TI INA199A1RSWT Voltage output, high or low side measurement, bi-directional zerã¸-drift series current shunt monitor Datasheet

QFN
Package
INA199A1
INA199A2
INA199A3
SC70
Package
www.ti.com
SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
Voltage Output, High or Low Side Measurement, Bi-Directional Zerø-Drift Series
CURRENT SHUNT MONITOR
Check for Samples: INA199A1, INA199A2, INA199A3
FEATURES
DESCRIPTION
•
•
The INA199Ax series of voltage output current shunt
monitors can sense drops across shunts at
common-mode voltages from –0.3V to 26V,
independent of the supply voltage. Three fixed gains
are available: 50V/V, 100V/V, and 200V/V. The low
offset of the Zerø-Drift architecture enables current
sensing with maximum drops across the shunt as low
as 10mV full-scale.
1
2
•
•
•
•
WIDE COMMON-MODE RANGE: –0.3V to 26V
OFFSET VOLTAGE: ±150mV (Max)
(Enables shunt drops of 10mV full-scale)
ACCURACY
– ±1.5% Gain Error (Max over temperature)
– 0.5mV/°C Offset Drift (Max)
– 10ppm/°C Gain Drift (Max)
CHOICE OF GAINS:
– INA199A1: 50V/V
– INA199A2: 100V/V
– INA199A3: 200V/V
QUIESCENT CURRENT: 100mA (max)
PACKAGES: SC70, THIN QFN-10
These devices operate from a single +2.7V to +26V
power supply, drawing a maximum of 100mA of
supply current. All versions are specified from –40°C
to +105°C, and offered in both SC70 and thin
QFN-10 packages.
PRODUCT FAMILY TABLE
APPLICATIONS
•
•
•
•
•
•
NOTEBOOK COMPUTERS
CELL PHONES
TELECOM EQUIPMENT
POWER MANAGEMENT
BATTERY CHARGERS
WELDING EQUIPMENT
GAIN
R3 AND R4
R1 AND R2
INA199A1
50
20kΩ
1MΩ
INA199A2
100
10kΩ
1MΩ
INA199A3
200
5kΩ
1MΩ
RSHUNT
Supply
Reference
Voltage
REF
GND
+2.7V to +26V
PRODUCT
INA199Ax
OUT
R1
R3
R2
R4
Load
Output
IN-
IN+
V+
CBYPASS
0.01mF
to
0.1mF
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2010, Texas Instruments Incorporated
INA199A1
INA199A2
INA199A3
SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION (1)
PRODUCT
GAIN
INA199A1
50V/V
INA199A2
100V/V
INA199A3
(1)
200V/V
PACKAGE-LEAD
PACKAGE
DESIGNATOR
PACKAGE MARKING
OBG
SC70-6
DCK
Thin QFN-10
RSW
NSJ
SC70-6
DCK
OBH
Thin QFN-10
RSW
NTJ
SC70-6
DCK
OBI
Thin QFN-10
RSW
NUJ
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range, unless otherwise noted.
INA199A1, INA199A2, INA199A3
UNIT
Supply Voltage
Analog Inputs,
VIN+, VIN– (2)
Differential (VIN+) – (VIN–)
Common-mode (3)
REF Input
Output
(3)
+26
V
–26 to +26
V
GND – 0.3 to +26
V
GND – 0.3 to (V+) + 0.3
V
GND – 0.3 to (V+) + 0.3
V
5
mA
Operating Temperature
–40 to +125
°C
Storage Temperature
–65 to +150
°C
Junction Temperature
+150
°C
Human Body Model (HBM)
4000
V
Charged-Device Model (CDM)
1000
V
Machine Model (MM)
200
V
Input Current Into All Pins (3)
ESD Ratings:
(1)
(2)
(3)
2
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.
Input voltage at any pin may exceed the voltage shown if the current at that pin is limited to 5mA.
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): INA199A1 INA199A2 INA199A3
INA199A1
INA199A2
INA199A3
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SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA = –40°C to +105°C.
At TA = +25°C, VS = +5V, VIN+ = 12V, VSENSE = VIN+ – VIN–, and VREF = VS/2, unless otherwise noted.
