NB2308A 3.3 V Zero Delay Clock Buffer The NB2308A is a versatile, 3.3 V zero delay buffer designed to distribute high--speed clocks. It is available in a 16 pin package. The part has an on--chip PLL which locks to an input clock presented on the REF pin. The PLL feedback is required to be driven to FBK pin, and can be obtained from one of the outputs. The input--to--output propagation delay is guaranteed to be less than 250 ps, and the output--to--output skew is guaranteed to be less than 200 ps. The NB2308A has two banks of four outputs each, which can be controlled by the select inputs as shown in the Select Input Decoding Table. If all the output clocks are not required, Bank B can be three--stated. The select input also allows the input clock to be directly applied to the outputs for chip and system testing purposes. Multiple NB2308A devices can accept the same input clock and distribute it. In this case the skew between the outputs of the two devices is guaranteed to be less than 700 ps. The NB2308A is available in five different configurations (Refer to NB2308A Configurations Table). The NB2308AI1 is the base part, where the output frequencies equal the reference if there is no counter in the feedback path. The NB2308AI1H is the high--drive version of the --1 and the rise and fall times on this device are much faster. The NB2308AI2 allows the user to obtain 2X and 1X frequencies on each output bank. The exact configuration and output frequencies depends on which output drives the feedback pin. The NB2308AI3 allows the user to obtain 4X and 2X frequencies on the outputs. The NB2308AI4 enables the user to obtain 2X clocks on all outputs. Thus, the part is extremely versatile, and can be used in a variety of applications. The NB2308AI5H is a high--drive version with REF/2 on both banks. Features Zero Input -- Output Propagation Delay, Adjustable by Capacitive Load on FBK Input Multiple Configurations -- Refer to NB2308A Configurations Table Input Frequency Range: 15 MHz to 133 MHz Multiple Low--Skew Outputs Output--Output Skew Less than 200 ps Device--Device Skew Less than 700 ps Two banks of four outputs, three--stateable by two select inputs Less than 200 ps Cycle--to--Cycle Jitter Available in 16--pin SOIC and TSSOP Packages 3.3 V Operation Guaranteed Across Commercial and Industrial Temperature Ranges Advanced 0.35 m CMOS Technology These are Pb--Free Devices Semiconductor Components Industries, LLC, 2010 October, 2010 -- Rev. 8 1 http://onsemi.com MARKING DIAGRAMS* 16 16 XXXXXXXXXG AWLYWW 1 SOIC--16 D SUFFIX CASE 751B 1 16 XXXX XXXX ALYWG G 16 1 TSSOP--16 DT SUFFIX CASE 948F 1 XXXX = Device Code A = Assembly Location WL, L = Wafer Lot Y = Year WW, W = Work Week G or G = Pb--Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. Publication Order Number: NB2308A/D NB2308A ÷2 REF FBK PLL ÷2 CLKA1 Extra Divider (--3, --4) MUX CLKA2 Extra Divider (--5H) CLKA3 S2 CLKA4 SELECT INPUT DECODING S1 ÷2 CLKB1 Extra Divider (--2, --3) CLKB2 CLKB3 CLKB4 Figure 1. Block Diagram (see Figures 11, 12, 13, 14 and 15 for device specific Block Diagrams) Table 1. CONFIGURATIONS Device Feedback From Bank A Frequency Bank B Frequency NB2308AI1 Bank A or Bank B Reference Reference NB2308AI1H Bank A or Bank B Reference Reference NB2308AI2 Bank A Reference Reference ÷2 NB2308AI2 Bank B 2 X Reference Reference NB2308AI3 Bank A 2 X Reference Reference or Reference (Note 1) NB2308AI3 Bank B 4 X Reference 2 X Reference NB2308AI4 Bank A or Bank B 2 X Reference 2 X Reference NB2308AI5H Bank A or Bank B Reference ÷2 Reference ÷2 1. Output phase is indeterminant (0 or 180 from input clock). If