LM1117-N, LM1117I www.ti.com SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 LM1117-N/LM1117I 800mA Low-Dropout Linear Regulator Check for Samples: LM1117-N, LM1117I FEATURES DESCRIPTION • The LM1117-N is a series of low dropout voltage regulators with a dropout of 1.2V at 800mA of load current. It has the same pin-out as Texas Instruments' industry standard LM317. 1 2 • • • • • • Available in 1.8V, 2.5V, 2.85V, 3.3V, 5V, and Adjustable Versions Space Saving SOT-223 and WSON Packages Current Limiting and Thermal Protection Output Current 800mA Line Regulation 0.2% (Max) Load Regulation 0.4% (Max) Temperature Range – LM1117-N: 0°C to 125°C – LM1117I: −40°C to 125°C APPLICATIONS • • • • • 2.85V Model for SCSI-2 Active Termination Post Regulator for Switching DC/DC Converter High Efficiency Linear Regulators Battery Charger Battery Powered Instrumentation The LM1117-N is available in an adjustable version, which can set the output voltage from 1.25V to 13.8V with only two external resistors. In addition, it is also available in five fixed voltages, 1.8V, 2.5V, 2.85V, 3.3V, and 5V. The LM1117-N offers current limiting and thermal shutdown. Its circuit includes a zener trimmed bandgap reference to assure output voltage accuracy to within ±1%. The LM1117-N series is available in WSON, PFM, SOT-223, TO-220, and TO-263 DDPAK packages. A minimum of 10µF tantalum capacitor is required at the output to improve the transient response and stability. TYPICAL APPLICATION Active Terminator for SCSI-2 Bus Figure 1. Fixed Output Regulator 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM1117-N, LM1117I SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 www.ti.com Block Diagram Connection Diagrams Figure 2. SOT-223 Top View Figure 3. TO-220 Top View Figure 4. PFM Top View Figure 5. DDPAK/TO-263 Top View 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I LM1117-N, LM1117I www.ti.com SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 Figure 6. DDPAK/TO-263 Side View ADJ/GND 1 VIN 2 8 NOT CONNECTED 7 VOUT VOUT VIN 3 6 VOUT VIN 4 5 VOUT When using the WSON package Pins 2, 3 & 4 must be connected together and Pins 5, 6 & 7 must be connected together Figure 7. WSON Top View These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) Maximum Input Voltage (VIN to GND) 20V Power Dissipation (3) Internally Limited Junction Temperature (TJ) (3) 150°C Storage Temperature Range Lead Temperature -65°C to 150°C TO-220 (T) Package 260°C, 10 sec SOT-223 (IMP) Package 260°C, 4 sec ESD Tolerance (4) (1) (2) (3) (4) 2000V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/θJA. All numbers apply for packages soldered directly into a PC board. For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF. OPERATING RATINGS (1) Input Voltage (VIN to GND) Junction Temperature Range (TJ) (2) (1) (2) 15V LM1117-N 0°C to 125°C LM1117I −40°C to 125°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/θJA. All numbers apply for packages soldered directly into a PC board. Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I Submit Documentation Feedback 3 LM1117-N, LM1117I SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 www.ti.com LM1117-N ELECTRICAL CHARACTERISTICS Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire junction temperature range for operation, 0°C to 125°C. Symbol VREF VOUT ΔVOUT ΔVOUT Min (1) Typ (2) Max (1) Units LM1117-N-ADJ IOUT = 10mA, VIN-VOUT = 2V, TJ = 25°C 10mA ≤ IOUT ≤ 800mA, 1.4V ≤ VIN-VOUT ≤ 10V 1.238 1.225 1.250 1.250 1.262 1.270 V V LM1117-N-1.8 IOUT = 10mA, VIN = 3.8V, TJ = 25°C 0 ≤ IOUT ≤ 800mA, 3.2V ≤ VIN ≤ 10V 1.782 1.746 1.800 1.800 1.818 1.854 V V LM1117-N-2.5 IOUT = 10mA, VIN = 4.5V, TJ = 25°C 0 ≤ IOUT ≤ 800mA, 3.9V ≤ VIN ≤ 10V 2.475 2.450 2.500 2.500 2.525 2.550 V V LM1117-N-2.85 IOUT = 10mA, VIN = 4.85V, TJ = 25°C 0 ≤ IOUT ≤ 800mA, 4.25V ≤ VIN ≤ 10V 0 ≤ IOUT ≤ 500mA, VIN = 4.10V 2.820 2.790 2.790 2.850 2.850 2.850 2.880 2.910 2.910 V V V LM1117-N-3.3 IOUT = 10mA, VIN = 5V TJ = 25°C 0 ≤ IOUT ≤ 800mA, 4.75V≤ VIN ≤ 10V 3.267 3.235 3.300 3.300 3.333 3.365 V V LM1117-N-5.0 IOUT = 10mA, VIN = 7V, TJ = 25°C 0 ≤ IOUT ≤ 800mA, 6.5V ≤ VIN ≤ 12V 4.950 4.900 5.000 5.000 5.050 5.100 V V Parameter Reference Voltage Output Voltage Line Regulation (3) Load Regulation (3) Conditions LM1117-N-ADJ IOUT = 10mA, 1.5V ≤ VIN-VOUT ≤ 13.75V 0.035 0.2 % LM1117-N-1.8 IOUT = 0mA, 3.2V ≤ VIN ≤ 10V 1 6 mV LM1117-N-2.5 IOUT = 0mA, 3.9V ≤ VIN ≤ 10V 1 6 mV LM1117-N-2.85 IOUT = 0mA, 4.25V ≤ VIN ≤ 10V 1 6 mV LM1117-N-3.3 IOUT = 0mA, 4.75V ≤ VIN ≤ 15V 1 6 mV LM1117-N-5.0 IOUT = 0mA, 6.5V ≤ VIN ≤ 15V 1 10 mV LM1117-N-ADJ VIN-VOUT = 3V, 10 ≤ IOUT ≤ 800mA 0.2 0.4 % LM1117-N-1.8 VIN = 3.2V, 0 ≤ IOUT ≤ 800mA 1 10 mV LM1117-N-2.5 VIN = 3.9V, 0 ≤ IOUT ≤ 800mA 1 10 mV LM1117-N-2.85 VIN = 4.25V, 0 ≤ IOUT ≤ 800mA 1 10 mV LM1117-N-3.3 VIN = 4.75V, 0 ≤ IOUT ≤ 800mA 1 10 mV LM1117-N-5.0 VIN = 6.5V, 0 ≤ IOUT ≤ 800mA VIN-V (1) (2) (3) (4) 4 OUT Dropout Voltage (4) 1 15 mV IOUT = 100mA 1.10 1.20 V IOUT = 500mA 1.15 1.25 V IOUT = 800mA 1.20 1.30 V All limits are ensured by testing or statistical analysis. Typical Values represent the most likely parametric normal. Load and line regulation are measured at constant junction room temperature. The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the output voltage has dropped 100mV from the nominal value obtained at VIN = VOUT +1.5V. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I LM1117-N, LM1117I www.ti.com SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 LM1117-N ELECTRICAL CHARACTERISTICS (continued) Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire junction temperature range for operation, 0°C to 125°C. Symbol ILIMIT Parameter Conditions Min (1) Typ (2) Max (1) Units 800 1200 1500 mA Current Limit VIN-VOUT = 5V, TJ = 25°C Minimum Load Current (5) LM1117-N-ADJ VIN = 15V 1.7 5 mA Quiescent Current LM1117-N-1.8 VIN ≤ 15V 5 10 mA LM1117-N-2.5 VIN ≤ 15V 5 10 mA LM1117-N-2.85 VIN ≤ 10V 5 10 mA LM1117-N-3.3 VIN ≤ 15V 5 10 mA LM1117-N-5.0 VIN ≤ 15V Thermal Regulation TA = 25°C, 30ms Pulse Ripple Regulation fRIPPLE =1 20Hz, VIN-VOUT = 3V VRIPPLE = 1VPP 60 Adjust Pin Current Adjust Pin Current Change 10 ≤ IOUT≤ 800mA, 1.4V ≤ VIN-VOUT ≤ 10V Temperature Stability 10 mA 0.1 %/W 75 dB 60 120 μA 0.2 5 μA 0.5 % 0.3 % Long Term Stability TA = 125°C, 1000Hrs RMS Output Noise (% of VOUT), 10Hz ≤ f ≤10kHz 0.003 % Thermal Resistance Junction-to-Case 3-Lead SOT-223 15.0 °C/W 3-Lead TO-220 3.0 °C/W 3-Lead TO-263 10 °C/W 3-Lead SOT-223 (No heat sink) 136 °C/W 3-Lead TO-220 (No heat sink) 79 °C/W 3-Lead TO-263 (6) (No heat sink) 92 °C/W 3-Lead PFM 55 °C/W 40 °C/W Thermal Resistance Junction-to-Ambient (No air flow) 8-Lead WSON (5) (6) (7) 5 0.01 (7) The minimum output current required to maintain regulation. Minimum pad size of 0.038in2 Thermal Performance for the WSON was obtained using JESD51-7 board with six vias and an ambient temperature of 22°C. For information about improved thermal performance and power dissipation for the WSON, refer to Application Note AN-1187 (SNOA401). LM1117I ELECTRICAL CHARACTERISTICS Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire junction temperature range for operation, −40°C to 125°C. Symbol VREF VOUT (1) (2) Min (1) Typ (2) Max (1) Units LM1117I-ADJ IOUT = 10mA, VIN-VOUT = 2V, TJ = 25°C 10mA ≤ IOUT ≤ 800mA, 1.4V ≤ VIN-VOUT ≤ 10V 1.238 1.200 1.250 1.250 1.262 1.290 V V LM1117I-3.3 IOUT = 10mA, VIN = 5V, TJ = 25°C 0 ≤ IOUT ≤ 800mA, 4.75V ≤ VIN ≤ 10V 3.267 3.168 3.300 3.300 3.333 3.432 V V LM1117I-5.0 IOUT = 10mA, VIN = 7V, TJ = 25°C 0 ≤ IOUT ≤ 800mA, 6.5V ≤ VIN ≤ 12V 4.950 4.800 5.000 5.000 5.050 5.200 V V Parameter Reference Voltage Output Voltage Conditions All limits are ensured by testing or statistical analysis. Typical Values represent the most likely parametric normal. Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I Submit Documentation Feedback 5 LM1117-N, LM1117I SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 www.ti.com LM1117I ELECTRICAL CHARACTERISTICS (continued) Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire junction temperature range for operation, −40°C to 125°C. Symbol ΔVOUT ΔVOUT VIN-V OUT ILIMIT Parameter Line Regulation (3) Load Regulation (3) Dropout Voltage (4) Conditions Min (1) LM1117I-ADJ IOUT = 10mA, 1.5V ≤ VIN-VOUT ≤ 13.75V 0.3 % 1 10 mV LM1117I-5.0 IOUT = 0mA, 6.5V ≤ VIN ≤ 15V 1 15 mV LM1117I-ADJ VIN-VOUT = 3V, 10 ≤ IOUT ≤ 800mA 0.2 0.5 % LM1117I-3.3 VIN = 4.75V, 0 ≤ IOUT ≤ 800mA 1 15 mV LM1117I-5.0 VIN = 6.5V, 0 ≤ IOUT ≤ 800mA 1 20 mV IOUT = 100mA 1.10 1.30 V IOUT = 500mA 1.15 1.35 V IOUT = 800mA 1.20 1.40 V 1200 1500 mA Current Limit VIN-VOUT = 5V, TJ = 25°C Minimum Load Current (5) LM1117I-ADJ VIN = 15V 1.7 5 mA Quiescent Current LM1117I-3.3 VIN ≤ 15V 5 15 mA Thermal Regulation TA = 25°C, 30ms Pulse Ripple Regulation fRIPPLE =1 20Hz, VIN-VOUT = 3V VRIPPLE = 1VPP Adjust Pin Current Change 800 60 10 ≤ IOUT≤ 800mA, 1.4V ≤ VIN-VOUT ≤ 10V Temperature Stability 6 Units 0.035 Adjust Pin Current (5) (6) (7) Max (1) LM1117I-3.3 IOUT = 0mA, 4.75V ≤ VIN ≤ 15V LM1117I-5.0 VIN ≤ 15V (3) (4) Typ (2) 5 15 mA 0.01 0.1 %/W 75 dB 60 120 μA 0.2 10 μA 0.5 % 0.3 % Long Term Stability TA = 125°C, 1000Hrs RMS Output Noise (% of VOUT), 10Hz ≤ f ≤10kHz 0.003 % Thermal Resistance Junction-to-Case 3-Lead SOT-223 15.0 °C/W 3-Lead TO-263 10 °C/W Thermal Resistance Junction-to-Ambient No air flow) 3-Lead SOT-223 (No heat sink) 136 °C/W 3-Lead TO-263 (No heat sink) (6) 92 °C/W 8-Lead WSON (7) 40 °C/W Load and line regulation are measured at constant junction room temperature. The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the output voltage has dropped 100mV from the nominal value obtained at VIN = VOUT +1.5V. The minimum output current required to maintain regulation. Minimum pad size of 0.038in2 Thermal Performance for the WSON was obtained using JESD51-7 board with six vias and an ambient temperature of 22°C. For information about improved thermal performance and power dissipation for the WSON, refer to Application Note AN-1187 (SNOA401). Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I LM1117-N, LM1117I www.ti.com SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS Dropout Voltage (VIN-V OUT) Short-Circuit Current Figure 8. Figure 9. Load Regulation LM1117-N-ADJ Ripple Rejection Figure 10. Figure 11. LM1117-N-ADJ Ripple Rejection vs. Current Temperature Stability Figure 12. Figure 13. Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I Submit Documentation Feedback 7 LM1117-N, LM1117I SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) Adjust Pin Current LM1117-N-2.85 Load Transient Response Figure 14. Figure 15. LM1117-N-5.0 Load Transient Response LM1117-N-2.85 Line Transient Response Figure 16. Figure 17. LM1117-N-5.0 Line Transient Response Figure 18. 8 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I LM1117-N, LM1117I www.ti.com SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 APPLICATION INFORMATION EXTERNAL CAPACITORS/STABILITY Input Bypass Capacitor An input capacitor is recommended. A 10µF tantalum on the input is a suitable input bypassing for almost all applications. Adjust Terminal Bypass Capacitor The adjust terminal can be bypassed to ground with a bypass capacitor (CADJ) to improve ripple rejection. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. At any ripple frequency, the impedance of the CADJ should be less than R1 to prevent the ripple from being amplified: 1/(2π*fRIPPLE*CADJ) < R1 (1) The R1 is the resistor between the output and the adjust pin. Its value is normally in the range of 100-200Ω. For example, with R1 = 124Ω and fRIPPLE = 120Hz, the CADJ should be > 11µF. Output Capacitor The output capacitor is critical in maintaining regulator stability, and must meet the required conditions for both minimum amount of capacitance and ESR (Equivalent Series Resistance). The minimum output capacitance required by the LM1117-N is 10µF, if a tantalum capacitor is used. Any increase of the output capacitance will merely improve the loop stability and transient response. The ESR of the output capacitor should range between 0.3Ω - 22Ω. In the case of the adjustable regulator, when the CADJ is used, a larger output capacitance (22µf tantalum) is required. OUTPUT VOLTAGE The LM1117-N adjustable version develops a 1.25V reference voltage, VREF, between the output and the adjust terminal. As shown in Figure 19, this voltage is applied across resistor R1 to generate a constant current I1. The current IADJ from the adjust terminal could introduce error to the output. But since it is very small (60µA) compared with the I1 and very constant with line and load changes, the error can be ignored. The constant current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level. For fixed voltage devices, R1 and R2 are integrated inside the devices. Figure 19. Basic Adjustable Regulator LOAD REGULATION The LM1117-N regulates the voltage that appears between its output and ground pins, or between its output and adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the best load regulation, a few precautions are needed. Figure 20, shows a typical application using a fixed output regulator. The Rt1 and Rt2 are the line resistances. It is obvious that the VLOAD is less than the VOUT by the sum of the voltage drops along the line resistances. In this case, the load regulation seen at the RLOAD would be degraded from the data sheet specification. To improve this, the load should be tied directly to the output terminal on the positive side and directly tied to the ground terminal on the negative side. Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I Submit Documentation Feedback 9 LM1117-N, LM1117I SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 www.ti.com Figure 20. Typical Application using Fixed Output Regulator When the adjustable regulator is used (Figure 21), the best performance is obtained with the positive side of the resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with 0.05Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05Ω x IL. If R1 (=125Ω) is connected near the load, the effective line resistance will be 0.05Ω (1+R2/R1) or in this case, it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation. Figure 21. Best Load Regulation using Adjustable Output Regulator PROTECTION DIODES Under normal operation, the LM1117-N regulators do not need any protection diode. With the adjustable device, the internal resistance between the adjust and output terminals limits the current. No diode is needed to divert the current around the regulator even with capacitor on the adjust terminal. The adjust pin can take a transient signal of ±25V with respect to the output voltage without damaging the device. When a output capacitor is connected to a regulator and the input is shorted to ground, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and rate of decrease of VIN. In the LM1117-N regulators, the internal diode between the output and input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large output capacitor (≥1000 µF), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, an external diode is recommended between the output and input pins to protect the regulator, as shown in Figure 22. 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I LM1117-N, LM1117I www.ti.com SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 Figure 22. Regulator with Protection Diode HEATSINK REQUIREMENTS When an integrated circuit operates with an appreciable current, its junction temperature is elevated. It is important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is determined by summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is demonstrated in Figure 23. The heat generated at the device junction flows through the die to the die attach pad, through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a heatsink. RθJC (Component Variables) RθCA (Application Variables) Leadframe Size & Material Mounting Pad Size, Material, & Location No. of Conduction Pins Placement of Mounting Pad Die Size PCB Size & Material Die Attach Material Traces Length & Width Molding Compound Size and Material Adjacent Heat Sources Volume of Air Ambient Temperatue Shape of Mounting Pad The case temperature is measured at the point where the leads contact with the mounting pad surface Figure 23. Cross-Sectional View of Integrated Circuit Mounted on a Printed Circuit Board The LM1117-N regulators have internal thermal shutdown to protect the device from over-heating. Under all possible operating conditions, the junction temperature of the LM1117-N must be within the range of 0°C to 125°C. A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD , must be calculated: IIN = IL + IG (2) Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I Submit Documentation Feedback 11 LM1117-N, LM1117I SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 www.ti.com PD = (VIN-VOUT)I L + VINIG (3) Figure 24 shows the voltages and currents which are present in the circuit. Figure 24. Power Dissipation Diagram The next parameter which must be calculated is the maximum allowable temperature rise, TR(max): TR(max) = TJ(max)-TA(max) where • • TJ(max) is the maximum allowable junction temperature (125°C) which will be encountered in the application TA(max) is the maximum ambient temperature which will be