LP5522 www.ti.com SNVS488 – JUNE 2007 Programmable LED Driver Check for Samples: LP5522 FEATURES • • • 1 • 2 • • Programmable blinking sequence – 1 to 3 programmable pulses – 1 ms to 255 ms LED on time – 10 ms to 2500 ms LED off time – Single or continuous run of programmed blinking sequence Constant current high side output driver Adjustable current with external resistor 0.2 uA typical shutdown current Autonomous operation without external clock Micro SMD-6 package with 0.4 mm pitch: – 1.215 mm x 0.815 mm x 0.6 mm (LxWxH) APPLICATIONS • • • Indicator lights Phone cosmetics Toys DESCRIPTION The LP5522 is a simple single wire programmable LED controller in six bump micro SMD package. It provides constant current flow through high side driver. Output current can be set from 1 mA to 20 mA by using an external resistor on the ISET pin. If no external resistor is used, output current is set to 5 mA default current. The LP5522 is controlled using only one signal. The signal controls either directly the LED driver or it launches previously programmed blinking sequence. The LP5522 works autonomously without a clock signal from the master device. Very low LED driver headroom voltage makes possible to use supply voltages close to LED forward voltage. Current consumption of the LP5522 is minimized when LED is turned off and once controller is disabled all supporting functions are also shut down. Very small micro SMD package together with minimum number of external components is a best fit for handheld devices. Typical Application VIN VDD ISET + - LP5522 LED CTRL GND GNDT 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated LP5522 SNVS488 – JUNE 2007 www.ti.com Connection Diagrams and Package Mark Information Connection Diagram Figure 1. Micro SMD-6 package, 0.815 x 1.215 x 0.60 mm body size, 0.4 mm pitch 2 LED GND GNDT 1 VDD ISET CTRL A B C Figure 2. Top View Figure 3. Micro SMD-6 package, 0.815 x 1.215 x 0.60 mm body size, 0.4 mm pitch GNDT GND LED 2 CTRL ISET VDD 1 C B A Figure 4. Bottom View PACKAGE MARK X V 6 X = 1 Digit Date Code V = Die Traceability 6 = Product Identification = Pin A1 PIN DESCRIPTIONS Pin Name Type A1 VDD P Power supply pin Description B1 ISET AI Current set input C1 CTRL DI Digital control input A2 LED AO Current source output B2 GND G Ground C2 GNDT G Ground A: Analog Pin, D: Digital Pin, G: Ground Pin, P: Power Pin, I: Input Pin, O: Output Pin These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Links: LP5522 LP5522 www.ti.com SNVS488 – JUNE 2007 Absolute Maximum Ratings (1) (2) V (VDD, LED, ISET) -0.3V to +6.0V Voltage on logic pin (CTRL) Continuous Power Dissipation -0.3V to VDD +0.3V with 6.0V max (3) Internally Limited Junction Temperature (TJ-MAX) 125°C Storage Temperature Range -65°C to +150°C Maximum Lead Temperature (Reflow soldering, 3 times) 260°C (4) ESD Rating (5) Human Body Model (1) (2) (3) (4) (5) 2 kV Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. All voltages are with respect to the potential at the GND pins. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=160°C (typ.) and disengages at TJ=140°C (typ.). For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN1112 : Micro SMD Wafer Level Chip Scale Package. The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. MIL-STD-883 3015.7 Operating Ratings (1) (2) Voltage on power pin (VDD) 2.7V to 5.5V Recommended Load Current 1 mA to 20 mA Junction Temperature (TJ) Range Ambient Temperature (TA) Range (1) (2) (3) -30°C to +125°C (3) -30°C to +85°C Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. All voltages are with respect to the potential at the GND pins. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). Thermal Properties Junction-to-Ambient Thermal Resistance (θJA), TMD06 Package (1) (1) 87°C/W .Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Links: LP5522 3 LP5522 SNVS488 – JUNE 2007 www.ti.com Electrical Characteristics (1) (2) Limits in standard typeface are for TJ = 25°C. Limits in boldface type apply over the operating ambient temperature range (30°C < TA < +85°C). Unless otherwise noted, specifications apply to the LP5522 Block Diagram with: VIN = 3.6V, RISET = 24 kΩ, CIN = 100 nF. Symbol IVDD Typ Max Units Standby supply current Parameter CTRL = L Condition 0.2 1 µA Active Mode Supply Current CTRL = H, LED = off 40 55 µA 5 ILEAKAGE LED Pin Leakage Current IOUT LED Output Current Without external resistor LED Output Current With external 24kΩ 0.04% resistor Min 1 µA +8 mA % +8 mA % 35 50 mV −8 20 −8 IMIRROR External RISET Mirroring Ratio 1:400 VISET ISET Reference Voltage VHR Minimum Headroom Voltage (VIN - VLED) (3) 70 100 mV T_CYCLE_H Minimum LED On Time 0.9 1.0 1.1 ms T_CYCLE_L Minimum LED Off Time 9 10 11 ms ONRESOLUTION LED On Time Resolution 1 ms OFFRESOLUTIO LED Off Time Resolution 10 ms 1.23 IOUT set to 10 mA IOUT set to 20 mA V N T_Timeout_H LED Timeout On Time 287 319 351 ms T_Timeout_L LED Timeout Off Time 2.87 3.19 3.51 s VIL Logic Input Low Level 0.5 V VIH Logic Input High Level 1.2 IIN CTRL Input Current -1 1 µA tON CTRL Pulse ON Time 15 µs tOFF CTRL Pulse OFF Time 30 µs tENTER Command Entering Period 500 tENTER+tBLANK Command Entering Period + Blank Period (1) (2) (3) 4 V µs 1500 µs All voltages are with respect to the potential at the GND pins. Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm. The current source is connected internally between VIN an VLED. The voltage across the current source, (VIN - VLED), is referred to a headroom voltage (VHR). Minimum headroom voltage is defined as the VHR voltage when the LED current has dropped 10% from the value measured at VLED = VIN - 1V. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Links: LP5522 LP5522 www.ti.com SNVS488 – JUNE 2007 LP5522 Block Diagram Modes of Operation POR RESET POR = H POR = L STANDBY Control command Control command ends ACTIVE RESET In the reset mode all functions are off and all registers are reset to the default values. Reset is entered always if internal Power On Reset (POR) is active. Power On Reset will activate during the device startup or when the supply voltage VIN falls below 1.5V (typ.). STANDBY: After Power On Reset device is in Standby mode. This is the low power consumption mode, when all circuit functions are disabled. ACTIVE: Once rising edge of CTRL signal is detected device goes into Active mode. In Active mode four sub modes are present: RUN: Run mode is divided into two sub modes depending on whether a blinking sequence is programmed into memory or not. Non-programmed mode: No blinking sequence programmed to memory. LED output follows CTRL input Programmed mode: Blinking sequence programmed to memory. LED output follows the programmed blinking sequence RUN ONCE: In Run once mode, programmed blinking sequence is performed once and after that device returns into Standby mode. Run once mode is available only if a blinking sequence is programmed into memory. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Links: LP5522 5 LP5522 SNVS488 – JUNE 2007 www.ti.com TRAINING: In Training mode new blinking sequence can be programmed. LED output follows CTRL signal during the programming TSD: If chip temperature rises above 160°C (typ.) device goes into Thermal Shut Down (TSD) mode. In TSD mode output is disabled but supporting functions are on. LED Driver Operational Description The LP5522 LED driver is constant current source. Current can be set with external resistor (RISET) so that the current ratio between resistor and LED is 1:400. RISET current correlates to ISET reference voltage (VISET). Consequently, current through LED can be adjusted using equation IOUT = 480/RISET. Use of external resistor is optional. If external resistor is not connected, default output current is 5 mA. When external resistor is not used ISET pin should be connected to VDD. 6 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Links: LP5522 LP5522 www.ti.com SNVS488 – JUNE 2007 LED Driver Typical Performance Characteristics TJ = 25°C. Unless otherwise noted, typical performance characteristics apply to the LP5522 Block Diagram with: VIN = 3.6V, RISET = 24 kΩ, CIN = 100 nF. Output Current vs RISET (Expanded Range) Output Current vs RISET Output Current vs Input Voltage (ISET Connected To VDD) Output Current vs Headroom Voltage Line Regulation LED Startup Control Interface Operational Description LP5522 has one digital control input, CTRL. Threshold levels of CTRL input are fixed to enable control from low voltage controller. CTRL signal is used to control the mode of the circuit. A rising edge of the CTRL signal activates the circuit and starts a command entering period. During the command entering period all rising edges are counted. After command entering period there is a blank period when no rising edges are allowed. If CTRL is left high after command entering period, the consequent command is performed right after the blank period. Note that timing diagrams are not on scale! Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Links: LP5522 7 LP5522 SNVS488 – JUNE 2007 www.ti.com CTRL LED Command entering period Blank period Command execution starts If CTRL signal is low after command entering period, command execution starts when CTRL is pulled high. This does not apply to Run command. With Run command CTRL must be high. Note that no rising edges are allowed during blank period. CTRL LED Command entering period Command execution starts Blank period LED Controller Commands and Operation There are four commands available for LP5522. Command Number of rising edges during command entering period Run One rising edge Training start Two rising edges Training end Three rising edges Run once Four rising edges RUN COMMAND One rising edge of CTRL signal within command entering period is interpreted as Run command. In programmed mode blinking sequence is started right after Blank period and it is repeated as long as CTRL signal is kept high. When CTRL signal is set low device goes into Standby mode. CTRL To Standby LED Command entering period Blank period Programmed sequence In non-programmed mode LED is on as long as CTRL is kept high. When CTRL signal is set low device goes into Standby mode. 8 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Links: LP5522 LP5522 www.ti.com SNVS488 – JUNE 2007 CTRL To Standby LED Command entering period Blank period RUN ONCE COMMAND Programmed blinking sequence is performed once after Run Once command. Four rising edges of CTRL signal within command entering period is interpreted as Run Once command. If CTRL is kept high after command entering period the programmed blinking sequence starts right after the blank period has elapsed. CTRL signal must stay high as long as programmed blinking sequence is executed. If CTRL is set low during execution of blinking sequence, device goes to standby and execution of blinking sequence is stopped. CTRL To Standby Programmed sequence LED Command entering period Blank period If CTRL signal is low after command entering period, Run Once command is executed once the CTRL is set high. CTRL To Standby Programmed sequence LED Command entering period Blank period TRAINING START COMMAND Blinking sequence is programmed into memory in training mode. Blinking sequence is stored into volatile memory, thus removing input voltage VIN resets the memory. Memory can also be reset by giving Training Start and Training End commands without any valid LED ON/OFF times. LP5522 enters to Training mode after Training Start command. Two rising edges within command entering period is interpreted as the Training Start command. The first LED ON time capturing is started once the rising edge of CTRL signal is detected after the blank period. LED output follows CTRL signal during the programming. The first LED ON time is recorded once CTRL signal is set low. Same time the first LED OFF time capturing is started. Programmed blinking sequence can have one to three LED ON/OFF times. In order to be programmed correctly, at least one valid LED ON and LED OFF time must be recorded. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Links: LP5522 9 LP5522 SNVS488 – JUNE 2007 www.ti.com CTRL LED Command entering period Blank period 1st ON Time 1st OFF Time starts TRAINING END COMMAND Blinking sequence programming ends once Training End command is introduced. Three rising edges within time period of tENTER is interpreted as Training End command. Note that blank period is also reguired after Training End command. During blanc period no rising edges are allowed. When Training End command is introduced during LED OFF time capturing, LED OFF time is recorded and chip goes to standby mode. To Standby CTRL LED 1st ON time 1st OFF time 2nd ON time 2nd OFF time tENTER Blank period If Training End command is introduced during LED ON time capturing, the associated LED ON period is not recorded and hence neither OFF time. Notice that valid OFF time before Training End is longer than half of Minimum LED OFF period (T_CYCLE_L). To Standby CTRL LED 1st ON time 1st OFF time 2nd ON time tENTER Blank period t < ½*T_CYCLE_L LED TIMEOUT ON/OFF TIMES When LP5522 is in training mode and CTRL signal is high longer than LED Timeout ON time, the ON time counter saturates. In this case saturated ON time is recorded and LED OFF time capturing is started. At the same time LED is switched off even if the CTRL signal is still high. If ON time counter has saturated, LED OFF time recording is terminated either by giving a Train End command or setting the CTRL signal to low and back to high. Setting the CTRL signal back to high records the LED OFF time and starts next ON time capturing. If anyhow CTRL is still high after the LED Timeout OFF time has been elapsed the OFF time counter saturates and saturated OFF time is recorded. After that chip waits the CTRL signal to go low which cause the chip to go Standby. 10 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Links: LP5522 LP5522 www.ti.com SNVS488 – JUNE 2007 To Standby Run command CTRL LED tENTER + tBLANK T_TIMEOUT_H T_TIMEOUT_L LED OFF time counter can saturate also if Training end command is not given or no new ON time has been started. In this case saturated OFF time is recorded and chip goes to Standby. To Standby Run once command To Standby CTRL LED tENTER + tBLANK T_TIMEOUT_L Recommended External Components INPUT CAPACITOR, CIN Although not required for normal operation, a capacitor can be added to VIN to reduce line noise. A surfacemount multi-layer ceramic capacitor (MLCC) is recommended. MLCCs with a X7R or X5R temperature characteristic are preferred. CURRENT SET RESISTOR, RISET If other than 5 mA current is required, RISET resistor can be used to adjust the current. For 20 mA current 24 kΩ resistor is required. Accuracy of the resistor directly effects to the accuracy of the LED current. 1% or better is recommended. LED Forward voltage of LED must be less than minimum input voltage minus minimum headroom voltage (VHR). For example with 2.7V input voltage and 20 mA LED current the maximum LED forward voltage is 2.7V - 100 mV = 2.6V. List of Recommended External Components Symbol Symbol Explanation Value Unit Type CIN VDD Bypass Capacitor 100 nF Ceramic, X7R or X5R RISET Current Set Resistor for 20 mA LED Current 24 kΩ 1% LED User defined Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Links: LP5522 11 PACKAGE OPTION ADDENDUM www.ti.com 17-Nov-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Samples (3) (Requires Login) LP5522TM/NOPB ACTIVE DSBGA YFQ 6 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM LP5522TMX/NOPB ACTIVE DSBGA YFQ 6 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Nov-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LP5522TM/NOPB DSBGA YFQ 6 250 178.0 8.4 LP5522TMX/NOPB DSBGA YFQ 6 3000 178.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.04 1.4 0.76 4.0 8.0 Q1 1.04 1.4 0.76 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Nov-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP5522TM/NOPB DSBGA YFQ LP5522TMX/NOPB DSBGA YFQ 6 250 203.0 190.0 41.0 6 3000 206.0 191.0 90.0 Pack Materials-Page 2 MECHANICAL DATA YFQ0006xxx TMD06XXX (Rev B) D: Max = 1.26 mm, Min = 1.16 mm E: Max = 0.86 mm, Min = 0.76 mm www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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