable power dissipation characteristic curves of the HTSOP-J8 and TO252-3/5 packages. Even
when the ambient temperature (Ta) is at normal temperature (25°C), the chip junction temperature (Tj) may be quite high so
please operate the IC at temperatures less than the acceptable power dissipation.
The calculation method for power consumption Pc(W) is as follows
Pc=(Vcc－Vo)×Io+Vcc×Icc
Acceptable loss Pd ≥ Pc
Solving this for load current Io in order to operate within the acceptable loss
Io ≤
Pd－Vcc×Icc
Vcc－Vo
Vcc
Vo
Io
Icc
: Input voltage
: Output voltage
: Load current
: Circuit current
It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal design.
Calculation Example) When TO252-3 / TO252-5, Ta=85°C, Vcc=13.5V, Vo=5.0V
3.115－13.5×Icc
8.5
Io ≤ 365.6mA (Icc : 0.5mA)
Io ≤
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TSZ22111・15・001
Figure 75 ②θja=20.8 °C/W → -48.1mW/°C
25°C = 6W → 85°C =3.115W
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Datasheet
BDxxFC0 series
●I/O equivalent circuit
Vcc Terminal
EN Terminal
200kΩ
Vcc
1kΩ
EN
200kΩ
IC
Vo Terminal BD30/33/50/60/70/80/90/J0/J2/J5FC0(W)
R1 (kΩ)
(Typ)
BD30FC0(W)
BD33FC0(W)
BD50FC0(W)
10
BD60FC0(W)
BD50FC0(W)
Vo
BD80C0A(W)
5
R2
BD90C0A(W)
BDJ0C0A(W)
5
R1
BDJ2C0A(W)
BDJ5C0A(W)
4
Vcc
R3
R2 (kΩ)
(Typ)
30.3
34
56.6
83.5
61.7
48.3
55
61.7
75
76.1
R3 (kΩ)
(Typ)
15
20
15
BD00FC0W
Vo Terminal
FB Terminal
Vcc
15kΩ
(Typ)
FB
Vo
Figure 76.
●Output Voltage Configuration Method (BD00FC0)
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 77.
Please be aware that the offset, due to the current that flows from the FB terminal, becomes large when resistors with large
values are used. Resistance values ranging from R2=5kΩ to 10kΩ is recommended.
VO
VOUT setting equation is,
R1
VFB ≒ 0.75 V
(TYP)
IC
FB pin
R2
VOUT≒VFB×(R1+R2)/R2
Thoroughly check the constant settings on the application because
circuit current increases depending on connected resistor.
Resistance value of R2 is from 5kΩ to 10kΩ.
Determine R1 by adjusting with R2.
Figure 77.
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Datasheet
BDxxFC0 series
●Operational Notes
1. Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may
result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open
mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device,
consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.
2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external
circuits, and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.
3. GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions.
Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics.
4. Ground wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused
by large currents. Also, ensure that the GND traces of external components do not cause variations on GND voltage. The
power supply and ground lines must be as short and thick as possible to reduce line impedance.
5. Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by
poor soldering or foreign objects) may result in damage to the IC.
6. Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications
where strong electromagnetic fields may be present.
7. Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to
stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
8. Power Dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including
reduced current capability due to the rise of chip temperature. The mentioned power dissipation in the absolute maximum
rating of this specification, at HTSOP-J8 andTO252-3/5 package when 114.3mm×76.2mm×1.6mm glass epoxy board is
mounted, is the value of when there is no heat dissipation board. And in case this exceeds, take the measures like
enlarge the size of board; make copper foil area for heat dissipation big; and use dissipation board and do not exceed the
power dissipation.
9. Thermal consideration
Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions. Consider Pc that
does not exceed Pd in actual operating conditions. (Pd≧Pc)
Tjmax : Maximum junction temperature=150(℃) , Ta : Peripheral temperature(℃) ,
θja : Thermal resistance of package-ambience(℃/W), Pd : Package Power dissipation (W),
Pc : Power consumption (W), Vcc : Input Voltage, VO : Output Voltage, IO : Load, Icc : Circut Current
Package Power dissipation
Power consumption
: Pd (W) = (Tjmax-Ta) / θja
: Pc (W) = (Vcc-VO)×IO+Vcc×Icc
10. Vcc pin
Insert a capacitor (VO≧5.0V:capacitor≧1µF, 1.0≦VO＜5.0V:capacitor≧2.2µF) between the Vcc and GND pins. Choose
the capacitance according to the line between the power smoothing circuit and the Vcc pin. Selection of the capacitance
also depends on the application. Verify the application and allow for sufficient margins in the design. It is recommended
to use a capacitor with excellent voltage and temperature characteristics.
