Cirrus CS2200-CP Fractional-n frequency synthesizer Datasheet

CS2200-CP
Fractional-N Frequency Synthesizer
Features
General Description
 Delta-Sigma Fractional-N Frequency Synthesis
–





Generates a Low Jitter 6 - 75 MHz Clock
from an 8 - 75 MHz Reference Clock
Highly Accurate PLL Multiplication Factor
– Maximum Error Less Than 1 PPM
I²C™ / SPI™ Control Port
Configurable Auxiliary Output
– Buffered Reference Clock
– PLL Lock Indication
– Duplicate PLL Output
Flexible Sourcing of Reference Clock
– External Oscillator or Clock Source
– Supports Inexpensive Local Crystal
Minimal Board Space Required
– No External Analog Loop-filter
Components
The CS2200-CP is an extremely versatile system clocking device that utilizes a programmable phase lock loop.
The CS2200-CP is based on an analog PLL architecture comprised of a Delta-Sigma Fractional-N
Frequency Synthesizer. This architecture allows for frequency synthesis and clock generation from a stable
reference clock.
The CS2200-CP supports both I²C and SPI for full software control.
The CS2200-CP is available in a 10-pin MSOP package
in Commercial (-10 °C to +70 °C) grade.
Customer development kits are also available for device
evaluation. Please see “Ordering Information” on
page 25 for complete details.
3.3 V
Timing Reference
I²C/SPI Software
Control
PLL Output
I²C / SPI
PLL Lock Indicator
8 MHz to 75 MHz
Low-Jitter Timing
Reference
Phase
Comparator
Internal
Loop Filter
Voltage Controlled
Oscillator
Auxiliary
Output
6 to 75 MHz
PLL Output
Fractional-N
Divider
Delta-Sigma
Modulator
N
Output to Input
Clock Ratio
http://www.cirrus.com
Copyright  Cirrus Logic, Inc. 2009
(All Rights Reserved)
AUG '09
DS759F1
CS2200-CP
TABLE OF CONTENTS
1. PIN DESCRIPTION ................................................................................................................................. 4
2. TYPICAL CONNECTION DIAGRAM ..................................................................................................... 5
3. CHARACTERISTICS AND SPECIFICATIONS ...................................................................................... 6
RECOMMENDED OPERATING CONDITIONS .................................................................................... 6
ABSOLUTE MAXIMUM RATINGS ........................................................................................................ 6
DC ELECTRICAL CHARACTERISTICS ................................................................................................ 6
AC ELECTRICAL CHARACTERISTICS ................................................................................................ 7
CONTROL PORT SWITCHING CHARACTERISTICS- I²C FORMAT ................................................... 8
CONTROL PORT SWITCHING CHARACTERISTICS - SPI FORMAT ................................................. 9
4. ARCHITECTURE OVERVIEW ............................................................................................................. 10
4.1 Delta-Sigma Fractional-N Frequency Synthesizer ......................................................................... 10
5. APPLICATIONS ................................................................................................................................... 11
5.1 Timing Reference Clock Input ........................................................................................................ 11
5.1.1 Internal Timing Reference Clock Divider ............................................................................... 11
5.1.2 Crystal Connections (XTI and XTO) ...................................................................................... 12
5.1.3 External Reference Clock (REF_CLK) .................................................................................. 12
5.2 Output to Input Frequency Ratio Configuration ............................................................................. 12
5.2.1 User Defined Ratio (RUD) ..................................................................................................... 12
5.2.2 Ratio Modifier (R-Mod) .......................................................................................................... 13
5.2.3 Effective Ratio (REFF) .......................................................................................................... 13
5.2.4 Ratio Configuration Summary ............................................................................................... 14
5.3 PLL Clock Output ........................................................................................................................... 14
5.4 Auxiliary Output .............................................................................................................................. 15
5.5 Clock Output Stability Considerations ............................................................................................ 15
5.5.1 Output Switching ................................................................................................................... 15
5.5.2 PLL Unlock Conditions .......................................................................................................... 15
5.6 Required Power Up Sequencing .................................................................................................... 16
6. SPI / I²C CONTROL PORT ................................................................................................................... 16
6.1 SPI Control ..................................................................................................................................... 16
6.2 I²C Control ...................................................................................................................................... 16
6.3 Memory Address Pointer ............................................................................................................... 18
6.3.1 Map Auto Increment .............................................................................................................. 18
7. REGISTER QUICK REFERENCE ........................................................................................................ 18
8. REGISTER DESCRIPTIONS ................................................................................................................ 19
8.1 Device I.D. and Revision (Address 01h) ....................................................................................... 19
8.1.1 Device Identification (Device[4:0]) - Read Only ..................................................................... 19
8.1.2 Device Revision (Revision[2:0]) - Read Only ........................................................................ 19
8.2 Device Control (Address 02h) ........................................................................................................ 19
8.2.1 Unlock Indicator (Unlock) - Read Only .................................................................................. 19
8.2.2 Auxiliary Output Disable (AuxOutDis) ................................................................................... 19
8.2.3 PLL Clock Output Disable (ClkOutDis) .................................................................................. 20
8.3 Device Configuration 1 (Address 03h) ........................................................................................... 20
8.3.1 R-Mod Selection (RModSel[2:0]) ........................................................................................... 20
8.3.2 Auxiliary Output Source Selection (AuxOutSrc[1:0]) ............................................................. 20
8.3.3 Enable Device Configuration Registers 1 (EnDevCfg1) ........................................................ 21
8.4 Global Configuration (Address 05h) ............................................................................................... 21
8.4.1 Device Configuration Freeze (Freeze) ................................................................................ 21
8.4.2 Enable Device Configuration Registers 2 (EnDevCfg2) ....................................................... 21
8.5 Ratio (Address 06h - 09h) .............................................................................................................. 21
8.6 Function Configuration 1 (Address 16h) ........................................................................................ 22
8.6.1 AUX PLL Lock Output Configuration (AuxLockCfg) .............................................................. 22
8.6.2 Reference Clock Input Divider (RefClkDiv[1:0]) .................................................................... 22
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8.7 Function Configuration 2 (Address 17h) ........................................................................................ 22
8.7.1 Enable PLL Clock Output on Unlock (ClkOutUnl) ................................................................. 22
9. CALCULATING THE USER DEFINED RATIO .................................................................................... 23
9.1 12.20 Format .................................................................................................................................. 23
10. PACKAGE DIMENSIONS .................................................................................................................. 24
THERMAL CHARACTERISTICS ......................................................................................................... 24
11. ORDERING INFORMATION .............................................................................................................. 25
12. REFERENCES .................................................................................................................................... 25
13. REVISION HISTORY .......................................................................................................................... 26
LIST OF FIGURES
Figure 1. Typical Connection Diagram ........................................................................................................ 5
Figure 2. Control Port Timing - I²C Format .................................................................................................. 8
Figure 3. Control Port Timing - SPI Format (Write Only) ............................................................................ 9
Figure 4. Delta-Sigma Fractional-N Frequency Synthesizer ..................................................................... 10
Figure 5. Internal Timing Reference Clock Divider ................................................................................... 11
Figure 6. REF_CLK Frequency vs a Fixed CLK_OUT .............................................................................. 11
Figure 7. External Component Requirements for Crystal Circuit .............................................................. 12
Figure 8. Ratio Feature Summary ............................................................................................................. 14
Figure 9. PLL Clock Output Options ......................................................................................................... 14
Figure 10. Auxiliary Output Selection ........................................................................................................ 15
Figure 11. Control Port Timing in SPI Mode ............................................................................................. 17
Figure 12. Control Port Timing, I²C Write .................................................................................................. 17
Figure 13. Control Port Timing, I²C Aborted Write + Read ....................................................................... 17
LIST OF TABLES
Table 1. Ratio Modifier .............................................................................................................................. 13
Table 2. Example 12.20 R-Values ............................................................................................................ 23
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1. PIN DESCRIPTION
VD
1
10
SDA/CDIN
GND
2
9
SCL/CCLK
CLK_OUT
3
8
AD0/CS
AUX_OUT
4
7
XTI/REF_CLK
TST_IN
5
6
XTO
Pin Name
#
Pin Description
VD
1
Digital Power (Input) - Positive power supply for the digital and analog sections.