encountered in the application (4) Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient thermal resistance (θJA) can be calculated: θJA = TR(max)/PD (5) If the maximum allowable value for θJA is found to be ≥136°C/W for PFM package or ≥79°C/W for TO-220 package or ≥92°C/W for TO-263 package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for θJA falls below these limits, a heatsink is required. As a design aid, Table 1 shows the value of the θJA of SOT-223 and PFM for different heatsink area. The copper patterns that we used to measure these θJAs are shown at the end of APPLICATION INFORMATION. Figure 25 and Figure 26 reflects the same test results as what are in the Table 1 Figure 27 and Figure 28 shows the maximum allowable power dissipation vs. ambient temperature for the SOT223 and PFM device. Figure 29 and Figure 30 shows the maximum allowable power dissipation vs. copper area (in2) for the SOT-223 and PFM devices. Please see AN1028 for power enhancement techniques to be used with SOT-223 and PFM packages. Application Note AN-1187 (SNOA401) discusses improved thermal performance and power dissipation for the WSON. Table 1. θJA Different Heatsink Area Layout Copper Area Thermal Resistance Top Side (in2) (1) Bottom Side (in2) (θJA,°C/W) SOT-223 (θJA,°C/W) PFM 1 0.0123 0 136 103 2 0.066 0 123 87 3 0.3 0 84 60 4 0.53 0 75 54 5 0.76 0 69 52 6 1 0 66 47 7 0 0.2 115 84 8 0 0.4 98 70 9 0 0.6 89 63 10 0 0.8 82 57 11 0 1 79 57 12 0.066 0.066 125 89 13 0.175 0.175 93 72 (1) Tab of device attached to topside copper 12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I LM1117-N, LM1117I www.ti.com SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 Table 1. θJA Different Heatsink Area (continued) Layout Copper Area Thermal Resistance 14 0.284 0.284 83 61 15 0.392 0.392 75 55 16 0.5 0.5 70 53 Figure 25. θJA vs. 1oz Copper Area for SOT-223 Figure 26. θJA vs. 2oz Copper Area for PFM Figure 27. Maximum Allowable Power Dissipation vs. Ambient Temperature for SOT-223 Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I Submit Documentation Feedback 13 LM1117-N, LM1117I SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 www.ti.com Figure 28. Maximum Allowable Power Dissipation vs. Ambient Temperature for PFM Figure 29. Maximum Allowable Power Dissipation vs. 1oz Copper Area for SOT-223 Figure 30. Maximum Allowable Power Dissipation vs. 2oz Copper Area for PFM 14 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I LM1117-N, LM1117I www.ti.com SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 Figure 31. Top View of the Thermal Test Pattern in Actual Scale Figure 32. Bottom View of the Thermal Test Pattern in Actual Scale Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I Submit Documentation Feedback 15 LM1117-N, LM1117I SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 www.ti.com TYPICAL APPLICATION CIRCUITS Figure 33. Adjusting Output of Fixed Regulators Figure 34. Regulator with Reference Figure 35. 1.25V to 10V Adjustable Regulator with Improved Ripple Rejection Figure 36. 5V Logic Regulator with Electronic Shutdown* 16 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I LM1117-N, LM1117I www.ti.com SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 Figure 37. Battery Backed-Up Regulated Supply Figure 38. Low Dropout Negative Supply Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I Submit Documentation Feedback 17 LM1117-N, LM1117I SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision L (March 2013) to Revision M • 18 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 17 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM1117-N LM1117I PACKAGE OPTION ADDENDUM www.ti.com 14-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM1117DT-1.8/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-1.8 LM1117DT-2.5/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-2.5 LM1117DT-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-3.3 LM1117DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-5.0 LM1117DT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-ADJ LM1117DTX-1.8/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-1.8 LM1117DTX-2.5/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-2.5 LM1117DTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-3.3 LM1117DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-5.0 