INA199A1, INA199A2, INA199A3
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
INPUT
Common-Mode Input Range
Common-Mode Rejection
Offset Voltage, RTI (1)
VCM
VIN+ = 0V to +26V, VSENSE = 0mV
VOS
VSENSE = 0mV
vs Temperature
dVOS/dT
vs Power Supply
PSR
Input Bias Current
–0.3
CMR
100
VS = +2.7V to +18V, VIN+ = +18V,
VSENSE = 0mV
26
120
V
dB
±5
±150
mV
0.1
0.5
mV/°C
±0.1
mV/V
IB
VSENSE = 0mV
28
mA
IOS
VSENSE = 0mV
±0.02
mA
INA199A1
50
V/V
INA199A2
100
V/V
INA199A3
200
Input Offset Current
OUTPUT
Gain
G
Gain Error
VSENSE = –5mV to 5mV
vs Temperature
V/V
±0.03
±1.5
%
3
10
ppm/°C
Nonlinearity Error
VSENSE = –5mV to 5mV
±0.01
%
Maximum Capacitive Load
No Sustained Oscillation
1
nF
VOLTAGE OUTPUT (2)
RL = 10kΩ to GND
Swing to V+ Power-Supply Rail
Swing to GND
(V+) – 0.05
(V+) – 0.2
V
(VGND) + 0.005
(VGND) + 0.05
V
FREQUENCY RESPONSE
Bandwidth
GBW
Slew Rate
SR
CLOAD = 10pF
14
kHz
0.4
V/ms
25
nV/√Hz
NOISE, RTI (1)
Voltage Noise Density
POWER SUPPLY
Operating Voltage Range
VS
–20°C to +85°C
Quiescent Current
IQ
+2.7
+26
V
+2.5
+26
V
VSENSE = 0mV
65
Over Temperature
100
mA
115
mA
TEMPERATURE RANGE
Specified Range
–40
+105
°C
Operating Range
–40
+125
°C
Thermal Resistance
q JA
SC70
(1)
(2)
250
°C/W
RTI = Referred-to-input.
See Typical Characteristic curve, Output Voltage Swing vs Output Current (Figure 6).
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): INA199A1 INA199A2 INA199A3
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INA199A1
INA199A2
INA199A3
SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
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PIN CONFIGURATIONS
DCK PACKAGE
SC70-6
(TOP VIEW)
RSW PACKAGE
Thin QFN-10
(TOP VIEW)
NC
REF
1
6
OUT
GND
2
5
IN-
V+
3
4
IN+
REF
8
GND
9
OUT
10
7
4
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V+
6
1
NC
(1)
(1)
(1)
2
5
IN-
4
IN-
3
IN+
IN+
NC = no connection.
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): INA199A1 INA199A2 INA199A3
INA199A1
INA199A2
INA199A3
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SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
TYPICAL CHARACTERISTICS
Performance measured with the INA199A3 at TA = +25°C, VS = +5V, VIN+ = 12V, and VREF = VS/2, unless otherwise noted.
COMMON-MODE REJECTION RATIO
vs TEMPERATURE
20
1.0
15
0.8
0.6
10
CMRR (mV/V)
Offset Voltage (mV)
OFFSET VOLTAGE
vs TEMPERATURE
5
0
-5
0.4
0.2
0
-0.2
-0.4
-10
-0.6
-15
-0.8
-20
-50
-25
0
25
50
75
100
-1.0
-50
125
0
-25
25
100
125
Figure 2.
GAIN
vs FREQUENCY
POWER-SUPPLY REJECTION RATIO
vs FREQUENCY
160
60
140
INA199A3
120
|PSRR| (dB)
50
Gain (dB)
75
Figure 1.
70
40
30
INA199A1
INA199A2
20
100
80
60
VS = +5V + 250mV Sine Disturbance
VCM = 0V
VDIF = Shorted
VREF = 2.5V
40
10
VCM = 0V
VDIF = 15mVPP Sine
0
-10
10
100
20
0
1k
10k
100k
1M
10M
1
10
100
Figure 4.
