Weitron B130F Reverse voltage 20 to 200v forward current 1.0a Datasheet

B120F thru B1200F
Schottky Barrier Rectifiers
Reverse Voltage 20 to 200V Forward Current 1.0A
P b Lead(Pb)-Free
FEATURES
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* Low power loss,high efficiency
* For use in low voltage high frequency inverters,
free wheeling,and polarity protection applications
* Guardring for over voltage protection
* High temperature soldering guaranteed:
260°C/10 seconds at terminals
Mechanical Data
CATHODE
Case: SOD-123FL/MINI SMA
molded plastic over sky die
Terminals: Tin Plated, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0155g
Handling precautin::None
ANODE
We declare that the material of product is
Haloggen free (green epoxy compound)
1.Electrical Characteristic
Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
symbol
device marking code
Unit
B120F
B130F
B140F
B145F
B150F
B160F
B180F
B1100F
12
13
14
145
15
16
18
110
115
120
100
150
200
V
B1150F B1200F
Maximum repetitive peak reverse
voltage
VRRM
20
30
40
45
50
60
80
Maximum RMS voltage
VRMS
14
21
28
31.5
35
42
56
70
105
140
V
Maximum DC blocking voltage
VDC
20
30
40
45
50
60
80
100
150
200
V
Maximum average forward rectified
current at TC = 75°C
IF(AV)
1.0
A
Peak forward surge current 8.3ms
single half sine-wave superimposed
on rated load (JEDEC Method)
IFSM
30
A
Typical thermal resistance (Note 1)
RθJA
RθJC
110
40
°C/W
TJ
–55 to +150
°C
TSTG
–65 to +175
°C
Operating junction temperature range
storage temperature range
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
symbol
B120F
B130F
0.5
0.35
0.45
0.50
B140F
B145F
B150F
B160F
B180F
B1100F
B1150F B1200F
Unit
Maximum instantaneous forward
voltage at(IF = 0.1 A, TJ = 25°C)
(IF = 0.7 A, TJ = 25°C)
(IF = 1.0 A, TJ = 25°C)
VF
Maximum DC reverse current at rated
DC blocking voltage TA = 25°C
Tj = 125°C
IR
0.5
10
mA
Typical junction capacitance at
4.0V, 1MHz
CJ
160
PF
0.55
0.7
0.85
0.90
0.92
V
NOTES:
1. 8.0mm2 (.013mm thick) land areas
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B120F thru B1200F
2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted )
Fig. 2 – Maximum Non-repetitive Peak
Forward Surge Current
1.0
0.5
0
15
0
100
25 50 75 100 125 150 175
CASE TEMPERATURE:Tc(°C)
Fig 3. – Typical Instantaneous Forward
Characteristics
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
10
1.0
0.1
1
10
Tj=125
1.0
0.1
Junction Capacitance (pF)
1000
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0.1
1.0
10
t,Pulse duration,sec
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Fig 6. – Typical Junction Capacitance
TJ = 25°C
f = 1.0 MHz
Vsig =
50 V
100
10
0.1
0.01
Tj=25
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Fig 5. –typical transient thermal
impedance
1.0
Tj=75
0.001
0.4
0.6
0.8
1.0
Instantaneous Forward Voltage (V)
10
10
Number of Cycles at 60Hz
Fig 4. – Typical Reverse Characteristics
0.01
100
TJ = TJ max
8.3ms Single
Half Sine-
30
0
0.01
0.2
Transient thermal impedance(°C/W)
Peak forward surge current (A)
60 Hz
Resistive or
Inductive Load
Instantaneous Reverse Current (mA)
Instantaneous Forward Current (A)
Average Forward Rectified Current (A)
Fig. 1 – Forward Current Derating Curve
0.1
1
Reverse Voltage (V)
10
100
28-May-2016
B120F thru B1200F
3. dimension:
SOD-123FL
MILLIMETERS
MIN
MAX
3.5
3.9
0.75
0.95
2.6
3.0
1.6
2.0
0.45Typ
0.9
1.2
0.12
0.22
0.8Typ
DIM
A
B
C
D
E
H
J
K
INCHES
MIN
MAX
0.138
0.159
0.029
0.037
0.103
0.119
0.063
0.079
0.018Typ
0.036
0.047
0.005
0.009
0.032Typ
Suggested solder pad layout
B
C
A
Dimensions in inches and (millimeters)
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PACKAGE
A
B
C
SOD-123FL
0.044(1.10 )
0.040(1.00)
0.079(2.00)
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28-May-2016
B120F thru B1200F
4.Packing information
Unit:mm
Symbol
tolerance
SOD-123FL
Carrier width
A
0.1
2.00
Carrier length
B
0.1
3.85
Carrier depth
C
0.1
1.10
Sprocket hole
d
0.1
1.50
13" Reel outside diameter
D
2.0
-
Item
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13" Reel inner diameter
D1
min
-
7" Reel outside diameter
D
2.0
178.00
7" Reel inner diameter
D1
min
62.00
Feed hole diameter
D2
0.5
13.00
Sprocket hole position
E
0.1
1.75
Punch hole position
F
0.1
3.50
Punch hole pitch
P
0.1
4.00
Spocket hole pitch
P0
0.1
4.00
Embossment center
P1
0.1
2.00
Overall tape thickness
T
0.1
0.23
Tape width
W
0.3
8.00
Reel width
W1
1.0
11.40
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28-May-2016
B120F thru B1200F
5.Suggested thermal profile for soldering process
1. Storage environment:Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(TL to TP)
<3℃/sec
Preheat
- Temperature Min(Tsmin)
150℃
- Temperature Max(Tsmax)
- Time(min to max)(ts)
200℃
60~120sec
Tsmax to TL
<3sec
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time(tL)
Peak Temperature(TP)
Time within 5℃ of actual Peak
Temperature(TP )
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217℃
60-260sec
255 -0/+5℃
10~30sec
Ramp-down Rate
<6℃/sec
Time 25℃ to Peak Temperature
<6minutes
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28-May-2016
B120F thru B1200F
6.High reliability test capabilities
Item Test
Solder Resistance
Condition
Reference
at 260±5℃ for 10±2sec immerse
body into solder 1/16" ± 1/32"
MIL-STD-750D METHOD-2031
Solderability
at 245±5℃ for 5 sec
MIL-STD-202F METHOD-208
High Temperature Reverse Bias
VR =80% rate at Tj =150℃ for 168hr
MIL-STD-750D METHOD-1038
Forward Operation Life
Rated average rectifier current
TA=25℃ for 500hrs
MIL-STD-750D METHOD-1027
TA=25℃,IF=IO
Intermittent Operation Life
On state:power on for 5 min.
Off state:power off for 5 min.
MIL-STD-750D METHOD-1036
on and off for 500 cycles
Pressure Cooker
15PSIG at TA=121℃ for 4hrs
JESD22-A102
-55℃ to +125℃ dwelled for 30
Temperature Cycling
min.
and transferred for 5min. Total 10
MIL-STD-750D METHOD-1051
cycles
0℃ for 5min. Rise to 100℃ for
Thermal Shock
5min.
MIL-STD-750D METHOD-1056
Total 10 cycles
8.3ms single half sine-wave
Forward Surge
superimposed on rated load,one
MIL-STD-750D METHOD-4066-2
surge
Humidity
at TA=85℃,RH=85% for 1000hrs
MIL-STD-750D METHOD-1021
High Temperature Storage Life
at 175℃ for 1000hrs
MIL-STD-750D METHOD-1031
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