FUJITSU SEMICONDUCTOR DATA SHEET DS05-20868-3E FLASH MEMORY CMOS 2M (256K × 8) BIT MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ FEATURES • • • • • • • • • • • • • • • Single 5.0 V read, write, and erase Minimizes system level power requirements Compatible with JEDEC-standard commands Pinout and software compatible with single-power supply Flash Superior inadvertent write protection 32-pin TSOP(I) (Package Suffix: PFTN-Normal Bend Type, PFTR-Reverse Bend Type) 32-pin PLCC (Package Suffix: PD) Minimum 100,000 write/erase cycles High performance 55 ns maximum access time Sector erase architecture One 16K byte, two 8K bytes, one 32K byte, and three 64K bytes Any combination of sectors can be erased. Also supports full chip erase Boot Code Sector Architecture T = Top sector B = Bottom sector Embedded Erase™ Algorithms Automatically pre-programs and erases the chip or any sector Embedded Program™ Algorithms Automatically programs and verifies data at specified address Data Polling and Toggle Bit feature for detection of program or erase cycle completion Low VCC write inhibit ≤ 3.2 V Hardware RESET pin Resets internal state machine to the read mode Erase Suspend/Resume Supports reading or programming data to a sector not being erased Sector protection Hardware method that disables any combination of sector from write or erase operation Temporary sector unprotection Temporary sector unprotection via the RESET pin Embedded Erase™, Embedded Program™ and ExpressFlash™ are trademarks of Advanced Micro Devices, Inc. MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ PACKAGE 32-pin plastic TSOP(I) 32-pin plastic TSOP(I) Marking Side Marking Side (FPT-32P-M24) (FPT-32P-M25) 32-pin plastic QFJ (PLCC) Marking Side (LCC-32P-M02) 2 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ GENERAL DESCRIPTION The MBM29F002TC/BC is a 2 M-bit, 5.0 V-Only Flash memory organized as 256K bytes of 8 bits each. The MBM29F002TC/BC is offered in a 32-pin TSOP(I) and 32-pin PLCC packages. This device is designed to be programmed in-system with the standard system 5.0 V VCC supply. A 12.0 V VPP is not required for program or erase operations. The device can also be reprogrammed in standard EPROM programmers. The standard MBM29F002TC/BC offers access times between 55 ns and 90 ns allowing operation of high-speed microprocessors without wait states. To eliminate bus contention the device has separate chip enable (CE), write enable (WE), and output enable (OE) controls. The MBM29F002TC/BC is command set compatible with JEDEC standard E2PROMs. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from 12.0 V Flash or EPROM devices. The MBM29F002TC/BC is programmed by executing the program command sequence. This will invoke the Embedded Program Algorithm which is an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. Each sector can be programmed and verified in less than 0.5 seconds. Erase is accomplished by executing the erase command sequence. This will invoke the Embedded Erase Algorithm which is an internal algorithm that automatically preprograms the array if it is not already programmed before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin. This device also features a sector erase architecture. The sector erase mode allows for sectors of memory to be erased and reprogrammed without affecting other sectors. A sector is typically erased and verified within 1 second (if already completely preprogrammed). The MBM29F002TC/BC is erased when shipped from the factory. The MBM29F002TC/BC device also features hardware sector protection. This feature will disable both program and erase operations in any number of secotrs (0 through 6). Fujitsu has implemented an Erase Suspend feature that enables the user to put erase on hold for any period of time to read data from or program data to a non-busy sector. Thus, true background erase can be achieved. The device features single 5.0 V power supply operation for both read and program functions. Internally generated and regulated voltages are provided for the program and erase operations. A low VCC detector automatically inhibits write operations during power transitions. The end of program or erase is detected by Data Polling of DQ7, or by the Toggle Bit I feature on DQ6. Once the end of a program or erase cycle has been completed, the device automatically resets to the read mode. The MBM29F002TC/BC also has a hardware RESET pin. When this pin is driven low, execution of any Embedded Program or Embedded Erase operations will be terminated. The internal state machine will then be reset into the read mode. The RESET pin may be tied to the system reset circuity. Therefore, if a system reset occurs during the Embedded Program or Embedded Erase operation, the device will be automatically reset to a read mode. This will enable the system microprocessor to read the boot-up firmware from the Flash memory. Fujitsu's Flash technology combines years of EPROM and E2PROM experience to produce the highest levels of quality, reliability, and cost effectiveness. The MBM29F002TC/BC memory electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunneling. The bytes are programmed one byte at a time using the EPROM programming mechanism of hot electron injection. 3 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ FLEXIBLE SECTOR-ERASE ARCHITECTURE • One 16K byte, two 8K bytes, one 32K byte, and three 64K bytes • Individual-sector, multiple-sector, or bulk-erase capability • Individual or multiple-sector protection is user definable 3FFFFH 16K byte 3FFFFH 64K byte 3BFFFH 8K byte 2FFFFH 64K byte 39FFFH 8K byte 1FFFFH 64K byte 37FFFH 32K byte 0FFFFH 32K byte 2FFFFH 64K byte 07FFFH 8K byte 1FFFFH 64K byte 05FFFH 8K byte 03FFFH 0FFFFH 64K byte 16K byte 00000H MBM29F002TC Sector Architecture 4 00000H MBM29F002BC Sector Architecture MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ PRODUCT LINE UP Part No. MBM29F002TC/BC VCC = 5.0 V ± 5% -55 — — VCC = 5.0 V ± 10% — -70 -90 Max. Address Access Time (ns) 55 70 90 Max. CE Access Time (ns) 55 70 90 Max. OE Access Time (ns) 30 30 35 Ordering Part No. ■ BLOCK DIAGRAM DQ0 to DQ7 VCC VSS Erase Voltage Generator WE Input/Output Buffers State Control RESET Command Register Program Voltage Generator Chip Enable Output Enable Logic CE OE STB Low VCC Detector Timer for Program/Erase Address Latch STB Data Latch Y-Decoder Y-Gating X-Decoder Cell Matrix A0 to A17 5 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ CONNECTION DIAGRAMS A12 A15 A16 RESET V CC WE A17 PLCC 4 3 2 1 32 31 30 A13 A5 7 27 A8 A4 8 26 A9 A3 9 25 A11 A2 10 24 OE A1 11 23 A10 A0 12 22 CE DQ0 13 21 DQ7 14 15 16 17 18 19 20 DQ6 28 DQ 5 6 DQ 4 A6 DQ3 A14 VSS 29 DQ 2 5 DQ1 A7 LCC-32P-M02 TSOP (I) A11 A9 A8 A13 A14 A17 WE VCC RESET A16 A15 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Marking Side Standard Pinout 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE DQ7 DQ6 DQ5 DQ4 DQ3 V SS DQ2 DQ1 DQ0 A0 A1 A2 A3 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 A3 A2 A1 A0 DQ0 DQ1 DQ2 VSS DQ3 DQ4 DQ5 DQ6 DQ7 CE A10 OE FPT-32P-M24 A4 A5 A6 A7 A12 A15 A16 RESET VCC WE A17 A14 A13 A8 A9 A11 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Marking Side Reverse Pinout FPT-32P-M25 6 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ LOGIC SYMBOL Table 1 18 A 0 to A 17 8 MBM29F002TC/BC Pin Configuration Pin Function A0 to A17 Address Inputs DQ0 to DQ7 Data Inputs/Outputs CE Chip Enable OE Output Enable WE Write Enable RESET Hardware Reset Pin/Sector Protection Unlock N.C. No Internal Connection VSS Device Ground VCC Device Power Supply DQ0 to DQ7 CE OE WE RESET Table 2 MBM29F002TC/BC User Bus Operations CE OE WE A0 A1 A6 A9 A10 DQ0 to DQ7 RESET Auto-Select Manufacturer Code (1) L L H L L L VID L Code H Auto-Select Device Code (1) L L H H L L VID L Code H Read (3) L L H A0 A1 A6 A9 A10 DOUT H Standby H X X X X X X X HIGH-Z H Output Disable L H H X X X X X HIGH-Z H Write (Program/Erase) L H L A0 A1 A6 A9 A10 DIN H Enable Sector Protection (2) L VID X X X VID X X H Verify Sector Protection (2) L L H L H L VID L Code H Temporary Sector Unprotection X X X X X X X X X VID Reset (Hardware) X X X X X X X X HIGH-Z L Operation Legend: L = VIL, H = VIH, X = VIL or VIH, = Pulse Input. See DC Characteristics for voltage levels. Notes: 1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 6. 