TI ADS1013 Ultra-small, low-power, spiâ ¢-compatible, 16-bit analog-to-digital converter and temperature sensor with internal reference Datasheet

ADS1118
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SBAS457C – OCTOBER 2010 – REVISED FEBRUARY 2013
Ultra-Small, Low-Power, SPI™-Compatible, 16-Bit
Analog-to-Digital Converter and Temperature Sensor with Internal Reference
Check for Samples: ADS1118
FEATURES
DESCRIPTION
•
The ADS1118 is a precision analog-to-digital
converter (ADC) with 16 bits of resolution offered in
an ultra-small, leadless QFN-10 package or an
MSOP-10 package. The ADS1118 is designed with
precision, power, and ease of implementation in
mind. The ADS1118 features an integrated voltage
reference and oscillator. Data are transferred via a
serial peripheral interface (SPI). The ADS1118
operates from a single power supply ranging from
2.0 V to 5.5 V.
1
23
•
•
•
•
•
•
•
•
•
Ultra-Small QFN Package:
2 mm × 1,5 mm × 0,4 mm
Wide Supply Range: 2.0 V to 5.5 V
Low Current Consumption:
– Continuous Mode: Only 150 μA
– Single-Shot Mode: Auto Power-Down
Programmable Data Rate:
8 SPS to 860 SPS
Single-Cycle Settling
Internal Low-Drift Voltage Reference
Internal Temperature Sensor:
0.5°C (max) Error
Internal Oscillator
Internal PGA
Four Single-Ended or Two Differential Inputs
APPLICATIONS
•
•
•
Temperature Measurement:
– Thermocouple Measurement
– Cold Junction Compensation
– Thermistor Measurement
Portable Instrumentation
Factory Automation and Process Controls
The ADS1118 can perform conversions at rates up to
860 samples per second (SPS). A programmable
gain amplifier (PGA) is integrated in the ADS1118
that offers input ranges from as low as ±256 mV up to
the supply rails, allowing both large and small signals
to be measured with high resolution. The ADS1118
also features an input multiplexer (MUX) that provides
two differential or four single-ended inputs. The
ADS1118 can also function as a high-accuracy
temperature sensor. This temperature sensor can be
used for system-level temperature monitoring or cold
junction compensation for thermocouples.
The ADS1118 operates either in continuous
conversion mode or single-shot mode that
automatically powers down after a conversion.
Single-shot mode significantly reduces current
consumption during idle periods. The ADS1118 is
specified from –40°C to +125°C.
2V
0.1 mF
2V
1 MW
GND
500 W
0.1 mF
GND
AIN0
VDD
1 mF
1 MW
500 W
Device
Voltage
Reference
AIN1
0.1 mF
SCLK
GND
GND
2V
1 MW
MUX
500 W
GND
16-Bit DS
ADC
SPI
Interface
GND
500 W
0.1 mF
1 mF
1 MW
PGA
0.1 mF
CS
DOUT/DRDY
DIN
AIN2
Oscillator
AIN3
High Accuracy
Temp Sensor
GND
GND
GND
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Motorola.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2013, Texas Instruments Incorporated
ADS1118
SBAS457C – OCTOBER 2010 – REVISED FEBRUARY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or visit the device product folder on www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
VALUE
VDD to GND
Analog input current
mA
10, continuous
mA
V
–0.3 to +5.5
V
Human body model (HBM)
JEDEC standard 22, test method A114-C.01, all pins
±4000
V
Charged device model (CDM)
JEDEC standard 22, test method C101, all pins
±1000
V
–40 to +125
°C
+150
°C
–60 to +150
°C
DIN, DOUT/DRDY, SCLK, CS voltage to GND
Operating temperature range
Maximum junction temperature
Storage temperature range
(1)
V
100, momentary
–0.3 to VDD + 0.3
Analog input voltage to GND
Electrostatic discharge
(ESD) ratings
UNIT
–0.3 to +5.5
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
PRODUCT FAMILY
2
DEVICE
RESOLUTION
(Bits)
MAXIMUM
SAMPLE RATE
(SPS)
INPUT CHANNELS
[Differential
(Single-Ended)]
PGA
INTERFACE
SPECIAL FEATURES
ADS1118
16
860
2 (4)
Yes
SPI
Temperature sensor
BBEI, SDQ
ADS1018
12
3300
2 (4)
Yes
SPI
Temperature sensor
BTNQ, SDZ
ADS1115
16
860
2 (4)
Yes
I2C
Comparator
BOGI, N4J
ADS1114
16
860
1 (1)
Yes
I2C
Comparator
BRNI, N5J
ADS1113
16
860
1 (1)
No
I2C
None
BROI, N6J
ADS1015
12
3300
2 (4)
Yes
I2C
Comparator
BRPI, N7J
2
PACKAGE
DESIGNATOR
MSOP, QFN
ADS1014
12
3300
1 (1)
Yes
IC
Comparator
BRQI, N8J
ADS1013
12
3300
1 (1)
No
I2C
None
BRMI, N9J
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SBAS457C – OCTOBER 2010 – REVISED FEBRUARY 2013
ELECTRICAL CHARACTERISTICS
Maximum and minimum specifications are at TA = –40°C to +125°C, unless otherwise noted. Typical values are at TA =
+25°C. All specifications are at VDD = 3.3 V, data rate = 8 SPS, and full-scale (FS) = ±2.048 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VDD
V
ANALOG INPUT
Full-scale input voltage range (1)
VIN = (AINP) – (AINN)
Analog input voltage
AINP or AINN to GND
See Table 2
GND
Differential input impedance
Common-mode input impedance
See Table 1
FS = ±6.144 V (1)
8
MΩ
(1)
FS = ±4.096 V , ±2.048 V
6
MΩ
FS = ±1.024 V
3
MΩ
100
MΩ
FS = ±0.512V, ±0.256 V
SYSTEM PERFORMANCE
Resolution
No missing codes
16
Data rate (DR)
Data rate variation
All data rates
–10
Output noise
Integral nonlinearity
Offset error
Bits
8, 16, 32, 64, 128, 250, 475, 860
SPS
10
%
1
LSB
±2
LSB
See Typical Characteristics
DR = 8 SPS, FS = ±2.048 V (2)
FS = ±2.048 V, differential inputs
±0.1
FS = ±2.048 V, single-ended inputs
±0.25
LSB
Offset drift
FS = ±2.048 V
0.002
LSB/°C
Offset power-supply rejection
FS = ±2.048 V, with dc supply variation
0.2
LSB/V
Gain error
(3)
FS = ±2.048 V at TA = +25°C
0.01
FS = ±0.256 V
Gain drift (3) (4)
FS = ±2.048 V
FS = ±6.144 V
0.15
7
5
(1)
40
5
Gain power-supply rejection
%
ppm/°C
ppm/°C
ppm/°C
10
ppm/V
PGA gain match (3)
Match between any two PGA gains
0.01
0.1
%
Gain match
Match between any two inputs
0.01
0.1
%
Offset match
Match between any two inputs
0.6
LSB
At dc and FS = ±0.256 V
105
dB
At dc and FS = ±2.048 V
100
dB
Common-mode rejection
At dc and FS = ±6.144 V
(1)
90
dB
fCM = 50 Hz, DR = 860 SPS
105
dB
fCM = 60 Hz, DR = 860 SPS
105
dB
TEMPERATURE SENSOR
Temperature sensor range
–40
Temperature sensor resolution
TA = 0°C to +70°C
Temperature sensor accuracy
TA = –40°C to +125°C
vs supply
(1)
(2)
(3)
(4)
+125
0.03125
0.2
°C
°C/LSB
±0.5
0.4
±1
0.03125
±0.25
°C
°C
°C/V
This parameter expresses the full-scale range of the ADC scaling. In no event should more than VDD + 0.3 V or 5.5 V (whichever is
smaller) be applied to this device.
Best-fit INL; covers 99% of full-scale.
Includes all errors from onboard PGA and reference.
Not production tested; ensured by characterization.
