Maxim MAX5541 Low-cost, 5v, serial-input, voltage-output, 16-bit dac Datasheet

19-1572; Rev 0; 12/99
Low-Cost, +5V, Serial-Input,
Voltage-Output, 16-Bit DAC
Features
♦ Full 16-Bit Performance Without Adjustments
The 10MHz 3-wire serial interface is SPI™/QSPI™/
MICROWIRE™ compatible and interfaces directly with
optocouplers for applications requiring isolation. The
MAX5541 is available in an 8-pin SO package.
♦ SPI/QSPI/MICROWIRE-Compatible Serial Interface
♦ +5V Single-Supply Operation
♦ Low Power: 1.5mW
♦ 1µs Settling Time
♦ Unbuffered Voltage Output Directly Drives 60kΩ
Loads
♦ Power-On Reset Circuit Clears DAC Output to 0V
(unipolar mode)
♦ Schmitt Trigger Inputs for Direct Optocoupler
Interface
Applications
High-Resolution Offset and Gain Adjustment
Ordering Information
PART
TEMP. RANGE
PIN-PACKAGE
Industrial Process Control
MAX5541CSA
0°C to +70°C
8 SO
Automated Test Equipment
MAX5541ESA
-40°C to +85°C
8 SO
Data Acquisition Systems
Functional Diagram
Pin Configuration
TOP VIEW
VDD
MAX5541
OUT 1
AGND 2
8 VDD
MAX5541
CS 4
16-BIT DAC
CS
DIN
SCLK
16-BIT DATA LATCH
7 DGND
6 DIN
REF 3
REF
5 SCLK
OUT
AGND
CONTROL
LOGIC
SERIAL INPUT REGISTER
SO
DGND
SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.
________________________________________________________________ Maxim Integrated Products
1
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MAX5541
General Description
The MAX5541 serial-input, voltage-output, 16-bit
monotonic digital-to-analog converter (DAC) operates
from a single +5V supply. The DAC output is
unbuffered, resulting in low 0.3mA supply current and
low 1LSB offset error. The DAC output range is 0V to
VREF. The DAC latch accepts a 16-bit serial word. A
power-on reset circuit clears the DAC output to 0V
(unipolar mode) when power is initially applied.
MAX5541
Low-Cost, +5V, Serial-Input,
Voltage-Output, 16-Bit DAC
ABSOLUTE MAXIMUM RATINGS
VDD to DGND............................................................-0.3V to +6V
CS, SCLK, DIN to DGND..........................................-0.3V to +6V
REF to AGND, DGND ..................................-0.3V to (VDD +0.3V)
AGND to DGND.....................................................-0.3V to +0.3V
OUT to AGND, DGND.................................. ............-0.3V to VDD
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (TA = +70°C)
8-Pin SO (derate 5.88mW/°C above +70°C)................471mW
Operating Temperature Ranges
MAX5541CSA .....................................................0°C to +70°C
MAX5541ESA ..................................................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10sec) ............................ +300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = +5V ±5%, VREF = +2.5V, VAGND = VDGND = 0, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
±0.5
±1.0
Bits
±4
±16
LSB
STATIC PERFORMANCE—ANALOG SECTION (RL = ∞)
Resolution
N
16
Differential Nonlinearity
DNL
Guaranteed monotonic
Integral Nonlinearity
INL
VDD = 5V
Zero-Code Offset Error
ZSE
Zero-Code Tempco
ZSTC
Gain Error (Note 1)
Bits
TA = +25°C
±1
TA = TMIN to TMAX
±2
TA = TMIN to TMAX
±0.05
ppm/°C
TA = +25°C
±5
TA = TMIN to TMAX
±10
Gain-Error Tempco
±0.1
DAC Output Resistance
ROUT
(Note 2)
Power-Supply Rejection
PSR
