Agilent HSDL-3612 IrDA® Data Compliant 115.2 kb/s 3 V to 5 V Infrared Transceiver Data Sheet Description The HSDL-3612 is a low-profile infrared transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data link. The module is compliant to IrDA Data Physical Layer Specifications 1.4 and IEC825-Class 1 Eye Safe. Functional Block Diagram VCC R1 LEDA (10) TXD (9) SP MD0 (4) HSDL-3612 MD1 (5) RXD (8) CX1 GND (7,3) CX2 VCC (1) AGND (2) Applications • Digital imaging – Digital still cameras – Photo-imaging printers • Data communication – Notebook computers – Desktop PCs – Win CE handheld products – Personal Digital Assistants (PDAs) – Printers – Fax machines, photocopiers – Screen projectors – Auto PCs – Dongles – Set-Top box • Telecommunication products – Cellular phones – Pagers • Small industrial & medical instrumentation – General data collection devices – Patient & pharmaceutical data collection devices Features • Fully compliant to IrDA 1.0 physical layer specifications – 9.6 kb/s to 115.2 kb/s operation • Typical link distance > 1.5 m • IEC825-Class 1 eye safe • Low power operation range – 2.7 V to 5.25 V • Small module size – 4.0 x 12.2 x 5.1 mm (HxWxD) • Complete shutdown – TXD, RXD, PIN diode • Low shutdown current – 10 nA typical • Adjustable optical power management – Adjustable LED drive-current to maintain link integrity • Integrated EMI shield – Excellent noise immunity • Edge detection input – Prevents the LED from long turn-on time • Interface to various super I/O and controller devices • Designed to accommodate light loss with cosmetic window • Only 2 external components are required The HSDL-3612 contains a highspeed and high-efficiency 870 nm LED, a silicon PIN diode, and an integrated circuit. The IC contains an LED driver and a receiver providing a single output (RXD) for all data rates supported. for adjustable optical power. With two programming pins; MODE 0 and MODE 1, the optical power output can be adjusted lower when the nominal desired link distance is one-third or two-third of the full IrDA link. The HSDL-3612 can be completely shut down to achieve very low power consumption. In the shut down mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. The HSDL-3612 also incorporated the capability The HSDL-3612 front view options (HSDL-3612-007/-037) and a top view packaging option (HSDL-3612-008/-038) come with integrated shield that helps to ensure low EMI emission and high immunity to EMI field, thus enhancing reliable performance. Ordering Information Package Option 2 Application Support Information The Application Engineering group is available to assist you with the technical understanding associated with HSDL-3612 infrared transceiver module. You can contact them through your local sales representatives for additional details. Package Front View Part Number HSDL-3612-007 Standard Package Increment 400 Front View HSDL-3612-037 1800 Top View HSDL-3612-008 400 Top View HSDL-3612-038 1800 I/O Pins Configuration Table Pin 1 2 3 4 5 6 7 8 9 10 Description Supply Voltage Analog Ground Ground Mode 0 Mode 1 No Connection Ground Receiver Data Output Transmitter Data Input LED Anode Symbol V CC AGND GND MD0 MD1 NC GND RXD TXD LEDA 10 9 8 7 6 5 4 3 2 10 9 8 7 6 5 4 3 2 Mode 1 0 0 1 1 RX Function Shutdown SIR SIR SIR TX Function Shutdown Full Distance Power 2/3 Distance Power 1/3 Distance Power Transceiver I/O Truth Table Transceiver Mode Active Active Active Shutdown X = Don’t Care Inputs TXD 1 0 0 X[3] EI X High[1] Low Low Outputs LED On Off Off Not Valid RXD Not Valid Low[2] High Not Valid EI = In-Band Infrared Intensity at detector Notes: 1. In-Band El ≤ 115.2 kb/s. 2. Logic Low is a pulsed response. The condition is maintained for duration dependent on the pattern and strength of the incident intensity. 