Renesas HA17324A Quad operational amplifier Datasheet

HA17324A Series
Quad Operational Amplifier
REJ03D0674-0400
Rev.4.00
Mar 10, 2006
Description
HA17324A series are quad operational amplifier that provide high gain and internal phase compensation, with single
power supply. They can be widely used to control equipments.
Features
•
•
•
•
Wide range of supply voltage, and single power supply used
Internal phase compensation
Wide range of common mode voltage, and possible to operate with an input about 0 V
Low electro-magnetic susceptibility level
Measurement Condition
Output Offset Voltage vs. Input Interference
5.0
Rs
Rs
−
+
Rf
0.01 µ
Vout
V
_ (= 100∗Vio)
Vin
−10 dBm
RF signal source
(for quasi-RF noise)
Output offset voltage (arb. unit)
Rf
Vcc = +7.5 V
Vee = −7.5 V
4.0
HA17324 series
3.0
2.0
Improvement
1.0
HA17324A series
0
−1.0
100E+3
1E+6
10E+6
100E+6
1E+9
Input RF frequency (Hz)
10E+9
Ordering Information
Type No.
HA17324A
HA17324AF
HA17324ARP
HA17324AT
Application
Commercial use
Rev.4.00 Mar 10, 2006 page 1 of 7
Package Name
DIP-14 pin
SOP-14 pin (JEITA)
SOP-14 pin (JEDEC)
TSSOP-14 pin
Package Code
PRDP0014AB-B
PRSP0014DF-B
PRSP0014DE-A
PTSP0014JA-B
HA17324A Series
Pin Arrangement
Vout1
1
Vin(−)1
2
Vin(+)1
3
VCC
4
Vin(+)2
5
Vin(−)2
6
Vout2
7
14 Vout4
1
− +
4
+ −
13 Vin(−)4
12 Vin(+)4
11 VEE
− +
2
+ −
3
10 Vin(+)3
9
Vin(−)3
8
Vout3
(Top view)
Circuit Schematic (1/4)
Q5
Vin(−)
Q1
Q2
Q3
Q4
Q6
C
Q7
R1
Vin(+)
Vout
Q11
Q10
Q8
Q13
Q12
Q9
Note: If Input/Output terminals voltage over the absolute maximum ratings, there is possibility of mis-operation,
characteristics deterioration and destruction, because of the current’s flowing to parasitic diode in IC.
The Input/Output terminals are recommended to be protected with the clamp circuit which using the diode with
low forward voltage (like schottky barrier diode) when there is a possibility for the Input/Output terminals
voltage exceeds the absolute maximum ratings.
Rev.4.00 Mar 10, 2006 page 2 of 7
HA17324A Series
Absolute Maximum Ratings
(Ta = 25°C)
Item
Power supply voltage
Output sink current
Common mode input voltage
Differential input voltage
Output voltage
Allowable power dissipation
Symbol
DIP
SOP
TSSOP
Operating temperature
Storage temperature
Ratings
32
50
−0.3 to +VCC
±VCC
−0.3 to +VCC
625 *2
625 *3
400 *4
−40 to +85
−55 to +125
VCC
Iosink
VCM
Vin(diff)
Vout
PT
Topr
Tstg
Unit
V
mA
V
V
V
mW
°C
°C
Notes: 1. HA17324A:
This is the allowable values up to Ta = 50°C. Derate by 8.3 mW/°C.
2. HA17324AF/ARP:
When it is mounted on glass epoxy board of 40 mm × 40 mm × 1.6 mmt with 10% wiring density, value at Ta
≤ 25°C. If Ta > 25°C, derated by 6.25 mW/°C.
When it is mounted on glass epoxy board of 40 mm × 40 mm × 1.6 mmt with 30% wiring density. If Ta >
32°C, derated by 6.70 mW/°C.
3. HA17324AT:
These are the allowable values up to Ta = 25°C. Derate by 4 mW/°C above that temperature.
Electrical Characteristics
(VCC = +15 V, Ta = 25°C)
Item
Input offset voltage
Input offset current
Input bias current
Power source rejection ratio
Voltage gain
Common mode rejection ratio
Symbol
VIO
IIO
IIB
PSRR
AVD
CMR
VCM
Min




75

−0.3
Typ
2
5
30
93
90
80

Max
7
50
500



13.5
Unit
mV
nA
nA
dB
dB
dB
V
Test Conditions
VCM = 7.5 V, RS = 50 Ω, Rf = 50 kΩ
VCM = 7.5 V, IIO = | II (–) – II (+) |
VCM = 7.5 V
f = 100 Hz, RS = 1 kΩ, Rj = 100 kΩ
RS = 1 kΩ, Rf = 100 kΩ, RL = ∞
RS = 50 Ω, Rf = 5 kΩ
RS = 1 kΩ, Rf = 100 kΩ, f = 100 Hz
Common mode input voltage
range
Maximum output voltage
VOP-P

13.6

V
Output source current
Output sink current
Supply current
Slew rate
Channel separation *1
Output sink current
Iosource
Iosink
ICC
SR
CS
Iosink
20
10



15
3
40
20
0.8
0.19
(120)
50
9


2




mA
mA
mA
V/µs
dB
µA
mA
f = 100 Hz, RS = 1 kΩ, Rf = 100 kΩ,
RL = 20 kΩ
VIN+ = 1 V, VIN– = 0 V, VOH = 10 V
VIN = 0 V, VIN = 1 V, VOL = 2.5 V
VIN = GND, RL = ∞
f = 1.5 kHz, VCM = 7.5 V, RL = ∞
f = 1 kHz
VIN+ = 0 V, VIN– = 1 V, VOL = 200 mV
VIN+ = 0 V, VIN– = 1 V, VOL = 1 V
Output voltage
VOH1
VOH2
VOL1
VOL2
13.2
12.0


13.6
13.3
0.8
1.1


1.0
1.8
V
V
V
V
Output voltage
Note:
1. Design spec.
Rev.4.00 Mar 10, 2006 page 3 of 7
IOH = –1 mA
IOH = –10 mA
IOL = 1 mA
IOL = 10 mA
HA17324A Series
Output Source Current vs. Ambient Temperature
80
VCC = 15 V
70
VOH = 10 V
60
50
40
30
20
10
0
−20
0
20
40
60
Ambeint temperature Ta (°C)
Input Bias Current vs. Ambient Temperature
80
Input bias current IIB (nA)
Output source current Iosource (mA)
Characteristic Curves
VCC = 15 V
VCM = 7.5 V
70
60
50
40
30
20
10
0
−20
80
2
1
8
16
24
32
Supply voltage VCC (V)
80
Input bias current IIB (nA)
Supply current ICC (mA)
Ta = 25°C
3
0
40
20
0
40
120
80
40
40
Maximum output voltage VOP-P (V)
Voltage gain AVD (dB)
Ta = 25°C
RL = ∞
Rev.4.00 Mar 10, 2006 page 4 of 7
8
16
24
32
Supply voltage VCC (V)
40
Maxlmum Output Voltage vs. Frequency
160
8
16
24
32
Supply voltage VCC (V)
Ta = 25°C
60
Voltage Gain vs. Supply Voltage
0
80
Input Bias Current vs. Supply Voltage
Supply Current vs. Supply Voltage
4
0
20
40
60
Ambeint temperature Ta (°C)
20
VCC = 15 V
Ta = 25°C
RL = 20 kΩ
16
12
8
4
0
1k
3k
10 k 30 k 100 k 300 k
Frequency f (Hz)
1M
HA17324A Series
Voltage Gain vs. Frequency
120
VCC = 15V
Ta = 25°C
RL = ∞
Voltage gain AVD (dB)
100
80
60
40
20
0
1
3
10
30
100
300
1k
3k
Frequency f (Hz)
10 k
30 k
100 k 300 k
Common Mode Rejection Ratio vs. Frequency
Common mode rejection ratio CMR (dB)
120
VCC = 15V
Ta = 25°C
RS = 50 Ω
100
80
60
40
20
0
100
Rev.4.00 Mar 10, 2006 page 5 of 7
300
1k
3 k 10 k 30 k 100 k 300 k
Frequency f (Hz)
1M
1M
HA17324A Series
Package Dimensions
JEITA Package Code
P-DIP14-6.3x19.2-2.54
RENESAS Code
PRDP0014AB-B
Previous Code
DP-14AV
MASS[Typ.]
0.97g
D
8
E
14
7
1
b3
A
Z
A1
Reference
Symbol
L
e1
D
E
A
A1
bp
b3
c
θ
e
Z
L
θ
bp
e
c
e1
( Ni/Pd/Au plating )
JEITA Package Code
P-SOP14-5.5x10.06-1.27
RENESAS Code
PRSP0014DF-B
*1
Previous Code
FP-14DAV
Dimension in Millimeters
Min
Nom Max
7.62
19.2 20.32
6.3 7.4
5.06
0.51
0.40 0.48 0.56
1.30
0.19 0.25 0.31
0°
15°
2.29 2.54 2.79
2.39
2.54
MASS[Typ.]
0.23g
D
F
14
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
8
c
HE
*2
E
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
1
Z
7
e
*3
bp
x
Reference Dimension in Millimeters
Symbol
M
A
L1
A1
θ
y
L
Detail F
Rev.4.00 Mar 10, 2006 page 6 of 7
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Min Nom Max
10.06 10.5
5.50
0.00 0.10 0.20
2.20
0.34 0.40 0.46
0.15 0.20 0.25
0°
8°
7.50 7.80 8.00
1.27
0.12
0.15
1.42
0.50 0.70 0.90
1.15
HA17324A Series
JEITA Package Code
P-SOP14-3.95x8.65-1.27
RENESAS Code
PRSP0014DE-A
*1
Previous Code
FP-14DNV
MASS[Typ.]
0.13g
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
F
D
14
8
c
*2
Index mark
HE
E
bp
Terminal cross section
( Ni/Pd/Au plating )
Reference Dimension in Millimeters
Symbol
Min
1
7
*3
e
Z
bp
x
M
A
L1
A1
θ
L
y
Detail F
JEITA Package Code
P-TSSOP14-4.4x5-0.65
RENESAS Code
PTSP0014JA-B
*1
Previous Code
TTP-14DV
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Nom Max
8.65 9.05
3.95
0.10 0.14 0.25
1.75
0.34 0.40 0.46
0.15 0.20 0.25
0°
8°
5.80 6.10 6.20
1.27
0.25
0.15
0.635
0.40 0.60 1.27
1.08
MASS[Typ.]
0.05g
D
F
14
8
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
HE
c
*2
E
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
Reference Dimension in Millimeters
Symbol
7
1
*3
Z
bp
x
M
L1
A
e
A1
θ
L
y
Detail F
Rev.4.00 Mar 10, 2006 page 7 of 7
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Min Nom Max
5.00 5.30
4.40
0.03 0.07 0.10
1.10
0.15 0.20 0.25
0.10 0.15 0.20
0°
8°
6.20 6.40 6.60
0.65
0.13
0.10
0.83
0.4 0.5 0.6
1.0
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0
Similar pages