MC74HC4851A, MC74HC4852A Analog Multiplexers/ Demultiplexers with Injection Current Effect Control www.onsemi.com Automotive Customized These devices are pin compatible to standard HC405x and MC1405xB analog mux/demux devices, but feature injection current effect control. This makes them especially suited for usage in automotive applications where voltages in excess of normal logic voltage are common. The injection current effect control allows signals at disabled analog input channels to exceed the supply voltage range without affecting the signal of the enabled analog channel. This eliminates the need for external diode/resistor networks typically used to keep the analog channel signals within the supply voltage range. The devices utilize low power silicon gate CMOS technology. The Channel Select and Enable inputs are compatible with standard CMOS outputs. • TSSOP−16 DT SUFFIX CASE 948F 1 QFN16 MN SUFFIX CASE 485AW 16 16 HC4851A AWLYWWG HC485xAG AWLYWW • Injection Current Cross−Coupling Less than 1 mV/mA (See • • • • • SOIC−16 WIDE DW SUFFIX CASE 751G MARKING DIAGRAMS Features Figure 10) Pin Compatible to HC405X and MC1405XB Devices Power Supply Range (VCC − GND) = 2.0 to 6.0 V In Compliance With the Requirements of JEDEC Standard No. 7 A Chip Complexity: 154 FETs or 36 Equivalent Gates NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free and are RoHS Compliant SOIC−16 D SUFFIX CASE 751B 1 SOIC−16 1 SOIC−16 WIDE 16 HC48 5xA ALYWG G 1 TSSOP−16 x A WL, L YY, Y WW, W G or G 4851 ALYWG G QFN16* *V4851 marking used for NLV74HC4851AMN1TWG = 1 or 2 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet. This document contains information on some products that are still under development. ON Semiconductor reserves the right to change or discontinue these products without notice. © Semiconductor Components Industries, LLC, 2016 October, 2016 − Rev. 21 1 Publication Order Number: MC74HC4851A/D MC74HC4851A, MC74HC4852A 13 X0 14 X1 15 X2 ANALOG 12 MULTIPLEXER/ INPUTS/ X3 DEMULTIPLEXER OUTPUTS X4 1 5 X5 2 X6 4 X7 11 A CHANNEL 10 B SELECT 9 INPUTS C 6 ENABLE PIN 16 = VCC PIN 8 = GND FUNCTION TABLE − MC74HC4851A Control Inputs 3 COMMON X OUTPUT/ INPUT Enable C L L L L L L L L H L L L L H H H H X Select B A L L H H L L H H X ON Channels X0 X1 X2 X3 X4 X5 X6 X7 NONE L H L H L H L H X Figure 1. MC74HC4851A Logic Diagram Single−Pole, 8−Position Plus Common Off VCC X2 X1 X0 X3 A B C 16 15 14 13 12 11 10 9 1 2 3 4 5 X4 X6 X X7 X5 6 7 X4 VCC 1 16 X6 2 15 X2 X 3 14 X1 X7 4 X5 5 12 X3 ENABLE 6 11 A N C 7 8 GND Enable NC Figure 2. MC74HC4851A 16−Lead Pinout (Top View) 13 X0 GND 10 B 8 9 C GND Figure 3. MC74HC4851A QFN Pinout FUNCTION TABLE − MC74HC4852A Control Inputs Select Enable B A ON Channels L L L L H L L H H X L H L H X Y0 Y1 Y2 Y3 12 ANALOG INPUTS/OUTPUTS CHANNEL‐SELECT INPUTS X0 14 X1 15 X2 11 X3 Y0 Y1 Y2 Y3 A B ENABLE X SWITCH 13 X COMMON OUTPUTS/INPUTS 1 Y SWITCH 3 Y 4 10 9 NONE X = Don’t Care 5 2 X0 X1 X2 X3 PIN 16 = VCC PIN 8 = GND VCC X2 X1 X X0 X3 A B 16 15 14 13 12 11 10 9 6 7 8 GND 6 Figure 4. MC74HC4852A Logic Diagram Double−Pole, 4−Position Plus Common Off 1 2 3 4 5 Y0 Y2 Y Y3 Y1 Enable NC Figure 5. MC74HC4852A 16−Lead Pinout (Top View) www.onsemi.com 2 MC74HC4851A, MC74HC4852A ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ MAXIMUM RATINGS Symbol Value Unit VCC Positive DC Supply Voltage (Referenced to GND) –0.5 to +7.0 V Vin DC Input Voltage (Any Pin) (Referenced to GND) –0.5 to VCC + 0.5 V ±25 mA 500 450 mW –65 to +150 °C I Parameter DC Current, Into or Out of Any Pin PD Power Dissipation in Still Air, SOIC Package† TSSOP