NCN1154 USB 2.0 High Speed, UART and Audio Switch with Negative Signal Capability The NCN1154 is a DP3T switch for combined true−ground audio, USB 2.0 high speed data, and UART applications. It allows portable systems to use a single port to pass either high speed data or audio signals from an external headset; the 3 channels being compliant to USB 2.0, USB 1.1 and USB 1.0. The switch is capable of passing signals with negative voltages as low as 2 V below ground. The device features shunt resistors on the audio ports. These resistors are switched in when the audio channel is off and provide a safe path to ground for any charge that may build up on the audio lines. This reduces Pop & Click noise in the audio system. The NCN1154 is housed in a space−saving, ultra low profile 2.0x1.7x0.5mm, 12 pin UQFN package. www.onsemi.com MARKING DIAGRAM 1 AC = Specific Device Code M = Date Code G = Pb−Free Package Features • • • • • 3:1 High Speed Switch USB 2.0, USB 1.1 & USB 1.0 Capable on all Channels High Bandwidth of 820 MHz on D+/D− Capable of Passing Negative Swing Signals Down to −2 V on R/L Channel 1.8 V Compatible Control Pins for 2.7 V v VCC v 4.2 V Audio Channel Shunt Resistors for Pop & Click Noise Reduction Ultra Low THD in Audio Mode: 0.01% into 16 W Load 5.25 V Tolerant Common Pins This is a Pb−Free Device APPLICATION DIAGRAM NCN1154 COM+ Rx COM− Tx R Micro or Mini USB Applications Shared High Speed Data or Audio on a Single Connector Mobile Phones Tablets Bar Code Scanners Portable Devices IN1, IN2 USB/ UART USB/ UART USB/ UART/ Audio L Typical Applications • • • • • • D+ D− USB Connector • • • • ACM G UQFN12 MU SUFFIX CASE 523AE From Baseband ORDERING INFORMATION Device NCN1154MUTAG Package Shipping† UQFN12 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2015 April, 2015 − Rev. 5 1 Publication Order Number: NCN1154/D NCN1154 VCC D+ COM+ D− TX L RX IN1 D+ 1 Tx 2 10 COM+ VCC 3 9 GND Rx 4 8 COM− D− 5 7 IN2 12 11 L COM− R IN1 Control Logic 6 R GND (Top View) IN2 Figure 1. Functional Block Diagram Figure 2. Pinout Diagram PIN DESCRIPTIONS Pin # Name Direction Description 1 D+ I/O Positive Data Line for USB Signals 2 Tx I/O Transmit Data Line for UART Signals 3 VCC Power 4 Rx I/O Receive Data Line for UART Signals 5 D− I/O Negative Data Line for USB Signals 6 R I/O Right Line for Audio Signals 7 IN2 Input 8 COM− I/O 9 GND Power 10 COM+ I/O 11 IN1 Input 12 L I/O Power Supply Control Input Select Line Right Audio / Negative Data Common Line Ground Left Audio / Positive Data Common Line Control Input Select Line Left Line for Audio Signals TRUTH TABLE IN1 IN2 D+, D− RX/TX L, R L, R SHUNT 0 0 Hi Z Hi Z Hi Z ON 0 1 ON Hi Z Hi Z ON 1 0 Hi Z Hi Z ON OFF 1 1 Hi Z ON Hi Z ON www.onsemi.com 2 NCN1154 OPERATING CONDITIONS MAXIMUM RATINGS Symbol Pins VCC VCC VIS R, L, D+, D−, Rx, Tx Parameter Value Unit −0.5 to +6.0 V −2.5 to VCC + 0.5 V Positive DC Supply Voltage Analog I/O COM+, COM− VIN IN1, IN2 ICC VCC TS −2.5 to +6.0 Control Input Voltage −0.5 to +6.0 V 50 mA −65 to +150 °C Positive DC Supply Current Storage Temperature IIS_CON COM+, COM−, R, L, D+, D−, Rx, Tx Analog Signal Continuous Current−Closed Switch $100 mA IIS_PK COM+, COM−, R, L, D+, D−, Rx, Tx Analog Signal Continuous Current 10% Duty Cycle $500 mA 1.0 mA IIN IN1, IN2 Control Input