2. Refer to the section on Sector Protection. 3. WE can be VIL if OE is VIL, OE at VIH initiates the write operations. 7 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ ORDERING INFORMATION Standard Products Fujitsu standard products are available in several packages. The order number is formed by a combination of: MBM29F002 T C -70 PFTN PACKAGE TYPE PFTN = 32-Pin Thin Small Outline Package (TSOP) Standard Pinout PFTR = 32-Pin Thin Small Outline Package (TSOP) Reverse Pinout PD = 32-Pin Rectangular Plastic Leaded Chip Carrier (PLCC) SPEED OPTION See Product Selector Guide C = Device Revision BOOT CODE SECTOR ARCHITECTURE T = Top sector B = Bottom sector DEVICE NUMBER/DESCRIPTION MBM29F002 2 Mega-bit (256K × 8-Bit) CMOS Flash Memory 5.0 V-only Read, Write, and Erase 8 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ FUNCTIONAL DESCRIPTION Read Mode The MBM29F002TC/BC has two control functions which must be satisfied in order to obtain data at the outputs. CE is the power control and should be used for a device selection. OE is the output control and should be used to gate data to the output pins if a device is selected. Address access time (tACC) is equal to the delay from stable addresses to valid output data. The chip enable access time (tCE) is the delay from stable addresses and stable CE to valid data at the output pins. The output enable access time is the delay from the falling edge of OE to valid data at the output pins (assuming the addresses have been stable for at least tACC-tOE time). Standby Mode There are two ways to implement the standby mode on the MBM29F002TC/BC devices, one using both the CE and RESET pins; the other via the RESET pin only. When using both pins, a CMOS standby mode is achieved with CE and RESET inputs both held at VCC ±0.3 V. Under this condition the current consumed is less than 5 µA. A TTL standby mode is achieved with CE and RESET pins held at VIH. Under this condition the current is reduced to approximately 1 mA. During Embedded Algorithm operation, VCC Active current (ICC2) is required even CE = VIH. The device can be read with standard access time (tCE) from either of these standby modes. When using the RESET pin only, a CMOS standby mode is achieved with RESET input held at VSS ±0.3 V (CE = “H” or “L”). Under this condition the current consumed is less than 5 µA. A TTL standby mode is achieved with RESET pin held at VIL (CE = “H” or “L”). Under this condition the current required is reduced to approximately 1 mA. Once the RESET pin is taken high, the device requires 500 ns of wake up time before outputs are valid for read access. In the standby mode the outputs are in the high impedance state, independent of the OE input. Output Disable With the OE input at a logic high level (VIH), output from the device is disabled. This will cause the output pins to be in a high impedance state. Autoselect The autoselect mode allows the reading out of a binary code from the device and will identify its manufacturer and type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional over the entire temperature range of the device. To activate this mode, the programming equipment must force VID (11.5 V to 12.5 V) on address pin A9. Two identifier bytes may then be sequenced from the device outputs by toggling address A0 from VIL to VIH. All addresses are don't cares except A0, A1, A6 and A10. (See Table 3.) The manufacturer and device codes may also be read via the command register, for instances when the MBM29F002TC/BC is erased or programmed in a system without access to high voltage on the A9 pin. The command sequence is illustrated in Table 6. (Refer to Autoselect Command section.) Byte 0 (A0 = VIL) represents the manufacturer's code (Fujitsu = 04H) and byte 1 (A0 = VIH) represents the device identifier code for MBM29F002TC = B0H, MBM29F002BC = 34H. These two bytes are given in the table 3. All identifiers for manufactures and device will exhibit odd parity with DQ7 defined as the parity bit. In order to read the proper device codes when executing the Autoselect, A1 must be VIL. (See Table 3.) The Autoselect mode also facilitates the determination of sector protection in the system. By performing a read operation at the address location XX02H with the higher order address bits A13, A14, A15, A16 and A17 set to the desired sector address, the device will return 01H for a protected sector and 00H for a non-protected sector. 9 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Table 3 .1 MBM29F002TC/BC Sector Protection Verify Autoselect Codes A13 to A17 A10 A6 A1 A0 Code (HEX) X VIL VIL VIL VIL 04H MBM29F002TC X VIL VIL VIL VIH B0H MBM29F002BC X VIL VIL VIL VIH 34H Sector Addresses VIL VIL VIH VIL 01H* Type Manufacture’s Code Device Code Sector Protection * : Outputs 01H at protected sector addresses and outputs 00H at unprotected sector addresses. Table 3 .2 Expanded Autoselect Code Table Code DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 04H 0 0 0 0 0 1 0 0 MBM29F002TC B0H 1 0 1 1 0 0 0 0 MBM29F002BC 34H 0 0 1 1 0 1 0 0 01H 0 0 0 0 0 0 0 1 Type Manufacture’s Code Device Code Sector Protection Table 4 A17 A16 A15 A14 A13 Address Range SA0 0 0 X X X 00000H to 0FFFFH SA1 0 1 X X X 10000H to 1FFFFH SA2 1 0 X X X 20000H to 2FFFFH SA3 1 1 0 X X 30000H to 37FFFH SA4 1 1 1 0 0 38000H to 39FFFH SA5 1 1 1 0 1 3A000H to 3BFFFH SA6 1 1 1 1 X 3C000H to 3FFFFH Table 5 10 Sector Address Tables (MBM29F002TC) Sector Address Tables (MBM29F002BC) A17 A16 A15 A14 A13 Address Range SA0 0 0 0 0 X 00000H to 03FFFH SA1 0 0 0 1 0 04000H to 05FFFH SA2 0 0 0 1 1 06000H to 07FFFH SA3 0 0 1 X X 08000H to 0FFFFH SA4 0 1 X X X 10000H to 1FFFFH SA5 1 0 X X X 20000H to 2FFFFH SA6 1 1 X X X 30000H to 3FFFFH MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Write Device erasure and programming are accomplished via the command register. The contents of the register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. The command register itself does not occupy any addressable memory location. The register is a latch used to store the commands, along with the address and data information needed to execute the command. The command register is written by bringing WE to VIL, while