LCD and Camera EMI Filter Array with ESD Protection CM1450 Features Product Description • • • The CM1450 comprises a family of inductor-capacitor (L-C) based EMI filter arrays with integrated ESD protection in a CSP form factor. The CM1450-06 and CM1450-08 are configured in 6 and 8 channel formats respectively. Each EMI filter channel of the CM1450 is implemented as a 5-pole L-C filter where the component values are 14pF-17nH-14pF-17nF14pF. The CM1450's roll-off frequency at -10dB attenuation is 400MHz and can be used in applications where the data rates are as high as 160Mbps while providing greater than 35dB over the 800MHz to 2.7GHz frequency range. The parts integrate ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports safely dissipate ESD strikes of ±15kV, exceeding the Level 4 requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • • • High bandwidth, high RF rejection filter array Six and eight channels of EMI filtering Utilizes Praetorian® inductor-based design technology for true L-C filter implementation OptiGuard™ coating for improved reliability ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Better than 40dB of attenuation at 1GHz Maintains signal integrity for signals that have a risetime and falltime as fast as 2ns Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 3.006mm x 1.376mm footprint Chip Scale Package (CM1450-06CS/CP) 20-bump, 4.006mm x 1.376mm footprint Chip Scale Package (CM1450-08CS/CP) RoHS-compliant, lead-free finishing Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data phones in cell phones, PDAs or notebook computers Wireless handsets / cell phones Handheld PCs/PDAs LCD and camera modules This device is particularly well-suited for portable electronics (e.g. wireless handsets, PDAs) because of its small package format and easy-to-use pin assignments. In particular, the CM1450 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in wireless handsets while maintaining the integrity of signals that have rise/fall times as fast as 2ns. The CM1450 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1450 is available in a space-saving, low-profile Chip Scale Package with lead-free finishing. ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1450/D CM1450 Rev. 2 | Page 2 of 16 | www.onsemi.com CM1450 PIN DESCRIPTIONS CM1450-06 CM1450-08 CM1450-06 CM1450-08 PIN(s) PIN(s) NAME DESCRIPTION PIN(s) PIN(s) NAME DESCRIPTION A1 A1 FILTER1 Filter Channel 1 C1 C1 FILTER1 Filter Channel 1 A2 A2 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2 A3 A3 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3 A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4 A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5 A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6 - A7 FILTER7 Filter Channel 7 - C7 FILTER7 Filter Channel 7 - A8 FILTER8 Filter Channel 8 - C8 FILTER8 Filter Channel 8 B1-B3 B1-B4 GND Device Ground Ordering Information PART NUMBERING INFORMATION Standard Finish Lead-free Finish2 Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 15 CSP CM1450-06CS N506 CM1450-06CP N506 20 CSP CM1450-08CS N508 CM1450-08CP N508 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 3 of 16 | www.onsemi.com CM1450 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C Current per Inductor 30 mA DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 2 | Page 4 of 16 | www.onsemi.com CM1450 ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL LTOT L1, L2 RDC IN-OUT CTOT C1, C2, C3 f f C RO PARAMETER CONDITIONS MIN TYP MAX UNITS Total Channel Inductance (L1 + L2) 34 nH Inductance 17 nH DC Channel Resistance 18 Ω Total Channel Capacitance (C1+ C2 + C3 ) At 2.5V DC, 1MHz, 30mV AC, Note 3 33.6 42 50.4 pF Capacitance At 2.5V DC, 1MHz, 30mV AC, Note 3 11.2 14 16.8 pF Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 137 MHz Roll-off Frequency at -10dB Attenuation ZSOURCE=50Ω, ZLOAD=50Ω 400 MHz V Diode Standoff Voltage IDIODE=10μA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE=+3.3V 0.1 1.0 μA VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA 6.8 -0.8 9.0 -0.4 V V In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 VDIODE VESD RDYN 5.6 -1.5 Dynamic Resistance Positive Negative ±30 kV ±15 kV 2.30 0.90 Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Rev. 2 | Page 5 of 16 | www.onsemi.com Ω Ω CM1450 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1) Rev. 2 | Page 6 of 16 | www.onsemi.com CM1450 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) Rev. 2 | Page 7 of 16 | www.onsemi.com CM1450 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3) Rev. 2 | Page 8 of 16 | www.onsemi.com CM1450 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4) Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4) Rev. 2 | Page 9 of 16 | www.onsemi.com CM1450 [pF] Performance Information (cont’d) D.C.Vo ltage Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Transient Response Characteristics Figure 10. Simulated Transient Response (input signal risetime and falltime= 2ns, clocked at 25, 50 and 75 MHz, 15Ω Source Resistance, 5pF Load) Rev. 2 | Page 10 of 16 | www.onsemi.com CM1450 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 11 of 16 | www.onsemi.com 260°C CM1450 Mechanical Details CM1450-06 CSP Mechanical Specifications The CM1450-06CS/CP is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 15 Millimeters Inches Dim Min Nom Max Min Nom Max A1 2.961 3.006 3.051 0.1166 0.1183 0.1201 A2 1.331 1.376 1.421 0.0524 0.0542 0.0559 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.203 0.253 0.303 0.0080 0.0100 0.0119 C2 0.203 0.253 0.303 0.0080 0.0100 0.0119 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1450-06CS/CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 12 of 16 | www.onsemi.com CM1450 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) CM1450-06 3.006 X 1.376 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm Figure 14. Tape and Reel Mechanical Data Rev. 2 | Page 13 of 16 | www.onsemi.com CM1450 Mechanical Details (cont’d) CM1450-08 Mechanical Specifications The package dimensions for the CM1450-08CS/CP are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Millimeters Inches Dim Min Nom Max Min Nom Max A1 3.961 4.006 4.051 0.1559 0.1577 0.1595 A2 1.331 1.376 1.421 0.0524 0.0542 0.0559 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.203 0.253 0.303 0.0080 0.0100 0.0119 C2 0.203 0.253 0.303 0.0080 0.0100 0.0119 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1450-08CS/CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 14 of 16 | www.onsemi.com CM1450 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1450-08 4.006 X 1.376 X 0.644 4.11 X 1.57 X 0.76 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 12mm 330mm (13") 3500 4mm 4mm Figure 15. Tape and Reel Mechanical Data Rev. 2 | Page 15 of 16 | www.onsemi.com CM1450 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Rev. 2 | Page 16 of 16 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative