Microchip MCP2021T Lin transceiver with voltage regulator Datasheet

MCP2021/2
LIN Transceiver with Voltage Regulator
Features
Description
• The MCP2021 and MCP2022 are compliant with
LIN Bus Specifications 1.3, 2.0, and 2.1 and are
compliant to SAE J2602
• Support Baud Rates up to 20 Kbaud with
LIN-compatible output driver
• 43V load dump protected
• Very low EMI meets stringent OEM requirements
• Wide supply voltage, 6.0V - 18.0V continuous:
- Maximum input voltage of 30V
• Extended Temperature Range: -40 to +125°C
• Interface to PIC EUSART and standard USARTs
• Local Interconnect Network (LIN) bus pin:
- Internal pull-up resistor and diode
- Protected against ground shorts
- Protected against loss of ground
- High current drive
• Automatic thermal shutdown
• On-Board Voltage Regulator:
- Output voltage of 5.0V with tolerances of
±3% overtemperature range
- Available with alternate output voltage of
3.3V with tolerances of ±3% overtemperature
range
- Maximum continuous input voltage of 30V
- Internal thermal overload protection
- Internal short circuit current limit
- External components limited to filter
capacitor only and load capacitor
• Two low-power modes:
- Receiver on, Transmitter off, voltage
regulator on (≅ 85 µA)
- Receiver monitoring bus, Transmitter off,
voltage regulator off (≅ 16 µA)
The MCP2021/2 provides a bidirectional, half-duplex
communication physical interface to automotive, and
industrial LIN systems to meet the LIN bus specification
Revision 2.0. The device incorporates a voltage
regulator with 5V @ 50 mA or 3.3V @ 50 mA regulated
power supply output. The regulator is short circuit
protected, and is protected by an internal thermal shutdown circuit. The regulator has been specifically
designed to operate in the automotive environment and
will survive reverse battery connections, +43V load
dump transients, and double-battery jumps. The device
has been designed to meet the stringent quiescent
current requirements of the automotive industry.
MCP2021/2 family members:
• 8-pin PDIP, DFN and SOIC packages:
- MCP2021-330, LIN-compatible driver,
8-pin, 3.3V regulator
- MCP2021-500, LIN-compatible driver,
8-pin, 5.0V regulator
• 14-lead PDIP, TSSOP and SOIC packages with
RESET output:
- MCP2022-330, LIN-compatible driver,
14-pin, 3.3V regulator
- MCP2022-500, LIN-compatible driver,
14-pin, 5.0V regulator
Package Types
DFN-8, PDIP-8, SOIC-8
1
2
3
MCP2021
RXD
CS/LWAKE
VREG
TXD
4
8
7
6
5
FAULT/TXE
VBB
LBUS
VSS
PDIP-14, SOIC-14, TSSOP-14
1
14
2
13
VREG
TXD
3
RESET
NC
NC
© 2009 Microchip Technology Inc.
4
5
MCP2022
RXD
CS/LWAKE
12
11
10
6
9
7
8
FAULT/TXE
VBB
LBUS
VSS
NC
NC
NC
DS22018E-page 1
MCP2021/2
Block Diagram
Short Circuit
Protection
Thermal
Protection
RESET
Voltage
Regulator
VREG
Internal Circuits
VBB
Ratiometric
Reference
Wake-Up
Logic and
Power Control
RXD
~30 kΩ
CS/LWAKE
TXD
LBUS
OC
FAULT/TXE
VSS
Thermal
Protection
DS22018E-page 2
Short Circuit
Protection
© 2009 Microchip Technology Inc.
MCP2021/2
1.0
DEVICE OVERVIEW
1.2
The MCP2021/2 provides a physical interface between
a microcontroller and a LIN half-duplex bus. It is
intended for automotive and industrial applications with
serial bus speeds up to 20 Kbaud.
1.2.1
The MCP2021/2 provides a half-duplex, bidirectional
communications interface between a microcontroller
and the serial network bus. This device will translate
the CMOS/TTL logic levels to LIN level logic, and vice
versa.
1.2.2
The LIN specification 2.0 requires that the transceiver
of all nodes in the system be connected via the LIN pin,
referenced to ground and with a maximum external
termination resistance of 510Ω from LIN bus to battery
supply. The 510Ω corresponds to 1 Master and 16
Slave nodes.
The MCP2021-500 provides a +5V 50 mA regulated
power output. The regulator uses a LDO design, is
short-circuit-protected and will turn the regulator output
off if it falls below 3.5V. The MCP2021/2 also includes
thermal shutdown protection. The regulator has been
specifically designed to operate in the automotive
environment and will survive reverse battery connections, +43V load dump transients and double-battery
jumps. The other members of the MCP2021-330 family
output +3.3V at 50 mA with a turn-off voltage of 2.5V.
(see Section 1.6 “Internal Voltage Regulator”).
1.1
1.1.1
Optional External Protection
REVERSE BATTERY PROTECTION
Internal Protection
ESD PROTECTION
For component-level ESD ratings, please refer to the
maximum operation specifications.
GROUND LOSS PROTECTION
The LIN Bus specification states that the LIN pin must
transition to the recessive state when ground is
disconnected. Therefore, a loss of ground effectively
forces the LIN line to a hi-impedance level.
1.2.3
THERMAL PROTECTION
The thermal protection circuit monitors the die
temperature and is able to shut down the LIN
transmitter and voltage regulator.
There are three causes for a thermal overload. A
thermal shut down can be triggered by any one, or a
combination of, the following thermal overload
conditions.
• Voltage regulator overload
• LIN bus output overload
• Increase in die temperature due to increase in
environment temperature
Driving the TXD and checking the RXD pin makes it
possible to determine whether there is a bus contention
(Rx = low, Tx = high) or a thermal overload condition
(Rx = high, Tx = low).
FIGURE 1-1:
An external reverse-battery-blocking diode should be
used to provide polarity protection (see Example 1-1).
1.1.2
TRANSIENT VOLTAGE
PROTECTION (LOAD DUMP)
An external 43V transient suppressor (TVS) diode,
between VBB and ground, with a 50Ω transient
protection resistor (RTP) in series with the battery
supply and the VBB pin serve to protect the device from
power transients (see Example 1-1) and ESD events.
