LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Parts LG-150SE/G-CT DATA SHEET DOC. NO : QW0905-LG-150SE/G-CT REV. : A DATE : 21 - Jun - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SE/G-CT Page 1/11 Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with infrared and vapor phase reflow solder process. Descriptions: 1. The LG-150SE/G SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: COLOR PART NO LG-150SE/G-CT MATERIAL Emitted GaAsP/GaP Orange GaP Green Lens Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SE/G-CT Page 2/11 Package Dimensions Cathode Mark 1.1 0.5 2 1 Resin 3.2 0.6 2.0 DIE2 Soldering Terminal DIE1 0.6 4 3 PCB 0.4 0.6 1.6 2 1 G SE 4 3 Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 0.7 0.4 0.7 0.8 1.8 0.8 Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm. 0.6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/11 PART NO. LG-150SE/G-CT Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol SE G UNIT Power Dissipation PD 65 65 mW Peak Forward Current Duty 1/10@10KHz IFP 80 120 mA Forward Current IF 25 25 mA Reverse Current @5V Ir 10 10 μA Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max Typical Electrical & Optical Characteristics (Ta=25 ℃) Items Luminous Intensity Symbol Min. Dominant Wavelength Spectral Line Half-Width Forward Voltage λP λD △λ SE 3.2 5.0 ---- 5.0 10 ---- SE ---- 610 ---- G ---- 565 ---- SE ---- 603 ---- G ---- 573 ---- SE ---- 45 ---- G ---- 30 ---- SE 1.7 ---- 2.6 1.7 ---- 2.6 SE ---- 140 ---- G 140 ---- VF G 2θ 1/2 Viewing Angle Max. UNIT Iv G Peak Wavelength Typ. ---- Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. CONDITION mcd IF=20mA nm IF=20mA nm IF=20mA nm IF=20mA V IF=20mA deg IF=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SE/G-CT Page 4/11 Typical Electro-Optical Characteristics Curve SE CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1.0 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 3.0 Relative Intensity@20mA Normalize @25℃ 1.2 Forward Voltage@20mA Normalize @25 ℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 0.5 0.0 600 650 Wavelength (nm) 700 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Fig.6 Directive Radiation 1.0 550 2.5 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 10 750 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SE/G-CT Page 5/11 Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 5.0 1.0 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) 500 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 Fig.6 Directive Radiation 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SE/G-CT Page 6/11 Carrier Type Dimensions 4.0±0.2 2.0 0.23 1.5 1.75 3.5±0.2 8.0±0.3 5.3 3.38 Polarity 4.0±0.2 1.36 1.76 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. • Packing Specifications Label Aluminum Moist-Proof bag Label Part No. Description Quantity/Reel LG-150SE/G-CT 8.0mm tape,7"reel 3000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SE/G-CT Page 7/11 Label Explanation BIN H : Orange Chip Luminous Intensity 立碁電子工業股份有限公司 LIGITEK LED LIGITEK ELECTRONICS CO., LTD. BIN K : Green Chip Luminous Intensity PART NO. : LG-150SE/G-CT HUE 22 : Orange Chip Dominant Wavelength LOT NO. : MC9400123 Q'TY(PCS) : 3000 PCS HUE 9 : Green Chip Dominant Wavelength VF:1.8 - 2.6 BIN/HUE : H/22-K/9 VF:1.8 - 2.6 1.8 - 2.6 : Forward Voltage Reel Dimensions 0.2 0.4 0.8 0.8 0.6 0.2 0.4 0.6 2.0±0.5 178±1.5 6.0±1.0 9.0±1.0 ψ13.5±1.0 12.0± 1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/11 PART NO. LG-150SE/G-CT Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-150SE/G-CT Page 9/11 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245± 5℃ within 5 sec Preheat 120 ~ 150℃ 120 ~ 180 sec 3-1. LEAD Reflow Solder Temp. (℃) 240 Rising +5 ℃/sec Cooling -5℃/sec Preheat 150 120 60 ~ 120 sec Time 5sec 3-2 PB-Free Reflow Solder 1~5° C/sec Preheat 180~200 ° C 1~5° C/sec 260° C MaX. 10sec.Max Above 220 ° C 60 sec.Max. 120 sec.Max. Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 10/11 PART NO. LG-150SE/G-CT Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 11/11 PART NO. LG-150SE/G-CT Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=1000hrs ±2hrs Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling IR Reflow 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface 1.105 ℃ ~ 25℃ ~ - 55℃ ~ 25℃ 30mins 5mins 30mins 5mins 2.10 Cyeles 1.T=260 ° C Max. 10sec.Max. 2. 6 Min MIL-STD-202F:103B JIS C 7021: B-11 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 MIL-STD-750D:2031.2 J-STD-020