EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR GENERAL DESCRIPTION EM55M450/EM55Q450 series is a tiny-controller-based voice synthesizer IC which contains all the function of EM55000 series and has an MTP/QTP ROM inside. FEATURES EM55M450/EM55Q450 RAM (nibbles) 128 PROGRAM 32K*10 ROM(bits) 204Kx 10 I/O ports 4 I + 12 I/O D/A Green/Traditional DAC by option OSC Ring or Resonator type by option Reset Pin Yes • • Single power supply 2.4V~5.1V, suitable for 3 batteries application. Port1 and Port2 with wake-up function, Port3.2 with programmable IR (38KHz carry) communication function • • • • • • • • • Power down mode for saving power consumption Single ROM for voice and program data Readable ROM code data One 6-bit timer overflow control Two stacks for subroutine calling 5-bit ASPCM /7-bit PCM voice synthesizer Multiple playing speeds in 1KHz ~22KHz for voice playback Multiple levels of volume control Traditional fixed current D/A output to drive external connected transistor for speaker or direct drive output to speaker. • Package type: EM55M450 COB: COB type * This specification are subject to be changed without notice. 4.22.2003 (V1.2) 1 EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR EM55M450 H: dice type EM55M450 P: 40 PDIP package EM55Q450 H: dice type PIN ASSIGNMENT EM55M450 P2.3 1 40 P3.0 P2.2 2 39 P3.1 P2.1 3 38 P3.2 P2.0 4 37 P3.3 P1.3 5 36 P4.0 P1.2 6 35 P4.1 P1.1 7 34 P4.2 P1.0 8 33 P4.3 RESET 9 32 VDD VPP 10 31 CIN VSSD 11 30 VO1 OSCO 12 29 VSSC OSCI 13 28 VO NC 14 27 VCC NC 15 26 NC NC 16 25 NC NC 17 24 NC NC 18 23 NC NC 19 22 NC NC 20 21 NC PDIP 40 PIN * This specification are subject to be changed without notice. 4.22.2003 (V1.2) 2 EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR PIN DESCRIPTIONS Symbol P1.0 P1.1 P1.2 P1.3 P2.0/ PD0 P2.1/ PD1 P2.2/ PD2 P2.3/ PD3 P3.0/ RDYB P3.1 / WEB P3.2 / OEB P3.3/ ACLK P4.0 P4.1 P4.2 P4.3 TEST / VPP(MTP power) VDD VSSD VCC VSSC Cin OSCI / CLK OSCO RESET VO1 VO I/O I I I I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I I I I I I I I O O Function Bit 0 of Port 1 Bit 1 of Port 1 Bit 2 of Port 1 Bit 3 of Port 1 Bit 0 of Port 2 / Program data pin for parallel data bit 0,4 Bit 1 of Port 2 / Program data pin for parallel data bit 1,5 Bit 2 of Port 2 / Program data pin for parallel data bit 2,6 Bit 3 of Port 2 / Program data pin for parallel data bit 3,7 Bit 0 of Port 3 / Program Ready signal Bit 1 of Port 3 / programming write enable Bit 2 of Port 3 / programming output enable Bit 3 of Port 3 / programming address increase Bit 0 of Port 4 Bit 1 of Port 4 Bit 2 of Port 4 Bit 3 of Port 4 Test / Programming power source Positive power supply Power ground Analog positive power supply Analog power ground Regulator capacitor Oscillation component pin / Program clock Oscillation component pin RESET pin (active high) Push Pull voice output Constant current output / Push Pull voice output ABSOLUTE MAXIMUM RATING Items Symbol Min Max Unit VDD-VSS -0.3 6.0 V Input Voltage VIN VGND-0.3 VDD+0.3 V Operating Temperature TOP 0.0 +70.0 0 C Storage Temperature TSTG -25.0 +125.0 0 C Supply Voltage * This specification are subject to be changed without notice. 