ACE ACE25AC100GTMTH Spi nor flash Datasheet

ACE25AC100G
SPI NOR FLASH
Description
The ACE25AC100G is 1M-bit Serial flash supports the standard Serial Peripheral Interface (SPI). SPI
clock frequency of up to 120MHz is supported for fast read command.
Features

1M-bit Serial Flash
256 bytes per programmable page

Standard SPI
Standard SPI: SCLK, CS#, SI, SO,

High Speed Clock Frequency
120MHz for fast read with 30PF load

Program/Erase Speed
Page Program time: 1.5ms typical
Sector Erase time: 150ms typical
Block Erase time: 0.8s typical
Chip Erase time: 6s/3s typic

Flexible Architecture
Sector of 4K-byte
Block of 64k-byte

Low Power Consumption
10mA maximum active current
5uA maximum standby current

Single Power Supply Voltage: Full voltage range:2.7~3.6V

Minimum 100,000 Program/Erase Cycle
Absolute Maximum Ratings
Parameter
Value
Unit
Ambient Operating Temperature
-40 to 85
℃
Storage Temperature
-65 to 150
℃
Output Short Circuit Current
200
mA
Applied Input/Output Voltage
-0.5 to 4.0
V
VCC
-0.5 to 4.0
V
VER 1.1
1
ACE25AC100G
SPI NOR FLASH
Packaging Type
DIP-8
SOP-8
SOP-8L
TSSOP-8
Pin Configurations
Pin Name
I/O
Functions
CS#
I
Chip Select Input
SO
O
Data Output
VSS
Ground
SI
I
Data Input
SCLK
I
Serial Clock Input
VCC
Power Supply
Ordering information
ACE25AC100G XX + X H
Halogen-free
U: Tube
T: Tape and Reel
Pb - free
DP: DIP-8
FM: SOP-8
FML: SOP-8L (208mil)
TM: TSSOP-8
VER 1.1
2
ACE25AC100G
SPI NOR FLASH
Block Diagram
Uniform Block Sector Architecture
ACE25AC100G 64K Bytes Block Sector Architecture
Block
1
0
Sector
Address Range
31
01F000H
01FFFFH
……
……
……
16
010000H
010FFFH
15
00F000H
00FFFFH
……
……
……
0
000000H
000FFFH
Device Operation
The ACE25AC100G features a serial peripheral interface on 4 signals bus: Serial Clock (SCLK), Chip
Select (CS#), Serial Data Input (SI) and Serial Data Output (SO). Both SPI bus mode 0 and 3 are
supported. Input data is latched on the rising edge of SCLK and data shifts out on the falling edge of
SCLK.
VER 1.1
3
ACE25AC100G
SPI NOR FLASH
Data Protection
The ACE25AC100G provides the following data protection methods:
Write Enable (WREN) command: The WREN command is set the Write Enable Latch bit (WEL). The WEL
bit will return to reset by the following situation:

Power-Up

Write Disable (WRDI)

Write Status Register (WRSR)

Page Program (PP)

Sector Erase (SE) / Block Erase (BE) / Chip Erase (CE)
Software Protection Mode:

SRWD=0, the Block Protect (BP2, BP1, BP0) bits define the section of the memory array that can be
read but not change
SRWD=1, the Write Status Register (WRSR) instruction is no longer accepted for execution and the