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ELECTRICAL CHARACTERISTICS (continued)
Maximum and minimum specifications are at TA = –40°C to +125°C, unless otherwise noted. Typical values are at TA =
+25°C. All specifications are at VDD = 3.3 V, data rate = 8 SPS, and full-scale (FS) = ±2.048 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUT/OUTPUT
Logic level
VIH
0.7 VDD
VDD
V
VIL
GND
0.2 VDD
V
VOH
IOH = 1 mA
0.8 VDD
VOL
IOL = 1 mA
GND
V
0.2 VDD
V
Input leakage
IH
VIH = 5.5 V
±10
μA
IL
VIL = GND
±10
μA
5.5
V
2
μA
5
μA
200
μA
300
μA
POWER-SUPPLY REQUIREMENTS
Power-supply voltage
2
Power-down current at TA = +25°C
0.5
Power-down current up to TA = +125°C
Supply current
Operating current at TA = +25°C
150
Operating current up to TA = +125°C
Power dissipation
VDD = 5.0 V
0.9
mW
VDD = 3.3 V
0.5
mW
VDD = 2.0 V
0.3
mW
TEMPERATURE
Storage temperature
–60
+150
°C
Specified temperature
–40
+125
°C
THERMAL INFORMATION
ADS1118
THERMAL METRIC (1)
MSOP (DGS)
QFN (RUG)
10 PINS
10 PINS
245.2
θJA
Junction-to-ambient thermal resistance
186.8
θJCtop
Junction-to-case (top) thermal resistance
51.5
69.3
θJB
Junction-to-board thermal resistance
108.4
172.0
ψJT
Junction-to-top characterization parameter
2.7
8.2
ψJB
Junction-to-board characterization parameter
106.5
170.8
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
n/a
(1)
4
UNITS
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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SBAS457C – OCTOBER 2010 – REVISED FEBRUARY 2013
PIN CONFIGURATIONS
RUG PACKAGE
QFN-10
(TOP VIEW)
DGS PACKAGE
MSOP-10
(TOP VIEW)
DIN
10
SCLK
1
9
DOUT/DRDY
CS
2
8
VDD
GND
3
7
AIN3
AIN0
4
6
AIN2
SCLK
1
10 DIN
CS
2
9
DOUT/DRDY
GND
3
8
VDD
AIN0
4
7
AIN3
AIN1
5
6
AIN2
5
AIN1
PIN DESCRIPTIONS
PIN #
PIN NAME
FUNCTION
1
SCLK
Digital input
Serial clock input
DESCRIPTION
2
CS
Digital input
Chip select; active low
3
GND
Analog
4
AIN0
Analog input
Differential channel 1: positive input or single-ended channel 1 input
5
AIN1
Analog input
Differential channel 1: negative input or single-ended channel 2 input
6
AIN2
Analog input
Differential channel 2: positive input or single-ended channel 3 input
7
AIN3
Analog input
Differential channel 2: negative input or single-ended channel 4 input
8
VDD
Analog
9
DOUT/DRDY
Digital output
Serial data out combined with data ready; active low
10
DIN
Digital input
Serial data input
Ground
Power supply: 2.0 V to 5.5 V
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SPI TIMING CHARACTERISTICS
tCSH
CS
tSCLK
tCSSC
tSPWH
tSCCS
SCLK
tDIHD
tDIST
tSPWL
tSCSC
DIN
tCSDOD
tDOHD
tDOPD
Hi-Z
tCSDOZ
Hi-Z
DOUT
Figure 1. Serial Interface Timing
TIMING REQUIREMENTS: SERIAL INTERFACE TIMING
At TA = –40°C to +125°C and VDD = 2.0 V to 5.5 V, unless otherwise noted.
SYMBOL
DESCRIPTION
MIN
MAX
UNIT
tCSSC
CS low to first SCLK: setup time (1)
100
ns
tSCLK
SCLK period
250
ns
tSPWH
SCLK pulse width: high
100
ns
tSPWL
SCLK pulse width: low (2)
tDIST
Valid DIN to SCLK falling edge: setup time
50
tDIHD
Valid DIN to SCLK falling edge: hold time
50
tDOPD
SCLK rising edge to valid new DOUT: propagation delay (3)
tDOHD
SCLK rising edge to DOUT invalid: hold time
tCSDOD
tCSDOZ
100
ns
28
ms
ns
ns
50
ns
0
ns
CS low to DOUT driven: propagation delay
100
ns
CS high to DOUT Hi-Z: propagation delay
100
ns
tCSH
CS high pulse
200
ns
tSCCS
Final SCLK falling edge to CS high
100
ns
(1)
(2)
(3)
6
CS can be tied low.
Holding SCLK low longer than 28 ms resets the SPI interface.
DOUT load = 20 pF || 100 kΩ to GND.
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TYPICAL CHARACTERISTICS
At TA = +25°C and VDD = 3.3 V, unless otherwise noted.
TOTAL ERROR vs INPUT SIGNAL
4
DATA RATE vs TEMPERATURE
4
3
2
2
Data Rate Error (%)
Total Error (mV)
Includes noise, offset, and gain error.
3
1
0
-1
-2
FS = ±2.048 V
Data Rate = 860 SPS
Differential Inputs
-3
-4
-2.048
-1.024
0
VDD = 2.0 V
VDD = 3.3 V
VDD = 5.0 V
1
0
−1
−2
−3
1.024
−4
−60 −40 −20
2.048
0
Input Signal (V)
20
40
60
80
Temperature (°C)
Figure 2.
100 120 140
G028
Figure 3.
NOISE vs INPUT SIGNAL
NOISE vs SUPPLY VOLTAGE
10
35
FS = ±0.512V
FS = ±2.048V
DR = 860SPS
DR = 860SPS
30
RMS Noise (µV)
RMS Noise (µV)
8
6
4
DR = 128SPS
25
20
15
DR = 128SPS
10
DR = 8SPS
DR = 8SPS
2
5
0
−0.5 −0.4 −0.3 −0.2 −0.1 0
0.1 0.2
Input Voltage (V)
0.3
0.4
0
2.0
0.5
2.5
3.0
G017
3.5
4.0
4.5
Supply Voltage (V)
Figure 4.
NOISE vs TEMPERATURE
G018
INL vs SUPPLY VOLTAGE
15
Integral Nonlinearity (ppm)
FS = ±2.048V
Data Rate = 8SPS
8
RMS Noise (µV)
5.5
Figure 5.
10
9
5.0
7
6
5
4
3
12.5
FS = ±0.256V
FS = ±0.512V
FS = ±2.048V
FS = ±6.144V
10
7.5
5
2.5
2
1
−40
−20
0
20
40
60
Temperature (°C)
80
100
120
0
2.0
G019
Figure 6.
2.5
3.0
3.5
4.0
4.5
Supply Voltage (V)
5.0
5.5
G010
Figure 7.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C and VDD = 3.3 V, unless otherwise noted.
INL vs INPUT SIGNAL
INL vs INPUT SIGNAL
5
10
FS = ±2.048V
VDD = 3.3V
DR = 8SPS
Best Fit
3
2
1
0
−1
−2
−40°C
+25°C
+125°C
−3
−4
−5
−2
−1.5
−40°C
+25°C
+125°C
8
Integral Nonlinearity (ppm)
Integral Nonlinearity (ppm)
4
6
4
2
0
−2
−4
FS = ±0.512V
VDD = 3.3V
DR = 8SPS
Best Fit
−6
−8
−1
−0.5
0
0.5
Input Signal (V)
1
1.5
−10
−0.5
2
−0.4
−0.2
G011
Figure 8.
INL vs INPUT SIGNAL
3
2
Integral Nonlinearity (ppm)
Integral Nonlinearity (ppm)
G012
1
0
−1
−2
−40°C
+25°C
+125°C
−3
−2
−1.5
−40°C
+25°C
+125°C
8
6
4
2
0
−2
−4
FS = ±0.512V
VDD = 5V
DR = 8SPS
Best Fit
−6
−8
−1
−0.5
0
0.5
Input Signal (V)
1
1.5
−10
−0.5
2
−0.4
−0.2
G013
Figure 10.
−0.1
0
0.1
Input Signal (V)
0.2
0.4
0.5
G014
Figure 11.
INL vs TEMPERATURE
INL vs DATA RATE
12
16
FS = ±2.048 V
DR = 8 SPS
Best Fit
VDD = 2.0 V
VDD = 3.3 V
VDD = 5.0 V
8
6
4
2
0
−60 −40 −20
FS = ±2.048V
Best Fit
14
Integral Nonlinearity (ppm)
Integral Nonlinearity (ppm)
0.5
INL vs INPUT SIGNAL
FS = ±2.048V
VDD = 5V
DR = 8SPS
Best Fit
−4
−40°C
+25°C
+125°C
12
10
8
6
4
2
0
20
40
60
80
Temperature (°C)
100 120 140
0
8
G015
Figure 12.