4.75V ≤ VDD ≤ 5.25V
Reference Input Range
VREF
(Note 3)
Reference Input Resistance
(Note 4)
RREF
LSB
LSB
ppm/°C
6.25
kΩ
±1.0
LSB
3.0
V
REFERENCE INPUT
2.0
11.5
kΩ
DYNAMIC PERFORMANCE—ANALOG SECTION (RL = ∞)
Voltage-Output Slew Rate
Output Settling Time
2
SR
CL = 10pF (Note 5)
25
V/µs
To ±1/2LSB of FS, CL = 10pF
1
µs
_______________________________________________________________________________________
Low-Cost, +5V, Serial-Input,
Voltage-Output, 16-Bit DAC
(VDD = +5V ±5%, VREF = +2.5V, VAGND = VDGND = 0, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DAC Glitch Impulse
Major-carry transition
10
nVs
Digital Feedthrough
Code = 0000 hex, CS = VDD,
SCLK = VDIN = 0 to VDD levels
10
nVs
DYNAMIC PERFORMANCE—REFERENCE SECTION
Reference -3dB Bandwidth
BW
Reference Feedthrough
Signal-to-Noise Ratio
SNR
Reference Input Capacitance
CIN
Code = FFFF hex
1
MHz
Code = 0000 hex, VREF = 1Vp-p at 100kHz
1
mVp-p
92
dB
Code = 0000 hex
75
Code = FFFF hex
120
pF
STATIC PERFORMANCE—DIGITAL INPUTS
Input High Voltage
VIH
Input Low Voltage
VIL
Input Current
IIN
Input Capacitance
CIN
Hysteresis Voltage
VH
2.4
V
0.8
V
VIN = 0
±1
µA
(Note 6)
10
pF
0.40
V
POWER SUPPLY
Positive Supply Range
VDD
4.75
5.25
Positive Supply Current
IDD
0.3
Power Dissipation
PD
1.5
V
1.1
mA
mW
TIMING CHARACTERISTICS
(VDD = +5V ±5%, VREF = +2.5V, VAGND = VDGND = 0, CMOS inputs, TA = TMIN to TMAX, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
10
MHz
SCLK Frequency
fCLK
SCLK Pulse Width High
tCH
45
ns
SCLK Pulse Width Low
tCL
45
ns
CS Low to SCLK High Setup
tCSS0
45
ns
CS High to SCLK High Setup
tCSS1
45
ns
SCLK High to CS Low Hold
tCSH0
30
ns
SCLK High to CS High Hold
tCSH1
45
ns
DIN to SCLK High Setup
tDS
40
ns
DIN to SCLK High Hold
tDH
0
ns
VDD High to CS Low
(power-up delay)
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
(Note 6)
20
µs
Gain Error tested at VREF = +2.0V, +2.5V, and +3.0V.
ROUT tolerance is typically ±20%.
Min/Max ranges guaranteed by gain-error test. Operation outside min/max limits will result in degraded performance.
Reference input resistance is code dependent, minimum at 8555 hex.
Slew-rate value is measured from 0% to 63%.
Guaranteed by design. Not production tested.
_______________________________________________________________________________________
3
MAX5541
ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics
(VDD = +5V, VREF = +2.5V, TA = +25°C, unless otherwise noted.)
SUPPLY CURRENT
vs. REFERENCE VOLTAGE
SUPPLY CURRENT (mA)
0.35
0.30
0.25
0.31
0.30
-20
0
20
40
60
80
100
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
0.28
0
1
2
3
4
5
-1.0
-60
6
20
60
REFERENCE VOLTAGE (V)
TEMPERATURE (°C)
INTEGRAL NONLINEARITY
vs. TEMPERATURE
DIFFERENTIAL NONLINEARITY
vs. TEMPERATURE
GAIN ERROR
vs. TEMPERATURE
0.8
0.8
0.4
0.4
0.2
0.2
DNL (LSB)
-0.2
-0.4
GAIN ERROR (LSB)
0.6
0.4
+DNL
0
-0.2
-DNL
-0.4
-INL
0
-0.2
-0.4
-0.6
-0.8
-0.8
-0.8
-1.0
-60
-1.0
-60
-20
20
60
100
140
-20
20
60
100
140
0.2
-0.6
-0.6
100
0.8
0.6
+INL
140
1.0
0.6
0
100
MAX5541-06
1.0
MAX5541-04
1.0
-1.0
-60
140
-20
20
60
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
INTEGRAL NONLINEARITY
vs. CODE
DIFFERENTIAL NONLINEARITY
vs. CODE
REFERENCE CURRENT
vs. CODE
0.75
0.50
0.25
0.25
DNL (LSB)
0.50
0
-0.25
-0.25
-0.50
-0.75
-0.75
-1.00