SRWD bit and Block Protect bits (BP2, BP1, BP0) are read only.
Table 1.ACE25AC100G Protected Area Sizes
Status bit
Protect level
Protect Block
0
0(none)
None
0
1
1 (1 block)
Block 7
0
1
0
2 (2 blocks)
Block 6-7
0
1
1
3 (4 blocks)
Block 4-7
1
0
0
4 (8 blocks)
All
1
0
1
5 (All)
All
1
1
0
6 (All)
All
1
1
1
7 (All)
All
BP2
BP1
BP0
0
0
0
VER 1.1
4
ACE25AC100G
SPI NOR FLASH
Status Register
S7
S6
S5
S4
S3
S2
S1
S0
SRWD
Reserved
Reserved
BP2
BP1
BP0
WEL
WIP
The status and control bits of the Status Register are as follows:
WIP bit.
The Write In Progress (WIP) bit indicates whether the memory is busy in program/erase/write status
register progress. When WIP bit sets to 1, the device is busy in program/erase/write status register
progress. When WIP bit sets 0, the device is not in program, erase or write status register.
WEL bit.
The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch. When set to 1,
the internal Write Enable Latch is set. When set to 0, the internal Write Enable Latch is reset and no Write
Status Register, Program or Erase command is accepted.
BP2, BP1, BP0 bits.
The Block Protect (BP2, BP1, BP0) bits are non-volatile. They define the size of the area to be software
protected against Program and Erase commands. These bits are written with the Write Status Register
(WRSR) command. When the Block Protect (BP2, BP1, BP0) bits are set to 1, the relevant memory area
(as defined in Table1) becomes protected against Page Program (PP), Sector Erase (SE) and Block
Erase (BE) commands. Chip Erase command will be ignored if one or more of the Block Protect (BP2,
BP1, BP0) bits are 1.
SRWD bit.
The Status Register Write Disable (SRWD) bit is a non-volatile One Time Program (OTP) bit in the status
register that provide another software protection. Once it is set to 1, the Write Status Register (WRSR)
instruction is no longer accepted and the SRWD bit and Block Protect bits (BP2, BP1, BP0) are read only.
SRWD
Status register
Memory
Status register can be written in (WEL bit is
0
set to "1") and the SRWD, BP2-BP0 bits can The protected area cannot be program or erase
be changed
1
The SRWD, BP2-BP0 of status register bits
cannot be changed
The protected area cannot be program or erase
VER 1.1
5
ACE25AC100G
SPI NOR FLASH
Commands Description
All commands, addresses and data are shifted in and out of the device, beginning with the most
significant bit on the first rising edge of SCLK after CS# is driven low. Then, the one-byte command code
must be shifted in to the device, most significant bit first on SI, each bit being latched on the rising edges
of SCLK. See Table2, every command sequence starts with a one-byte command code. Depending on
the command, this might be followed by address bytes, or by data bytes, or by both or none. CS# must be
driven high after the last bit of the command sequence has been shifted in. For the command of Read,
Fast Read, Read Status Register, and Read Device ID, the shifted-in command sequence is followed by a
data-out sequence. CS# can be driven high after any bit of the data-out sequence is being shifted out.
For the command of Page Program, Sector Erase, Block Erase, Chip Erase, Write Status Register, Write
Enable, Write Disable, CS# must be driven high exactly at a byte boundary, otherwise the command is
rejected. That is CS# must driven high when the number of clock pulses after CS# being driven low is an
exact multiple of eight. For Page Program, if at any time the input byte is not a full byte, nothing will
happen and WEL will not be reset.
Table2. Commands
Command Name
Byte1
Write Enable
06H
Write Disable
04H
Read Status Register
05H
(S7-S0)
(continuous)
Write Status Register
01H
(S7-S0)
(continuous)
Read Data
03H
A23-A16
A15-A8
A7-A0
(D7-D0)
(Next byte)
(continuous)
Fast Read
0BH
A23-A16
A15-A8
A7-A0
dummy
(D7-D0)
(continuous)
Page Program
02H
A23-A16
A15-A8
A7-A0
(D7-D0)
(Next byte)
Sector Erase
20H
A23-A16
A15-A8
A7-A0
Block Erase
D8H
A23-A16
A15-A8
A7-A0
Chip Erase
C7/60H
90H
dummy
dummy
00H
9FH
(MID7-MID0)
Manufacturer/Device
ID
Read Identification
Byte2
Byte3
Byte4
(JDID15-JDI (JDID7-JDID
D8)
0)
Byte5
Byte6
n-Bytes
(MID7-MID0) (DID7-DID0) (continuous)
(continuous)
VER 1.1
6
ACE25AC100G
SPI NOR FLASH
ID Definitions
Operation Code
M7-M0
ID15-ID8
ID7-ID0
9FH
0E
40
13
90H
0E
12
Write Enable (WREN) (06H)
The Write Enable (WREN) command is for setting the Write Enable Latch (WEL) bit. The Write Enable
Latch (WEL) bit must be set prior to every Page Program (PP), Sector Erase (SE), Block Erase (BE), Chip
Erase (CE) and Write Status Register (WRSR) command. The Write Enable (WREN) command
sequence: CS# goes low→Send Write Enable command→CS# goes high.
Figure1. Write Enable Sequence Diagram
Write Disable (WRDI) (04H)
The Write Disable command is for resetting the Write Enable Latch (WEL) bit. The Write Disable
command sequence: CS# goes low Send Write Disable command CS# goes high. The WEL bit is reset by
following condition: Power-up and upon completion of the Write Status Register, Page Program, Sector
Erase, Block Erase and Chip Erase commands.
Figure2. Write Disable Sequence Diagram
VER 1.1
7
ACE25AC100G
SPI NOR FLASH
Read Status Register (RDSR) (05H)
The Read Status Register (RDSR) command is for reading the Status Register. The Status Register may
be read at any time, even while a Program, Erase or Write Status Register cycle is in progress. When one
of these cycles is in progress, it is recommended to check the Write In Progress (WIP) bit before sending
a new command to the device. It is also possible to read the Status Register continuously.
Figure3. Read Status Register Sequence Diagram
Write Status Register (WRSR) (01H)
The Write Status Register (WRSR) command allows new values to be written to the Status Register.
Before it can be accepted, a Write Enable (WREN) command must previously have been executed. After
the Write Enable (WREN) command has been decoded and executed, the device sets the Write Enable
Latch (WEL).
The Write Status Register (WRSR) command has no effect on S6, S5, S1 and S0 of the Status Register.
CS# must be driven high after the eighth bit of the data byte has been latched in. If not, the Write Status
Register (WRSR) command is not executed. As soon as CS# is driven high, the self-timed Write Status
Register cycle (whose duration is tW) is initiated. While the Write Status Register cycle is in progress, the
Status Register may be read to check the value of the Write In Progress (WIP) bit. The Write In Progress
(WIP) bit is 1 during the self-timed Write Status Register cycle, and is 0 when it is completed. When the
cycle is completed, the Write Enable Latch (WEL) is reset.
The Write Status Register (WRSR) command allows the user to change the values of the Block Protect
(BP2, BP1, BP0) bits, to define the size of the area that is to be treated as read-only, as defined in
Table1.1 and 1.2. The Status Register Write Disable (SRWD) bit is a non-volatile One Time Program(OTP)
bit, the Write Status Register (WRSR) command allows the user to set the Status Register Write Disable
(SRWD) bit to 1. The Status Register Write Disable (SRWD) bit allow the device to be put in another
Software Protected Mode. Once the SRWD bit is set to 1, the Write Status Register (WRSR) command is
not executed, and the SRWD bit and Block Protect bits (BP2, BP1, BP0) are read only.