While this protection is optional, it should be
considered as good engineering practice.
THERMAL SHUTDOWN
STATE DIAGRAMS
LIN bus
shorted
to VBB
Output
Overload
Voltage
Regulator
Shutdown
Operation
Mode
Transmitter
Shutdown
Temp < SHUTDOWNTEMP Temp < SHUTDOWNTEMP
EQUATION 1-1:
RTP <= (VBBmin - 5.5) / 250 mA.
5.5V = VUVLO + 1.0V,
250 mA is the peak current at power-on when
VBB = 5.5V
© 2009 Microchip Technology Inc.
DS22018E-page 3
MCP2021/2
1.3
Modes of Operation
For an overview of all operational modes, please refer
to Table 1-1.
1.3.1
POWER-ON-RESET MODE
Upon application of VBB, the device enters Power-OnReset mode (POR). During this mode, the part
maintains the digital section in a reset mode and waits
until the voltage on pin VBB rises above the “ON”
threshold (Typ. 5.75V) to enter to the Ready mode. If
during the operation, the voltage on pin VBB falls below
the “OFF” threshold (Typ. 4.25V), the part comes back
to the Power-On-Reset mode.
1.3.2
POWER-DOWN MODE
In the Power-down mode, the transmitter and the
voltage regulator are both off. Only the receiver
section, and the CS/LWAKE pin wake-up circuits are in
operation. This is the lowest power mode.
If any bus activity (e.g. a BREAK character) or CS/
LWAKE going to a high level should occur during
Power-down mode, the device will immediately enter
the Ready mode, enable the voltage regulator, and
once the output has stabilized (approximately 0.3 ms to
1.2 ms), go to the Operation mode.
Note:
The above time interval < 1.2 ms assumes
12V VBB input and no thermal shutdown
event.
The part will also enter the Ready mode, followed by
the Operation mode, if the CS/LWAKE pin should
become active true (‘1’).
1.3.4
OPERATION MODE
In this mode, all internal modules are operational.
The MCP2021/2 will go into the Power-down mode on
the falling edge of CS/LWAKE.
1.3.5
TRANSMITTER OFF MODE
Whenever the FAULT/TXE signal is low and the LBUS
transmitter is off.
The transmitter may be re-enabled whenever the
FAULT/TXE signal returns high, either by removing the
internal fault condition or the CPU returning the FAULT/
TXE high. The transmitter will not be enabled if the
FAULT/TXE pin is brought high when the internal fault
is still present.
The transmitter is also turned off whenever the voltage
regulator is unstable or recovering from a fault. This
prevents unwanted disruption of the bus during times of
uncertain operation.
1.3.5.1
Wake-up
The Wake-up sub module observes the LBUS in order
to detect bus activity. Bus activity is detected when the
voltage on the LBUS stays below a threshold of
approximately 3V for at least a typical duration of 10 µs.
Such a condition causes the device to leave the Powerdown mode.
FIGURE 1-2:
CS/LWAKE
= false
Power-down
Mode
The part may only enter the Power-down mode after
going through an Operation mode step.
1.3.3
READY MODE
Upon entering the Ready mode, the voltage regulator
and receiver threshold detect circuit are powered up.
The transmitter remains in power down mode. The
device is ready to receive data but not to transmit. If a
microcontroller is being driven by the voltage regulator
output, it will go through a Power-on Reset and initialization sequence. The LIN pin is in the recessive state.
The device will stay in the Ready mode until the output
of the voltage regulator has stabilized and CS/LWAKE
pin is true (‘1’). After VREG is OK and CS/LWAKE pin is
true, the transmitter is enabled and the part enters the
Operation mode.
OPERATIONAL MODES
STATE DIAGRAMS
Transmitter
Off
Mode
Bus Activity
OR
CS/LWAKE = true
CS/LWAKE
= false
Operation
Mode
Ready
Mode
VBBOK = true
FAULT/TXE
= false
FAULT/TXE = true
VREGOK = true
AND
CS/LWAKE = true
POR
Start
Note:
While the MCP2021/2 is in shutdown, TXD
should not be actively driven high or it may
power internal logic through the ESD
diodes and may damage the device.
On Power-on of the VBB supply pin, the component will
stay in the Ready mode if CS/LWAKE is low. If CS/
LWAKE is high, the device will immediately enter the
Operation mode.
DS22018E-page 4
© 2009 Microchip Technology Inc.
MCP2021/2
TABLE 1-1:
OVERVIEW OF OPERATIONAL MODES
Transmitter
Receiver
Voltage
Regulator
POR
OFF
OFF
OFF
Read CS/LWAKE, if LOW, then READY,
if HIGH, Operational mode
READY
OFF
Activity
Detect
ON
If CS/LWAKE high level, then Operation
mode
OPERATION
ON
ON
ON
If CS/LWAKE low level, then Power down Normal
If FAULT/TXE low level, then Transmitter- Operation
Off mode
mode
POWER DOWN
OFF
Activity
Detect
OFF
On LIN bus falling, go to READY mode.
On CS/LWAKE high level, go to
Operational mode
TRANSMITTEROFF
OFF
ON
ON
If CS/LWAKE low level, then Power down
If FAULT/TXE high, then Operation mode
State
1.4
Operation
Comments
Bus Off state
Low Power
mode
Typical Applications
EXAMPLE 1-1:
TYPICAL MCP2021 APPLICATION
+12
+12
RTP(5)
WAKE-UP
43V(5)
CF
CG
220 kΩ
VDD
VREG
TXD
TXD
Master Node Only
+12
VBB
1 kΩ
RXD
RXD
I/O
CS/LWAKE
(3)
LIN Bus
LBUS
27V
(4)
FAULT/TXE
I/O
100nF
VSS
Note 1: See Figure 2-3 for correct capacity and ESR for stable operation..
2: CF is the filter capacitor for the external voltage supply.
3: This diode is only needed if CS/LWAKE is connected to 12V supply.
4: Transient suppressor diode. Vclamp L = 43V.
5: These components are required for additional load dump protection above 43V..
© 2009 Microchip Technology Inc.