CE is at VIL and OE is at VIH. Addresses are latched on the falling edge of WE or CE, whichever happens later; while data is latched on the rising edge of WE or CE, whichever happens first. Standard microprocessor write timings are used. Refer to AC Write Characteristics and the Erase/Programming Waveforms for specific timing parameters. Sector Protection The MBM29F002TC/BC features hardware sector protection. This feature will disable both program and erase operations in any number of sectors (0 through 6). The sector protection feature is enabled using programming equipment at the user's site. The device is shipped with all sectors unprotected. To activate this mode, the programming equipment must force VID on address pin A9 and control pin OE, (suggest VID = 11.5 V), CE = VIL. The sector addresses (A13, A14, A15, A16, and A17) should be set to the sector to be protected. Tables 4 and 5 define the sector address for each of the seven (7) individual sectors. Programming of the protection circuitry begins on the falling edge of the WE pulse and is terminated with the rising edge of the same. Sector addresses must be held constant during the WE pulse. See figures 14 and 21 for sector protection waveforms and algorithm. To verify programming of the protection circuitry, the programming equipment must force VID on address pin A9 with CE and OE at VIL and WE at VIH. Scanning the sector addresses (A13, A14, A15, A16, and A17) while (A10, A6, A1, A0) = (0, 0, 1, 0) will produce a logical “1” code at device output DQ0 for a protected sector. Otherwise the device will produce 00H for unprotected sector. In this mode, the lower order addresses, except for A0, A1, A6, and A10 are DON’T CARES. Address locations with A1 = VIL are reserved for Autoselect manufacturer and device codes. It is also possible to determine if a sector is protected in the system by writing an Autoselect command. Performing a read operation at the address location XX02H, where the higher order addresses (A13, A14, A15, A16, and A17) are the desired sector address will produce a logical “1” at DQ0 for a protected sector. See Table 3 for Autoselect codes. 11 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Temporary Sector Unprotection This feature allows temporary unprotection of previously protected sectors of the MBM29F002TC/BC device in order to change data. The Sector Unprotection mode is activated by setting the RESET pin to high voltage (12 V). During this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once the 12 V is taken away from the RESET pin, all the previously protected sectors will be protected again. Refer to Figures 14 and 21. Table 6 Command Sequence Bus Write Cycles Req'd MBM29F002TC/BC Command Definitions Bus Fifth Bus Sixth Bus First Bus Second Bus Third Bus Fourth Read/Write Write Cycle Write Cycle Write Cycle Write Cycle Write Cycle Cycle Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data Read/Reset* 1 XXXH F0H Reset/Read* 3 Manufacture Code — — — — — — — — — — 555H AAH 2AAH 55H 555H F0H RA RD — — — — 3 555H AAH 2AAH 55H 555H 90H 00H 04H — — — — Device Code 3 555H AAH 2AAH 55H 555H 90H 01H ID — — — — Byte Program 4 555H AAH 2AAH 55H 555H A0H PA PD — — — — Chip Erase 6 555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H 555H 10H Sector Erase 6 555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H SA 30H Sector Erase Suspend Erase can be suspended during sector erase with Addr (“H” or “L”), Data (B0H) Sector Erase Resume Erase can be resumed after suspend with Addr (“H” or “L”), Data (30H) Notes: 1. Address bits A11 to A17 = X = “H” or “L” for all address commands except or Program Address (PA) and Sector Address (SA). 2. Bus operations are defined in Table 2. 3. RA = Address of the memory location to be read. PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of the WE pulse. SA = Address of the sector to be erased. The combination of A17, A16, A15, A14, and A13 will uniquely select any sector. 4. RD = Data read from location RA during read operation. PD = Data to be programmed at location PA. Data is latched on the rising edge of WE. ID = Device Code (Refer to the section on Sector Protection Verify Autoselect Codes.) *: Either of the two reset commands will reset the device. Command Definitions Device operations are selected by writing specific address and data sequences into the command register. Writing incorrect address and data values or writing them in the improper sequence will reset the device to the read mode. Table 6 defines the valid register command sequences. Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are valid only while the Sector Erase operation is in progress. Moreover, both Read/Reset commands are functionally equivalent, resetting the device to the read mode. 12 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Read/Reset Command The read or reset operation is initiated by writing the read/reset command sequence into the command register. Microprocessor read cycles retrieve array data from the memory. The device remains enabled for reads until the command register contents are altered. The device will automatically power-up in the read/reset state. In this case, a command sequence is not required to read data. Standard microprocessor read cycles will retrieve array data. This default value ensures that no spurious alteration of the memory content occurs during the power transition. Refer to the AC Read Characteristics and Waveforms for the specific timing parameters. Autoselect Command Flash memories are intended for use in applications where the local CPU alters memory contents. As such, manufacture and device codes must be accessible while the device resides in the target system. PROM programmers typically access the signature codes by raising A9 to a high voltage. However, multiplexing high voltage onto the address lines is not generally desirable system design practice. The device contains an autoselect command operation to supplement traditional PROM programming methodology. The operation is initiated by writing the autoselect command sequence into the command register. Following the command write, a read cycle from address XX00H retrieves the manufacture code of 04H. A read cycle from address XX01H returns the device code D5H. (See Table 3). All manufacturer and device codes will exhibit odd parity with the DQ7 defined as the parity bit. Sector state (protection or unprotection) will be informed by address XX02H. Scanning the sector addresses (A17, A16, A15, A14, and A13) while (A10, A6, A1, A0) = (0, 0, 1, 0) will produce a logical “1” at device output DQ0 for a protected sector. To terminate the operation, it is necessary to write the read/reset command sequence into the register and also to write the Autoselect command during the operation, execute it after writing Read/Reset command sequence. Byte Programming The device is programmed on a byte-by-byte basis. Programming is a four bus cycle operation. There are two “unlock” write cycles. These are followed by the program set-up command and data write cycles. Addresses are latched on the falling edge of CE or WE, whichever happens later and the data is latched on the rising edge of CE or WE, whichever happens first. The rising edge of CE or WE (whichever happens first) begins programming. Upon executing the Embedded Program Algorithm command sequence, the system is not required to provide further controls or timings. The device will automatically provide adequate internally generated program pulses and verify the programmed cell margin. This automatic programming operation is completed when the data on DQ7 is equivalent to data written to this bit at which time the device returns to the read mode and addresses are no longer latched. (See Table 7, Hardware Sequence Flags.) Therefore, the device requires that a valid address to the device be supplied by the system at this particular instance of time. Data Polling must be performed at the memory location which is being programmed. Any commands written to the chip during this period will be ignored. If a hardware reset occurs during the programming operation, it is impossible to guarantee the data are being written. Programming is allowed in any sequence and across sector boundaries. Beware that a data “0” cannot be programmed back to a “1”. Attempting to do so may either hang up the device or result in an apparent success according to the data polling algorithm but a read from reset/read mode will show that the data is still “0”. Only erase operations can convert “0”s to “1”s. Figure 16 illustrates the Embedded ProgrammingTM Algorithm using typical command strings and bus operations. 13 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Chip Erase Chip erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the “set-up” command. Two more “unlock” write cycles are then followed by the chip erase command. Chip erase does not require the user to program the device prior to erase. Upon executing the Embedded Erase Algorithm command sequence the device will automatically program and verify the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. The automatic erase begins on the rising edge of the last WE pulse in the command sequence and terminates when the data on DQ7 is “1” (see Write Operation Status section) at which time the device returns to read the mode. Figure 17 illustrates the Embedded Erase™ Algorithm using typical command strings and bus operations. Sector Erase Sector erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the “set-up” command. Two more “unlock” write cycles are then followed by the Sector Erase command. The sector address (any address location within the desired sector) is latched on the falling edge of WE, while the command (Data = 30H) is latched on the rising edge of WE. After time-out of 50 µs from the rising edge of the last sector erase command, the sector erase operation will begin. Multiple sectors may be erased concurrently by writing the six bus cycle operations on Table 6. This sequence is followed with writes of the Sector Erase command to addresses in other sectors desired to be concurrently erased. The time between writes must be less than 50 µs otherwise that command will not be accepted and erasure will start. It is recommended that processor interrupts be disabled during this time to guarantee this condition. The interrupts can be re-enabled after the last Sector Erase command is written. A time-out of 50 µs from the rising edge of the last WE will initiate the execution of the Sector Erase command(s). If another falling edge of the WE occurs within the 50 µs time-out window the timer is reset. (Monitor DQ3 to determine if the sector erase timer window is still open, see section DQ3, Sector Erase Timer.) Any command other than Sector Erase or Erase Suspend during this time-out period will reset the device to the read mode, ignoring the previous command string. Resetting the device once execution has begun will corrupt the data in that sector. In that case, restart the erase on those sectors and allow them to complete. (Refer to the Write Operation Status section for DQ3, Sector Erase Timer operation.) Loading the sector erase buffer may be done in any sequence and with any number of sectors (0 to 6). Sector erase does not require the user to program the device prior to erase. The device automatically programs all memory locations in the sector(s) to be erased prior to electrical erase. When erasing a sector or sectors the remaining unselected sectors are not affected. The system is not required to provide any controls or timings during these operations. The automatic sector erase begins after the 50 µs time out from the rising edge of the WE pulse for the last sector erase command pulse and terminates when the data on DQ7 is “1” (see Write Operation Status section) at which time the device returns to the read mode. Data polling must be performed at an address within any of the sectors being erased. Figure 17 illustrates the Embedded Erase™ Algorithm using typical command strings and bus operations. 14 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Erase Suspend The Erase Suspend command allows the user to interrupt a Sector Erase operation and then perform data reads from or programs to a sector not being erased. This command is applicable ONLY during a Sector Erase operation which includes the time-out period for sector erase. The Erase Suspend command will be ignored if written during the Chip Erase operation or Embedded Program Algorithm. Writing the Erase Suspend command during the Sector Erase time-out results in immediate termination of the time-out period and suspension of the erase operation. Any other command written during the Erase Suspend mode will be ignored except the Erase Resume command. Writing the Erase Resume command resumes the erase operation. The addresses are DON’T CARES when writing the Erase Suspend or Erase Resume command. When the Erase Suspend command is written during the Sector Erase operation, the device will take a maximum of 15 µs to suspend the erase operation. When the device has entered the erase-suspended mode, the DQ7 bit will be at logic “1”, and DQ6 will stop toggling. The user must use the address of the erasing sector for reading DQ6 and DQ7 to determine if the erase operation has been suspended. Further writes of the Erase Suspend command are ignored. When the erase operation has been suspended, the device defaults to the erase-suspend-read mode. Reading data in this mode is the same as reading from the standard read mode except that the data must be read from sectors that have not been erase-suspended. Successively reading from the erase-suspended sector while the device is in the erase-suspend-read mode will cause DQ2 to toggle. (See the section on DQ2.) After entering the erase-suspend-read mode, the user can program the device by writing the appropriate command sequence for Byte Program. This program mode is known as the erase-suspend-program mode. Again, programming in this mode is the same as programming in the regular Byte Program mode except that the data must be programmed to sectors that are not erase-suspended. Successively reading from the erasesuspended sector while the device is in the erase-suspend-program mode will cause DQ2 to toggle. The end of the erase-suspended program operation is detected by Data polling of DQ7, or by the Toggle Bit I (DQ6) which is the same as the regular Byte Program operation. Note that DQ7 must be read from the Byte Program address while DQ6 can be read from any address. To resume the operation of Sector Erase, the Resume command (30H) should be written. Any further writes of the Resume command at this point will be ignored. Another Erase Suspend command can be written after the chip has resumed erasing. 