Electrolytic capacitor
IC
Ceramic capacitor, Low ESR capacitor
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Datasheet
BDxxFC0 series
11. Output pin
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a
capacitor with a capacitance of more than 1μF(3.0V≦VO≦15.0V). Electrolytic, tantalum and ceramic capacitors can be
used. We recommend a capacitor with a capacitance of more than 4.7μF(1.0V≦VO<3.0V). Ceramic capacitors can be
used. When selecting the capacitor, ensure that the capacitance of more than 1μF(3.0V≦VO≦15.0V) or more than
4.7μF(1.0V≦VO<3.0V) is maintained at the intended applied voltage and temperature range. Due to changes in
temperature, the capacitance can fluctuate possibly resulting in oscillation. For selection of the capacitor, refer to the
Cout_ESR vs IOUT data. The stable operation range given in the reference data is based on the standalone IC and
resistive load. For actual applications, the stable operating range is influenced by the PCB impedance, input supply
impedance, and load impedance. Therefore, verification of the final operating environment is needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R, or better, with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that
the actual application meets the required specification.
4.0V ≤ Vcc ≤ 26.5V
3.0V ≤ VO ≤ 15.0V
-25℃ ≤ Ta ≤ +85℃
5kΩ ≤ R2 ≤ 10kΩ (BD00FC0W)
Cin=2.2µF ≤ Cin ≤ 100µF
1µF ≤ Cout ≤ 100µF
6.0V≤Vcc≤26.5V
5.0V≤VO≤15.0V
-25℃≤Ta≤+85℃
0A≤IO≤1A
5kΩ≤R2≤10kΩ (BD00FC0W)
4.0V ≤ Vcc ≤ 26.5V
3.0V ≤ VO ≤ 15.0V
-25℃ ≤ Ta ≤ +85℃
0A ≤ IO ≤ 1A
5kΩ ≤ R2 ≤ 10kΩ (BD00FC0W)
100
100
100
Unstable operating region
Stable operating region
0.1
0.01
Cin（µF）
1
Cin（µF）
Cout_ESR(Ω）
10
Stable operating region
10
2.2
Unstable
operating region
1
1
0.001
0
200
400
600
800
1
1000
10
IIo(mA)
O(mA)
1
100
4.0V ≤ Vcc ≤ 26.5V
1.5V ≤ Vo < 3.0V
-25°C ≤ Ta ≤ +85°C
5kΩ ≤ R1 ≤ 10kΩ (BD00FC0W)
2.2µF ≤ Cin ≤ 100µF
4.7µF ≤ Cout ≤ 100µF
100
4.0V ≤ Vcc ≤ 26.5V
1.0V ≤ Vo < 3.0V
-25°C ≤ Ta ≤ +85°C
0A ≤ Io ≤ 1A
5kΩ≤ R1 ≤ 10kΩ (BD00FC0W)
100
100
Unstable operating region
Cout_ESR(Ω）
10
1
0.5
0.1
Stable operating region
0.01
Stable
operating region
1
Cin（µF）
Unstable operating region
Stable operating region
0.1
0.01
0.001
200
400
600
800
1000
Unstable
operating region
10
1
0
200
Io(mA)
400
600
800
1
1000
4.7
10
100
Cout（µF）
Io(mA)
Cout_ESR vs Io
1.0V ≤ Vo < 3.0V
(Reference data)
Cin vs Cout
1.0V ≤ Vo < 3.0V
(Reference data)
Vcc
VCC
(4.0V to 26.5V)
Stable
operating region
2.2
0.001
0
100
Cin vs Cout
3.0V ≤ Vo ≤ 15.0V
(Reference data)
4.0V ≤ Vcc ≤ 26.5V
1.0V ≤ Vo < 1.5V
-25°C ≤ Ta ≤ +85°C
5kΩ ≤ R1 ≤ 10kΩ (BD00FC0W)
2.2µF ≤ Cin ≤ 100µF
4.7µF ≤ Cout ≤ 100µF
10
10
Cout(µF)
Cout（µF）
Cout_ESR vs Io
3.0V ≤ Vo ≤ 15.0V
(Reference data)
Cout_ESR(Ω）
Stable operating region
10
Vo
Cin
(1µF or higher)
R2
EN
Cout
(1µF or higher)
Io
(Rout)
FB
GND
VEN
(5.0V)
R1
(5k to 10kΩ)
ESR
(0.001Ω
or higher)
Operation Note 11 Measurement circuit (BD00FC0W)
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Datasheet
BDxxFC0 series
4.0V ≤ Vcc ≤ 26.5V
1.0V ≤ Vo < 3.0V
(Cout and Ceramic capacitor 10µF is connected in parallel.)
-25°C ≤ Ta ≤ +85°C
0A ≤ Io ≤ 1A
5kΩ≤ R1 ≤ 10kΩ (BD00FC0W)
4.0V ≤ Vcc ≤ 26.5V
1.0V ≤ Vo < 3.0V
(Cout and Ceramic capacitor 10µF is connected in
parallel.)