Figure4. Write Status Register Sequence Diagram
VER 1.1
8
ACE25AC100G
SPI NOR FLASH
Read Data Bytes (READ) (03H)
The Read Data Bytes (READ) command is followed by a 3-byte address (A23-A0), each bit being
latched-in during the rising edge of SCLK. Then the memory content, at that address, is shifted out on SO,
each bit being shifted out, at a Max frequency fR, during the falling edge of SCLK. The first byte
addressed can be at any location. The address is automatically incremented to the next higher address
after each byte of data is shifted out. Therefore, the whole memory can be read with a single Read Data
Bytes (READ) command. During an Erase, Program or Write cycle, Read Data Byte (READ) command
will be rejected without affecting the cycle in progress.
Figure5. Read Data Bytes Sequence Diagram
Read Data Bytes At Higher Speed (Fast Read) (0BH)
The Read Data Bytes at Higher Speed (Fast Read) command is for quickly reading data out. It is followed
by a 3-byte address (A23-A0) and a dummy byte, each bit being latched-in during the rising edge of SCLK.
Then the memory content, at that address, is shifted out on SO, each bit being shifted out, at a Max
frequency fC, during the falling edge of SCLK. The first byte address can be at any location. The address
is automatically incremented to the next higher address after each byte of data is shifted out.
Figure6. Read Data Bytes at Higher Speed Sequence Diagram
VER 1.1
9
ACE25AC100G
SPI NOR FLASH
Page Program (PP) (02H)
The Page Program (PP) command is for programming the memory. A Write Enable (WREN) command
must previously have been executed to set the Write Enable Latch (WEL) bit before sending the Page
Program command.
The Page Program (PP) command is entered by driving CS# Low, followed by the command code, three
address bytes and at least one data byte on SI. If the 8 least significant address bits (A7-A0) are not all
zero, all transmitted data that goes beyond the end of the current page are programmed from the start
address of the same page (from the address whose 8 least significant bits (A7-A0) are all zero). CS# must
be driven low for the entire duration of the sequence. The Page Program command sequence: CS# goes
low sending Page Program command
-byte address on SI
The command sequence is shown in Figure7. If more than 256 bytes are sent to the device, previously
latched data are discarded and the last 256 data bytes are guaranteed to be programmed correctly within
the same page. If less than 256 data bytes are sent to device, they are correctly programmed at the
requested addresses without having any effects on the other bytes of the same page. CS# must be driven
high after the eighth bit of the last data byte has been latched in; otherwise the Page Program (PP)
command is not executed.
As soon as CS# is driven high, the self-timed Page Program cycle (whose duration is tPP) is initiated.
While the Page Program cycle is in progress, the Status Register may be read to check the value of the
Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Page Program cycle,
and is 0 when it is completed. Write Enable Latch (WEL) bit is reset to 0 at the end of the Page Program
Cycle..
Page Program (PP) command applied to a page which is protected by the Block Protect (BP2, BP1, BP0)
bit (see Table1) is not executed.
Figure7. Page Program Sequence Diagram
VER 1.1
10
ACE25AC100G
SPI NOR FLASH
Sector Erase (SE) (20H)
The Sector Erase (SE) command is for erasing the all data of the chosen sector. A Write Enable (WREN)
command must previously have been executed to set the Write Enable Latch (WEL) bit. The Sector Erase
(SE) command is entered by driving CS# low, followed by the command code, and 3-address byte on SI.
Any address inside the sector is a valid address for the Sector Erase (SE) command. CS# must be driven
low for the entire duration of the sequence.
The Sector Erase command sequence: CS# goes low sending Sector Erase command
-byte address
eighth bit of the last address byte has been latched in; otherwise the Sector Erase (SE) command is not
executed. As soon as CS# is driven high, the self-timed Sector Erase cycle (whose duration is tSE) is
initiated.
While the Sector Erase cycle is in progress, the Status Register may be read to check the value of the
Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Sector Erase cycle,
and is 0 when it is completed. Write Enable Latch (WEL) bit is reset to 0 at the end of the Sector Erase
cycle. Sector Erase (SE) command applied to a sector which is protected by the Block Protect (BP2, BP1,
BP0) bit (see Table1) is not executed.
Block Erase (BE) (D8H)
Figure8. Sector Erase Sequence Diagram
The Block Erase (BE) command is for erasing the all data of the chosen block. A Write Enable (WREN)
command must previously have been executed to set the Write Enable Latch (WEL) bit. The Block Erase
(BE) command is entered by driving CS# low, followed by the command code, and three address bytes
on SI. Any address inside the block is a valid address for the Block Erase (BE) command. CS# must be
driven low for the entire duration of the sequence.
The Block Erase command sequence: CS# goes low send Block Erase command 3-byte address on
e driven high after the
eighth bit of the last address byte has been latched in; otherwise the Block Erase (BE) command is not
executed. As soon as CS# is driven high, the self-timed Block Erase cycle (whose duration is tBE) is
initiated. While the Block Erase cycle is in progress, the Status Register may be read to check the value of
the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Block Erase
cycle, and is 0 when it is completed. Write Enable Latch (WEL) bit is reset to 0 at the end of the Block
Erase cycle. Block Erase (BE) commands applied to a block which is protected by the Block Protect (BP2,
BP1, BP0) bits (see Table1) is not executed.
Figure9. Block Erase Sequence Diagram
VER 1.1
11
ACE25AC100G
SPI NOR FLASH
Chip Erase (CE) (60/C7H)
The Chip Erase (CE) command is for erasing the all data of the chip. A Write Enable (WREN) command
must previously have been executed to set the Write Enable Latch (WEL) bit .The Chip Erase (CE)
command is entered by driving CS# Low, followed by the command code on Serial Data Input (SI). CS#
must be driven Low for the entire duration of the sequence.
The Chip Erase command sequence: CS# goes low send Chip Erase command CS# goes high. The
command sequence is shown in Figure10. CS# must be driven high after the eighth bit of the command
code has been latched in, otherwise the Chip Erase command is not executed. As soon as CS# is driven
high, the self-timed Chip Erase cycle (whose duration is tCE) is initiated. While the Chip Erase cycle is in
progress, the Status Register may be read to check the value of the Write In Progress (WIP) bit. The Write
In Progress (WIP) bit is 1 during the self-timed Chip Erase cycle, and is 0 when it is completed. Write
Enable Latch (WEL) bit is reset to 0 at the end of the Chip Erase cycle. The Chip Erase (CE) command is
ignored if one or more sectors are protected by (BP2, BP1, BP0) bits.
Figure10. Chip Erase Sequence Diagram
Read Manufacture ID/ Device ID (REMS) (90H)
The Read Manufacturer/Device ID command is for reading both the JEDEC assigned Manufacturer ID
and the specific Device ID. The command is initiated by driving the CS# pin low and shifting the command
