ICL3237 ® Data Sheet FN6003.3 October 21, 2005 1 Microamp Supply-Current, +3V to +5.5V, 1Mbps, RS-232 Transmitters/Receivers Features The Intersil ICL3237 contains 3.0V to 5.5V powered RS-232 transmitters/receivers which meet ElA/TIA-232 and V.28/V.24 specifications, even at VCC = 3.0V. Targeted applications are cell phones, PDAs, Palmtops, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. Efficient onchip charge pumps, coupled with manual powerdown function, reduce the standby supply current to a 1µA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 1Mbps (MBAUD = VCC) are guaranteed at worst case load conditions. This family is fully compatible with 3.3V only systems, mixed 3.3V and 5.0V systems, and 5.0V only systems. • Drop in Replacement for MAX3237 The ICL3237 is a 5 driver, 3 receiver device that also includes a noninverting always-active receiver for “wake-up” capability. Table 1 summarizes the features of the device represented by this data sheet, while Application Note AN9863 summarizes the features of each device comprising the ICL32XX 3V family. • ±15kV ESD Protected (Human Body Model) • Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V • Latch-Up Free • On-Chip Voltage Converters Require Only Four External Capacitors • Manual Powerdown Features • Flow Through Pinout • Receiver Hysteresis For Improved Noise Immunity • Pin Selectable Data Rate • Guaranteed Minimum Data Rate . . . . . . . 250kbps/1Mbps • Guaranteed Minimum Slew Rate . . . . . . . 6V/µs or 24V/µs • Wide Power Supply Range . . . . . . . Single +3V to +5.5V • Low Supply Current in Powerdown State. . . . . . . . . . .1µA • Pb-Free Plus Anneal Available (RoHS Compliant) Applications • Any System Requiring RS-232 Communication Ports - Battery Powered, Hand-Held, and Portable Equipment - Laptop Computers, Notebooks, Palmtops - Modems, Printers and other Peripherals - Digital Cameras - Cellular/Mobile Phone Related Literature • Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” • AN9863 “3V to +5.5V, 250k-1Mbps, RS-232 Transmitters/Receivers” TABLE 1. SUMMARY OF FEATURES PART NUMBER ICL3237 NO. OF NO. OF Tx. Rx. 5 3 NO. OF MONITOR Rx. (ROUTB) (NOTE 1) DATA RATE (kbps) Rx. ENABLE FUNCTION? READY OUTPUT? MANUAL POWERDOWN? AUTOMATIC POWERDOWN FUNCTION? 1 250/1000 YES NO YES NO NOTE: 1. Data rate is selectable via the MBAUD pin. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2001-2002, 2004-2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ICL3237 Pinout Ordering Information ICL3237 (SSOP) TOP VIEW PART NO. 28 C1+ C2+ 1 PART MARKING TEMP. RANGE (°C) PACKAGE PKG. DWG. # 27 V+ ICL3237CA ICL3237CA 0 to 70 28 Ld SSOP M28.209 26 VCC ICL3237CAZ (See Note) ICL3237CAZ 0 to 70 28 Ld SSOP (Pb-free) M28.209 25 C1- T1OUT 5 24 T1IN ICL3237IA ICL3237IA -40 to 85 28 Ld SSOP M28.209 T2OUT 6 23 T2IN -40 to 85 28 Ld SSOP (Pb-free) M28.209 22 T3IN ICL3237IAZ (See Note) ICL3237IAZ T3OUT 7 R1IN 8 21 R1OUT *Add “-T” suffix to part number for tape and reel packaging. R2IN 9 20 R2OUT GND 2 C2- 3 V- 4 NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 19 T4IN T4OUT 10 18 R3OUT R3IN 11 17 T5IN T5OUT 12 EN 13 16 R1OUTB SHDN 14 15 MBAUD Pin Descriptions PIN VCC FUNCTION System Power Supply Input (3.0V to 5.5V). V+ Internally Generated Positive Transmitter Supply (+5.5V). V- Internally Generated Negative Transmitter Supply (-5.5V). GND Ground Connection. C1+ External Capacitor (Voltage Doubler) is connected to this lead. C1- External Capacitor (Voltage Doubler) is connected to this lead. C2+ External Capacitor (Voltage Inverter) is connected to this lead. C2- External Capacitor (Voltage Inverter) is connected to this lead. TIN TTL/CMOS Compatible Transmitter Inputs. TOUT RS-232 level (nominally ±5.5V) transmitter outputs. RIN RS-232 Compatible Receiver Inputs. ROUT TTL/CMOS Level Receiver