Current Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. NOTE: These devices have limited built−in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage. RECOMMENDED OPERATING CONDITIONS Symbol Pins VCC VCC VIS D+ to COM+, D− to COM− VIN Min Max Unit 2.7 5.0 V GND VCC V L to COM+, R to COM− −2.0 VCC Tx to COM+, Rx to COM− GND VCC GND VCC V −40 +85 °C IN1, IN2 TA Parameter Positive DC Supply Voltage Analog Signal Voltage (Note 1) Control Input Voltage Operating Temperature Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. In USB mode, any signal supplied to the off−state audio inputs R, L may not swing below ground or above 1.5 V. DC ELECTRICAL CHARACTERISTICS CONTROL INPUT Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. −40°C to +85°C Symbol VIH Pins IN1, IN2 Parameter Control Input HIGH Voltage VIL IN1, IN2 Control Input LOW Voltage IIN IN1, IN2 Current Input Leakage Current Test Conditions 0 ≤ VIS ≤ VCC www.onsemi.com 3 VCC (V) 2.7 3.3 4.2 Min Typ Max 1.3 1.4 1.5 − − 2.7 3.3 4.2 − − 0.4 0.4 0.4 V − − ±50 nA Unit V NCN1154 SUPPLY CURRENT AND LEAKAGE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. −40°C to +85°C Symbol INC,NO(OFF) Pins D+, D− R, L Tx, Rx Parameter OFF State Leakage Test Conditions VCOM−, VCOM+ = 0 V, 4.2 V VD+, VD− = 4.2 V, 0 V or float VL, VR = float or 4.2 V, 0 V VCC (V) 4.2 ICOM(ON) COM−, COM+ ON State Leakage VCOM−, VCOM+ = 0 V, 4.2 V VD+, VD− = 4.2 V, 0 V or float VL, VR = float or 4.2 V, 0 V 4.2 ICC IOFF VCC COM−, COM+ Quiescent Supply Power OFF Leakage VIS = GND to VCC; ID = 0 A 0 ≤ VIS ≤ 5.0 V 4.2 0 Min Typ 21 Max ±80 Unit nA ±100 nA 35 50 mA mA USB ON RESISTANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. −40°C to +85°C VCC (V) 2.7 3.3 4.2 Min Typ Max 5.5 5.5 5.5 7.5 7.5 7.5 Symbol RON Pins D+ to COM+ D− to COM− Parameter On−Resistance Test Conditions ION = 10 mA VIS = 0 V to VCC Unit W RFLAT D+ to COM+ D− to COM− On−Resistance Flatness ION = 10 mA VIS = 0 V to VCC 2.7 3.3 4.2 0.08 0.08 0.08 W DRON D+ to COM+ D− to COM− On−Resistance Matching ION = 10 mA VIS = 0 V to VCC 2.7 3.3 4.2 0.03 0.03 0.03 W AUDIO ON RESISTANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. −40°C to +85°C Min Typ Max 3.0 3.0 3.0 4.7 4.7 4.7 Symbol RON Pins R to COM+ L to COM− Parameter On−Resistance Test Conditions ION = 10 mA VIS = −1.5 to 1.5 RFLAT R to COM+ L to COM− On−Resistance Flatness ION = 10 mA VIS = −1.5 to 1.5 2.7 3.3 4.2 0.11 0.11 0.11 W DRON R to COM+ L to COM− On−Resistance Matching ION = 10 mA VIS = −1.5 to 1.5 2.7 3.3 4.2 0.03 0.03 0.03 W Shunt Resistance (Resistor + Switch) ION = 10 mA 2.7 − 4.2 118 RSH L, R VCC (V) 2.7 3.3 4.2 160 Unit W W UART ON RESISTANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. −40°C to +85°C Min Typ Max 5.5 5.5 5.5 7.5 7.5 7.5 Symbol RON Pins Tx to COM+ Rx to COM− Parameter On−Resistance Test Conditions ION = 10 mA VIS = 0 V to VCC RFLAT Tx to COM+ Rx to COM− On−Resistance Flatness ION = 10 mA VIS = 0 V to VCC 2.7 3.3 4.2 0.08 0.08 0.08 W DRON Tx to COM+ Rx to COM− On−Resistance Matching ION = 10 mA VIS = 0 V to VCC 2.7 3.3 4.2 0.03 0.03 0.03 W VCC (V) 2.7 3.3 4.2 Unit W Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 4 NCN1154 AC ELECTRICAL CHARACTERISTICS TIMING/FREQUENCY Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. RL = 50 W, CL = 35 pF, f = 1 MHz. −405C to +855C Symbol Pins