160
0
-0.50
20k
30k
40k
DAC CODE
50k
60k
70k
120
80
40
0
-1.00
10k
200
REFERENCE CURRENT (µA)
0.75
MAX5541-09
1.00
MAX5541-07
1.00
0
-20
TEMPERATURE (°C)
MAX5541-05
-40
INL (LSB)
0.32
0.29
0.20
4
0.33
MAX5541-08
SUPPLY CURRENT (mA)
0.40
0.8
ZERO-CODE OFFSET ERROR (LSB)
0.34
0.45
1.0
MAX5541-02
0.35
MAX5541-01
0.50
ZERO-CODE OFFSET ERROR
vs. TEMPERATURE
MAX5541-03
SUPPLY CURRENT
vs. TEMPERATURE
INL (LSB)
MAX5541
Low-Cost, +5V, Serial-Input,
Voltage-Output, 16-Bit DAC
0
10k
20k
30k
40k
DAC CODE
50k
60k
70k
0
10k
20k
30k
40k
DAC CODE
_______________________________________________________________________________________
50k
60k
70k
Low-Cost, +5V, Serial-Input,
Voltage-Output, 16-Bit DAC
FULL-SCALE STEP RESPONSE
(fSCLK = 10MHz)
MAX5541-11
MAX5541-10
FULL-SCALE STEP RESPONSE
(fSCLK = 20MHz)
OUT
500mV/div
OUT
500mV/div
1µs/div
400ns/div
CL = 13pF, RL = ∞
CL = 13pF, RL = ∞
MAJOR-CARRY OUTPUT GLITCH
MAX5541-13
MAX5541-12
DIGITAL FEEDTHROUGH
CS
5V/div
SCLK
5V/div
OUT
AC-COUPLED
100mV/div
OUT
AC-COUPLED
50mV/div
2µs/div
2µs/div
CODE = 0000 hex
______________________________________________________________Pin Description
PIN
NAME
FUNCTION
1
OUT
2
AGND
DAC Output Voltage
3
REF
Voltage Reference Input. Connect to external +2.5V reference.
4
CS
Chip-Select Input
5
SCLK
6
DIN
7
DGND
8
VDD
Analog Ground
Serial-Clock Input. Duty cycle must be between 40% and 60%.
Serial-Data Input
Digital Ground
+5V Supply Voltage
_______________________________________________________________________________________
5
MAX5541
Typical Operating Characteristics (continued)
(VDD = +5V, VREF = +2.5V, TA = +25°C, unless otherwise noted.)
MAX5541
Low-Cost, +5V, Serial-Input,
Voltage-Output, 16-Bit DAC
Detailed Description
The MAX5541 voltage-output, 16-bit digital-to-analog
converter (DAC) offers 16-bit monotonicity with less
than 1LSB differential linearity error. Serial-data transfer
minimizes the number of package pins required.
The MAX5541 is composed of two matched DAC sections, with a 12-bit inverted R-2R DAC forming the 12
LSBs and the 4 MSBs derived from 15 identically
matched resistors. This architecture allows the lowest
glitch energy to be transferred to the DAC output on
major-carry transitions. It also decreases the DAC output impedance by a factor of eight compared to a standard R-2R ladder, allowing unbuffered operation in
medium-load applications. Figure 1 is the Timing
Diagram.
Digital Interface
The MAX5541 digital interface is a standard 3-wire connection compatible with SPI/QSPI/MICROWIRE interfaces. The chip-select input (CS) frames the serial data
loading at the data input pin (DIN). Immediately following CS’s high-to-low transition, the data is shifted
synchronously and latched into the input register on the
rising edge of the serial-clock input (SCLK). After 16
data bits have been loaded into the serial input register, it transfers its contents to the DAC latch on CS’s
low-to-high transition (Figure 2). Note that if CS does
not remain low during the entire 16 SCLK cycles, data
will be corrupted. In this case, reload the DAC latch
with a new 16-bit word.
External Reference
The MAX5541 operates with external voltage references from 2V to 3V. The reference voltage determines
the DAC’s full-scale output voltage.