3. To maintain low shutdown current, TXD needs to be driven high or low and not left floating. 3 1 BOTTOM VIEW (HSDL-3612-008/-038) Transceiver Control Truth Table Mode 0 1 0 0 1 1 BACK VIEW (HSDL-3612-007/-037) Recommended Application Circuit Components Component R1 Recommended Value 6.2 Ω ± 5%, 0.5 Watt, for 2.7 ≤ VCC ≤ 3.6 V operation 15.0 Ω ± 5%, 0.5 Watt, for 4.75 ≤ VCC ≤ 5.25 V operation 0.47 µF ± 20%, X7R Ceramic 6.8 µF ± 20%, Tantalum CX1[4] CX2[5] Notes: 4. CX1 must be placed within 0.7 cm of the HSDL-3612 to obtain optimum noise immunity. 5. In "HSDL-3612 Functional Block Diagram" on page 1 it is assumed that Vled and VCC share the same supply voltage and filter capacitors. In case the 2 pins are powered by different supplies CX2 is applicable for Vled and CX1 for VCC . In environments with noisy power supplies, including CX2 on the VCC line can enhance supply rejection performance. 0.7 200 180 0.6 160 140 LOP (mW/sr) ILED (A) 0.5 0.4 0.3 120 100 80 60 0.2 40 0.1 0 1.3 20 1.5 1.7 1.9 2.1 LEDA VOLTAGE (V) ILED vs. LEDA. 2.3 0 0 30 60 90 120 150 180 210 240 270 300 ILED (mA) Light Output Power (LOP) vs. ILED. Marking Information The HSDL-3612-007/-037 is marked “3612YYWW” on the shield where “YY” indicates the unit’s manufacturing year, and “WW” refers to the work week in which the unit is tested. CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 4 Absolute Maximum Ratings [6] Parameter Storage Temperature Operating Temperature DC LED Current Peak LED Current Symbol TS TA ILED(DC) ILED(PK) Minimum –40 –20 Maximum +100 +70 165 750 Unit °C °C mA mA LED Anode Voltage Supply Voltage Transmitter Data Input Current Receiver Data Output Voltage VLEDA Vcc ITXD(DC) –0.5 0 –12 7 7 12 V V mA VO –0.5 Vcc+0.5 V Conditions ≤ 2 µs pulse width, ≤ 10% duty cycle |IO(RXD)| = 20 µA Note: 6. For implementations where case to ambient thermal resistance ≤ 50°C/W. Recommended Operating Conditions Parameter Operating Temperature Supply Voltage Logic High Input Voltage for TXD, MD0, MD1, and FIR_SEL Logic Low Transmitter Input Voltage LED (Logic High) Current Pulse Amplitude Receiver Signal Rate 5 Symbol TA VCC VIH Minimum –20 2.7 2 VCC/3 Maximum +70 5.25 VCC Unit °C V V VIL ILEDA 0 180 2.4 VCC/3 300 115.2 V mA kb/s Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25 °C and 3.3 V unless otherwise noted. Parameter Transceiver Supply Current Digital Input Current Transmitter Transmitter Radiant Intensity Symbol Typ. Max. Unit Conditions VI(TXD) ≤ VIL or VI(TXD) ≥ VIH VI(TXD) ≤ VIL, EI = 0 0 ≤ VI ≤ VCC Shutdown I CC1 10 200 nA Idle Logic Low/High ICC2 IL/H 2.5 –1 5 1 mA µA Logic High Intensity EIH 50 120 400 mW/sr Peak Wavelength Spectral Line Half Width Viewing Angle Optical Pulse Width Rise and Fall Times λP 875 nm ∆λ1/2 35 nm Maximum Optical Pulse Width tpw (max) LED Anode On State Voltage LED Anode Off State Leakage Current 6 Min. 2θ1/2 tpw (EI) 30 1.5 1.6 tr (EI), tf (EI) 20 VON(LEDA) ILK(LEDA) 1 60 1.8 ° µs 40 ns 50 µs 2.4 V 100 nA VIH = 3.0 V ILEDA = 200 mA θ1/2 ≤ 15° tpw(TXD) = 1.6 µs at 115.2 kb/s tpw(TXD) = 1.6 µs at 115.2 kb/s tr/f (TXD) = 10 ns TXD pin stuck high ILEDA = 200 mA, VI(TXD) ≥ VIH VLEDA = VCC = 5.25 V, VI(TXD) ≤ VIL Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25 °C and 3.3 V unless otherwise noted. Receiver Receiver Data Output Voltage Parameter Symbol Min. Typ. Max. Unit Logic Low[7] VOL 0 - 0.4 V Logic High VOH VCC – 