6-Channel EMI Filter Array with ESD Protection CM1440 Features Product Description • • The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes. Each EMI filter channel integrates a high quality pi-style filter (30pF-100Ω-30pF) which provides greater than 30dB of attenuation in the 800MHz to 2.7GHz frequency range. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports safely dissipate ESD strikes of ±30kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • Six channels of EMI filtering for data ports Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network ±30kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 35dB attenuation (typical) at 1 GHz 15-bump, 0.4mm pitch, 2.360mm x 1.053mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance OptiGuard™ coated for improved reliability at assembly RoHS compliant (lead-free) finishing Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules This device is particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package and easyto-use pin assignments. In particular, the CM1440 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1440 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1440 is available in a space saving, low profile Chip Scale Package with RoHS compliant lead-free finishing. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space savings versus competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball. ©2010 SCILLC. All rights reserved. April 2010 Rev. 3 Publication Order Number: CM1440/D CM1440 Electrical Schematic 1 of 6 EMI/RFI + ESD Channels PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION A1 FILTER1 Filter Channel 1 A2 FILTER2 Filter Channel 2 A3 FILTER3 Filter Channel 3 A4 FILTER4 Filter Channel 4 A5 FILTER5 Filter Channel 5 A6 FILTER6 Filter Channel 6 B1-B3 GND Device Ground C1 FILTER1 Filter Channel 1 C2 FILTER2 Filter Channel 2 C3 FILTER3 Filter Channel 3 C4 FILTER4 Filter Channel 4 C5 FILTER5 Filter Channel 5 C6 FILTER6 Filter Channel 6 Rev. 3 | Page 2 of 12 | www.onsemi.com CM1440 Ordering Information PART NUMBERING INFORMATION Pins Package Ordering Part Number1 Part Marking 15 CSP CM1440-06CP N406 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 3 | Page 3 of 12 | www.onsemi.com CM1440 ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R PARAMETER CONDITIONS Resistance CTOTAL MIN TYP MAX UNITS 80 100 120 Ω Total Channel Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC 48 60 72 pF C Capacitance C1 At 2.5VDC Reverse Bias, 1MHz, 30mVAC 24 30 36 pF VDIODE Standoff Voltage IDIODE=10μA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE= 3.3V 0.1 1 μA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA 6.8 -0.8 9.0 -0.4 V V In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 VESD RDYN f C 5.6 -1.5 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω V ±30 kV ±30 kV 2.3 0.9 Ω Ω 60 MHz R=100Ω, C=30pF Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Rev. 3 | Page 4 of 12 | www.onsemi.com CM1440 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1) Rev. 3 | Page 5 of 12 | www.onsemi.com CM1440 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) Rev. 3 | Page 6 of 12 | www.onsemi.com CM1440 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3) Rev. 3 | Page 7 of 12 | www.onsemi.com CM1440 Performance Information (cont’d) Typical Diode Capacitance vs. Input Voltage Figure 7. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25°C) Rev. 3 | Page 8 of 12 | www.onsemi.com CM1440 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 9 of 12 | www.onsemi.com 260°C CM1440 Mechanical Details CSP Mechanical Specifications CM1440 devices are supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. # per tape and reel PACKAGE DIMENSIONS 3500 pieces Controlling dimension: millimeters Package Custom CSP Bumps 15 Millimeters Inches Dim Min Nom Max Min Nom Max 2.3150 2.3600 2.4050 0.911 0.0929 0.0947 A2 1.008 1.053 1.098 0.0397 0.0415 0.0432 B1 0.395 0.4000 0.405 0.0156 0.0157 0.0159 B2 0.195 0.2000 0.205 0.0076 0.0078 0.0080 B3 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 B4 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 C1 0.130 0.1800 0.230 0.0051 0.0071 0.0091 C2 0.130 0.1800 0.230 0.0051 0.0071 0.0091 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 B3 A1 0.25 DIA. 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS Package Dimensions for CM1440 Chip Scale Package Rev. 3 | Page 10 of 12 | www.onsemi.com CM1440 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) CM1440 2.36 X 1.053X 0.644 POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 2.62 X 1.12X 0.76 8mm 178mm (7") 3500 4mm 4mm + + + Figure 10. Tape and Reel Mechanical Data Rev. 3 | Page 11 of 12 | www.onsemi.com CM1440 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Rev. 3 | Page 12 of 12 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative