LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SMD LED Pb Lead-Free Parts LG-5630DGMZ-X-T60-A01 DATA SHEET DOC. NO : QW0905-LG-5630DGMZ-X-T60-A01 REV. : A DATE : 28 - Apr. - 2017 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Product Model Designation System LG - 56 30 DGM Z - X - T60 - A01 A A Title LG:Ligitek B C B Dimension(L) 56:5.6mm D E F G H C D E Dimension(W) Emitting Color Zener 30:3.0mm DGM :Green Color F G H Chip Modification Test Current Bin Modification -X: 2 chip in 1(Parallel) T60: 60mA Page 1/11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Typical Applications Features *. SMTpackage *.Suitable for all SMT assembly and soldering methodes *. Pb-Free Reflow soldering application *. More Energy Efficient than lncandescent and most Halogen lamps. *. RoHS compliant Dimension *. Reading Light (car,bus,aircraft) *. Portable(flashlight,bicycle). *. Backlights(Monitor,TV) / Light Guides. *. Automotive Exterior (Stop-Tail-Tum,CHMSL,Mirror Side Repeat). *. Commercial and Residential Architectural lighting. *. Mini-accent / Uplighters / Downlighters / Orientation lighting *. Fiber Optic Alternative / Decorative / Entertainment lighting. *. Security / Garden lighting. *. Cove / Undershelf / Task lighting. *. Traffic signaling / Beacons / Rail crossing and Wayside lighting. 5.3 1 3 2 4 3.0 5.6 Recommended Solder Patterns 0.9 1.62 0.8 2.0 0.5 2 0.8 1 5 4 0.5 2.1 3 1.28 Slug Anode(+) 1 2 5 1 4 3.8 6.8 Cathode(-) 3 4 2 5 3 0.3 2.3 1.6 NC Note: 1.The tolerance unless mentioned is ±0.1mm,unit=mm. 2.It is strongly recommended to apply on electrically isolated heat conducting film between the slug and contact surfaces. Page 2/11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Absolute Maximum Ratings at Ta=25℃ Symbol Ratings UNIT IF 60 mA Power Dissipation PD 0.216 W Peak pulse current Duty 1/10@10KHz IFP 100 mA LED junction Temperature Tj 125 ℃ Reverse Current(VR=5V) Ir 10 μA Electrostatic Discharge ESD 2000 V Storage Temperature Tstg -40 ~ +100 °C Operating Temperature Topr -40 ~ +85 °C Soldering Temperature Tp 260 °C Parameter DC Forward Current Typical Electrical & Optical Characteristics (Ta=25℃) Items Symbol Min. Typ. Max. UNIT CONDITION Luminous Intensity Iv 4000 5000 ---- mcd IF=60mA Dominant Wavelength λD 519 ---- 531 nm IF=60mA △λ ---- 36 ---- nm IF=60mA VF 2.8 ---- 3.6 V IF=60mA 2θ 1/2 ---- 120 ---- deg IF=60mA Spectral Line Half-Width Forward Voltage Viewing Angle Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2.The luminous intensity data did not including ±15% testing tolerance. 3.Green emitters are built with InGaN. Page 3/11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Luminous Intensity Classification Iv(mcd) at 60mA BIN CODE Min. Max. Y-2 4000 5000 Z-1 5000 6500 Z-2 6500 8000 AA-1 8000 10000 Color Code Classification λD(nm) at 60mA BIN CODE Min. Max. 1O 519 522 1P 522 525 1Q 525 528 1R 528 531 Forward Voltage Classification BIN CODE 1 2 3 4 Vf(v) at 60mA Min. Max. 2.8 3.0 3.2 3.4 3.0 3.2 3.4 3.6 Page 4/11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Recommended Profile for Reflow Soldering Pb -free solder temperature profile Pb -free solder Temperature profile Pre-heat Pre-heat time Peak-Temperature Soldering time condition 180-200°C 120 Sec Max 260°C Max 10 Sec Max 260°C.Max. 10 Sec .Max. 1-5°C/Sec. 60 Sec.Max. Above220°C 6°C/Sec. Pre-heating 180-200°C 1-5°C/Sec. 120 Sec. Max. (1) (2) (3) (4) Reflow soldering should not be done more than two times. When soldering,do not put stress on the LEDs during heating. After soldering,do not warp the circuit board. The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter,the picking up nozzle that does not affect the silicone resin should be used. Hand Soldering Conditions: Do not exceed 3 seconds at maximum 320°C under soldering iron.