0.2 - VCC V 2θ1/2 EIH 30 0.0036 500 ° mW/cm2 0.3 µW/cm2 Viewing Angle Logic High Receiver Input Irradiance Logic Low Receiver Input Irradiance Receiver Peak Sensitivity Wavelength Receiver SIR Pulse Width Receiver Latency Time Receiver Rise/Fall Times Receiver Wake Up Time EIL λP tpw (SIR) tL tr/f (RXD) tW 880 1 20 25 Conditions IOL = 1.0 mA, EI ≥ 3.6 µW/cm2 , θ1/2 ≤ 15° IOH = –20 µA, EI ≤ 0.3 µW/cm2 , θ1/2 ≤ 15° For in-band signals ≤ 115.2 kb/s[8] For in-band signals[8] nm 4.0 50 100 µs µs ns µs θ1/2 ≤ 15°[9], CL = 10 pF [10] Notes: 7. Logic Low is a pulsed response. The condition is maintained for duration dependent on pattern and strength of the incident intensity. 8. An in-band optical signal is a pulse/sequence where the peak wavelength, lp, is defined as 850 ≤ lp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 9. For in-band signals ≤ 115.2 kb/s where 3.6 µW/cm2 ≤ EI ≤ 500 mW/cm2 . 10. Wake Up Time is the time between the transition from a shutdown state to an active state and the time when the receiver is active and ready to receive infrared signals. 7 TXD “Stuck ON” Protection TXD LED tpw (MAX.) RXD Output Waveform tpw VOH 90% 50% VOL 10% tf tr LED Optical Waveform tpw LED ON 90% 50% 10% LED OFF tr tf Receiver Wake Up Time Definition (when MD0 π 1 and MD1 π 0) RX LIGHT RXD VALID DATA tw 8 HSDL-3612-007 and HSDL3612-037 Package Outline with Dimension and Recommended PC Board Pad Layout MOUNTING CENTER 6.10 PIN FUNCTION PIN FUNCTION 1 VCC 6 NC 2 AGND 7 GND 3 GND 8 RXD 4 MD0 9 TXD 5 MD1 10 LEDA 1.17 4.18 4.98 TOP VIEW 2.45 R 2.00 R 1.77 4.00 1.90 1.90 0.80 0.80 1.70 1.20 3.24 4.05 SIDE VIEW 3.84 12.20 FRONT VIEW ALL DIMENSIONS IN MILLIMETERS (mm). DIMENSION TOLERANCE IS 0.20 mm UNLESS OTHERWISE SPECIFIED. MOUNTING CENTER MID OF LAND PIN 1 PIN 10 0.70 0.43 1.05 PIN 10 2.40 PIN 1 2.08 0.45 0.70 4.95 10 CASTELLATION: PITCH 1.1 ± 0.1 CUMULATIVE 9.90 ± 0.1 BACK VIEW 9 2.35 2.84 LAND PATTERN HSDL-3612-008 and HSDL3612-038 Package Outline with Dimension and Recommended PC Board Pad Layout 11.7 5 0.36 0.53 2.5 0.47 0.85 R2 .3 0.31 0.31 2.08 0.84 3.85 .1 R2 0.83 0.3 4.16 +0.05 - 0.00 2.08 1.46 0.42 2.57 0.28 1.77 0.94 3.24 3.84 5 2.15 +0.05 - 0.00 5 12.2 +0.10 - 0.00 11.7 +0.05 - 0.00 0.1 4.65 R2 R1 .77 0.1 0.94 0.8 0.73 10 1.95 Tape and Reel Dimensions (HSDL-3612-007, -037) ALL DIMENSIONS IN MILLIMETERS (mm) QUANTITY = 400 PIECES PER REEL (HSDL-3612-007) 1800 PIECES PER TAPE (HSDL-3612-037) 13.00 ± 0.50 R 1.00 (40 mm MIN.) EMPTY (400 mm MIN.) LEADER PARTS MOUNTED 21.00 ± 0.80 EMPTY (40 mm MIN.) 2.00 ± 0.50 DIRECTION OF PULLING CONFIGURATION OF TAPE LABEL SHAPE AND DIMENSIONS OF REELS A 10° 4 ∅1.55 ± 0.05 5 2.00 ± 0.10 6 4.00 ± 0.10 B 3 1.75 ± 0.10 5° (MAX.) 11.50 ± 0.10 2 12 12.50 ± 0.10 A 3.8 24.00 ± 0.30 1 ∅1.5 ± 0.1 8 A A 8.00 ± 0.10 7 B 10 0.40 ± 0.10 11 4.25 ± 0.10 SECTION B-B 5° (MAX.) 4.4 A 5.20 ± 0.10 9 SECTION A-A 11 A A Tape and Reel Dimensions (HSDL-3612-008, -038) QUANTITY = 400 PIECES PER REEL (HSDL-3612-008) 1800 PIECES PER TAPE (HSDL-3612-038) ALL DIMENSIONS IN MILLIMETERS (mm) 13.00 ± 0.50 R 1.00 (40 mm MIN.) EMPTY (400 mm MIN.) LEADER PARTS MOUNTED 21.00 ± 0.80 EMPTY (40 mm MIN.) 2.00 ± 0.50 DIRECTION OF PULLING CONFIGURATION OF TAPE LABEL SHAPE AND DIMENSIONS OF REELS Po Do P2 D1 B E 5° (MAX.) F W Bo 8 ± 0.10 A A T B P1 5.4 ± 0.15 Ko 5° (MAX.) SECTION B-B Ao SECTION A-A SYMBOL SPEC SYMBOL SPEC Ao Bo Ko Po P1 P2 T 4.4 ± 0.10 12.50 ± 0.10 4.85 ± 0.10 4.0 ±0.10 8.0 ± 0.10 2.0 ± 0.10 0.35 ± 0.10 E F Do D1 W 10Po 1.75 ± 0.10 11.5 ± 0.10 1.55 ± 0.10 1.5 ± 0.10 24.0 ± 0.3 40.0 ± 0.20 NOTES: 1. I.D. sprocket hole pitch cumulative tolerance is ± 0.2 mm. 2. Corner camber shall be not more than 1 mm per 100 mm through a length of 250 mm. 3. Ao and Bo measured on a place 0.3 mm above the bottom of the pocket. 