DS22018E-page 5
MCP2021/2
EXAMPLE 1-2:
TYPICAL MCP2022 APPLICATION
+12
+12
RTP(5)
WAKE-UP
43V(5)
CF
CG
220 kΩ
VDD
VREG
TXD
TXD
Master Node Only
+12
VBB
1 kΩ
I/O
CS/LWAKE
(3)
LIN Bus
LBUS
RXD
RXD
27V
(4)
FAULT/TXE
I/O
INT
RESET
VSS
100 nF
VDD (6)
Note 1: See Figure 2-3 for correct capacity and ESR for stable operation.
2: CF is the filter capacitor for the external voltage supply.
3: This diode is only needed if CS/LWAKE is connected to 12V supply.
4: Transient suppressor diode. Vclamp L = 43V.
5: These components are required for additional load dump protection above 43V.
6: Required if CPU does not have internal pullup.
DS22018E-page 6
© 2009 Microchip Technology Inc.
MCP2021/2
EXAMPLE 1-3:
TYPICAL MCP2022 APPLICATION
+12
+12
RTP(5)
WAKE-UP
43V(5)
CF
CG
220 kΩ
VDD
VREG
TXD
TXD
Master Node Only
+12
VBB
1 kΩ
I/O
I/O
27V
CS/LWAKE
(3)
LIN Bus
LBUS
RXD
RXD
(4)
FAULT/TXE
1 kΩ
RESET
MCLR
VSS
100 nF
5V
Note 1: See Figure 2-3 for correct capacity and ESR for stable operation.
2: CF is the filter capacitor for the external voltage supply.
3: This diode is only needed if CS/LWAKE is connected to 12V supply.
4: Transient suppressor diode. Vclamp L = 43V.
5: These components are required for additional load dump protection above 43V.
FIGURE 1-3:
TYPICAL LIN NETWORK CONFIGURATION
40m
+ Return
LIN bus
1 kΩ
VBB
LIN bus
MCP202X
LIN bus
MCP202X
Slave 1
µC
LIN bus
MCP202X
LIN bus
MCP202X
Slave 2
µC
Slave n <16
µC
Master
µC
© 2009 Microchip Technology Inc.
DS22018E-page 7
MCP2021/2
1.5
Pin Descriptions
TABLE 1-1:
PINOUT DESCRIPTIONS
Devices
Function
Pin
Name
8-Pin
DFN,
PDIP,
SOIC
14-Pin
PDIP,
SOIC,
TSSOP
Pin
Type
VREG
3
3
O
Power Output
VSS
5
11
P
Ground
VBB
7
13
P
Battery Supply
TXD
4
4
I
Transmit Data Input (TTL)
RXD
1
1
O
Receive Data Output (CMOS)
LBUS
6
12
I/O
LIN bus (bidirectional)
CS/LWAKE
2
2
TTL
Chip Select (TTL)
FAULT/TXE
8
14
OD
Fault Detect Output, Transmitter Enable (OD)
RESET
—
5
OD
RESET signal Output (OD)
Normal Operation
Legend: TTL = TTL input buffer, ST = Schmitt Trigger input buffer, OD = Open-Drain output,
P = Power, O = Output, I = Input
1.5.1
POWER OUTPUT (VREG)
Positive Supply Voltage Regulator Output pin.
1.5.2
GROUND (VSS)
Ground pin.
1.5.3
BATTERY (VBB)
Battery Positive Supply Voltage pin. This pin is also the
input for the internal voltage regulator.
1.5.4
TRANSMIT DATA INPUT (TXD)
The Transmit Data Input pin has an internal pull-up to
VREG. The LIN pin is low (dominant) when TXD is low,
and high (recessive) when TXD is high.
For extra bus security, TXD is internally forced to ‘1’
when VREG is less than 1.8V (typ.).
In case the thermal protection detects an over-temperature condition while the signal TXD is low, the
transmitter is shutdown. The recovery from the thermal
shutdown is equal to adequate cooling time.
1.5.5
RECEIVE DATA OUTPUT (RXD)
The Receive Data Output pin is a standard CMOS
output and follows the state of the LIN pin.
1.5.6
LIN BUS
The bidirectional LIN bus Interface pin is the driver unit
for the LIN pin and is controlled by the signal TXD. LIN
has an open collector output with a current limitation.
To reduce EMI, the edges during the signal changes
are slope-controlled. To further reduce radiated
emissions, the LBUS pin has corner-rounding control for
both falling and rising edges.
DS22018E-page 8
The internal LIN Receiver observes the activities on
LIN bus, and generates the output signal RXD that
follows the state of the LBUS. A 1st degree 1 MHz, lowpass input filter is placed to maintain EMI immunity.
1.5.7
CS/LWAKE
Chip Select Input pin. A internal pull-down resistor will
keep the CS/LWAKE pin low. This is done to ensure
that no disruptive data will be present on the bus while
the microcontroller is executing a Power-on Reset and
I/O initialization sequence. The pin must see a high
level to activate the transmitter.
If CS/LWAKE= ‘0’ when the VBB supply is turned on,
the device stays in Ready mode (Low-power mode). In
Ready mode, both the receiver and the voltage
regulator are on and the LIN transmitter driver is off.
If CS/LWAKE = ‘1’ when the VBB supply is turned on,
the device will proceed to the Operation mode as soon
as the VREG output has stabilised.
This pin may also be used as a local wake-up input
(See Example 1-1). In this implementation, the microcontroller will set the I/O pin that controls the CS/
LWAKE as an high-impedance input. The internal pulldown resistor will keep the input low. An external
switch, or other source, can then wake-up both the
transceiver and the microcontroller.
Note:
CS/LWAKE should not be tied directly to
VREG as this could force the MCP202x into
Operation
Mode
before
the
microcontroller is initialized.
© 2009 Microchip Technology Inc.
MCP2021/2
1.5.8
FAULT/TXE
Fault Detect output and Transmitter Enable input
bidirectional pin.
This pin is an open-drain output. Its state is defined as
shown in Table 1-2. The transmitter driver is disabled
whenever this pin is low (‘0’), either from an internal
fault condition or by external drive. This allows the
transmitter to be placed in an off state and still allow the
voltage regulator to operate. Refer to Table 1-1.
