TI MSP430FW428IPMR Mixed signal microcontroller Datasheet

MSP430FW42x
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SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
MIXED SIGNAL MICROCONTROLLER
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
•
Low Supply Voltage Range: 1.8 V to 3.6 V
Ultra-Low Power Consumption:
– Active Mode: 200 µA at 1 MHz, 2.2 V
– Standby Mode: 0.7 µA
– Off Mode (RAM Retention): 0.1 µA
Five Power-Saving Modes
Wake-Up From Standby Mode in Less Than
6 µs
Frequency-Locked Loop, FLL+
16-Bit RISC Architecture,
125-ns Instruction Cycle Time
Scan IF for Background Water, Heat, and Gas
Volume Measurement
16-Bit Timer_A With Three Capture/Compare
Registers
16-Bit Timer_A With Five Capture/Compare
Registers
Integrated LCD Driver for Up to 96 Segments
On-Chip Comparator
Serial Onboard Programming, No External
Programming Voltage Needed Programmable
Code Protection by Security Fuse
Brownout Detector
•
•
•
•
•
Supply Voltage Supervisor/Monitor With
Programmable Level Detection
Bootstrap Loader in Flash Devices
Family Members Include:
– MSP430FW423:
8KB + 256B Flash Memory,
256B RAM
– MSP430FW425:
16KB + 256B Flash Memory,
512B RAM
– MSP430FW427:
32KB + 256B Flash Memory,
1KB RAM
– MSP430FW428:
48KB + 256B Flash Memory,
2KB RAM
– MSP430FW429:
60KB + 256B Flash Memory,
2KB RAM
Available in 64-Pin Quad Flat Pack (QFP)
For Complete Module Descriptions, See the
MSP430x4xx Family User's Guide, Literature
Number SLAU056
DESCRIPTION
The Texas Instruments MSP430 family of ultra-low-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 6 µs.
The MSP430xW42x series are microcontroller configurations with two built-in 16-bit timers, a comparator, 96
LCD segment drive capability, a scan interface, and 48 I/O pins.
Typical applications include sensor systems that capture analog signals, convert them to digital values, and
process the data and transmit them to a host system. The comparator and timers make the configurations ideal
for gas, heat, and water meters, industrial meters, counter applications, hand-held meters, etc.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2011, Texas Instruments Incorporated
MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Table 1. ORDERING INFORMATION (1)
PACKAGED DEVICES (2)
TA
PLASTIC 64-PIN QFP
(PM)
MSP430FW423IPM
MSP430FW425IPM
−40°C to 85°C
MSP430FW427IPM
MSP430FW428IPM
MSP430FW429IPM
(1)
(2)
2
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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AVCC
DVSS
AVSS
P6.2/SIFCH2
P6.1/SIFCH1
P6.0/SIFCH0
RST/NMI
TCK
TMS
TDI/TCLK
TDO/TDI
P1.0/TA0.0
P1.1/TA0.0/MCLK
P1.2/TA0.1
P1.3/TA1.0/SVSOUT
P1.4/TA1.0
Pin Designation
1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
2
47
3
46
4
45
5
44
6
43
7
42
8
MSP430xW42x
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
33
16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P1.5/TA0CLK/ACLK
P1.6/CA0
P1.7/CA1
P2.0/TA0.2
P2.1/TA1.1
P5.7/R33
P5.6/R23
P5.5/R13
R03
P5.4/COM3
P5.3/COM2
P5.2/COM1
COM0
P2.2/TA1.2/S23
P2.3/TA1.3/S22
P2.4/TA1.4/S21
P4.4/S5
P4.3/S6
P4.2/S7
P4.1/S8
P4.0/S9
P3.7/S10
P3.6/S11
P3.5/S12
P3.4/S13
P3.3/S14
P3.2/S15
P3.1/S16
P3.0/S17
P2.7/SIFCLKG/S18
P2.6/CAOUT/S19
P2.5/TA1CLK/S20
DVCC
P6.3/SIFCH3/SIFCAOUT
P6.4/SIFCI0
P6.5/SIFCI1
P6.6/SIFCI2/SIFDACOUT
P6.7/SIFCI3/SVSIN
SIFCI
XIN
XOUT
SIFVSS
SIFCOM
P5.1/S0
P5.0/S1
P4.7/S2
P4.6/S3
P4.5/S4
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Functional Block Diagram
XIN
DVCC
XOUT
DVSS
AVCC
AVSS
P1
P2
P4
P3
8
8
Port 1
Port 2
8 I/O
Interrupt
Capability
8 I/O
Interrupt
Capability
P6
P5
8
8
8
8
Port 3
Port 4
Port 5
Port 6
8 I/O
8 I/O
8 I/O
8 I/O
ACLK
Oscillator
FLL+
MCLK
8 MHz
CPU
incl. 16
Registers
Emulation
Module
JTAG
Interface
SMCLK
Flash
RAM
60KB/48KB
32KB
16KB
8KB
2KB
1KB
512B
256B
Scan IF
MAB
MDB
POR/
Multilevel
SVS/
Brownout
Watchdog
Timer
WDT
15/16-Bit
Timer0_A3
Timer1_A5
3 CC Reg
5 CC Reg
Comparator_
A
Basic
Timer 1
1 Interrupt
Vector
LCD
96
Segments
1,2,3,4 MUX
fLCD
RST/NMI
4
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Table 2. Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
AVCC
64
Analog supply voltage, positive terminal. Supplies SVS, brownout, oscillator, comparator_A,
scan IF AFE, port 6, and LCD resistive divider circuitry; must not power up prior to DVCC.
AVSS
62
Analog supply voltage, negative terminal. Supplies SVS, brownout, oscillator, comparator_A,
scan IF AFE. and port 6. Must be externally connected to DVSS. Internally connected to DVSS.
DVCC
1
Digital supply voltage, positive terminal.
DVSS
63
Digital supply voltage, negative terminal.
SIFVSS
10
Scan IF AFE reference supply voltage.
P1.0/TA0.0
53
I/O
General-purpose digital I/O/Timer0_A. Capture: CCI0A input, compare: Out0 output/BSL
transmit
P1.1/TA0.0/MCLK
52
I/O
General-purpose digital I/O/Timer0_A. Capture: CCI0B input/MCLK output/BSL receive
Note: TA0.0 is only an input on this pin.
P1.2/TA0.1
51
I/O
General-purpose digital I/O/Timer0_A, capture: CCI1A input, compare: Out1 output
P1.3/TA1.0/ SVSOUT
50
I/O
General-purpose digital I/O/Timer1_A, capture: CCI0B input/SVS: output of SVS comparator
Note: TA1.0 is only an input on this pin.
P1.4/TA1.0
49
I/O
General-purpose digital I/O/Timer1_A, capture: CCI0A input, compare: Out0 output
P1.5/TA0CLK/ACLK
48
I/O
General-purpose digital I/O/input of Timer0_A clock/output of ACLK
P1.6/CA0
47
I/O
General-purpose digital I/O/Comparator_A input
P1.7/CA1
46
I/O
General-purpose digital I/O/Comparator_A input
P2.0/TA0.2
45
I/O
General-purpose digital I/O/Timer0_A, capture: CCI2A input, compare: Out2 output
P2.1/TA1.1
44
I/O
General-purpose digital I/O/Timer0_A, capture: CCI1A input, compare: Out1 output
P2.2/TA1.2/S23
35
I/O
General-purpose digital I/O/Timer1_A, capture: CCI2A input, compare: Out2 output/LCD
segment output 23 (1)
P2.3/TA1.3/S22
34
I/O
General-purpose digital I/O/Timer1_A, capture: CCI3A input, compare: Out3 output/LCD
segment output 22 (1)
P2.4/TA1.4/S21
33
I/O
General-purpose digital I/O/Timer1_A, capture: CCI4A input, compare: Out4 output/LCD
segment output 21 (1)
P2.5/TA1CLK/S20
32
I/O
General-purpose digital I/O/input of Timer1_A clock/LCD segment output 20 (1)
P2.6/CAOUT/S19
31
I/O
General-purpose digital I/O/Comparator_A output/LCD segment output 19 (1)
P2.7/SIFCLKG/S18
30
I/O
General-purpose digital I/O/Scan IF, signal SIFCLKG from internal clock generator/LCD
segment output 18 (1)
P3.0/S17
29
I/O
General-purpose digital I/O/ LCD segment output 17 (1)
P3.1/S16
28
I/O
General-purpose digital I/O/ LCD segment output 16 (1)
P3.2/S15
27
I/O
General-purpose digital I/O/ LCD segment output 15 (1)
P3.3/S14
26
I/O
General-purpose digital I/O/ LCD segment output 14 (1)
P3.4/S13
25
I/O
General-purpose digital I/O/LCD segment output 13 (1)
P3.5/S12
24
I/O
General-purpose digital I/O/LCD segment output 12 (1)
P3.6/S11
23
I/O
General-purpose digital I/O/LCD segment output 11 (1)
P3.7/S10
22
I/O
General-purpose digital I/O/LCD segment output 10 (1)
P4.0/S9
21
I/O
General-purpose digital I/O/LCD segment output 9 (1)
P4.1/S8
20
I/O
General-purpose digital I/O/LCD segment output 8 (1)
P4.2/S7
19
I/O
General-purpose digital I/O/LCD segment output 7 (1)
P4.3/S6
18
I/O
General-purpose digital I/O/LCD segment output 6 (1)
P4.4/S5
17
I/O
General-purpose digital I/O/LCD segment output 5 (1)
P4.5/S4
16
I/O
General-purpose digital I/O/LCD segment output 4 (1)
P4.6/S3
15
I/O
General-purpose digital I/O/LCD segment output 3 (1)
P4.7/S2
14
I/O
General-purpose digital I/O/LCD segment output 2 (1)
P5.0/S1
13
I/O
General-purpose digital I/O/LCD segment output 1 (1)
P5.1/S0
12
I/O
General-purpose digital I/O/LCD segment output 0 (1)
(1)
LCD function selected automatically when applicable LCD module control bits are set, not with PxSEL bits.
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Table 2. Terminal Functions (continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
COM0
36
O
Common output. COM0-3 are used for LCD backplanes
P5.2/COM1
37
I/O
General-purpose digital I/O/common output. COM0-3 are used for LCD backplanes
P5.3/COM2
38
I/O
General-purpose digital I/O/common output. COM0-3 are used for LCD backplanes
P5.4/COM3
39
I/O
General-purpose digital I/O/common output. COM0-3 are used for LCD backplanes
R03
40
I
P5.5/R13
41
I/O
General-purpose digital I/O/input port of third most positive analog LCD level (V4 or V3)
P5.6/R23
42
I/O
General-purpose digital I/O/input port of second most positive analog LCD level (V2)
P5.7/R33
43
I/O
General-purpose digital I/O/output port of most positive analog LCD level (V1)
P6.0/SIFCH0
59
I/O
General-purpose digital I/O/Scan IF, channel 0 sensor excitation output and signal input
P6.1/SIFCH1
60
I/O
General-purpose digital I/O/Scan IF, channel 1 sensor excitation output and signal input
P6.2/SIFCH2
61
I/O
General-purpose digital I/O/Scan IF, channel 2 sensor excitation output and signal input
P6.3/SIFCH3/
SIFCAOUT
2
I/O
General-purpose digital I/O/Scan IF, channel 3 sensor excitation output and signal input/Scan
IF comparator output
P6.4/SIFCI0
3
I/O
General-purpose digital I/O/Scan IF, channel 0 signal input to comparator
P6.5/SIFCI1
4
I/O
General-purpose digital I/O/Scan IF, channel 1 signal input to comparator
P6.6/SIFCI2/
SIFDACOUT
5
I/O
General-purpose digital I/O/Scan IF, channel 2 signal input to comparator/10-bit DAC output
P6.7/SIFCI3/SVSIN
6
I/O
General-purpose digital I/O/Scan IF, channel 3 signal input to comparator/SVS, analog input
SIFCI
7
I
Scan IF input to Comparator.
SIFCOM
11
O
Common termination for Scan IF sensors.
RST/NMI
58
I
Reset input or nonmaskable interrupt input port.
TCK
57
I
Test clock. TCK is the clock input port for device programming and test.
TDI/TCLK
55
I
Test data input or test clock input. The device protection fuse is connected to TDI/TCLK.