LM1117DTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 LM1117 DT-ADJ LM1117IDT-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-3.3 LM1117IDT-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-5.0 LM1117IDT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-ADJ LM1117IDTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-3.3 LM1117IDTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-5.0 LM1117IDTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM1117 IDT-ADJ LM1117ILD-ADJ/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS & no Sb/Br) SN Level-3-260C-168 HR -40 to 125 1117IAD Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 14-Nov-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM1117IMP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 N05B LM1117IMP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 N06B LM1117IMP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 N03B LM1117IMPX-3.3 NRND SOT-223 DCY 4 TBD Call TI Call TI -40 to 125 N05B LM1117IMPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 N05B LM1117IMPX-5.0 NRND SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 125 N06B LM1117IMPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 N06B LM1117IMPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 N03B LM1117LD-1.8/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS & no Sb/Br) SN Level-3-260C-168 HR 0 to 125 1117-18 LM1117LD-2.5/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS & no Sb/Br) SN Level-3-260C-168 HR 0 to 125 1117-25 LM1117LD-3.3/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS & no Sb/Br) SN Level-3-260C-168 HR 0 to 125 1117-33 LM1117LD-ADJ/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 1117ADJ LM1117LDX-1.8 NRND WSON NGN 8 4500 TBD Call TI Call TI 0 to 125 1117-18 LM1117LDX-1.8/NOPB ACTIVE WSON NGN 8 4500 Green (RoHS & no Sb/Br) SN Level-3-260C-168 HR 0 to 125 1117-18 LM1117LDX-ADJ/NOPB ACTIVE WSON NGN 8 4500 Green (RoHS & no Sb/Br) SN Level-3-260C-168 HR 0 to 125 1117ADJ LM1117MP-1.8/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N12A LM1117MP-2.5/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N13A LM1117MP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N05A LM1117MP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N06A Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 14-Nov-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM1117MP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N03A LM1117MPX-1.8/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N12A LM1117MPX-2.5/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N13A LM1117MPX-3.3 ACTIVE SOT-223 DCY 4 2000 TBD Call TI Call TI LM1117MPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N05A N05A LM1117MPX-5.0 NRND SOT-223 DCY 4 2000 TBD Call TI Call TI 0 to 125 N06A LM1117MPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N06A LM1117MPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 N03A LM1117S-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM1117S ADJ LM1117SX-3.3/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM1117S 3.3 LM1117SX-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM1117S 5.0 LM1117SX-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM1117S ADJ LM1117T-2.5/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 125 LM1117T 2.5 LM1117T-3.3/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 125 LM1117T 3.3 LM1117T-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 125 LM1117T 5.0 LM1117T-ADJ/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 125 LM1117T ADJ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 14-Nov-2013 OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 19-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM1117DTX-1.8/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117DTX-2.5/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117DTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117DTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117DTX-ADJ/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117IDTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117IDTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117IDTX-ADJ/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM1117ILD-ADJ/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117IMP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117IMP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117IMP-ADJ/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 