COMMON-MODE REJECTION RATIO
vs FREQUENCY
OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT
Output Voltage Swing (V)
140
120
100
80
60
VS = +5V
VCM = 1V Sine
VDIF = Shorted
VREF = 2.5V
20
0
1
10k
Figure 3.
160
40
1k
10
100
1k
100k
Frequency (Hz)
Frequency (Hz)
|CMRR| (dB)
50
Temperature (°C)
Temperature (°C)
10k
100k
1M
V+
(V+) - 0.5
(V+) - 1.0
(V+) - 1.5
(V+) - 2.0
(V+) - 2.5
(V+) - 3.0
VS = 5V to 26V
VS = 2.7V
to 26V
VS = 2.7V
GND + 3.0
GND + 2.5
GND + 2.0
GND + 1.5
GND + 1.0
GND + 0.5
GND
TA = -40°C
TA = +25°C
TA = +105°C
VS = 2.7V to 26V
0
5
10
Frequency (Hz)
Figure 5.
15
20
25
30
35
40
Output Current (mA)
Figure 6.
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Product Folder Link(s): INA199A1 INA199A2 INA199A3
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INA199A1
INA199A2
INA199A3
SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
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TYPICAL CHARACTERISTICS (continued)
Performance measured with the INA199A3 at TA = +25°C, VS = +5V, VIN+ = 12V, and VREF = VS/2, unless otherwise noted.
INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE
with SUPPLY VOLTAGE = +5V
50
V+
(V+) - 0.25
(V+) - 0.50
(V+) - 0.75
(V+) - 1.00
(V+) - 1.25
(V+) - 1.50
+25°C
40
-20°C
Input Bias Current (mA)
Output Voltage (V)
OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT
(VS = 2.5V)
+85°C
GND + 1.50
GND + 1.25
GND + 1.00
GND + 0.75
GND + 0.50
GND + 0.25
GND
+85°C
+25°C
IB+, IB-, VREF = 0V
30
20
IB+, IB-, VREF = 2.5V
10
0
-20°C
-10
0
2
4
5
8
10
12
14
18
16
0
5
10
15
20
25
30
Common-Mode Voltage (V)
Output Current (mA)
Figure 7.
Figure 8.
INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE
with SUPPLY VOLTAGE = 0V (Shutdown)
INPUT BIAS CURRENT
vs TEMPERATURE
30
30
20
Input Bias Current (mA)
Input Bias Current (mA)
25
IB+, VREF = 2.5V
15
10
5
IB+, IB-, VREF = 0V
and
IB-, VREF = 2.5V
0
5
10
15
28
27
26
25
-50
-5
0
29
20
25
30
-25
0
Common-Mode Voltage (V)
INPUT-REFERRED VOLTAGE NOISE
vs FREQUENCY
Input-Referred Voltage Noise (nV/ÖHz)
Quiescent Current (mA)
100
QUIESCENT CURRENT
vs TEMPERATURE
66
64
62
INA199A1
25
50
75
100
125
VS = ±2.5V
VREF = 0V
VIN-, VIN+ = 0V
10
100
1k
10k
100k
Frequency (Hz)
Figure 11.
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INA199A3
INA199A2
10
1
0
125
100
Temperature (°C)
6
75
Figure 10.
68
-25
50
Figure 9.
70
60
-50
25
Temperature (°C)
Figure 12.
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): INA199A1 INA199A2 INA199A3
INA199A1
INA199A2
INA199A3
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SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
TYPICAL CHARACTERISTICS (continued)
Performance measured with the INA199A3 at TA = +25°C, VS = +5V, VIN+ = 12V, and VREF = VS/2, unless otherwise noted.
STEP RESPONSE
(10mVPP Input Step)
2VPP Output Signal
10mVPP Input Signal
Input Voltage
(5mV/diV)
Referred-to-Input
Voltage Noise (200nV/div)
Output Voltage
(0.5V/diV)
0.1Hz to 10Hz VOLTAGE NOISE
(Referred-to-Input)
VS = ±2.5V
VCM = 0V
VDIF = 0V
VREF = 0V
Time (100ms/div)
Time (1s/div)
Figure 13.