The FAULT/TXE also signals a mismatch between the
TXD input and the LBUS level. This can be used to
detect a bus contention. Since the bus exhibits a
propagation delay, the sampling of the internal
compare is debounced to eliminate false faults.
This pin has an internal
approximately 750 kΩ.
pull-up
resistor
of
Note 1: The FAULT/TXE pin is true (0) whenever
the internal circuits have detected a short
or thermal excursion and have disabled
the LBUS output driver.
2: FAULT/TXE is true (0) when VREG not OK
and has disabled the LBUS output driver.
The FAULT/TXE pin sampled at a rate faster than every
10 µs.
TABLE 1-2:
FAULT/TXE TRUTH TABLE
FAULT/TXE
TXD
In
RXD
Out
LINBUS
I/O
Thermal
Override
L
H
VBB
H
H
L
Definition
External
Input
Driven
Output
OFF
H
L
FAULT, TXD driven low, LINBUS shorted to
VBB (Note 1)
VBB
OFF
H
H
OK
L
GND
OFF
H
H
OK
H
L
GND
OFF
H
H
OK, data is being received from the LINBUS
x
x
VBB
ON
H
L
FAULT, Tranceiver in thermal shutdown
x
x
VBB
x
L
x
NO FAULT, the CPU is commanding the
tranceiver to turn off the transmitter driver
Legend: x = don’t care
Note 1: The FAULT/TXE is valid after approximately 25 µs after TXD falling edge. This is to eliminate false fault
reporting during bus propagation delays.
1.5.9
RESET
RESET is an open-drain output pin. This pin tracks an
internal signal that tracks the internal system voltage
has reached a valid, stable level. As long as the internal
voltage is valid, this pin will remain high (‘1’). When the
system voltage drops below the minimum required, the
voltage regulator will shut down and immediately
convert the RESET output to (‘0’). When connected to
a micro-controller input, this can provide a warning that
the voltage regulator is shutting down (see Example 12). Alternately, it can act as an external brown-out by
connecting the RESET output to MCLR (see
Example 1-3). In addition to monitoring the internal
voltage, RESET is asserted immediately upon entering
the Powerdown mode.
© 2009 Microchip Technology Inc.
DS22018E-page 9
MCP2021/2
1.6
1.6.1
Internal Voltage Regulator
5.0V REGULATOR
The MCP2021 has a low-drop-out voltage, positive
regulator capable of supplying 5.00 VDC ±3% at up to
50 mA of load current over the entire operating
temperature range of -40°C to +125°C. With a load
current of 50 mA, the minimum input to output voltage
differential required for the output to remain in
regulation is typically +0.5V (+1V maximum over the
full operating temperature range). Quiescent current is
less than 100 µA with a full 50 mA load current when
the input to output voltage differential is greater than
+3.00V.
When the input voltage (VBB) drops below the
differential needed to provide stable regulation, the
output VREG) will track the input down to approximately
+4.25V. The regulator will turn off the output at this
point. This will allow PIC® microcontrollers, with
internal POR circuits, to generate a clean arming of the
Power-on Reset trip point. The regulator output will
stay off until VBB is above +5.75 VDC.
In the start phase, the device must see at least 6.0V to
initiate operation during power up. In the Power-down
mode, the VBB monitor will be turned off.
Note:
The regulator requires an external output bypass
capacitor for stability. See Figure 2-3 for correct capacity and ESR for stable operation.
Designed for automotive applications, the regulator will
protect itself from double-battery jumps and up to +43V
load dump transients. The voltage regulator has both
short-circuit and thermal shutdown protection built-in.
Regarding the correlation between VBB, VREG and IDD,
please refer to Figure 1-5 through 1-7. When the input
voltage (VBB) drops below the differential needed to
provide stable regulation, the output Vreg will track the
input down to approximately 3.5V, at which point the
regulator will turn off. This will allow microcontrollers
with internal POR circuits to generate a clean arming of
the Power-on Reset trip point. The MCP2021 will then
monitor VBB and turn on the regulator when Vbb is
6.0V.
FIGURE 1-4:
The regulator has an overload current
limiting of approximately 100 mA. During a
short circuit, the VREG is monitored. If
VREG is lower than 3.5V, the VREG will turn
off. After a recovery time of about three
milliseconds, the VREG will be checked
again. If there is no short circuit, (VREG >
3.5V) then the VREG will be switched back
on.
The regulator has a thermal shutdown. If the thermal
protection circuit detects an over temperature
condition, and the signals TXD and RXD are LOW, or
TXD is HIGH, the regulator will shut down. The recovery
from the thermal shutdown is equal to adequate cooling
time.
VOLTAGE REGULATOR BLOCK DIAGRAM
Pass
Element
VREG
VBB
Sampling
Network
Fast
Transient
Loop
Buffer
VSS
VREF
DS22018E-page 10
© 2009 Microchip Technology Inc.
MCP2021/2
1.6.2
3.3V REGULATOR
A metal option provides for a alternate 3.30 VDC ±3%
at up to 50 mA of load current over the entire operating
temperature range of -40°C to +125°C. All
specifications given above for the 5.0V operation apply
except for any difference noted here.
Note:
The regulator has an overload current
limiting of approximately 100 mA. If VREG
is lower than 2.5V, the VREG will turn off.
The same input tracking of 4.25V applies the 3.3V
regulator.
FIGURE 1-5:
VOLTAGE REGULATOR OUTPUT ON POWER-ON RESET
VBB
V
8
6
4
2
0
t
VREG
V
5.0
3.5
3
0
t
(1)
Note 1:
2:
3:
4:
© 2009 Microchip Technology Inc.
(2)
(3)
Start-up, VBB < 5.75V, regulator off.
VBB > 5.75V, regulator on.
VBB ≤ 5.5V, regulator tracks VBB
VBB < 4.25V, regulator will turn off
DS22018E-page 11
MCP2021/2
FIGURE 1-6:
VOLTAGE REGULATOR OUTPUT ON POWER DIP
VBB
V
12
8
6
4
3.5
2
0
t
VREG
V
5
4
3.5
3
0
t
(1)
Note 1:
2:
3:
4:
DS22018E-page 12
(2) (3) (4)
Voltage regulator on.
VBB ≤ 5.5V, regulator tracks VBB until VBB < 4.25V.
VREG < 3.5V, regulator is off.
VBB > 5.75V, regulator on.
© 2009 Microchip Technology Inc.
MCP2021/2
FIGURE 1-7:
VOLTAGE REGULATOR OUTPUT ON OVERCURRENT SITUATION
IREG
mA
50
0
6
t
VREG
V
5.0
3.5
3
0
t
(1)
Note 1:
2:
1.7
(2)
IREG less than 50 mA, regulator on.
After IREG exceeds IREGmax, voltage regulator output will be reduced
until VREG off is reached.
ICSP™ Considerations
The following should be considered when the
MCP2021/2 is connected to pins supporting in-circuit
programming:
• Power used for programming the microcontroller
can be supplied from the programmer, or from the
MCP2021/2.
• The voltage on VREG should not exceed the
maximum output voltage of VREG.
© 2009 Microchip Technology Inc.
DS22018E-page 13
MCP2021/2
NOTES:
DS22018E-page 14
© 2009 Microchip Technology Inc.
MCP2021/2
2.0
ELECTRICAL CHARACTERISTICS
2.1
Absolute Maximum Ratings†
VIN DC Voltage on RXD and TXD ........................................................................................................ -0.3 to VREG+0.3V
VIN DC Voltage on FAULT and RESET.........................................................................................................-0.3 to +5.5V
VIN DC Voltage on CS/LWAKE.......................................................................................................................-0.3 to +43V
VBB Battery Voltage, non-operating (LIN bus recessive, no regulator load, t < 60s) .....................................-0.3 to +43V
VBB Battery Voltage, transient ISO 7637 Test 1 ......................................................................................................-200V
VBB Battery Voltage, transient ISO 7637 Test 2a ...................................................................................................+150V
VBB Battery Voltage, transient ISO 7637 Test 3a ....................................................................................................-300V
VBB Battery Voltage, transient ISO 7637 Test 3b ...................................................................................................+200V
VBB Battery Voltage, continuous ....................................................................................................................-0.3 to +30V
VLBUS Bus Voltage, continuous.......................................................................................................................-18 to +30V
VLBUS Bus Voltage, transient (Note 1)............................................................................................................-27 to +43V
ILBUS Bus Short Circuit Current Limit ....................................................................................................................200 mA
ESD protection on LIN, VBB (IEC 61000-4-2, 330 Ohm, 150 pF) (Note 3) .............................................. minimum ±9 kV
ESD protection on LIN, VBB (Charge Device Model) (Note 2).............................................................................. ±1500V
ESD protection on LIN, VBB (Human Body Model, 1 kOhm, 100 pF) (Note 4) ....................................................... ±8 kV
ESD protection on LIN, VBB (Machine Model) (Note 2) ..........................................................................................±800V
ESD protection on all other pins (Human Body Model) (Note 2) ............................................................................ > 4 kV
Maximum Junction Temperature ............................................................................................................................. 150°C
Storage Temperature .................................................................................................................................. -55 to +150°C
Note 1: ISO 7637/1 load dump compliant (t < 500 ms).
2: According to JESD22-A114-B.
3:
According to IBEE, without bus filter.
4: Limited by Test Equipment.
† NOTICE: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
© 2009 Microchip Technology Inc.
DS22018E-page 15
MCP2021/2
2.2
DC Specifications
DC Specifications
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBB = 6.0V to 18.0V
TA = -40°C to +125°C
CLOADREG = 10 µF
Parameter
Sym
VBB Quiescent Operating
Current
IBBQ
Min.
Typ.
Max.
Units
Conditions
115
210
µA
IOUT = 0 mA,
LBUS recessive
—
120
215
µA
VOUT = 3.3V
—
90
190
µA
With VREG on, transmitter
off, receiver on, FAULT/
TXE = VIL, CS = VIH
Power
VBB Transmitter-off
Current
IBBTO
—
95
210
µA
VOUT = 3.3V
VBB Power-down Current
IBBPD
—
16
26
µA
With VREG powered-off,
receiver on and transmitter
off, FAULT/TXE = VIH,
TXD = VIH, CS = VIL)
IBBNOGND
-1
—
1
mA
VBB = 12V, GND to VBB,
VLIN = 0-18V
High Level Input Voltage
(TXD, FAULT/TXE)
VIH
2.0 or
(0.25VREG
+0.8)
—
VREG
+0.3
V
Low Level Input Voltage
(TXD, FAULT/TXE)
VIL
-0.3
—
0.15 VREG
V
High Level Input Current
(TXD, FAULT/TXE)
IIH
-2.5
—
—
µA
Input voltage = 0.8*VREG
Low Level Input Current
(TXD, FAULT/TXE)
IIL
-10
—
—
µA
Input voltage = 0.2*VREG
Pull-up Current on Input
(TXD)
IPUTXD
-3.0
—
—
µA
~800 kΩ internal pull-up to
VREG @ VIH = 0.7*VREG
High Level Input Voltage
(CS/LWAKE)
VIH
0.7VREG
—
VBB
V
Through a current-limiting
resistor
Low Level Input Voltage
(CS/LWAKE)
VIL
-0.3
—
0.3VREG
V
High Level Input Current
(CS/LWAKE)
IIH
—
—
7.0
µA
Input voltage = 0.8*VREG
Low Level Input Current
(CS/LWAKE)
IIL
—
—
3.0
µA
Input voltage = 0.2*VREG
IPDCS
—
—
6.0
µA
~1.3MΩ internal pull-down
to VSS @ VIH = 3.5V
VBB Current with VSS
Floating
Microcontroller Interface
Pull-down Current on
Input (CS/LWAKE)
Note 1:
2:
3:
Internal current limited. 2.0 ms maximum recovery time (RLBUS = 0Ω, TX = 0.4 VREG, VLBUS = VBB).
For design guidance only, not tested.
Node has to sustain the current that can flow under this condition; bus must be operational under this
condition.
DS22018E-page 16
© 2009 Microchip Technology Inc.