Power-On Reset
The MAX5541 has a power-on reset circuit to set the
DAC’s output to 0V in unipolar mode when VDD is first
applied. This ensures that unwanted DAC output voltages will not occur immediately following a system
power-up, such as after power loss. In bipolar mode,
the DAC output is set to -VREF.
;;;;;;;;
;;;;;;;;;
; ; ;;
tCSH1
CS
tCSHO
tCSSO
tCH
tCSS1
tCL
SCLK
tDH
tDS
D15
DIN
D14
D0
Figure 1. Timing Diagram
CS
DAC
UPDATED
SCLK
DIN
D15 D14 D13 D12 D11 D10 D9 D8
MSB
D7 D6 D5 D4 D3 D2 D1 D0
LSB
Figure 2. 3-Wire Interface Timing Diagram
6
_______________________________________________________________________________________
Low-Cost, +5V, Serial-Input,
Voltage-Output, 16-Bit DAC
Reference and Analog Ground Inputs
The MAX5541 operates with external voltage references
from 2V to 3V, and maintains 16-bit performance with
proper reference selection and application. Ideally, the
reference’s temperature coefficient should be less than
0.4ppm/°C to maintain 16-bit accuracy to within 1LSB
over the commercial (0°C to +70°C) temperature range.
Since this converter is designed as an inverted R-2R
voltage-mode DAC, the input resistance seen by the
voltage reference is code dependent. The worst-case
input-resistance variation is from 11.5kΩ (at code 8555
hex) to 200kΩ (at code 0000 hex). The maximum
change in load current for a 2.5V reference is 2.5V/
11.5kΩ = 217µA; therefore, the required load regulation
is 7ppm/mA for a maximum error of 0.1LSB. This implies
a reference output impedance of <18mΩ. In addition,
the impedance of the signal path from the voltage reference to the reference input must be kept low because it
contributes directly to the load-regulation error.
The requirement for a low-impedance voltage reference
is met with capacitor bypassing at the reference inputs
and ground. A 0.1µF ceramic capacitor with short leads
between REF and AGND provides high-frequency
bypassing. A surface-mount ceramic chip capacitor is
preferred because it has the lowest inductance. An
additional 10µF between REF and AGND provides lowfrequency bypassing. A low-ESR tantalum, film, or
organic semiconductor capacitor works well. Leaded
capacitors are acceptable because impedance is not
as critical at lower frequencies. The circuit can benefit
from even larger bypassing capacitors, depending on
the stability of the external reference with capacitive
loading. If separate force and sense lines are not used,
connect the appropriate force and sense pins together
close to the package.
AGND must also be low impedance, as load-regulation
errors will be introduced by excessive AGND resistance. As in all high-resolution, high-accuracy applications, separate analog and digital ground planes yield
the best results. Connect DGND to AGND at the AGND
pin to form the “star” ground for the DAC system. For
the best possible performance, always refer remote
DAC loads to this system ground.
Unbuffered Operation
Unbuffered operation reduces power consumption as
well as offset error contributed by the external output
buffer. The R-2R DAC output is available directly at
OUT, allowing 16-bit performance from +VREF to AGND
without degradation at zero-scale. The DAC’s output
impedance is also low enough to drive medium loads
(RL > 60kΩ) without degradation of INL or DNL; only
the gain error is increased by externally loading the
DAC output.
External Output Buffer Amplifier
In unipolar mode, the output amplifier is used in a voltage-follower connection. The DAC’s output resistance
is constant and is independent of input code; however,
the output amplifier’s input impedance should still be as
high as possible to minimize gain errors. The DAC’s
output capacitance is also independent of input code,
thus simplifying stability requirements on the external
amplifier.
In single-supply applications, precision amplifiers with
input common-mode ranges including AGND are available; however, their output swings do not normally
include the negative rail (AGND) without significant performance degradation. A single-supply op amp, such
as the MAX495, is suitable if the application does not
use codes near zero.
