Diodes DMP2200UDW Dmp2160ufdbq-7 Datasheet

DMP2200UDW
Dual P-CHANNEL ENHANCEMENT MODE MOSFET
Summary
V(BR)DSS
RDS(on) max
260mΩ @VGS = -4.5V
500mΩ @VGS = -2.5V
1000mΩ @VGS = -1.8V
-20V
ADVANCE INFORMATION
Features
•
•
•
•
•
•
•
ID max
-0.9 A
Description
This MOSFET is designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it
ideal for high-efficiency power management applications.
Mechanical Data
•
•
Applications
•
•
Low RDS(ON) – Minimizes Conduction Losses
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
ESD Protected Gate
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
•
•
•
Battery Disconnect Switch
Load Switch for Power Management Functions
•
Case: SOT363
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals Connections: See Diagram
Terminals: Finish - Matte Tin Annealed over Alloy 42 Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.006 grams (Approximate)
D1
SOT363
Gate Protection
Diode
Top View
D2
G1
S1
S2
S2
G2
D1
G2
G1
ESD PROTECTED
D2
Gate Protection
Diode
S1
Top View
Pin out
Q2 P-CHANNEAL
Q1 P-CHANNEAL
Ordering Information (Note 4)
Part Number
DMP2200UDW-7
DMP2200UDW-13
Notes:
Case
SOT363
SOT363
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
SOT363
P22 = Marking Code
YM = Date Code Marking
Y or Y= Year (ex: B = 2014)
M = Month (ex: 9 = September)
Date Code Key
Year
Code
Month
Code
2014
B
Jan
1
2015
C
Feb
2
DMP2200UDW
Document number: DS37689 Rev. 1 - 2
Mar
3
2016
D
Apr
4
May
5
2017
E
Jun
6
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2018
F
Jul
7
Aug
8
2019
G
Sep
9
Oct
O
2020
H
Nov
N
Dec
D
February 2015
© Diodes Incorporated
DMP2200UDW
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
TA = +25°C
TA = +85°C
ADVANCE INFORMATION
Continuous Drain Current (Note 6)
Value
-20
±8
-0.9
-0.7
ID
Units
V
V
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Total Power Dissipation (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Ambient (Note 6)
Value
0.45
0.6
PD
Steady
State
Steady
State
Units
W
W
275
RθJA
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
RθJC
TJ, TSTG
208
°C/W
72
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-Off Delay Time
Turn-On Rise Time
Turn-Off Fall Time
Notes:
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-20






-1
±10
V
µA
µA
VGS = 0V, ID = 250µA
VDS = -16V, VGS = 0V
VGS = ±8V, VDS = 0V
VGS(th)
-0.4

-1.2
V
RDS (ON)

180
240
320
260
500
1,000
mΩ
VSD

-0.8
-1.2
V
VDS = VGS, ID = -250µA
VGS = -4.5V, ID = -0.88A
VGS = -2.5V, ID = -0.71A
VGS = -1.8V, ID = -0.20A
VGS = 0V, IS = -0.48A
Ciss
Coss
Crss
Rg
Qg
Qgs
Qgd
tD(ON)











