Shoulder HDF459MF11 This specification shall cover the characteristics of saw filter 459mhz with used for remote-control security Datasheet

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDF459M F11
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2010-10-28
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 1 of 6
SAW FILTER
HDF459M
F11
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Page 2 of 6
SAW FILTER
HDF459M
F11
1. SCOPE
This specification shall cover the characteristics of SAW filter 459MHz with used for
remote-control security.
2. ELECTRICAL SPECIFICATION
DC Voltage VDC
AC Voltage Vpp
Operation temperature
Storage temperature
RF Power Dissipation
Electronic Characteristics
10V
10V50Hz/60Hz
-40℃ to +85℃
-45℃ to +85℃
0dBm
2-1.Type frequency response
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Page 3 of 6
SAW FILTER
HDF459M
2-2.Electrical characteristics
Characteristic
Sym
Norminal Frequency
fc
459
Insertion Loss
IL
2.5
BW3
800
3dB Bandwidth
Temperature
Stability
Units
MHz
4.0 *
dB
KHz
Fo
fc
KHz
FTC
0.032
ppm/℃
|fA|
10
ppm/yr
1.0
2
MΩ
at fc-21.4MHz (Image)
40
46
at fc-10.7MHz (Lo)
16
30
Ultimate
35
℃
Turnover Frequency
DC Insulation Resistance
between Any Two Pins
25
Max
To
Frequecy Temp.Coefficient
15
Typical
Turnover Temp.
Frequency Aging Absolute Value
during the First Year
Rejection
Min
F11
dB
55
* With High Q-Factor inductance
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Page 4 of 6
SAW FILTER
HDF459M
F11
3. TEST CIRCUIT
L1=39nH;L2=39nH
C1=14pF;C2=14pF
4. DIMENSION
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Page 5 of 6
SAW FILTER
HDF459M
F11
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.
5-2 Low temperature exposure
Subject the device to -40℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high
temperature of +85℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in 2-2.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
meet the specifications in 2-2.
5-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
2-2.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in 2-2.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2-2.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be solded. Please avoid soldering another part of
component.
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Page 6 of 6
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