IRDC3899-P1V2 SupIRBuck TM USER GUIDE FOR IR3899 EVALUATION BOARD 1.2Vout DESCRIPTION The IR3899 is a synchronous buck converter, providing a compact, high performance and flexible solution in a small 4mm X 5 mm Power QFN package. Key features offered by the IR3899 include internal Digital Soft Start/Soft Stop, precision 0.5Vreference voltage, Power Good, thermal protection, programmable switching frequency, Enable input, input under-voltage lockout for proper start-up, enhanced line/ load regulation with feed forward, external frequency synchronization with smooth clocking, internal LDO and pre-bias startup. Output over-current protection function is implemented by sensing the voltage developed across the on-resistance of the synchronous Mosfet for optimum cost and performance and the current limit is thermally compensated. This user guide contains the schematic and bill of materials for the IR3899 evaluation board. The guide describes operation and use of the evaluation board itself. Detailed application information for IR3899 is available in the IR3899 data sheet. BOARD FEATURES • Vin = +12V (+ 13.2V Max) •Vout = +1.2V @ 0- 9A • Fs=600kHz • L= 0.51uH • Cin= 4x10uF (ceramic 1206) + 1X330uF (electrolytic) • Cout=6x22uF (ceramic 0805) 12/8/2011 1 IRDC3899-P1V2 CONNECTIONS and OPERATING INSTRUCTIONS A well regulated +12V input supply should be connected to VIN+ and VIN-. A maximum of 9A load should be connected to VOUT+ and VOUT-. The inputs and output connections of the board are listed in Table I. IR3899 has only one input supply and internal LDO generates Vcc from Vin. If operation with external Vcc is required, then R15 can be removed and external Vcc can be applied between Vcc+ and Vcc- pins. Vin pin and Vcc/LDO_Out pins should be shorted together for external Vcc operation. The output can track voltage at the Vp pin. For this purpose, Vref pin is to be connected to ground (use zero ohm resistor for R21). The value of R14 and R28 can be selected to provide the desired tracking ratio between output voltage and the tracking input. Table I. Connections Connection Signal Name VIN+ Vin (+12V) VIN- Ground of Vin Vout+ Vout(+1.2V) Vout- Ground for Vout Vcc+ Vcc/ LDO_Out Pin Vcc- Ground for Vcc input Enable Enable PGood Power Good Signal AGnd Analog ground LAYOUT The PCB is a 4-layer board (2.23”x2”) using FR4 material. All layers use 2 Oz. copper. The PCB thickness is 0.062”. The IR3899 and other major power components are mounted on the top side of the board. Power supply decoupling capacitors, the bootstrap capacitor and feedback components are located close to IR3899. The feedback resistors are connected to the output at the point of regulation and are located close to the SupIRBuck IC. To improve efficiency, the circuit board is designed to minimize the length of the on-board power ground current path. 12/8/2011 2 IRDC3899-P1V2 Connection Diagram Vin Gnd Gnd Vout Enable VDDQ Top View Vref Sync S-Ctrl AGnd PGood Vsns Vcc+ Vcc- Bottom View Fig. 1: Connection Diagram of IR3899/98/97 Evaluation Boards 12/8/2011 3 IRDC3899-P1V2 Fig. 2: Board Layout-Top Layer Single point connection between AGnd and PGnd Fig. 3: Board Layout-Bottom Layer 12/8/2011 4 IRDC3899-P1V2 Fig. 4: Board Layout-Mid Layer 1 Fig. 5: Board Layout-Mid Layer 2 12/8/2011 5 Fig. 6: Schematic of the IR3899 evaluation board IRDC3899-P1V2 12/8/2011 6 IRDC3899-P1V2 Bill of Materials Item Qty Part Reference Value Description Manufacturer Part Number 1 1 C1 330uF SMD Electrolytic F size 25V 20% Panasonic EEV-FK1E331P 2 4 C2 C3 C4 C5 10uF 1206, 25V, X5R, 20% TDK C3216X5R1E106M 3 4 C7 C12 C14 C24 0.1uF 0603, 25V, X7R, 10% Murata GRM188R71E104KA01B 4 1 C8 2200pF 0603,50V,X7R Murata GRM188R71H222KA01B 5 1 C11 270pF 0603, 50V, NP0, 5% Murata GRM1885C1H271JA01D 6 6 C15 C16 C17 C18 C19 C20 22uF TDK C2012X5R0J226M 7 1 C23 2.2uF 0603, 16V, X5R, 20% TDK C1608X5R1C225M 8 1 C26 10nF 0603, 25V, X7R, 10% Murata GRM188R71E103KA01J 9 1 C32 1.0uF 0603, 25V, X5R, 10% Murata GRM188R61E105KA12D 10 1 L1 0.51uH SMD 11.0x7.2x7.5mm,0.29mΩ Vitec 59PR9876N 11 1 R1 1.43K Thick Film, 0603,1/10W,1% Panasonic ERJ-3EKF1431V 12 2 R2 R11 3.32K Thick Film, 0603,1/10W,1% Panasonic ERJ-3EKF3321V 13 2 R3 R12 2.37K Thick Film, 0603,1/10W,1% Panasonic ERJ-3EKF2371V 14 1 R4 100 Thick Film, 0603,1/10W,1% Panasonic ERJ-3EKF1000V 15 1 R6 20 Thick Film, 0603,1/10W,1% Panasonic ERJ-3EKF20R0V 16 1 R9 39.2K Thick Film, 0603,1/10W,1% Panasonic ERJ-3EKF3922V 17 5 R10 R13 R14 R15 R50 0 Panasonic ERJ-3GEY0R00V 18 2 R17 R18 49.9K Thick Film, 0603,1/10W,1% Panasonic