Package† Tstg Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 Seconds SOIC or TSSOP Package This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. °C 260 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. †Derating: SOIC Package: –7 mW/°C from 65° to 125°C TSSOP Package: −6.1 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC Positive DC Supply Voltage (Referenced to GND) 2.0 6.0 V Vin DC Input Voltage (Any Pin) (Referenced to GND) GND VCC V VIO* Static or Dynamic Voltage Across Switch 0.0 1.2 V TA Operating Temperature Range, All Package Types –55 +125 °C tr, tf Input Rise/Fall Time (Channel Select or Enable Inputs) 0 0 0 1000 500 400 ns VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. *For voltage drops across switch greater than 1.2 V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded. DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted Symbol Parameter Condition Guaranteed Limit VCC V −55 to 25°C ≤85°C ≤125°C Unit VIH Minimum High−Level Input Voltage, Channel−Select or Enable Inputs Ron = Per Spec 2.0 3.0 4.5 6.0 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 V VIL Maximum Low−Level Input Voltage, Channel−Select or Enable Inputs Ron = Per Spec 2.0 3.0 4.5 6.0 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 V Iin Maximum Input Leakage Current on Digital Pins (Enable/A/B/C) Vin = VCC or GND 6.0 ±0.1 ±1.0 ±1.0 mA ICC Maximum Quiescent Supply Current (per Package) Vin(digital) = VCC or GND Vin(analog) = GND 6.0 2 20 40 mA www.onsemi.com 3 MC74HC4851A, MC74HC4852A DC CHARACTERISTICS — Analog Section Guaranteed Limit Symbol Ron DRon Ioff Ion ≤85°C ≤125°C Unit Condition VCC −55 to 25°C Maximum “ON” Resistance Vin = VIL or VIH; VIS = VCC to GND (Note 1); IS ≤ 2.0 mA (Note 2) 2.0 3.0 4.5 6.0 1700 1100 550 400 1750 1200 650 500 1800 1300 750 600 W Delta “ON” Resistance Vin = VIL or VIH; VIS = VCC/2 (Note 1); IS ≤ 2.0 mA (Note 2) 2.0 3.0 4.5 6.0 300 160 80 60 400 200 100 80 500 240 120 100 W Maximum Off−Channel Leakage Current, Any One Channel Common Channel Vin = VCC or GND 6.0 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 Maximum On−Channel Leakage Channel−to−Channel Vin = VCC or GND 6.0 ±0.1 ±0.1 ±0.1 Parameter mA mA 1. VIS is the input voltage of an analog I/O pin. 2. IS is the currebnt flowing in or out of analog I/O pin. AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) VCC −55 to 25°C ≤85°C ≤125°C Unit Maximum Propagation Delay, Analog Input to Analog Output 2.0 3.0 4.5 6.0 160 80 40 30 180 90 45 35 200 100 50 40 ns Maximum Propagation Delay, Enable or Channel−Select to Analog Output 2.0 3.0 4.5 6.0 260 160 80 78 280 180 90 80 300 200 100 80 ns 10 35 40 10 35 40 10 35 40 pF Parameter Symbol tPHL, tPLH tPHL, tPHZ,PZH tPLH, tPLZ,PZL Cin Maximum Input Capacitance (All Switches Off) (All Switches Off) CPD Power Dissipation Capacitance Digital Pins Any Single Analog Pin Common Analog Pin Typical 5.0 20 pF INJECTION CURRENT COUPLING SPECIFICATIONS (VCC = 5V, TA = −55°C to +125°C) Symbol VDout Parameter Condition Maximum Shift of Output Voltage of Enabled Analog Channel Iin* ≤ 1 mA, RS ≤ 3,9 kW Iin* ≤ 10 mA, RS ≤ 3,9 kW Iin* ≤ 1 mA, RS ≤ 20 kW Iin* ≤ 10 mA, RS ≤ 20 kW * Iin = Total current injected into all disabled channels. www.onsemi.com 4 Typ Max Unit 0.1 1.0 0.5 5.0 1.0 5.0 2.0 20 mV MC74HC4851A, MC74HC4852A 1100 1000 R on , ON RESISTANCE (OHMS) 900 -55°C 800 +25°C 700 +125°C 600 500 400 300 200 R on , ON RESISTANCE (OHMS) 1100 1000 100 800 700 600 500 +25°C 300 +125°C 200 0.4 0.8 1.2 1.6 0 0.0 2.0 0.6 1.2 1.8 2.4 Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Figure 6. Typical