ON FW344A Power mosfet Datasheet

Ordering number : EN8998C
FW344A
Power MOSFET
http://onsemi.com
30V, 4.5A, 64mΩ, –30V, –3.5A, 102mΩ, Complementary Dual SOIC8
Features
•
•
•
•
ON-resistance Nch : RDS(on)1=49mΩ(typ.)
Pch : RDS(on)1=78mΩ(typ.)
4V drive
Halogen free compliance
Nch+Pch MOSFET
Specifications
Absolute Maximum Ratings at Ta=25°C
Parameter
Symbol
Drain-to-Source Voltage
Conditions
N-channel
VDSS
VGSS
Gate-to-Source Voltage
Drain Current (DC)
P-channel
Unit
30
--30
V
±20
±20
V
ID
IDP
4.5
--3.5
A
Drain Current (PW≤10μs)
Duty cycle≤1%
5
--4
A
Drain Current (PW≤10μs)
IDP
Duty cycle≤1%
18
--14
Allowable Power Dissipation
When mounted on ceramic substrate (2000mm2×0.8mm) 1unit
Total Dissipation
PD
PT
1.7
W
Channel Temperature
Tch
150
°C
Storage Temperature
Tstg
--55 to +150
°C
1.4
When mounted on ceramic substrate (2000mm2×0.8mm)
A
W
This product is designed to “ESD immunity < 200V*”, so please take care when handling.
* Machine Model
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Package Dimensions
Product & Package Information
unit : mm (typ)
7072-001
• Package
: SOIC8
• JEITA, JEDEC
: SC-87, SOT-96
• Minimum Packing Quantity : 2,500 pcs./reel
FW344A-TL-2W
4.9
0.375
1
4
0.445
0.254 (GAGE PLANE)
0.175
1.55
1.375
1.27
Semiconductor Components Industries, LLC, 2013
July, 2013
0.715
0.22
5
3.9
6.0
8
1 : Source1
2 : Gate1
3 : Source2
4 : Gate2
5 : Drain2
6 : Drain2
7 : Drain1
8 : Drain1
Packing Type : TL
Marking
FW344
A LOT No.
TL
Electrical Connection
8
7
6
5
1
2
3
4
SOIC8
91212 TKIM/62712 TKIM/31412 TKIM/22212PA TKIM TC-00002693 No.8998-1/9
FW344A
Electrical Characteristics at Ta=25°C
Parameter
Symbol
Conditions
Ratings
min
typ
Unit
max
[N-channel]
Drain-to-Source Breakdown Voltage
Zero-Gate Voltage Drain Current
Gate-to-Source Leakage Current
Cutoff Voltage
Forward Transfer Admittance
Static Drain-to-Source On-State Resistance
V(BR)DSS
IDSS
ID=1mA, VGS=0V
VDS=30V, VGS=0V
IGSS
VGS(off)
| yfs |
VGS=±16V, VDS=0V
VDS=10V, ID=1mA
VDS=10V, ID=4.5A
2.6
RDS(on)1
ID=4.5A, VGS=10V
49
64
mΩ
RDS(on)2
ID=2A, VGS=4.5V
80
112
mΩ
RDS(on)3
ID=2A, VGS=4V
100
140
mΩ
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Turn-ON Delay Time
Rise Time
Turn-OFF Delay Time
30
V
1.2
1
μA
±10
μA
2.6
V
S
280
pF
60
pF
Crss
30
pF
td(on)
tr
6
ns
21
ns
20
ns
Fall Time
td(off)
tf
Total Gate Charge
Qg
VDS=10V, f=1MHz
See specified Test Circuit.
Gate-to-Source Charge
Qgs
Gate-to-Drain “Miller” Charge
Qgd
Diode Forward Voltage
VSD
IS=4.5A, VGS=0V
V(BR)DSS
IDSS
IGSS
ID=--1mA, VGS=0V
VDS=10V, VGS=10V, ID=4.5A
10
ns
5.6
nC
1.2
nC
0.8
0.85
nC
1.2
V
--1
μA
±10
μA
[P-channel]
Drain-to-Source Breakdown Voltage
Zero-Gate Voltage Drain Current
Gate-to-Source Leakage Current
Cutoff Voltage
Forward Transfer Admittance
VGS(off)
| yfs |
--1.2
--2.3
V
ID=--3.5A, VGS=--10V
ID=--2A, VGS=--4.5V
78
102
mΩ
RDS(on)2
125
175
mΩ
RDS(on)3
ID=--2A, VGS=--4V
145
205
mΩ
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Turn-ON Delay Time
Turn-OFF Delay Time
VGS=±16V, VDS=0V
VDS=--10V, ID=--1mA
3.9
Input Capacitance
Rise Time
V
VDS=--10V, ID=--3.5A
RDS(on)1
Static Drain-to-Source On-State Resistance
--30
VDS=--30V, VGS=0V
S
250
pF
65
pF
Crss
46
pF
td(on)
tr
5.4
ns
34
ns
28
ns
Fall Time
td(off)
tf
Total Gate Charge
Qg
Gate-to-Source Charge
Qgs
Gate-to-Drain “Miller” Charge
Qgd
Diode Forward Voltage
VSD
VDS=--10V, f=1MHz
See specified Test Circuit.
