ON MC10ELT28DTR2 5 v ttl to differential pecl and differential pecl to ttl translator Datasheet

MC10ELT28, MC100ELT28
5 VTTL to Differential
PECL and Differential PECL
to TTL Translator
Description
•
•
•
•
•
•
•
•
•
•
3.5 ns Typical PECL to TTL Propagation Delay
1.2 ns Typical TTL to PECL Propagation Delay
PNP TTL Inputs for Minimal Loading
24 mA TTL Outputs
Flow Through Pinouts
Operating Range VCC= 4.75 V to 5.25 V with GND= 0 V
QTTL Output Will Default High with Inputs Left Open or < 1.3 V
QECL Output Will Default High with Inputs Left Open
Internal PECL Input Pulldown Resistors
Pb−Free Packages are Available
MARKING DIAGRAMS*
8
8
8
HLT28
ALYW
G
1
SOIC−8
D SUFFIX
CASE 751
1
8
8
1
TSSOP−8
DT SUFFIX
CASE 948R
1
DFN8
MN SUFFIX
CASE 506AA
H
K
5G
2V
M
= MC10
= MC100
= MC10
= MC100
= Date Code
KLT28
ALYW
G
1
8
HT28
ALYWG
G
1
KT28
ALYWG
G
2V MG
G
Features
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5G MG
G
The MC10ELT/100ELT28 is a differential PECL to TTL translator
and a TTL to differential PECL translator in a single package. Because
PECL (Positive ECL) levels are used, only +5 V and ground are
required. The small outline 8-lead package and the dual translation
design of the ELT28 makes it ideal for applications which are sending
and receiving signals across a backplane.
The 100 Series contains temperature compensation.
1
1
A
L
Y
W
G
4
4
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 9
1
Publication Order Number:
MC10ELT28/D
MC10ELT28, MC100ELT28
DECL
DECL
1
Table 1. PIN DESCRIPTION
8 VCC
7
2
PECL
Pin
QTTL
TTL
QECL
3
6 DTTL
QECL
4
5 GND
Function
QTTL
TTL Outputs
DTTL
TTL Data Inputs
QECL, QECL
PECL Differential Outputs
DECL, DECL
PECL Differential Inputs
VCC
Positive Supply
GND
Ground
EP
Exposed pad must be connected to a
sufficient thermal conduit. Electrically
connect to the most negative supply or
leave floating open.
Figure 1. 8−Lead Pinout (Top View) and Logic
Diagram
Table 2. ATTRIBUTES
Characteristics
ESD Protection
Value
Human Body Model
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
SOIC−8
TSSOP−8
DFN8
Flammability Rating
Pb Pkg
Pb−Free Pkg
Level 1
Level 1
Level 1
Level 1
Level 3
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
71 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
VCC
Positive Power Supply
GND = 0 V
VIN
Input Voltage
GND = 0 V
Iout
PECL Output Current
Continuous
Surge
TA
Tstg
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
qJC
Thermal Resistance (Junction−to−Case)
qJA
Condition 2
Unit
7
V
0 to 6
V
50
100
mA
mA
Operating Temperature Range
−40 to +85
°C
Storage Temperature Range
−65 to +150
°C
SOIC−8
SOIC−8
190
130
°C/W
°C/W
Standard Board
SOIC−8
41 to 44
°C/W
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Pb
Pb−Free
VI VCC
Rating
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
MC10ELT28, MC100ELT28
Table 4. 10ELT SERIES PECL DC CHARACTERISTICS VCC= 5.0 V; GND= 0.0 V (Note 2)
−40°C
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
VOH
Output HIGH Voltage (Note 3)
3920
4010
4110
4020
4105
4190
4090
4185
4280
mV
VOL
Output LOW Voltage (Note 3)
3050
3200
3350
3050
3210
3370
3050
3227
3405
mV
VIH
Input HIGH Voltage (Single−Ended)
3770
4110
3870
4190
3940
4280
mV
VIL
Input LOW Voltage (Single−Ended)
3050
3500
3050
3520
3050
3555
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential) (Note 4)
2.2
5.0
2.2
5.0
2.2
5.0
V
IIH
Input HIGH Current
175
mA
IIL
Input LOW Current
Symbol
Characteristic
255
0.5
175
0.5
0.3
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with VCC. VCC can vary ± 0.25 V.
3. PECL outputs are terminated through a 50 W resistor to VCC − 2 V.
4. VIHCMR min varies 1:1 with GND, VIHCMR max varies 1:1 with VCC.
Table 5. 100ELT SERIES PECL DC CHARACTERISTICS VCC= 5.0 V; GND= 0.0 V (Note 5)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
VOH
Output HIGH Voltage (Note 6)
3915
3995
4120
3975
4045
4120
3975
4050
4120
mV
VOL
Output LOW Voltage (Note 6)
3170
3305
3445
3190
3295
3380
3190
3295
3380
mV
VIH
Input HIGH Voltage (Single−Ended)
3835
4120
3835
4120
3835
4120
mV
VIL
Input LOW Voltage (Single−Ended)
3190
3525
3190
3525
3190
3525
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential) (Note 7)
2.2
5.0
2.2
5.0
2.2
5.0
V
IIH
Input HIGH Current
175
mA
IIL
Input LOW Current
255
0.5
175
0.5
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with VCC. VCC can vary ± 0.25 V.