8
0.4
10
4
10
0.2
Figure 9.
5
−5
−0.1
0
0.1
Input Signal (V)
16
32
64
128
250
Data Rate (SPS)
475
860
G016
Figure 13.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C and VDD = 3.3 V, unless otherwise noted.
SINGLE-ENDED OFFSET VOLTAGE vs TEMPERATURE
SINGLE-ENDED OFFSET VOLTAGE vs SUPPLY
60
60
AIN0 to GND
AIN1 to GND
AIN2 to GND
AIN3 to GND
AIN0 to GND
AIN1 to GND
AIN2 to GND
AIN3 to GND
40
Offset Voltage (µV)
Offset Voltage (µV)
40
20
0
−20
−40
20
0
−20
−40
FS = ±2.048V
−60
−40
−20
FS = ±2.048V
0
20
40
60
Temperature (°C)
80
100
−60
120
2
2.5
3
3.5
4
Supply Voltage (V)
G004
Figure 14.
G005
DIFFERENTIAL OFFSET VOLTAGE vs SUPPLY
40
40
AIN0 to AIN1
AIN0 to AIN3
AIN1 to AIN3
AIN2 to AIN3
20
AIN0 to AIN1
AIN0 to AIN3
AIN1 to AIN3
AIN2 to AIN3
30
Offset Voltage (µV)
30
Offset Voltage (µV)
5
Figure 15.
DIFFERENTIAL OFFSET VOLTAGE vs TEMPERATURE
10
0
−10
−20
−30
20
10
0
−10
−20
−30
FS = ±2.048V
−40
−40
−20
FS = ±2.048V
0
20
40
60
Temperature (°C)
80
100
−40
120
2
2.5
G006
Figure 16.
3
3.5
4
Supply Voltage (V)
4.5
5
G007
Figure 17.
OFFSET DRIFT HISTOGRAM
OFFSET HISTOGRAM
15
200
TA = −40°C to +125°C
FS = ±2.048 V, MUX = AIN0 to AIN3
30 units from one production lot.
540 units from 3 production lots
FS = ±2.048V
Number of Occurrences
Number of Occurrences
4.5
10
5
100
50
Offset Drift (LSB/°C)
−10
−8
−6
−4
−2
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
0.005
0.004
0.003
0.002
0.001
0
−0.001
−0.002
−0.003
−0.004
0
−0.005
0
150
Offset (µV)
G046
Figure 18.
G000
Figure 19.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C and VDD = 3.3 V, unless otherwise noted.
GAIN ERROR vs TEMPERATURE
GAIN ERROR vs SUPPLY
0.15
0.05
0.04
0.1
0.02
Gain Error (%)
Gain Error (%)
0.03
0.01
0
FS = ±0.256V
FS = ±0.512V
FS = ±1.024V
FS = ±2.048V
FS = ±4.096V
FS = ±6.144V
−0.01
−0.02
−0.03
−0.04
−0.05
−40
−20
0
20
40
60
80
Temperature (°C)
100
120
0.05
FS = ±256 mV
0
FS = ±2.048 V
-0.05
-0.1
-0.15
140
2
2.5
3
G008
3.5
Figure 20.
4.5
5
5.5
Figure 21.
GAIN ERROR HISTOGRAM
OPERATING CURRENT vs TEMPERATURE
300
200
540 units from 3 production lots
FS = ±2.048V
250
Operating Current (mA)
Number of Occurrences
4
Supply Voltage (V)
150
100
50
VDD = 5 V
200
150
VDD = 3.3 V
VDD = 2 V
100
50
0
Gain Error (%)
0.05
0.04
0.045
0.03
0.035
0.02
0.025
0.01
0.015
0
0.005
−0.01
−0.005
−0.02
−0.015
0
-40
-20
0
100
120
140
FREQUENCY RESPONSE
0
VDD = 2.0 V
VDD = 3.3 V
VDD = 5.0 V
Data Rate = 8 SPS
-10
-20
3.5
3
Gain (dB)
Power−Down Current (dB)
80
Figure 23.
POWER-DOWN CURRENT vs TEMPERATURE
2.5
2
-30
-40
-50
1.5
-60
1
-70
0.5
0
−40
−20
0
20
40
60
80
Temperature (°C)
100
120
140
-80
1
G003
Figure 24.
10
60
G000
5
4
40
Temperature (°C)
Figure 22.
4.5
20
10
100
1k
10k
Input Frequency (Hz)
Figure 25.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C and VDD = 3.3 V, unless otherwise noted.
TEMPERATURE SENSOR ERROR
vs
AMBIENT TEMPERATURE (MSOP)
TEMPERATURE SENSOR ERROR HISTOGRAM (MSOP)
1
40
Average Temperature Error
Average ± 3 sigma
Average ± 6 sigma
0.6
35
Number of Occurrences
0.4
0.2
0
−0.2
−0.4
−0.6
TA = −40°C
48 units from 3 production lots.
30
25
20
15
10
5
−0.8
G023
0.5
0.4
0.3
0.2
0
120
0.1
100
0
80
−0.1
20
40
60
Temperature (°C)
−0.2
0
−0.3
−20
−0.5
−1
−40
−0.4
Temperature Error (°C)
0.8
Temperature Error (°C)
Figure 27.
TEMPERATURE SENSOR ERROR HISTOGRAM (MSOP)
TEMPERATURE SENSOR ERROR HISTOGRAM (MSOP)
15
Temperature Error (°C)
0.5
0.4
0.3
−0.5
0.5
0.4
0.3
0.2
0.1
0
−0.1
0
−0.2
0
−0.3
5
−0.4
5
0.2
10
0.1
10
20
0
15
25
−0.1
20
30
−0.2
25
TA = +25°C
48 units from 3 production lots
−0.3
Number of Occurrences
35
30
−0.5
Temperature Error (°C)
G041
G042
Figure 28.
Figure 29.
TEMPERATURE SENSOR ERROR HISTOGRAM (MSOP)
TEMPERATURE SENSOR ERROR HISTOGRAM (MSOP)
35
Temperature Error (°C)
G043
Figure 30.
Temperature Error (°C)
0.5
−0.5
0.5
0.4
0.3
0.2
0.1
0
−0.1
−0.2
0
−0.3
0
−0.4
5
−0.5
5
0.4
10
0.3
10
15
0.2
15
20
0.1
20
25
0
25
30
−0.1
30
TA = +125°C
48 units from 3 production lots
−0.2
Number of Occurrences
35
40
TA = +70°C
48 units from 3 production lots
−0.3
40
−0.4
Number of Occurrences
35
40
TA = 0°C
48 units from 3 production lots
−0.4
40
Number of Occurrences
G040
Figure 26.
G045
Figure 31.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C and VDD = 3.3 V, unless otherwise noted.
TEMPERATURE SENSOR ERROR
vs
AMBIENT TEMPERATURE (QFN)
1
80
Average Temperature Error
Average “ 3 sigma
Average “ 6 sigma
0.8
0.6
TA í °C
94 units from production.
70
Number of Occurrences
0.4
0.2
0
-0.2
-0.4
-0.6
60
50
40
30
20
10
-0.8
-1
C007
0.5
0.4
0.3
0.2
120
0.1
100
0
80
-0.1
20
40
60
Temperature (ƒC)
-0.2
0
-0.3
-20
-0.5
0
-40
-0.4
Temperature Error (ƒC)
TEMPERATURE SENSOR ERROR HISTOGRAM (QFN)
Temperature Error (ƒC)
Figure 33.
TEMPERATURE SENSOR ERROR HISTOGRAM (QFN)
TEMPERATURE SENSOR ERROR HISTOGRAM (QFN)
80
80
0.5
0.4
0.3
-0.5
0.5
0.4
0.3
0.2
0.1
0
-0.1
0
-0.2
0
-0.3
10
-0.4
10
0.2
20
0.1
20
30
0
30
40
-0.1
40
50
-0.2
50
60
-0.3
Number of Occurrences
60
Temperature Error (ƒC)
Temperature Error (ƒC)
C002
C003
Figure 34.
Figure 35.
TEMPERATURE SENSOR ERROR HISTOGRAM (QFN)
TEMPERATURE SENSOR ERROR HISTOGRAM (QFN)
80
80
Temperature Error (ƒC)
C004
Figure 36.
Temperature Error (ƒC)
0.5
0.4
0.3
-0.5
0.5
0.4
0.3
0.2
0.1
0
-0.1
0
-0.2
0
-0.3
10
-0.4
10
0.2
20
0.1
20
30
0
30
40
-0.1
40
50
-0.2
50
60
-0.3
60
-0.5
TA = +125°C
94 units from production.
