1. Features • Full Trusted Computing Group (TCG) Trusted Platform Module (TPM) Version 1.2 Compatibility • Compliant with TCG PC Client Specific TPM Interface Specification Version 1.2 • Single-chip Turnkey Solution Trusted Platform Module • Hardware Asymmetric Crypto Engine • 2048-bit RSA® Sign in 200ms • AVR® RISC Microprocessor • Internal EEPROM Storage for RSA Keys Atmel AT97SC3204 LPC Interface • 33MHz LPC (Low Pin Count) Bus for Easy PC Interface • Secure Hardware and Firmware Design and Chip Layout • True Random Number Generator (RNG) – FIPS 140-2 Compliant • NV Storage space for 1280-bytes of user defined data Summary • 3.3V Supply Voltage • 28-lead Thin TSSOP, Wide TSSOP or 40-lead QFN Packages * See the full data sheet for detailed design information • Offered in both Commercial (0 to 70°C) and Industrial (-40 to +85°C) Temperature Ranges 2. Description The Atmel® AT97SC3204 is a fully integrated security module designed to be integrated into personal computers and other embedded systems. It implements version 1.2 of the Trusted Computing Group (TCG) specification for Trusted Platform Modules (TPM). The TPM includes a cryptographic accelerator capable of computing a 2048-bit RSA signature in 200ms and a 1024-bit RSA signature in 40ms. Performance of the SHA-1 accelerator is 20µs per 64-byte block. The chip communicates with the PC through the LPC interface. The TPM supports SIRQ (for interrupts) and CLKRUN to permit clock stopping for power savings in mobile computers. 5294BS–TPM–9/10 Note: This is a summary document. A complete document is available under NDA. For more information, please contact your local Atmel sales office. Table 1-1. 2 Pin Configurations Pin Name Function VCC 3.3V Supply Voltage SB3V Standby 3.3V Supply Voltage GND Ground LRESET# PCI Reset Input Active Low LAD0 LPC Command, Address, Data Line Input/Output LAD1 LPC Command, Address, Data Line Input/Output LAD2 LPC Command, Address, Data Line Input/Output LAD3 LPC Command, Address, Data Line Input/Output LCLK 33MHz PCI Clock Input LFRAME# LPC FRAME Input CLKRUN# PCI Clock Run Input/Output LPCPD# LPC Power Down Input SERIQ Serialized Interrupt Request Input/Output GPIO6 General Purpose Input/Output TestI Test Input (disabled) TestBI Test Input (disabled) ATest Atmel Test Pin NC No Connect NBO Not Bounded out Atmel AT24C256C 5294BS–TPM–9/10 Atmel AT24C256C Pinout Diagrams 28-pin Thin TSSOP 4.4 mm x 9.7 mm Body 0.65 mm Pitch ATest 1 28 LPCPD# ATest 2 27 SERIRQ 31 NBO 32 NBO 33 NBO 34 NBO 35 NBO 36 NBO 1 39 ATest ATest 40 ATest 28-pin TSSOP 6.1 mm x 9.7 mm Body 0.65 mm Pitch 37 SERIRQ 40-pin QFN 6.0 mm x 6.0 mm Body 0.50 mm Pitch 38 LPCPD# Figure 2-1. 30 LAD0 GND 2 29 GND 3 28 VCC 5 24 VCC NC 5 26 LFRAME# GPIO6 6 23 LAD1 TestI 6 25 LCLK NC 7 22 LFRAME# TestBI 7 24 LAD2 TestI 8 21 LCLK VCC 8 23 VCC 20 LAD2 GND 9 22 GND VCC 10 GND 11 19 VCC NBO 10 21 LAD3 NBO 12 NBO 13 17 LAD3 NBO 14 15 CLKRUN# TestBI 9 18 GND 16 LRESET# LRESET# 20 SB3V CLKRUN# 19 27 LAD1 NBO 18 4 NBO 17 GPIO6 NBO 16 25 GND NBO 15 4 NBO 14 GND NBO 13 26 LAD0 NBO 12 3 NBO 11 ATest SB3V 3 5294BS–TPM–9/10 Figure 2-2. GPIO6 Atmel AT97SC3204 Block Diagram ROM Program EEPROM Program 33MHz LPC Interface AVR 8-bit RISC CPU SRAM EEPROM Data GPIO RNG CRYPTO Engine Timer Physical Security Circuitry The TPM includes a hardware random number generator, including a FIPS-approved Pseudo Random Number Generator that is used for key generation and TCG protocol functions. The RNG is also available to the system to generate random numbers that may be needed during normal operation. The chip uses a dynamic internal memory management scheme to store multiple RSA keys. Other than the standard TCG commands (TPM_FlushSpecific, TPM_Loadkey2), no system intervention is required to manage this internal key cache. The TPM is offered to OEM and ODM manufacturers as a turnkey solution, including the firmware integrated on the chip. In addition, Atmel provides the necessary device driver software for integration into certain operating systems, along with BIOS drivers. Atmel will also provide manufacturing support software for use by OEMs and ODMs during initialization and