GND
2
Ground (Input) - Ground reference.
CLK_OUT
3
PLL Clock Output (Output) - PLL clock output.
4
Auxiliary Output (Output) - This pin outputs a buffered version of one of the input or output clocks,
or a status signal, depending on register configuration.
5
Test Input (Input) - This pin is for factory test purposes and must be connected to GND for proper
operation.
6
7
Crystal Connections (XTI/XTO) / Timing Reference Clock Input (REF_CLK) (Input/Output) XTI/XTO are I/O pins for an external crystal which may be used to generate the low-jitter PLL input
clock. REF_CLK is an input for an externally generated low-jitter reference clock.
8
Address Bit 0 (I²C) / Control Port Chip Select (SPI) (Input) - AD0 is a chip address pin in I²C
Mode. CS is the chip select signal in SPI Mode.
9
Control Port Clock (Input) - SCL/CCLK is the serial clock for the serial control port in I²C and SPI
mode.
AUX_OUT
TST_IN
XTO
XTI/REF_CLK
AD0/CS
SCL/CCLK
SDA/CDIN
4
10 Serial Control Data (Input/Output) - SDA is the data I/O line in I²C Mode. CDIN is the input data
line for the control port interface in SPI Mode.
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2. TYPICAL CONNECTION DIAGRAM
Note1
Notes:
1. Resistors
required for I2C
operation.
0.1 µF
2 kΩ
1 µF
+3.3 V
2 kΩ
VD
SCL/CCLK
System MicroController
SDA/CDIN
CLK_OUT
AD0/CS
To circuitry which requires
a low-jitter clock
CS2200-CP
AUX_OUT
1
or
2
XTI/REF_CLK
XTO
GND
Low-Jitter
Timing Reference
To other circuitry or
Microcontroller
TST_IN
REF_CLK
1
N.C. x
XTO
or
Crystal
XTI
2
XTO
40 pF
40 pF
Figure 1. Typical Connection Diagram
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3. CHARACTERISTICS AND SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
GND = 0 V; all voltages with respect to ground. (Note 1)
Parameters
DC Power Supply
Symbol
Min
Typ
Max
Units
VD
3.1
3.3
3.5
V
TAC
-10
-
+70
°C
Ambient Operating Temperature (Power Applied)
Commercial Grade
Notes: 1. Device functionality is not guaranteed or implied outside of these limits. Operation outside of these limits
may adversely affect device reliability.
ABSOLUTE MAXIMUM RATINGS
GND = 0 V; all voltages with respect to ground.
Parameters
Symbol
Min
Max
Units
DC Power Supply
VD
-0.3
6.0
V
Input Current
IIN
-
±10
mA
Digital Input Voltage (Note 2)
VIN
-0.3
VD + 0.4
V
Ambient Operating Temperature (Power Applied)
TA
-55
125
°C
Storage Temperature
Tstg
-65
150
°C
WARNING: Operation at or beyond these limits may result in permanent damage to the device.
Notes: 2. The maximum over/under voltage is limited by the input current except on the power supply pin.
DC ELECTRICAL CHARACTERISTICS
Test Conditions (unless otherwise specified): VD = 3.1 V to 3.5 V; TA = -10°C to +70°C (Commercial Grade).
Parameters
Symbol
Min
Typ
Max
Units
Power Supply Current - Unloaded
(Note 3)
ID
-
12
18
mA
Power Dissipation - Unloaded
(Note 3)
PD
-
40
60
mW
Input Leakage Current
IIN
-
-
±10
µA
Input Capacitance
IC
-
8
-
pF
High-Level Input Voltage
VIH
70%
-
-
VD
Low-Level Input Voltage
VIL
-
-
30%
VD
High-Level Output Voltage (IOH = -1.2 mA)
VOH
80%
-
-
VD
Low-Level Output Voltage (IOH = 1.2 mA)
VOL
-
-
20%
VD
Notes: 3. To calculate the additional current consumption due to loading (per output pin), multiply clock output
frequency by load capacitance and power supply voltage.
For example, fCLK_OUT (49.152 MHz) * CL (15 pF) * VD (3.3 V) = 2.4 mA of additional current due to
these loading conditions on CLK_OUT.
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AC ELECTRICAL CHARACTERISTICS
Test Conditions (unless otherwise specified): VD = 3.1 V to 3.5 V; TA = -10°C to +70°C (Commercial Grade);
CL = 15 pF.