70
-0.4
TA = +70°C
94 units from production.
Number of Occurrences
70
Number of Occurrences
TA = +25°C
94 units from production.
70
-0.4
TA = 0°C
94 units from production.
-0.5
Number of Occurences
70
12
C001
Figure 32.
C006
Figure 37.
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OVERVIEW
The ADS1118 is a very small, low-power, 16-bit, delta-sigma (ΔΣ) analog-to-digital converter (ADC). The
ADS1118 is extremely easy to configure and design into a wide variety of applications, and allows precise
measurements to be obtained with very little effort. Both experienced and novice users of data converters find
designing with the ADS1118 family to be intuitive and problem-free.
The ADS1118 consists of a ΔΣ ADC core with adjustable gain, an internal voltage reference, a clock oscillator,
and an SPI. This device is also a highly linear and accurate temperature sensor. All of these features are
intended to reduce required external circuitry and improve performance. Figure 38 shows the ADS1118
functional block diagram.
VDD
Device
Voltage
Reference
MUX
AIN0
Gain = 2/3, 1,
2, 4, 8, or 16
CS
SCLK
AIN1
16-Bit DS
ADC
PGA
SPI
Interface
DIN
DOUT/DRDY
AIN2
Oscillator
AIN3
Temperature
Sensor
GND
Figure 38. ADS1118 Functional Block Diagram
The ADS1118 ADC core measures a differential signal, VIN, that is the difference of AINP and AINN. The
converter core consists of a differential, switched-capacitor ΔΣ modulator followed by a digital filter. This
architecture results in a very strong attenuation in any common-mode signals. Input signals are compared to the
internal voltage reference. The digital filter receives a high-speed bitstream from the modulator and outputs a
code proportional to the input voltage.
The ADS1118 has two available conversion modes: single-shot mode and continuous conversion mode. In
single-shot mode, the ADC performs one conversion of the input signal upon request and stores the value to an
internal conversion register. The device then enters a power-down state. This mode is intended to provide
significant power savings in systems that require only periodic conversions or when there are long idle periods
between conversions. In continuous conversion mode, the ADC automatically begins a conversion of the input
signal as soon as the previous conversion is completed. The rate of continuous conversion is equal to the
programmed data rate. Data can be read at any time and always reflect the most recently completed conversion.
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MULTIPLEXER
The ADS1118 contains an input multiplexer, as shown in Figure 39. Either four single-ended or two differential
signals can be measured. Additionally, AIN0, AIN1, and AIN2 may be measured differentially to AIN3. The
multiplexer is configured by three bits (MUX[2:0], bits 14-12) in the Config register. When single-ended signals
are measured, the negative input of the ADC is internally connected to GND by a switch within the multiplexer.
VDD
Device
AIN0
VDD
GND
AINP
AIN1
AINN
VDD
GND
AIN2
VDD
GND
AIN3
GND
GND
Figure 39. ADS1118 MUX
When measuring single-ended inputs, note that the negative range of the output codes is not used. These codes
are intended for measuring negative differential signals, such as (AINP – AINN) < 0. Electrostatic discharge (ESD)
diodes to VDD and GND protect the ADS1118 inputs. To prevent the ESD diodes from turning on, the absolute
voltage on any input must stay within the range given in Equation 1:
GND – 0.3 V < AINx < VDD + 0.3 V
(1)
If the voltages on the input pins can possibly violate these conditions, external Schottky clamp diodes and series
resistors may be required to limit the input current to safe values (see the Absolute Maximum Ratings table).
Although the analog inputs can support signals marginally above supply, under no circumstances should any
analog or digital input or output be driven to greater than 5.5 V with respect to the GND pin.
Also, overdriving one unused input on the ADS1118 may affect conversions currently taking place on other input
pins. If overdriving unused inputs is possible, TI recommends clamping the signal with external Schottky diodes.
14
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ANALOG INPUTS
The ADS1118 uses a switched-capacitor input stage where capacitors are continuously charged and then
discharged to measure the voltage between AINP and AINN. The capacitors used are small, and to external
circuitry, the average loading appears resistive. This structure is shown in Figure 40. The resistance is set by the
capacitor values and the rate at which they are switched. Figure 41 shows the on/off setting of the switches
illustrated in Figure 40. During the sampling phase, switches S1 are closed. This event charges CA1 to AINP, CA2
to AINN, and CB to (AINP – AINN). During the discharge phase, S1 is first opened and then S2 is closed. Both CA1
and CA2 then discharge to approximately 0.7 V and CB discharges to 0 V. This charging draws a very small
transient current from the source driving the ADS1118 analog inputs. The average value of this current can be
used to calculate the effective impedance (Reff), where Reff = VIN / IAVERAGE.
0.7V
CA1
AINP
S1
ZCM
S2
0.7V
Equivalent
Circuit
AINP
CB
S1
ZDIFF
S2
AINN
AINN
0.7V
ZCM
CA2
fCLK = 250kHz
0.7V
Figure 40. Simplified Analog Input Circuit
tSAMPLE
ON
S1
OFF
ON
S2
OFF
Figure 41. S1 and S2 Switch Timing for Figure 40
The common-mode input impedance is measured by applying a common-mode signal to the shorted AINP and
AINN inputs and measuring the average current consumed by each pin. The common-mode input impedance
changes depending on the PGA gain setting, but is approximately 6MΩ for the default PGA gain setting. In
Figure 40, the common-mode input impedance is ZCM.
The differential input impedance is measured by applying a differential signal to AINP and AINN inputs where one
input is held at 0.7 V. The current that flows through the pin connected to 0.7 V is the differential current and
scales with the PGA gain setting. In Figure 40, the differential input impedance is ZDIFF. Table 1 describes the
typical differential input impedance.
Table 1. Differential Input Impedance
FS (V)
(1) (1)
±6.144
(1)
DIFFERENTIAL INPUT IMPEDANCE
22 MΩ
±4.096(1) (1)
15 MΩ
±2.048
4.9 MΩ
±1.024
2.4 MΩ
±0.512
710 kΩ
±0.256
710 kΩ
This parameter expresses the full-scale range of the ADC scaling. In
no event should more than VDD + 0.3V be applied to this device.
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The typical value of the input impedance cannot be neglected. Unless the input source has a low impedance, the
ADS1118 input impedance may affect the measurement accuracy. For sources with high output impedance,
buffering may be necessary. Note that active buffers introduce noise, and also introduce offset and gain errors.
All of these factors should be considered in high-accuracy applications.
Because the clock oscillator frequency drifts slightly with temperature, the input impedances also drift. For many
applications, this input impedance drift can be ignored, and the values given in Table 1 for typical input
impedance are valid.
FULL-SCALE INPUT
A programmable gain amplifier (PGA) is implemented before the ADS1118 ΔΣ core. The PGA is configured by
three bits (PGA[2:0], bits 11-9) in the Config register and can be set to gains of 2/3, 1, 2, 4, 8, and 16. Table 2
shows the corresponding full-scale (FS) ranges. However, analog input voltages may never exceed the analog
input voltage limits given in the Electrical Characteristics table. In case a supply voltage of VDD greater than 4 V
is used, the 2/3 PGA setting allows input voltages to extend up to the supply. Note though that in this case, or
whenever the supply voltage is less than the FS range (for example, VDD = 3.3 V and PGA = 1), a full-scale
ADC output code cannot be obtained. This inability means that some dynamic range is lost.
Table 2. PGA Gain and Corresponding Full-Scale
Range
(1)
16
PGA SETTING
FS (V)
2/3
±6.144 (1)
1
±4.096 (1)
2
±2.048
4
±1.024
8
±0.512
16
±0.256
This parameter expresses the full-scale range of the ADC scaling. In
no event should more than VDD + 0.3 V be applied to this device.
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DATA FORMAT
The ADS1118 provides 16 bits of data in binary twos complement format. The positive full-scale input produces
an output code of 7FFFh and the negative full-scale input produces an output code of 8000h. The output clips at
these codes for signals that exceed full-scale. Table 3 summarizes the ideal output codes for different input
signals. Figure 42 shows code transitions versus input voltage.
Table 3. Input Signal versus Ideal Output Code
INPUT SIGNAL, VIN
(AINP – AINN)
15
≥ FS (2
IDEAL OUTPUT CODE (1)
15
– 1)/2
7FFFh
+FS/215
0001h
0
0
15
–FS/2
FFFFh
≤ –FS
(1)
8000h
Excludes the effects of noise, INL, offset, and gain errors.
