Transient Voltage Suppressors Array for ESD Protection Low Capacitance ESDXXV23T-LA Series Description SOT-23 The ESDXXV23T-LA is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Feature Functional Diagram u 300 Watts Peak Pulse Power per Line (tp=8/20μs) u Protects two I/O lines (Common Mode) u Protects one I/O line (Differential Mode) u Low clamping voltage u Working voltages : 3.3, 5, 8, 12, 15 and 24V u Low leakage current u IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) u IEC61000-4-4 (EFT) 40A (5/50ηs) u IEC61000-4-5 (Lightning) 5A (8/20μs) Applications u Digital Visual Interface (DVI) u Audio/Video Inputs u Wireless Network Systems u Monitors and Flat Panel Displays u Medical Sensors u Notebook Computers u Set Top Box u Projection TV Mechanical Characteristics u JEDEC SOT-23 Package u Molding Compound Flammability Rating : UL 94V-0 u Weight 8.0 Milligrams (Approximate) u Quantity Per Reel : 3,000pcs u Reel Size : 7 inch u Lead Finish : Lead Free Mechanical Characteristics Symbol Parameter Value Units 300 W PPP Peak Pulse Power (tp=8/20μs waveform) TL Lead Soldering Temperature 260 (10sec) ºC TSTG Storage Temperature Range -55 to +150 ºC Operating Temperature Range -55 to +150 ºC TJ Air Discharge ±15 Contact Discharge ±8 IEC61000-4-2 (ESD) IEC61000-4-4 (EFT) 40 A IEC61000-4-5 ( Lightning ) 5 A UN Semiconductor Co., Ltd. Revision January 06, 2014 KV www.unsemi.com.tw 1/3 @ UN Semiconductor Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information. Transient Voltage Suppressors Array for ESD Protection Low Capacitance ESDXXV23T-LA Series Electrical Characteristics (@ 25℃ Unless Otherwise Specified ) Device Marking VRWM (V) (Max.) VB (V) (Min.) IT (mA) VC @1A (Max.) (Max.) ESD03V23T-LA N03 3.3 4.0 1 7.5 ESD05V23T-LA N05 5.0 6.0 1 ESD08V23T-LA N08 8.0 8.5 ESD12V23T-LA N12 12.0 ESD15V23T-LA N15 ESD24V23T-LA N24 Part Number (@A) IR (μA) (Max.) C (pF) (Typ.) 13.0 5 40 0.6 9.8 17.0 5 5 0.6 1 13.5 19.0 5 1 0.6 13.3 1 19.0 28.0 5 1 0.6 15.0 16.7 1 24.0 35.0 5 1 0.6 24.0 26.7 1 43.0 60.0 5 1 0.6 VC Characteristic Curves Fig1. 8/20μs Pulse Waveform Fig2. ESD Pulse Waveform (according to IEC 61000-4-2) tr 100 Peak Value IPP 80 100% TEST WAVEFORM PARAMETERS tr=8μs td=20μs Percent of Peak Pulse Current % IPP - Peak Pulse Current - % of IPP 120 60 40 td=t IPP/2 20 0 0 5 10 15 20 25 tr = 0.7~1ns Time (ns) 60ns ESD Clamping (+8KV Contac per IEC61000-4-2) Fig4. UN Semiconductor Co., Ltd. Revision January 06, 2014 10% 30ns 30 t - Time (μs) Fig3. 90% ESD Clamping (-8KV Contac per IEC61000-4-2) www.unsemi.com.tw 2/3 @ UN Semiconductor Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information. Transient Voltage Suppressors Array for ESD Protection Low Capacitance ESDXXV23T-LA Series SOT-23 Package Outline & Dimensions Millimeters Inches Symbol Soldering Footprint UN Semiconductor Co., Ltd. Revision January 06, 2014 Min. Nom. Max. Min. Nom. Max. A 0.89 1.00 1.11 0.035 0.040 0.044 A1 0.01 0.06 0.10 0.001 0.002 0.004 b 0.37 0.44 0.50 0.15 0.18 0.020 c 0.09 0.13 0.18 0.003 0.005 0.007 D 2.80 2.90 3.04 0.110 0.114 0.120 E 1.20 1.30 1.40 0.047 0.051 0.055 e 1.78 1.90 2.04 0.070 0.075 0.081 L 0.35 0.54 0.69 0.014 0.021 0.029 HE 2.10 2.40 2.64 0.083 0.094 0.104 Symbol Millimeters Inches X 0.80 0.031 X1 0.95 0.037 Y 0.90 0.035 Z 2.00 0.079 www.unsemi.com.tw 3/3 @ UN Semiconductor Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information.