-25°C ≤ Ta ≤ +85°C
5kΩ ≤ R1 ≤ 10kΩ (BD00FC0W)
2.2µF ≤ Cin ≤ 100µF
1µF ≤ Cout ≤ 100µF
100
100
Unstable operating region
1
Cin（µF）
Cout_ESR(Ω）
10
Stable operating region
0.1
0.01
Stable operating region
10
2.2
Unstable
operating region
1
0.001
0
200
400
600
800
1
1000
10
Io(mA)
Cin vs Cout
1.0V ≤ Vo < 3.0V
Cout and Ceramic capacitor 10µF is
connected in parallel.
(Reference data)
Cout_ESR vs Io
1.0V ≤ Vo < 3.0V
Cout and Ceramic capacitor 10µF is
connected in parallel.
(Reference data)
Vcc
Vo
Cin
(1µF or higher)
VCC
(4.0V to 26.5V)
100
Cout（µF）
R2
EN
FB
GND
R1
(5k to 10kΩ)
VEN
(5.0V)
Cout
(1µF
or higher)
ESR
(0.001Ω
or higher)
10µF
Output
load
Io(Rout)
Operation Note 11 Measurement circuit (BD00FC0W)
12. EN pin
Do not make the voltage level of the chip’s enable pin at floating level or in between VEN(High) and VEN(Low). Otherwise,
the output voltage would be unstable or indefinite.
13. For a steep change of the Vcc voltage
Because MOSFET for output Transistor is used when an input voltage change is very steep, it may evoke large current.
When selecting the value of external circuit constants, please make sure that the operation on the actual application
takes these conditions into account.
14. For infinitesimal fluctuations of output voltage.
For applications that have infinitesimal fluctuations of the output voltage caused by some factors (e.g. disturbance noise,
input voltage fluctuations, load fluctuations, etc.), please take enough measures to avoid some influence (e.g. insert a
filter, etc.).
15. Over current protection circuit (OCP)
The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output
capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit
output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other
component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.
However, the IC should not be used in applications characterized by the continuous or transitive operation of the
protection circuits.
16. Thermal Shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off, completely, in the event of
thermal overload. It is not designed to protect the IC from damage or guarantee its operation. IC’s should not be used
after this function has activated, or in applications where the operation of this circuit is assumed.
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Datasheet
BDxxFC0 series
17. In some applications, the Vcc and the Vo potential might be reversed, possibly resulting in circuit internal damage or
damage to the elements. For example, the accumulated charge in the output pin capacitor flow backward from the Vo to
the Vcc when the Vcc shorts to the GND. Use a capacitor with a capacitance with less than 1000μF for reducing the
damage. We also recommend using reverse polarity diodes in series between the Vcc and the GND or a bypass diode
between the Vo and the Vcc.
18. Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes
and/or transistors. For example (refer to the Figure below):
○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode
○When GND > Pin B, the PN junction operates as a parasitic transistor
Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Example of monolithic IC structure
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Datasheet
BDxxFC0 series
●Physical Dimension Tape and Reel InformationS
Package Name
HTSOP-J8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
∗ Order quantity needs to be multiple of the minimum quantity.
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Datasheet
BDxxFC0 series
Package Name
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TO252-3
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Datasheet
BDxxFC0 series
Package Name
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TO252-5
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Datasheet
BDxxFC0 series
●Marking Diagram
TO252-3
TO252-3
(TOP VIEW)
Part Number Marking
Output
Voltage[V]
Part Number
Marking
3.3
33FC0
5.0
50FC0
LOT Number
1PIN
TO252-5
(TOP VIEW)
TO252-5
Part Number Marking
LOT Number
1PIN
Output
Voltage[V]
Part Number
Marking
Variable
00FC0W
3.0
30FC0W
3.3
33FC0W
5.0
50FC0W
6.0
60FC0W
7.0
70FC0W
8.0
80FC0W
9.0
90FC0W
10.0
J0FC0W
12.0
J2FC0W
15.0
J5FC0W
Output
Voltage[V]
Part Number
Marking
Variable
00FC0W
3.0
30FC0W
3.3
33FC0W
5.0
50FC0W
6.0
60FC0W
7.0
70FC0W
8.0
80FC0W
9.0
90FC0W
10.0
J0FC0W
12.0
J2FC0W
15.0
J5FC0W
HTSOP-J8
HTSOP-J8 (TOP VIEW)
Part Number Marking
x x F C 0 W
LOT Number
1PIN MARK
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Datasheet
BDxxFC0 series
●Revision History
Date
27.Aug.2013
Revision
001
20.Oct. 2015
002
02.Dec. 2015
003
16.May. 2016
004
Changes
New Release
Add BDxxFC0FP and BDxxFC0WFP
Change pin name OUT -> Vo
P2 Lineup modified
The document control number:TSZ02201-0GAG0A600040-1-2
-> TSZ02201-0G2G0A600040-1-2
P8 Power dissipation deleted
P8 notes added in electrical characteristics
P9 Copper Pattern area modified
Misentry modified in Whole page
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD50FC0FP - Web Page
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD50FC0FP
TO252-3
2000
2000
Taping
inquiry
Yes