Figure 14.
COMMON-MODE VOLTAGE
TRANSIENT RESPONSE
INVERTING DIFFERENTIAL INPUT OVERLOAD
Output Voltage
0V
2V/div
0V
Output Voltage (40mV/div)
Common-Mode Voltage (1V/div)
Inverting Input Overload
Common Voltage Step
Output
0V
VS = 5V, VCM = 12V, VREF = 2.5V
Time (50ms/div)
Time (250ms/div)
Figure 15.
Figure 16.
NONINVERTING DIFFERENTIAL INPUT OVERLOAD
START-UP RESPONSE
Supply Voltage
1V/div
2V/div
Noninverting Input Overload
Output
Output Voltage
0V
0V
VS = 5V, VCM = 12V, VREF = 2.5V
VS = 5V, 1kHz Step with VDIFF = 0V, VREF = 2.5V
Time (250ms/div)
Time (100ms/div)
Figure 17.
Figure 18.
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Product Folder Link(s): INA199A1 INA199A2 INA199A3
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INA199A1
INA199A2
INA199A3
SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
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TYPICAL CHARACTERISTICS (continued)
Performance measured with the INA199A3 at TA = +25°C, VS = +5V, VIN+ = 12V, and VREF = VS/2, unless otherwise noted.
BROWNOUT RECOVERY
1V/div
Supply Voltage
Output Voltage
0V
VS = 5V, 1kHz Step with VDIFF = 0V, VREF = 2.5V
Time (100ms/div)
Figure 19.
8
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Product Folder Link(s): INA199A1 INA199A2 INA199A3
INA199A1
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INA199A3
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SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
APPLICATION INFORMATION
BASIC CONNECTIONS
Figure 20 shows the basic connections for the
INA199Ax. The input pins, IN+ and IN–, should be
connected as closely as possible to the shunt resistor
to minimize any resistance in series with the shunt
resistance.
REF
GND
+2.7V to +26V
RSHUNT
Supply
Reference
Voltage
INA199Ax
R1
OUT
R3
Load
Output
IN-
IN+
V+
R2
R4
CBYPASS
0.01mF
to
0.1mF
Figure 20. Typical Application
Power-supply bypass capacitors are required for
stability. Applications with noisy or high-impedance
power supplies may require additional decoupling
capacitors to reject power-supply noise. Connect
bypass capacitors close to the device pins.
On the RSW package, two pins are provided for each
input. These pins should be tied together (that is, tie
IN+ to IN+ and tie IN– to IN–).
POWER SUPPLY
The input circuitry of the INA199Ax can accurately
measure beyond its power-supply voltage, V+. For
example, the V+ power supply can be 5V, whereas
the load power-supply voltage can be as high as
+26V. However, the output voltage range of the OUT
terminal is limited by the voltages on the
power-supply pin. Note also that the INA199Ax can
withstand the full –0.3V to +26V range in the input
pins, regardless of whether the device has power
applied or not.
The INA199Ax series of current-shunt monitors give
equivalent accuracy at a full-scale range on the order
of 10mV. This accuracy reduces shunt dissipation by
an order of magnitude with many additional benefits.
Alternatively, there are applications that must
measure current over a wide dynamic range that can
take advantage of the low offset on the low end of the
measurement. Most often, these applications can use
the lower gain INA199A1 or INA199A2 to
accommodate larger shunt drops on the upper end of
the scale. For instance, an INA199A1 operating on a
3.3V supply could easily handle a full-scale shunt
drop of 60mV, with only 150mV of offset.
UNIDIRECTIONAL OPERATION
Unidirectional operation allows the INA199Ax to
measure currents through a resistive shunt in one
direction. The most frequent case of unidirectional
operation sets the output at ground by connecting the
REF pin to ground. In unidirectional applications
where the highest possible accuracy is desirable at
very low inputs, bias the REF pin to a convenient
value above 50mV to get the device output swing into
the linear range for zero inputs.