0x7FFF
0x0001
0x0000
0xFFFF
¼
Output Code
¼
0x7FFE
0x8001
0x8000
¼
-FS
2
15
0
Input Voltage (AINP - AINN)
-1
-FS
2
FS
¼
15
2
15
FS
2
-1
15
Figure 42. ADS1118 Code Transition Diagram
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TEMPERATURE SENSOR
The temperature measurement mode of the ADS1118 is configured as a 14-bit result when enabled. Two bytes
must be read to obtain data. The first byte is the most significant byte (MSB), followed by a second byte, the
least significant byte (LSB). The first 14 bits are used to indicate temperature. That is, the 14-bit temperature
result is left-justified within the 16-bit result register and the last two bits always read back as '0'. One 14-bit LSB
equals 0.03125°C. Negative numbers are represented in binary twos complement format.
Table 4. 14-bit Temperature Data Format
TEMPERATURE (°C)
DIGITAL OUTPUT (BINARY)
HEX
128
01 0000 0000 0000
1000
127.96875
00 1111 1111 1111
0FFF
100
00 1100 1000 0000
0C80
80
00 1010 0000 0000
0A00
75
00 1001 0110 0000
0960
50
00 0110 0100 0000
0640
25
00 0011 0010 0000
0320
0.25
00 0000 0000 1000
0008
0
00 0000 0000 0000
0000
–0.25
11 1111 1111 1000
3FF8
–25
11 1100 1110 0000
3CE0
–55
11 1001 0010 0000
3920
Converting from Temperature to Digital Codes
For positive temperatures (for example, +50°C):
Twos complement is not performed on positive numbers. Therefore, simply convert the number to binary
code in a 14-bit left justified format with the MSB = 0 to denote the positive sign.
Example: (+50°C)/(0.03125°C/count) = 1600 = 0640h = 00 0110 0100 0000
For negative temperatures (for example –25°C):
Generate the twos complement of a negative number by complementing the absolute binary number and
adding 1. Then denote the negative sign with the MSB = 1.
Example:(|–25°C|)/(0.03125°C/count) = 800 = 0320h = 00 0011 0010 0000
Twos complement format: 11 1100 1101 1111 + 1 = 11 1100 1110 0000
Converting from Digital Codes to Temperature
To convert from digital codes to temperature, first check whether the MSB is a '0' or a '1'. If the MSB is a '0',
simply multiply the decimal code by 0.03125°C to obtain the result. If the MSB = 1, subtract '1' from the result
and complement all of the bits. Then multiply the result by –0.03125°C.
Example: ADS1118 reads back 0960h: 0960h has an MSB = 0.
(0960h) × (0.03125°C) = (2400) × (0.03125°C) = +75°C
Example: ADS1118 reads back 3CE0h: 3CE0h has an MSB = 1.
Complement the result: 3CE0h → 0320h
(0320h) × (–0.03125°C) = (800) × (–0.03125°C) = –25°C
18
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ALIASING
As with any data converter, if the input signal contains frequencies greater than half the data rate, aliasing
occurs. To prevent aliasing, the input signal must be bandlimited. However, some signals are inherently
bandlimited. For example, the output of a thermocouple (which has a limited rate of change) is inherently
bandlimited. Nevertheless, these signals can still contain noise and interference components. These components
can fold back into the sampling band in the same way as with any other signal.
The ADS1118 digital filter provides some attenuation of high-frequency noise, but the frequency response of this
1st-order sinc filter cannot completely replace an anti-aliasing filter. For a few applications, some external filtering
may be required; in such instances, a simple RC filter is adequate. When designing an input filter circuit, be sure
to take into account the interaction between the filter network and the ADS1118 input impedance. TI
recommends keeping the filter resistance value below 1 kΩ.
RESET AND POWER-UP
When the ADS1118 powers up, a reset is performed. As part of the reset process, the ADS1118 sets all of its
bits in the Config register to the respective default settings. By default, the ADS1118 enters a power-down state
at start-up. The device interface and digital blocks are active, but no data conversions are performed. The initial
power-down state of the ADS1118 is intended to relieve systems with tight power-supply requirements from
encountering a surge during power-up.
OPERATING MODES
The ADS1118 operates in one of two modes: continuous conversion or single-shot mode. The MODE bit in the
Config register selects the respective operating mode.
Continuous Conversion Mode
In continuous conversion mode (MODE bit set to '0'), the ADS1118 continuously performs conversions. When a
conversion completes, the ADS1118 places the result in the Conversion register and immediately begins another
conversion.
Power-Down (Single-Shot Mode)
When the MODE bit in the Config register is set to '1', the ADS1118 enters power-down state and is configured
to operate in single-shot mode. This condition is also the default state that the ADS1118 enters when power is
first applied. In power-down state, the ADS1118 consumes no more than 2 μA of current. During this time, the
device responds to commands, but does not perform any data conversions. The ADS1118 is held in power-down
state until a '1' is written to the SS bit in the Config register. When the SS bit is asserted, the device powers up,
resets the SS bit to '0', and starts a single conversion. When conversion data are ready for retrieval, the device
powers down again. Writing a '1' to the SS bit while a conversion is ongoing has no effect. To exit this mode,
simply write a '0' to the MODE bit in the Config register to start operating in continuous conversion mode.
DUTY CYCLING FOR LOW POWER
The noise performance of a ΔΣ ADC generally improves when lowering the output data rate because more
samples of the internal modulator can be averaged to yield one conversion result. In applications where power
consumption is critical, the improved noise performance at low data rates may not be required. For these
applications, the ADS1118 supports duty cycling that can yield significant power savings by periodically
requesting high data rate readings at an effectively lower data rate. For example, an ADS1118 in power-down
state with a data rate set to 860 SPS can be operated by a microcontroller that instructs a single-shot conversion
every 125 ms (8 SPS). Because a conversion at 860 SPS only requires approximately 1.2 ms, the ADS1118
enters power-down state for the remaining 123.8 ms. In this configuration, the ADS1118 consumes
approximately 1/100th the power that it otherwise would consume in continuous conversion mode. The duty
cycling rate is completely arbitrary and is defined by the master controller. The ADS1118 offers lower data rates
that do not implement duty cycling and also offers improved noise performance if required.
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SERIAL INTERFACE
The SPI-compatible serial interface consists of either four signals (CS, SCLK, DIN, and DOUT/DRDY), or three
signals (in which case CS may be tied low). The interface is used to read conversion data, read and write
registers, and control device operation.
CHIP SELECT (CS)
The chip select (CS) selects the ADS1118 for SPI communication. This feature is useful when multiple devices
share the same serial bus. CS must remain low for the duration of the serial communication. When CS is taken
high, the serial interface is reset, SCLK is ignored, and DOUT/DRDY enters a high-impedance state. In this state,
DOUT/DRDY cannot provide data ready indication. In situations where multiple devices are present and
DOUT/DRDY must be monitored, CS must be periodically lowered. At this point, the DOUT/DRDY pin either
immediately goes high to indicate that no new data are available, or DOUT/DRDY immediately goes low to
indicate that new data are present in the Conversion register and are available for transfer. New data can be
transferred at any time without concern of data corruption. When a transmission starts, the current result is
locked into the output shift register and does not change until the communication completes. This system avoids
any possibility of data corruption. If the ADS1118 does not share the serial bus with another device, CS may be
tied low.
SERIAL CLOCK (SCLK)
The serial clock (SCLK) features a Schmitt-triggered input and is used to clock data on the DIN and
DOUT/DRDY pins into and out of the ADS1118. Even though the input has hysteresis, TI recommends keeping
SCLK as clean as possible to prevent glitches from accidentally shifting the data. If SCLK is held low for 28 ms,
the serial interface resets and the next SCLK pulse starts a new communication cycle. This timeout feature can
be used to recover communication when a serial interface transmission is interrupted. When the serial interface
is idle, hold SCLK low.
DATA INPUT (DIN)
The data input pin (DIN) is used along with SCLK to send data to the ADS1118. The device latches data on DIN
on the SCLK falling edge. The ADS1118 never drives the DIN pin.
DATA OUTPUT AND DATA READY (DOUT/DRDY)
The data output and data ready pin (DOUT/DRDY) is used with SCLK to read conversion and register data from
the ADS1118. DOUT/DRDY is also used to indicate that a conversion is completed and new data are available.
