Product Brief Infineon rounds off the Backhaul Family with a packaged RF Solution for V-band Radio Backhaul Transceiver Chip – BGT60 Infineon has a broad portfolio of packaged RF transceivers for basestation backhaul solutions – beside BGT70 and BGT80 for E-band radio, also BGT60 for V-band radio. The family approach has a major benefit – one architecture supporting the three backhaul frequency ranges of 60, 70 and 80GHz. Customers can easily design all three radios with the same footprint for all three transceivers. Mobile communication and especially LTE (4G) is gaining momentum these days due to the fact that all big carriers and mobile phone manufacturers are investing in the 4th generation ecosystem. The primary challenge facing this ecosystem is the fact that LTE will further enhance video and data exchange to a maximum, allowing everybody to send their latest holiday pictures and videos to friends. The bulk of today’s base station infrastructure is not equipped to support the required high data throughput. The connection between the base station has up to now been planned for lower data rates (< 100MBit/s) and now needs increased capacity. This is where wireless backhaul technology comes into play. A solution using wireless backhaul in the V-band (57–64GHz) will enable the 7GHz frequency to support higher data rates. This enables data rates > 1Gbit/s for video and data services, sufficient for LTE. Backhaul Network Example LTE BTS Picocell Picocell Macrocell Picocell Microcell 4G/LTE Characteristics of different Base Station Sizes Base Station Picocell Microcell Macrocell Range 10–200m 200m–2km 1–30km No. of users 8–32 64+ 200+ Typical application SMB, enterprise, public indoor areas Metro outdoors, city centers, capacity hotspots Outdoor coverage Deployment scenario Enterprise or operator deployed Operator deployed Operator deployed www.infineon.com/rf BGT60 Features Target Feature Details Developed for telecommunication only Support FDD and TDD systems (in full duplex or half-duplex mode) Support modulation schemes: QPSK, QAM Support small cell backhaul (up to 1000m) Direct conversion I/Q transceiver IF bandwidth 1000MHz Differential RF/IF interface for lower loss and better isolation Integration of VCO (Voltage Controller Oscillator) signal generation PNssb (Phase Noise single side band) < -80dBc/Hz @ 100kHz offset Typ. 13dBm linear output power 7dB NF (Noise Figure) Integrated power detection function Integrated thermal sensor eWLB (embedded Wafer Level Ball Grid Array) packaged device Product Brief Infineon rounds off the Backhaul Family with a packaged RF Solution for V-band Radio Backhaul Transceiver Chip – BGT60 However, if we compare the 60GHz V-band with the 80GHz E-band, the former is always seen as a less favorable frequency band, due to the sharp oxygen absorption. This means that in addition to the Free Space Loss (FSL), oxygen absorption loss must be taken into account and a margin allowed for rain fade. As a result, a maximum link distance of up to 1000 meters is possible. This could be considered a disadvantage in traditional network design, where a microwave link would mostly be used for distances beyond 1000 meters. Particularly in the case of Picocell deployment, high oxygen absorption and the associated reduced range becomes a real benefit compared to traditional microwave or other wireless backhauling solutions: Benefits of V-band Radio Hundreds of links can be installed in a dense area Very low interference between the PTP links or other 60GHz devices in the field High bandwidth for up to 1Gbit/s (full duplex) per link The Infineon business approach enables such a Gbit service with the latest technology. Thanks to Infineon’s advanced SiGe (Silicon Germanium) technology with a transit frequency of 200GHz, we can integrate all RF (Radio Frequency) building blocks – such as Power Amplifier (PA), Low Noise Amplifier (LNA), Mixer, Programmable Gain Amplifier (PGA), Voltage Controlled Oscillator (VCO) – into a single chip. This technology is already proven and fully qualified for Infineon Millimeter and Microwave chipsets (e.g. 77GHz automotive radar). Furthermore, Infineon houses this single-chip in a plastic package which makes a major difference to the market. Up to now, solutions have been bare die and require expensive tools and equipment to build up a radio system. With the Infineon packaged chipset, customers can save money and reduce the time-to-market significantly. The chip is a transceiver for 57–64GHz (BGT60), housed in an eWLB(6 × 6mm²) package. V-Band TDD Half Duplex System in TDD Base Station A Base Station B I/F I/Q Upconversion BGT60 BGT60 I/F I/Q Upconversion I/F I/Q Downconversion Tx or Rx On Rx or Tx On I/F I/Q Downconversion Benefits of BGT60 Packaged solution, easy to use and standard SMT flow for mounting on customer system Highly integrated RF transceiver requiring no external RF discretes, thereby simplifying the customer design and time-to-market Architecture of Direct Conversion Zero IF eases interface to latest modem/BB designs (no external filter) A transceiver approach with implemented BIST (Built-In Self-Test) on the chip to enable RF testing at Infineon production Family concept (common architecture, package, pinning) simplifies customer designs due to modular approach Published by Infineon Technologies AG 85579 Neubiberg, Germany © 2013 Infineon Technologies AG. All Rights Reserved. Visit us: www.infineon.com Order Number: B132-H9781-G1-X-7600 Date: 08 / 2013 Transceiver Chip Solution BGT60 for ISM band (license free), 57–64GHz BGT60 has identical pinning and same footprint as BGT70 or BGT80 Channel, Tx or Rx, selection via SPI Attention please! The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/ or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.