2, 4, and 8-Channel Low-Capacitance ESD Protection Array CM1230 Features Product Description • • The CM1230 is a family of 2, 4 and 8 channel, very low capacitance ESD protection diode arrays in a CSP form factor. It is ideal for protecting systems with high data and clock rates or for circuits that need low capacitive loading. Each channel consists of a pair of ESD diodes that act as clamp diodes to steer ESD current pulses to either the positive or negative supply rail. A zener diode is integrated between the positive and negative supply rails. The VCC rail is protected from ESD strikes and eliminates the need for a bypass capacitor to absorb positive ESD strikes to ground. Each channel can safely dissipate ESD strikes of ±8kV, meeting the Level 4 requirement of the IEC61000-4-2 international standard as well as ±15kV air discharges per the IEC61000-4-2 specification. Using the MIL-STD883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±15kV. • • • • • • • • • Two, four, and eight channels of ESD protection Provides ESD protection to IEC61000-4-2 Level 4 • ±8kV contact discharge • ±15kV air discharge Low loading capacitance of 0.8pF typical Minimal capacitance change with temperature and voltage Channel I/O to GND capacitance difference of 0.02pF typical is ideal for differential signals Channel I/O to I/O capacitance 0.15pF typical Zener diode protects supply rail and eliminates the need for external by-pass capacitors Each I/O pin can withstand over 1000 ESD strikes* Available in 4, 6 and 10 bump Chip Scale Packages (CSP) OptiGuard™ coated for improved reliability at assembly RoHS-compliant, lead-free version finishing Applications • • • • • LCD and camera data lines in wireless handsets that use high-speed serial interfaces. I/O port protection for mobile handsets, notebook computers, DSCs, MP3 players, PDAs, etc. including USB, 1394 and serial ATA Wireless handsets Handheld PCs/PDAs LCD and camera modules ©2010 SCILLC. All rights reserved. May 2010 – Rev. 2 This device is well-suited for next generation wireless handsets that implement high-speed serial interface solutions for the LCD display and camera interfaces. In these designs, a tolerance above 1.5pF cannot be tolerated when high data rates are transferred between the baseband choppiest and the LCD driver/controller Is. Higher capacitive loading normally causes the rise and fall times to slow which hampers the functionality of circuit and operation of the wireless handset. The CM1230 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1230 is available in a space-saving, low profile Chip Scale Package with RoHS-compliant, lead-free finishing. Publication Order Number: CM1230/D CM1230 *Standard test condition is IEC61000-4-2 level 4 test circuit with each (A OUT /BOUT) pin subjected to ±12kV contact discharge for 1000 pulses. Discharges are timed at 1 second intervals and all 1000 strikes are completed in one continuous test run. Rev.3 | Page 2 of 16 | www.onsemi.com CM1230 Ordering Information PART NUMBERING INFORMATION # of Channels Bumps Package Ordering Part Number1 Part Marking 2 4 CSP-4 CM1230-02CP L 2 4 CSP-4 CM1230-J2CP L 4 6 CSP-6 CM1230-04CP L30 8 10 CSP-10 CM1230-08CP L308 Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Pin Descriptions 2-CHANNEL, 4-BUMP CSP 8-CHANNEL, 10-BUMP CSP PI N NAME TYPE DESCRIPTION PI N NAME TYPE A1 VN GND Negative voltage supply rail A1 CH1 I/O ESD Channel B1 CH2 I/O ESD Channel B1 CH2 I/O ESD Channel A2 CH1 I/O ESD Channel A2 CH3 I/O ESD Channel B2 VP PWR Positive voltage supply rail B2 CH4 I/O ESD Channel A3 VP PWR Positive voltage supply rail B3 VN GND Negative voltage supply rail 4-CHANNEL, 6-BUMP CSP DESCRIPTION PI N NAME TYPE A1 CH1 I/O ESD Channel A4 CH5 I/O ESD Channel B1 CH2 I/O ESD Channel B4 CH6 I/O ESD Channel A2 VP PWR Positive voltage supply rail A5 CH7 I/O ESD Channel B2 VN GND Negative voltage supply rail B5 CH8 I/O ESD Channel A3 CH3 I/O ESD Channel B3 CH4 I/O ESD Channel DESCRIPTION Rev. 3 | Page 3 of 16 | www.onsemi.com CM1230 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS 6.0 V Operating Temperature Range -40 to +85 °C Storage Temperature Range -65 to +150 °C (VN - 0.5) to (VP + 0.5) V Operating Supply Voltage (VP - VN) DC Voltage at any channel input STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev.3 | Page 4 of 16 | www.onsemi.com RATING UNITS -40 to +85 °C CM1230 ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS 3.3 5.5 V 8.0 μA 0.80 0.80 0.95 0.95 V V VP Operating Supply Voltage (VP-VN) IP Operating Supply Current (VP-VN)=3.3V VF Diode Forward Voltage Top Diode Bottom Diode IF = 8mA; TA=25°C ILEAK Channel Leakage Current TA=25°C; VP=5V, VN=0V, VIN = 0V to 5V ±0.1 ±1.0 μA CIN Channel Input Capacitance