code “90H” followed by a 24-bit address (A23-A0) of 000000H. After which, the Manufacturer ID and the
Device ID are shifted out on the falling edge of SCLK with most significant bit (MSB) first as shown in
Figure11. If the 24-bit address is initially set to 000001H, the Device ID will be read first .
Figure11. Read Manufacture ID/ Device ID Sequence Diagram
VER 1.1
12
ACE25AC100G
SPI NOR FLASH
Read Identification (RDID) (9FH)
The Read Identification (RDID) command allows the 8-bit manufacturer identification to be read, followed
by two bytes of device identification. The device identification indicates the memory type in the first byte,
and the memory capacity of the device in the second byte. Any Read Identification (RDID) command
while an Erase or Program cycle is in progress, is not decoded, and has no effect on the cycle that is in
progress.
The device is first selected by driving CS# to low. Then, the 8-bit command code for the command is
shifted in.
This is followed by the 24-bit device identification, stored in the memory, being shifted out on Serial Data
Output, each bit being shifted out during the falling edge of Serial Clock. The command sequence is
shown in Figure12. The Read Identification (RDID) command is terminated by driving CS# to high at any
time during data output. After CS# is driven high, the device returns to Standby Mode and awaits for new
command.
Figure12. Read Identification ID Sequence Diagram
VER 1.1
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ACE25AC100G
SPI NOR FLASH
Electrical Characteristics
Power-On Timing
Table3. Power-Up Timing and Write Inhibit Threshold
Symbol
Parameter
Min
Max
Unit
tVSL
VCC(min) To CS# Low
10
tPUW
Time Delay Before Write Instruction
1
10
ms
VWI
Write Inhibit Voltage
1
2.5
V
us
Initial Delivery State
The device is delivered with the memory array erased: all bits are set to 1(each byte contains FFH).The
Status Register contains 00H (all Status Register bits are 0).
Data Retention and Endurance
Parameter
Minimum Pattern Data Retention Time
Erase/Program Endurance
Test Condition
Min
Unit
150℃
10
Years
125℃
20
Years
-40 to 85℃
100K
Cycles
Latch up Characteristics
Parameter
Min
Max
Input Voltage Respect To VSS On I/O Pins
-1.0V
VCC+1.0V
VCC Current
-100mA
100mA
VER 1.1
14
ACE25AC100G
SPI NOR FLASH
Capacitance Measurement Condition
Symbol
Parameter
CIN
Min
Typ
Max
Unit
Conditions
Input Capacitance
6
pF
VIN=0V
COUT
Output Capacitance
8
pF
VOUT=0V
CL
Load Capacitance
30
Input Rise And Fall time
pF
5
ns
Input Pulse Voltage
0.1VCC to 0.8VCC
V
Input Timing Reference Voltage
0.2VCC to 0.7VCC
V
Output Timing Reference Voltage
0.5VCC
V
Maximum Negative Overshoot Waveform
Maximum Positive Overshoot Waveform
Figure13. Input Test Waveform and Measurement Level
VER 1.1
15
ACE25AC100G
SPI NOR FLASH
DC Characteristics(T=-40℃~85℃,VCC=2.7~3.6V)
Symbol
Parameter
ILI
Test Condition
Min.
Max.
Unit
Input Leakage Current
±2
μA
ILO
Output Leakage Current
±2
μA
ICC1
Standby Current
1
5
μA
15
20
CS#=VCC VIN=VCC or
VSS
CLK=0.1VCC/0.9VCC at
ICC3
Operating Current(Read)
120MHz for Fast Read
Typ
mA
CLK=0.1VCC/0.9VCC at
13
40MHz for Read
18
ICC4
Operating Current(PP)
CS#=VCC
10
mA
ICC5
Operating Current(WRSR)
CS#=VCC
10
mA
ICC6
Operating Current(SE)
CS#=VCC
10
mA
ICC7
Operating Current(BE)
CS#=VCC
10
mA
VIL
Input Low Voltage
-0.5
0.2VCC
V
VIH
Input High Voltage
0.7VCC
VCC+0.4
V
VOL
Output Low Voltage
IOL=1.6mA
0.4
V
VOH
Output High Voltage
IOH=-100uA
VCC-0.2
V
VER 1.1
16
ACE25AC100G
SPI NOR FLASH
AC Characteristics(T=-40℃~85℃,VCC=2.7~3.6V，CL=30pf)
Symbol
Parameter
Min.
fC
Serial Clock Frequency For:Fast Read(0BH),
fR
Max.
Unit
DC
120
MHz
Serial Clock Frequency For:Read(03H)
DC
40
MHz
tCLH
Serial Clock High Time