TDO/TDI
54
I/O
TMS
56
I
Test mode select. TMS is used as an input port for device programming and test.
XIN
8
I
Input port for crystal oscillator XT1. Standard or watch crystals can be connected.
XOUT
9
O
Output terminal of crystal oscillator XT1.
6
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Input port of fourth positive (lowest) analog LCD level (V5)
Test data output port. TDO/TDI data output or programming data input terminal.
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SHORT-FORM DESCRIPTION
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions, are
performed as register operations in conjunction with
seven addressing modes for source operand and four
addressing modes for destination operand.
The CPU is integrated with 16 registers that provide
reduced
instruction
execution
time.
The
register-to-register operation execution time is one
cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register, and
constant generator, respectively. The remaining
registers are general-purpose registers.
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled with
all instructions.
Instruction Set
The instruction set consists of the original 51
instructions with three formats and seven address
modes. Each instruction can operate on word and
byte data. Table 3 shows examples of the three types
of instruction formats; Table 4 shows the address
modes.
Program Counter
PC/R0
Stack Pointer
SP/R1
SR/CG1/R2
Status Register
Constant Generator
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
General-Purpose Register
R11
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
Table 3. Instruction Word Formats
INSTRUCTION FORMAT
EXAMPLE
OPERATION
Dual operands, source-destination
ADD
R4,R5
R4 + R5 → R5
Single operands, destination only
CALL
R8
PC→(TOS), R8 →PC
Relative jump, un/conditional
JNE
Jump-on-equal bit = 0
Table 4. Address Mode Descriptions
ADDRESS MODE
(1)
S
(1)
D
(1)
SYNTAX
EXAMPLE
OPERATION
Register
●
●
MOV Rs, Rd
MOV R10, R11
R10 → R11
MOV 2(R5), 6(R6)
M(2+R5)→ M(6+R6)
Indexed
●
●
MOV X(Rn), Y(Rm)
Symbolic (PC relative)
●
●
MOV EDE, TONI
M(EDE) → M(TONI)
Absolute
●
●
MOV & MEM, & TCDAT
M(MEM) → M(TCDAT)
Indirect
●
MOV @Rn, Y(Rm)
MOV @R10, Tab(R6)
M(R10) → M(Tab+R6)
Indirect autoincrement
●
MOV @Rn+, Rm
MOV @R10+, R11
M(R10) → R11
R10 + 2→ R10
Immediate
●
MOV #X, TONI
MOV #45, TONI
#45 → M(TONI)
S = source D = destination
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Operating Modes
The MSP430 has one active mode and five software-selectable low-power modes of operation. An interrupt
event can wake up the device from any of the five low-power modes, service the request, and restore back to the
low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
• Active mode (AM)
– All clocks are active
• Low-power mode 0 (LPM0)
– CPU is disabled
– ACLK and SMCLK remain active, MCLK is available to modules
– FLL+ loop control remains active
• Low-power mode 1 (LPM1)
– CPU is disabled
– ACLK and SMCLK remain active, MCLK is available to modules
– FLL+ loop control is disabled
• Low-power mode 2 (LPM2)
– CPU is disabled
– MCLK, FLL+ loop control, and DCOCLK are disabled
– DCO's dc-generator remains enabled
– ACLK remains active
• Low-power mode 3 (LPM3)
– CPU is disabled
– MCLK, FLL+ loop control, and DCOCLK are disabled
– DCO's dc-generator is disabled
– ACLK remains active
• Low-power mode 4 (LPM4)
– CPU is disabled
– ACLK is disabled
– MCLK, FLL+ loop control, and DCOCLK are disabled
– DCO's dc-generator is disabled
– Crystal oscillator is stopped
8
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Interrupt Vector Addresses
The interrupt vectors and the power-up starting address are located in the address range 0FFFFh to 0FFE0h.
The vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 5. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM INTERRUPT
WORD ADDRESS
PRIORITY
Power-up
External Reset
Watchdog
Flash memory
WDTIFG
KEYV (1)
Reset
0FFFEh
15, highest
NMI
Oscillator Fault
Flash memory access
violation
NMIIFG
OFIFG
ACCVIFG (1) (2)
(Non)maskable
(Non)maskable
(Non)maskable
0FFFCh
14
Timer1_A5
TA1CCR0 CCIFG (3)
Maskable
0FFFAh
13
Timer1_A5
TA1CCR1 CCIFG to
TA1CCR4 CCIFG, TA1CTL
TAIFG (1) (3)
Maskable
0FFF8h
12
Comparator_A
CMPAIFG
Maskable
0FFF6h
11
Watchdog Timer
WDTIFG
Maskable
0FFF4h
10
Maskable
0FFF2h
9
0FFF0h
8
0FFEEh
7
Scan IF
Timer0_A3
TA0CCR0 CCIFG
(3)
Maskable
0FFECh
6
Timer0_A3
TA0CCR1 CCIFG,
TA0CCR2 CCIFG,
TA0CTL TAIFG (1) (2)
Maskable
0FFEAh
5
I/O port P1
(eight flags)
P1IFG.0 to P1IFG.7 (1) (2)
Maskable
0FFE8h
4
0FFE6h
3
0FFE4h
2
Maskable
0FFE2h
1
Maskable
0FFE0h
0, lowest
I/O port P2
(eight flags)
Basic Timer1
(1)
(2)
(3)
SIFIFG0 to SIFIFG6
(1)
P2IFG.0 to P2IFG.7
BTIFG
(1) (2)
Multiple source flags
(Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general interrupt-enable cannot.
Interrupt flags are located in the module.
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Special Function Registers
Most interrupt and module-enable bits are collected in the lowest address space. Special-function register bits
not allocated to a functional purpose are not physically present in the device. This arrangement provides simple
software access.
Interrupt Enable 1 and 2
Address
7
6
00h
7
01h
6
5
4
1
0
ACCVIE
NMIIE
3
2
OFIE
WDTIE
rw-0
rw-0
rw-0
rw-0
5
4
1
0
3
2
BTIE
rw-0
WDTIE:
OFIE:
NMIIE:
ACCVIE:
BTIE:
Watchdog-timer interrupt enable. Inactive if watchdog mode is selected. Active if watchdog timer is configured in interval
timer mode.
Oscillator-fault-interrupt enable
Nonmaskable-interrupt enable
Flash access violation interrupt enable
Basic Timer1 interrupt enable
Interrupt Flag Register 1 and 2
Address
7
6
5
02h
7
03h
6
5
1
0
NMIIFG
4
OFIFG
WDTIFG
rw-0
rw-1
rw-(0)
2
1
0
2
1
0
4
3
2
3
BTIFG
rw-0
WDTIFG:
OFIFG:
NMIIFG:
BTIFG:
Set on watchdog timer overflow (in watchdog mode) or security key violation.
Reset on VCC power up or a reset condition at the RST/NMI pin in reset mode
Flag set on oscillator fault
Set via RST/NMI pin
Basic Timer1 interrupt flag
Module Enable Registers 1 and 2
Address
7
6
5
4
3
04h/05h
Legend
10
rw:
rw-0,1:
rw-(0,1):
Bit can be Read and Written.
Bit can be Read and Written. It is Reset or Set by PUC.
Bit can be Read and Written. It is Reset or Set by POR.
SFR bit is not present in device
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Memory Organization
Table 6. Memory Organization
MSP430FW423
MSP430FW425
MSP430FW427
MSP430FW428
Size
8KB
16KB
32KB
48KB
60KB
Interrupt vector
Flash
0FFFFh - 0FFE0h
0FFFFh - 0FFE0h
0FFFFh - 0FFE0h
0FFFFh - 0FFE0h
0FFFFh - 0FFE0h
Code memory
Flash
0FFFFh - 0E000h
0FFFFh - 0C000h
0FFFFh - 08000h
0FFFFh - 04000h
0FFFFh - 01100h
Size
256 Byte
256 Byte
256 Byte
256 Byte
256 Byte
010FFh - 01000h
010FFh - 01000h
010FFh - 01000h
010FFh - 01000h
010FFh - 01000h
1KB
1KB
1KB
1KB
1KB
0FFFh - 0C00h
0FFFh - 0C00h
0FFFh - 0C00h
0FFFh - 0C00h
0FFFh - 0C00h
256 Byte
512 Byte
1KB
2KB
2KB
02FFh - 0200h
03FFh - 0200h
05FFh - 0200h
09FFh - 0200h
09FFh - 0200h
16-bit
01FFh - 0100h
01FFh - 0100h
01FFh - 0100h
01FFh - 0100h
01FFh - 0100h
8-bit
0FFh - 010h
0FFh - 010h
0FFh - 010h
0FFh - 010h
0FFh - 010h
8-bit
SFR
0Fh - 00h
0Fh - 00h
0Fh - 00h
0Fh - 00h
0Fh - 00h
Memory
Information
memory
Boot memory
RAM
Peripherals
Size
Size
MSP430FW429
Bootstrap Loader (BSL)
The MSP430 bootstrap loader (BSL) enables users to program the flash memory or RAM using a UART serial
interface. Access to the MSP430 memory via the BSL is protected by user-defined password. For complete
description of the features of the BSL and its implementation, see the MSP430 Programming Via the Bootstrap
Loader User's Guide (SLAU319).
BSL FUNCTION
PM PACKAGE PINS
Data Transmit
53 - P1.0
Data Receiver
52 - P1.1
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Flash Memory
The flash memory can be programmed via the JTAG port, the bootstrap loader, or in system by the CPU. The
CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include:
•
•
•
•
Flash memory has n segments of main memory and two segments of information memory (A and B) of
128 bytes each. Each segment in main memory is 512 bytes in size.
Segments 0 to n may be erased in one step, or each segment may be individually erased.
Segments A and B can be erased individually, or as a group with segments 0 to n. Segments A and B are
also called information memory.
New devices may have some bytes programmed in the information memory (needed for test during
manufacturing). The user should perform an erase of the information memory prior to the first use.
8KB
16KB
32KB
0FFFFh
0FFFFh
0FFFFh
0FE00h 0FE00h 0FE00h
0FDFFh 0FDFFh 0FDFFh
Segment 0
With Interrupt V ectors
Segment 1
0FC00h 0FC00h 0FC00h
0FBFFh 0FBFFh 0FBFFh
Segment 2
0FA00h
0F9FFh
0FA00h
0F9FFh
0FA00h
0F9FFh
Main Memory
0E400h 0C400h
0E3FFh 0C3FFh
083FFh
0E200h 0C200h
0E1FFh 0C1FFh
08200h
081FFh
0E000h
010FFh
0C000h
010FFh
08000h
010FFh
01080h
0107Fh
01080h
0107Fh
01080h
0107Fh
08400h
Segment n−1
Segment n
Segment A
Information Memory
Segment B
01000h
12
01000h
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Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, refer to the MSP430x4xx Family User's Guide (SLAU056).
Oscillator and System Clock
The clock system is supported by the FLL+ module that includes support for a 32768-Hz watch crystal oscillator,
an internal digitally-controlled oscillator (DCO), and a high-frequency crystal oscillator. The FLL+ clock module is
designed to meet the requirements of both low system cost and low power consumption. The FLL+ features a
digital frequency locked loop (FLL) hardware that, in conjunction with a digital modulator, stabilizes the DCO
frequency to a programmable multiple of the watch crystal frequency. The internal DCO provides a fast turn-on
clock source and stabilizes in less than 6 µs. The FLL+ module provides the following clock signals:
•
•
•
•
Auxiliary clock (ACLK), sourced from a 32768-Hz watch crystal or a high frequency crystal.
Main clock (MCLK), the system clock used by the CPU.
Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules.
ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, or ACLK/8.
Brownout, Supply Voltage Supervisor
The brownout circuit is implemented to provide the proper internal reset signal to the device during power-on and
power-off. The supply voltage supervisor (SVS) circuitry detects if the supply voltage drops below a user
selectable level and supports both supply voltage supervision (the device is automatically reset) and supply
voltage monitoring (SVM, the device is not automatically reset).
The CPU begins code execution after the brownout circuit releases the device reset. However, VCC may not have
ramped to VCC(min) at that time. The user must insure the default FLL+ settings are not changed until VCC reaches
VCC(min). If desired, the SVS circuit can be used to determine when VCC reaches VCC(min).
Digital I/O
There are six 8-bit I/O ports implemented—ports P1 through P6:
•
•
•
•
All individual I/O bits are independently programmable.
Any combination of input, output, and interrupt conditions is possible.
Edge-selectable interrupt input capability for all the eight bits of ports P1 and P2.
Read/write access to port-control registers is supported by all instructions.
Basic Timer1
The Basic Timer1 has two independent 8-bit timers which can be cascaded to form a 16-bit timer/counter. Both
timers can be read and written by software. The Basic Timer1 can be used to generate periodic interrupts and
clock for the LCD module.
LCD Drive
The LCD driver generates the segment and common signals required to drive an LCD display. The LCD
controller has dedicated data memory to hold segment drive information. Common and segment signals are
generated as defined by the mode. Static, 2-MUX, 3-MUX, and 4-MUX LCDs are supported by this peripheral.
Watchdog Timer (WDT)
The primary function of the watchdog timer module is to perform a controlled system restart after a software
problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not
needed in an application, the module can be configured as an interval timer and can generate interrupts at
selected time intervals.
Comparator_A
The primary function of the comparator_A module is to support precision slope analog-to-digital conversions,
battery-voltage supervision, and monitoring of external analog signals.
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Scan Interface
The scan interface is used to measure linear or rotational motion and supports LC and resistive sensors such as
GMR sensors. The scan IF incorporates a VCC/2 generator, a comparator, and a 10-bit DAC and supports up to
four sensors.
Timer0_A3
Timer0_A3 is a 16-bit timer/counter with three capture/compare registers. Timer_A3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer0_A3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Table 7. Timer0_A3 Signal Connections
INPUT PIN NUMBER
DEVICE INPUT
SIGNAL
MODULE INPUT
NAME
48 - P1.5
TA0CLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
48 - P1.5
TA0CLK
INCLK
53 - P1.0
TA0.0
CCI0A
52 - P1.1
TA0.0
CCI0B
DVSS
GND
51 - P1.2
45 - P2.0
14
DVCC
VCC
TA0.1
CCI1A
CAOUT (internal)
CCI1B
DVSS
GND
DVCC
VCC
TA0.2
CCI2A
ACLK (internal)
CCI2B
DVSS
GND
DVCC
VCC
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MODULE BLOCK
MODULE OUTPUT
SIGNAL
Timer
NA
OUTPUT PIN
NUMBER
53 - P1.0
CCR0
TA0.0
51 - P1.2
CCR1
TA0.1
45 - P2.0
CCR2
TA0.2
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Timer1_A5
Timer1_A5 is a 16-bit timer/counter with five capture/compare registers. Timer1_A5 can support multiple
capture/compares, PWM outputs, and interval timing. Timer1_A5 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Table 8. Timer1_A5 Signal Connections
INPUT PIN NUMBER
DEVICE INPUT
SIGNAL
MODULE INPUT
NAME
32 - P2.5
TA1CLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
32 - P2.5
TA1CLK
INCLK
49 - P1.4
TA1.0
CCI0A
50 - P1.3
TA1.0
CCI0B
DVSS
GND
44 - P2.1
35 - P2.2
34 - P2.3
33 - P2.4
DVCC
VCC
TA1.1
CCI1A
CAOUT (internal)
CCI1B
DVSS
GND
DVCC
VCC
TA1.2
CCI2A
SIFO0sig (internal)
CCI2B
DVSS
GND
DVCC
VCC
TA1.3
CCI3A
SIFO1sig (internal)
CCI3B
DVSS
GND
DVCC
VCC
TA1.4
CCI4A
SIFO2sig (internal)
CCI4B
DVSS
GND
DVCC
VCC
Copyright © 2003–2011, Texas Instruments Incorporated
MODULE BLOCK
MODULE OUTPUT
SIGNAL
Timer
NA
OUTPUT PIN
NUMBER
49 - P1.4
CCR0
TA1.0
44 - P2.1
CCR1
TA1.1
35 - P2.2
CCR2
TA1.2
34 - P2.3
CCR3
TA1.3
33 - P2.4
CCR4
TA1.4
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Peripheral File Map
Table 9. Peripherals With Word Access
Watchdog
Watchdog Timer control
WDTCTL
0120h
Timer1_A5
Timer1_A interrupt vector
TA1IV
011Eh
Timer1_A control
TA1CTL
0180h
Capture/compare control 0
TA1CCTL0
0182h
Capture/compare control 1
TA1CCTL1
0184h
Capture/compare control 2
TA1CCTL2
0186h
Capture/compare control 3
TA1CCTL3
0188h
Capture/compare control 4
TA1CCTL4
018Ah
Reserved
018Ch
Reserved
018Eh
Timer1_A register
TA1R
0190h
Capture/compare register 0
TA1CCR0
0192h
Capture/compare register 1
TA1CCR1
0194h
Capture/compare register 2
TA1CCR2
0196h
Capture/compare register 3
TA1CCR3
0198h
Capture/compare register 4
TA1CCR4
019Ah
Reserved
019Ch
Reserved
Timer0_A3
019Eh
Timer0_A interrupt vector
TA0IV
012Eh
Timer0_A control
TA0CTL0
0160h
Capture/compare control 0
TA0CCTL0
0162h
Capture/compare control 1
TA0CCTL1
0164h
Capture/compare control 2
TA0CCTL2
0166h
Reserved
0168h
Reserved
016Ah
Reserved
016Ch
Reserved
016Eh
Timer0_A register
TA0R
0170h
Capture/compare register 0
TA0CCR0
0172h
Capture/compare register 1
TA0CCR1
0174h
Capture/compare register 2
TA0CCR2
0176h
Reserved
0178h
Reserved
017Ah
Reserved
017Ch
Reserved
Flash
16
017Eh
Flash control 3
FCTL3
012Ch
Flash control 2
FCTL2
012Ah
Flash control 1
FCTL1
0128h
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Table 9. Peripherals With Word Access (continued)
Scan IF
SIF timing state machine 23
SIFTSM23
01FEh
⋮
⋮
⋮
SIF timing state machine 0
SIFTSM0
01D0h
SIF DAC register 7
SIFDACR7
01CEh
⋮
⋮
⋮
SIF DAC register 0
SIFDACR0
01C0h
SIF control register 5
SIFCTL5
01BEh
SIF control register 4
SIFCTL4
01BCh
SIF control register 3
SIFCTL3
01BAh
SIF control register 2
SIFCTL2
01B8h
SIF control register 1
SIFCTL1
01B6h
SIF processing state machine vector
SIFPSMV
01B4h
SIF counter CNT1/2
SIFCNT
01B2h
Reserved
SIFDEBUG
01B0h
Table 10. Peripherals With Byte Access
LCD
LCD memory 20
LCDM20
0A4h
⋮
⋮
⋮
LCD memory 16
LCDM16
0A0h
LCD memory 15
LCDM15
09Fh
⋮
⋮
⋮
LCD memory 1
LCDM1
091h
LCD control and mode
LCDCTL
090h
Comparator_A port disable
CAPD
05Bh
Comparator_A control 2
CACTL2
05Ah
Comparator_A control 1
CACTL1
059h
Brownout, SVS
SVS control register
SVSCTL
056h
FLL+ Clock
FLL+ Control 1
FLL_CTL1
054h
FLL+ Control 0
FLL_CTL0
053h
System clock frequency control
SCFQCTL
052h
System clock frequency integrator
SCFI1
051h
System clock frequency integrator
SCFI0
050h
BT counter 2
BTCNT2
047h
BT counter 1
BTCNT1
046h
BT control
BTCTL
040h
Port P6 selection
P6SEL
037h
Port P6 direction
P6DIR
036h
Port P6 output
P6OUT
035h
Port P6 input
P6IN
034h
Port P5 selection
P5SEL
033h
Port P5 direction
P5DIR
032h
Port P5 output
P5OUT
031h
Port P5 input
P5IN
030h
Port P4 selection
P4SEL
01Fh
Port P4 direction
P4DIR
01Eh
Port P4 output
P4OUT
01Dh
Port P4 input
P4IN
01Ch
Comparator_A
Basic Timer1
Port P6
Port P5
Port P4
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Table 10. Peripherals With Byte Access (continued)
Port P3
Port P2
Port P1
Special Functions
18
Port P3 selection
P3SEL
01Bh
Port P3 direction
P3DIR
01Ah
Port P3 output
P3OUT
019h
Port P3 input
P3IN
018h
Port P2 selection
P2SEL
02Eh
Port P2 interrupt enable
P2IE
02Dh
Port P2 interrupt-edge select
P2IES
02Ch
Port P2 interrupt flag
P2IFG
02Bh
Port P2 direction
P2DIR
02Ah
Port P2 output
P2OUT
029h
Port P2 input
P2IN
028h
Port P1 selection
P1SEL
026h
Port P1 interrupt enable
P1IE
025h
Port P1 interrupt-edge select
P1IES
024h
Port P1 interrupt flag
P1IFG
023h
Port P1 direction
P1DIR
022h
Port P1 output
P1OUT
021h
Port P1 input
P1IN
020h
SFR module enable 2
ME2
005h
SFR module enable 1
ME1
004h
SFR interrupt flag 2
IFG2
003h
SFR interrupt flag 1
IFG1
002h
SFR interrupt enable 2
IE2
001h
SFR interrupt enable 1
IE1
000h
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Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
Voltage applied at VCC to VSS
-0.3 V to 4.1 V
Voltage applied to any pin (2)
-0.3 V to VCC + 0.3 V
Diode current at any device terminal
±2 mA
Storage temperature range, Tstg
(1)
(2)
Unprogrammed device
-55°C to 150°C
Programmed device
-40°C to 85°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS.The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TDI/TCLK pin when blowing the JTAG fuse.
Recommended Operating Conditions
MIN
Supply voltage during program execution (1) (AVCC = DVCC1 = DVCC2 = VCC)
VCC
Supply voltage during program execution, SVS enabled, PORON = 1
(AVCC = DVCC1 = DVCC2 = VCC)
VCC
VCC
Supply voltage during flash memory programming
VSS
Supply voltage (AVSS = DVSS1 = DVSS2 = VSS)
TA
Operating free-air temperature range
f(LFXT1)
LFXT1 crystal frequency (3)
f(System)
Processor frequency (signal
MCLK)
(1)
(2)
MAX
UNIT
3.6
V
2
3.6
V
2.7
3.6
V
0
0
V
85
°C
450
8000
kHz
(1) (2)
(AVCC = DVCC1 = DVCC2 = VCC)
-40
LF selected, XTS_FLL = 0
Watch crystal
32.768
XT1 selected, XTS_FLL = 1
Ceramic resonator
XT1 selected, XTS_FLL = 1
Crystal
1000
8000
VCC = 1.8 V
DC
4.15
VCC = 3.6 V
DC
8
MHz
It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
The minimum operating supply voltage is defined according to the trip point where POR is going active by decreasing the supply
voltage. POR is going inactive when the supply voltage is raised above the minimum supply voltage plus the hysteresis of the SVS
circuitry.
In LF mode, the LFXT1 oscillator requires a watch crystal. In XT1 mode, LFXT1 accepts a ceramic resonator or a crystal.
f (System) − Maximum Processor Frequency − MHz
(3)
(1)
NOM
1.8
Supply V oltage Range
During Programming of
the Flash Memory
f (MHz)
8 MHz
Supply V oltage Range During
Program Execution
4.15 MHz
1.8 V
2.7 V
3V
3.6 V
VCC − Supply Voltage − V
Figure 1. Maximum Frequency vs Supply Voltage
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Electrical Characteristics
Supply Current Into AVCC + DVCC Excluding External Current ('FW423, 'FW425, and 'FW427
devices) (1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TA
TYP
MAX
2.2 V
200
250
3V
300
350
2.2 V
57
70
3V
92
100
2.2 V
11
14
3V
17
22
-40°C
0.95
1.4
-10°C
0.8
1.3
I(AM)
Active mode (AM)
f(MCLK) = f(SMCLK) = f(DCO) = 1 MHz,
f(ACLK) = 32768 Hz, XTS_FLL = 0
-40°C to 85°C
I(LPM0)
Low-power mode 0 (LPM0) (2)
f(MCLK) = f(SMCLK) = f(DCO) = 1 MHz,
f(ACLK) = 32768 Hz, XTS_FLL = 0,
FN_8 = FN_4 = FN_3 = FN_2 = 0
-40°C to 85°C
I(LPM2)
Low-power mode 2 (LPM2) (2)
-40°C to 85°C
25°C
I(LPM3)
Low-power mode 3 (LPM3) (3) (2)
VCC
2.2 V
0.7
1.2
60°C
0.95
1.4
85°C
1.6
2.3
-40°C
1.1
1.7
-10°C
1
1.6
0.9
1.5
60°C
1.1
1.7
85°C
2
2.6
-40°C
0.1
0.5
0.1
0.5
0.8
2.5
25°C
I(LPM4)
Low-power mode (LPM4) (2)
25°C
85°C
(1)
(2)
(3)
20
MIN
3V
2.2 V/3 V
UNIT
µA
µA
µA
µA
µA
All inputs are tied to 0 V or VCC. Outputs do not source or sink any current. The current consumption is measured with active Basic
Timer1 and LCD (ACLK selected). The current consumption of the Comparator_A and the SVS module are specified in the respective
sections.
Current consumption for brownout included.
The LPM3 currents are characterized with a KDS Daishinku DT−38 (6 pF) crystal.
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Supply Current Into AVCC + DVCC Excluding External Current ('FW428 and 'FW429 devices) (1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TA
TYP
MAX
2.2 V
210
290
3V
320
390
2.2 V
60
75
3V
95
110
2.2 V
11
14
3V
17
22
-40°C
0.95
1.4
-10°C
0.8
1.3
0.7
1.5
60°C
1.0
1.9
85°C
1.7
2.9
-40°C
1.1
1.7
-10°C
1.0
1.6
I(AM)
Active mode (AM)
f(MCLK) = f(SMCLK) = f(DCO) = 1 MHz,
f(ACLK) = 32768 Hz, XTS_FLL = 0
-40°C to 85°C
I(LPM0)
Low-power mode 0 (LPM0) (2)
f(MCLK) = f(SMCLK) = f(DCO) = 1 MHz,
f(ACLK) = 32768 Hz, XTS_FLL = 0,
FN_8 = FN_4 = FN_3 = FN_2 = 0
-40°C to 85°C
I(LPM2)
Low-power mode 2 (LPM2) (2)
-40°C to 85°C
25°C
I(LPM3)
Low-power mode 3 (LPM3) (3) (2)
25°C
VCC
2.2 V
3V
0.9
1.85
60°C
1.3
2.6
85°C
2.1
3.9
-40°C
I(LPM4)
Low-power mode (LPM4) (2)
25°C
85°C
(1)
(2)
(3)
MIN
2.2 V/3 V
0.1
0.5
0.15
0.5
1.3
2.5
UNIT
µA
µA
µA
µA
µA
µA
All inputs are tied to 0 V or VCC. Outputs do not source or sink any current. The current consumption is measured with active Basic
Timer1 and LCD (ACLK selected). The current consumption of the Comparator_A and the SVS module are specified in the respective
sections.
Current consumption for brownout included.
The LPM3 currents are characterized with a KDS Daishinku DT−38 (6 pF) crystal.
Current consumption of active mode versus system frequency
I(AM) = I(AM) [1 MHz] × f(System) [MHz]
Current consumption of active mode versus supply voltage
I(AM) = I(AM) [3 V] + 140 µA/V × (VCC - 3 V)
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Schmitt-Trigger Inputs − Ports (P1, P2, P3, P4, P5, P6), RST/NMI, JTAG (TCK, TMS, TDI/TCLK)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VIT-
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ - VIT- )
MIN
TYP
MAX
VCC = 2.2 V
1.1
1.5
VCC = 3 V
1.5
1.9
VCC = 2.2 V
0.4
0.9
VCC = 3 V
0.9
1.3
VCC = 2.2 V
0.3
1.1
0.45
1
VCC = 3 V
UNIT
V
V
V
Inputs Px.x, TAx.x
PARAMETER
t(int)
TEST CONDITIONS
MIN
2.2 V/3 V
1.5
2.2 V
62
3V
50
2.2 V
62
3V
50
Port P1, P2: P1.x to P2.x, external trigger
signal for the interrupt flag (1)
External interrupt timing
t(cap)
Timer_A capture timing
TAx x
f(TAext)
Timer_A clock frequency
externally applied to pin
TAxCLK, INCLK t(H) = t(L)
f(TAint)
Timer_A clock frequency
SMCLK or ACLK signal selected
(1)
VCC
TYP
MAX
UNIT
cycle
ns
ns
2.2 V
8
3V
10
2.2 V
8
3V
10
MHz
MHz
The external signal sets the interrupt flag every time the minimum t(int) parameters are met. It may be set even with trigger signals
shorter than t(int). Both the cycle and timing specifications must be met to ensure the flag is set. t(int) is measured in MCLK cycles.
Leakage Current − Ports (P1, P2, P3, P4, P5, P6) (1)
PARAMETER
Ilkg(Px.x)
(1)
(2)
22
Leakage current
TEST CONDITIONS
Port P1.x
Port x: V(Px.x) (2)
MIN
VCC = 2.2 V/3 V
TYP
MAX
UNIT
±50
nA
The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
The port pin must be selected as input.
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Outputs − Ports (P1, P2, P3, P4, P5, P6)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
High-level output voltage
VOL
(1)
(2)
Low-level output voltage
TEST CONDITIONS
MIN
TYP
MAX
IOH(max) = -1.5 mA,
VCC = 2.2 V (1)
IOH(max) = -6 mA,
VCC = 2.2 V (2)
IOH(max) = -1.5 mA,
VCC = 3 V (1)
IOH(max) = -6 mA,
VCC = 3 V (2)
VCC - 0.6
VCC
IOL(max) = 1.5 mA,
VCC = 2.2 V (1)
VSS
VSS + 0.25
IOL(max) = 6 mA,
VCC = 2.2 V (2)
VSS
VSS + 0.6
IOL(max) = 1.5 mA,
VCC = 3 V (1)
VSS
VSS + 0.25
IOL(max) = 6 mA,
VCC = 3 V (2)
VSS
VSS + 0.6
VCC - 0.25
VCC
VCC - 0.6
VCC
VCC - 0.25
VCC
UNIT
V
V
The maximum total current, IOH(max) and IOL(max), for all outputs combined, should not exceed ±12 mA to satisfy the maximum specified
voltage drop.
The maximum total current, IOH(max) and IOL(max), for all outputs combined, should not exceed ±48 mA to satisfy the maximum specified
voltage drop.
Output Frequency
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
f(Px.y)
TEST CONDITIONS
(1 ≤ × ≤ 6, 0 ≤ y ≤ 7)
CL = 20 F,
IL = ±1.5 mA
P1.1/TA0.0/MCLK,
P1.5/TA0CLK/ACLK
CL = 20 pF
f(ACLK)
f(MCLK)
f(SMCLK)
TYP
Duty cycle of output
frequency
P1.1/TA0.0/MCLK,
CL = 20 pF
VCC = 2.2 V/3 V
Copyright © 2003–2011, Texas Instruments Incorporated
MAX
DC
10
VCC = 3 V
DC
12
VCC = 2.2 V
8
VCC = 3 V
P1.5/TA0CLK/ACLK ,
CL = 20 pF
VCC = 2.2 V/3 V
t(Xdc)
MIN
VCC = 2.2 V
UNIT
MHz
MHz
12
fACLK = fLFXT1 = fXT1
40%
fACLK = fLFXT1 = fLF
30%
fACLK = fLFXT1/n
60%
70%
50%
fMCLK = fLFXT1/n
50% 15 ns
50%
50%+
15 ns
fMCLK = fDCOCLK
50% 15 ns
50%
50%+
15 ns
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TYPICAL LOW -LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOL TAGE
TYPICAL LOW -LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOL TAGE
40
TA = 25°C
VCC = 2.2 V
P2.4
IOL − Typical Low-Level Output Current − mA
IOL − Typical Low-Level Output Current − mA
25
20
TA = 85°C
15
10
5
0
0.0
nd
0.5
1.0
1.5
2.0
VCC = 3 V
P2.4
35
TA = 85°C
30
25
20
15
10
5
0
0.0
2.5
TA = 25°C
VOL − Low-Level Output Voltage − V
0.5
1.0
Figure 2.
IOH − Typical High-Level Output Current − mA
IOH − Typical High-Level Output Current − mA
3.0
3.5
0
VCC = 2.2 V
P2.4
−5
−10
−15
TA = 85°C
TA = 25°C
0.5
1.0
1.5
2.0
VOH − High-Level Output Voltage − V
Figure 4.
24
2.5
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
−25
0.0
2.0
Figure 3.
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
−20
1.5
VOL − Low-Level Output Voltage − V
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2.5
−5
VCC = 3 V
P2.4
−10
−15
−20
−25
−30
−35
TA = 85°C
−40
−45
TA = 25°C
−50
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VOH − High-Level Output Voltage − V
Figure 5.
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Wake-UP LPM3
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
f = 1 MHz
td(LPM3)
Delay time
UNIT
6
f = 2 MHz
VCC = 2.2 V/3 V
6
f = 3 MHz
µs
6
RAM
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
(1)
TEST CONDITIONS
MIN
CPU halted (1)
VRAMh
TYP
MAX
1.6
UNIT
V
This parameter defines the minimum supply voltage when the data in program memory RAM remain unchanged. No program execution
should take place during this supply voltage condition.
LCD
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
V(33)
TEST CONDITIONS
Voltage at P5.7/R33
V(23)
Voltage at P5.5/R13
V(33) - V(03)
Voltage at R33 to R03
I(R03)
R03 = VSS
Input leakage
I(R23)
P5.5/R13 = VCC/3
P5.6/R23 = 2 × VCC/3
V(Sxx1)
V(Sxx2)
Segment line voltage
I(Sxx) = -3 µA,
2.5
V(Sxx3)
Copyright © 2003–2011, Texas Instruments Incorporated
VCC = 3 V
VCC + 0.2
UNIT
V
[V(33)- V(03)] × 1/3
+ V(03)
No load at all
segment and
common lines,
VCC = 3 V
V(Sxx0)
MAX
[V(33) - V(03)] ×
2/3 + V(03)
VCC = 3 V
V(13)
TYP
2.5
Voltage at P5.6/R23
Analog voltage
I(R13)
MIN
VCC + 0.2
±20
±20
nA
±20
V(03)
V(03) - 0.1
V(13)
V(13) - 0.1
V(23)
V(23) - 0.1
V(33)
V(33) + 0.1
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Comparator_A (1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
I(CC)
CAON = 1, CARSEL = 0, CAREF = 0
I(Refladder/RefDiode)
CAON = 1, CARSEL = 0, CAREF = 1/2/3,
No load at P1.6/CA0 and P1.7/CA1
TYP
MAX
2.2 V
MIN
25
40
3V
45
60
2.2 V
30
50
3V
45
71
V(Ref025)
Voltage @ 0.25 VCC node
VCC
PCA0 = 1, CARSEL = 1, CAREF = 1,
No load at P1.6/CA0 and P1.7/CA1
2.2 V/3 V
0.23
0.24
0.25
V(Ref050)
Voltage @ 0.5 VCC node
VCC
PCA0 = 1, CARSEL = 1, CAREF = 2,
No load at P1.6/CA0 and P1.7/CA1
2.2 V/3 V
0.47
0.48
0.5
2.2 V
390
480
540
3V
400
490
550
V(RefVT)
See Figure 6, Figure 7
PCA0 = 1, CARSEL = 1, CAREF = 3,
No load at P1 6/CA0 and P1 7/CA1,
TA = 85°C
VIC
Common-mode input
voltage range
CAON = 1
Vp– VS
Offset voltage
Vhys
Input hysteresis
(1)
(2)
µA
mV
0
2.2 V/3 V
-30
30
mV
2.2 V/3 V
0
0.7
1.4
mV
TA = 25°C
Overdrive 10 mV, without filter: CAF = 0
2.2 V
130
210
300
3V
80
150
240
TA = 25°C
Overdrive 10 mV, with filter: CAF = 1
2.2 V
1.4
1.9
3.4
3V
0.9
1.5
2.6
TA = 25°C
Overdrive 10 mV, without filter: CAF = 0
2.2 V
130
210
300
3V
80
150
240
TA = 25°C
Overdrive 10 mV, with filter: CAF = 1
2.2 V
1.4
1.9
3.4
3V
0.9
1.5
2.6
CAON = 1
t(response LH)
t(response HL)
µA
2.2 V/3 V
(2)
VCC - 1
UNIT
V
ns
µs
ns
µs
The leakage current for the Comparator_A terminals is identical to Ilkg(Px.x) specification.
The input offset voltage can be cancelled by using the CAEX bit to invert the Comparator_A inputs on successive measurements. The
two successive measurements are then summed together.
REFERENCE VOLTAGE
vs
FREE-AIR TEMPERATURE
650
V(RefVT) − Reference Voltage − mV
VCC = 3 V
600
Typical
550
500
450
400
−45
−25
−5
15
35
55
75
95
TA − Free-Air Temperature − °C
Figure 6.
26
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REFERENCE VOLTAGE
vs
FREE-AIR TEMPERATURE
650
V(RefVT) − Reference Voltage − mV
VCC = 2.2 V
600
Typical
550
500
450
400
−45
−25
−5
15
35
55
75
95
TA − Free-Air Temperature − °C
Figure 7.
0V
0
VCC
CAF
1
CAON
To Internal
Modules
Low Pass Filter
V+
V−
+
_
0
0
1
1
CAOUT
Set CAIFG
Flag
τ ≈ 2 µs
Figure 8. Block Diagram of Comparator_A Module
VCAOUT
Overdrive
V−
400 mV
V+
t (response)
Figure 9. Overdrive Definition
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POR/Brownout Reset (BOR) (1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
td(BOR)
V(B_IT-)
Brownout
(2)
dVCC/dt ≤ 3 V/s (see Figure 10 through Figure 12)
Vhys(B_IT-)
dVCC/dt ≤ 3 V/s (see Figure 10)
t(reset)
Pulse length needed at RST/NMI pin to accepted
reset internally, VCC = 2.2 V/3 V
(1)
(2)
UNIT
2000
µs
0.7 ×
V(B_IT- )
dVCC/dt ≤ 3 V/s (see Figure 10)
VCC(start)
MAX
70
130
V
1.71
V
210
mV
2
µs
The current consumption of the brownout module is already included in the ICC current consumption data. The voltage level V(B_IT-) +
Vhys(B_IT-) is ≤ 1.8 V.
During power up, the CPU begins code execution following a period of td(BOR) after VCC = V(B_IT-)+ Vhys(B_IT-). The default FLL+ settings
must not be changed until VCC ≥ VCC(min), where VCC(min) is the minimum supply voltage for the desired operating frequency. See the
MSP430x4xx Family User's Guide for more information on the brownout/SVS circuit.
VCC
Vhys(B_IT−)
V(B_IT−)
VCC(start)
1
0
t d(BOR)
Figure 10. POR/Brownout Reset (BOR) vs Supply Voltage
VCC
2
Vcc = 3 V
Typical Conditions
VCC (drop) − V
t pw
3V
1.5
1
VCC(drop)
0.5
0
0.001
1
t pw − Pulse Width − µs
1000
1 ns
1 ns
t pw − Pulse Width − µs
Figure 11. VCC(drop) Level with a Square Voltage Drop to Generate a POR/Brownout Signal
28
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VCC
VCC (drop) − V
2
1.5
t pw
3V
V cc = 3 V
Typical Conditions
1
VCC(drop)
0.5
t f = tr
0
0.001
1
1000
tf
tr
t pw − Pulse Width − µs
t pw − Pulse Width − µs
Figure 12. VCC(drop) Level With a Triangle Voltage Drop to Generate a POR/Brownout Signal
SVS (Supply Voltage Supervisor/Monitor) (1) (2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
t(SVSR)
TEST CONDITIONS
MIN
dVCC/dt > 30 V/ms (see Figure 13)
TYP
5
150
dVCC/dt ≤ 30 V/ms
2000
SVSon, switch from VLD = 0 to VLD ≉ 0, VCC = 3 V
td(SVSon)
20
(3)
tsettle
VLD ≉ 0
V(SVSstart)
VLD ≉ 0, VCC/dt ≤ 3 V/s (see Figure 13)
VLD = 1
VCC/dt ≤ 3 V/s (see Figure 13)
Vhys(SVS_IT-)
VCC/dt ≤ 3 V/s (see Figure 13), external voltage
applied on A7
V(SVS_IT-)
VCC/dt ≤ 3V/s (see Figure 13)
VCC/dt ≤ 3 V/s (see Figure 13), external voltage
applied on A7
ICC(SVS)
(1)
(2)
(3)
(4)
(5)
(5)
VLD ≉ 0, VCC = 2.2 V/3 V
MAX
VLD = 2 .. 14
VLD = 15
70
UNIT
µs
150
µs
12
µs
1.55
1.7
V
120
155
mV
V(SVS_IT-)
x 0.004
V(SVS_IT-)
× 0.08
4.4
10.4
VLD = 1
1.8
1.9
2.05
VLD = 2
1.94
2.1
2.25
VLD = 3
2.05
2.2
2.37
VLD = 4
2.14
2.3
2.48
VLD = 5
2.24
2.4
2.6
VLD = 6
2.33
2.5
2.71
VLD = 7
2.46
2.65
2.86
VLD = 8
2.58
2.8
3
VLD = 9
2.69
2.9
3.13
VLD = 10
2.83
3.05
3.29
VLD = 11
2.94
3.2
3.42
VLD = 12
3.11
3.35
3.61 (4)
VLD = 13
3.24
3.5
3.76 (4)
VLD = 14
3.43
(4)
3.99 (4)
VLD = 15
1.1
1.2
1.3
10
15
3.7
mV
V
µA
The current consumption of the SVS module is not included in the ICC current consumption data.
The SVS is not active at power up.
tsettle is the settling time that the comparator o/p needs to have a stable level after VLD is switched VLD ≉ 0 to a different VLD value
somewhere between 2 and 15. The overdrive is assumed to be > 50 mV.
The recommended operating voltage range is limited to 3.6 V.
The current consumption of the SVS module is not included in the ICC current consumption data.
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Software Sets VLD>0: SVS is Active
VCC
Vhys(SVS_IT−)
V
(SVS_IT−)
V(SVSstart)
Vhys(B_IT−)
V(B_IT−)
VCC(start)
Brownout
Region
Brownout
Brownout
Region
1
0
SVS out
t d(BOR)
t d(BOR)
SVS Circuit is Active From VLD > to V CC < V (B_IT−)
1
0
t d(SVSon)
Set POR
1
t d(SVSR)
Undefined
0
Figure 13. SVS Reset (SVSR) vs Supply Voltage
VCC
t pw
3V
2
Rectangular Drop
VCC(drop) − V
1.5
VCC(drop)
Triangular Drop
1
1 ns
0.5
1 ns
VCC
t pw
3V
0
1
10
100
1000
t pw − Pulse Width − µs
VCC(drop)
t f = tr
tf
tr
t − Pulse Width − µs
Figure 14. VCC(drop) with a Square Voltage Drop and a Triangle Voltage Drop to Generate an SVS Signal
30
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DCO
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
f(DCOCLK)
N(DCO) = 01Eh, FN_8 = FN_4 = FN_3 = FN_2 = 0, D = 2;
DCOPLUS = 0, fCrystal = 32.768 kHz
f(DCO = 2)
FN_8 = FN_4 = FN_3 = FN_2 = 0; DCOPLUS = 1
f(DCO = 27)
FN_8 = FN_4 = FN_3 = FN_2 = 0; DCOPLUS = 1
f(DCO = 2)
FN_8 = FN_4 = FN_3 = FN_2 = 1; DCOPLUS = 1
f(DCO = 27)
FN_8 = FN_4 = FN_3 = FN_2 = 1; DCOPLUS = 1
f(DCO = 2)
FN_8 = FN_4 = 0, FN_3 = 1, FN_2 = x; ; DCOPLUS = 1
f(DCO = 27)
FN_8 = FN_4 = 0, FN_3 = 1, FN_2 = x; ; DCOPLUS = 1
f(DCO = 2)
FN_8 = 0, FN_4 = 1, FN_3 = FN_2 = x; ; DCOPLUS = 1
f(DCO = 27)
FN_8 = 0, FN_4 = 1, FN_3 = FN_2 = x; ; DCOPLUS = 1
f(DCO = 2)
FN_8 = 1, FN_4 = 1 = FN_3 = FN_2 = x; ; DCOPLUS = 1
f(DCO = 27)
FN_8 = 1, FN_4 = 1 = FN_3 = FN_2 = x; ; DCOPLUS = 1
Sn
Step size between adjacent DCO taps:
Sn = fDCO(Tap n+1) /fDCO(Tap n) (see Figure 16 for taps 21 to 27)
Dt
Temperature drift, N(DCO) = 01Eh, FN_8 = FN_4 = FN_3 =
FN_2 = 0
D = 2; DCOPLUS = 0
DV
Drift with VCC variation, N(DCO) = 01Eh, FN_8 = FN_4 = FN_3
= FN_2 = 0
D = 2; DCOPLUS = 0
f
MIN
TYP
2.2 V/3 V
MAX
UNIT
1
MHz
2.2 V
0.3
0.65
1.25
3V
0.3
0.7
1.3
2.2 V
2.5
5.6
10.5
3V
2.7
6.1
11.3
2.2 V
0.7
1.3
2.3
3V
0.8
1.5
2.5
2.2 V
5.7
10.8
18
3V
6.5
12.1
20
2.2 V
1.2
2
3
3V
1.3
2.2
3.5
2.2 V
9
15.5
25
3V
10.3
17.9
28.5
2.2 V
1.8
2.8
4.2
3V
2.1
3.4
5.2
2.2 V
13.5
21.5
33
3V
16
26.6
41
2.2 V
2.8
4.2
6.2
3V
4.2
6.3
9.2
2.2 V
21
32
46
3V
30
46
70
1 < TAP ≤ 20
1.06
TAP = 27
1.07
2.2 V
-0.2
-0.3
-0.4
3V
-0.2
-0.3
-0.4
0
5
15
2.2 V/3 V
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
1.11
1.17
%/°C
%/V
f
(DCO)
f (DCO20 C)
(DCO)
f (DCO3V)
1.0
1.0
0
1.8
2.4
3.0
3.6
VCC − V
−40
−20
0
20
40
60
85
TA − °C
Figure 15. DCO Frequency vs Supply Voltage VCC and vs Ambient Temperature
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1.17
Max
1.11
1.07
1.06
Min
1
20
27
DCO Tap
Figure 16. DCO Tap Step Size
f (DCO)
Legend
Tolerance at T ap 27
DCO Frequency
Adjusted by Bits
29 to 2 5 in SCFI1 {N {DCO} }
Tolerance at T ap 2
Overlapping DCO Ranges:
Uninterrupted Frequency Range
FN_2=0
FN_3=0
FN_4=0
FN_8=0
FN_2=1
FN_3=0
FN_4=0
FN_8=0
FN_2=x
FN_3=1
FN_4=0
FN_8=0
FN_2=x
FN_3=x
FN_4=1
FN_8=0
FN_2=x
FN_3=x
FN_4=x
FN_8=1
Figure 17. Five Overlapping DCO Ranges Controlled by FN_x Bits
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Crystal Oscillator, LFXT1 Oscillator (1)
(2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
OSCCAPx = 0h
CXIN
CXOUT
Integrated input capacitance (3)
Integrated output capacitance (3)
OSCCAPx = 1h
OSCCAPx = 2h
10
2.2 V/3 V
18
OSCCAPx = 0h
0
OSCCAPx = 2h
VIH
(1)
(2)
(3)
(4)
Input levels at XIN (4)
UNIT
pF
14
OSCCAPx = 3h
OSCCAPx = 1h
MAX
0
10
2.2 V/3 V
pF
14
OSCCAPx = 3h
VIL
TYP
18
2.2 V/3 V
VSS
0.2 × VCC
0.8 × VCC
VCC
V
The parasitic capacitance from the package and board may be estimated to be 2 pF. The effective load capacitor for the crystal is (CXIN
× CXOUT) / (CXIN+ CXOUT). This is independent of XTS_FLL.
To improve EMI on the low-power LFXT1 oscillator, particularly in the LF mode (32 kHz), the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
External capacitance is recommended for precision real-time clock applications; OSCCAPx = 0h.
Applies only when using an external logic-level clock source. XTS_FLL must be set. Not applicable when using a crystal or resonator.
Copyright © 2003–2011, Texas Instruments Incorporated
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33
MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
www.ti.com
Scan IF, Port Drive, Port Timing
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
VOL(SIFCHx)
Voltage drop due to excitation
transistor's on-resistance (see
Figure 18)
I(SIFCHx) = 2 mA,
SIFTEN = 1
3V
0.3
V
VOH(SIFCHx)
Voltage drop due to damping
transistor’s on-resistance (1) (see
Figure 18)
I(SIFCHx) = -200 µA,
SIFTEN = 1
3V
0.1
V
0
0.1
V
3V
-50
50
nA
2.2 V/3 V
-20
20
ns
VOL(SIFCOM)
I(SIFCOM) = 3 mA,
SIFSH = 1
ISIFCHx(tri-state)
V(SIFCHx) = 0 V to AVCC, port
function disabled,
SIFSH = 1
ΔtdSIFCH :
twEx(tsm) - twSIFCH
(1)
Change of pulse width of internal
signal SIFEX(tsm) to pulse width
at pin SIFCHx (see Figure 18)
2.2 V/3 V
I(SIFCHx) = 3 mA,
tEx(SIFCHx) = 500 ns ±20%
SIFCOM = 1.5V , supplied externally (see Figure 19)
tEx(SIFCHx)
SIFEX(tsm)
P6.x/SIFCH.x
tSIFCH(x)
Figure 18. P6.x/SIFCHx Timing, SIFCHx Function Selected
SIFCOM
VOH(SIFCHx)
Damping
Transistor
I(SIFCHx)
P6.x/SIFCH.x
VOL(SIFCHx)
Excitation
Transistor
Figure 19. Voltage Drop Due to On-Resistance
34
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MSP430FW42x
www.ti.com
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
Scan IF, Sample Capacitor/Ri Timing (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
CSHC(SIFCHx)
Sample capacitance at SIFCHx
pin
SIFEx(tsm) = 1, SIFSH = 1
Ri(SIFCHx)
Serial input resistance at the
SIFCHx pin
SIFEx(tsm) = 1, SIFSH = 1
tHold
Maximum hold time (2)
ΔVsample < 3 mV
(1)
(2)
VCC
MIN
TYP
MAX
2.2 V/3 V
5
7
pF
2.2 V/3 V
1.5
3
kΩ
62
UNIT
µs
The minimum sampling time (7.6 x tau for 1/2 LSB accuracy) with maximum CSHC(SIFCHx) and Ri(SIFCHx) and Ri(source) is tsample(min) ~ 7.6
× CSHC(SIFCHx) × (Ri(SIFCHx) + Ri(source)) with Ri(source) estimated at 3 kΩ, tsample(min) = 319 ns.
The sampled voltage at the sample capacitance varies less than 3 mV (ΔVsample) during the hold time tHold. If the voltage is sampled
after tHold, the sampled voltage may be any other value.
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35
MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
www.ti.com
Scan IF, VCC/2 Generator
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
AVCC
Analog supply
voltage
AVCC = DVCC (connected together),
AVSS = DVSS (connected together)
AICC
Scan IF VCC/2
generator operating
supply current into
AVCC terminal
CL at SIFCOM pin = 470 nF ±20%,
frefresh(SIFCOM) = 32768 Hz
frefresh(SIFCOM)
VCC/2 refresh
frequency
Source clock = ACLK
V(SIFCOM)
Output voltage at pin CL at SIFCOM pin = 470 nF ±20%,
SIFCOM
ILoad = 1 µA
Isource(SIFCOM)
SIFCOM source
current (1) (see
Figure 20)
Isink(SIFCOM)
SIFCOM sink current
trecovery(SIFCOM)
I
=I
= 0 mA,
Time to recover from Load1 LOAD3
ILoad2 = 3 mA, tload(on) = 500 ns,
voltage drop on load
CL at SIFCOM pin = 470 nF ±20%
2.2 V/3 V
ton(SIFCOM)
Time to reach 98%
after VCC/2 is
switched on
CL at SIFCOM pin = 470 nF ±20%,
frefresh(SIFCOM) = 32768 Hz
2.2 V/3 V
1.7
SIFEN = 1, SIFVCC2 = 1, SIFSH = 0,
AVCC = AVCC - 100 mV,
frefresh(SIFCOM) = 32768 Hz
2.2 V/3 V
80
tVccSettle(SIFCOM)
Settling time to
±VCC/512 (2 LSB)
after AVCC voltage
change
AVCC = AVCC + 100 mV,
frefresh(SIFCOM) = 32768 Hz
2.2 V/3 V
(1)
2.2
MAX
3.6
2.2 V
250
350
3V
370
450
2.2 V/3 V
30
32.768
AVCC/2 0.05
AVCC/2
2.2 V
-500
3V
-900
2.2 V
150
3V
180
UNIT
V
nA
kHz
AVCC/2 +
0.05
V
µA
nA
30
µs
6
ms
ms
3
The sink and source currents are a function of the voltage at the pin SIFCOM. The maximum currents are reached if SIFCOM is shorted
to GND or VCC. Due to the topology of the output section (see Figure 20) the VCC/2 generator can source relatively large currents but
can sink only small currents.
VCC
VCC/2
ISource(SIFCOM)
SIFCOM
ISink(SIFCOM)
Figure 20. P6.x/SIFCHx Timing, SIFCHx Function Selected
36
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SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
Scan IF, 10-bit DAC
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
AVCC
Analog supply voltage
AVCC = DVCC (connected together)
AVSS = DVSS (connected together)
AICC
Scan IF 10-bit DAC operating
supply current into AVCC terminal
CL at SIFCOM pin = 470 nF ±20%,
frefresh(SIFCOM) = 32768 Hz
VCC
MIN
2.2
MAX
3.6
2.2 V
23
45
3V
33
60
Resolution
10
INL
Integral nonlinearity
RL = 1000 MΩ,
CL = 20 pF
2.2 V/3 V
DNL
Differential nonlinearity
RL = 1000 MΩ,
CL = 20 pF
EZS
EG
RO
Output resistance
ton(SIFDAC)
On time after AVCC of SIFDAC is
switched on
tSettle(SIFDAC)
TYP
V
µA
bit
±5
LSB
2.2 V/3 V
±1
LSB
Zero scale error
2.2 V/3 V
±10
mV
Gain error
2.2 V/3 V
0.6
%
50
kΩ
µs
Settling time
±2
UNIT
25
V+SIFCA - VSIFDAC = ±6 mV
2.2 V/3 V
2
SIFDAC code = 1C0h → 240h,
VSIFDAC(240h) - V+SIFCA = +6 mV
2.2 V/3 V
2
SIFDAC code = 240h → 1C0h,
VSIFDAC(1C0h) - V+SIFCA = -6 mV
2.2 V/3 V
2
µs
Scan IF, Comparator
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
AVCC = DVCC (connected together),
AVSS = DVSS (connected together)
MIN
TYP
UNIT
AVCC
Analog supply voltage
AICC
Scan IF comparator operating
supply current into AVCC terminal
VIC
Common mode input voltage
range (1)
2.2 V/3 V
VOffset
Input offset voltage
2.2 V/3 V
dVOffset/dT
Temperature coefficient of VOffset
2.2 V/3 V
10
µV/°C
dVOffset/dVCC
VOffset supply voltage (VCC)
sensitivity
2.2 V/3 V
0.3
mV/V
Vhys
Input voltage hysteresis
V+terminal = V-terminal = 0.5 x VCC
ton(SIFCA)
On time after SIFCA is switched
on
V+SIFCA - VSIFDAC = +6 mV,
V+SIFCA = 0.5 x AVCC
2.2 V/3 V
2
µs
tSettle(SIFCA)
Settle time
V+SIFCA - VSIFDAC = -12 mV → 6 mV,
V+SIFCA = 0.5 x AVCC
2.2 V/3 V
2.0
µs
(1)
2.2
MAX
3.6
V
µA
2.2 V
25
35
3V
35
50
AVCC 0.6
0.9
±30
2.2 V
0
18
3V
0
18
V
mV
mV
The comparator output is reliable when at least one of the input signals is within the common mode input voltage range.
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MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
www.ti.com
Scan IF, SIFCLK Oscillator
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
AVCC = DVCC (connected together),
AVSS = DVSS (connected together)
MIN
TYP
2.2
MAX
3.6
UNIT
AVCC
Analog supply voltage
AICC
Scan IF oscillator operating
supply current into AVCC
terminal
fSIFCLKG = 0
Scan IF oscillator at minimum
setting
TA = 25ºC,
SIFCLKFQ = 0000
SIFNOM = 0
1.8
3.2
SIFNOM = 1
0.45
0.8
fSIFCLKG = 8
Scan IF oscillator at nominal
setting
TA = 25ºC,
SIFCLKFQ = 0000
SIFNOM = 0
4
SIFNOM = 1
1
fSIFCLKG = 15
Scan IF oscillator at maximum
setting
TA = 25ºC,
SIFCLKFQ = 0000
SIFNOM = 0
4.48
6.8
SIFNOM = 1
1.12
1.7
ton(SIFCLKG)
Settling time to full operation
after VCC is switched on
2.2 V/3 V
150
500
S(SIFCLK)
Frequency change per ±1
SIFCLKFQ(SIFCTL5) step
S(SIFCLK) = f(SIFCLKFQ + 1) / f(SIFCLKFQ)
2.2 V/3 V
1.01
Dt
Temperature Coefficient
SIFCLKFQ(SIFCTL5) = 8
2.2 V/3 V
0.35
%/_C
DV
Frequency vs supply voltage
VCC variation
SIFCLKFQ(SIFCTL5) = 8
2.2 V/3 V
2
%/V
MAX
UNIT
2.2 V
75
3V
90
1.05
V
µA
MHz
MHz
MHz
ns
1.18 Hz/Hz
Flash Memory
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
VCC(PGM/ ERASE)
Program and erase supply voltage
2.7
3.6
V
fFTG
Flash timing generator frequency
257
476
kHz
IPGM
Supply current from DVCC during program
5
mA
IERASE
Supply current from DVCC during erase
7
mA
tCPT
Cumulative program time
(1)
2.7 V/ 3.6 V
10
ms
tCMErase
Cumulative mass erase time
(2)
2.7 V/ 3.6 V
2.7 V/ 3.6 V
3
2.7 V/ 3.6 V
3
20
104
Program/Erase endurance
tRetention
Data retention duration
tWord
Word or byte program time
35
Block program time for 1st byte or word
30
tBlock,
0
TJ = 25°C
ms
105
100
years
tBlock, 1-63
Block program time for each additional byte
or word
tBlock, End
Block program end-sequence wait time
tMass Erase
Mass erase time
5297
tSeg Erase
Segment erase time
4819
(1)
(2)
(3)
38
(3)
cycles
21
tFTG
6
The cumulative program time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
The mass erase duration generated by the flash timing generator is at least 11.1 ms ( = 5297 × (1 / fFTG,max) = 5297 x (1 / 476 kHz)).
To achieve the required cumulative mass erase time, the Flash Controller's mass erase operation can be repeated until this time is met.
(A worst case minimum of 19 cycles are required).
These values are hardwired into the Flash Controller's state machine (tFTG = 1/fFTG).
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MSP430FW42x
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SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
JTAG Interface
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTCK
TCK input frequency
(1)
RInternal
Internal pull-up resistance on TMS, TCK,
TDI/TCLK
(2)
(1)
(2)
MAX
UNIT
2.2 V
VCC
MIN
0
TYP
5
MHz
3V
0
10
MHz
2.2 V/3 V
25
60
90
kΩ
MIN
TYP
MAX
fTCK may be restricted to meet the timing requirements of the module selected.
TMS, TDI/TCLK, and TCK pullup resistors are implemented in all versions.
JTAG Fuse (1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VCC(FB)
Supply voltage during fuse-blow condition
VFB
Voltage level on TDI/TCLK for fuse-blow:
IFB
Supply current into TDI/TCLK during fuse blow
tFB
Time to blow fuse
(1)
TEST CONDITIONS
TA = 25°C
VCC
2.5
6
UNIT
V
7
V
100
mA
1
ms
Once the fuse is blown, no further access to the MSP430 JTAG/Test and emulation features is possible. The JTAG block is switched to
bypass mode.
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MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
www.ti.com
APPLICATION INFORMATION
Port P1, P1.0 to P1.5, Input/Output With Schmitt Trigger
Pad Logic
CAPD.x
P1SEL.x
0: Input
1: Output
0
P1DIR.x
Direction Control
From Module
P1OUT.x
1
0
1
Module X OUT
Bus
keeper
P1.0/TA0.0
P1.1/TA0.0/MCLK
P1.2/TA0.1
P1.3/TA1.0/SVSOUT
P1.4/TA1.0
P1.5/TA0CLK/ACLK
P1IN.x
EN
D
Module X IN
P1IE.x
P1IRQ.x
P1IFG.x
EN
Q
Interrupt
Edge
Select
Set
P1IES.x
P1SEL.x
NOTE: 0 ≤ x ≤ 5.
Port Function is Active if CAPD.x = 0
†
‡
40
PnSEL.x
PnDIR.x
Direction
Control
From Module
PnOUT.x
Module X
OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P1SEL.0
P1DIR.0
P1DIR.0
P1OUT.0
Out0 Sig.†
P1IN.0
CCI0A†
P1IE.0
P1IFG.0
P1IES.0
P1SEL.1
P1DIR.1
P1DIR.1
P1OUT.1
MCLK
P1IN.1
CCI0B†
P1IE.1
P1IFG.1
P1IES.1
P1SEL.2
P1DIR.2
P1DIR.2
P1OUT.2
Out1 Sig.†
P1IN.2
CCI1A†
P1IE.2
P1IFG.2
P1IES.2
P1SEL.3
P1DIR.3
P1DIR.3
P1OUT.3
SVSOUT
P1IN.3
CCI0B‡
P1IE.3
P1IFG.3
P1IES.3
P1SEL.4
P1DIR.4
P1DIR.4
P1OUT.4
Out0 Sig.‡
P1IN.4
CCI0A‡
P1IE.4
P1IFG.4
P1IES.4
P1SEL.5
P1DIR.5
P1DIR.5
P1OUT.5
ACLK
P1IN.5
T0ACLK†
P1IE.5
P1IFG.5
P1IES.5
Timer0_A
Timer1_A
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MSP430FW42x
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SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
Port P1, P1.6, P1.7 Input/Output With Schmitt Trigger
Pad Logic
Note: Port Function Is Active if CAPD.6 = 0
CAPD.6
P1SEL.6
0: Input
1: Output
0
P1DIR.6
1
P1DIR.6
P1.6/
CA0
0
P1OUT.6
1
DVSS
Bus
Keeper
P1IN.6
EN
D
unused
P1IE.7
P1IRQ.07
EN
Interrupt
Edge
Select
Q
P1IFG.7
Set
P1IES.x
P1SEL.x
Comparator_A
P2CA
AVcc
CAREF
CAEX
CA0
CAF
CCI1B
+
to Timer_Ax
−
CA1
2
CAREF
Reference Block
Pad Logic
Note: Port Function Is Active if CAPD.7 = 0
CAPD.7
P1SEL.7
0: Input
1: Output
0
P1DIR.7
1
P1.7/
CA1
P1DIR.7
0
P1OUT.7
1
DVSS
Bus
Keeper
P1IN.7
EN
unused
P1IRQ.07
D
P1IE.7
P1IFG.7
EN
Q
Set
Interrupt
Edge
Select
P1IES.7
Copyright © 2003–2011, Texas Instruments Incorporated
P1SEL.7
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MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
www.ti.com
Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
P2.0, P2.1
LCDM.5
LCDM.6
P2.2 to P2.5
LCDM.7
P2.6, P2.7
0: Port Active
1: Segment xx
Function Active
Pad Logic
Segment xx
P2SEL.x
0: Input
1: Output
0
P2DIR.x
Direction Control
From Module
P2OUT.x
1
0
P2.x
1
Module X OUT
Bus
keeper
P2.0/TA0.2
P2.1/TA1.1
P2.2/TA1.2/S23
P2.3/TA1.3/S22
P2.4/TA1.4/S21
P2.5/TA1CLK/S20
P2.6/CAOUT/S19
P2.7/SIFCLKG/S18
P2IN.x
EN
D
Module X IN
P2IE.x
P2IRQ.x
P2IFG.x
Q
EN
Set
NOTE: 0 ≤ x ≤ 7
Interrupt
Edge
Select
P2IES.x
P2SEL.x
PnSEL.x
PnDIR.x
Direction
Control
From Module
PnOUT.x
Module X
OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P2SEL.0
P2DIR.0
P2DIR.0
P2OUT.0
Out2 Sig.†
P2IN.0
CCI2A†
P2IE.0
P2IFG.0
P2IES.0
P2SEL.1
P2DIR.1
P2DIR.1
P2OUT.1
Out1 Sig.‡
P2IN.1
CCI1A‡
P2IE.1
P2IFG.1
P2IES.1
P2SEL.2
P2DIR.2
P2DIR.2
P2OUT.2
Out2 Sig.‡
P2IN.2
CCI2A‡
P2IE.2
P2IFG.2
P2IES.2
P2SEL.3
P2DIR.3
P2DIR.3
P2OUT.3
Out3 Sig.‡
P2IN.3
CCI3A‡
P2IE.3
P2IFG.3
P2IES.3
P2SEL.4
P2DIR.4
P2DIR.4
P2OUT.4
Out4 Sig.‡
P2IN.4
CCI4A‡
P2IE.4
P2IFG.4
P2IES.4
P2SEL.5
P2DIR.5
P2DIR.5
P2OUT.5
DVSS
P2IN.5
TA1CLK1‡
P2IE.5
P2IFG.5
P2IES.5
P2SEL.6
P2DIR.6
P2DIR.6
P2OUT.6
CAOUT
P2IN.6
Unused
P2IE.6
P2IFG.6
P2IES.6
P2SEL.7
P2DIR.7
P2DIR.7
P2OUT.7
SIFCLKG§
P2IN.7
Unused
P2IE.7
P2IFG.7
P2IES.7
†Timer0_A
‡Timer1_A
§Scan
42
IF
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Copyright © 2003–2011, Texas Instruments Incorporated
MSP430FW42x
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SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
LCDM.5
P3.2 to P3.7
LCDM.6
LCDM.7
P3.0, P3.1
0: Port Active
1: Segment xx
Function Active
Pad Logic
Segment xx
P3SEL.x
0: Input
1: Output
0
P3DIR.x
Direction Control
From Module
P3OUT.x
1
0
1
Module X OUT
P3.x
Bus
keeper
P3.0/S17
P3.1/S16
P3.2/S15
P3.3/S14
P3.4/S13
P3.5/S12
P3.6/S11
P3.7/S10
P3IN.x
EN
D
Module X IN
NOTE: 0 ≤ x ≤ 7
PnSEL.x
PnDIR.x
Direction
Control
From Module
PnOUT.x
Module X
OUT
PnIN.x
Module X IN
P3SEL.0
P3DIR.0
P3DIR.0
P3OUT.0
DVSS
P3IN.0
Unused
P3SEL.1
P3DIR.1
P3DIR.1
P3OUT.1
DVSS
P3IN.1
Unused
P3SEL.2
P3DIR.2
P3DIR.2
P3OUT.2
DVSS
P3IN.2
Unused
P3SEL.3
P3DIR.3
P3DIR.3
P3OUT.3
DVSS
P3IN.3
Unused
P3SEL.4
P3DIR.4
P3DIR.4
P3OUT.4
DVSS
P3IN.4
Unused
P3SEL.5
P3DIR.5
P3DIR.5
P3OUT.5
DVSS
P3IN.5
Unused
P3SEL.6
P3DIR.6
P3DIR.6
P3OUT.6
DVSS
P3IN.6
Unused
P3SEL.7
P3DIR.7
P3DIR.7
P3OUT.7
DVSS
P3IN.7
Unused
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MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
www.ti.com
Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
LCDM.5
LCDM.6
LCDM.7
0: Port Active
1: Segment xx
Function Active
Pad Logic
Segment xx
P4SEL.x
0: Input
1: Output
0
P4DIR.x
Direction Control
From Module
P4OUT.x
1
0
P4.x
1
Module X OUT
Bus
keeper
P4.0/S9
P4.1/S8
P4.2/S7
P4.3/S6
P4.4/S5
P4.5/S4
P4.6/S3
P4.7/S2
P4IN.x
EN
D
Module X IN
NOTE: 0 ≤ x ≤ 7
44
PnSEL.x
PnDIR.x
Direction
Control
From Module
PnOUT.x
Module X
OUT
PnIN.x
Module X IN
P4SEL.0
P4DIR.0
P4DIR.0
P4OUT.0
DVSS
P4IN.0
Unused
P4SEL.1
P4DIR.1
P4DIR.1
P4OUT.1
DVSS
P4IN.1
Unused
P4SEL.2
P4DIR.2
P4DIR.2
P4OUT.2
DVSS
P4IN.2
Unused
P4SEL.3
P4DIR.3
P4DIR.3
P4OUT.3
DVSS
P4IN.3
Unused
P4SEL.4
P4DIR.4
P4DIR.4
P4OUT.4
DVSS
P4IN.4
Unused
P4SEL.5
P4DIR.5
P4DIR.5
P4OUT.5
DVSS
P4IN.5
Unused
P4SEL.6
P4DIR.6
P4DIR.6
P4OUT.6
DVSS
P4IN.6
Unused
P4SEL.7
P4DIR.7
P4DIR.7
P4OUT.7
DVSS
P4IN.7
Unused
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Copyright © 2003–2011, Texas Instruments Incorporated
MSP430FW42x
www.ti.com
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
Port P5, P5.0, P5.1, Input/Output With Schmitt Trigger
LCDM.5
0: Port Active
1: Segment
Function Active
LCDM.6
LCDM.7
Pad Logic
Segment xx or
COMx or Rxx
P5SEL.x
0: Input
1: Output
0
P5DIR.x
Direction Control
From Module
P5OUT.x
1
0
1
Module X OUT
P5.x
Bus
keeper
P5.0/S1
P5.1/S0
P5IN.x
EN
D
Module X IN
NOTE: x = 0, 1
PnSEL.x
PnDIR.x
Direction
Control
From Module
PnOUT.x
Module X
OUT
PnIN.x
Module X IN
Segment
P5SEL.0
P5DIR.0
P5DIR.0
P5OUT.0
DVSS
P5IN.0
Unused
S1
P5SEL.1
P5DIR.1
P5DIR.1
P5OUT.1
DVSS
P5IN.1
Unused
S0
Copyright © 2003–2011, Texas Instruments Incorporated
Submit Documentation Feedback
45
MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
www.ti.com
Port P5, P5.2 to P5.4, Input/Output With Schmitt Trigger
0: Port Active
1: COMx Function
Active
Pad Logic
COMx
P5SEL.x
0: Input
1: Output
0
P5DIR.x
Direction Control
From Module
P5OUT.x
Module X OUT
1
0
P5.x
1
Bus
keeper
P5.2/COM1
P5.3/COM2
P5.4/COM3
P5IN.x
EN
D
Module X IN
NOTE: 2 ≤ x ≤ 4
46
PnSEL.x
PnDIR.x
Direction
Control
From Module
PnOUT.x
Module X
OUT
PnIN.x
Module X IN
COMx
P5SEL.2
P5DIR.2
P5DIR.2
P5OUT.2
DVSS
P5IN.2
Unused
COM1
P5SEL.3
P5DIR.3
P5DIR.3
P5OUT.3
DVSS
P5IN.3
Unused
COM2
P5SEL.4
P5DIR.4
P5DIR.4
P5OUT.4
DVSS
P5IN.4
Unused
COM3
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Copyright © 2003–2011, Texas Instruments Incorporated
MSP430FW42x
www.ti.com
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
Port P5, P5.5 to P5.7, Input/Output With Schmitt Trigger
0: Port Active
1: Rxx Function
Active
Pad Logic
Rxx
P5SEL.x
0: Input
1: Output
0
P5DIR.x
Direction Control
From Module
P5OUT.x
Module X OUT
1
0
P5.x
1
Bus
keeper
P5.5/R13
P5.6/R23
P5.7/R33
P5IN.x
EN
D
Module X IN
NOTE: 5 ≤ x ≤ 7
PnSEL.x
PnDIR.x
Direction
Control
From Module
PnOUT.x
Module X
OUT
PnIN.x
Module X IN
Rxx
P5SEL.5
P5DIR.5
P5DIR.5
P5OUT.5
DVSS
P5IN.5
Unused
R13
P5SEL.6
P5DIR.6
P5DIR.6
P5OUT.6
DVSS
P5IN.6
Unused
R23
P5SEL.7
P5DIR.7
P5DIR.7
P5OUT.7
DVSS
P5IN.7
Unused
R33
Copyright © 2003–2011, Texas Instruments Incorporated
Submit Documentation Feedback
47
MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
www.ti.com
Port P6, P6.0, P6.1, P6.2, P6.4, P6.5, Input/Output With Schmitt Trigger
P6SEL.x
0
P6DIR.x
Direction Control
From Module
0: Input
1: Output
1
Pad Logic
0
P6OUT.x
Module X OUT
P6.X
1
P6.0/SIFCH0
P6.1/SIFCH1
P6.2/SIFCH2
P6.4/SIFCI0
P6.5/SIFCI1
Bus Keeper
P6IN.x
EN
Module X IN
D
To/From Scan I/F
P6SEL.x must be set if the corresponding pins are used by the Scan IF
.
x: Bit Identifier = 0, 1, 2, 4, or 5
NOTE
Analog signals applied to digital gates can cause current flow from the positive to the
negative terminal. The throughput current flows if the analog signal is in the range of
transitions 0→1 or 1→0. The value of the throughput current depends on the driving
capability of the gate. For MSP430, it is approximately 100 µA.