A less frequent case of unipolar output biasing is to
bias the output by connecting the REF pin to the
supply; in this case, the quiescent output for zero
input is at quiescent supply. This configuration would
only respond to negative currents (inverted voltage
polarity at the device input).
BIDIRECTIONAL OPERATION
Bidirectional operation allows the INA199Ax to
measure currents through a resistive shunt in two
directions. In this case, the output can be set
anywhere within the limits of what the reference
inputs allow (that is, between 0V to V+). Typically, it
is set at half-scale for equal range in both directions.
In some cases, however, it is set at a voltage other
than half-scale when the bidirectional current is
nonsymmetrical.
The quiescent output voltage is set by applying
voltage to the reference input. Under zero differential
input conditions the output assumes the same voltage
that is applied to the reference input.
SELECTING RS
The zero-drift offset performance of the INA199Ax
offers several benefits. Most often, the primary
advantage of the low offset characteristic enables
lower full-scale drops across the shunt. For example,
non-zero-drift current shunt monitors typically require
a full-scale range of 100mV.
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INA199A2
INA199A3
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INPUT FILTERING
An obvious and straightforward location for filtering is
at the output of the INA199Ax; however, this location
negates the advantage of the low output impedance
of the internal buffer. The only other option for filtering
is at the input pins of the INA199Ax; this location
requires consideration of the ±30% tolerance of the
input impedance. Figure 21 shows a filter placed at
the input pins.
However, in current shunt monitoring applications.
there is also a concern for how much current is
drained from the shunt circuit in shutdown conditions.
Evaluating this current drain involves considering the
simplified schematic of the INA199Ax in shutdown
mode shown in Figure 22.
REF
RSHUNT << RFILTER
RSHUNT
Supply
Reference
Voltage
INA199Ax
OUT
Load
Output
LOAD
VSUPPLY
RFILTER < 10W
Reference
Voltage
RFILTER < 10W
GND
1MW
R3
R2
R4
IN-
CFILTER
Shutdown
Control
REF
INA199Ax
OUT
CBYPASS
GND
R1
R3
IN+
V+
Output
PRODUCT
R3 and R4
INA199A1
INA199A2
INA199A3
20kW
10kW
5kW
INf-3dB
+2.7V to +26V
IN+
V+
R2
f-3dB =
1
2p (2 RFILTER) CFILTER
R4
Figure 22. Basic Circuit for Shutting Down
INA199Ax with Grounded Reference
CBYPASS
0.01mF
to
0.1mF
Figure 21. Input Filter
Using the lowest possible resistor values minimizes
both the initial shift in gain and effects of tolerance.
The effect on initial gain is given by Equation 1:
GainError% = 100 - [100 ´ {R/(R + RFILT)}]
(1)
Where R is the value for R3 or R4 from Table 1 for the
model in question.
Table 1. Internal Input Resistance Value By
Product
PRODUCT
GAIN
R3 AND R4
INA199A1
50
20kΩ
INA199A2
100
10kΩ
INA199A3
200
5kΩ
Using an INA199A2, for example, the total effect on
gain error can be calculated by replacing the R with
10kΩ – 30%, (or 7kΩ), or 10kΩ + 30% (or 13kΩ). The
tolerance extremes of RFILT can also be inserted into
the equation. If a pair of 100Ω, 1% resistors are used
on the inputs, the initial gain error is approximately
2%.
SHUTTING DOWN THE INA199Ax SERIES
While the INA199Ax series does not have a
shutdown pin, the low power consumption allows
powering from the output of a logic gate or transistor
switch that can turn on and turn off the INA199Ax
power-supply quiescent current.
10
NOTE: 1MΩ paths from shunt inputs to reference and INA199Ax
outputs.
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Note that there is typically slightly more than 1MΩ
impedance (from the combination of 1MΩ feedback
and 5kΩ input resistors) from each input of the
INA199Ax to the OUT pin and to the REF pin. The
amount of current flowing through these pins depends
on the respective ultimate connection. For example, if
the REF pin is grounded, the calculation of the effect
of the 1MΩ impedance from the shunt to ground is
straightforward. However, if the reference or op amp
is powered while the INA199Ax is shut down, the
calculation is direct; instead of assuming 1MΩ to
ground, however, assume 1MΩ to the reference
voltage. If the reference or op amp is also shut down,
some knowledge of the reference or op amp output
impedance under shutdown conditions is required.