4
ns
tCLL
Serial Clock Low Time
4
ns
tCLCH
Serial Clock Rise Time(Slew Rate)
0.2
V/ns
tCHCL
Serial Clock Fall Time(Slew Rate)
0.2
V/ns
tSLCH
CS# Active Setup Time
5
ns
tCHSH
CS# Active Hold Time
5
ns
tSHCH
CS# Not Active Setup Time
5
ns
tCHSL
CS# Not Active Hold Time
5
ns
tSHSL
CS# High Time (read/write)
20
ns
tSHQZ
Output Disable Time
tCLQX
Output Hold Time
1
ns
tDVCH
Data In Setup Time
2
ns
tCHDX
Data In Hold Time
2
ns
tHLCH
Hold# Low Setup Time(relative to Clock)
5
ns
tHHCH
Hold# High Setup Time(relative to Clock)
5
ns
tCHHL
Hold# High Hold Time(relative to Clock)
5
ns
tCHHH
Hold# Low Hold Time(relative to Clock)
5
ns
tHLQZ
Hold# Low To High-Z Output
6
ns
tHHQX
Hold# Low To Low-Z Output
6
ns
tCLQV
Clock Low To Output Valid
6.5
ns
tWHSL
Write Protect Setup Time Before CS# Low
20
ns
tSHWL
Write Protect Hold Time After CS# High
100
ns
tRES2
Typ
6
ns
CS# High To Standby Mode With Electronic
Signature Read
0.1
us
tW
Write Status Register Cycle Time
50
100
ms
tPP
Page Programming Time
1.5
2
ms
tSE
Sector Erase Time
150
300
ms
tBE
Block Erase Time
0.8
1.5
s
tCE
Chip Erase Time
6
10
s
VER 1.1
17
ACE25AC100G
SPI NOR FLASH
Figure14. Serial Input Timing
Figure15. Output Timing
VER 1.1
18
ACE25AC100G
SPI NOR FLASH
Packaging information
DIP-8
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
3.710
4.310
0.146
0.170
A1
0.510
A2
3.200
3.600
0.126
0.142
B
0.380
0.570
0.015
0.022
B1
0.020
1.524（BSC）
0.060（BSC）
C
0.204
0.360
0.008
0.014
D
9.000
9.400
0.354
0.370
E
6.200
6.600
0.244
0.260
E1
7.320
7.920
0.288
0.312
e
2.540 (BSC)
0.100（BSC）
L
3.000
3.600
0.118
0.142
E2
8.400
9.000
0.331
0.354
VER 1.1
19
ACE25AC100G
SPI NOR FLASH
Packaging information
SOP-8
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
1.350
1.750
0.053
0.069
A1
0.100
0.250
0.004
0.010
A2
1.350
1.550
0.053
0.061
b
0.330
0.510
0.013
0.020
c
0.170
0.250
0.006
0.010
D
4.700
5.100
0.185
0.200
E
3.800
4.000
0.150
0.157
E1
5.800
6.200
0.228
0.244
e
1.270 (BSC)
0.050 (BSC)
L
0.400
1.270
0.016
0.050
θ
0°
8°
0°
8°
VER 1.1
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ACE25AC100G
SPI NOR FLASH
Packaging information
SOP-8L (208mil)
Symbol
Dimensions In Millimeters
Min
Max
A
Dimensions In Inches
Min
Max
2.150
0.085
A1
0.050
0.250
0.002
0.010
A2
1.700
1.900
0.067
0.075
b
0.350
0.500
0.014
0.020
c
0.100
0.250
0.004
0.010
D
5.130
5.330
0.202
0.210
E
7.700
8.100
0.303
0.319
E1
5.180
5.380
0.204
0.212
e
1.270 (BSC)
0.050 (BSC)
L
0.500
0.850
0.020
0.033
θ
0°
8°
0°
8°
VER 1.1
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ACE25AC100G
SPI NOR FLASH
Packaging information
TSSOP-8
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
D
2.900
3.100
0.114
0.122
E
4.300
4.500
0.169
0.177
b
0.190
0.300
0.007
0.012
c
0.090
0.200
0.004
0.008
E1
6.250
6.550
0.246
0.258
A
1.200
0.047
A2
0.800
1.000
0.031
0.039
A1
0.050
0.150
0.002
0.006
e
L
0.65 (BSC)
0.500
H
θ
0.026 (BSC)
0.700
0.020
0.25 (TYP)
1°
0.028
0.01 (TYP)
7°
1°
7°
VER 1.1
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ACE25AC100G
SPI NOR FLASH
Notes
ACE does not assume any responsibility for use as critical components in life support devices or systems
without the express written approval of the president and general counsel of ACE Electronics Co., LTD.
As sued herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and shoes failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be reasonably expected to result in
a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can
be reasonably expected to cause the failure of the life support device or system, or to affect its safety
or effectiveness.
ACE Technology Co., LTD.
http://www.ace-ele.com/
VER 1.1
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