ON CM1230-08CP 2, 4, and 8-channel low-capacitance esd protection array Datasheet

2, 4, and 8-Channel Low-Capacitance
ESD Protection Array
CM1230
Features
Product Description
•
•
The CM1230 is a family of 2, 4 and 8 channel, very
low capacitance ESD protection diode arrays in a
CSP form factor. It is ideal for protecting systems
with high data and clock rates or for circuits that
need low capacitive loading. Each channel consists
of a pair of ESD diodes that act as clamp diodes to
steer ESD current pulses to either the positive or
negative supply rail. A zener diode is integrated
between the positive and negative supply rails. The
VCC rail is protected from ESD strikes and eliminates
the need for a bypass capacitor to absorb positive
ESD strikes to ground. Each channel can safely
dissipate ESD strikes of ±8kV, meeting the Level 4
requirement of the IEC61000-4-2 international
standard as well as ±15kV air discharges per the
IEC61000-4-2 specification. Using the MIL-STD883 (Method 3015) specification for Human Body
Model (HBM) ESD, the pins are protected for
contact discharges at greater than ±15kV.
•
•
•
•
•
•
•
•
•
Two, four, and eight channels of ESD protection
Provides ESD protection to IEC61000-4-2
Level 4
•
±8kV contact discharge
•
±15kV air discharge
Low loading capacitance of 0.8pF typical
Minimal capacitance change with temperature
and voltage
Channel I/O to GND capacitance difference of
0.02pF typical is ideal for differential signals
Channel I/O to I/O capacitance 0.15pF typical
Zener diode protects supply rail and eliminates
the need for external by-pass capacitors
Each I/O pin can withstand over 1000 ESD
strikes*
Available in 4, 6 and 10 bump Chip Scale
Packages (CSP)
OptiGuard™ coated for improved reliability at
assembly
RoHS-compliant, lead-free version finishing
Applications
•
•
•
•
•
LCD and camera data lines in wireless
handsets that use high-speed serial interfaces.
I/O port protection for mobile handsets,
notebook computers, DSCs, MP3 players,
PDAs, etc. including USB, 1394 and serial ATA
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
©2010 SCILLC. All rights reserved.
May 2010 – Rev. 2
This device is well-suited for next generation
wireless handsets that implement high-speed serial
interface solutions for the LCD display and camera
interfaces. In these designs, a tolerance above
1.5pF cannot be tolerated when high data rates are
transferred between the baseband choppiest and
the LCD driver/controller Is. Higher capacitive
loading normally causes the rise and fall times to
slow which hampers the functionality of circuit and
operation of the wireless handset. The CM1230
incorporates OptiGuard™ which results in improved
reliability at assembly. The CM1230 is available in a
space-saving, low profile Chip Scale Package with
RoHS-compliant, lead-free finishing.
Publication Order Number:
CM1230/D
CM1230
*Standard test condition is IEC61000-4-2 level 4 test circuit with each (A
OUT
/BOUT) pin subjected to ±12kV contact discharge for 1000 pulses. Discharges are timed at 1 second intervals and all 1000 strikes are completed in one
continuous test run.
Rev.3 | Page 2 of 16 | www.onsemi.com
CM1230
Ordering Information
PART NUMBERING INFORMATION
# of Channels
Bumps
Package
Ordering Part Number1
Part Marking
2
4
CSP-4
CM1230-02CP
L
2
4
CSP-4
CM1230-J2CP
L
4
6
CSP-6
CM1230-04CP
L30
8
10
CSP-10
CM1230-08CP
L308
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.
Pin Descriptions
2-CHANNEL, 4-BUMP CSP
8-CHANNEL, 10-BUMP CSP
PI
N
NAME
TYPE
DESCRIPTION
PI
N
NAME
TYPE
A1
VN
GND
Negative voltage supply rail
A1
CH1
I/O
ESD Channel
B1
CH2
I/O
ESD Channel
B1
CH2
I/O
ESD Channel
A2
CH1
I/O
ESD Channel
A2
CH3
I/O
ESD Channel
B2
VP
PWR
Positive voltage supply rail
B2
CH4
I/O
ESD Channel
A3
VP
PWR
Positive voltage supply rail
B3
VN
GND
Negative voltage supply rail
4-CHANNEL, 6-BUMP CSP
DESCRIPTION
PI
N
NAME
TYPE
A1
CH1
I/O
ESD Channel
A4
CH5
I/O
ESD Channel
B1
CH2
I/O
ESD Channel
B4
CH6
I/O
ESD Channel
A2
VP
PWR
Positive voltage supply rail
A5
CH7
I/O
ESD Channel
B2
VN
GND
Negative voltage supply rail
B5
CH8
I/O
ESD Channel
A3
CH3
I/O
ESD Channel
B3
CH4
I/O
ESD Channel
DESCRIPTION
Rev. 3 | Page 3 of 16 | www.onsemi.com
CM1230
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
6.0
V
Operating Temperature Range
-40 to +85
°C
Storage Temperature Range
-65 to +150
°C
(VN - 0.5) to (VP + 0.5)
V
Operating Supply Voltage (VP - VN)
DC Voltage at any channel input
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Rev.3 | Page 4 of 16 | www.onsemi.com
RATING
UNITS
-40 to +85
°C
CM1230
ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE 1)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
3.3
5.5
V
8.0
μA
0.80
0.80
0.95
0.95
V
V
VP
Operating Supply Voltage (VP-VN)
IP
Operating Supply Current
(VP-VN)=3.3V
VF
Diode Forward Voltage
Top Diode
Bottom Diode
IF = 8mA; TA=25°C
ILEAK
Channel Leakage Current
TA=25°C; VP=5V, VN=0V,
VIN = 0V to 5V
±0.1
±1.0
μA
CIN
Channel Input Capacitance
At 1 MHz, VP=3.3V, VN=0V,
VIN=1.65V
0.8
1.20
pF
Channel Input Capacitance Matching
At 1 MHz, VP=3.3V, VN=0V,
VIN=1.65V
0.02
pF
CMUTUAL
Mutual Capacitance between signal
pin and adjacent signal pin
At 1 MHz, VP=3.3V, VN=0V,
VIN=1.65V
0.15
pF
VESD
In-system ESD Protection
Peak Discharge Voltage at any
channel input, in system
a) Contact discharge per
IEC 61000-4-2 standard
b) Human Body Model, MILSTD-883, Method 3015
Notes 3 and 4; TA=25°C
±8
kV
Notes 2 and 4; TA=25°C
±15
kV
ΔC
0.60
0.60
IN
VCL
RDYN
Channel Clamp Voltage
Positive Transients
Negative Transients
TA=25°C, IPP = 1A, tP = 8/20μS;
Note 4
Dynamic Resistance
Positive Transients
Negative Transients
IPP = 1A, tP = 8/20μS
Any I/O pin to Ground; Note 4
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
+9.8
-1.8
V
V
0.76
0.56
Ω
Ω
All parameters specified at TA = -40°C to +85°C unless otherwise noted.
Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded.
Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded.
These measurements performed with no external capacitor on VP.
Measured under pulsed conditions, pulse width = 0.7ms, maximum current = 1.5A.
Rev. 3 | Page 5 of 16 | www.onsemi.com
CM1230
Performance Information
Input Channel Capacitance Performance Curves
Rev.3 | Page 6 of 16 | www.onsemi.com
CM1230
Performance Information (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Insertion Loss VS. Frequency (0V DC Bias, VP=3.3V)
Insertion Loss VS. Frequency (2.5V DC Bias, VP=3.3V)
Rev. 3 | Page 7 of 16 | www.onsemi.com
CM1230
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev.3 | Page 8 of 16 | www.onsemi.com
260°C
CM1230
Mechanical Details
CSP-4 Mechanical Specifications (CM1230-02CP)
The CM1230-02CP is supplied in a 4 bump Chip Scale Package (CSP). Dimensions are shown below. For
complete information on the CSP, see the California Micro Devices CSP Package Information document.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
4
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
0.915 0.960 1.005 0.0360 0.0378 0.0396
A2
0.915 0.960 1.005 0.0360 0.0378 0.0396
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.495 0.500 0.505 0.0195 0.0197 0.0199
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.180 0.230 0.280 0.0071 0.0091 0.0110
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for
CM1230-02CP Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 3 | Page 9 of 16 | www.onsemi.com
CM1230
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1230-02CP*
0.96 x 0.96 x 0.644
1.14 x 1.00 x 0.70
8mm
178mm (7")
3500
4mm
4mm
Figure 3. Tape and Reel Mechanical Data*
* CM1230-02CP and CM1230-J2CP are the same mechanical package. The only difference is the Pin 1
orientation (red dot) on the tape and reel.