4. Ko measured from a place on the inside bottom of the pocket to top surface of carrier. 5. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. 12 Moisture Proof Packaging All HSDL-3612 options are shipped in moisture proof package. Once opened, moisture absorption begins. UNITS IN A SEALED MOISTURE-PROOF PACKAGE Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temp. Time In reels 60°C ≥ 48 hours In bulk 100°C ≥ 4 hours 125°C ≥ 2 hours 150°C ≥ 1 hour Baking should be done only once. PACKAGE IS OPENED (UNSEALED) Recommended Storage Conditions ENVIRONMENT LESS THAN 30°C, AND LESS THAN 60% RH Storage Temperature 10°C to 30°C Relative Humidity below 60% RH YES NO BAKING IS NECESSARY YES PACKAGE IS OPENED LESS THAN 72 HOURS NO PERFORM RECOMMENDED BAKING CONDITIONS 13 NO Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. If times longer than 72 hours are needed, the parts must be stored in a dry box. Reflow Profile MAX. 245°C T – TEMPERATURE – (°C) 230 R3 200 183 170 150 R2 90 sec. MAX. ABOVE 183°C 125 R1 100 R4 R5 50 25 0 50 100 150 200 250 300 t-TIME (SECONDS) P1 HEAT UP Process Zone Heat Up Solder Paste Dry P2 SOLDER PASTE DRY Symbol P1, R1 P2, R2 P3, R3 Solder Reflow Cool Down P3, R4 P4, R5 The reflow profile is a straightline representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different ∆T/∆time temperature change rates. The ∆T/∆time rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-3612 castellation I/O pins are heated to a temperature of 125°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4°C per second to allow for even heating of both the PC board and HSDL-3612 castellation I/O pins. 14 P3 SOLDER REFLOW P4 COOL DOWN DT 25°C to 125°C 125°C to 170°C 170°C to 230°C (245°C at 10 seconds max.) 230°C to 170°C 170°C to 25°C Process zone P2 should be of sufficient time duration (> 60 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 170°C (338°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 230°C (446°F) for optimum results. The dwell time above the liquidus point of solder should be between 15 and 90 seconds. It usually takes about 15 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 90 seconds, the intermetallic growth within the solder connections becomes excessive, Maximum DT/Dtime 4°C/s 0.5°C/s 4°C/s -4°C/s -3°C/s resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 170°C (338°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed -3°C per second maximum. This limitation is necessary to allow the PC board and HSDL-3612 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3612 transceiver. Appendix A: HSDL-3612-007/-037 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCBA Figure 1.0. Stencil and PCBA. 1.1 Recommended Land Pattern for HSDL-3612-007/-037 Dim. a b c (pitch) d e f g mm 2.40 0.70 1.10 2.35 2.80 3.13 4.31 Inches 0.095 0.028 0.043 0.093 0.110 0.123 0.170 SHIELD SOLDER PAD Rx LENS Tx LENS e d g b Y f a X theta FIDUCIAL 10x PAD Figure 2.0. Top view of land pattern. 15 c FIDUCIAL 1.2 Adjacent Land Keep-out and Solder Mask Areas Dim. h j k l mm min. 0.2 13.4 4.7 3.2 Inches min. 0.008 0.528 0.185 0.126 Note: Wet/Liquid Photo-Imaginable solder resist/mask is recommended. j • Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. Tx LENS LAND Rx LENS SOLDER MASK h k Y • “h” is the minimum solder resist strip width required to avoid solder bridging adjacent pads. • It is recommended that 2 fiducial cross be placed at midlength of the pads for unit alignment. 