Outputs. ROUTB EN SHDN MBAUD TTL/CMOS Level, Noninverting, Always Enabled Receiver Output. Active Low Receiver Enable Control; doesn’t disable ROUTB output. Active Low Input to Shutdown Transmitters and On-Board Power Supply, to place device in low power mode. Input Low selects 250kbps data rate, and input high selects 1Mbps data rate. 2 ICL3237 Typical Operating Circuit ICL3237 + 0.1µF 28 C1 0.1µF + C2 0.1µF + + C3 (OPTIONAL CONNECTION, NOTE) +3.3V 25 1 3 C1+ 26 27 VCC C1C2+ V- C2T1 24 + V+ 4 C4 0.1µF + 5 T1IN T1OUT T2 23 6 T2IN T2OUT T3 22 7 T3IN T3OUT T4 19 RS-232 LEVELS 10 T4OUT T4IN T5 17 12 T5IN TTL/CMOS LOGIC LEVELS C3 0.1µF T5OUT 16 R1OUTB 21 8 R1OUT R1IN 5kΩ R1 20 9 R2OUT R2IN 5kΩ R2 18 11 R3OUT R3IN 5kΩ R3 13 VCC RS-232 LEVELS EN 14 SHDN 15 TO CONTROL LOGIC MBAUD GND 2 NOTE: THE NEGATIVE TERMINAL OF C3 CAN BE CONNECTED TO EITHER VCC OR GND. 3 ICL3237 Absolute Maximum Ratings Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V V- to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V Input Voltages TIN, EN, SHDN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V MBAUD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC+0.3V RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Resistance (Typical, Note 2) θJA (oC/W) 28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100 Moisture Sensitivity (see Technical Brief TB363) All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1 Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (Lead Tips Only) Operating Conditions Temperature Range ICL3237C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC ICL3237I. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 2. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 3V, C1 - C4 = 0.22µF; VCC = 3.15V to 5.5V, C1 - C4 = 0.1µF, Unless Otherwise Specified. Typicals are at TA = 25oC PARAMETER TEST CONDITIONS TEMP (oC) MIN TYP MAX UNITS DC CHARACTERISTICS Supply Current, Powerdown Disabled All Outputs Unloaded, VCC = 3.15V, SHDN = VCC 25 - 0.3 1.0 mA Supply Current, Powerdown SHDN = GND 25 - 1.0 10 µA LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Low TIN, EN, SHDN, MBAUD Full - - 0.8 V Input Logic Threshold High TIN, EN, SHDN, MBAUD VCC = 3.3V Full 2.0 - - V VCC = 5.0V Full 2.4 - - V 25 - 0.5 - V Transmitter Input Hysteresis Input Leakage Current TIN, EN, SHDN, MBAUD Full - ±0.01 ±1.0 µA Output Leakage Current EN = VCC (Receivers Disabled) Full - ±0.05 ±10 µA Output Voltage Low IOUT = 1.6mA Full - - 0.4 V Output Voltage High IOUT = -1.0mA Full - V VCC -0.6 VCC -0.1 RECEIVER INPUTS Input Voltage Range Full -25 - 25 V VCC = 3.3V 25 0.6 1.2 - V VCC = 5.0V 25 0.8 1.5 - V VCC = 3.3V to 5.0V 25 - 1.6 2.4 V Input Hysteresis 25 - 0.3 - V Input Resistance 25 3 5 7 kΩ Full ±5.0 ±5.4 - V Input Threshold Low Input Threshold High TRANSMITTER OUTPUTS Output Voltage Swing All Transmitter Outputs Loaded with 3kΩ to Ground 4 ICL3237 Electrical Specifications Test Conditions: VCC = 3V, C1 - C4 = 0.22µF; VCC = 3.15V to 5.5V, C1 - C4 = 0.1µF, Unless Otherwise Specified. Typicals are at TA = 25oC (Continued) TEMP (oC) MIN TYP MAX UNITS Full 300 10M - Ω Full - ±35 ±60 mA VOUT = ±12V, VCC = 0V or 3V to 5.5V, SHDN = GND Full - - ±25 µA RL = 3kΩ, One Transmitter Switching PARAMETER Output Resistance TEST CONDITIONS VCC = V+ = V- = 0V, Transmitter Output = ±2V Output Short-Circuit Current Output Leakage Current TIMING CHARACTERISTICS Maximum Data Rate Receiver Propagation Delay Receiver Input to Receiver Output, CL = 150pF CL = 1000pF MBAUD = GND Full 250 700 - kbps VCC = 3V to 4.5V, CL = 250pF MBAUD = VCC Full 1000 1700 - kbps VCC = 4.5V to 5.5V, CL = 1000pF MBAUD = VCC Full 1000 1100 - kbps tPHL 25 - 0.15 - µs tPLH 25 - 0.15 - µs Receiver Output Enable Time Normal Operation 25 - 200 - ns Receiver Output Disable Time Normal Operation 25 - 200 - ns Transmitter Skew