15 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Write Operation Status Table 7 Hardware Sequence Flags DQ7 DQ6 DQ5 DQ3 DQ2 DQ7 Toggle 0 0 1 0 Toggle 0 1 Toggle 1 1 0 0 Toggle (Note 1) Erase Suspend Read (Non-Erase Suspended Sector) Data Data Data Data Data Erase Suspend Program (Non-Erase Suspended Sector) DQ7 Toggle (Note 2) 0 0 1 (Note 3) DQ7 Toggle 1 0 1 0 Toggle 1 1 N/A DQ7 Toggle 1 0 N/A Status Embedded Program Algorithm Embedded Erase Algorithm Erase Suspend Read (Erase Suspended Sector) In Progress Erase Suspended Mode Embedded Program Algorithm Exceeded Time Limits Embedded Erase Algorithm Erase Suspended Mode Erase Suspend Program (Non-Erase Suspended Sector) Notes: 1. Performing successive read operations from the erase-suspended sector will cause DQ2 to toggle. 2. Performing successive read operations from any address will cause DQ6 to toggle. 3. Reading the byte address being programmed while in the erase-suspend program mode will indicate logic “1” at the DQ2 bit. However, successive reads from the erase-suspended sector will cause DQ2 to toggle. DQ7 Data Polling The MBM29F002TC/BC device features Data Polling as a method to indicate to the host that the embedded algorithms are in progress or completed. During the Embedded Program Algorithm, an attempt to read the device will produce the complement of the data last written to DQ7. Upon completion of the Embedded Program Algorithm, an attempt to read the device will produce the true data last written to DQ7. During the Embedded Erase™ Algorithm, an attempt to read the device will produce a “0” at the DQ7 output. Upon completion of the Embedded Erase Algorithm an attempt to read the device will produce a “1” at the DQ7 output. The flowchart for Data Polling (DQ7) is shown in Figure 18. Data polling will also flag the entry into Erase Suspend. DQ7 will switch “0” to “1” at the start of the Erase Suspend mode. Please note that the address of an erasing sector must be applied in order to observe DQ7 in the Erase Suspend Mode. During Program in Erase Suspend, Data polling will perform the same as in regular program execution outside of the suspend mode. For chip erase, the Data Polling is valid after the rising edge of the sixth WE pulse in the six write pulse sequence. For sector erase, the Data Polling is valid after the last rising edge of the sector erase WE pulse. Data Polling must be performed at sector address within any of the sectors being erased and not a sector that is within a protected sector. Otherwise, the status may not be valid. 16 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Just prior to the completion of Embedded Algorithm operation DQ7 may change asynchronously while the output enable (OE) is asserted low. This means that the device is driving status information on DQ7 at one instant of time and then that byte's valid data at the next instant of time. Depending on when the system samples the DQ7 output, it may read the status or valid data. Even if the device has completed the Embedded Algorithm operations and DQ7 has a valid data, the data outputs on DQ0 to DQ6 may be still invalid. The valid data on DQ0 to DQ7 will be read on the successive read attempts. The Data Polling feature is only active during the Embedded Programming Algorithm, Embedded Erase Algorithm, Erase Suspend, erase-suspend-program mode, or sector erase time-out. (See Table 7.) See Figure 9 for the Data Polling timing specifications and diagrams. DQ6 Toggle Bit I The MBM29F002TC/BC also features the “Toggle Bit I” as a method to indicate to the host system that the embedded algorithms are in progress or completed. During an Embedded Program or Erase Algorithm cycle, successive attempts to read (OE toggling) data from the device at any address will result in DQ6 toggling between one and zero. Once the Embedded Program or Erase Algorithm cycle is completed, DQ6 will stop toggling and valid data will be read on the next successive attempts. During programming, the Toggle Bit I is valid after the rising edge of the fourth WE pulse in the four write pulse sequence. For chip erase, and sector erase the Toggle Bit I is valid after the rising edge of the sixth WE pulse in the six write pulse sequence. For Sector Erase, the Toggle Bit I is valid after the last rising edge of the sector erase WE pulse. The Toggle Bit I is active during the sector erase time out. In programming, if the sector being written to is protected, the Toggle Bit I will toggle for about 2 µs and then stop toggling without the data having changed. In erase, the device will erase all the selected sectors except for the ones that are protected. If all selected sectors are protected, the chip will toggle the Toggle Bit I for about 100 µs and then drop back into read mode, having changed none of the data. Either CE or OE toggling will cause the DQ6 to toggle. In addition, an Erase Suspend/Resume command will cause DQ6 to toggle. See Figure 10 for the Toggle Bit I timing specifications and diagrams. DQ5 Exceeded Timing Limits DQ5 will indicate if the program or erase time has exceeded the specified limits (internal pulse count). Under these conditions DQ5 will produce a “1”. This is a failure condition which indicates that the program or erase cycle was not successfully completed. Data Polling DQ7, DQ6 is the only operating function of the device under this condition. The CE circuit will partially power down the device under these conditions (to approximately 2 mA). The OE and WE pins will control the output disable functions as described in Table 2. The DQ5 failure condition may also appear if a user tries to program a 1 to a location that is previously programmed to 0. In this case the device locks out and never completes the Embedded Algorithm operation. Hence, the system never reads a valid data on DQ7 bit and DQ6 never stops toggling. Once the device has exceeded timing limits, the DQ5 bit will indicate a “1.” Please note that this is not a device failure condition since the device was incorrectly used. If this occurs, reset the device. 