Parameters
Crystal Frequency
Fundamental Mode XTAL
Symbol
Conditions
Min
Typ
Max
Units
fXTAL
RefClkDiv[1:0] = 10
RefClkDiv[1:0] = 01
RefClkDiv[1:0] = 00
RefClkDiv[1:0] = 10
RefClkDiv[1:0] = 01
RefClkDiv[1:0] = 00
8
16
32
-
14
28
50
MHz
MHz
MHz
8
16
32
-
14
28
56
MHz
MHz
MHz
-
55
%
14
MHz
75
MHz
Reference Clock Input Frequency
fREF_CLK
Reference Clock Input Duty Cycle
DREF_CLK
45
Internal System Clock Frequency
fSYS_CLK
8
PLL Clock Output Frequency
fCLK_OUT
6
-
PLL Clock Output Duty Cycle
tOD
Measured at VD/2
45
50
55
%
Clock Output Rise Time
tOR
20% to 80% of VD
-
1.7
3.0
ns
Clock Output Fall Time
tOF
80% to 20% of VD
-
1.7
3.0
ns
Period Jitter
tJIT
(Note 4)
-
70
-
ps rms
Base Band Jitter (100 Hz to 40 kHz)
(Notes 4, 5)
-
50
-
ps rms
Wide Band JItter (100 Hz Corner)
(Notes 4, 6)
-
175
-
ps rms
-
1
3
ms
0
-
±0.5
ppm
PLL Lock Time - REF_CLK
tLR
Output Frequency Synthesis Resolution (Note 7)
ferr
fREF_CLK = 8 to 75 MHz
Notes: 4. fCLK_OUT = 24.576 MHz; Sample size = 10,000 points; AuxOutSrc[1:0] = 11.
5. In accordance with AES-12id-2006 section 3.4.2. Measurements are Time Interval Error taken with 3rd
order 100 Hz to 40 kHz bandpass filter.
6. In accordance with AES-12id-2006 section 3.4.1. Measurements are Time Interval Error taken with 3rd
order 100 Hz Highpass filter.
7. The frequency accuracy of the PLL clock output is directly proportional to the frequency accuracy of the
reference clock.
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CONTROL PORT SWITCHING CHARACTERISTICS- I²C FORMAT
Inputs: Logic 0 = GND; Logic 1 = VD; CL = 20 pF.
Parameter
Symbol
Min
Max
Unit
SCL Clock Frequency
fscl
-
100
kHz
Bus Free-Time Between Transmissions
tbuf
4.7
-
µs
Start Condition Hold Time (prior to first clock pulse)
thdst
4.0
-
µs
Clock Low Time
tlow
4.7
-
µs
Clock High Time
thigh
4.0
-
µs
Setup Time for Repeated Start Condition
tsust
4.7
-
µs
SDA Hold Time from SCL Falling
(Note 8)
thdd
0
-
µs
tsud
250
-
ns
Rise Time of SCL and SDA
tr
-
1
µs
Fall Time SCL and SDA
tf
-
300
ns
SDA Setup Time to SCL Rising
Setup Time for Stop Condition
tsusp
4.7
-
µs
Acknowledge Delay from SCL Falling
tack
300
1000
ns
Delay from Supply Voltage Stable to Control Port Ready
tdpor
100
-
µs
Notes: 8. Data must be held for sufficient time to bridge the transition time, tf, of SCL.
VD
t dpor
Repeated
Start
Stop
SDA
t buf
t
t high
t hdst
tf
hdst
t susp
SCL
Stop
Start
t
low
t
hdd
t sud
t sust
tr
Figure 2. Control Port Timing - I²C Format
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CONTROL PORT SWITCHING CHARACTERISTICS - SPI FORMAT
Inputs: Logic 0 = GND; Logic 1 = VD; CL = 20 pF.
Parameter
Symbol
Min
Max
Unit
fccllk
-
6
MHz
tspi
500
-
ns
CS High Time Between Transmissions
tcsh
1.0
-
µs
CS Falling to CCLK Edge
tcss
20
-
ns
CCLK Low Time
tscl
66
-
ns
CCLK High Time
tsch
66
-
ns
CCLK Clock Frequency
CCLK Edge to CS Falling
(Note 9)
CDIN to CCLK Rising Setup Time
tdsu
40
-
ns
CCLK Rising to DATA Hold Time
(Note 10)
tdh
15
-
ns
Rise Time of CCLK and CDIN
(Note 11)
tr2
-
100
ns
Fall Time of CCLK and CDIN
(Note 11)
tf2
-
100
ns
tdpor
100
-
µs
Delay from Supply Voltage Stable to Control Port Ready
Notes: 9. tspi is only needed before first falling edge of CS after power is applied. tspi = 0 at all other times.
10. Data must be held for sufficient time to bridge the transition time of CCLK.
11. For fcclk < 1 MHz.
VD
tdpor
CS
t spi
t css
t scl
t sch
t csh
CCLK
t r2
t f2
CDIN
t dsu
tdh
Figure 3. Control Port Timing - SPI Format (Write Only)
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4. ARCHITECTURE OVERVIEW
4.1
Delta-Sigma Fractional-N Frequency Synthesizer
The core of the CS2200 is a Delta-Sigma Fractional-N Frequency Synthesizer which has very high-resolution for Input/Output clock ratios, low phase noise, very wide range of output frequencies and the ability to
quickly tune to a new frequency. In very simplistic terms, the Fractional-N Frequency Synthesizer multiplies
the Timing Reference Clock by the value of N to generate the PLL output clock. The desired output to input
clock ratio is the value of N that is applied to the delta-sigma modulator (see Figure 4).
The analog PLL based frequency synthesizer uses a low-jitter timing reference clock as a time and phase
reference for the internal voltage controlled oscillator (VCO). The phase comparator compares the fractional-N divided clock with the original timing reference and generates a control signal. The control signal is filtered by the internal loop filter to generate the VCO’s control voltage which sets its output frequency. The
delta-sigma modulator modulates the loop integer divide ratio to get the desired fractional ratio between the
reference clock and the VCO output (thus the one’s density of the modulator sets the fractional value). This
allows the design to be optimized for very fast lock times for a wide range of output frequencies without the
need for external filter components. As with any Fractional-N Frequency Synthesizer the timing reference
clock should be stable and jitter-free.
Timing Reference
Clock
Phase
Comparator
Internal
Loop Filter
Voltage Controlled
Oscillator
PLL Output
Fractional-N
Divider
Delta-Sigma
Modulator
N
Figure 4. Delta-Sigma Fractional-N Frequency Synthesizer
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5. APPLICATIONS
5.1
Timing Reference Clock Input
The low jitter timing reference clock (RefClk) can be provided by either an external reference clock or an
external crystal in conjunction with the internal oscillator. In order to maintain a stable and low-jitter PLL output the timing reference clock must also be stable and low-jitter; the quality of the timing reference clock
directly affects the performance of the PLL and hence the quality of the PLL output.