This pin transitions low when new data are ready for retrieval. The data ready signal can be used to trigger a
microcontroller to start reading data from the ADS1118. Data on DOUT/DRDY are shifted out on the SCLK rising
edge. In continuous conversion mode, DOUT/DRDY transitions high again 8 µs before the next data ready signal
(when DOUT/DRDY asserts low) if no data are retrieved from the device. This transition is shown in Figure 43.
Data transmission must complete before DOUT/DRDY automatically returns high. By default, DOUT/DRDY is
configured with a weak pull-up resistor if CS is high. This feature is intended to reduce the risk of DOUT/DRDY
floating near midsupply and causing leakage current in the master device. Alternatively, the ADS1118
DOUT/DRDY pin can be configured in the Config register to go to a high-impedance state when CS is high. If the
ADS1118 does not share the serial bus with another device, CS may be tied low.
CS(1)
SCLK
DOUT/DRDY
8 µs
Hi-Z
DIN
(1) CS may be held low. If CS is low, DOUT/DRDY asserts low indicating new data are available.
Figure 43. DOUT/DRDY Behavior Without Data Retrieval in Continuous Conversion Mode
20
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REGISTERS
The ADS1118 has two registers that are accessible via the SPI port. The Conversion register contains the result
of the last conversion. The Config register allows the user to change the ADS1118 operating modes and query
the status of the devices.
Conversion Register
The 16-bit Conversion register contains the result of the last conversion in binary twos complement format.
Following power-up, the Conversion register is cleared to '0', and remains '0' until the first conversion is
completed. The register format is shown in Table 5.
Table 5. Conversion Register (Read-Only)
BIT
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
NAME
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Config Register
The 16-bit Config register can be used to control the ADS1118 operating mode, input selection, data rate, PGA
settings, and temperature sensor mode. The register format is shown in Table 6.
Table 6. Config Register (Read/Write)
15
14
13
12
11
10
9
8
SS
MUX2
MUX1
MUX0
PGA2
PGA1
PGA0
MODE
7
6
5
4
3
2
1
0
DR2
DR1
DR0
TS_MODE
PULL_UP_EN
NOP1
NOP2
NOT USED
Default = 058Bh.
Bit 15
SS: Single-shot conversion start
This bit is used to start a single conversion. SS can only be written when in power-down state and has no
effect when a conversion is ongoing.
When writing:
0 = No effect
1 = Start a single conversion (when in power-down state)
Always reads back as '0' (default).
Bits[14:12]
MUX[2:0]: Input multiplexer configuration
These bits configure the input multiplexer.
000 = AINP is
001 = AINP is
010 = AINP is
011 = AINP is
Bits[11:9]
AIN0 and AINN is
AIN0 and AINN is
AIN1 and AINN is
AIN2 and AINN is
AIN1 (default)
AIN3
AIN3
AIN3
100 = AINP is
101 = AINP is
110 = AINP is
111 = AINP is
AIN0 and AINN is
AIN1 and AINN is
AIN2 and AINN is
AIN3 and AINN is
GND
GND
GND
GND
PGA[2:0]: Programmable gain amplifier configuration
These bits configure the programmable gain amplifier.
000 = FS is ±6.144
001 = FS is ±4.096
010 = FS is ±2.048
011 = FS is ±1.024
(1)
V (1)
V (1)
V (default)
V
100 = FS is ±0.512
101 = FS is ±0.256
110 = FS is ±0.256
111 = FS is ±0.256
V
V
V
V
This parameter expresses the full-scale range of the ADC scaling. In no event should more than VDD + 0.3 V be applied to this device.
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Bit 8
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MODE: Device operating mode
This bit controls the ADS1118 operating mode.
0 = Continuous conversion mode
1 = Power-down and single-shot mode (default)
Bits[7:5]
DR[2:0]: Data rate
These bits control the data rate setting.
000 = 8 SPS
001 = 16 SPS
010 = 32 SPS
011 = 64 SPS
Bit 4
100 = 128 SPS (default)
101 = 250 SPS
110 = 475 SPS
111 = 860 SPS
TS_MODE: Temperature sensor mode
This bit configures the ADC to convert temperature or input signals.
0 = ADC mode (default)
1 = Temperature sensor mode
Bit 3
PULL_UP_EN: Pull-up enable
This bit enables a weak pull-up resistor on the DOUT/DRDY pin. When enabled, a 400-kΩ resistor connects
the bus line to supply. When disabled, the DOUT/DRDY pin floats.
0 = Pull-up resistor disabled on DOUT/DRDY pin
1 = Pull-up resistor enabled on DOUT/DRDY pin (default)
Bits[2:0]
NOP: No operation
The NOP bits control whether data are written to the Config register or not. In order for data to be written to the
Config register, the NOP bits must be '01'. Any other value results in a NOP command. DIN can be held high or
low during SCLK pulses without data being written to the Config register.
00
01
10
11
Bit 0
= Invalid data, do not update the contents of the Config register
= Valid data, update the Config register (default)
= Invalid data, do not update the contents of the Config register
= Invalid data, do not update the contents of the Config register
Not used
Always reads '1'
22
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DATA RETRIEVAL
Data can be written to and read from the ADS1118 in the same manner in single-shot mode as in continuous
conversion mode, without having to issue any commands. The mode in which ADS1118 operates in can be
selected by the MODE bit in the Config register. Setting the MODE bit to '0' puts the device in continuous
conversion mode. In this mode, the device is constantly starting new conversions even when CS is high. When
configured for single-shot mode by setting the MODE bit to '1,' a new conversion only starts by writing a '1' to the
SS bit.
The conversion data are always buffered, and retain the current data until replaced by new conversion data.
Therefore, data can be read at any time without concern of data corruption. When DOUT/DRDY asserts low,
indicating that new conversion data are ready, the conversion data are read by shifting the data out on
DOUT/DRDY. The MSB of the data (bit 15) on DOUT/DRDY is clocked out on the first SCLK rising edge. At the
same time that the conversion result is clocked out of DOUT/DRDY, new Config register data are latched on DIN
on the SCLK falling edge.
The ADS1118 also offers the possibility of direct readback of the Config register settings in the same data
transmission cycle. One complete data transmission cycle consists of either 32 bits (when the Config register
data readback is used) or 16 bits. The short 16-bit cycle can only be used when the CS line can be controlled
and is not permanently tied low.
32-Bit Data Transmission Cycle
As shown in Figure 44, the data in a 32-bit data transmission cycle consists of four bytes: two bytes for the
conversion result and an additional two bytes for the Config register readback. The MSB is always read first.
Direct Config register data readback is only functional for the first two bytes that are written to the device in a
data transmission cycle. Therefore, TI recommends writing the same Config register setting twice during one
cycle.
CS(1)
1
9
17
25
SCLK
DOUT/DRDY
Hi-Z
DIN
DATA MSB
DATA LSB
CONFIG MSB
CONFIG LSB
CONFIG MSB
CONFIG LSB
CONFIG MSB
CONFIG LSB
Next Data Ready
(1) CS may be held low. If CS is low, DOUT/DRDY asserts low indicating new data are available.
Figure 44. 32-Bit Data Transmission Cycle with Config Register Readback
Alternatively, DIN can be held either low or high for the second half of the data transmission cycle, as shown in
Figure 45. When the ADS1118 is configured for continuous conversion mode by setting the MODE bit to '0', DIN
can even be held either low or high for the entire transmission cycle as well if no changes to the device setup
must be made.
CS(1)
1
9
17
25
SCLK
DOUT/DRDY
DIN
Hi-Z
DATA MSB
DATA LSB
CONFIG MSB
CONFIG LSB
CONFIG MSB
CONFIG LSB
Next Data Ready
(1) CS may be held low. If CS is low, DOUT/DRDY asserts low indicating new data are available.
Figure 45. 32-Bit Data Transmission Cycle: DIN Held Low
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16-Bit Data Transmission Cycle
If Config register data are not required to be readback, the ADS1118 conversion data can also be clocked out in
a short 16-bit data transmission cycle, as shown in Figure 46. Therefore, CS must be taken high after the 16th
SCLK cycle. Taking CS high resets the SPI interface. The next time CS is taken low, data transmission starts
with the currently buffered conversion result on the first SCLK rising edge. If DOUT/DRDY is low when data
retrieval starts, the conversion buffer is already updated with a new result. Otherwise, if DOUT/DRDY is high, the
same result from the previous data transmission cycle is read.