ERJ-3EKF4992V 19 1 R19 7.5K Thick Film, 0603,1/10W,1% Panasonic ERJ-3EKF7501V 20 1 U1 IR3899 PQFN 4x5mm IR IR3899MPBF 12/8/2011 0805, 6.3V, X5R, 20% Thick Film, 0603,1/10W 7 IRDC3899-P1V2 TYPICAL OPERATING WAVEFORMS Vin=12.0V, Vo=1.2V, Io=0-9A, Room Temperature, no airflow Fig. 7: Start up at 9A Load Ch1:Vin, Ch2:Vo, Ch3:PGood Ch4:Enable Fig. 9: Start up with 1V Pre Bias , 0A Load, Ch2:Vo Fig. 11: Inductor node at 9A load Ch3:LX 12/8/2011 Fig. 8: Start up at 9A Load, Ch1:Vin, Ch2:Vo, Ch3:Vcc, Ch4:PGood Fig. 10: Output Voltage Ripple, 9A load Ch2: Vout , Fig. 12: Short circuit (Hiccup) Recovery Ch2:Vout , Ch4:Iout 8 IRDC3899-P1V2 TYPICAL OPERATING WAVEFORMS Vin=12.0V, Vo=1.2V, Io=0-9A, Room Temperature, no air flow Fig. 13: Transient Response, 4.5A to 9A step Ch4-Iout Ch2:Vout 12/8/2011 9 IRDC3899-P1V2 TYPICAL OPERATING WAVEFORMS Vin=12.0V, Vo=1.2V, Io=0-9A, Room Temperature, no air flow Fig. 14: Bode Plot at 9A load shows a bandwidth of 115.6KHz and phase margin of 50.3 degrees 12/8/2011 10 IRDC3899-P1V2 TYPICAL OPERATING WAVEFORMS Vin=12.0V, Vo=1.2V, Io=0-9A, Room Temperature, no air flow Fig (15) Soft start and soft stop using S_Ctrl pin Fig (16) Feed Forward for Vin change from 7 to 16V and back to 7V Ch2-Vout Ch3-Vin 12/8/2011 11 IRDC3899-P1V2 TYPICAL OPERATING WAVEFORMS Vin=12.0V, Vo=1.2V, Io=0-9A, Room Temperature, no air flow 90 88 Efficiency(%) 86 84 82 80 78 76 0.9 1.8 2.7 3.6 4.5 5.4 6.3 7.2 8.1 9 8.1 9 Iout(A) Fig.17: Efficiency versus load current 1.8 1.6 PDissipation (W) 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0.9 1.8 2.7 3.6 4.5 5.4 6.3 7.2 Iout(A) Fig.18: Power loss versus load current 12/8/2011 12 IRDC3899-P1V2 THERMAL IMAGES Vin=12.0V, Vo=1.2V, Io=0-9A, Room Temperature, No Air flow Fig. 19: Thermal Image of the board at 9A load Test point 1 is IR3899 Test point 2 is inductor 12/8/2011 13 IRDC3899-P1V2 PCB METAL AND COMPONENT PLACEMENT Evaluations have shown that the best overall performance is achieved using the substrate/PCB layout as shown in following figures. PQFN devices should be placed to an accuracy of 0.050mm on both X and Y axes. Self-centering behavior is highly dependent on solders and processes, and experiments should be run to confirm the limits of self-centering on specific processes. For further information, please refer to “SupIRBuck™ Multi-Chip Module (MCM) Power Quad Flat No-Lead (PQFN) Board Mounting Application Note.” (AN1132) Figure 20: PCB Metal Pad Spacing (all dimensions in mm) 12/8/2011 14 IRDC3899-P1V2 SOLDER RESIST IR recommends that the larger Power or Land Area pads are Solder Mask Defined (SMD.) This allows the underlying Copper traces to be as large as possible, which helps in terms of current carrying capability and device cooling capability. When using SMD pads, the underlying copper traces should be at least 0.05mm larger (on each edge) than the Solder Mask window, in order to accommodate any layer to layer misalignment. (i.e. 0.1mm in X & Y.) However, for the smaller Signal type leads around the edge of the device, IR recommends that these are Non Solder Mask Defined or Copper Defined. When using NSMD pads, the Solder Resist Window should be larger than the Copper Pad by at least 0.025mm on each edge, (i.e. 0.05mm in X&Y,) in order to accommodate any layer to layer misalignment. Ensure that the solder resist in-between the smaller signal lead areas are at least 0.15mm wide, due to the high x/y aspect ratio of the solder mask strip. Figure 21: Solder resist 12/8/2011 15 IRDC3899-P1V2 STENCIL DESIGN Stencils for PQFN can be used with thicknesses of 0.100-0.250mm (0.004-0.010"). Stencils thinner than 0.100mm are unsuitable because they deposit insufficient solder paste to make good solder joints with the ground pad; high reductions sometimes create similar problems. Stencils in the range of 0.125mm-0.200mm (0.005-0.008"), with suitable reductions, give the best results. Evaluations have shown that the best overall performance is achieved using the stencil design shown in following figure. This design is for a stencil thickness of 0.127mm (0.005").The reduction should be adjusted for stencils of other thicknesses. Figure 22: Stencil Pad Spacing (all dimensions in mm) 12/8/2011 16 IRDC3899-P1V2 PACKAGE INFORMATION Figure 23: Package Dimensions IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 This product has been designed and qualified for the Industrial market Visit us at www.irf.com for sales contact information Data and specifications subject to change without notice. 12/11 12/8/2011 17