TI1 CD74HCT4020E High-speed cmos logic 14-stage binary counter Datasheet

[ /Title
(CD74
HC402
0,
CD74
HCT40
20)
/Subject
(High
Speed
CMOS
CD54HC4020, CD74HC4020,
CD54HCT4020, CD74HCT4020
Data sheet acquired from Harris Semiconductor
SCHS201C
High-Speed CMOS Logic
14-Stage Binary Counter
February 1998 - Revised October 2003
Features
Description
• Fully Static Operation
The ’HC4020 and ’HCT4020 are 14-stage ripple-carry
binary counters. All counter stages are master-slave flipflops. The state of the stage advances one count on the
negative clock transition of each input pulse; a high voltage
level on the MR line resets all counters to their zero state. All
inputs and outputs are buffered.
• Buffered Inputs
• Common Reset
• Negative Edge Clocking
• Fanout (Over Temperature Range)
Ordering Information
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
PART NUMBER
• Wide Operating Temperature Range . . . -55oC to 125oC
TEMP. RANGE
(oC)
PACKAGE
• Balanced Propagation Delay and Transition Times
CD54HC4020F3A
-55 to 125
16 Ld CERDIP
• Significant Power Reduction Compared to LSTTL
Logic ICs
CD54HCT4020F3A
-55 to 125
16 Ld CERDIP
CD74HC4020E
-55 to 125
16 Ld PDIP
CD74HC4020M
-55 to 125
16 Ld SOIC
CD74HC4020MT
-55 to 125
16 Ld SOIC
CD74HC4020M96
-55 to 125
16 Ld SOIC
CD74HCT4020E
-55 to 125
16 Ld PDIP
CD74HCT4020M
-55 to 125
16 Ld SOIC
CD74HCT4020MT
-55 to 125
16 Ld SOIC
CD74HCT4020M96
-55 to 125
16 Ld SOIC
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel
of 250.
Pinout
CD54HC4020, CD54HCT4020
(CERDIP)
CD74HC4020, CD74HCT4020
(PDIP, SOIC)
TOP VIEW
Q12 1
16 VCC
Q13 2
15 Q11
Q14 3
14 Q10
Q6 4
13 Q8
Q5 5
12 Q9
Q7 6
11 MR
Q4 7
10 CP
GND 8
9 Q1‘
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
CD54HC4020, CD74HC4020, CD54HCT4020, CD74HCT4020
Functional Diagram
VCC
16
10
9
INPUT
PULSES
7
5
4
6
14-STAGE
RIPPLE
COUNTER
13
12
14
15
1
2
3
11
MASTER
RESET
Q1’
Q4
Q5
Q6
Q7
Q8
BUFFERED
OUTPUTS
Q9
Q10
Q11
Q12
Q13
Q14
8
GND
TRUTH TABLE
CP COUNT
MR
OUTPUT STATE
↑
L
No Change
↓
L
Advance to Next State
X
H
All Outputs Are Low
H = High Voltage Level, L = Low Voltage Level, X = Don’t Care,
↑ = Transition from Low to High Level, ↓ = Transition from High to Low.
2
MR
CP
11
10
Q1’
R
R
9
CP Q
2
CP Q
CP Q
I Q’
CP Q
R
CP Q
3
CP Q
R
CP Q
4
CP Q
Q4
7
R
CP Q
5
CP Q
Q5
5
R
CP Q
6
CP Q
Q6
4
R
CP Q
7
CP Q
Q7
6
R
CP Q
8
CP Q
Q8
13
R
CP Q
9
CP Q
Q9
12
R
CP Q
10
CP Q
Q10
14
R
CP Q
11
CP Q
Q11
15
R
CP Q
12
CP Q
Q12
1
R
CP Q
13
CP Q
Q13
2
R
CP Q
14
CP Q
Q14
3
CD54/74HC4020, CD54/74HCT4020
Logic Diagram
3
CD54HC4020, CD74HC4020, CD54HC4020, CD74HCT4020
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
VIH
-
-
2
1.5
-
-
1.5
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
-
1.5
-
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
II
VCC or
GND
-
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
4
CD54HC4020, CD74HC4020, CD54HCT4020, CD74HCT4020
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
IO (mA)
High Level Input
Voltage
VIH
-
-
Low Level Input
Voltage
VIL
-
High Level Output
Voltage
CMOS Loads
VOH
VIH or VIL
PARAMETER
25oC
VCC
(V)
-40oC TO 85oC -55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
4.5 to
5.5
2
-
-
2
-
2
-
V
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
II
VCC and
GND
0
5.5
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
(Note 2)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
MR
0.65
CP
0.5
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.,
360µA max at 25oC.