MCP2021/2
2.2
DC Specifications (Continued)
DC Specifications
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBB = 6.0V to 18.0V
TA = -40°C to +125°C
CLOADREG = 10 µF
Parameter
Sym
Min.
Typ.
Max.
Units
High Level Input Voltage
VIH(LBUS)
0.6 VBB
Low Level Input Voltage
VIL(LBUS)
-8
Conditions
—
18
V
Recessive state
—
0.4 VBB
V
Dominant state
VIH(LBUS) - VIL(LBUS)
Bus Interface
VHYS
—
—
0.175 VBB
V
Low Level Output Current
Input Hysteresis
IOL(LBUS)
40
—
200
mA
Output voltage = 0.1 VBB,
VBB = 12V
Pull-up Current on Input
IPU(LBUS)
5
—
180
µA
~30 kΩ internal pull-up
@ VIH (LBUS) = 0.7 VBB
ISC
50
—
200
mA
(Note 1)
VOH(LBUS)
0.8 VBB
—
VBB
V
Low Level Output Voltage
VOLLO
(LBUS)
—
—
0.2 VBB
V
Input Leakage Current (at
the receiver during
dominant bus level)
IBUS_PAS_DOM
-1
—
—
mA
Driver off,
VBUS = 0V,
VBAT = 12V
Leakage Current
(disconnected from
ground)
IBUS_NO_GND
-1
—
+1
mA
GNDDEVICE = VBAT,
0V < VBUS < 18V,
VBAT = 12V
IBUS
—
—
10
µA
VBAT = GND,
0 < VBUS < 18V,
TA = -40°C to +85°C
(Note 3)
50
µA
TA = +85°C to +125°C
0.525 VBB
V
VBUS_CNT = (VIL (LBUS) +
VIH (LBUS))/2
47
kΩ
Short Circuit Current
Limit
High Level Output
Voltage
Leakage Current
(disconnected from VBAT)
Receiver Center Voltage
Slave Termination
Note 1:
2:
3:
VBUS_CNT
0.475 VBB
0.5
VBB
Rslave
20
30
= 0Ω, TX = 0.4 VREG, VLBUS = VBB).
Internal current limited. 2.0 ms maximum recovery time
For design guidance only, not tested.
Node has to sustain the current that can flow under this condition; bus must be operational under this
condition.
© 2009 Microchip Technology Inc.
(RLBUS
VOH(LBUS) must be at least
0.8 VBB
DS22018E-page 17
MCP2021/2
2.2
DC Specification (Continued)
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBB = 6.0V to 18.0V
TA = -40°C to +125°C
CLOADREG = 10 µF
DC Specifications
Parameter
Sym
Min.
Typ.
Max.
Units
Conditions
VOUT
4.85
5.00
5.15
V
0 mA < IOUT < 50 mA,
ΔVOUT2
—
10
50
mV
5 mA < IOUT < 50 mA
refer to Section 1.6
“Internal Voltage
Regulator”
Voltage Regulator - 5.0V
Output Voltage
Load Regulation
IVRQ
—
—
25
µA
IOUT = 0 mA, (Note 2)
Power Supply Ripple
Reject
PSRR
—
—
50
dB
1 VPP @10-20 kHz
CLOAD = 10 µf,
ILOAD = 50 mA
Output Noise Voltage
eN
—
—
100
Quiescent Current
µVRMS 10 Hz – 40 MHz
CFILTER = 10 µf,
CBP = 0.1 µf, CLOAD 10 µf,
ILOAD = 50 mA
Shutdown Voltage
VSD
3.5
—
4.0
V
Input Voltage to Maintain
Regulation
VBB
6.0
—
18.0
V
Input Voltage to Turn Off
Output
VOFF
4.0
—
4.5
V
Input Voltage to Turn On
Output
VON
5.5
—
6.0
V
Note 1:
2:
3:
See Figure 1-5
Internal current limited. 2.0 ms maximum recovery time (RLBUS = 0Ω, TX = 0.4 VREG, VLBUS = VBB).
For design guidance only, not tested.
Node has to sustain the current that can flow under this condition; bus must be operational under this
condition.
FIGURE 2-1:
MCP2021-500 SAFE OPERATING RANGE
60
Voltage Regulator Load (mA)
12V DFN
50
12V SOIC
18V DFN
40
18V SOIC
30
20
10
-40
-34
-28
-22
-16
-10
-4
2
8
14
20
26
32
38
44
50
56
62
68
74
80
86
92
98
104
110
116
122
0
Temperature (°C)
DS22018E-page 18
© 2009 Microchip Technology Inc.
MCP2021/2
2.2
DC Specification (Continued)
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBB = 6.0V to 18.0V
TA = -40°C to +125°C
CLOADREG = 10 µF
DC Specifications
Parameter
Sym
Min.
Typ.
Max.
Units
Conditions
Output Voltage
VOUT
3.20
3.30
3.40
V
Line Regulation
ΔVOUT1
—
10
50
mV
IOUT = 1 mA,
6.0V < VBB < 18V
Load Regulation
ΔVOUT2
—
10
50
mV
5 mA < IOUT < 50 mA
Refer to Section 1.6
“Internal Voltage
Regulator”
Voltage Regulator - 3.3V
Quiescent Current
0 mA < IOUT < 50 mA
IVRQ
—
—
25
µA
IOUT = 0 mA, (Note 2)
Power Supply Ripple
Reject
PSRR
—
—
50
dB
1 VPP @10-20 kHz
CLOAD = 10 µf,
ILOAD = 50 mA
Output Noise Voltage
eN
—
—
100
µVRMS 10 Hz – 40 MHz
/√Hz CFILTER = 10 µf, CBP =
0.1 µf CLOAD = 10 µf,
ILOAD = 50 mA
Shutdown Voltage
VSD
2.5
—
2.7
V
Input Voltage to Maintain
Regulation
VBB
6.0
—
18.0
V
Input Voltage to Turn Off
Output
VOFF
4.0
—
4.5
V
Input Voltage to Turn On
Output
VON
5.5
—
6.0
V
Note 1:
2:
3:
See Figure 1-5
Internal current limited. 2.0 ms maximum recovery time (RLBUS = 0Ω, TX = 0.4 VREG, VLBUS = VBB).
For design guidance only, not tested.
Node has to sustain the current that can flow under this condition; bus must be operational under this
condition.
FIGURE 2-2:
MCP2021-330 SAFE OPERATING RANGE
Voltage Regulator Load (mA)
60
12V DFN
50
12V SOIC
18V DFN
40
18V SOIC
30
20
10
-40
-34
-28
-22
-16
-10
-4
2
8
14
20
26
32
38
44
50
56
62
68
74
80
86
92
98
104
110
116
122
0
Temperature (°C)
© 2009 Microchip Technology Inc.
DS22018E-page 19
MCP2021/2
FIGURE 2-3:
ESR CURVES FOR LOAD CAPACITOR SELECTION
ESR Curves
10
Instable
Stable only
ESR [ohm]
1
with Tantalum or
Electrolytic cap.
Stable with
Tantalum,
Electrolytic and
Ceramic cap.
Instable
0.1
0.01
Instable
0.001
0.1
1
10
100
1000
Load Capacitor [uF]
DS22018E-page 20
© 2009 Microchip Technology Inc.
MCP2021/2
2.3
AC Specification
AC CHARACTERISTICS
Parameter
VBB = 6.0V to 18.0V; TA = -40°C to +125°C
Sym
Min.
Typ.
Max.
Units
Test Conditions
Bus Interface - Constant Slope Time Parameters
Slope rising and falling
edges
tSLOPE
3.5
—
22.5
µs
7.3V <= VBB <= 18V
Propagation Delay of
Transmitter
tTRANSPD
—
—
4.0
µs
tTRANSPD = max (tTRANSPDR or
tTRANSPDF)
Propagation Delay of
Receiver
tRECPD
—
—
6.0
µs
tRECPD = max (tRECPDR or
tRECPDF)
Symmetry of Propagation
Delay of Receiver rising
edge w.r.t. falling edge
tRECSYM
-2.0
—
2.0
µs
tRECSYM = max (tRECPDF tRECPDR)
Symmetry of Propagation
Delay of Transmitter rising
edge w.r.t. falling edge
tTRANSSYM
-2.0
—
2.0
µs
tTRANSSYM = max (tTRANSPDF tTRANSPDR)
tFAULT
—
—
32.5
µs
tFAULT = max (tTRANSPD +
tSLOPE + tRECPD)
Duty Cycle 1 @20.0 kbit/sec
39.6
—
—
%tBIT
CBUS;RBUS conditions:
1 nF; 1 kΩ | 6.8 nF; 660Ω |
10 nF; 500Ω
THREC(MAX) = 0.744 x VBB,
THDOM(MAX) = 0.581 x VBB,
VBB =7.0V - 18V; tBIT = 50 µs.
D1 = tBUS_REC(MIN) / 2 x tBIT)
Duty Cycle 2 @20.0 kbit/sec
—
—
58.1
%tBIT
CBUS;RBUS conditions:
1 nF; 1 kΩ | 6.8 nF; 660Ω |
10 nF; 500Ω
THREC(MAX) = 0.284 x VBB,
THDOM(MAX) = 0.422 x VBB,
VBB =7.6V - 18V; tBIT = 50 µs.
D2 = tBUS_REC(MAX) / 2 x tBIT)
Duty Cycle 3 @10.4 kbit/sec
41.7
—
—
%tBIT
CBUS;RBUS conditions:
1 nF; 1 kΩ | 6.8 nF; 660Ω |
10 nF; 500Ω
THREC(MAX) = 0.778 x VBB,
THDOM(MAX) = 0.616 x VBB,
VBB =7.0V - 18V; tBIT = 96 µs.
D3 = tBUS_REC(MIN) / 2 x tBIT)
Duty Cycle 4 @10.4 kbit/sec
—
—
59.0
%tBIT
CBUS;RBUS conditions:
1 nF; 1 kΩ | 6.8 nF; 660Ω |
10 nF; 500Ω
THREC(MAX) = 0.251 x VBB,
THDOM(MAX) = 0.389 x VBB,
VBB =7.6V - 18V; tBIT = 96 µs.
D4 = tBUS_REC(MAX) / 2 x tBIT)
Time to sample of FAULT/
TXE for bus conflict reporting
© 2009 Microchip Technology Inc.
DS22018E-page 21
MCP2021/2
2.3
AC Specification (Continued)
AC CHARACTERISTICS
VBB = 6.0V to 18.0V; TA = -40°C to +125°C
Parameter
Sym
Min.
Typ.
Max.
Units
Test Conditions
tBDB
5
10
20
µs
Bus debounce time
tBACTVE
100
250
500
µs
After Bus debounce time
Voltage Regulator Enabled
to Ready
tVEVR
—
—
1200
µs
(Note 1)
Chip Select to Operation
Ready
tCSOR
—
—
500
µs
(Note 1)
Voltage Regulator
Bus Activity Debounce time
Bus Activity to Voltage
Regulator Enabled
Chip Select to Power-down
tCSPD
—
—
80
µs
tSHUTDOWN
20
—
100
µs
VREG OK detect to RESET
inactive
tRPU
—
—
10.0
µs
VREG OK detect to RESET
active
tRPD
—
—
10.0
µs
Short circuit to shut-down
RESET Timing
Note 1:
2.4
Time depends on external capacitance and load.
Thermal Specifications
THERMAL CHARACTERISTICS
Parameter
Symbol
Typ
Max
Units
Recovery Temperature
θRECOVERY
+140
—
°C
Shutdown Temperature
θSHUTDOWN
+150
—
°C
tTHERM
1.5
5.0
ms
Short Circuit Recovery Time
Test Conditions
Thermal Package Resistances
Thermal Resistance, 8L-DFN
θJA
35.7
—
°C/W
Thermal Resistance, 8L-PDIP
θJA
89.3
—
°C/W
Thermal Resistance, 8L-SOIC
θJA
149.5
—
°C/W
Thermal Resistance, 14L-PDIP
θJA
70
—
°C/W
Thermal Resistance, 14L-SOIC
θJA
95.3
—
°C/W
Thermal Resistance, 14L-TSSOP
θJA
100
—
°C/W
Note 1:
The maximum power dissipation is a function of TJMAX, ΘJA and ambient temperature TA. The maximum
allowable power dissipation at an ambient temperature is PD = (TJMAX - TA) ΘJA. If this dissipation is
exceeded, the die temperature will rise above 150°C and the MCP2021 will go into thermal shutdown.