On Resistance VCC = 2V Figure 7. Typical On Resistance VCC = 3V 660 440 600 400 540 360 480 420 360 -55°C 300 +25°C 240 +125°C 180 -55°C 280 160 120 40 2.7 3.6 0 0.0 4.5 +125°C 200 80 1.8 +25°C 240 60 0.9 1.2 2.4 3.6 4.8 Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Figure 8. Typical On Resistance VCC = 4.5V Figure 9. Typical On Resistance VCC = 6V www.onsemi.com 5 3.0 320 120 0 0.0 -55°C 400 100 R on , ON RESISTANCE (OHMS) R on , ON RESISTANCE (OHMS) 0 0.0 900 6.0 MC74HC4851A, MC74HC4852A External DC P.S. VCC = 5 V Vin2 / Iin2 meas. here. Current Source HP4155C Smu #2 Vin1 = 4.9 V (Smu3) Iin1 measure here Vm1 connected here. 4 16 13 3 X7 RS X0 X Vout Vm2 connected here. 6 NOTES: Rs = 3.9 KW or 20 KW. NOTES: Vm1 & Vm2 are internal NOTES: HP4155C Voltmeters. 8 GND or VSS Figure 10. Injection Current Coupling Specification www.onsemi.com 6 MC74HC4851A, MC74HC4852A 5V 6V 5V VCC VCC HC4051A Sensor Microcontroller Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8 (8x Identical Circuitry) Common Out A/D - Input Figure 11. Actual Technology Requires 32 passive components and one extra 6V regulator to suppress injection current into a standard HC4051 multiplexer 5V VCC VCC HC4851A Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8 Sensor (8x Identical Circuitry) Common Out Microcontroller A/D - Input Figure 12. MC74HC4851A Solution Solution by applying the HC4851A multiplexer www.onsemi.com 7 MC74HC4851A, MC74HC4852A PLOTTER VCC PROGRAMMABLE POWER SUPPLY MINI COMPUTER DC ANALYZER 16 VEE VCC OFF - + VCC VCC A COMMON O/I OFF NC DEVICE UNDER TEST ANALOG IN VIH COMMON OUT 6 8 GND Figure 14. Maximum Off Channel Leakage Current, Any One Channel, Test Set−Up Figure 13. On Resistance Test Set−Up VCC 16 VEE ANALOG I/O VCC A VEE 16 A OFF VCC OFF VIH VCC VCC ON COMMON O/I VCC N/C ANALOG I/O VIL 6 COMMON O/I OFF 6 8 8 Figure 15. Maximum Off Channel Leakage Current, Common Channel, Test Set−Up Figure 16. Maximum On Channel Leakage Current, Channel to Channel, Test Set−Up VCC VCC 16 VCC CHANNEL SELECT ON/OFF 50% OFF/ON GND tPLH ANALOG OUT COMMON O/I ANALOG I/O TEST POINT CL* tPHL 6 50% 8 CHANNEL SELECT *Includes all probe and jig capacitance Figure 17. Propagation Delays, Channel Select to Analog Out Figure 18. Propagation Delay, Test Set−Up Channel Select to Analog Out www.onsemi.com 8 MC74HC4851A, MC74HC4852A VCC 16 VCC ANALOG IN COMMON O/I ANALOG I/O ON 50% TEST POINT CL* GND tPLH tPHL ANALOG OUT 6 8 50% *Includes all probe and jig capacitance Figure 19. Propagation Delays, Analog In to Analog Out tf tr tPZL ANALOG OUT 2 GND tPLZ 16 HIGH IMPEDANCE 10% VCC VCC 1 TEST POINT ON/OFF CL* VOL tPHZ ENABLE VOH 90% 10kW ANALOG I/O 2 50% tPZH POSITION 1 WHEN TESTING tPHZ AND tPZH POSITION 2 WHEN TESTING tPLZ AND tPZL 1 VCC 90% 50% 10% ENABLE ANALOG OUT Figure 20. Propagation Delay, Test Set−Up Analog In to Analog Out 50% 6 8 HIGH IMPEDANCE Figure 21. Propagation Delays, Enable to Analog Out Figure 22. Propagation Delay, Test Set−Up Enable to Analog Out VCC VCC A 16 COMMON O/I NC ANALOG I/O VCC 6 8 11 CHANNEL SELECT Figure 23. Power Dissipation Capacitance, Test Set−Up www.onsemi.com 9 MC74HC4851A, MC74HC4852A Gate = VCC (Disabled) Disabled Analog Mux Input Vin > VCC + 0.7V P+ Common Analog Output Vout > VCC P+ + + + N - Substrate (on VCC potential) Figure 24. Diagram of Bipolar Coupling Mechanism Appears if Vin exceeds VCC, driving injection current into the substrate A B C ENABLE 11 10 INJECTION CURRENT CONTROL 13 INJECTION CURRENT CONTROL 14 INJECTION CURRENT CONTROL 15 INJECTION CURRENT CONTROL 12 INJECTION CURRENT CONTROL 1 INJECTION CURRENT CONTROL 5 INJECTION CURRENT CONTROL 2 INJECTION CURRENT CONTROL 4 INJECTION CURRENT CONTROL 3 X0 X1 X2 X3 9 6 Figure 25. Function Diagram, HC4851A www.onsemi.com 10 X4 X5 X6 X7 X MC74HC4851A, MC74HC4852A A B ENABLE 10 9 INJECTION CURRENT CONTROL 13 INJECTION CURRENT CONTROL 14 INJECTION CURRENT CONTROL 15 13 INJECTION CURRENT CONTROL 12 INJECTION CURRENT CONTROL 3 INJECTION CURRENT CONTROL 1 INJECTION CURRENT CONTROL 5 INJECTION CURRENT CONTROL 2 INJECTION CURRENT CONTROL 4 INJECTION CURRENT CONTROL 3 X0 X1 X2 X3 X Y0 Y1 6 Figure 26. Function Diagram, HC4852A www.onsemi.com 11 Y2 Y3 Y MC74HC4851A, MC74HC4852A ORDERING INFORMATION Device Package MC74HC4851ADG MC74HC4851ADR2G 48 Units / Rail SOIC−16 (Pb−Free) NLVHC4851ADR2G* MC74HC4851ADTR2G NLVHC4851ADTR2G* MC74HC4851ADWR2G NLVHC4851ADWR2G* TSSOP−16 (Pb−Free) 2500 Units / Tape & Reel SOIC−16 WIDE (Pb−Free) 1000 Units / Tape & Reel 3000 Units / Tape & Reel QFN16 (Pb−Free) MC74HC4852ADG MC74HC4852ADR2G NLVHC4852ADTR2G* 3000 Units / Tape & Reel 48 Units / Rail SOIC−16 (Pb−Free) NLV74HC4852ADR2G* MC74HC4852ADTR2G 2500 Units / Tape & Reel 2500 Units / Tape & Reel NLV74HC4851AMNTWG*# NLV74HC4851AMN1TWG*# (In Development) Shipping† 2500 Units / Tape & Reel 2500 Units / Tape & Reel TSSOP−16 (Pb−Free) 2500 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. #MN suffix is with pull−back lead, MN1 is without pull−back lead. Refer to ’Detail A’ of case outline on page 16. www.onsemi.com 12 MC74HC4851A, MC74HC4852A PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX CASE 948F ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S S ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ K K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. N 0.25 (0.010) 8 1 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE H D DETAIL E G DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 13 INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74HC4851A, MC74HC4852A PACKAGE DIMENSIONS SOIC−16 WB DW SUFFIX CASE 751G−03 ISSUE D A D 9 1 8 16X M T A h X 45 _ MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0_ 7_ S B S L A 0.25 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. B B 14X e A1 H E 0.25 8X M B M 16 q C T SEATING PLANE SOLDERING FOOTPRINT* 16X 0.58 11.00 1 16X 1.27 PITCH 1.62 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 14 MC74HC4851A, MC74HC4852A PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE K −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 B M S G R K F X 45 _ C −T− SEATING PLANE J M D DIM A B C D F G J K M P R 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT* 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 15 MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74HC4851A, MC74HC4852A PACKAGE DIMENSIONS QFN16, 2.5x3.5, 0.5P CASE 485AW ISSUE O D PIN ONE REFERENCE A B ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 2X L1 DETAIL A E DIM A A1 A3 b D D2 E E2 e K L L1 ÇÇÇ ÉÉÉ TOP VIEW MOLD CMPD DETAIL B ALTERNATE CONSTRUCTIONS A DETAIL B (A3) 0.10 C 16X ALTERNATE TERMINAL CONSTRUCTIONS EXPOSED Cu 0.15 C L L 0.15 C 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.50 BSC 0.85 1.15 3.50 BSC 1.85 2.15 0.50 BSC 0.20 --0.35 0.45 --0.15 A1 0.08 C NOTE 4 C SIDE VIEW SEATING PLANE SOLDERING FOOTPRINT* 3.80 0.15 C A B D2 16X L 8 2.10 K 0.50 PITCH 0.15 C A B 10 DETAIL A 2.80 1.10 E2 1 16X 2 15 1 b 0.10 C A B 0.05 C 16X 0.60 NOTE 3 16X PACKAGE OUTLINE 0.30 DIMENSIONS: MILLIMETERS e *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. e/2 BOTTOM VIEW ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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