Adam HMCAB184G High density card edge .050 [1.27] vesa micro channel architecture (mca) Datasheet

HIGH DENSITY CARD EDGE
.050" [1.27] VESA MICRO CHANNEL
ARCHITECTURE (MCA)
Adam Technologies, Inc.
HMCA SERIES
INTRODUCTION:
Adam Tech HMCA Series Card Edge Connectors include Standard
and Express versions designed for PCB’s in Peripheral Component
Interconnect (PCI) applications. Each is manufactured in a four row,
high density package which is completely compatible to industry
standards and has specially engineered contacts which provide a
very short electrical path between boards. Adam Tech card edge
connectors are designed for high performance with solid board pegs
and precision located, selectively gold plated contacts which are
ideal in high speed, increased bandwidth applications
FEATURES:
PCI and PCI Express Versions
High density compact designs
Industry standard PCI compatible
Special contact design reduces electrical path
Selectively plated contacts
Open bottom for after solder cleaning
MATING PC BOARDS:
All .050" centerline printed circuit board pads with a thickness of
.062" to .072"
SPECIFICATIONS:
Material:
Standard insulator: PPS, 30% glass reinforced, rated UL94V-0
Optional Hi-Temp insulator: Nylon 6T, rated UL94V-0
Insulator Color: Dark Brown (White 120 pos.)
Contacts: Phosphor Bronze
Contact Plating:
Gold Flash (30 µin Optional) over Nickel underplate on contact area,
tin over copper underplate on tails.
Electrical:
Operating voltage: 125V AC max.
Current rating: 1 Amp max.
Contact resistance: 30 mΩ max. initial
Insulation resistance: 1000 MΩ min.
Dielectric withstanding voltage: 500V AC for 1 minute
Mechanical:
Insertion force: 7 oz max.
Withdrawal force: 0.9 oz min
Temperature Rating:
Operating temperature: -55°C to +105°C
Soldering process temperature:
Standard insulator: 235°C
Hi-Temp insulator: 260°C
PACKAGING:
Anti-ESD plastic trays
ORDERING INFORMATION
HMCA
A
112
G
PLATING
G = Selectively
gold plated
contacts
SERIES INDICATOR
HMCA =
VESA Micro-channel
Card Edge connector
PEGS =
A = Plastic pegs
B = Metal boardlocks
POSITIONS
112, 120, 132, 182, 184, 194
SAFETY AGENCY APPROVALS:
UL Recognized File No. E224053
CSA Certified File No. LR1578596
Pb
UL
®
172
®
®
RoHS
V
E
DCOMPLIANT
2002 / 95 / EC
HI-TEMP
INSULATOR
AVA I L A B L E
OPTIONS
Add designator(s) to end of part number
30 = 30 µin gold plating in contact area
HT = Hi-Temp insulator for Hi-Temp soldering
processes up to 260°C
909 Rahway Avenue • Union, RoHS
New Jersey 07083 • T: 908-687-5000 • F: 908-687-5710 • WWW.ADAM-TECH.COM
COMPLIANT
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