Prerequisite for Switching Specifications
25oC
PARAMETER
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
fMAX
2
6
-
5
-
4
-
MHz
4.5
30
-
25
-
20
-
MHz
6
35
-
29
-
24
-
MHz
2
80
-
100
-
120
-
ns
4.5
16
-
20
-
24
-
ns
6
14
-
17
-
20
-
ns
HC TYPES
Maximum Input Pulse
Frequency
Input Pulse Width
tW
5
CD54HC4020, CD74HC4020, CD54HCT4020, CD74HCT4020
Prerequisite for Switching Specifications
(Continued)
25oC
PARAMETER
Reset Removal Time
Reset Pulse Width
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
tREM
2
50
-
65
-
75
-
ns
4.5
10
-
13
-
15
-
ns
6
9
-
11
-
13
-
ns
2
80
-
100
-
120
-
ns
4.5
16
-
20
-
24
-
ns
6
14
-
17
-
20
-
ns
fMAX
4.5
25
-
20
-
16
-
MHz
tW
4.5
20
-
25
-
30
-
ns
tREC
4.5
10
-
13
-
15
-
ns
tW
4.5
20
-
25
-
30
-
ns
tW
HCT TYPES
Maximum Input Pulse
Frequency
Input Pulse Width
Reset Recovery Time
Reset Pulse Width
Switching Specifications Input tr, tf = 6ns
PARAMETER
TEST
SYMBOL CONDITIONS
25oC
-40oC TO 85oC
-55oC TO 125oC
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
140
-
175
-
210
ns
4.5
-
-
28
-
35
-
42
ns
CL =15pF
5
-
11
-
-
-
-
-
ns
CL = 50pF
6
-
-
24
-
30
-
36
ns
CL = 50pF
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
CL =15pF
5
-
6
-
-
-
-
-
ns
CL = 50pF
6
-
-
13
-
16
-
19
ns
CL = 50pF
2
-
-
170
-
215
-
255
ns
4.5
-
-
34
-
43
-
51
ns
5
-
14
-
-
-
-
-
ns
6
-
-
29
-
37
-
43
ns
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
HC TYPES
Propagation Delay Time
(Figure 1)
tPLH,
tPHL
CL = 50pF
CP to Q1’ Output
Qn to Qn + 1
MR to Qn
Output Transition Time
(Figure 1)
tPLH,
tPHL
tPLH,
tPHL
tTLH, tTHL CL = 50pF
Input Capacitance
CIN
CL = 50pF
-
-
-
10
-
10
-
10
pF
Power Dissipation Capacitance
(Notes 3, 4)
CPD
CL =15pF
5
-
30
-
-
-
-
-
pF
6
CD54HC4020, CD74HC4020, CD54HCT4020, CD74HCT4020
Switching Specifications Input tr, tf = 6ns
(Continued)
TEST
SYMBOL CONDITIONS
PARAMETER
25oC
-40oC TO 85oC
-55oC TO 125oC
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
CL = 50pF
4.5
-
-
40
-
50
-
60
ns
CL =15pF
5
-
17
-
-
-
-
-
ns
tPLH,
tPHL
CL = 50pF
4.5
-
-
15
-
19
-
22
ns
CL =15pF
5
-
6
-
-
-
-
-
ns
tPLH,
tPHL
CL = 50pF
4.5
-
-
40
-
50
-
60
ns
CL =15pF
5
-
17
-
-
-
-
-
ns
4.5
-
-
15
-
19
-
22
ns
HCT TYPES
Propagation Delay Time
(Figure 2)
tPLH,
tPHL
CP to Q1’ Output
Qn to Qn + 1
MR to Qn
Output Transition
tTLH, tTHL CL = 50pF
Input Capacitance
CIN
CL =15pF
-
-
-
10
-
10
-
10
pF
Power Dissipation Capacitance
(Notes 3, 4)
CPD
CL =15pF
5
-
30
-
-
-
-
-
pF
NOTES:
3. CPD is used to determine the dynamic power consumption, per package.
4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
Test Circuits and Waveforms
tfCL
trCL
CLOCK
90%
10%
tWL + tWH =
I
tWL
50%
tfCL = 6ns
fCL
I
fCL
3V
VCC
50%
10%
tWL + tWH =
trCL = 6ns
CLOCK
50%
2.7V
0.3V
GND
1.3V
0.3V
tWL
tWH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
1.3V
1.3V
GND
tWH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
7
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-8945801EA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8945801EA
CD54HCT4020F3A
CD54HC4020F
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
CD54HC4020F
CD54HC4020F3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8500301EA
CD54HC4020F3A
CD54HCT4020F3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8945801EA
CD54HCT4020F3A
CD74HC4020E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD74HC4020E
CD74HC4020EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD74HC4020E
CD74HC4020M
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC4020M
CD74HC4020M96
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC4020M
CD74HC4020M96E4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC4020M
CD74HC4020M96G4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC4020M
CD74HC4020MG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC4020M
CD74HCT4020E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD74HCT4020E
CD74HCT4020M
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HCT4020M
CD74HCT4020M96
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HCT4020M
CD74HCT4020M96G4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HCT4020M
CD74HCT4020MG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HCT4020M
CD74HCT4020MT
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HCT4020M
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2014
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD54HC4020, CD54HCT4020, CD74HC4020, CD74HCT4020 :
• Catalog: CD74HC4020, CD74HCT4020
• Military: CD54HC4020, CD54HCT4020
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2014
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74HC4020M96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD74HCT4020M96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74HC4020M96
SOIC
D
16
2500
333.2
345.9
28.6
CD74HCT4020M96
SOIC
D
16
2500
333.2
345.9
28.6
Pack Materials-Page 2
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