17 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 DQ3 Sector Erase Timer After the completion of the initial sector erase command sequence the sector erase time-out will begin. DQ3 will remain low until the time-out is complete. Data Polling and Toggle Bit I are valid after the initial sector erase command sequence. If Data Polling or the Toggle Bit I indicates the device has been written with a valid erase command, DQ3 may be used to determine if the sector erase timer window is still open. If DQ3 is high (“1”) the internally controlled erase cycle has begun; attempts to write subsequent commands (other than Erase Suspend) to the device will be ignored until the erase operation is completed as indicated by Data Polling or Toggle Bit I. If DQ3 is low (“0”), the device will accept additional sector erase commands. To insure the command has been accepted, the system software should check the status of DQ3 prior to and following each subsequent sector erase command. If DQ3 were high on the second status check, the command may not have been accepted. Refer to Table 7: Hardware Sequence Flags. DQ2 Toggle Bit II This toggle bit II, along with DQ6, can be used to determine whether the device is in the Embedded Erase™ Algorithm or in Erase Suspend. Successive reads from the erasing sector will cause DQ2 to toggle during the Embedded Erase™ Algorithm. If the device is in the erase-suspended-read mode, successive reads from the erase-suspended sector will cause DQ2 to toggle. When the device is in the erase-suspended-program mode, successive reads from the byte address of the non-erase suspended sector will indicate a logic “1” at the DQ2 bit. DQ7 DQ6 DQ2 DQ7 toggles 1 Erase 0 toggles toggles Erase Suspend Read (1) (Erase-Suspended Sector) 1 1 toggles DQ7 (2) toggles 1 (2) Mode Program Erase Suspend Program Notes: 1. These status flags apply when outputs are read from a sector that has been erase-suspended. 2. These status flags apply when outputs are read from the byte address of the non-erase suspended sector. DQ6 is different from DQ2 in that DQ6 toggles only when the standard program or Erase, or Erase Suspend Program operation is in progress. The behavior of these two status bits, along with that of DQ7, is summarized as follows: For example, DQ2 and DQ6 can be used together to determine the erase-suspend-read mode (DQ2 toggles while DQ6 does not). See also Table 7 and Figure 15. Furthermore, DQ2 can also be used to determine which sector is being erased. When the device is in the erase mode, DQ2 toggles if this bit is read from the erasing sector. 18 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 RESET Hardware Reset The MBM29F002TC/BC device may be reset by driving the RESET pin to VIL. The RESET pin must be kept low (VIL) for at least 500 ns. Any operation in progress will be terminated and the internal state machine will be reset to the read mode 20 µs after the RESET pin is driven low. If a hardware reset occurs during a program operation, the data at that particular location will be indeterminate. When the RESET pin is low and the internal reset is complete, the device goes to standby mode and cannot be accessed. Also, note that all the data output pins are tri-stated for the duration of the RESET pulse. Once the RESET pin is taken high, the device requires tRH of wake up time until outputs are valid for read access. The RESET pin may be tied to the system reset input. Therefore, if a system reset occurs during the Embedded Program or Erase Algorithm, the device will be automatically reset to read mode and this will enable the system’s microprocessor to read the boot-up firmware from the Flash memory. 19 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Data Protection The MBM29F002TC/BC is designed to offer protection against accidental erasure or programming caused by spurious system level signals that may exist during power transitions. During power up the device automatically resets the internal state machine in the Read mode. Also, with its control register architecture, alteration of the memory contents only occurs after successful completions of specific multi-bus cycle command sequences. The device also incorporates several features to prevent inadvertent write cycles resulting from VCC power-up and power-down transitions or system noise. Low VCC Write Inhibit To avoid initiation of a write cycle during VCC power-up and power-down, a write cycle is locked out for VCC less than 3.2 V (typically 3.7 V). If VCC < VLKO, the command register is disabled and all internal program/erase circuits are disabled. Under this condition the device will reset to the read mode. Subsequent writes will be ignored until the VCC level is greater than VLKO. It is the users responsibility to ensure that the control pins are logically correct to prevent unintentional writes when VCC is above 3.2 V. Write Pulse “Glitch” Protection Noise pulses of less than 5 ns (typical) on OE, CE, or WE will not initiate a write cycle. Logical Inhibit Writing is inhibited by holding any one of OE = VIL, CE = VIH or WE = VIH. To initiate a write cycle CE and WE must be a logical zero while OE is a logical one. Power-Up Write Inhibit Power-up of the device with WE = CE = VIL and OE = VIH will not accept commands on the rising edge of WE. The internal state machine is automatically reset to the read mode on power-up. 20 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ ABSOLUTE MAXIMUM RATINGS Storage Temperature ........................................................................................–55°C to +125°C Ambient Temperature with Power Applied ........................................................–40°C to +85°C Voltage with Respect to Ground All pins except A9, OE, and RESET (Note 1).–2.0 V to +7.0 V VCC (Note 1) ......................................................................................................–2.0 V to +7.0 V A9, OE, and RESET (Note 2) ............................................................................–2.0 V to +13.5 V Notes: 1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, inputs may negative overshoot VSS to –2.0 V for periods of up to 20 ns. Maximum DC voltage on output and I/O pins is VCC +0.5 V. During voltage transitions, outputs may positive overshoot to VCC +2.0 V for periods up to 20 ns. 2. Minimum DC input voltage on A9, OE, and RESET pins are –0.5 V. During voltage transitions, A9, OE, and RESET pins may negative overshoot VSS to –2.0 V for periods of up to 20 ns. Maximum DC input voltage on A9, OE, and RESET are +13.0 V which may overshoot to 14.0 V for periods up to 20 ns. Voltage difference between input voltage and power supply. (VIN – VCC) do not exceed 9 V. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATING RANGES Ambient Temperature (TA) ................................................................................ –40°C to +85°C VCC Supply Voltages MBM29F002TC/BC-55 ................................................................................. +4.75 V to +5.25 V MBM29F002TC/BC-70/-90 ........................................................................... +4.50 V to +5.50 V Operating ranges define those limits between which the functionality of the device is guaranteed. WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand. 21 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ MAXIMUM OVERSHOOT 20 ns +0.8 V 20 ns –0.5 V –2.0 V 20 ns Figure 1 Maximum Negative Overshoot Waveform 20 ns VCC +2.0 V VCC +0.5 V +2.0 V 20 ns Figure 2 20 ns Maximum Positive Overshoot Waveform 1 20 ns +14.0 V +13.0 V VCC +0.5 V 20 ns 20 ns Note: This waveform is applied for A9, OE, and RESET. Figure 3 22 Maximum Positive Overshoot Waveform 2 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ DC CHARACTERISTICS Parameter Symbol Parameter Description Test Conditions Min. Max. Unit ILI Input Leakage Current VIN = VSS to VCC, VCC = VCC Max. — ±1.0 µA ILO Output Leakage Current VOUT = VSS to VCC, VCC = VCC Max. — ±1.0 µA ILIT A9, OE, RESET Inputs Leakage Current VCC = VCC Max. A9, OE, RESET = 12.5 V — 50 µA ICC1 VCC Active Current (Note 1) CE = VIL, OE = VIH — 35 mA ICC2 VCC Active Current (Note 2) CE = VIL, OE = VIH — 50 mA VCC = VCC Max., CE = VIH RESET = VIH — 1 mA VCC = VCC Max., CE = VCC ±0.3 V, RESET = VCC ±0.3 V — 5 µA VCC = VCC Max. RESET = VIL — 1 mA VCC = VCC Max. RESET = VSS ±0.3 V — 5 µA ICC3 ICC4 VCC Current (Standby) VCC Current (Standby, Reset) VIL Input Low Level — –0.5 0.8 V VIH Input High Level — 2.0 VCC+0.5 V VID Voltage for Autoselect and Sector Protection (A9, OE, RESET) (Note 3, 4) — 11.5 12.5 V VOL Output Low Voltage Level IOL = 12.0 mA, VCC = VCC Min. — 0.45 V IOH = –2.5 mA, VCC = VCC Min. 2.4 — V VCC–0.4 — V 3.2 4.2 V VOH1 Output High Voltage Level VOH2 VLKO Low VCC Lock-Out Voltage IOH = –100 µA — Notes: 1. The ICC current listed includes both the DC operating current and the frequency dependent component (at 6 MHz). The frequency component typically is 2 mA/MHz, with OE at VIH. 2. ICC active while Embedded Algorithm (program or erase) is in progress. 3. Applicable to sector protection function. 4. (VID – VCC) do not exceed 9 V. 23 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ AC CHARACTERISTICS • Read Only Operations Characteristics Parameter Symbols Description -55 -70 -90 (Note1) (Note2) (Note2) Unit Test Setup JEDEC Standard tAVAV tRC Read Cycle Time tAVQV tACC Address to Output Delay tELQV tCE Chip Enable to Output Delay tGLQV tOE Output Enable to Output Delay tEHQZ tDF tGHQZ tAXQX — — Min. 55 70 90 ns CE = VIL OE = VIL Max. 55 70 90 ns OE = VIL Max. 55 70 90 ns — Max. 30 30 35 ns Chip Enable to Output HIGH-Z — Max. 20 20 20 ns tDF Output Enable to Output HIGH-Z — Max. 20 20 20 ns tOH Output Hold Time From Addresses, CE or OE, Whichever Occurs First — Min. 0 0 0 ns tREADY RESET Pin Low to Read Mode — Max. 20 20 20 µs Note: 1.Test Conditions: Output Load: 1 TTL gate and 30 pF Input rise and fall times: 5 ns Input pulse levels: 0.0 V to 3.0 V Timing measurement reference level Input: 1.5 V Output: 1.5 V Note: 2. Test Conditions: Output Load: 1 TTL gate and 100 pF Input rise and fall times: 5 ns Input pulse levels: 0.45 V to 2.4 V Timing measurement reference level Input: 0.8 V and 2.0 V Output: 0.8 V and 2.0 V 5.0 V IN3064 or Equivalent 2.7 kΩ Device Under Test 6.2 kΩ CL Diodes = IN3064 or Equivalent Note: 1. CL = 30 pF including jig capacitance 2. CL = 100 pF including jig capacitance Figure 4 24 Test Conditions MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 • Write/Erase/Program Operations Parameter Symbols JEDEC MBM29F002TC/BC Description Standard -55 -70 -90 Unit tAVAV tWC Write Cycle Time Min. 55 70 90 ns tAVWL tAS Address Setup Time Min. 0 0 0 ns tWLAX tAH Address Hold Time Min. 40 45 45 ns tDVWH tDS Data Setup Time Min. 25 30 45 ns tWHDX tDH Data Hold Time Min. 0 0 0 ns — tOES Output Enable Setup Time Min. 0 0 0 ns — tOEH Output Enable Hold Time Read Min. 0 0 0 ns Toggle Bit I and Data Polling Min. 10 10 10 ns tGHWL tGHWL Read Recover Time Before Write Min. 0 0 0 ns tGHEL tGHEL Read Recover Time Before Write Min. 0 0 0 ns tELWL tCS CE Setup Time Min. 0 0 0 ns tWLEL tWS WE Setup Time Min. 0 0 0 ns tWHEH tCH CE Hold Time Min. 0 0 0 ns tEHWH tWH WE Hold Time Min. 0 0 0 ns tWLWH tWP Write Pulse Width Min. 30 35 45 ns tELEH tCP Write Pulse Width Min. 30 35 45 ns tWHWL tWPH Write Pulse Width High Min. 20 20 20 ns tEHEL tCPH Write Pulse Width High Min. 20 20 20 ns tWHWH1 tWHWH1 Byte Programming Operation Typ. 8 8 8 µs tWHWH2 tWHWH2 Sector Erase Operation (Note 1) Typ. 1 1 1 sec Max. 8 8 8 sec — tVCS VCC Setup Time Min. 50 50 50 µs — tVIDR Rise Time to VID Min. 500 500 500 ns — tVLHT Voltage Transition Time (Note 2) Min. 4 4 4 µs — tWPP Write Pulse Width (Note 2) Min. 100 100 100 µs — tOESP OE Setup Time to WE Active (Note 2) Min. 4 4 4 µs — tCSP CE Setup Time to WE Active (Note 2) Min. 4 4 4 µs (Continued) 25 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 (Continued) Parameter Symbols JEDEC MBM29F002TC/BC Description Standard -70 -90 Unit — tRP RESET Pulse Width Min. 500 500 500 ns — tRH RESET Hold Time Before Read Min. 50 50 50 ns — tEOE Delay Time from Embedded Output Enable Max. 30 30 35 ns Notes: 1. This does not include the preprogramming time. 2. This timing is for Sector Protection operation. 26 -55 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ SWITCHING WAVEFORMS • Key to Switching Waveforms WAVEFORM INPUTS OUTPUTS Must Be Steady Will Be Steady May Change from H to L Will Be Changing from H to L May Change from L to H Will Be Changing from L to H “H” or “L” Any Change Permitted Changing, State Unknown Does Not Apply Center Line is HighImpedance “Off” State t RC Addresses Addresses Stable t ACC CE t OE t DF OE t OEH WE t CE DQ 0 to DQ 7 High-Z Output Valid High-Z Figure 5.1 AC Waveforms for Read Operations 27 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 t RC Addresses Addresses Stable t ACC t RH RESET t OH DQ 0 to DQ 7 High-Z Output Valid Figure 5.2 AC Waveforms for Read Operations 28 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 3rd Bus Cycle Addresses Data Polling 555H PA PA tAH tWC tRC tAS CE tCS tCH tCE OE tWP tOE tWHWH1 tGHWL WE tWPH tOH tDH A0H Data PD DQ7 DOUT DOUT tDS Notes: 1. PA is address of the memory location to be programmed. 2. PD is data to be programmed at byte address. 3. DQ7 is the output of the complement of the data written to the device. 4. DOUT is the output of the data written to the device. 5. Figure indicates last two bus cycles of four bus cycle sequence. Figure 6 AC Waveforms for Alternate WE Controlled Program Operations 29 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 3rd Bus Cycle Addresses Data Polling 555H PA PA tAH tWC tAS tWH WE tGHEL OE tCP tWHWH1 CE tWS tCPH tDH Data A0H PD DQ7 DOUT tDS Notes: 1. PA is address of the memory location to be programmed. 2. PD is data to be programmed at byte address. 3. DQ7 is the output of the complement of the data written to the device. 4. DOUT is the output of the data written to the device. 5. Figure indicates last two bus cycles of four bus cycle sequence. Figure 7 30 AC Waveforms for Alternate CE Controlled Program Operations MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Addresses 2AAH 555H t WC t AS 555H 555H 2AAH SA* t AH CE t CS t CH OE t GHWL t WP t WPH WE t DS t DH AAH Data 55H 80H AAH 55H 10H/ 30H t VCS V CC * : SA is the sector address for Sector Erase. Addresses = 555H for Chip Erase. Figure 8 AC Waveforms Chip/Sector Erase Operations 31 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 tCH CE tDF tOE OE tOEH WE tCE * DQ7 Data DQ7 = Valid Data DQ7 tEOE tWHWH1 or 2 DQ0 to DQ6 Data High-Z DQ0 to DQ6 = Output Flug DQ0 to DQ7 Valid Data High-Z * : DQ7 = Valid Data (The device has completed the Embedded operation.) Figure 9 AC Waveforms for Data Polling During Embedded Algorithm Operations CE tOEH WE tOES OE * DQ6 Data DQ6 = Toggle DQ6 = Stop Toggling DQ6 = Toggle DQ0 to DQ7 Valid tOE * : DQ6 stops toggling (The device has completed the Embedded operation.) Figure 10 32 AC Waveforms for Toggle Bit I during Embedded Algorithm Operations MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 tRP RESET tREADY Figure 11 RESET Timing Diagram 33 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 A17, A16, A15, A14, A13 SAx SAy A0 A1 A6 V ID 5V A9 t VLHT V ID 5V OE t OESP t VLHT t WPP t VLHT t VLHT WE t CSP CE Data 01H t OE t VCS VCC SGAx = Sector Address for initial sector SGAy = Sector Address for next sector Figure 12 34 AC Waveforms for Sector Protection Timing Diagram MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 VCC tVIDR tVCS tVLHT VID 5V 5V RESET CE Program or Erase Command Sequence WE tVLHT tVLHT Unprotection period Figure 13 Enter Embedded Erasing WE Erase Suspend Erase Temporary Sector Unprotection Timing Diagram Enter Erase Suspend Program Erase Suspend Read Erase Suspend Program Erase Resume Erase Suspend Read Erase Erase Complete DQ6 DQ2 Toggle DQ2 and DQ6 with OE Note: DQ2 is read from the erase-suspended sector. Figure 14 DQ2 vs. DQ6 35 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 EMBEDDED ALGORITHMS Start Write Program Command Sequence (See Below) Data Polling Device Increment Address No Last Address ? Yes Programming Completed Program Command Sequence (Address/Command): 555H/AAH 2AAH/55H 555H/A0H Program Address/Program Data Figure 15 36 Embedded ProgramTM Algorithm MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Start Write Erase Command Sequence (See Below) Data Polling or Toggle Bit I Successfully Completed Erasure Completed Chip Erase Command Sequence (Address/Command): Individual Sector/Multiple Sector Erase Command Sequence (Address/Command): 555H/AAH 555H/AAH 2AAH/55H 2AAH/55H 555H/80H 555H/80H 555H/AAH 555H/AAH 2AAH/55H 2AAH/55H 555H/10H Sector Address/30H Sector Address/30H Additional sector erase commands are optional. Sector Address/30H Note: To insure the command has been accepted, the system software should check the status of DQ3 prior to and following each subsequent sector erase command. If DQ3 were high on the second status check, the command may not have been accepted. Figure 16 Embedded Erase™ Algorithm 37 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Start VA = Address for programming = Any of the sector addresses within the sector being erased during sector erase or multiple erases operation. = Any of the sector addresses within the sector not being protected during sector erase or multiple sector erases operation. Read Byte (DQ0 to DQ7) Addr. = VA DQ7 = Data? Yes No No DQ5 = 1? Yes Read Byte (DQ0 to DQ7) Addr. = VA DQ7 = Data? Yes No Fail Pass Note: DQ7 is rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5. Figure 17 38 Data Polling Algorithm MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Start Read Byte (DQ0 to DQ7) Addr. = “H” or “L” No DQ6 = Toggle ? Yes No DQ5 = 1 ? Yes Read Byte (DQ0 to DQ7) Addr. = “H” or “L” DQ6 = Toggle ? No Yes Fail Pass Note: DQ6 is rechecked even if DQ5 = “1” because DQ6 may stop toggling at the same time as DQ5 changing to “1”. Figure 18 Toggle Bit I Algorithm 39 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Start Setup Sector Addr. (A17, A16, A15, A14, A13) PLSCNT = 1 OE = VID, A9 = VID, CE = VIL, RESET = VIH Increment PLSCNT Activate WE Pulse Time out 100 µs WE = VIH, CE = OE = VIL, (A9 should remain VID) Read from Sector Addr. (A19, A18, A17) A1 = 1, A0 = A6 = 0 No No PLSCNT = 25? Yes Remove VID from A9 Write Reset Command Data = 01H? Yes Yes Protect Another Sector? No Device Failed Remove VID from A9 Write Reset Command Sector Protection Completed Figure 19 40 Sector Protection Algorithm MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 Start RESET = VID (Note 1) Perform Erase or Program Operations RESET = VIH Temporary Sector Unprotection Completed (Note 2) Notes: 1. All Protected sectors unprotected. 2. All previously protected sectors are protected once again. Figure 20 Temporary Sector Unprotection Algorithm 41 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ ERASE AND PROGRAMMING PERFORMANCE Limits Parameter Unit Comments Min. Typ. Max. Sector Erase Time — 1 8 sec Excludes 00H programming prior to erasure Byte Programming Time — 8 150 µs Excludes system-level overhead Chip Programming Time — 2.1 5 sec Excludes system-level overhead 100,000 — — cycles Erase/Program Cycle ■ TSOP(I) PIN CAPACITANCE Parameter Symbol Parameter Description Test Setup Typ. Max. Unit CIN Input Capacitance VIN = 0 7 8 pF COUT Output Capacitance VOUT = 0 8 10 pF CIN2 Control Pin Capacitance VIN = 0 8 10 pF Typ. Max. Unit Note: Test conditions TA = 25°C, f = 1.0 MHz ■ PLCC PIN CAPACITANCE Parameter Symbol Parameter Description CIN Input Capacitance VIN = 0 7 8 pF COUT Output Capacitance VOUT = 0 8 10 pF CIN2 Control Pin Capacitance VIN = 0 8 10 pF Notes: 1. Sampled, not 100% tested. 2. Test conditions TA = 25°C, f = 1.0 MHz 42 Test Setup MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 ■ PACKAGE DIMENSIONS 32-pin plastic TSOP(I) (FPT-32P-M24) LEAD No. 1 Details of "A" part 32 0.15(.006) MAX 0.35(.014) MAX INDEX "A" 16 17 0.15(.006) 0.25(.010) 0.15±0.05 (.006±.002) 20.00±0.20 (.787±.008) 18.40±0.20 (.724±.008) 0.10(.004) 19.00±0.20 (.748±.008) C 1994 FUJITSU LIMITED F32035S-2C-1 8.00±0.20 (.315±.008) 0.50(.0197) TYP 0.50±0.10 (.020±.004) 7.50(.295) REF. 0.20±0.10 (.008±.004) 0.05(.002)MIN (STAND OFF) +0.10 +.004 1.10 –0.05 .043 –.002 (Mounting height) 0.10(.004) M Dimensions in mm(inches) 43 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 32-pin plastic TSOP(I) (FPT-32P-M25) LEAD No. 1 32 Details of "A" part 0.15(.006) MAX 0.35(.014) MAX INDEX "A" 16 17 0.15(.006) 0.20±0.10 (.008±.004) 0.15±0.05 (.006±.002) 19.00±0.20 (.748±.008) 0.10(.004) 0.50±0.10 (.020±.004) 0.50(.0197) TYP 7.50(.295) REF. 0.25(.010) 0.10(.004) M 0.05(.002)MIN (STAND OFF) +0.10 18.40±0.20 (.724±.008) 8.00±0.20 (.315±.008) +.004 1.10 –0.05 .043 –.002 (Mounting height) 20.00±0.20 (.787±.008) C 44 1997 FUJITSU LIMITED F32036S-2C-2 Dimensions in mm(inches) MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 32-pin plastic QFJ(PLCC) (LCC-32P-M02) 3.40±0.16 (.134±.006) 2.25±0.38 (.089±.015) 12.37±0.13 (.487±.005) 11.43±0.08 (.450±.003) 4 1 32 0.64(.025) MIN 30 5 7.62(.300)REF 1.27±0.13 (.050±.005) 29 INDEX 13.97±0.08 14.94±0.13 (.550±.003) (.588±.005) 13 12.95±0.51 (.510±.020) 10.16(.400) REF 21 14 20 R0.95(.037) TYP 0.66(.026) TYP +0.05 0.20 –0.02 +.002 .008 –.001 0.43(.017) TYP 10.41±0.51 (.410±.020) 0.10(.004) No C 1994 FUJITSU LIMITED C32021S-2C-4 : LEAD No. Dimensions in mm(inches) 45 MBM29F002TC-55/-70/-90/MBM29F002BC-55/-70/-90 FUJITSU LIMITED For further information please contact: Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka Nakahara-ku, Kawasaki-shi Kanagawa 211-8588, Japan Tel: (044) 754-3763 Fax: (044) 754-3329 http://www.fujitsu.co.jp/ North and South America FUJITSU MICROELECTRONICS, INC. Semiconductor Division 3545 North First Street San Jose, CA 95134-1804, USA Tel: (408) 922-9000 Fax: (408) 922-9179 Customer Response Center Mon. - Fri.: 7 am - 5 pm (PST) Tel: (800) 866-8608 Fax: (408) 922-9179 http://www.fujitsumicro.com/ Europe FUJITSU MIKROELEKTRONIK GmbH Am Siebenstein 6-10 D-63303 Dreieich-Buchschlag Germany Tel: (06103) 690-0 Fax: (06103) 690-122 http://www.fujitsu-ede.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD #05-08, 151 Lorong Chuan New Tech Park Singapore 556741 Tel: (65) 281-0770 Fax: (65) 281-0220 http://www.fmap.com.sg/ F9903 FUJITSU LIMITED Printed in Japan 46 All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document are presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. Any semiconductor devices have an inhereut chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan.