MC10H334 Quad Bus Driver/Receiver with Transmit and Receiver Latches Description http://onsemi.com The MC10H334 is a Quad Bus Driver/Receiver with transmit and receiver latches. When disabled, (OE = high) the bus outputs will fall to −2.0 V. Data to be transmitted or received is passed through its respective latch when the respective latch enable (DLE and RLE) is at a low level. Information is latched on the positive transition of DLE and RLE. The parameters specified are with 25 W loading on the bus drivers and 50 W loads on the receivers. MARKING DIAGRAMS* MC10H352L AWLYYWW Features • Propagation Delay, 1.6 ns Typical Data−to−Output • Improved Noise Margin 150 mV (Over Operating Voltage and • • • Temperature Range) Voltage Compensated MECL 10K™ Compatible Pb−Free Packages are Available* CDIP−20 L SUFFIX CASE 732 1 20 10H334G AWLYYWW 20 1 VCC 1 20 VCC03 BUS1 2 19 BUS2 BUS0 3 18 BUS3 VCC02 4 17 OE D1 5 16 D2 D0 6 15 D3 DLE 7 14 RLE R0 8 13 R3 R1 9 12 R2 VEE 10 11 VCC02 PLLC−20 FN SUFFIX CASE 775 A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION Figure 1. Pin Assignment See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. Pin assignment is for Dual−in−Line Package. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 7 1 Publication Order Number: MC10H334/D MC10H334 Table 1. MAXIMUM RATINGS Symbol Rating Unit VEE Power Supply (VCC = 0) Characteristic −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range − Plastic − Ceramic −55 to +150 −55 to +165 °C °C − Continuous − Surge Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1) 0° Symbol IE IinH Characteristic 25° 75° Min Max Min Max Min Max Unit Power Supply Current − 161 − 161 − 161 mA Input Current High Pins 5,6,15,16 Pins 7,14 Pin 17 − − − 397 460 520 − − − 273 297 357 − − − 273 297 357 0.5 − 0.5 − 0.3 − mA mA IinL Input Current Low VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc 1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Receiver outputs are terminated through a 50 W resistor to −2.0 V dc. Bus outputs are terminated through a 25 W resistor to −2.0 Vdc. Table 3. AC PARAMETERS 0° Symbol 25° 75° Min Max Min Max Min Max Propagation Delay Data−to−Bus Output DLE−to−Bus Output OE−to−Bus Output Bus−to−R0 RLE−to−R0 Data−to−Receiver R0 0.5 1.0 0.5 0.5 0.5 1.0 2.5 2.7 2.5 1.9 2.1 3.8 0.5 1.0 0.5 0.5 0.5 1.0 2.5 2.7 2.5 1.9 2.1 3.8 0.5 1.0 0.5 0.5 0.5 1.0 2.5 2.7 2.5 1.9 2.1 3.8 tr Rise Time 0.5 2.2 0.5 2.2 0.5 2.2 ns tf Fall Time 0.5 2.2 0.5 2.2 0.5 2.2 ns tpd Characteristic Unit ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. http://onsemi.com 2 MC10H334 LOGIC DIAGRAM 17 OE 7 DLE G 6 D0 D Q BUS0 3 5 D1 D Q BUS1 2 16 D2 D Q BUS2 19 15 D3 D Q BUS3 18 OUTPUT LATCH 14 RLE 8 R0 Q D 9 R1 Q D 12 R2 Q D 13 R3 Q D 10 VEE 1 VCC RECEIVER LATCH 4 VCC01 11 VCC02 20 VCC03 G DRIVER TRUTH TABLE RECEIVER TRUTH TABLE D DLE OE Busn+1 Bus RLE Rn+1 X X H −2.0 V Bus L Bus X H Rn D L L D X H L Busn ORDERING INFORMATION Package Shipping † MC10H334FN PLLC−20 46 Units / Rail MC10H334FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H334FNR2 PLLC−20 500 / Tape & Reel MC10H334FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H334L CDIP−20 19 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MC10H334 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E 0.007 (0.180) M T L−M B Y BRK −N− U N S 0.007 (0.180) M T L−M S S N S D −L− −M− Z W 20 D 1 V 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z T L−M S N H J 0.007 (0.180) M T L−M S −T− VIEW S SEATING PLANE F 0.007 (0.180) M T L−M S VIEW S N S N S K 0.004 (0.100) G S S K1 E G1 0.010 (0.250) S T L−M S VIEW D−D A C 0.010 (0.250) G1 X NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− N S MC10H334 PACKAGE DIMENSIONS CDIP−20 L SUFFIX CERAMIC DIP PACKAGE CASE 732−03 ISSUE E 20 11 1 10 NOTES: 1. LEADS WITHIN 0.010 DIAMETER, TRUE POSITION AT SEATING PLANE, AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONS A AND B INCLUDE MENISCUS. B A N H L C F D G K DIM A B C D F G H J K L M N J M SEATING PLANE INCHES MIN MAX 0.940 0.990 0.260 0.295 0.150 0.200 0.015 0.022 0.055 0.065 0.100 BSC 0.020 0.050 0.008 0.012 0.125 0.160 0.300 BSC 0_ 15_ 0.010 0.040 MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. 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Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 5 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. MC10H334/D