6. PECL outputs are terminated through a 50 W resistor to VCC − 2 V.
7. VIHCMR min varies 1:1 with GND, VIHCMR max varies 1:1 with VCC.
Table 6. TTL OUTPUT DC CHARACTERISTICS VCC = 4.75V to 5.25V; TA = −40°C to 85°C
Symbol
Characteristic
Condition
VOH
Output HIGH Voltage
IOH = −3.0 mA
VOL
Output LOW Voltage
IOL = 24 mA
ICCH
Power Supply Current
ICCL
Power Supply Current
IOS
Output Short Circuit Current
Min
Typ
Max
2.4
−150
Unit
V
0.5
V
27
40
mA
29
42
mA
−60
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
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3
MC10ELT28, MC100ELT28
Table 7. TTL INPUT DC CHARACTERISTICS VCC = 4.75 V to 5.25 V; TA = −40°C to 85°C
Symbol
Max
Unit
IIH
Input HIGH Current
Characteristic
VIN = 2.7 V
Condition
Min
Typ
20
mA
IIHH
Input HIGH Current
VIN = 7.0 V
100
mA
IIL
Input LOW Current
VIN = 0.5 V
−0.6
mA
VIK
Input Clamp Diode Voltage
IIN = −18 mA
−1.2
V
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
2.0
V
0.8
V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
Table 8. AC CHARACTERISTICS VCC = 4.75 V to 5.25 V (Note 8)
−40°C
Symbol
fmax
Maximum Toggle Frequency
tPLH
Propagation Delay @ 1.5 V
tPHL
Min
Characteristic
Typ
25°C
Max
Min
TBD
2.0
0.6
5.5
1.2
2.0
0.9
DECL to QTTL
DTTL to QECL
2.0
0.4
5.5
1.0
2.0
0.5
QECL
0.15
1.5
200
1000
tr, tf
Rise/Fall Times
(20% − 80%)
VPP
PECL Input Swing (Note 9)
tr/tf
Output Rise Time (10% − 90%)
Output Fall Time (10% − 90%)
Max
Min
100
DECL to QTTL
DTTL to QECL
Propagation Delay @ 1.5 V
Typ
85°C
Typ
Max
TBD
Unit
MHz
ns
1.2
5.5
1.5
2.0
0.6
5.5
1.35
0.8
5.5
1.1
2.0
0.7
5.5
1.3
0.15
1.5
0.15
1.5
ns
200
1000
200
1000
mV
1.6
1.1
ns
ns
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
8. RL = 500 W to GND and CL = 20 pF to GND. Refer to Figure 2.
9. VPP(min) is the minimum input swing for which AC parameters are guaranteed.
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4
MC10ELT28, MC100ELT28
APPLICATION
TTL RECEIVER
CHARACTERISTIC TEST
*CL includes
fixture
capacitance
CL *
RL
AC TEST LOAD
GND
Figure 2. TTL Output Loading Used for Device Evaluation
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5
MC10ELT28, MC100ELT28
ORDERING INFORMATION
Package
Shipping†
SOIC−8
98 Units / Rail
MC10ELT28DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC10ELT28DR2
SOIC−8
2500 / Tape & Reel
MC10ELT28DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC10ELT28DT
TSSOP−8
100 Units / Rail
MC10ELT28DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC10ELT28DTR2
TSSOP−8
2500 / Tape & Reel
MC10ELT28DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC10ELT28MNR4
DFN8
1000 / Tape & Reel
DFN8
(Pb−Free)
1000 / Tape & Reel
SOIC−8
98 Units / Rail
MC100ELT28DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC100ELT28DR2
SOIC−8
2500 / Tape & Reel
MC100ELT28DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC100ELT28DT
TSSOP−8
100 Units / Rail
MC100ELT28DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC100ELT28DTR2
TSSOP−8
2500 / Tape & Reel
MC100ELT28DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC100ELT28MNR4
DFN8
1000 / Tape & Reel
DFN8
(Pb−Free)
1000 / Tape & Reel
Device
MC10ELT28D
MC10ELT28MNR4G
MC100ELT28D
MC100ELT28MNR4G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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6
MC10ELT28, MC100ELT28
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AH
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
1
0.25 (0.010)
M
Y
M
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
H
0.10 (0.004)
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC10ELT28, MC100ELT28
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
0.10 (0.004)
S
2X
L/2
L
8
5
1
PIN 1
IDENT
0.15 (0.006) T U
K REF
S
M
T U
V
S
0.25 (0.010)
B
−U−
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
S
M
A
−V−
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
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8
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0_
6_
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0_
6_
MC10ELT28, MC100ELT28
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE D
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
TOP VIEW
0.08 C
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.70
0.90
0.50 BSC
0.20
−−−
0.25
0.35
A
0.10 C
8X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
E
(A3)
SIDE VIEW
A1
C
D2
e
e/2
4
1
8X
L
E2
K
8
5
8X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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For additional information, please contact your local
Sales Representative
MC10ELT28/D
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