Parameter Test Conditions VCC (V) Min Typ Max Unit tON Turn−ON Time (Closed to Open) 15 ms tOFF Turn−OFF Time (Closed to Open) 67 ns TBBM Break−Before−Make Time 11 ms 820 800 750 MHz BW D+ / DTx / Rx R/L −3 dB Bandwidth CL = 5 pF RS = 50 W ISOLATION Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. RL = 50 W, CL = 5 pF. −405C to +855C Symbol Pins OIRR Open XTALK COM+ to COM− Parameter Test Conditions VCC (V) Min Typ Max Unit OFF−Isolation f = 100 kHz, RS = 50 W −81 dB Non−Adjacent Channel Crosstalk f = 100 kHz, RS = 50 W −93 dB THD+N Total Harmonic Distortion + Noise IN1, IN2 = 3.0 V f = 20 Hz to 20 kHz VCOM = 0.5 Vpp RL = 600 W 3.0 0.001 % PSRR Power Supply Rejection Ratio f = 10 kHz RCOM = 50 W 3.0 60 dB CAPACITANCE Min and Max apply for TA between −40°C to +85°C and TJ up to +125°C (Unless otherwise noted). Typical values are referenced to TA = +25°C, VCC = 3.3 V. RL = 50 W, CL = 5 pF, f = 1 MHz. −405C to +855C Symbol Pins CIN IN1, IN2 CON Parameter Test Conditions Control Pin Input Capacitance VCC = 0 V R to COM+ L to COM− COFF D+, D− Tx, Rx Typ Max Unit 2.0 pF 9.0 pF Audio ON Capacitance 8.5 pF USB, UART OFF Capacitance 3.5 pF D+, Tx to COM+ USB, UART ON Capacitance D−, Rx to COM− CON Min www.onsemi.com 5 NCN1154 TABLE OF GRAPHS Symbol Parameter Figure NE Near End Signaling Eye Diagram 3, 4, 5, 6 FE Far End Signaling Eye Diagram 7, 8, 9, 10 BW Frequency Response 11, 12, 13 Figure 3. Reference Near End Eye Diagram (Path Trough Dedicated Line, Temp = 255C) Figure 4. USB Switch Near End Eye Diagram (VCC = 3.6 V, IN1 = 0, IN2 = 1, Temp = 255C) Figure 5. UART Switch Near End Eye Diagram (VCC = 3.6 V, IN1 = 1, IN2 = 1, Temp = 255C) Figure 6. Audio Switch Near End Eye Diagram (VCC = 3.6 V, IN1 = 1, IN2 = 0, Temp = 255C) www.onsemi.com 6 NCN1154 Figure 7. Reference Far End Eye Diagram (Path Trough Dedicated Line, Temp = 255C) Figure 8. USB Switch Far End Eye Diagram (VCC = 3.6V, IN1 = 0, IN2 = 1, Temp = 255C) Figure 9. UART Switch Far End Eye Diagram (Vcc = 3.6 V, IN1 = 1, IN2 = 1, Temp = 255C) Figure 10. Audio Switch Far End Eye Diagram (VCC = 3.6 V, IN1 = 1, IN2 = 0, Temp = 255C) www.onsemi.com 7 NCN1154 0 −1 −1 D+ D− MAGNITUDE (dB) −3 −4 −5 −6 −7 −8 −3 −4 −5 −6 −7 −8 −9 −10 100k Tx Rx −2 −9 1M 10M 100M 1000M −10 100k 1M 10M 100M 1000M FREQUENCY (Hz) FREQUENCY (Hz) Figure 11. USB Path Frequency Response Figure 12. UART Path Frequency Response 0 L −1 R −2 MAGNITUDE (dB) MAGNITUDE (dB) −2 0 −3 −4 −5 −6 −7 −8 −9 −10 100k 1M 10M 100M 1000M FREQUENCY (Hz) Figure 13. Audio Path Frequency Response www.onsemi.com 8 NCN1154 PACKAGE DIMENSIONS UQFN12 1.7x2.0, 0.4P CASE 523AE ISSUE A ÉÉ ÉÉ ÉÉ D PIN 1 REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH 0.03 MAX ON BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B L1 DETAIL A E NOTE 5 TOP VIEW DIM A A1 A3 b D E e K L L1 L2 DETAIL B A 0.05 C DETAIL B OPTIONAL CONSTRUCTION 12X 0.05 C A1 A3 8X C SIDE VIEW SEATING PLANE K 5 MOUNTING FOOTPRINT SOLDERMASK DEFINED 7 DETAIL A e 2.00 1 12X 1 11 L MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.70 BSC 2.00 BSC 0.40 BSC 0.20 ---0.45 0.55 0.00 0.03 0.15 REF 12X L2 BOTTOM VIEW b 0.10 M C A B 0.05 M C 0.32 NOTE 3 0.40 PITCH 2.30 11X 0.22 12X 0.69 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 9 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCN1154/D