tPHL - tPLH (Note 3) MBAUD = GND 25 - 100 ns MBAUD = VCC, VCC = 3.0V 25 - 25 ns Receiver Skew tPHL - tPLH, CL = 150pF 25 - 50 - ns Transition Region Slew Rate CL = 150pF to 1000pF MBAUD = GND VCC = 3.3V, RL = 3kΩ to 7kΩ, MBAUD = VCC Measured From 3V to -3V or -3V to 3V CL = 150pF to 2500pF MBAUD = GND 25 6 17 30 V/µs 25 24 40 150 V/µs 25 4 12 30 V/µs Human Body Model 25 - ±15 - kV IEC61000-4-2 Contact Discharge 25 - ±8 - kV IEC61000-4-2 Air Gap Discharge 25 - >±8 - kV Human Body Model 25 - ±2.5 - kV ESD PERFORMANCE RS-232 Pins (TOUT, RIN) All Other Pins NOTE: 3. Skew is measured at the input switching points (1.4V). 5 ICL3237 Detailed Description regardless of the state of any control lines. All the receivers convert RS-232 signals to CMOS output levels and accept inputs up to ±25V while presenting the required 3kΩ to 7kΩ input impedance (see Figure 1) even if the power is off (VCC = 0V). The receivers’ Schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. The ICL3237 operates from a single +3V to +5.5V supply, guarantees a 1Mbps minimum data rate, requires only four small external 0.1µF capacitors, features low power consumption, and meets all EIA/TIA-232 and V.28 specifications. The circuit is divided into three sections: The charge pump, the transmitters, and the receivers. Monitor receivers remain active even during manual powerdown and forced receiver disable, making them extremely useful for Ring Indicator monitoring. Standard receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral’s protection diodes (see Figures 2 and 3). This renders them useless for wake up functions, but the corresponding monitor receiver can be dedicated to this task as shown in Figure 3. Charge-Pump Intersil’s new ICL32XX family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate ±5.5V transmitter supplies from a VCC supply as low as 3.0V. This allows these devices to maintain RS-232 compliant output levels over the ±10% tolerance range of 3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1µF capacitors for the voltage doubler and inverter functions at VCC = 3.3V. See the “Capacitor Selection” section, and Table 3 for capacitor recommendations for other operating conditions. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings. VCC RXOUT RXIN -25V ≤ VRIN ≤ +25V GND ≤ VROUT ≤ VCC 5kΩ GND FIGURE 1. INVERTING RECEIVER CONNECTIONS Transmitters Powerdown Functionality The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip ±5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages. This 3V device requires a nominal supply current of 0.3mA during normal operation (not in powerdown mode). This is considerably less than the 5mA to 11mA current required of 5V RS-232 devices. The already low current requirement drops significantly when the device enters powerdown mode. In powerdown, supply current drops to 1µA, because the on-chip charge pump turns off (V+ collapses to VCC, Vcollapses to GND), and the transmitter outputs three-state. This micro-power mode makes the ICL3237 ideal for battery powered and portable applications. All transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (see Table 2). These outputs may be driven to ±12V when disabled. The ICL3237 guarantees a 1Mbps data rate (if MBAUD = 1) for full load conditions (3kΩ and 250pF), VCC ≥ 3.0V, with one transmitter operating at full speed. Under more typical conditions of VCC ≥ 3.3V, C1-4 = 0.1µF, RL = 3kΩ, and CL = 250pF, one transmitter easily operates at 1.7Mbps. Software Controlled (Manual) Powerdown On the ICL3237, the powerdown control is via a simple shutdown (SHDN) pin. Driving this pin high enables normal operation, while driving it low forces the IC into it’s powerdown state. Connect SHDN to VCC if the powerdown function isn’t needed. Note that all the receiver outputs remain enabled