phase integrity is required, use the NB2308AI2. Table 2. SELECT INPUT DECODING S2 S1 Clock A1 -- A4 Clock B1 -- B4 Output Source 0 0 Three--state Three--state PLL Y 0 1 Driven Three--state PLL N 1 0 Driven (Note 2) Driven Reference Y 1 1 Driven Driven PLL N 2. Outputs inverted on 2308--2 and 2308--3 in bypass mode, S2 = 1 and S1 = 0. http://onsemi.com 2 PLL ShutDown NB2308A REF 1 16 FBK CLKA1 2 15 CLKA4 CLKA2 3 14 CLKA3 VDD 4 13 VDD GND 5 12 GND CLKB1 6 11 CLKB4 CLKB2 7 10 CLKB3 S2 8 9 S1 NB2308A Figure 2. Pin Configuration Table 3. PIN DESCRIPTION Pin # Pin Name Description 1 REF (Note 3) 2 CLKA1 (Note 4) Buffered clock output, Bank A. 3 CLKA2 (Note 4) Buffered clock output, Bank A. Input reference frequency, 5 V tolerant input. 4 VDD 3.3 V supply. 5 GND Ground. 6 CLKB1 (Note 4) Buffered clock output, Bank B. 7 CLKB2 (Note 4) Buffered clock output, Bank B. 8 S2 (Note 5) Select input, bit 2. 9 S1 (Note 5) Select input, bit 1. 10 CLKB3 (Note 4) Buffered clock output, Bank B. 11 CLKB4 (Note 4) Buffered clock output, Bank B. 12 GND Ground. 13 VDD 3.3 V supply. 14 CLKA3 (Note 4) Buffered clock output, Bank A. 15 CLKA4 (Note 4) Buffered clock output, Bank A. 16 FBK PLL feedback input. 3. Weak pulldown. 4. Weak pulldown on all outputs. 5. Weak pullup on these inputs. http://onsemi.com 3 NB2308A Table 4. MAXIMUM RATINGS Parameter Min Max Unit Supply Voltage to Ground Potential --0.5 +7.0 V DC Input Voltage (Except REF) --0.5 VDD + 0.5 V DC Input Voltage (REF) --0.5 7 V Storage Temperature --65 +150 C Maximum Soldering Temperature (10 sec) 260 C Junction Temperature 150 C >2000 V Static Discharge Voltage (per MIL--STD--883, Method 3015) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 5. OPERATING CONDITIONS Parameter Description Min Max Unit 3.0 3.6 V --40 0 85 70 C VDD Supply Voltage TA Operating Temperature (Ambient Temperature) CL Load Capacitance, below 100 MHz 30 pF CL Load Capacitance, from 100 MHz to 133 MHz 15 pF CIN Input Capacitance (Note 6) 7 pF Max Unit 0.8 V Industrial Commercial 6. Applies to both REF Clock and FBK. Table 6. ELECTRICAL CHARACTERISTICS VCC = 3.0 V to 3.6 V, GND = 0 V, TA = --40C to +85C Parameter Description Test Conditions Min VIL Input LOW Voltage VIH Input HIGH Voltage IIL Input LOW Current VIN = 0 V 50.0 mA IIH Input HIGH Current VIN = VDD 100.0 mA VOL Output LOW Voltage IOL = 8 mA (--1, --2, --3, --4) IOL = 12 mA (--1H, --5H) 0.4 V VOH Output HIGH Voltage IOH = --8 mA (--1, --2, --3, --4) IOH = --12 mA (--1H, --5H) IDD Supply Current (Note 7) Unloaded outputs 100 MHz REF --2, --3, --4 49 mA Select inputs at VDD or GND --1H, --5H 60 mA Unloaded outputs, 66 MHz REF (--1, --2, --3, --4) 34 mA Unloaded outputs, 33 MHz REF (--1, --2, --3, --4) 18 mA 2.0 7. Supply currents are measured for PLL--Bypass Mode (S2 = 1, S1 = 0). http://onsemi.com 4 V 2.4 V NB2308A Table 7. SWITCHING CHARACTERISTICS VCC = 3.0 V to 3.6 V, GND = 0 V, TA = --40C to +85C Parameter Description Test Conditions Min Typ Unit 100 133.3 133.3 MHz % t1 Output Frequency 30 pF load (all devices) 15 pF load (--1H, --5H) 15 pF load (--1, --2, --3, --4) t1 Duty Cycle = (t2 / t1) * 100 (all devices) Measured at 1.4 V, FOUT = < 66.66 MHz 30 pF load 40.0 50.0 60.0 Measured at 1.4 V, FOUT = < 50 MHz 15 pF load 45.0 50.0 55.0 t3 Output Rise Time (--1, --2, --3, --4) 15 15 15 Max ns Measured between 0.8 V and 2.0 V 30 pF load 2.20 Measured between 0.8 V and 2.0 V 15 pF load 1.50 Output Rise Time (--1H, --5H) Measured between 0.8 V and 2.0 V 30 pF load 1.50 Output Fall Time (--1, --2, --3, --4) Measured between 2.0 V and 0.8 V 30 pF load 2.20 Measured between 0.8 V and 2.0 V 15 pF load 