184
26.4
18.5
221
2.1
0.4
0.5











pF
pF
pF
Ω
nC
nC
nC
tD(OFF)
tr
tf
9.8
24.4
88
45
ns
ns
ns
ns
Test Condition
VDS = -10V, VGS = 0V
f = 1.0MHz
VDS = VGS = 0V,f = 1.0MHz
VGS = -4.5V, VDS = -10V,
ID = -1.7A
VDD = -10V, ID = -1.5A,
VGS = -4.5V, RGEN = 1Ω
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMP2200UDW
Document number: DS37689 Rev. 1 - 2
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February 2015
© Diodes Incorporated
DMP2200UDW
5.0
5
T A = -55°C
VDS = -5.0V
T A = 25°C
VGS = -8.0V
VGS = -3.0V
3.0
VGS = -2.0V
2.0
VGS = -1.8V
VGS = -1.5V
ID, DRAIN CURRENT (A)
ID , DRAIN CURRENT (A)
4
VGS = -4.5V
1.0
T A = 85°C
T A = 150°C
3
2
1
VGS = -1.2V
0.0
0
4
1
2
3
VDS , DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristic
RD S(ON ), DRAIN-SOURCE ON-RESISTANCE ( Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ( Ω)
0.28
0.26
VGS = -2.5V
0.24
0.22
0.2
VGS = -4.5V
0.18
0.16
0
1
2
3
4
I D, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0
5
0.3
3.5
0.5
1.5
2
2.5
3
1
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
I D = -0.88A
0.55
0.5
0.45
0.4
0.35
0.3
0.25
0.2
I D = -0.71A
0.15
5
0.1
0
1
2
3
4
5
6
7
V GS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Transfer Characteristics
8
1.5
0.32
VGS = -4.5V
T A = 150°C
R DS(ON), DRA IN-S OURCE
O N-RESI STA NCE (NORMALIZED)
0.28
T A = 125°C
0.26
0.24
T A = 85°C
0.22
0.2
TA = 25°C
0.18
0.16
0.14
T A = -55°C
0
1
2
3
4
ID , DRAIN CURRENT (A)
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
DMP2200UDW
Document number: DS37689 Rev. 1 - 2
VGS = -2.5V
1.4
0.3
0.12
0
0.6
0.34
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ( Ω)
ADVANCE INFORMATION
4.0
TA = 125°C
5
I D = -0.71A
1.3
VGS = -4.5V
1.2
ID = -0.88A
1.1
1
0.9
0.8
0.7
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
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DMP2200UDW
0.34
VGS(th), GATE THRESHOLD VOLTAGE (V)
R DS(ON), DRAI N-SO URCE O N-RES ISTANCE (Ω )
1
VGS = -2.5V
0.32
I D = -0.71A
0.3
0.28
0.26
0.24
0.22
VGS = -4.5V
0.2
ID = -0.88A
0.18
0.16
0.14
0.12
-50
0.9
0.8
ID = -1mA
0.7
I D = -250µA
0.6
0.5
0.4
0.3
-50
-25
25
50
75 100 125
0
TJ, JUNCTION TEMPERATURE ( °C)
Figure 8 Gate Threshold Variation vs.
Junction Temperature
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE ( °C)
Figure 7 On-Resistance Variation with Temperature
-25
CT , JUNCTION CAPACITANCE (pF)
TA = 150°C
4
I S, SOURCE CURRENT (A)
150
1000
5
3
T A = 125°C
TA = 25°C
2
T A = 85°C
T A = 55°C
1
C iss
100
Coss
f = 1MHz
0
Crss
10
0
0.3
0.6
0.9
1.2
1.5
0
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
5
10
15
VDS , DRAIN-SOURCE VOLTAGE (V)
Figure 10 Typical Junction Capacitance
20
10
8
RDS(on)
Limited
7
6
-ID , DRAIN CURRENT (A)
V GS GATE THRESHOLD VOLTAGE (V)
ADVANCE INFORMATION
0.36
5
VDS = -10V
4
I D = -1.7A
3
2
PW = 100µs
1
DC
PW = 10s
PW = 1s
PW = 100ms
PW = 10ms
0.1
T J (m ax ) = 150°C
PW = 1ms
T A = 25°C
1
0
0
1
2
3
Qg, TOTAL GATE CHARGE (nC)
Figure 11 Gate Charge
DMP2200UDW
Document number: DS37689 Rev. 1 - 2
4
0.01
0.1
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V GS = 4.5V
Single Pulse
DUT on 1 * MRP Board
10
1
-VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12 SOA, Safe Operation Area
100
February 2015
© Diodes Incorporated
DMP2200UDW
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCE INFORMATION
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
Rθ JA (t) = r(t) * RθJA
D = 0.005
RθJA = 271°C/W
Duty Cycle, D = t1/ t2
D = Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
SOT363
Dim Min Max Typ
A 0.10 0.30 0.25
B 1.15 1.35 1.30
C 2.00 2.20 2.10
D
0.65 Typ
F 0.40 0.45 0.425
H 1.80 2.20 2.15
J
0
0.10 0.05
K 0.90 1.00 1.00
L 0.25 0.40 0.30
M 0.10 0.22 0.11
0°
8°
α
All Dimensions in mm
A
B C
H
K
M
J
D
L
F
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C2
Z
C2
Dimensions Value (in mm)
Z
2.5
G
1.3
X
0.42
Y
0.6
C1
1.9
C2
0.65
C1
G
Y
X
DMP2200UDW
Document number: DS37689 Rev. 1 - 2
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DMP2200UDW
IMPORTANT NOTICE
ADVANCE INFORMATION
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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failure of the life support device or to affect its safety or effectiveness.
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Copyright © 2015, Diodes Incorporated
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DMP2200UDW
Document number: DS37689 Rev. 1 - 2
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February 2015
© Diodes Incorporated
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