during shutdown (see Table 2). For the lowest power consumption during powerdown, the receivers should also be disabled by driving the EN input high (see next section, and Figures 2 and 3). The time required to exit powerdown, and resume transmission is only 100µs. Transmitter inputs float if left unconnected, and may cause ICC increases. Connect unused inputs to GND for the best performance. Receivers The ICL3237 device contains standard inverting receivers that three-state only when the EN control line is driven high. Additionally, it includes a noninverting (monitor) receiver (denoted by the ROUTB label) that is always active, TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE SHDN INPUT EN INPUT TRANSMITTER OUTPUTS RECEIVER OUTPUTS ROUTB OUTPUT L L High-Z Active Active Manual Powerdown L H High-Z High-Z Active Manual Powerdown w/Rcvr. Disabled H L Active Active Active Normal Operation H H Active High-Z Active Normal Operation w/Rcvr. Disabled 6 MODE OF OPERATION ICL3237 Receiver ENABLE Control This device also features an EN input to control the receiver outputs. Driving EN high disables all the inverting (standard) receiver outputs placing them in a high impedance state. This is useful to eliminate supply current, due to a receiver output forward biasing the protection diode, when driving the input of a powered down (VCC = GND) peripheral (see Figure 2). The enable input has no effect on transmitter nor monitor (ROUTB) outputs. VCC CURRENT FLOW VOUT = VCC Rx POWERED DOWN UART When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-. Tx SHDN = GND GND OLD RS-232 CHIP FIGURE 2. POWER DRAIN THROUGH POWERED DOWN PERIPHERAL VCC TRANSITION DETECTOR TO WAKE-UP LOGIC ICL3237 R1OUTB POWERED DOWN UART VOUT = HI-Z R1OUT TX TABLE 3. REQUIRED CAPACITOR VALUES VCC (V) C1 (µF) C2, C3, C4 (µF) 3.0 to 3.6 0.22 0.22 3.15 to 3.6 0.1 0.1 4.5 to 5.5 0.047 0.33 3.0 to 5.5 0.22 1.0 Power Supply Decoupling VCC RX Capacitor Selection The charge pumps require 0.1µF capacitors for 3.3V operation. For other supply voltages refer to Table 3 for capacitor values. Do not use values smaller than those listed in Table 3. Increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without increasing C1’s value, however, do not increase C1 without also increasing C2, C3, and C4 to maintain the proper ratios (C1 to the other capacitors). VCC VCC For higher speed serial communications, the ICL3237 features MegaBaud operation. In MegaBaud operating mode (MBAUD = VCC), the ICL3237 transmitters guarantee a 1Mbps data rate with worst-case loads of 3kΩ in parallel with 250pF for 3.0V < VCC < 4.5V. For 5V ±10% operation, the ICL3237 transmitters guarantee a 1Mbps data rate into worst-case loads of 3kΩ in parallel with 1000pF. R1IN In most circumstances a 0.1µF bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitor C1. Connect the bypass capacitor as close as possible to the IC. T1IN T1OUT SHDN = GND, EN = VCC FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN MegaBaud Selection In normal operating mode (MBAUD = GND), the ICL3237 transmitters guarantee a 250kbps data rate with worst-case loads of 3kΩ in parallel with 1000pF. This provides compatibility with PC-to-PC communication software, such as Laplink™. 7 Transmitter Outputs when Exiting Powerdown Figure 4 shows the response of two transmitter outputs when exiting powerdown mode. As they activate, the two transmitter outputs properly go to opposite RS-232 levels, with no glitching, ringing, nor undesirable transients. Each transmitter is loaded with 3kΩ in parallel with 2500pF. Note that the transmitters enable only when the magnitude of the supplies exceed approximately 3V. High Data Rates The ICL3237 maintains the RS-232 ±5V minimum transmitter output voltages even at high data rates. Figure 5 Laplink® is a registered trademark of Traveling Software. ICL3237 details a transmitter loopback test circuit, and Figure 6 illustrates the standard speed loopback test result for a single transmitter driving 1000pF and an RS-232 load at 250kbps. Figure 7 shows the megabaud loopback results for a single transmitter driving 250pF and an RS-232 load at 1Mbps. The static transmitters were also loaded with an RS-232 receiver. 