VDS=--10V, VGS=--10V, ID=--3.5A
24
ns
5
nC
1
nC
1.2
IS=--3.5A, VGS=0V
--0.88
nC
--1.5
V
No.8998-2/9
FW344A
Switching Time Test Circuit
[N-channel]
10V
0V
[P-channel]
VDD=15V
VIN
0V
--10V
ID=4.5A
RL=3.3Ω
VIN
D
PW=10μs
D.C.≤1%
VDD= --15V
VIN
VOUT
D
PW=10μs
D.C.≤1%
G
VOUT
G
FW344A
P.G
ID= --3.5A
RL=4.3Ω
VIN
50Ω
FW344A
P.G
S
50Ω
S
Ordering Information
Device
FW344A-TL-2W
Shipping
memo
SOIC8
2,500pcs./reel
Pb Free and Halogen Free
ID -- VDS
V
7
VGS=3.0V
1.5
3
1.0
2
0.5
1
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Drain-to-Source Voltage, VDS -- V
RDS(on) -- VGS
0.9
200
150
100
50
0
2
4
6
8
Gate-to-Source Voltage, VGS -- V
0.5
10
IT16699
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Gate-to-Source Voltage, VGS -- V
[Nch]
Ta=25°C
4.5A
0
0
IT16697
ID=2.0A
250
0
1.0
5.0
IT16698
RDS(on) -- Ta
200
Static Drain-to-Source
On-State Resistance, RDS(on) -- mΩ
300
Static Drain-to-Source
On-State Resistance, RDS(on) -- mΩ
4
Ta=
75°
--2
C
5°C
2.0
5
°C
2.5
6
25
3.0
[Nch]
VDS=10V
8
Drain Current, ID -- A
3.5
ID -- VGS
9
4.0
4.0
[Nch]
6.0V
10.0V 8.0V
4.5V
4.5
Drain Current, ID -- A
Package
[Nch]
150
2.0A
, I D=
4.0V
=
VGS
2.0A
,I =
4.5V D
=
VGS
A
I =4.5
0.0V, D
1
=
V GS
100
50
0
--60
--40
--20
0
20
40
60
80
100
Ambient Temperature, Ta -- °C
120
140
160
IT16700
No.8998-3/9
FW344A
5
3
C
25°
2
5°C
1.0
=
Ta
7
--2
5
°C
75
3
0.1
0.01
2
3
5 7 0.1
2
3
5 7 1.0
2
3
SW Time -- ID
100
0.1
7
5
3
td(off)
2
10
tf
td(on)
7
5
tr
3
0
0.2
0.4
0.6
0.8
1.0
1.2
IT16702
Ciss, Coss, Crss -- VDS
1000
[Nch]
f=1MHz
7
5
Ciss, Coss, Crss -- pF
Ciss
3
2
100
7
Coss
5
Crss
3
2
2
5
7
2
1.0
3
5
Drain Current, ID -- A
VGS -- Qg
10
10
7
10
IT16703
[Nch]
Drain Current, ID -- A
6
5
4
3
2
1
2
3
5
4
Total Gate Charge, Qg -- nC
--3.0V
--1.5
--1.0
--0.5
VGS= --2.5V
--0.1
--0.2
--0.3
--0.4
--0.5
op
er
ati
on
Operation in this
area is limited by RDS(on).
Ta=25°C
Single pulse
1unit
When mounted on ceramic substrate (2000mm2×0.8mm)
0.1
7
5
3
2
2 3
5 7 0.1
2 3
5 7 1.0
2 3
5 7 10
2 3
ID -- VGS
--7
5 7 100
IT16749
[Pch]
--6
--2.0
0
DC
1.0
7
5
3
2
VDS= --10V
--10
.
--2.5
0μ
1m s
10 s
10 ms
0m
s
10
s
Drain-to-Source Voltage, VDS -- V
[Pch]
--6.