1.50 Output Fall Time (--1H, --5H) Measured between 2.0 V and 0.8 V 30 pF load 1.25 Output--to--Output Skew on same Bank (--1, --2, --3, --4) All outputs equally loaded 200 Output--to--Output Skew (--1H, --5H) All outputs equally loaded 200 Output Bank A--to--Output Bank B Skew (--1, --4, --5H) All outputs equally loaded 200 Output Bank A--to--Output Bank B Skew (--2, --3) All outputs equally loaded 400 t6 Delay, REF Rising Edge to FBK Rising Edge Measured at VDD/2 0 250 ps t7 Device--to--Device Skew Measured at VDD/2 on the FBK pins of the device 0 700 ps tJ Cycle--to--Cycle Jitter (--1, --1H, --4, --5H) Measured at 66.67 MHz, loaded outputs, 15 pF load 200 ps Measured at 66.67 MHz, loaded outputs, 30 pF load 200 Measured at 133.3 MHz, loaded outputs 15 pF load 100 Measured at 66.67 MHz, loaded outputs, 30 pF load 400 Measured at 66.67 MHz, loaded outputs, 15 pF load 400 Stable power supply, valid clock presented on REF and FBK pins 1.0 t4 t5 Cycle--to--Cycle Jitter (--2, --3) tLOCK PLL Lock Time http://onsemi.com 5 ns ps ms NB2308A Zero Delay and Skew Control To close the feedback loop of the NB2308A, the FBK pin can be driven from any of the eight available output pins. The output driving the FBK pin will be driving a total load of 7 pF plus any additional load that it drives. The relative loading of this output (with respect to the remaining outputs) can adjust the input--output delay. This is shown in Figure 3. For applications requiring zero input--output delay, all outputs including the one providing feedback should be equally loaded. If input--output delay adjustments are required, use the above graph to calculate loading differences between the feedback output and remaining outputs. For zero output--output skew, be sure to load outputs equally. All outputs should be uniformly loaded to achieve Zero Delay between input and output. REF INPUT TO CLKA/CLKB DELAY (ps) 1500 1000 500 0 --500 --1000 --1500 --30 --25 --20 --15 --10 --5 0 5 10 15 20 25 30 OUTPUT LOAD DIFFERENCE: FBK LOAD -- CLKA/CLKB LOAD (pF) Figure 3. REF Input to CLKA/CLKB Delay vs. Difference in Loading between FBK Pin and CLKA/CLKB Pins SWITCHING WAVEFORMS t1 t2 1.4 V 1.4 V 2.0 V 1.4 V 0.8 V OUTPUT 0.8 V t3 Figure 4. Duty Cycle Timing OUTPUT 0V t4 Figure 5. All Outputs Rise/Fall Time 1.4 V V DD 2 INPUT 1.4 V OUTPUT 3.3 V 2.0 V V DD 2 OUTPUT t6 t5 Figure 6. Output -- Output Skew Figure 7. Input -- Output Propagation Delay V DD 2 FBK_Device 1 V DD 2 FBK_Device 2 t7 Figure 8. Device -- Device Skew http://onsemi.com 6 NB2308A TEST CIRCUITS VDD VDD 0.1 mF OUTPUTS VDD CLKOUT 0.1 mF CLOAD OUTPUTS 1 kΩ VDD 0.1 mF 1 kΩ 10 pF VDD GND 0.1 mF GND Figure 9. Test Circuit #1 GND GND Figure 10. Test Circuit #2 For parameter t8 (output slew rate) on --1H devices BLOCK DIAGRAMS FBK FBK CLKA1 CLKA1 CLKA2 CLKA2 REF PLL REF MUX PLL MUX CLKA3 CLKA3 S2 SELECT INPUT DECODING SELECT INPUT DECODING S1 CLKA4 S2 CLKA4 S1 ÷2 CLKB1 CLKB1 CLKB2 CLKB2 CLKB3 CLKB3 CLKB4 CLKB4 Figure 11. NB2308AI1 and NB2308AI1H Figure 12. NB2308AI2 http://onsemi.com 7 NB2308A BLOCK DIAGRAMS FBK FBK ÷2 CLKA1 ÷2 CLKA1 CLKA2 REF PLL CLKA2 MUX CLKA3 REF PLL MUX CLKA3 CLKA4 S2 CLKA4 S2 SELECT INPUT DECODING SELECT INPUT DECODING ÷2 S1 S1 CLKB1 CLKB1 CLKB2 CLKB2 CLKB3 CLKB3 CLKB4 CLKB4 Figure 13. NB2308AI3 Figure 14. NB2308AI4 FBK CLKA1 CLKA2 REF ÷2 PLL MUX CLKA3 CLKA4 S2 SELECT INPUT DECODING S1 CLKB1 CLKB2 CLKB3 CLKB4 Figure 15. NB2308AI5H http://onsemi.com 8 NB2308A ORDERING INFORMATION Marking Operating Range Package Shipping† NB2308AI1DG 2308AI1G Industrial & Commercial SOIC--16 (Pb--Free) 48 Units / Rail NB2308AI1DR2G 2308AI1G Industrial & Commercial