For instance, if the reference source behaves as an
open circuit when it is unpowered, little or no current
flows through the 1MΩ path.
Regarding the 1MΩ path to the output pin, the output
stage of a disabled INA199Ax does constitute a good
path to ground; consequently, this current is directly
proportional to a shunt common-mode voltage
impressed across a 1MΩ resistor.
As a final note, when the device is powered up, there
is an additional, nearly constant, and well-matched
25mA that flows in each of the inputs as long as the
shunt common-mode voltage is 3V or higher. Below
2V common-mode, the only current effects are the
result of the 1MΩ resistors.
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): INA199A1 INA199A2 INA199A3
INA199A1
INA199A2
INA199A3
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SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
REF INPUT IMPEDANCE EFFECTS
As with any difference amplifier, the INA199Ax series
common-mode rejection ratio is affected by any
impedance present at the REF input. This concern is
not a problem when the REF pin is connected directly
to most references or power supplies. When using
resistive dividers from the power supply or a
reference voltage, the REF pin should be buffered by
an op amp.
In systems where the INA199Ax output can be
sensed differentially, such as by a differential input
analog-to-digital converter (ADC) or by using two
separate ADC inputs, the effects of external
impedance on the REF input can be cancelled.
Figure 23 depicts a method of taking the output from
the INA199Ax by using the REF pin as a reference.
RSHUNT
Supply
Load
ADC
REF
INA199Ax
OUT
USING THE INA199Ax WITH COMMON-MODE
TRANSIENTS ABOVE 26V
With a small amount of additional circuitry, the
INA199Ax series can be used in circuits subject to
transients higher than 26V, such as automotive
applications. Use only zener diode or zener-type
transient absorbers (sometimes referred to as
Transzorbs); any other type of transient absorber has
an unacceptable time delay. Start by adding a pair of
resistors as shown in Figure 24 as a working
impedance for the zener. It is desirable to keep these
resistors as small as possible, most often around
10Ω. Larger values can be used with an effect on
gain that is discussed in the section on input filtering.
Because this circuit limits only short-term transients,
many applications are satisfied with a 10Ω resistor
along with conventional zener diodes of the lowest
power rating that can be found. This combination
uses the least amount of board space. These diodes
can be found in packages as small as SOT-523 or
SOD-523.
Output
RSHUNT
Supply
GND
R1
R3
RPROTECT
10W
+2.7V to +26V
Load
IN-
RPROTECT
10W
IN+
V+
R2
Reference
Voltage
R4
CBYPASS
0.01mF
to
0.1mF
REF
Figure 23. Sensing INA199Ax to Cancel Effects of
Impedance on the REF Input
GND
INA199Ax
OUT
1MW
R3
1MW
R4
V+
Shutdown
Control
Output
IN-
IN+
CBYPASS
Figure 24. INA199Ax Transient Protection Using
Dual Zener Diodes
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): INA199A1 INA199A2 INA199A3
Submit Documentation Feedback
11
INA199A1
INA199A2
INA199A3
SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
In the event that low-power zeners do not have
sufficient transient absorption capability and a higher
power transzorb must be used, the most
package-efficient solution then involves using a single
transzorb and back-to-back diodes between the
device inputs. This method is shown in Figure 25.
The most space-efficient solutions are dual
series-connected diodes in a single SOT-523 or
SOD-523 package. In both examples shown in
Figure 24 and Figure 25, the total board area
required by the INA199Ax with all protective
components is less than that of an SO-8 package,
and only slightly greater than that of an MSOP-8
package.