5.1.1
Internal Timing Reference Clock Divider
The Internal Timing Reference Clock (SysClk) has a smaller maximum frequency than what is allowed on
the XTI/REF_CLK pin. The CS2200 supports the wider external frequency range by offering an internal
divider for RefClk. The RefClkDiv[1:0] bits should be set such that SysClk, the divided RefClk, then falls
within the valid range as indicated in “AC Electrical Characteristics” on page 7.
Timing Reference Clock
XTI/REF_CLK
8 MHz < RefClk <
50 MHz (XTI)
58 MHz (REF_CLK)
Timing Reference
Clock Divider
÷1
÷2
÷4
Internal Timing
Reference Clock
Fractional-N
Frequency
Synthesizer
8 MHz < SysClk < 14 MHz
PLL Output
N
RefClkDiv[1:0]
Figure 5. Internal Timing Reference Clock Divider
It should be noted that the maximum allowable input frequency of the XTI/REF_CLK pin is dependent
upon its configuration as either a crystal connection or external clock input. See the “AC Electrical Characteristics” on page 7 for more details.
For the lowest possible output jitter, attention should be paid to the absolute frequency of the Timing Reference Clock relative to the PLL Output frequency (CLK_OUT). To minimize output jitter, the Timing Reference Clock frequency should be chosen such that fRefClk is at least +/-15 kHz from fCLK_OUT*N/32
where N is an integer. Figure 6 shows the effect of varying the RefClk frequency around fCLK_OUT*N/32.
It should be noted that there will be a jitter null at the zero point when N = 32 (not shown in Figure 6). An
example of how to determine the range of RefClk frequencies around 12 MHz to be used in order to
achieve the lowest jitter PLL output at a frequency of 12.288 MHz is as follows:
f L ≤ f RefClk ≤ f H where:
CLK__OUT Jitter
180
= 12.288MHz × 0.96875 + 15kHz
= 11.919MHz
and
f H = f CLK_OUT × 32
------ – 15kHz
32
= 12.288MHz × 1 + 15kHz
Typical Base Band Jitter (psec)
f
CLK__OUT
f L = f CLK_OUT × 31
------ + 15kHz
32
160
140
120
100
-15 kHz
80
+15 kHz
60
40
20
-80
= 12.273MHz
*32/N
-60
-40
-20
0
20
40
60
80
Normalized REF__CLK Frequency (kHz)
Figure 6. REF_CLK Frequency vs a Fixed CLK_OUT
Referenced Control
Register Location
RefClkDiv[1:0] .......................“Reference Clock Input Divider (RefClkDiv[1:0])” on page 22
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5.1.2
Crystal Connections (XTI and XTO)
An external crystal may be used to generate RefClk. To accomplish this, a 20 pF fundamental mode parallel resonant crystal must be connected between the XTI and XTO pins as shown in Figure 7. As shown,
nothing other than the crystal and its load capacitors should be connected to XTI and XTO. Please refer
to the “AC Electrical Characteristics” on page 7 for the allowed crystal frequency range.
XTI
40 pF
XTO
40 pF
Figure 7. External Component Requirements for Crystal Circuit
5.1.3
External Reference Clock (REF_CLK)
For operation with an externally generated REF_CLK signal, XTI/REF_CLK should be connected to the
reference clock source and XTO should be left unconnected or pulled low through a 47 kΩ resistor to
GND.
5.2
5.2.1
Output to Input Frequency Ratio Configuration
User Defined Ratio (RUD)
The User Defined Ratio, RUD, is a 32-bit un-signed fixed-point number, stored in the Ratio register set,
which determines the basis for the desired input to output clock ratio. The 32-bit RUD is represented in a
12.20 format where the 12 MSBs represent the integer binary portion while the remaining 20 LSBs represent the fractional binary portion. The maximum multiplication factor is approximately 4096 with a resolution of 0.954 PPM in this configuration. See “Calculating the User Defined Ratio” on page 23 for more
information.
The status of internal dividers, such as the internal timing reference clock divider, are automatically taken
into account. Therefore RUD is simply the desired ratio of the output to input clock frequencies.
Referenced Control
Register Location
Ratio......................................“Ratio (Address 06h - 09h)” on page 21
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5.2.2
Ratio Modifier (R-Mod)
The Ratio Modifier is used to internally multiply/divide the RUD (the Ratio stored in the register space remains unchanged). The available options for RMOD are summarized in Table 1 on page 13.
The R-Mod value selected by RModSel[2:0] is always used in the calculation for the Effective Ratio
(REFF), see “Effective Ratio (REFF)” on page 13. If R-Mod is not desired, RModSel[2:0] should be left at
its default value of ‘000’, which corresponds to an R-Mod value of 1, thereby effectively disabling the ratio
modifier.
RModSel[2:0]
Ratio Modifier
000
1
001
2
010
4
011
8
100
0.5
101
0.25
110
0.125
111
0.0625
Table 1. Ratio Modifier
Referenced Control
Register Location
Ratio......................................“Ratio (Address 06h - 09h)” on page 21
RModSel[2:0] ........................“R-Mod Selection (RModSel[2:0])” section on page 20
5.2.3
Effective Ratio (REFF)
The Effective Ratio (REFF) is an internal calculation comprised of RUD and the appropriate modifiers, as
previously described. REFF is calculated as follows:
REFF = RUD • RMOD
To simplify operation the device handles some of the ratio calculation functions automatically (such as
when the internal timing reference clock divider is set). For this reason, the Effective Ratio does not need
to be altered to account for internal dividers.
Ratio modifiers which would produce an overflow or truncation of REFF should not be used; For example
if RUD is 1024 an RMOD of 8 would produce an REFF value of 8192 which exceeds the 4096 limit of the
12.20 format. In all cases, the maximum and minimum allowable values for REFF are dictated by the frequency limits for both the input and output clocks as shown in the “AC Electrical Characteristics” on
page 7.
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5.2.4
Ratio Configuration Summary
The RUD is the user defined ratio stored in the register space. R-Mod is applied if selected. The user defined ratio, and ratio modifier make up the effective ratio REFF, the final calculation used to determine the
output to input clock ratio. The effective ratio is then corrected for the internal dividers. The conceptual
diagram in Figure 8 summarizes the features involved in the calculation of the ratio values used to generate the fractional-N value which controls the Frequency Synthesizer.