CS
1
9
1
9
SCLK
DOUT/DRDY
DIN
Hi-Z
DATA MSB
DATA LSB
DATA MSB
DATA LSB
CONFIG MSB
CONFIG LSB
CONFIG MSB
CONFIG LSB
Figure 46. 16-Bit Data Transmission Cycle
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APPLICATION INFORMATION
The following sections give example circuits and suggestions for using the ADS1118 in various situations.
BASIC CONNECTIONS AND LAYOUT CONSIDERATIONS
For many applications, connecting the ADS1118 is simple. A basic connection diagram for the ADS1118 is
shown in Figure 47. Most microcontroller SPI peripherals can operate with the ADS1118. The interface operates
in SPI mode 1 where CPOL = 0 and CPHA = 1. In SPI mode 1, SCLK idles low and data are launched or
changed only on SCLK rising edges; data are latched or read by the master and slave on SCLK falling edges.
Details of the SPI communication protocol employed by the ADS1118 can be found in the SPI Timing
Characteristics section. Although not required, placing 49.9-Ω resistors in series with all of the digital pins is good
practice. This resistance smooths sharp transitions, suppresses overshoot, and offers some overvoltage
protection. Care must be taken to still meet all SPI timing requirements because the additional resistors interact
with the bus capacitances present on the digital signal lines.
Device
10
VDD
DIN
Microcontroller or
Microprocessor
with SPI Port
1
SCLK
DOUT/DRDY
9
2
CS
VDD
8
3
GND
AIN3
7
4
AIN0
AIN2
6
0.1mF (typ)
AIN1
5
DOUT
DIN
Inputs Selected
from Configuration
Register
CS
SCLK
Figure 47. Typical Connections of the ADS1118
The fully-differential input of the ADS1118 is ideal for connecting to differential sources (such as thermocouples
and thermistors) with a moderately low source impedance. Although the ADS1118 can read bipolar differential
signals, the device cannot accept negative voltages on either input because every pin on the ADS1118 employs
the use of ESD protection diodes. In the event that an input exceeds supply or drops below ground, these diodes
begin to turn on. Therefore, thinking of the ADS1118 positive input as noninverting, and of the negative input as
inverting may be helpful.
The 0.1-μF bypass capacitor supplies the momentary bursts of extra current required from the supply when the
ADS1118 is converting. This bypass capacitor should be placed as close to the device as possible. For very
sensitive systems, or systems in harsh noise environments, avoiding the use of vias for connecting the bypass
capacitor may offer superior bypass and noise immunity.
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TI recommends employing best design practices when laying out a printed circuit board (PCB) for both analog
and digital components. This recommendation generally means that the layout should separate analog
components [such as ADCs, amplifiers, references, digital-to-analog converters (DACs), and analog MUXs] from
digital components [such as microcontrollers, complex programmable logic devices (CPLDs), field-programmable
gate arrays (FPGAs), radio frequency (RF) transceivers, universal serial bus (USB) transceivers, and switching
regulators]. An example of good component placement is shown in Figure 48. While Figure 48 provides a good
example of component placement, the best placement for each application is unique to the geometries,
components, and PCB fabrication capabilities being employed. That is, there is no single layout that is perfect for
every design and careful consideration must always be used when designing with any analog components.
Ground fill or
Ground plane
Supply
Generation
Interface
Tranceiver
Microprocessor
ADS1118
Optional: Split
Ground Cut
Signal
Conditioning
(RC filters
and
amplifiers)
Ground fill or
Ground plane
Optional: Split
Ground Cut
Ground fill or
Ground plane
Connector
or Antenna
Ground fill or
Ground plane
Figure 48. System Component Placement
The use of split analog and digital ground planes is not necessary for improved noise performance (although for
thermal isolation this option is a worthwhile consideration). However, the use of a solid ground plane or ground
fill in PCB areas with no components is essential for optimum performance. If the system being used employs a
split digital and analog ground plane, TI generally recommends that the ground planes be connected together as
close to the ADS1118 as possible. TI also strongly recommends that digital components, especially RF portions,
be kept as far as practically possible from analog circuitry in a given system. Additionally, minimize the distance
that digital control traces run through analog areas and avoid allowing these traces to be near sensitive analog
components. Digital return currents usually flow through a ground path that is as close to the digital path as
possible. If a solid ground connection to a plane is not available, these currents may find paths back to the
source that interfere with analog performance. The implications that layout has on the temperature sensing
functions are much more significant than they are for the ADC functions. Details on layout considerations for the
temperature sensor can be found in the Thermocouple Measurement with Cold Junction Compensation section.
For a detailed layout example, refer to the ADS1118EVM User's Guide (SBAU184).
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CONNECTING MULTIPLE DEVICES
Connecting multiple ADS1118s to a single bus is simple. SCLK, DIN, and DOUT/DRDY can be safely shared by
using a dedicated chip-select (CS) for each SPI-enabled device. By default, when CS goes high for the
ADS1118, DOUT/DRDY is pulled up to the supply of the ADS1118 by a weak 400 kΩ resistor. This feature is
intended to prevent DOUT/DRDY from floating near mid-rail and causing excess current leakage on a
microcontroller input. If the PULL_UP_EN bit in the Config register is set to '0', the DOUT/DRDY pin enters a 3state mode when CS transitions high. The ADS1118 cannot issue a data ready pulse on DOUT/DRDY when CS
is high. In order to evaluate when a new conversion is ready from the ADS1118 when using multiple devices, the
master can periodically drop CS to the ADS1118. When CS goes low, the DOUT/DRDY pin immediately drives
either high or low. If the DOUT/DRDY line drives low on a low CS, new data are currently available for clocking
out at any time. If the DOUT/DRDY line drives high, no new data are available and the ADS1118 returns the last
read conversion result. Valid data can be retrieved from the ADS1118 at anytime without concern of data
corruption. If a new conversion becomes available during data transmission, it is not available for readback until
a new SPI transmission is initiated.
Microcontroller or
Microprocessor
Device
SCLK
DIN
10 DIN
1 SCLK DOUT/DRDY 9
2 CS
VDD
8
DOUT
3 GND
AIN3
7
CS1
4 AIN0
AIN2
6
AIN1
5
CS2
Device
10 DIN
1 SCLK DOUT/DRDY 9
2 CS
VDD
8
3 GND
AIN3
7
AIN2
6
4 AIN0
AIN1
5
NOTE: Power and input connections omitted for clarity.
Figure 49. Connecting Multiple ADS1118s
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USING GPIO PORTS FOR COMMUNICATION
Most microcontrollers have programmable input/output (I/O) pins that can be set in software to act as inputs or
outputs. If an SPI controller is not available, the ADS1118 can be connected to GPIO pins and the SPI bus
protocol can be simulated. Using GPIO pins to generate the SPI interface only requires that the pins be
configured as push or pull inputs or outputs. Furthermore, if the SCLK line is held low for more than 28 ms, the
communication times out. This condition means that the GPIO ports must be capable of providing SCLK pulses
with no more than 28 ms between pulses.
SINGLE-ENDED INPUTS
Although the ADS1118 has two differential inputs, the device can easily measure four single-ended signals.
Figure 50 shows a single-ended connection scheme. The ADS1118 is configured for single-ended measurement
by configuring the MUX to measure each channel with respect to ground. Data are then read out of one input
based on the selection in the Config register. The single-ended signal can range from 0 V up to positive supply
or +FS, whichever is lower. Negative voltages cannot be applied to this circuit because the ADS1118 can only
accept positive voltages with respect to ground. The ADS1118 does not loose linearity within the input range.
The ADS1118 offers a differential input voltage range of ±FS. The single-ended circuit shown in Figure 50
however only uses the positive half of the ADS1118 FS input voltage range because it does not produce
differentially negative inputs. Because only half of the FS range is used, one bit of resolution is lost. For optimal
noise performance, TI recommends using differential configurations whenever possible. Differential
configurations maximize the dynamic range of the ADC and provide strong attenuation of common-mode noise.
VDD
Device
10
DIN
1
SCLK
DOUT/DRDY
9
2
CS
VDD
8
3
GND
AIN3
7
4
AIN0
AIN2
6
0.1mF (typ)
AIN1
5
Inputs Selected
from Configuration
Register
NOTE: Digital pin connections omitted for clarity.
