MBRS1635 thru MBRS16150 Taiwan Semiconductor CREAT BY ART FEATURES Surface Mount Schottky Barrier Rectifiers - Low power loss, high efficiency - Ideal for automated placement - Guardring for overvoltage protection - High surge current capability - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA TO-263AB (D2PAK) Case: TO-263AB (D2PAK) Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - halogen-free Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix "H" on packing code meet JESD 201 class 2 whisker test Polarity: As marked Weight: 1.37 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL MBRS MBRS MBRS MBRS MBRS MBRS MBRS 1635 1645 1650 1660 1690 16100 16150 Unit Maximum repetitive peak reverse voltage VRRM 35 45 50 60 90 100 150 V Maximum RMS voltage VRMS 24 31 35 42 63 70 105 V Maximum DC blocking voltage VDC 35 45 50 60 90 100 150 V Maximum average forward rectified current IF(AV) 16 A Peak repetitive forward current (Rated VR, Square wave, 20KHz) IFRM 32 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 150 A Peak repetitive reverse surge Current (Note 1) IRRM 1 VF 0.63 0.75 0.85 0.95 0.57 0.65 0.82 0.92 0.3 0.1 7.5 5 Maximum instantaneous forward voltage (Note 2) IF=16A, TJ=25℃ IF=16A, TJ=125℃ Maximum reverse current @ rated VR TJ=25 ℃ TJ=125 ℃ Typical thermal resistance Operating junction temperature range Storage temperature range IR 0.5 0.5 15 10 A V mA O RθJC 1.5 TJ - 55 to +150 O C - 55 to +175 O C TSTG C/W Note 1: 2.0μs Pulse Width, f=1.0KHz Note 2: Pulse Test : 300μs Pulse Width, 1% Duty Cycle Document Number: DS_D1309064 Version: I13 MBRS1635 thru MBRS16150 Taiwan Semiconductor ORDERING INFORMATION PART NO. AEC-Q101 PACKING CODE GREEN COMPOUND QUALIFIED MBRS16xx (Note 1) PACKAGE PACKING D2PAK 800 / 13" Paper reel CODE RN Prefix "H" Suffix "G" C0 2 50 / Tube D PAK Note 1: "xx" defines voltage from 35V (MBRS1635) to 150V (MBRS16150) EXAMPLE AEC-Q101 PREFERRED P/N PART NO. PACKING CODE MBRS1660 RN MBRS1660 RN MBRS1660 RNG MBRS1660 RN MBRS1660HRN MBRS1660 QUALIFIED H GREEN COMPOUND CODE G DESCRIPTION Green compound RN AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) FIG. 2 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 20 AVERAGE FORWARD A CURRENT (A) 16 12 8 RESISTIVE OR INDUCTIVELOAD WITH HEATSINK 4 0 50 60 70 80 90 100 110 120 130 140 150 PEAK FORWARD SURGE CURRENT (A) FIG.1 FORWARD CURRENT DERATING CURVE 150 125 100 75 50 8.3ms Single Half Sine Wave JEDEC Method 25 0 1 10 FIG. 3 TYPICAL FORWARD CHARACTERISTICS FIG. 4 TYPICAL REVERSE CHARACTERISTICS 100 100 INSTANTANEOUS REVERSE A CURRENT (mA) Pulse Width=300μs 1% Duty Cycle INSTANTANEOUS FORWARD A CURRENT (A) 100 NUMBER OF CYCLES AT 60 Hz CASE TEMPERATURE (oC) 10 TJ=125℃ 1 TJ=25℃ 0.1 MBRS1635-1645 MBRS1650-16150 10 TJ=125℃ 1 0.1 TJ=75℃ 0.01 MBRS1635-1645 MBRS1650-16150 TJ=25℃ 0.001 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 FORWARD VOLTAGE (V) Document Number: DS_D1309064 1 1.1 1.2 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Version: I13 MBRS1635 thru MBRS16150 Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE 100 f=1.0MHz Vsig=50mVp-p TRANSIENT THERMAL IMPEDANCE A (℃/W) JUNCTION CAPACITANCE (pF) A 10000 10 1000 MBRS1635-1645 MBRS1650-16150 100 1 0.1 0.1 1 10 100 0.01 0.1 1 REVERSE VOLTAGE (V) 10 100 T-PULSE DURATION(s) PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) Min Max Min Max A - 10.5 - 0.413 B 14.60 15.88 0.575 0.625 C 2.41 2.67 0.095 0.105 D 0.68 0.94 0.027 0.037 E 2.29 2.79 0.090 0.110 F 4.44 4.70 0.175 0.185 G 1.14 1.40 0.045 0.055 H 1.14 1.40 0.045 0.055 I 8.25 9.25 0.325 0.364 J 0.36 0.53 0.014 0.021 K 2.03 2.79 0.080 0.110 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 10.8 0.425 B 8.3 0.327 C 1.1 0.043 D 3.5 0.138 E 16.9 0.665 F 9.5 0.374 G 2.5 0.098 MARKING DIAGRAM P/N = Specific Device Code G = Green Compound YWW = Date Code F = Factory Code Document Number: DS_D1309064 Version: I13 MBRS1635 thru MBRS16150 Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1309064 Version: I13