Timing Reference Clock
(XTI/REF_CLK)
Divide
RefClkDiv[1:0]
Effective Ratio REFF
SysClk
Ratio Format
User Defined Ratio RUD
Ratio
12.20
RModSel[2:0]
RefClkDiv[1:0]
Ratio
Modifier
R Correction
Frequency
Synthesizer
PLL Outpu
N
Figure 8. Ratio Feature Summary
Referenced Control
Register Location
Ratio......................................“Ratio (Address 06h - 09h)” on page 21
RModSel[2:0] ........................“R-Mod Selection (RModSel[2:0])” section on page 20
RefClkDiv[1:0] .......................“Reference Clock Input Divider (RefClkDiv[1:0])” on page 22
5.3
PLL Clock Output
The PLL clock output pin (CLK_OUT) provides a buffered version of the output of the frequency synthesizer.
The driver can be set to high-impedance with the ClkOutDis bit.
The output from the PLL automatically drives a static low condition while the PLL is un-locked (when the
clock may be unreliable). This feature can be disabled by setting the ClkOutUnl bit, however the state
CLK_OUT may then be unreliable during an unlock condition.
ClkOutUnl
PLL Locked/Unlocked
0
0
2:1 Mux
1
2:1 Mux
PLL Output
ClkOutDis
0
PLL Clock Output
PLLClkOut
PLL Clock Output Pin
(CLK_OUT)
1
Figure 9. PLL Clock Output Options
Referenced Control
Register Location
ClkOutUnl..............................“Enable PLL Clock Output on Unlock (ClkOutUnl)” on page 22
ClkOutDis ..............................“PLL Clock Output Disable (ClkOutDis)” on page 20
14
DS759F1
CS2200-CP
5.4
Auxiliary Output
The auxiliary output pin (AUX_OUT) can be mapped, as shown in Figure 10, to one of three signals: reference clock (RefClk), additional PLL clock output (CLK_OUT), or a PLL lock indicator (Lock). The mux is controlled via the AuxOutSrc[1:0] bits. If AUX_OUT is set to Lock, the AuxLockCfg bit is then used to control
the output driver type and polarity of the LOCK signal (see section 8.6.1 on page 22). If AUX_OUT is set to
CLK_OUT the phase of the PLL Clock Output signal on AUX_OUT may differ from the CLK_OUT pin. The
driver for the pin can be set to high-impedance using the AuxOutDis bit.
AuxOutSrc[1:0]
Timing Reference Clock
(RefClk)
PLL Clock Output
(PLLClkOut)
AuxOutDis
Auxiliary Output Pin
(AUX_OUT)
3:1 Mux
PLL Lock/Unlock Indication
(Lock)
AuxLockCfg
Figure 10. Auxiliary Output Selection
Referenced Control
Register Location
AuxOutSrc[1:0]......................“Auxiliary Output Source Selection (AuxOutSrc[1:0])” on page 20
AuxOutDis .............................“Auxiliary Output Disable (AuxOutDis)” on page 19
AuxLockCfg...........................“AUX PLL Lock Output Configuration (AuxLockCfg)” section on page 22
5.5
Clock Output Stability Considerations
5.5.1
Output Switching
CS2200 is designed such that re-configuration of the clock routing functions do not result in a partial clock
period on any of the active outputs (CLK_OUT and/or AUX_OUT). In particular, enabling or disabling an
output, changing the auxiliary output source between REF_CLK and CLK_OUT, and the automatic disabling of the output(s) during unlock will not cause a runt or partial clock period.
The following exceptions/limitations exist:
•
Enabling/disabling AUX_OUT when AuxOutSrc[1:0] = 11 (unlock indicator).
•
Switching AuxOutSrc[1:0] to or from 11 (unlock indicator)
(Transitions between AuxOutSrc[1:0] = [00,10] will not produce a glitch).
•
Changing the ClkOutUnl bit while the PLL is in operation.
When any of these exceptions occur, a partial clock period on the output may result.
5.5.2
PLL Unlock Conditions
Certain changes to the clock inputs and registers can cause the PLL to lose lock which will affect the presence the clock signal on CLK_OUT. The following outlines which conditions cause the PLL to go unlocked:
•
DS759F1
Changes made to the registers which affect the Fraction-N value that is used by the Frequency Syn15
CS2200-CP
thesizer. This includes all the bits shown in Figure 8 on page 14.
•
5.6
Any discontinuities on the Timing Reference Clock, REF_CLK.
Required Power Up Sequencing
•
Apply power to the device. The output pins will remain low until the device is configured with a valid ratio
via the control port.
•
Write the desired operational configurations. The EnDevCfg1 and EnDevCfg2 bits must be set to 1 during the initialization register writes; the order does not matter.
–
The Freeze bit may be set prior to this step and cleared afterward to ensure all settings take effect
at the same time.
6. SPI / I²C CONTROL PORT
The control port is used to access the registers and allows the device to be configured for the desired operational
modes and formats. The operation of the control port may be completely asynchronous with respect to device inputs
and outputs. However, to avoid potential interference problems, the control port pins should remain static if no operation is required.
The control port operates with either the SPI or I²C interface, with the CS2200 acting as a slave device. SPI Mode
is selected if there is a high-to-low transition on the AD0/CS pin after power-up. I²C Mode is selected by connecting
the AD0/CS pin through a resistor to VD or GND, thereby permanently selecting the desired AD0 bit address state.
In both modes the EnDevCfg1 and EnDevCfg2 bits must be set to 1 for normal operation.
WARNING: All “Reserved” registers must maintain their default state to ensure proper functional operation.
Referenced Control
Register Location
EnDevCfg1 ............................“Enable Device Configuration Registers 1 (EnDevCfg1)” on page 21
EnDevCfg2 ............................“Enable Device Configuration Registers 2 (EnDevCfg2)” section on page 21
6.1
SPI Control
In SPI Mode, CS is the chip select signal; CCLK is the control port bit clock (sourced from a microcontroller),
and CDIN is the input data line from the microcontroller. Data is clocked in on the rising edge of CCLK. The
device only supports write operations.
Figure 11 shows the operation of the control port in SPI Mode. To write to a register, bring CS low. The first
eight bits on CDIN form the chip address and must be 10011110. The next eight bits form the Memory Address Pointer (MAP), which is set to the address of the register that is to be updated. The next eight bits are
the data which will be placed into the register designated by the MAP.
There is MAP auto increment capability, enabled by the INCR bit in the MAP register. If INCR is a zero, the
MAP will stay constant for successive read or writes. If INCR is set to a 1, the MAP will automatically increment after each byte is read or written, allowing block writes of successive registers.
6.2
I²C Control
In I²C Mode, SDA is a bidirectional data line. Data is clocked into and out of the device by the clock, SCL.
There is no CS pin. The AD0 pin forms the least-significant bit of the chip address and should be connected
to VD or GND as appropriate. The state of the AD0 pin should be maintained throughout operation of the
device.
16
DS759F1
CS2200-CP
CS
0
1
2
4
3
5
6
7
8
9
10 11 12 13 14 15 16 17
CCLK
CHIP ADDRESS
1
CDIN
0
0
1
1
1
MAP BYTE
1
0
6
INCR
5
4
3
DATA +n
DATA
2
1
0
7
6
1
7
0
6
1
0
Figure 11. Control Port Timing in SPI Mode
The signal timings for a read and write cycle are shown in Figure 12 and Figure 13. A Start condition is defined as a falling transition of SDA while the clock is high. A Stop condition is a rising transition while the
clock is high. All other transitions of SDA occur while the clock is low. The first byte sent to the CS2200 after
a Start condition consists of the 7-bit chip address field and a R/W bit (high for a read, low for a write). The
upper 6 bits of the 7-bit address field are fixed at 100111 followed by the logic state of the AD0 pin. The
eighth bit of the address is the R/W bit. If the operation is a write, the next byte is the Memory Address Pointer (MAP) which selects the register to be read or written. If the operation is a read, the contents of the register pointed to by the MAP will be output. Setting the auto increment bit in MAP allows successive reads or
writes of consecutive registers. Each byte is separated by an acknowledge bit. The ACK bit is output from
the CS2200 after each input byte is read and is input from the microcontroller after each transmitted byte.
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
19
24 25 26 27 28
SCL
CHIP ADDRESS (WRITE)
1
SDA
0
0
1
1
1
AD0
MAP BYTE
0
INCR
6
5
4
3
2
1
0
ACK
7
6
DATA +n
DATA +1
DATA
1
0
ACK
7
6
1
0
7
6
1
0
ACK
ACK
STOP
START
Figure 12. Control Port Timing, I²C Write
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
16
17 18
19
20 21 22 23 24 25 26 27 28
SCL
CHIP ADDRESS (WRITE)
SDA
1
0
0
1
STOP
MAP BYTE
1 1 AD0 0
INCR
6
5
4
3
2
1
ACK
START
CHIP ADDRESS (READ)
1
0
0
ACK
0
1
1
DATA
1 AD0 1
7
ACK
START
DATA +1
0
7
ACK
0
DATA + n
7
0
NO
ACK
STOP
Figure 13. Control Port Timing, I²C Aborted Write + Read
Since the read operation cannot set the MAP, an aborted write operation is used as a preamble. As shown
in Figure 12, the write operation is aborted after the acknowledge for the MAP byte by sending a stop condition. The following pseudocode illustrates an aborted write operation followed by a read operation.
Send start condition.
Send 100111x0 (chip address & write operation).
Receive acknowledge bit.
Send MAP byte, auto increment off.
Receive acknowledge bit.
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17
CS2200-CP
Send stop condition, aborting write.
Send start condition.
Send 100111x1(chip address & read operation).
Receive acknowledge bit.
Receive byte, contents of selected register.
Send acknowledge bit.
Send stop condition.
Setting the auto increment bit in the MAP allows successive reads or writes of consecutive registers. Each
byte is separated by an acknowledge bit.
6.3
Memory Address Pointer
The Memory Address Pointer (MAP) byte comes after the address byte and selects the register to be read
or written. Refer to the pseudocode above for implementation details.
6.3.1
Map Auto Increment
The device has MAP auto increment capability enabled by the INCR bit (the MSB) of the MAP. If INCR is
set to 0, MAP will stay constant for successive I²C writes or reads and SPI writes. If INCR is set to 1, MAP
will auto increment after each byte is read or written, allowing block reads or writes of successive registers.
7. REGISTER QUICK REFERENCE
This table shows the register and bit names with their associated default values.
EnDevCfg1 and EnDevCfg2 bits must be set to 1 for normal operation.
WARNING: All “Reserved” registers must maintain their default state to ensure proper functional operation.
Adr
Name
01h Device ID
p 19
02h Device Ctrl
p 19
03h Device Cfg 1
p 20
05h Global Cfg
p 21
06h
- 32-Bit Ratio
09h
16h Funct Cfg 1
p 22
17h Funct Cfg 2
p 22
18
7
6
5
4
3
2
1
Device4
Device3
Device2
Device1
Device0
Revision2
Revision1
0
0
0
0
0
x
x
Unlock
Reserved
Reserved
Reserved
Reserved
Reserved
AuxOutDis
x
x
x
0
0
0
0
RModSel2 RModSel1 RModSel0 Reserved
Reserved AuxOutSrc1 AuxOutSrc0
0
0
0
0
0
0
0
Reserved
Reserved
Reserved
Reserved
Freeze
Reserved
Reserved
0
0
0
0
0
0
0
MSB
...........................................................................................................................
MSB-8
...........................................................................................................................
LSB+15
...........................................................................................................................
LSB+7
...........................................................................................................................
Reserved AuxLockCfg Reserved RefClkDiv1 RefClkDiv0 Reserved
Reserved
0
0
0
0
0
0
0
Reserved
Reserved
Reserved ClkOutUnl Reserved
Reserved
Reserved
0
0
0
0
0
0
0
0
Revision0
x
ClkOutDis
0
EnDevCfg1
0
EnDevCfg2
0
MSB-7
MSB-15
LSB+8
LSB
Reserved
0
Reserved
0
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CS2200-CP
8. REGISTER DESCRIPTIONS
In I²C Mode all registers are read/write unless otherwise stated. In SPI mode all registers are write only. All “Reserved” registers must maintain their default state to ensure proper functional operation. The default state of each
bit after a power-up sequence or reset is indicated by the shaded row in the bit decode table and in the “Register
Quick Reference” on page 18.
Control port mode is entered when the device recognizes a valid chip address input on its I²C/SPI serial control pins
and the EnDevCfg1 and EnDevCfg2 bits are set to 1.