www.ti.com
RSHUNT
Supply
RPROTECT
10W
Load
RPROTECT
10W
Reference
Voltage
REF
GND
INA199Ax
OUT
1MW
R3
1MW
R4
V+
Shutdown
Control
Output
IN-
IN+
CBYPASS
Figure 25. INA199Ax Transient Protection Using a
Single Transzorb and Input Clamps
12
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): INA199A1 INA199A2 INA199A3
INA199A1
INA199A2
INA199A3
www.ti.com
SBOS469B – MAY 2009 – REVISED FEBRUARY 2010
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (June 2009) to Revision B
Page
•
Deleted ordering information content from Package/Ordering table .................................................................................... 2
•
Updated DCK pinout drawing ............................................................................................................................................... 4
Changes from Original (May 2009) to Revision A
•
Page
Added ordering number and transport media, quantity columns to Package/Ordering Information table ............................ 2
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): INA199A1 INA199A2 INA199A3
Submit Documentation Feedback
13
PACKAGE OPTION ADDENDUM
www.ti.com
16-Apr-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
INA199A1DCKR
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
INA199A1DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
INA199A1RSWR
ACTIVE
UQFN
RSW
10
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
INA199A1RSWT
ACTIVE
UQFN
RSW
10
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
INA199A2DCKR
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
INA199A2DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
INA199A2RSWR
ACTIVE
UQFN
RSW
10
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
INA199A2RSWT
ACTIVE
UQFN
RSW
10
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
INA199A3DCKR
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
INA199A3DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
INA199A3RSWR
ACTIVE
UQFN
RSW
10
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
INA199A3RSWT
ACTIVE
UQFN
RSW
10
250
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Apr-2010
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Apr-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
INA199A1DCKR
Package Package Pins
Type Drawing
SC70
DCK
6
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
180.0
8.4
2.55
2.34
1.22
4.0
8.0
Q3
INA199A1DCKT
SC70
DCK
6
250
180.0
8.4
2.55
2.34
1.22
4.0
8.0
Q3
INA199A1RSWR
UQFN
RSW
10
3000
179.0
8.4
1.7
2.1
0.7
4.0
8.0
Q1
INA199A1RSWT
UQFN
RSW
10
250
179.0
8.4
1.7
2.1
0.7
4.0
8.0
Q1
INA199A2DCKR
SC70
DCK
6
3000
180.0
8.4
2.55
2.34
1.22
4.0
8.0
Q3
INA199A2DCKT
SC70
DCK
6
250
180.0
8.4
2.55
2.34
1.22
4.0
8.0
Q3
INA199A2RSWR
UQFN
RSW
10
3000
179.0
8.4
1.7
2.1
0.7
4.0
8.0
Q1
INA199A2RSWT
UQFN
RSW
10
250
179.0
8.4
1.7
2.1
0.7
4.0
8.0
Q1
INA199A3DCKR
SC70
DCK
6
3000
180.0
8.4
2.55
2.34
1.22
4.0
8.0
Q3
INA199A3DCKT
SC70
DCK
6
250
180.0
8.4
2.55
2.34
1.22
4.0
8.0
Q3
INA199A3RSWR
UQFN
RSW
10
3000
179.0
8.4
1.7
2.1
0.7
4.0
8.0
Q1
INA199A3RSWT
UQFN
RSW
10
250
179.0
8.4
1.7
2.1
0.7
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Apr-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
INA199A1DCKR
SC70
DCK
6
3000
202.0
201.0
28.0
INA199A1DCKT
SC70
DCK
6
250
202.0
201.0
28.0
INA199A1RSWR
UQFN
RSW
10
3000
195.0
200.0
45.0
INA199A1RSWT
UQFN
RSW
10
250
195.0
200.0
45.0
INA199A2DCKR
SC70
DCK
6
3000
202.0
201.0
28.0
INA199A2DCKT
SC70
DCK
6
250
202.0
201.0
28.0
INA199A2RSWR
UQFN
RSW
10
3000
195.0
200.0
45.0
INA199A2RSWT
UQFN
RSW
10
250
195.0
200.0
45.0
INA199A3DCKR
SC70
DCK
6
3000
202.0
201.0
28.0
INA199A3DCKT
SC70
DCK
6
250
202.0
201.0
28.0
INA199A3RSWR
UQFN
RSW
10
3000
195.0
200.0
45.0
INA199A3RSWT
UQFN
RSW
10
250
195.0
200.0
45.0
Pack Materials-Page 2
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