0V
--4
.5V
--4
.0V
0V --8.0V
--3.0
[Nch]
10
ID=4.5A
IT16705
ID -- VDS
--3.5
30
IT16704
IDP=18A (PW≤10μs)
10
7
5
3
2
0.01
0.01
6
Drain Current, ID -- A
1
0
20
ASO
100
7
5
3
2
8
7
10
Drain-to-Source Voltage, VDS -- V
VDS=10V
ID=4.5A
9
0
--0.6
--0.7
--0.8
Drain-to-Source Voltage, VDS -- V
--0.9
--1.0
IT16750
--5
--4
--3
--2
--1
0
0
--0.5
--1.0
--1.5
--2.0
--2
Ta=
5°
75°
C
C
3
°C
2
25
Switching Time, SW Time -- ns
5
1.0
0.1
Gate-to-Source Voltage, VGS -- V
3
2
Diode Forward Voltage, VSD -- V
[Nch]
VDD=15V
VGS=10V
7
Drain Current, ID -- A
1.0
7
5
0.01
5 7 10
IT16701
Drain Current, ID -- A
0
3
2
3
2
2
0
[Nch]
VGS=0V
5°C
25°C
--25°
C
7
IS -- VSD
10
7
5
Source Current, IS -- A
Forward Transfer Admittance, | yfs | -- S
[Nch]
VDS=10V
Ta=
7
| yfs | -- ID
10
--2.5
--3.0
Gate-to-Source Voltage, VGS -- V
--3.5
--4.0
IT16751
No.8998-4/9
FW344A
ID= --2A
--3.5A
200
150
100
50
0
0
--2
--4
--6
--8
Gate-to-Source Voltage, VGS -- V
3
2
C
5°
--2
=
°C
Ta
75
7
5
°C
25
3
0.1
--0.01
2
3
5 7 --0.1
2
3
5 7 --1.0
2
3
SW Time -- ID
100
--40
--20
0
20
40
60
80
100
120
140
160
IT16753
IS -- VSD
[Pch]
VGS=0V
3
2
--1.0
7
5
3
2
--0.1
7
5
5
3
tf
2
10
7
td(on)
5
tr
3
--0.2
--0.4
--0.6
--0.8
--1.0
--1.2
IT16755
Ciss, Coss, Crss -- VDS
1000
[Pch]
f=1MHz
7
5
3
Ciss, Coss, Crss -- pF
td(off)
0
Diode Forward Voltage, VSD -- V
[Pch]
VDD= --15V
VGS= --10V
7
Switching Time, SW Time -- ns
50
--0.01
5 7 --10
IT16754
Drain Current, ID -- A
Ciss
2
100
7
Coss
5
Crss
3
2
2
1.0
--0.1
2
3
5
7
--1.0
2
3
5
Drain Current, ID -- A
7
[Pch]
VDS= --10V
ID= --3.5A
--9
10
--10
--7
--6
--5
--4
--3
--2
--1
1
2
3
4
Total Gate Charge, Qg -- nC
--5
5
6
IT16757
--10
--15
--20
--25
Drain-to-Source Voltage, VDS -- V
--100
7
5
3
2
Drain Current, ID -- A
--8
0
0
IT16756
VGS -- Qg
--10
Gate-to-Source Voltage, VGS -- V
A
--3.5
V, I D=
--10.0
V GS=
3
2
2
0
.0A
= --2
V, I D
--4.5
=
VGS
100
--10
7
5
Source Current, IS -- A
Forward Transfer Admittance, | yfs | -- S
[Pch]
5
1.0
= -VGS
150
Ambient Temperature, Ta -- °C
VDS= --10V
7
.0A
= --2
, ID
4.0V
IT16752
| yfs | -- ID
10
200
0
--60
--10
[Pch]
250
Ta=7
5°C
25°C
250
RDS(on) -- Ta
300
Static Drain-to-Source
On-State Resistance, RDS(on) -- mΩ
Static Drain-to-Source
On-State Resistance, RDS(on) -- mΩ
[Pch]
Ta=25°C
--25°C
RDS(on) -- VGS
300
--10
7
5
3
2
ASO
[Pch]
IDP= --14A(PW≤10μs)
100
μs
1
10 ms
ms
10
0m
s
ID= --3.5A
DC
--1.0
7
5
3
2
--0.1
7
5
3
2
--30
IT13192
10
s
op
era
Operation in this area tion
is limited by RDS(on).
Ta=25°C
Single pulse
1unit
When mounted on ceramic substrate (2000mm2×0.8mm)
--0.01
--0.01 2 3
5 7--0.1
2 3
5 7--1.0
2 3
5 7--10
2 3
Drain-to-Source Voltage, VDS -- V
5 7--100
IT16758
No.8998-5/9
FW344A
PD -- Ta
[Nch/Pch]
1.7
1.5
1.4
To
t
al
1.0
Di
ss
1u
ip
nit
ati
on
0.5
0
0
20
40
60
80
100
120
140
Ambient Temperature, Ta -- °C
PD (FET1) -- PD (FET2)
1.6
When mounted on ceramic substrate
(2000mm2×0.8mm)
Allowable Power Dissipation (FET1), PD -- W
Allowable Power Dissipation, PD -- W
2.0
When mounted on ceramic substrate
(2000mm2×0.8mm)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
160
0
0.2
0.4
0.6
0.8
1.0
1.2
Allowable Power Dissipation (FET1), PD -- W
IT16759
1.4
1.6
IT16760
Taping Specification
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No.8998-7/9
FW344A
Outline Drawing
FW344A-TL-2W
Land Pattern Example
Mass (g) Unit
0.082 mm
* For reference
Unit: mm
5.60
1.75
0.65
1.27
No.8998-8/9
FW344A
Note on usage : Since the FW344A is a MOSFET product, please avoid using this device in the vicinity of
highly charged objects.
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PS No.8998-9/9
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