verification of the TPM during board assembly. Full documentation for TCG primitives can be found in the TCG TPM Main Specification, Parts 1 to 3, on the TCG Web site located at https://www.trustedcomputinggroup.org. TPM features specific to PC Client platforms are specified in the “TCG PC Client Specific TPM Interface Specification, Version 1.2”, also available on the TCG web site. Implementation guidance for 32-bit PC platforms is outlined in the “TCG PC Client Specific Implementation Specification for Conventional BIOS for TCG Version 1.2”, also available on the TCG web site. 4 Atmel AT24C256C 5294BS–TPM–9/10 Atmel AT24C256C 3. Ordering Information Table 1-2. Atmel AT24C256C Ordering Information Atmel Ordering Code AT97SC3204 (1) Package Operating Range 28A2 (28-pin Thin TSSOP) Lead-free, RoHS Commercial (0°C to 70°C) Industrial (-40°C to 85°C) AT97SC3204(1) 28A3 (28-pin TSSOP) Lead-free, RoHS Commercial (0°C to 70°C) Industrial (-40°C to 85°C) AT97SC3204(1) 40ML1 (40-pin QFN) (2) Lead-free, RoHS Commercial (0°C to 70°C) Industrial (-40°C to 85°C) Notes: 1. Please see the Atmel AT97SC3204 datasheet addendum for the complete catalog number ordering code 5 5294BS–TPM–9/10 4. Package Drawing 28A2 – Thin TSSOP b L L1 E E1 e D A A2 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL 1. 2. 3. 4. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not exceed .15mm (.006 in) per side. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed .25mm (.010 in) per side. Dimension 'b' does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the 'b' dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. Dimension 'D' and 'E1' to be determined at Datum Plane H. D MIN NOM MAX NOTE 9.60 9.70 9.80 1,4 4.50 2,4 E E1 6.40 BSC 4.30 4.40 A 1.20 A2 0.80 b 0.19 e L L1 1.00 1.05 0.30 0.65 BSC 0.45 0.60 0.75 1.00 REF This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AE for additional information. Package Drawing Contact: [email protected] 6 TITLE 28A2, 28-lead, 4.4x9.7 mm Body, 0.65 pitch, Thin Shrink Small Outline Package (TSSOP) 3 6/17/08 GPC TFL DRAWING NO. REV. 28A2 B Atmel AT24C256C 5294BS–TPM–9/10 Atmel AT24C256C 28A3 – TSSOP b L L1 E E1 e End View Top View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL D D A A2 NOM MAX NOTE 9.70 9.80 2, 5 6.20 3, 5 E E1 Side View MIN 9.60 8.10 BSC 6.00 A – – 1.20 A2 0.80 1.00 1.05 b 0.19 – 0.30 e L L1 Note: 1. 2. 3. 4. 5. R 6.10 4 0.65 BSC 0.45 0.60 0.75 1.00 REF This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional information. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. Dimension D and E1 to be determined at Datum Plane H. 1/8/02 2325 Orchard Parkway San Jose, CA 95131 TITLE 28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch, Thin Shrink Small Outline Package (TSSOP) DRAWING NO. REV. 28A3 A 7 5294BS–TPM–9/10 40ML1 – QFN A D A1 N A2 A3 1 2 Pin 1 Indicator 3 E Top View L 0 Side View COMMON DIMENSIONS (Unit of Measure = mm) D2 SYMBOL MIN D E2 2 b 1 N R 8 4.25 3.95 4.10 4.25 - 0.85 0.90 A1 0.0 0.01 0.05 A2 - 0.65 0.70 0.20 REF 0.30 e Bottom View 2. 4.10 E2 L PIN1 ID Note: 1. 3.95 A b NOTE 6.00 BSC D2 A3 e MAX 6.00 BSC E 3 NOM 0.40 0.50 0.50 BSC 0.18 0.23 0.30 2 This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper dimensions, tolerances, datums, etc. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 9/27/07 2325 Orchard Parkway San Jose, CA 95131 TITLE 40ML1, , 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded Quad Flat No Lead Package (QFN) Punched DRAWING NO. REV. 40ML1 C Atmel AT24C256C 5294BS–TPM–9/10 Atmel AT24C256C 5. Revision History Doc. Rev. Date Comments 5294BS 10/2010 Added Industrial Grade support detail 5294AS 01/2008 Initial document release 9 5294BS–TPM–9/10 Product Contact Product Line [email protected] Sales Contact www.atmel.com/contacts Literature Requests www.atmel.com/literature Atmel Corporation Atmel Asia Limited Atmel Munich GmbH Atmel Japan 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 www.atmel.com Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 JAPAN Tel: (+81)(3) 3523-3551 Fax: (+81)(3) 3523-7581 © 2010 Atmel Corporation. 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