4.22.2003 (V1.2) 3 EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR ELECTRICAL CHARACTERISTICS (VDD=3V, 25oC unless otherwise specified) Items Operating Voltage Standby current operating current Sym. VDD IDDS IDDO Min 2.4 - Typ. 3.0 1.8 Max. 5.1 2 3.5 Unit V uA mA operating current IDDO - 3 6 mA Drive current of P2,P3, P4 Sink current of P2 (before KEYB) Sink current of P2 (after KEYB) Sink current of P3,P4 Input current of P1 Output current of VO IOD IOS IOS IOS IIH IVO 2.0 2.3 2.3 4.0 3.0 3.0 3.5 3.5 3.0 5.0 10.0 10.0 6 mA uA mA mA uA mA Output sink current of VO1, VO IVO 120 150. R FOSC 1.08 100 1.20 Oscillation resistor Oscillation freq. mA 1.32 KΩ MHz Condition no load no load, traditional D/A operate no load, Green voice D/A operate VO=2.4V VO=3V VO=0.4V VO=0.4V VO=3V VO=0.7V, traditional D/A operate Vo=Vo1=1.5 V, Green voice D/A operate osc=100 KΩ DC PROGRAMMING CHARACTERISTICS: Items VDD programming voltage VDD erase voltage VPP voltage(programming process) Input current Output high voltage Output low voltage VDD supply current VPP supply current Sym. VDD VDD VPP IIN VOH VOL IDD IPP Min. 4.7 4.7 11.3 2.4 - * This specification are subject to be changed without notice. Typ. 5.0 5.0 12 2.4 - Max. 5.3 5.3 12.7 7 0.4 100 50 Unit V V V uA V V mA mA Test Conditions VDD = 5V, VIN = 0~VDD IOH = 400uA IOL = 2.1mA VDD=5V VPP=12V 4.22.2003 (V1.2) 4 EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR APPLICATION CIRCUIT VCC VCC VO1 VDD VO OSCI Rosc P43 OSCO P42 TEST P41 Cin P40 0.1 uF P33 0.1 uF P32 VSSD P31 VSSC P30 P23 P13 P22 P12 P21 P11 P20 P10 VCC Note : TR1 TR5 TR9 TR13 TR17 TR2 TR6 TR10 TR14 TR18 TR3 TR7 TR11 TR15 TR19 TR4 TR8 TR12 TR16 TR20 It should add a 0.1 uF ceramic capacitor between Cin and ground. It is suggested to add a 0.1 uF ceramic capacitor between VDD and VSS. * This specification are subject to be changed without notice. 4.22.2003 (V1.2) 5 EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR PAD DIAGRAM (0,0) EM55M450/EM55Q450 12 OSCO 32 33 34 35 36 37 38 39 40 1 2 3 4 5 6 7 8 9 10 11 P3.0 P2.3 P2.2 P2.1 P2.0 P1.3 P1.2 P1.1 P1.0 RESET TEST/VPP VSSD 31 OSCI P3.1 CIN 13 P3.2 VO1 30 P3.3 29 P4.0 VSSC P4.1 28 P4.2 VO P4.3 27 VDD VCC * This specification are subject to be changed without notice. 4.22.2003 (V1.2) 6 EM55M/Q450 TINY-CONTROLLER-BASED MTP/QTP SOUND PROCESSOR Pin NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Symbol P2.3 P2.2 P2.1 P2.0 P1.3 P1.2 P1.1 P1.0 RESET TEST/VPP VSSD OSCO OSCI NC NC NC NC NC NC NC X -2.0 118.1 238.1 358.0 478.1 598.0 718.1 838.0 958.0 1101.5 1276.0 1304.0 1304.0 Y -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1013.4 -893.4 Pin NO. 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Symbol NC NC NC NC NC NC VCC VO VSSC VO1 CIN VDD P4.3 P4.2 P4.1 P4.0 P3.3 P3.2 P3.1 P3.0 X -1311.0 -1311.0 -1311.0 -1311.0 -1282.7 -1082.0 -962.0 -842.0 -722.0 -602.0 -481.9 -362.0 -242.0 -122.0 Y -616.0 -736.0 -856.0 -976.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 -1356.0 Chip size : 2920*3020 um For PCB layout, IC substrate must be connected to VSSD. * This specification are subject to be changed without notice. 4.22.2003 (V1.2) 7