Since the LSBs for a 16-bit DAC are extremely small
(38.15µV for VREF = 2.5V), pay close attention to the
external amplifier’s input specification. The input offset
voltage can degrade the zero-scale error and might
require an output offset trim to maintain full accuracy if
the offset voltage is greater than 1/2LSB. Similarly, the
input bias current multiplied by the DAC output resistance (typically 6.25kΩ) contributes to the zero-scale
error. Temperature effects also must be taken into consideration. Over the commercial temperature range, the
offset voltage temperature coefficient (referenced to
+25°C) must be less than 0.42µV/°C to add less than
1/2LSB of zero-scale error. The external amplifier’s
input resistance forms a resistive divider with the DAC
output resistance, which results in a gain error. To contribute less than 1/2LSB of gain error, the input resistance typically must be greater than:
6.25kΩ /
1 1 

 = 205MΩ
2  214 
The settling time is affected by the buffer input capacitance, the DAC’s output capacitance, and PC board
capacitance. The typical DAC output voltage settling
time is 1µs for a full-scale step. Settling time can be significantly less for smaller step changes. Assuming a
single time-constant exponential settling response, a
full-scale step takes 12 time constants to settle to within
1/2LSB of the final output voltage. The time constant is
equal to the DAC output resistance multiplied by the
total output capacitance. The DAC output capacitance
is typically 10pF. Any additional output capacitance will
increase the settling time.
_______________________________________________________________________________________
7
MAX5541
Applications Information
MAX5541
Low-Cost, +5V, Serial-Input,
Voltage-Output, 16-Bit DAC
The external buffer amplifier’s gain-bandwidth product
is important because it increases the settling time by
adding another time constant to the output response.
The effective time constant of two cascaded systems,
each with a single time-constant response, is approximately the root square sum of the two time constants.
The DAC output’s time constant is 1µs / 12 = 83ns,
ignoring the effect of additional capacitance. If the time
constant of an external amplifier with 1MHz bandwidth
is 1 / 2π (1MHz) = 159ns, then the effective time constant of the combined system is:
Table 1. Unipolar Code Table
DAC LATCH CONTENTS
MSB
) (
)
VREF • (65,535 / 65,536)
1000 0000 0000 0000
VREF • (32,768 / 65,536) = 1/2VREF
0000 0000 0000 0001
VREF • (1 / 65,536)
0000 0000 0000 0000
0V
For optimum system performance, use PC boards with
separate analog and digital ground planes. Wire-wrap
boards are not recommended. Connect the two ground
planes together at the low-impedance power-supply
source. Connect DGND and AGND together at the IC.
The best ground connection can be achieved by connecting the DAC’s DGND and AGND pins together and
connecting that point to the system analog ground
plane. If the DAC’s DGND is connected to the system
digital ground, digital noise may get through to the
DAC’s analog portion.
Bypass VDD with a 0.1µF ceramic capacitor connected
between V DD and AGND. Mount it with short leads
close to the device. Ferrite beads can also be used to
further isolate the analog and digital power supplies.
This suggests that the settling time to within 1/2LSB of
the final output voltage, including the external buffer
amplifier, will be approximately 12 • 180ns = 2.15µs.
Digital Inputs and Interface Logic
The digital interface for the 16-bit DAC is based on a 3wire standard that is SPI/QSPI/MICROWIRE compatible. The three digital inputs (CS, DIN, and SCLK) load
the digital input data serially into the DAC.
All of the digital inputs include Schmitt-trigger buffers to
accept slow-transition interfaces. This means that optocouplers can interface directly to the MAX5541 without
additional external logic. The digital inputs are TTL/
CMOS-logic compatible.
Chip Information
Unipolar Configuration
TRANSISTOR COUNT: 2209
SUBSTRATE CONNECTED TO DGND
Figure 3 shows the MAX5541 configured for unipolar
operation with an external op amp. The op amp is set for
unity gain, and Table 1 shows the codes for this circuit.
+2.5V
1111 1111 1111 1111
Power-Supply Bypassing and
Ground Management

2
2
 96ns + 159ns  = 186ns


(
ANALOG OUTPUT, VOUT
LSB
10µF
+5V
0.1µF
0.1µF
MC68XXXX
VDD
PCS0
CS
MOSI
DIN
SCLK
SCLK
REF
(REFS)
MAX495
MAX5541
DGND
OUT
UNIPOLAR
OUT
EXTERNAL OP AMP
AGND_
Figure 3. Typical Operating Circuit
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 1999 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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