SOT-223 DCY 4 0 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117IMPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117IMPX-3.3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117IMPX-5.0/NOPB SOT-223 LM1117IMPX-5.0 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117IMPX-ADJ/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117LD-1.8/NOPB WSON Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Oct-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM1117LD-2.5/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117LD-3.3/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117LD-ADJ/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117LDX-1.8 WSON NGN 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117LDX-1.8/NOPB WSON NGN 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117LDX-ADJ/NOPB WSON NGN 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM1117MP-1.8/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MP-2.5/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MP-ADJ/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MPX-1.8/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MPX-2.5/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MPX-3.3/NOPB SOT-223 LM1117MPX-3.3 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117MPX-ADJ/NOPB SOT-223 LM1117MPX-5.0 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM1117SX-3.3/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1117SX-5.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1117SX-ADJ/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1117DTX-1.8/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117DTX-2.5/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117DTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117DTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117DTX-ADJ/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117IDTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117IDTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117IDTX-ADJ/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM1117ILD-ADJ/NOPB WSON NGN 8 1000 213.0 191.0 55.0 LM1117IMP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117IMP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117IMP-ADJ/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117IMPX-3.3 SOT-223 DCY 4 0 367.0 367.0 35.0 LM1117IMPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117IMPX-5.0 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117IMPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117IMPX-ADJ/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117LD-1.8/NOPB WSON NGN 8 1000 213.0 191.0 55.0 LM1117LD-2.5/NOPB WSON NGN 8 1000 213.0 191.0 55.0 LM1117LD-3.3/NOPB WSON NGN 8 1000 213.0 191.0 55.0 Pack Materials-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 19-Oct-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1117LD-ADJ/NOPB WSON NGN 8 1000 213.0 191.0 55.0 LM1117LDX-1.8 WSON NGN 8 4500 367.0 367.0 35.0 LM1117LDX-1.8/NOPB WSON NGN 8 4500 367.0 367.0 35.0 LM1117LDX-ADJ/NOPB WSON NGN 8 4500 367.0 367.0 35.0 LM1117MP-1.8/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-2.5/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MP-ADJ/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM1117MPX-1.8/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-2.5/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-3.3 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-5.0 SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117MPX-ADJ/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM1117SX-3.3/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1117SX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1117SX-ADJ/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 Pack Materials-Page 4 MECHANICAL DATA NDE0003B www.ti.com MECHANICAL DATA NDP0003B TD03B (Rev F) www.ti.com MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0°–10° 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA NGN0008A LDC08A (Rev B) www.ti.com MECHANICAL DATA KTT0003B TS3B (Rev F) BOTTOM SIDE OF PACKAGE www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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