8.1
Device I.D. and Revision (Address 01h)
7
Device4
8.1.1
6
Device3
5
Device2
4
Device1
3
Device0
2
Revision2
1
Revision1
0
Revision0
2
Reserved
1
AuxOutDis
0
ClkOutDis
Device Identification (Device[4:0]) - Read Only
I.D. code for the CS2200.
8.1.2
Device[4:0]
Device
00000
CS2200.
Device Revision (Revision[2:0]) - Read Only
CS2200 revision level.
REVID[2:0]
8.2
Revision Level
100
B2 and B3
110
C1
Device Control (Address 02h)
7
Unlock
8.2.1
6
Reserved
5
Reserved
4
Reserved
3
Reserved
Unlock Indicator (Unlock) - Read Only
Indicates the lock state of the PLL.
8.2.2
Unlock
PLL Lock State
0
PLL is Locked.
1
PLL is Unlocked.
Auxiliary Output Disable (AuxOutDis)
This bit controls the output driver for the AUX_OUT pin.
DS759F1
AuxOutDis
Output Driver State
0
AUX_OUT output driver enabled.
1
AUX_OUT output driver set to high-impedance.
Application:
“Auxiliary Output” on page 15
19
CS2200-CP
8.2.3
PLL Clock Output Disable (ClkOutDis)
This bit controls the output driver for the CLK_OUT pin.
8.3
ClkOutDis
Output Driver State
0
CLK_OUT output driver enabled.
1
CLK_OUT output driver set to high-impedance.
Application:
“PLL Clock Output” on page 14
Device Configuration 1 (Address 03h)
7
RModSel2
8.3.1
6
RModSel1
5
RModSel0
4
Reserved
3
Reserved
2
AuxOutSrc1
1
AuxOutSrc0
0
EnDevCfg1
R-Mod Selection (RModSel[2:0])
Selects the R-Mod value, which is used as a factor in determining the PLL’s Fractional N.
8.3.2
RModSel[2:0]
R-Mod Selection
000
Left-shift R-value by 0 (x 1).
001
Left-shift R-value by 1 (x 2).
010
Left-shift R-value by 2 (x 4).
011
Left-shift R-value by 3 (x 8).
100
Right-shift R-value by 1 (÷ 2).
101
Right-shift R-value by 2 (÷ 4).
110
Right-shift R-value by 3 (÷ 8).
111
Right-shift R-value by 4 (÷ 16).
Application:
“Ratio Modifier (R-Mod)” on page 13
Auxiliary Output Source Selection (AuxOutSrc[1:0])
Selects the source of the AUX_OUT signal.
AuxOutSrc[1:0]
Auxiliary Output Source
00
RefClk.
01
Reserved.
10
CLK_OUT.
11
PLL Lock Status Indicator.
Application:
“Auxiliary Output” on page 15
Note: When set to 11, AuxLckCfg sets the polarity and driver type. See “AUX PLL Lock Output Configuration (AuxLockCfg)” on page 22.
20
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CS2200-CP
8.3.3
Enable Device Configuration Registers 1 (EnDevCfg1)
This bit, in conjunction with EnDevCfg2, configures the device for control port mode. These EnDevCfg
bits can be set in any order and at any time during the control port access sequence, however they must
both be set before normal operation can occur.
EnDevCfg1
Register State
0
Disabled.
1
Enabled.
Application:
“SPI / I²C Control Port” on page 16
Note: EnDevCfg2 must also be set to enable control port mode. See “SPI / I²C Control Port” on
page 16.
8.4
Global Configuration (Address 05h)
7
Reserved
8.4.1
6
Reserved
5
Reserved
4
Reserved
3
Freeze
2
Reserved
1
Reserved
0
EnDevCfg2
Device Configuration Freeze (Freeze)
Setting this bit allows writes to the Device Control and Device Configuration registers (address 02h - 04h)
but keeps them from taking effect until this bit is cleared.
8.4.2
FREEZE
Device Control and Configuration Registers
0
Register changes take effect immediately.
1
Modifications may be made to Device Control and Device Configuration registers (registers 02h-04h) without
the changes taking effect until after the FREEZE bit is cleared.
Enable Device Configuration Registers 2 (EnDevCfg2)
This bit, in conjunction with EnDevCfg1, configures the device for control port mode. These EnDevCfg
bits can be set in any order and at any time during the control port access sequence, however they must
both be set before normal operation can occur.
EnDevCfg2
Register State
0
Disabled.
1
Enabled.
Application:
“SPI / I²C Control Port” on page 16
Note: EnDevCfg1 must also be set to enable control port mode. See “SPI / I²C Control Port” on
page 16.
8.5
Ratio (Address 06h - 09h)
7
MSB
MSB-8
LSB+15
LSB+7
6
5
4
3
2
1
...................................................................................................................................................
...................................................................................................................................................
...................................................................................................................................................
...................................................................................................................................................
0
MSB-7
MSB-15
LSB+8
LSB
These registers contain the User Defined Ratio as shown in the “Register Quick Reference” section on
page 18. These 4 registers form a single 32-bit ratio value as shown above. See “Output to Input Frequency
Ratio Configuration” on page 12 and “Calculating the User Defined Ratio” on page 23 for more details.
DS759F1
21
CS2200-CP
8.6
Function Configuration 1 (Address 16h)
7
Reserved
8.6.1
6
AuxLockCfg
5
Reserved
4
RefClkDiv1
3
RefClkDiv0
2
Reserved
1
Reserved
0
Reserved
AUX PLL Lock Output Configuration (AuxLockCfg)
When the AUX_OUT pin is configured as a lock indicator (AuxOutSrc[1:0] = 11), this bit configures the
AUX_OUT driver to either push-pull or open drain. It also determines the polarity of the lock signal. If
AUX_OUT is configured as a clock output, the state of this bit is disregarded.
AuxLockCfg
AUX_OUT Driver Configuration
0
Push-Pull, Active High (output ‘high’ for unlocked condition, ‘low’ for locked condition).
1
Open Drain, Active Low (output ‘low’ for unlocked condition, high-Z for locked condition).
Application:
“Auxiliary Output” on page 15
Note: AUX_OUT is an unlock indicator, signalling an error condition when the PLL is unlocked. Therefore, the pin polarity is defined relative to the unlock condition.
8.6.2
Reference Clock Input Divider (RefClkDiv[1:0])
Selects the input divider for the timing reference clock.
8.7
RefClkDiv[1:0]
Reference Clock Input Divider
REF_CLK Frequency Range
00
÷ 4.