2.0 Recommended Solder Paste/ Cream Volume for Castellation Joints Based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume). 16 l Figure 3.0. HSDL-3612-007/-037 PCBA – Adjacent land keep-out and solder mask. 2.1 Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used: See Fig 4.0 t, nominal stencil thickness l, length of aperture mm inches mm inches 0.152 0.006 2.8 ± 0.05 0.110 ± 0.002 0.127 0.005 3.4 ± 0.05 0.134 ± 0.002 w, the width of aperture is fixed at 0.70 mm (0.028 inches) Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions APERTURE AS PER LAND DIMENSIONS t (STENCIL THICKNESS) SOLDER PASTE w l Figure 4.0. Solder paste stencil aperture. 3.0 Pick and Place Misalignment Tolerance and Product SelfAlignment after Solder Reflow If the printed solder paste volume is adequate, the unit will selfalign in the X-direction after solder reflow. Units should be properly reflowed in IR Hot Air convection oven using the recommended reflow profile. The direction of board travel does not matter. 17 Allowable Misalignment Tolerance X – direction Theta – direction ≤ 0.2 mm (0.008 inches) ± 2 degrees 3.1 Tolerance for X-axis Alignment of Castellation Misalignment of castellation to the land pad should not exceed 0.2 mm or approximately half the width of the castellation during placement of the unit. The castellations will completely selfalign to the pads during solder reflow as seen in the pictures below. Photo 1.0. Castellation misaligned to land pads in x-axis before reflow. 3.2 Tolerance for Rotational (Theta) Misalignment Units when mounted should not be rotated more than ± 2 degrees with reference to center X-Y as specified in Fig 2.0. Pictures 3.0 and 4.0 show units before and Photo 3.0. Unit is rotated before reflow. Photo 2.0. Castellation self-align to land pads after reflow. after reflow. Units with a Theta misalignment of more than 2 degrees do not completely self align after reflow. Units with ± 2 degree rotational or Theta misalignment self-aligned completely after solder reflow. Photo 4.0. Unit self-aligns after reflow. 3.3 Y-axis Misalignment of Castellation In the Y-direction, the unit does not self-align after solder reflow. It is recommended that the unit be placed in line with the fiducial mark (mid-length of land pad.) This will enable sufficient land length (minimum of 1/2 land length.) to form a good joint. See Fig 5.0. LENS EDGE FIDUCIAL Y MINIMUM 1/2 THE LENGTH OF THE LAND PAD Figure 5.0. Section of a castellation in Y-axis. 3.4 Example of Good HSDL-3612007/-037 Castellation Solder Joints This joint is formed when the printed solder paste volume is adequate, i.e. 0.30 cubic mm and reflowed properly. It should be reflowed in IR Hot-air convection reflow oven. Direction of board travel does not matter. Photo 5.0. Good solder joint. 4.0 Solder Volume Evaluation and Calculation Geometry of an HSDL-3612-007/ -037 solder fillet. 0.425 0.20 0.8 0.4 1.2 0.70 0.7 Appendix B: HSDL-3612-008/-038 SMT Assembly Application Note 1.0. Solder Pad, Mask, and Metal Solder Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCBA Figure 1. Stencil and PCBA. 1.1. Recommended Land Pattern for HSDL-3612-008/-038 SHIELD SOLDER PAD e Dim. a b c (pitch) d e f g mm 1.95 0.60 1.10 1.60 5.70 3.80 2.40 inches 0.077 0.024 0.043 0.063 0.224 0.123 0.170 d g Y Rx LENS b Tx LENS theta f X h a FIDUCIAL 20 10x PAD c FIDUCIAL 2.0 Y-axis Misalignment of Castellation In the Y-direction, the unit does not self-align after solder reflow. It is recommended that the unit be placed in line