(one time only) Page 5/11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Typical Electro Optical Characteristics Curves Fig.2 Forward current vs.Luminous Intensity Relative Luminous Intensity(%) Fig.1 Forward current vs. Forward Voltage 60 50 40 30 20 10 0 2.7 2.8 2.9 3 3.1 3.2 3.3 1.2 1 0.8 0.6 0.4 0.2 0 0 10 20 30 Fig.3 Directivity Radiation 0° -30° 30° -60° 60° 100% 75% 50% 25% 0 25% 50% 75% 100% Fig.4 Relative Intensity vs. Wavelength 1.0 0.5 0.0 450 500 40 50 Forward Current(mA) Forward Current(mA) Relative Intensity@60mA Forward Voltage(V) 70 550 Wavelength (nm) Page 6/11 600 60 70 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Carrier Type Dimensions 4.0 0.25 1.5 1.75 - 5.5 + 12.0±0.3 5.95 9.3 Polarity 4.0 3.25 1.2 Note : The tolerances unless mentioned is ±0.2mm. Packing Specifications Label Aluminum Moist-Proof bag Label Desiccant Page 7/11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Label Explanation Pb LIGITEK ELECTRONICS CO., LTD. PART : LG-5630DGMZ-X-T60-A01 BIN : Luminous Flux LOT : GS11520109 HUE : Dominant Wavelength QTY(PCS): 2000 VF : Forward Voltage BIN/HUE : Z-1/1P VF:3.0-3.2 Reel Dimensions 16.0±1.0 60.2±0.5 Page 8/11 178±1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Box Explanation 1. 4 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm W L H Page 9/11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reliability Test Classification Test Item Test Condition Sample Size Operating Life Test 1.Ta=25°C 2.If=60mA 3.t=1000 hrs (-24hrs,+72hrs) 22 High Temperature Storage Test 1.Ta=100°C±5°C 2.t=1000 hrs (-24hrs,+72hrs) 22 Low Temperature Storage Test 1.Ta=-40°C±5°C 2.t=1000 hrs (-24hrs,+72hrs) 22 High Temperature High Humidity Storage Test 1.Ta=85°C 2.RH=85% 3.t=1000hrs(-24hrs,+72hrs) 22 1.Ta=100°C±5°C ~ -40°C±5°C 20min/ 10sec / 20min 2.total 100 cycles 22 1.100°C±5°C ~ -40°C±5°C 30mins / 5mins / 30mins 2.100 Cyeles 22 Endurance Test Thermal Shock Test Environmental Test Temperature Cycling IR Reflow 1.T=260°C Max. 10sec.Max. 2. 6 Min Page 10/11 22 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Precautions For Use: Storage time: 1. Calculated shelf life before opening is 12 months at < 30°C and < 90% relative humidity (RH) 2. After bag is opened, devices which will be subjected to reflow soldering or other high temperature processes must be a) Assemblied within 168 hours in an environment of ≦ 30°C / 60% RH, or b) Stored at ambient of 10% RH or less 3. Devices are required baking before assembly if: a) Humidity Indicator Card reads >10% (for level 2a -5a) or >60% (for level 2) at ambient temperature 23 ±5°C b) 2.a) or 2.b) doesn't meet 4. If baking is required, devices should be baked for >72 hours at 60±5°C / 5% RH.Performing baking only once, and using the baked devices within 72 hours. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forward current should not be allowed to change by more than 40% of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Page 11/11