Rev.3 | Page 10 of 16 | www.onsemi.com
CM1230
Mechanical Details (cont’d)
CSP-4 Mechanical Specifications (CM1230-J2CP)
The CM1230-J2CP is supplied in a 4 bump Chip Scale Package (CSP). Dimensions are shown below. For
complete information on the CSP, see the California Micro Devices CSP Package Information document.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
4
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
0.915 0.960 1.005 0.0360 0.0378 0.0396
A2
0.915 0.960 1.005 0.0360 0.0378 0.0396
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.495 0.500 0.505 0.0195 0.0197 0.0199
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.180 0.230 0.280 0.0071 0.0091 0.0110
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for
CM1230-J2CP Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 3 | Page 11 of 16 | www.onsemi.com
CM1230
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1230-J2CP*
0.96 x 0.96 x 0.644
1.14 x 1.00 x 0.70
8mm
178mm (7")
3500
4mm
4mm
Figure 4. Tape and Reel Mechanical Data*
*CM1230-02CP and CM1230-J2CP are the same mechanical package. Only difference is the Pin 1 orientation
(red dot) on the tape and reel.
Rev.3 | Page 12 of 16 | www.onsemi.com
CM1230
Mechanical Details (cont’d)
CSP-6 Mechanical Specifications
The CM1230-04CP is supplied in a 6 bump Chip Scale Package (CSP). Dimensions are shown below. For
complete information on the CSP, see the California Micro Devices CSP Package Information document.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
6
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
0.915 0.960 1.005 0.0360 0.0378 0.0396
A2
1.415 1.460 1.505 0.0557 0.0575 0.0593
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.495 0.500 0.505 0.0195 0.0197 0.0199
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.180 0.230 0.280 0.0071 0.0091 0.0110
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for
CM1230-04CP Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 3 | Page 13 of 16 | www.onsemi.com
CM1230
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1230-04CP
1.46 x 0.96 x 0.644
1.72 x 1.17 x 0.73
8mm
178mm (7")
3500
4mm
4mm
Figure 5. Tape and Reel Mechanical Data
Rev.3 | Page 14 of 16 | www.onsemi.com
CM1230
Mechanical Details (cont’d)
CSP-10 Mechanical Specifications
The CM1230-08CP is supplied in a 10 bump Chip Scale Package (CSP). Dimensions are shown below. For
complete information on the CSP, see the California Micro Devices CSP Package Information document.
Controlling dimension: millimeters
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
10
Millimeters
Inches
Dim
Min
Nom
Max
A1
0.915
0.960
1.005
0.0360 0.0378 0.0396
A2
2.415
2.460
2.505
0.0951 0.0969 0.0986
B1
0.495
0.500
0.505
0.0195 0.0197 0.0199
B2
0.495
0.500
0.505
0.0195 0.0197 0.0199
C1
0.180
0.230
0.280
0.0071 0.0091 0.0110
C2
0.180
0.230
0.280
0.0071 0.0091 0.0110
D1
0.575
0.644
0.714
0.0226 0.0254 0.0281
D2
0.368
0.419
0.470
0.0145 0.0165 0.0185
# per tape and
reel
Min
Nom
3500 pieces
Max
Package Dimensions for
CM1230-08CP Chip Scale Package
Rev. 3 | Page 15 of 16 | www.onsemi.com
CM1230
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1230-08CP
2.46 x 0.96 x 0.644
2.62 x 1.12 x 0.76
8mm
178mm (7")
3500
4mm
4mm
Figure 6. Tape and Reel Mechanical Data
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
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Rev.3 | Page 16 of 16 | www.onsemi.com
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