5V/DIV. MBAUD = GND T1IN T1OUT 5V/DIV. SHDN T1 R1OUT VCC = +3.3V C1 - C4 = 0.1µF 2V/DIV. 2µs/DIV. FIGURE 6. LOOPBACK TEST AT 250kbps (CL = 1000pF) T2 5V/DIV. MBAUD = VCC VCC = +3.3V C1 - C4 = 0.1µF T1IN TIME (20µs/DIV.) FIGURE 4. TRANSMITTER OUTPUTS WHEN EXITING POWERDOWN T1OUT VCC + 0.1µF R1OUT + C1+ VCC V+ C1 C1- + C3 VCC = +3.3V C1 - C4 = 0.1µF 0.5µs/DIV. ICL3237 + V- C2+ C2 C4 + FIGURE 7. LOOPBACK TEST AT 1Mbps (CL = 250pF) C2TIN RIN ROUT EN VCC Interconnection with 3V and 5V Logic TOUT CL The ICL3237 directly interfaces with most 5V logic families, including ACT and HCT CMOS. See Table 4 for more information on possible combinations of interconnections. 5K SHDN MBAUD GND or VCC FIGURE 5. TRANSMITTER LOOPBACK TEST CIRCUIT 8 TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS SUPPLY VOLTAGES SYSTEM POWER-SUPPLY VOLTAGE (V) VCC SUPPLY VOLTAGE (V) 3.3 3.3 5 5 5 3.3 COMPATIBILITY Compatible with all CMOS families. Compatible with all TTL and CMOS logic families. Compatible with ACT and HCT CMOS, and with TTL. Incompatible with AC, HC, or CD4000 CMOS. ICL3237 Typical Performance Curves VCC = 3.3V, TA = 25oC 6 TRANSMITTER OUTPUT VOLTAGE (V) TRANSMITTER OUTPUT VOLTAGE (V) 6 VOUT+ 4 2 1 TRANSMITTER AT 250kbps OTHER TRANSMITTERS AT 30kbps 0 MBAUD = GND -2 VOUT - -4 -6 VOUT+ 4 2 1 TRANSMITTER AT 1Mbps OTHER TRANSMITTERS AT 30kbps 0 MBAUD = VCC -2 VOUT -4 -6 0 1000 2000 3000 4000 5000 0 1000 2000 LOAD CAPACITANCE (pF) 3000 4000 FIGURE 8. LOW SPEED TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE FIGURE 9. HIGH SPEED TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE 90 25 MBAUD = GND MBAUD = VCC 70 SLEW RATE (V/µs) 20 SLEW RATE (V/µs) 5000 LOAD CAPACITANCE (pF) +SLEW 15 -SLEW 10 +SLEW 50 30 -SLEW -SLEW 10 0 5 0 1000 2000 3000 4000 0 5000 1000 FIGURE 10. LOW SPEED SLEW RATE vs LOAD CAPACITANCE 3000 4000 5000 FIGURE 11. HIGH SPEED SLEW RATE vs LOAD CAPACITANCE 90 55 MBAUD = VCC MBAUD = GND 1Mbps 80 45 SUPPLY CURRENT (mA) 50 SUPPLY CURRENT (mA) 2000 LOAD CAPACITANCE (pF) LOAD CAPACITANCE (pF) 250kbps 40 120kbps 35 30 25 70 60 50 250kbps 40 120kbps 30 20kbps 20 20 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF) FIGURE 12. LOW SPEED SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA 9 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF) FIGURE 13. HIGH SPEED SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA ICL3237 Typical Performance Curves VCC = 3.3V, TA = 25oC (Continued) 3.5 NO LOAD ALL OUTPUTS STATIC SUPPLY CURRENT (mA) 3.0 2.5 2.0 1.5 1.0 0.5 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) FIGURE 14. SUPPLY CURRENT vs SUPPLY VOLTAGE Die Characteristics SUBSTRATE POTENTIAL (POWERED UP) GND TRANSISTOR COUNT 619 PROCESS Si Gate CMOS 10 6.0 ICL3237 Shrink Small Outline Plastic Packages (SSOP) M28.209 (JEDEC MO-150-AH ISSUE B) N 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M 2 GAUGE PLANE 3 0.25 0.010 SEATING PLANE -A- INCHES E -B- 1 B M L A D -C- α e B C 0.10(0.004) 0.25(0.010) M C A M SYMBOL MIN MAX MIN MAX NOTES A - 0.078 - 2.00 - A1 0.002 - 0.05 - - A2 0.065 0.072 1.65 1.85 - B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.390 0.413 9.90 10.50 3 E 0.197 0.220 5.00 5.60 4 e A2 A1 B S NOTES: MILLIMETERS 0.026 BSC H 0.292 L 0.022 N α 0.65 BSC 0.322 7.40 0.037 0.55 28 0° - 0.95 6 28 8° 0° - 8.20 7 8° 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. Rev. 2 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11