32 MHz to 56 MHz (50 MHz with XTI)
01
÷ 2.
16 MHz to 28 MHz
10
÷ 1.
8 MHz to 14 MHz
11
Reserved.
Application:
“Internal Timing Reference Clock Divider” on page 11
Function Configuration 2 (Address 17h)
7
Reserved
8.7.1
6
Reserved
5
Reserved
4
ClkOutUnl
3
Reserved
2
Reserved
1
Reserved
0
Reserved
Enable PLL Clock Output on Unlock (ClkOutUnl)
Defines the state of the PLL output during the PLL unlock condition.
22
ClkOutUnl
Clock Output Enable Status
0
Clock outputs are driven ‘low’ when PLL is unlocked.
1
Clock outputs are always enabled (results in unpredictable output when PLL is unlocked).
Application:
“PLL Clock Output” on page 14
DS759F1
CS2200-CP
9. CALCULATING THE USER DEFINED RATIO
Note:
The software for use with the evaluation kit has built in tools to aid in calculating and converting the User
Defined Ratio. This section is for those who are not interested in the software or who are developing their
systems without the aid of the evaluation kit.
Most calculators do not interpret the fixed point binary representation which the CS2200 uses to define the output
to input clock ratio (see Section 5.2.1 on page 12); However, with a simple conversion we can use these tools to
generate a binary or hex value which can be written to the Ratio register.
9.1
12.20 Format
To calculate the User Defined Ratio (RUD) to store in the register(s), divide the desired output clock frequency by the given input clock (RefClk). Then multiply the desired ratio by the scaling factor of 220 to get the
scaled decimal representation; then use the decimal to binary/hex conversion function on a calculator and
write to the register. A few examples have been provided in Table 2.
Scaled Decimal
Representation =
(output clock/input clock) • 220
Hex Representation of
Binary RUD
12.288 MHz/10 MHz=1.2288
1288490
00 13 A9 2A
11.2896 MHz/44.1 kHz=256
268435456
10 00 00 00
Desired Output to Input Clock Ratio
(output clock/input clock)
Table 2. Example 12.20 R-Values
DS759F1
23
CS2200-CP
10.PACKAGE DIMENSIONS
10L MSOP (3 mm BODY) PACKAGE DRAWING (Note 1)
N
D
E11
c
E
A2
A
∝
e
b
A1
SIDE VIEW
1 2 3
END VIEW
L
SEATING
PLANE
L1
TOP VIEW
DIM
MIN
INCHES
NOM
A
A1
A2
b
c
D
E
E1
e
L
L1
-0
0.0295
0.0059
0.0031
----0.0157
--
-----0.1181 BSC
0.1929 BSC
0.1181 BSC
0.0197 BSC
0.0236
0.0374 REF
MAX
0.0433
0.0059
0.0374
0.0118
0.0091
----0.0315
--
MIN
MILLIMETERS
NOM
NOTE
MAX
-0
0.75
0.15
0.08
----0.40
--
-----3.00 BSC
4.90 BSC
3.00 BSC
0.50 BSC
0.60
0.95 REF
1.10
0.15
0.95
0.30
0.23
----0.80
--
4, 5
2
3
Notes: 1. Reference document: JEDEC MO-187
2. D does not include mold flash or protrusions which is 0.15 mm max. per side.
3. E1 does not include inter-lead flash or protrusions which is 0.15 mm max per side.
4. Dimension b does not include a total allowable dambar protrusion of 0.08 mm max.
5. Exceptions to JEDEC dimension.
THERMAL CHARACTERISTICS
Parameter
Junction to Ambient Thermal Impedance
24
JEDEC 2-Layer
JEDEC 4-Layer
Symbol
Min
Typ
Max
Units
θJA
θJA
-
170
100
-
°C/W
°C/W
DS759F1
CS2200-CP
11.ORDERING INFORMATION
Product
Description
Package
Pb-Free
CS2200-CP
Clocking Device
10L-MSOP
Yes
CS2200-CP
Clocking Device
10L-MSOP
Yes
CDK2000
Evaluation Platform
-
Yes
Grade
Commercial
-
Temp Range Container
Order#
-10° to +70°C
Rail
CS2200CP-CZZ
-10° to +70°C
Tape and
Reel
CS2200CP-CZZR
-
-
CDK2000-CLK
12.REFERENCES
1. Audio Engineering Society AES-12id-2006: “AES Information Document for digital audio measurements Jitter performance specifications,” May 2007.
2. Philips Semiconductor, “The I²C-Bus Specification: Version 2,” Dec. 1998.
http://www.semiconductors.philips.com
DS759F1
25
CS2200-CP
13.REVISION HISTORY
Release
F1
Changes
Updated Period Jitter specification in “AC Electrical Characteristics” on page 7.
Updated Crystal and Ref Clock Frequency specifications in “AC Electrical Characteristics” on page 7.
Updated “Internal Timing Reference Clock Divider” on page 11 and added Figure 6 on page 11.
Contacting Cirrus Logic Support
For all product questions and inquiries, contact a Cirrus Logic Sales Representative.
To find one nearest you, go to www.cirrus.com
IMPORTANT NOTICE
Cirrus Logic, Inc. and its subsidiaries (“Cirrus”) believe that the information contained in this document is accurate and reliable. However, the information is subject
to change without notice and is provided “AS IS” without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant
information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale
supplied at the time of order acknowledgment, including those pertaining to warranty, indemnification, and limitation of liability. No responsibility is assumed by Cirrus
for the use of this information, including use of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third
parties. This document is the property of Cirrus and by furnishing this information, Cirrus grants no license, express or implied under any patents, mask work rights,
copyrights, trademarks, trade secrets or other intellectual property rights. Cirrus owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for use within your organization with respect to Cirrus integrated circuits or other products of Cirrus. This consent
does not extend to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE
IN PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICES, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK AND CIRRUS DISCLAIMS AND MAKES NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND
FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH A MANNER. IF THE CUSTOMER OR CUSTOMER’S CUSTOMER USES OR PERMITS THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY
INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS’ FEES AND COSTS, THAT MAY RESULT FROM OR ARISE IN CONNECTION WITH THESE USES.
Cirrus Logic, Cirrus, and the Cirrus Logic logo designs are trademarks of Cirrus Logic, Inc. All other brand and product names in this document may be trademarks
or service marks of their respective owners.
I²C is a trademark of Philips Semiconductor.
SPI is a trademark of Motorola, Inc.
26
DS759F1