SOIC--16 (Pb--Free) 2500 Tape & Reel NB2308AI1HDG 2308AI1HG Industrial & Commercial SOIC--16 (Pb--Free) 48 Units / Rail NB2308AI1HDR2G 2308AI1HG Industrial & Commercial SOIC--16 (Pb--Free) 2500 Tape & Reel NB2308AI1DTG 2308 AI1 Industrial & Commercial TSSOP--16 (Pb--Free) 96 Units / Rail NB2308AI1DTR2G 2308 AI1 Industrial & Commercial TSSOP--16 (Pb--Free) 2500 Tape & Reel NB2308AI1HDTG 2308 AI1H Industrial & Commercial TSSOP--16 (Pb--Free) 96 Units / Rail NB2308AI1HDTR2G 2308 AI1H Industrial & Commercial TSSOP--16 (Pb--Free) 2500 Tape & Reel NB2308AI2DG 2308AI2G Industrial & Commercial SOIC--16 (Pb--Free) 48 Units / Rail NB2308AI2DR2G 2308AI2G Industrial & Commercial SOIC--16 (Pb--Free) 2500 Tape & Reel NB2308AI2DTG 2308 AI2 Industrial & Commercial TSSOP--16 (Pb--Free) 96 Units / Rail NB2308AI2DTR2G 2308 AI2 Industrial & Commercial TSSOP--16 (Pb--Free) 2500 Tape & Reel NB2308AI2HDG 2308AI2HG Industrial & Commercial SOIC--16 (Pb--Free) 48 Units / Rail NB2308AI2HDR2G 2308AI2HG Industrial & Commercial SOIC--16 (Pb--Free) 2500 Tape & Reel NB2308AI2HDTG 2308 AI2H Industrial & Commercial TSSOP--16 (Pb--Free) 96 Units / Rail NB2308AI2HDTR2G 2308 AI2H Industrial & Commercial TSSOP--16 (Pb--Free) 2500 Tape & Reel NB2308AI3DG 2308AI3G Industrial & Commercial SOIC--16 (Pb--Free) 48 Units / Rail NB2308AI3DR2G 2308AI3G Industrial & Commercial SOIC--16 (Pb--Free) 2500 Tape & Reel NB2308AI3DTG 2308 AI3 Industrial & Commercial TSSOP--16 (Pb--Free) 96 Units / Rail NB2308AI3DTR2G 2308 AI3 Industrial & Commercial TSSOP--16 (Pb--Free) 2500 Tape & Reel NB2308AI4DG 2308AI4G Industrial & Commercial SOIC--16 (Pb--Free) 48 Units / Rail NB2308AI4DR2G 2308AI4G Industrial & Commercial SOIC--16 (Pb--Free) 2500 Tape & Reel NB2308AI4DTG 2308 AI4 Industrial & Commercial TSSOP--16 (Pb--Free) 96 Units / Rail NB2308AI4DTR2G 2308 AI4 Industrial & Commercial TSSOP--16 (Pb--Free) 2500 Tape & Reel Device Availability Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 9 NB2308A ORDERING INFORMATION Marking Operating Range Package Shipping† NB2308AI5HDG 2308AI5HG Industrial & Commercial SOIC--16 (Pb--Free) 48 Units / Rail NB2308AI5HDR2G 2308AI5HG Industrial & Commercial SOIC--16 (Pb--Free) 2500 Tape & Reel NB2308AI5HDTG 2308 AI5H Industrial & Commercial TSSOP--16 (Pb--Free) 96 Units / Rail NB2308AI5HDTR2G 2308 AI5H Industrial & Commercial TSSOP--16 (Pb--Free) 2500 Tape & Reel Device Availability Now Now Now Now †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 10 NB2308A PACKAGE DIMENSIONS TSSOP--16 CASE 948F--01 ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U T U M S V S S K K1 2X L/2 16 9 J1 B --U-- L SECTION N--N J PIN 1 IDENT. N 8 1 0.25 (0.010) M 0.15 (0.006) T U S A --V-- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE --W--. N F DETAIL E --W-- C 0.10 (0.004) --T-- SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 -----1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 ------ 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NB2308A PACKAGE DIMENSIONS SOIC--16 CASE 751B--05 ISSUE K --A-16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 --B-1 P 8 PL 0.25 (0.010) 8 B M S DIM A B C D F G J K M P R G R K F X 45 _ C --T-- SEATING PLANE J M D MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT 8X 6.40 16X 1.12 1 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303--675--2175 or 800--344--3860 Toll Free USA/Canada Fax: 303--675--2176 or 800--344--3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800--282--9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81--3--5773--3850 http://onsemi.com 12 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NB2308A/D