Figure 50. Measuring Single-Ended Inputs
The ADS1118 is also designed to allow AIN3 to serve as a common point for measurements by adjusting the
MUX configuration. AIN0, AIN1, and AIN2 can all be measured with respect to AIN3. In this configuration the
ADS1118 can operate with inputs where AIN3 serves as the common point. This ability improves the usable
range over the single-ended configuration because it allows negative differential voltages when GND < AIN3 <
VDD; however, it does not offer attenuation of common-mode noise.
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THERMOCOUPLE MEASUREMENT WITH COLD JUNCTION COMPENSATION
For an independent, two-channel thermocouple system, Figure 51 shows the basic connections. This circuit
contains a simple low-pass, anti-aliasing filter, mid-point bias, and open detection. While the digital filter of the
ADS1118 strongly attenuates high-frequency components of noise, TI generally recommends providing a firstorder passive RC filter to further improve this performance. The differential RC filter formed by the 500 Ω
resistors (RDIFFA and RDIFFB) and the 1 µF (CDIFF) capacitor offers a cutoff frequency of approximately 320 Hz.
Additional filtering can be achieved by increasing the differential capacitor or the resistance values. However,
avoid increasing the filter resistance beyond 1 kΩ because the effects of the interaction with ADCs input
impedance begin to affect the linearity and gain error of the ADS1118. Because of the high sampling rates
supported by the ADS1118, simple post digital filtering in a microcontroller can alleviate the requirements of the
analog filter and can also offer the flexibility to implement filter notches at 50 Hz or 60 Hz. Two 0.1 µF (CCMA and
CCMB) capacitors are also added to offer attenuation of high-frequency common-mode noise components.
Because mismatches in the common-mode capacitors cause differential noise, TI recommends that the
differential capacitor be at least an order of magnitude (10x) larger than the common-mode capacitors.
3.3 V
0.1 PF
GND
3.3 V
GND
RDIFFA
500
RPU = 1 M
CCMA = 0.1 PF
AIN0
VDD
CDIFF = 1 PF
AIN1
RDIFFB
500
RPD = 1 M
Voltage Reference
(PGA Gain = 16)
±256mV FS
CCMB = 0.1 PF
SCLK
GND
GND
MUX
GND
3.3 V
DOUT/DRDY
Temperature
Sensor
Oscillator
GND
RDIFFB
500
GND
CS
CCMA = 0.1 PF
AIN2
CDIFF = 1 PF
AIN3
RPD = 1 M
Digital Filter
and
Interface
16-Bit
û ADC
DIN
RDIFFA
500
RPU = 1 M
PGA
CCMB = 0.1 PF
GND
GND
Figure 51. Two-Channel Thermocouple System
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The two 1-MΩ resistors (RPU and RPD) serve two purposes. The first purpose is to offer a common-mode bias
near midsupply. Although the ADS1118 does offer the ability to float the common-mode of a signal or connect
any of the inputs to a common point such as ground or supply, TI generally recommends avoiding such
situations. Connecting one of the inputs to a common point decreases performance by converting common-mode
noise into differential signal noise that is not strongly attenuated. The second purpose of the 1-MΩ resistors is to
offer a weak pull-up and pull-down for sensor open detection. In the event that a sensor is disconnected, the
inputs to the ADC extend to supply and ground and yield a full-scale readout, indicating a sensor disconnection.
The procedure to actually achieve cold-junction compensation is simple and can be done in several ways. One
way is to interleave readings between the thermocouple inputs and the temperature sensor. That is, acquire one
on-chip temperature result for every thermocouple ADC voltage measured. If the cold junction is in a very stable
environment, more periodic cold junction measurements may be sufficient. These operations yield two results for
every thermocouple measurement and cold junction measurement cycle: the thermocouple voltage VTC and the
on-chip temperature TCJC. In order to account for the cold junction, the temperature sensor within the ADS1118
must first be converted to a voltage proportional to the thermocouple currently being used yielding VCJC. This
conversion is generally accomplished by performing a reverse lookup on the table being used for the
thermocouple voltage to temperature conversion. Then, adding the two voltages yields the thermocouple
compensated voltage (VActual), where VCJC + VTC = VActual. VActual is then converted to temperature using the
same lookup table as before, yielding TActual.
Thermocouple manufacturers usually supply a lookup table with their thermocouples that offer excellent accuracy
for linearization of a specific type of thermocouple. The granularity on these lookup tables is generally very
precise (at around 1°C for each lookup value). To save microcontroller memory and development time, an
interpolation technique applied to these values can be used. By choosing 16 to 32 equally-spaced values from
the manufacturer's lookup tables over a desired temperature range, using a simple linear approximation of
intervals between is generally very precise.
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REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (August 2012) to Revision C
Page
•
Updated document to current standards .............................................................................................................................. 1
•
Changed Single-Shot Mode sub-bullet in Low Current Consumption Features bullet ......................................................... 1
•
Changed Internal Temperature Sensor Features bullet ....................................................................................................... 1
•
Changed Description section ................................................................................................................................................ 1
•
Changed Product Family table ............................................................................................................................................. 2
•
Changed conditions for Electrical Characteristics table ....................................................................................................... 3
•
Changed Analog Input, Full-scale input voltage range parameter row in Electrical Characteristics table ........................... 3
•
Changed footnotes 1 and 2 in Electrical Characteristics table ............................................................................................. 3
•
Changed System Performance, Integral nonlinearity and Gain Error test conditions in Electrical Characteristics table ..... 3
•
Changed first two Temperature Sensor, Temperature sensor accuracy parameter test conditions in Electrical
Characteristics table ............................................................................................................................................................. 3
•
Changed Power-Supply Requirements, Supply current parameter test conditions in Electrical Characteristics table ........ 4
•
Added QFN (RUG) data to Thermal Information table ......................................................................................................... 4
•
Changed Function column name in Pin Descriptions table .................................................................................................. 5
•
Changed footnote 3 of Timing Requirements: Serial Interface Timing table ........................................................................ 6
•
Updated Figure 3 .................................................................................................................................................................. 7
•
Updated Figure 12 ................................................................................................................................................................ 8
•
Changed title of Figure 14 to Figure 17 ................................................................................................................................ 8
•
Updated Figure 18 and Figure 24 ......................................................................................................................................... 9
•
Changed conditions in Figure 27 to Figure 31 ................................................................................................................... 10
•
Updated Figure 26 .............................................................................................................................................................. 11
•
Changed comments in Figure 33 to Figure 37 ................................................................................................................... 11
•
Changed Overview section ................................................................................................................................................. 13
•
Changed Multiplexer section .............................................................................................................................................. 14
•
Changed Full-Scale Input section ....................................................................................................................................... 16
•
Added multiplication points to example equations in Converting from Digital Codes to Temperature section .................. 18
•
Changed Aliasing, Reset and Power-Up, Operating Modes, and Duty Cycling for Low Power sections .......................... 19
•
Changed Serial Interface, Chip Select, Serial Clock, Data Input, and Data Output and Data Ready sections ................. 20
•
Changed Registers section ................................................................................................................................................. 21
•
Changed Data Retrieval section ......................................................................................................................................... 23
•
Changed Application Information section ........................................................................................................................... 25
•
Updated Figure 51 .............................................................................................................................................................. 29
Changes from Revision A (July 2011) to Revision B
Page
•
Added (MSOP) to titles of Figure 26 to Figure 31 .............................................................................................................. 11
•
Added Figure 32 to Figure 37 ............................................................................................................................................. 12
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PACKAGE OPTION ADDENDUM
www.ti.com
23-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Samples
(3)
(Requires Login)
ADS1118IDGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS1118IDGST
ACTIVE
VSSOP
DGS
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS1118IRUGR
ACTIVE
X2QFN
RUG
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ADS1118IRUGT
ACTIVE
X2QFN
RUG
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
ADS1118IDGSR
VSSOP
DGS
10
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.4
5.3
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.3
1.3
8.0
12.0
Q1
ADS1118IDGST
VSSOP
DGS
10
250
180.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
ADS1118IRUGR
X2QFN
RUG
10
3000
179.0
8.4
1.75
2.25
0.65
4.0
8.0
Q1
ADS1118IRUGT
X2QFN
RUG
10
250
179.0
8.4
1.75
2.25
0.65
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS1118IDGSR
VSSOP
DGS
10
2500
370.0
355.0
55.0
ADS1118IDGST
VSSOP
DGS
10
250
195.0
200.0
45.0
ADS1118IRUGR
X2QFN
RUG
10
3000
203.0
203.0
35.0
ADS1118IRUGT
X2QFN
RUG
10
250
203.0
203.0
35.0
Pack Materials-Page 2
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