Use P6SEL.x=1 to prevent throughput current. P6SEL.x should be set, if an analog signal
is applied to the pin.
48
PnSEL.x
PnDIR.x
Dir. Control
From Module
PnOUT.x
Module X OUT
PnIN.x
Module X IN
P6Sel.0
P6DIR.0
P6DIR.0
P6OUT.0
DVSS
P6IN.0
unused
P6Sel.1
P6DIR.1
P6DIR.1
P6OUT.1
DVSS
P6IN.1
unused
P6Sel.2
P6DIR.2
P6DIR.2
P6OUT.2
DVSS
P6IN.2
unused
P6Sel.4
P6DIR.4
P6DIR.4
P6OUT.4
DVSS
P6IN.4
unused
P6Sel.5
P6DIR.5
P6DIR.5
P6OUT.5
DVSS
P6IN.5
unused
Submit Documentation Feedback
Copyright © 2003–2011, Texas Instruments Incorporated
MSP430FW42x
www.ti.com
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
NOTE
The signal at pins P6.x/SIFCHx and P6.x/SIFCIx are shared by Port P6 and the Scan IF
module. P6SEL.x must be set if the corresponding pins are used by the Scan IF.
Port P6, P6.3 Input/Output With Schmitt Trigger
P6SEL.3
0
P6DIR.3
1
0: Input
1: Output
Pad Logic
0
P6OUT.x
SIFCAOUT
P6.3/SIFCH3/SIFCAOUT
1
Bus Keeper
P6IN.3
EN
Module X IN
D
To/From Scan I/F
P6SEL.x must be set if the corresponding pins are used by the Scan IF
.
NOTE
Analog signals applied to digital gates can cause current flow from the positive to the
negative terminal. The throughput current flows if the analog signal is in the range of
transitions 0→1 or 1→0. The value of the throughput current depends on the driving
capability of the gate. For MSP430, it is approximately 100 µA.
Use P6SEL.x=1 to prevent throughput current. P6SEL.x should be set, if an analog signal
is applied to the pin.
P6SEL.3
P6DIR.3
Port Function
0
0
P6.3 Input
0
1
P6.3 Output
1
0
SIFCH3 (Scan IF channel 3 excitation output and comparator input)
1
1
SIFCAOUT (Comparator output)
Copyright © 2003–2011, Texas Instruments Incorporated
Submit Documentation Feedback
49
MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
www.ti.com
Port P6, P6.6 Input/Output With Schmitt Trigger
P6SEL.6
0
P6DIR.6
0: Input
1: Output
1
Pad Logic
0
P6OUT.6
DVss
P6.6/SIFCI2/DACOUT
1
Bus Keeper
P6IN.6
EN
Module X IN
D
1
From Scan I/F DAC
To Scan I/F comparator input mux
P6SEL.x must be set if the corresponding pins are used by the Scan IF
.
NOTE
Analog signals applied to digital gates can cause current flow from the positive to the
negative terminal. The throughput current flows if the analog signal is in the range of
transitions 0→1 or 1→0. The value of the throughput current depends on the driving
capability of the gate. For MSP430, it is approximately 100 µA.
Use P6SEL.x=1 to prevent throughput current. P6SEL.x should be set, if an analog signal
is applied to the pin.
50
P6SEL.6
P6DIR.6
0
0
P6.6 Input
0
1
P6.6 Output
1
0
SIFCI2 (Scan IF channel 2 comparator input)
1
1
SIFDAOUT (Scan IF DAC output)
Submit Documentation Feedback
Port Function
Copyright © 2003–2011, Texas Instruments Incorporated
MSP430FW42x
www.ti.com
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
Port P6, P6.7 Input/Output With Schmitt Trigger
SVS VLDx=15
P6SEL.7
P6DIR.7
0
0: Input
1: Output
1
Pad Logic
0
P6OUT.7
DVss
P6.7/SIFCI3/SVSIN
1
Bus Keeper
P6IN.7
EN
Module X IN
D
SVS VLDx=15
1
To SVS
To Scan I/F comparator (+) terminal
P6SEL.x must be set if the corresponding pins are used by the Scan IF
.
NOTE
Analog signals applied to digital gates can cause current flow from the positive to the
negative terminal. The throughput current flows if the analog signal is in the range of
transitions 0→1 or 1→0. The value of the throughput current depends on the driving
capability of the gate. For MSP430, it is approximately 100 µA.
Use P6SEL.x=1 to prevent throughput current. P6SEL.x should be set, if an analog signal
is applied to the pin.
SVS VLDx = 15
P6SEL.7
P6DIR.7
Port Function
0
0
0
P6.7 Input
0
0
1
P6.7 Output
0
1
X
SIFCI3 (Scan IF channel 3 comparator input)
1
X
X
SVSIN
Copyright © 2003–2011, Texas Instruments Incorporated
Submit Documentation Feedback
51
MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
www.ti.com
JTAG Pins TMS, TCK, TDI/TCLK, TDO/TDI, Input/Output with Schmitt-Trigger or Output
TDO
Controlled by JT AG
Controlled by JT AG
TDO/TDI
JTAG
Controlled
by JTAG
DVCC
TDI
Burn and T est
Fuse
TDI/TCLK
Test
and
Emulation
DVCC
TMS
Module
TMS
DVCC
TCK
TCK
RST/NMI
Tau ~ 50 ns
Brownout
TCK
52
Submit Documentation Feedback
G
D
U
S
G
D
U
S
Copyright © 2003–2011, Texas Instruments Incorporated
MSP430FW42x
www.ti.com
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
JTAG Fuse Check Mode
MSP430 devices that have the fuse on the TDI/TCLK terminal have a fuse check mode that tests the continuity
of the fuse the first time the JTAG port is accessed after a power-on reset (POR). When activated, a fuse check
current (I(TF)) of 1.8 mA at 3 V can flow from the TDI/TCLK pin to ground if the fuse is not burned. Care must be
taken to avoid accidentally activating the fuse check mode and increasing overall system power consumption.
Activation of the fuse check mode occurs with the first negative edge on the TMS pin after power up or if the
TMS is being held low during power up. The second positive edge on the TMS pin deactivates the fuse check
mode. After deactivation, the fuse check mode remains inactive until another POR occurs. After each POR the
fuse check mode has the potential to be activated.
The fuse check current only flows when the fuse check mode is active and the TMS pin is in a low state (see
Figure 21). Therefore, the additional current flow can be prevented by holding the TMS pin high (default
condition). The JTAG pins are terminated internally and therefore do not require external termination.
Time TMS Goes Low After POR
TMS
ITF
ITDI/TCLK
Figure 21. Fuse Check Mode Current
Copyright © 2003–2011, Texas Instruments Incorporated
Submit Documentation Feedback
53
MSP430FW42x
SLAS383D – OCTOBER 2003 – REVISED JANUARY 2011
www.ti.com
Table 11. Revision History (1)
REVISION
SLAS383
(1)
54
COMMENTS
Initial release
SLAS383A
Clarified descriptions for AVCC and AVSS in Terminal Functions table (page 4)
Clarified notes in Interrupt Vector Addresses (page 8)
Removed VIL and VIH entries from Recommended Operating Conditions (page 18)
Changed note 2 on Recommended Operating Conditions (page 18)
Added to Wakeup LPM3 table (page 22)
Removed TAx references in Comparator_A table (page 23)
Clarified notes on Flash Memory table (page 36)
SLAS383B
Updated functional block diagram (page 3)
Clarified test conditions in recommended operating conditions table (page 18)
Clarified test conditions in electrical characteristics table (page 19)
Added Ilkg(Px.x) for all ports in leakage current table (page 20)
Clarified test conditions in DCO table (page 29)
Changed tCPT maximum value from 4 ms to 10 ms in Flash Memory table (page 36)
SLAS383C
Updated max values for VIC and Vhys in Scan IF, Comparator table (page 35)
SLAS383D
Added information about 'FW428 and 'FW429
Page and figure numbers refer to the respective document revision.
Submit Documentation Feedback
Copyright © 2003–2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
(Requires Login)
MSP430FW423IPM
ACTIVE
LQFP
PM
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430FW423IPMR
ACTIVE
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430FW425IPM
ACTIVE
LQFP
PM
64
1
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430FW425IPMR
ACTIVE
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430FW427IPM
ACTIVE
LQFP
PM
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430FW427IPMR
ACTIVE
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430FW428IPM
PREVIEW
LQFP
PM
64
160
TBD
MSP430FW428IPMR
ACTIVE
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
MSP430FW429CY
PREVIEW
DIESALE
Y
0
450
Green (RoHS
& no Sb/Br)
Call TI
N / A for Pkg Type
MSP430FW429IPM
PREVIEW
LQFP
PM
64
160
TBD
Call TI
Call TI
MSP430FW429IPMR
ACTIVE
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
Call TI
Samples
Call TI
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2011
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Apr-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
MSP430FW423IPMR
LQFP
PM
64
1000
330.0
24.4
12.3
12.3
2.5
16.0
24.0
Q2
MSP430FW423IPMR
LQFP
PM
64
1000
330.0
24.4
13.0
13.0
2.1
16.0
24.0
Q2
MSP430FW425IPMR
LQFP
PM
64
1000
330.0
24.4
13.0
13.0
2.1
16.0
24.0
Q2
MSP430FW425IPMR
LQFP
PM
64
1000
330.0
24.4
12.3
12.3
2.5
16.0
24.0
Q2
MSP430FW427IPMR
LQFP
PM
64
1000
330.0
24.4
13.0
13.0
2.1
16.0
24.0
Q2
MSP430FW427IPMR
LQFP
PM
64
1000
330.0
24.4
12.3
12.3
2.5
16.0
24.0
Q2
MSP430FW428IPMR
LQFP
PM
64
1000
330.0
24.4
12.3
12.3
2.5
16.0
24.0
Q2
MSP430FW429IPMR
LQFP
PM
64
1000
330.0
24.4
12.3
12.3
2.5
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Apr-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MSP430FW423IPMR
LQFP
PM
64
1000
333.2
345.9
41.3
MSP430FW423IPMR
LQFP
PM
64
1000
346.0
346.0
41.0
MSP430FW425IPMR
LQFP
PM
64
1000
346.0
346.0
41.0
MSP430FW425IPMR
LQFP
PM
64
1000
333.2
345.9
41.3
MSP430FW427IPMR
LQFP
PM
64
1000
346.0
346.0
41.0
MSP430FW427IPMR
LQFP
PM
64
1000
333.2
345.9
41.3
MSP430FW428IPMR
LQFP
PM
64
1000
333.2
345.9
41.3
MSP430FW429IPMR
LQFP
PM
64
1000
333.2
345.9
41.3
Pack Materials-Page 2
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
33
48
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
11,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040152 / C 11/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
May also be thermally enhanced plastic with leads connected to the die pads.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and
Automotive
www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
Wireless
www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions
www.ti.com/lprf
TI E2E Community Home Page
e2e.ti.com
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