MC100LVEL58 3.3V ECL 2:1 Multiplexer Description The MC100LVEL58 is a 2:1 multiplexer. The device is pin and functionally equivalent to the EL58 and works from a 3.3 V supply. With AC performance similar to the EL58 device, the LVEL58 is ideal for low voltage applications which require the ultimate in AC performance. www.onsemi.com Features • 440 ps Typical Propagation Delays • ESD Protection: > 4 kV Human Body Model, 8 8 1 1 > 200 V Machine Model SOIC−8 NB D SUFFIX CASE 751 • The 100 Series Contains Temperature Compensation • PECL Mode Operating Range: VCC = 3.0 V to 3.8 V TSSOP−8 DT SUFFIX CASE 948R with VEE = 0 V • NECL Mode Operating Range: VCC = 0 V • • • • • • • with VEE = −3.0 V to −3.8 V Internal Input Pulldown Resistors Q Output will Default LOW with Inputs Open or at VEE Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Moisture Sensitivity Level ♦ Level 1 for SOIC−8 NB ♦ Level 3 for TSSOP−8 ♦ For Additional Information, see Application Note AND8003/D Flammability Rating: UL 94 V−0 @ 0.125 in, Oxygen Index: 28 to 34 Transistor Count = 93 devices These Devices are Pb-Free, Halogen Free and are RoHS Compliant MARKINGDIAGRAMS* 8 8 KVL58 ALYW G KV58 ALYWG G 1 1 SOIC−8 NB TSSOP−8 A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION Package Shipping† SOIC−8 NB (Pb-Free) 98 Units/Tube MC100LVEL58DTG TSSOP−8 (Pb-Free) 100 Units/Tube MC100LVEL58DTR2G TSSOP−8 (Pb-Free) 2500/Tape & Reel Device MC100LVEL58DG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2016 July, 2016 − Rev. 7 1 Publication Order Number: MC100LVEL58/D MC100LVEL58 NC 1 Da 2 1 8 VCC 7 Q 6 Q 5 VEE MUX Db 3 SEL 4 0 Figure 1. Logic Diagram and Pinout Assignment Table 1. PIN DESCRIPTION Table 2. TRUTH TABLE FUNCTION PIN Da, Db Q, Q SEL VCC VEE NC ECL Data Inputs ECL Differential Data Outputs ECL Select Input Positive Supply Negative Supply No Connect SEL Data H L a b Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Units VCC PECL Mode Power Supply VEE = 0 V 8 to 0 V VEE NECL Mode Power Supply VCC = 0 V −8 to 0 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 to 0 −6 to 0 V Iout Output Current Continuous Surge 50 100 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm SOIC−8 NB 190 130 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−8 NB 41 to 44 ± 5% °C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm TSSOP−8 185 140 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP−8 41 to 44 ± 5% °C/W Tsol Wave Solder Pb-Free 265 °C VI ≤ VCC VI ≥ VEE Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) www.onsemi.com 2 MC100LVEL58 Table 4. LVPECL DC CHARACTERISTICS (VCC = 3.3 V; VEE = 0.0 V (Note 1)) −40°C Symbol Characteristic Min 25°C Typ Max 21 28 Min 85°C Typ Max 21 28 Min Typ Max Unit 23 30 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 2215 2295 2420 2275 2345 2420 2275 2345 2420 mV VOL Output LOW Voltage (Note 2) 1470 1605 1745 1490 1595 1680 1490 1595 1680 mV VIH Input HIGH Voltage 2135 2420 2135 2420 2135 2420 mV VIL Input LOW Voltage 1490 1825 1490 1825 1490 1825 mV IIH Input HIGH Current 150 mA IIL Input LOW Current 150 150 0.5 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V. 2. Outputs are terminated through a 50ĂW resistor to VCC − 2.0 V. Table 5. LVNECL DC CHARACTERISTICS (VCC = 0.0 V; VEE = −3.3 V (Note 1)) −40°C Symbol Characteristic Typ Max 21 28 −1085 −1005 −880 Output LOW Voltage (Note 2) −1830 −1695 Input HIGH Voltage −1165 VIL Input LOW Voltage −1810 IIH Input HIGH Current IIL Input LOW Current IEE Power Supply Current VOH Output HIGH Voltage (Note 2) VOL VIH Min 25°C Min 85°C Typ Max 21 28 −1025 −955 −880 −1555 −1810 −1705 −880 −1165 −1475 −1810 150 0.5 Min Typ Max Unit 23 30 mA −1025 −955 −880 mV −1620 −1810 −1705 −1620 mV −880 −1165 −880 mV −1475 −1810 −1475 mV 150 mA 150 0.5 0.5 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary ±0.3 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 6. AC CHARACTERISTICS (VCC = 3.3 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −3.3 V (Note 1)) −40°C Symbol Characteristic fmax Maximum Toggle Frequency tPLH tPHL Propagation D to Q Delay SEL to Q tr tf Output Rise/Fall Times Q (20% − 80%) Min 25°C Typ Max Min TBD Typ 85°C Max Min TBD Typ Max TBD GHz 340 435 560 350 440 570 370 450 590 350 455 570 360 |460 580 380 470 600 320 100 320 100 100 Unit 320 ps ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. VEE can vary ±0.3 V. www.onsemi.com 3 MC100LVEL58 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 3.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices www.onsemi.com 4 MC100LVEL58 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC100LVEL58 PACKAGE DIMENSIONS TSSOP−8 CASE948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF M T U V S 0.25 (0.010) B −U− 4 M A −V− S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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