with the fiducial mark (mid-length of land pad). This will enable sufficient land length (minimum of 1/2 land length) to form a good joint. See Figure 2. Y FIDUCIAL 1/2 THE LENGTH OF THE CASTELLATION PAD Figure 2. Section of a castellation in Y-axis. 21 Appendix C: Optical Port Dimensions for HSDL-3612: To ensure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maximum dimensions minimize the effects of stray light. The minimum size corresponds to a cone angle of 300 and the maximum size corresponds to a cone angle of 60º. In the figure below, X is the width of the window, Y is the height of the window and Z is the distance from the HSDL-3612 to OPAQUE MATERIAL the back of the window. The distance from the center of the LED lens to the center of the photodiode lens, K, is 7.08mm. The equations for computing the window dimensions are as follows: X = K + 2*(Z+D)*tanA Y = 2*(Z+D)*tanA The above equations assume that the thickness of the window is negligible compared to the distance of the module from the back of the window (Z). If they are comparable, Z' replaces Z in the above equation. Z' is defined as Z'=Z+t/n where ‘t’ is the thickness of the window and ‘n’ is the refractive index of the window material. The depth of the LED image inside the HSDL-3612, D, is 8mm. ‘A’ is the required half angle for viewing. For IrDA compliance, the minimum is 150 and the maximum is 300 . Assuming the thickness of the window to be negligible, the equations result in the following tables and graphs: IR TRANSPARENT WINDOW Y X IR TRANSPARENT WINDOW K Z A D Section of a castellation in Y-axis. 22 OPAQUE MATERIAL Aperture Width (x, mm) max. min. 16.318 11.367 17.472 11.903 18.627 12.439 19.782 12.975 20.936 13.511 22.091 14.047 23.246 14.583 24.401 15.118 25.555 15.654 26.710 16.190 APERTURE WIDTH (X) vs MODULE DEPTH APERTURE HEIGHT (Y) vs MODULE DEPTH 30 25 25 20 15 10 X MAX. X MIN. 5 0 0 1 2 3 4 5 6 7 MODULE DEPTH (Z) – mm 23 APERTURE HEIGHT (Y) – mm APERTURE WIDTH (X) – mm Module Depth, (z) mm 0 1 2 3 4 5 6 7 8 9 Aperture height (y, mm) max. min. 9.238 4.287 10.392 4.823 11.547 5.359 12.702 5.895 13.856 6.431 15.011 6.967 16.166 7.503 17.321 8.038 18.475 8.574 19.630 9.110 8 9 20 15 10 5 0 0 Y MAX. Y MIN. 1 2 3 4 5 6 7 MODULE DEPTH (Z) – mm 8 9 Window Material Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture. An IR filter dye may be used in the window to make it look black to the eye, but the total optical loss of the window should be 10 percent or less for best optical performance. Light loss should be measured at 875 nm. Shape of the Window From an optics standpoint, the window should be flat. This Flat Window (First choice) 24 ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical or industrial design reasons, place the same curve on the back side of the window that has an identical radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will significantly reduce the effects. The amount of change in the radiation pattern is dependent upon the material chosen for the Curved Front and Back (Second choice) window, the radius of the front and back curves, and the distance from the back surface to the transceiver. Once these items are known, a lens design can be made which will eliminate the effect of the front surface curve. The following drawings show the effects of a curved window on the radiation pattern. In all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm. Curved Front, Flat Back (Do not use) www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2003 Agilent Technologies, Inc. Obsoletes 5988-8423EN April 30, 2003 5988-9349EN