At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V 0.8 1.20 pF Channel Input Capacitance Matching At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V 0.02 pF CMUTUAL Mutual Capacitance between signal pin and adjacent signal pin At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V 0.15 pF VESD In-system ESD Protection Peak Discharge Voltage at any channel input, in system a) Contact discharge per IEC 61000-4-2 standard b) Human Body Model, MILSTD-883, Method 3015 Notes 3 and 4; TA=25°C ±8 kV Notes 2 and 4; TA=25°C ±15 kV ΔC 0.60 0.60 IN VCL RDYN Channel Clamp Voltage Positive Transients Negative Transients TA=25°C, IPP = 1A, tP = 8/20μS; Note 4 Dynamic Resistance Positive Transients Negative Transients IPP = 1A, tP = 8/20μS Any I/O pin to Ground; Note 4 Note 1: Note 2: Note 3: Note 4: Note 5: +9.8 -1.8 V V 0.76 0.56 Ω Ω All parameters specified at TA = -40°C to +85°C unless otherwise noted. Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded. Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. These measurements performed with no external capacitor on VP. Measured under pulsed conditions, pulse width = 0.7ms, maximum current = 1.5A. Rev. 3 | Page 5 of 16 | www.onsemi.com CM1230 Performance Information Input Channel Capacitance Performance Curves Rev.3 | Page 6 of 16 | www.onsemi.com CM1230 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Insertion Loss VS. Frequency (0V DC Bias, VP=3.3V) Insertion Loss VS. Frequency (2.5V DC Bias, VP=3.3V) Rev. 3 | Page 7 of 16 | www.onsemi.com CM1230 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev.3 | Page 8 of 16 | www.onsemi.com 260°C CM1230 Mechanical Details CSP-4 Mechanical Specifications (CM1230-02CP) The CM1230-02CP is supplied in a 4 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 4 Millimeters Inches Dim Min Nom Max Min Nom Max A1 0.915 0.960 1.005 0.0360 0.0378 0.0396 A2 0.915 0.960 1.005 0.0360 0.0378 0.0396 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1230-02CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 3 | Page 9 of 16 | www.onsemi.com CM1230 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1230-02CP* 0.96 x 0.96 x 0.644 1.14 x 1.00 x 0.70 8mm 178mm (7") 3500 4mm 4mm Figure 3. Tape and Reel Mechanical Data* * CM1230-02CP and CM1230-J2CP are the same mechanical package. The only difference is the Pin 1 orientation (red dot) on the tape and reel. Rev.3 | Page 10 of 16 | www.onsemi.com CM1230 Mechanical Details (cont’d) CSP-4 Mechanical Specifications (CM1230-J2CP) The CM1230-J2CP is supplied in a 4 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 4 Millimeters Inches Dim Min Nom Max Min Nom Max A1 0.915 0.960 1.005 0.0360 0.0378 0.0396 A2 0.915 0.960 1.005 0.0360 0.0378 0.0396 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1230-J2CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 3 | Page 11 of 16 | www.onsemi.com CM1230 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1230-J2CP* 0.96 x 0.96 x 0.644 1.14 x 1.00 x 0.70 8mm 178mm (7") 3500 4mm 4mm Figure 4. Tape and Reel Mechanical Data* *CM1230-02CP and CM1230-J2CP are the same mechanical package. Only difference is the Pin 1 orientation (red dot) on the tape and reel. Rev.3 | Page 12 of 16 | www.onsemi.com CM1230 Mechanical Details (cont’d) CSP-6 Mechanical Specifications The CM1230-04CP is supplied in a 6 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 6 Millimeters Inches Dim Min Nom Max Min Nom Max A1 0.915 0.960 1.005 0.0360 0.0378 0.0396 A2 1.415 1.460 1.505 0.0557 0.0575 0.0593 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1230-04CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 3 | Page 13 of 16 | www.onsemi.com CM1230 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1230-04CP 1.46 x 0.96 x 0.644 1.72 x 1.17 x 0.73 8mm 178mm (7") 3500 4mm 4mm Figure 5. Tape and Reel Mechanical Data Rev.3 | Page 14 of 16 | www.onsemi.com CM1230 Mechanical Details (cont’d) CSP-10 Mechanical Specifications The CM1230-08CP is supplied in a 10 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. Controlling dimension: millimeters PACKAGE DIMENSIONS Package Custom CSP Bumps 10 Millimeters Inches Dim Min Nom Max A1 0.915 0.960 1.005 0.0360 0.0378 0.0396 A2 2.415 2.460 2.505 0.0951 0.0969 0.0986 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Min Nom 3500 pieces Max Package Dimensions for CM1230-08CP Chip Scale Package Rev. 3 | Page 15 of 16 | www.onsemi.com CM1230 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1230-08CP 2.46 x 0.96 x 0.644 2.62 x 1.12 x 0.76 8mm 178mm (7") 3500 4mm 4mm Figure 6. Tape and Reel Mechanical Data ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Rev.3 | Page 16 of 16 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative