ON CM1440-06CP 6-channel emi filter array with esd protection Datasheet

6-Channel EMI Filter Array
with ESD Protection
CM1440
Features
Product Description
•
•
The CM1440 is a six channel low-pass EMI filter
array with ESD protection that reduces EMI/RFI
emissions while providing robust protection from ESD
strikes. Each EMI filter channel integrates a high
quality pi-style filter (30pF-100Ω-30pF) which
provides greater than 30dB of attenuation in the
800MHz to 2.7GHz frequency range. The parts
include avalanche-type ESD diodes on every pin,
which provide a very high level of protection for
sensitive electronic components that may be
subjected to electrostatic discharge (ESD). The ESD
protection diodes connected to the filter ports safely
dissipate ESD strikes of ±30kV, beyond the
maximum requirement of the IEC61000-4-2
international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the pins are protected for contact
discharges at greater than ±30kV.
•
•
•
•
•
•
•
Six channels of EMI filtering for data ports
Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network
±30kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±30kV ESD protection on each channel (HBM)
Greater than 35dB attenuation (typical) at 1 GHz
15-bump, 0.4mm pitch, 2.360mm x 1.053mm
footprint Chip Scale Package (CSP)
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
OptiGuard™ coated for improved reliability at
assembly
RoHS compliant (lead-free) finishing
Applications
•
•
•
•
•
•
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs
or notebook computers.
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
This device is particularly well-suited for portable
electronics (e.g. wireless handsets, PDAs, notebook
computers) because of its small package and easyto-use pin assignments. In particular, the CM1440 is
ideal for EMI filtering and protecting data and control
lines for the I/O data ports, LCD display and camera
interface in mobile handsets.
The CM1440 incorporates OptiGuard™ which results
in improved reliability at assembly. The CM1440 is
available in a space saving, low profile Chip Scale
Package with RoHS compliant lead-free finishing. It is
manufactured with a 0.40mm pitch and 0.25mm CSP
solder ball to provide up to 28% board space savings
versus competing CSP devices with 0.50mm pitch
and 0.30mm CSP solder ball.
©2010 SCILLC. All rights reserved.
April 2010 Rev. 3
Publication Order Number:
CM1440/D
CM1440
Electrical Schematic
1 of 6 EMI/RFI + ESD Channels
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
A1
FILTER1
Filter Channel 1
A2
FILTER2
Filter Channel 2
A3
FILTER3
Filter Channel 3
A4
FILTER4
Filter Channel 4
A5
FILTER5
Filter Channel 5
A6
FILTER6
Filter Channel 6
B1-B3
GND
Device Ground
C1
FILTER1
Filter Channel 1
C2
FILTER2
Filter Channel 2
C3
FILTER3
Filter Channel 3
C4
FILTER4
Filter Channel 4
C5
FILTER5
Filter Channel 5
C6
FILTER6
Filter Channel 6
Rev. 3 | Page 2 of 12 | www.onsemi.com
CM1440
Ordering Information
PART NUMBERING INFORMATION
Pins
Package
Ordering Part Number1
Part Marking
15
CSP
CM1440-06CP
N406
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Rev. 3 | Page 3 of 12 | www.onsemi.com
CM1440
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL
R
PARAMETER
CONDITIONS
Resistance
CTOTAL
MIN
TYP
MAX
UNITS
80
100
120
Ω
Total Channel Capacitance
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
48
60
72
pF
C
Capacitance C1
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
24
30
36
pF
VDIODE
Standoff Voltage
IDIODE=10μA
6.0
ILEAK
Diode Leakage Current (reverse bias)
VDIODE= 3.3V
0.1
1
μA
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
6.8
-0.8
9.0
-0.4
V
V
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method
3015
b) Contact Discharge per IEC 61000-4-2 Level 4
Note 2
VESD
RDYN
f
C
5.6
-1.5
Dynamic Resistance
Positive
Negative
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
V
±30
kV
±30
kV
2.3
0.9
Ω
Ω
60
MHz
R=100Ω, C=30pF
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Rev. 3 | Page 4 of 12 | www.onsemi.com
CM1440
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1)
Rev. 3 | Page 5 of 12 | www.onsemi.com
CM1440
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
Rev. 3 | Page 6 of 12 | www.onsemi.com
CM1440
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3)
Rev. 3 | Page 7 of 12 | www.onsemi.com
CM1440
Performance Information (cont’d)
Typical Diode Capacitance vs. Input Voltage
Figure 7. Filter Capacitance vs. Input Voltage
(normalized to capacitance at 2.5VDC and 25°C)
Rev. 3 | Page 8 of 12 | www.onsemi.com
CM1440
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 3 | Page 9 of 12 | www.onsemi.com
260°C
CM1440
Mechanical Details
CSP Mechanical Specifications
CM1440 devices are supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the California Micro Devices CSP Package Information
document.
# per tape and
reel
PACKAGE DIMENSIONS
3500 pieces
Controlling dimension: millimeters
Package
Custom CSP
Bumps
15
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
2.3150 2.3600 2.4050
0.911
0.0929 0.0947
A2
1.008
1.053
1.098
0.0397 0.0415 0.0432
B1
0.395
0.4000 0.405
0.0156 0.0157 0.0159
B2
0.195
0.2000 0.205
0.0076 0.0078 0.0080
B3
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
B4
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138
C1
0.130
0.1800 0.230
0.0051 0.0071 0.0091
C2
0.130
0.1800 0.230
0.0051 0.0071 0.0091
D1
0.575
0.644
0.714
0.0226 0.0254 0.0281
D2
0.368
0.419
0.470
0.0145 0.0165 0.0185
B3
A1
0.25 DIA.
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
Package Dimensions for
CM1440 Chip Scale Package
Rev. 3 | Page 10 of 12 | www.onsemi.com
CM1440
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
CM1440
2.36 X 1.053X
0.644
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
2.62 X 1.12X 0.76
8mm
178mm (7")
3500
4mm
4mm
+
+
+
Figure 10. Tape and Reel Mechanical Data
Rev. 3 | Page 11 of 12 | www.onsemi.com
CM1440
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
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Rev. 3 | Page 12 of 12 | www.onsemi.com
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