DS22018E-page 22
© 2009 Microchip Technology Inc.
MCP2021/2
2.5
Timing Diagrams and Specifications
FIGURE 2-4:
BUS TIMING DIAGRAM
TXD
50%
50%
LBUS
.95VLBUS
.50VBB
.0++++++++++++++++++++++++---5V
0.0V
TTRANSPDR
TTRANSPDF
TRECPDF
TRECPDR
RXD
50%
Internal TXD/RXD
Compare
Match
50%
Match
Match
Match
Match
FAULT Sampling
TFAULT
TFAULT
FAULT/TXE Output
FIGURE 2-5:
Stable
Hold
Value
Stable
Hold
Value
Stable
REGULATOR CS/LWAKE TIMING DIAGRAM
CS/LWAKE
TCSOR
VREG
VOUT
TCSPD
© 2009 Microchip Technology Inc.
DS22018E-page 23
MCP2021/2
FIGURE 2-6:
REGULATOR BUS WAKE TIMING DIAGRAM
TVEVR
LBUS
.4VBB
TBDB + TBACTVE
VREG
VOUT
FIGURE 2-7:
RESET TIMING DIAGRAM
6.0V
5.0V
VBB
5.0V
4.0V
3.5V
VREG
TRPD
TRPD
RESET
TRPU
DS22018E-page 24
TRPU
© 2009 Microchip Technology Inc.
MCP2021/2
FIGURE 2-8:
CS/LWAKE TO RESET TIMING DIAGRAM
CS/LWAKE
TCSOR
VREG
VOUT
TRPU
TCSPD
RESET
FIGURE 2-9:
TYPICAL IBBQ VS. TEMPERATURE
0.2
Ibbq mA
0.15
0.1
Vbb = 6V
Vbb = 7.3V
0.05
Vbb = 12V
Vbb = 14.4V
Vbb = 18V
0
-40C
25C
85C
125C
Temperature (°C)
© 2009 Microchip Technology Inc.
DS22018E-page 25
MCP2021/2
TYPICAL IBBTO VS TEMPERATURE
mA
FIGURE 2-10:
0.18
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
-40C
Vbb = 6V
Vbb = 7.3V
Vbb = 12V
Vbb = 14.4V
Vbb = 18V
25C
85C
125C
Temperature (°C)
FIGURE 2-11:
TYPICAL IPD VS. TEMPERATURE
0.025
Ipd (mA)
0.02
0.015
0.01
Vbb = 6V
Vbb = 7.3V
Vbb = 12V
0.005
Vbb = 14.4V
Vbb = 18V
0
-40C
25C
85C
125C
Temperature (°C)
DS22018E-page 26
© 2009 Microchip Technology Inc.
MCP2021/2
3.0
PACKAGING INFORMATION
3.1
Package Marking Information
8-Lead DFN (4x4)
XXXXXXX
XXXXXXX
XXYYWW
NNN
202150
e3
E/MD^^
0733
256
8-Lead DFN-S (6x5)
XXXXXXX
XXXXXXX
XXYYWW
NNN
8-Lead SOIC (150 mil)
e3
*
Note:
Example:
2021500
e3
E/P^^256
0729
XXXXXXXX
XXXXXNNN
YYWW
Legend: XX...X
Y
YY
WW
NNN
Example:
2021500
e3
E/MF^^
0733
256
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXYYWW
NNN
Example:
Example:
2021500E
e3
SN^^0729
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2009 Microchip Technology Inc.
DS22018E-page 27
MCP2021/2
3.1
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP2022)
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
MCP2022-500
e3
E/P^^
0729256
14-Lead SOIC (150 mil) (MCP2022)
Example:
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
14-Lead TSSOP (MCP2022)
XXXXXXXX
YYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS22018E-page 28
MCP2022-500
E/SL^^
e3
0729256
Example
2022500E
0729
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2009 Microchip Technology Inc.
MCP2021/2
8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
b
N
N
L
E
E2
K
EXPOSED
PAD
2
2
1
NOTE 1
1
NOTE 1
D2
TOP VIEW
BOTTOM VIEW
A3
A
A1
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
0.80
0.80 BSC
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
Exposed Pad Width
E2
Overall Width
E
Exposed Pad Length
D2
0.00
3.00
3.60
b
0.25
0.30
0.35
Contact Length
L
0.30
0.55
0.65
Contact-to-Exposed Pad
K
0.20
–
–
Contact Width
4.00 BSC
0.00
2.20
2.80
4.00 BSC
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-131C
© 2009 Microchip Technology Inc.
DS22018E-page 29
MCP2021/2
%
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DS22018E-page 30
© 2009 Microchip Technology Inc.
MCP2021/2
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
e
D
L
b
N
N
K
E
E2
EXPOSED PAD
NOTE 1
1
2
2
NOTE 1
1
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
0.80
1.27 BSC
0.85
1.00
Standoff
A1
0.00
0.01
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
5.00 BSC
Overall Width
E
Exposed Pad Length
D2
3.90
4.00
4.10
Exposed Pad Width
E2
2.20
2.30
2.40
6.00 BSC
Contact Width
b
0.35
0.40
0.48
Contact Length
L
0.50
0.60
0.75
Contact-to-Exposed Pad
K
0.20
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
–
Microchip Technology Drawing C04-122B
© 2009 Microchip Technology Inc.
DS22018E-page 31
MCP2021/2
%
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DS22018E-page 32
© 2009 Microchip Technology Inc.
MCP2021/2
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
e
eB
b1
b
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
8
Pitch
e
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
b1
.040
.060
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
© 2009 Microchip Technology Inc.
DS22018E-page 33
MCP2021/2
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
A2
A
c
φ
L
A1
β
L1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
1.25
–
–
Standoff §
A1
0.10
–
0.25
Overall Width
E
Molded Package Width
E1
3.90 BSC
Overall Length
D
4.90 BSC
1.75
6.00 BSC
Chamfer (optional)
h
0.25
–
0.50
Foot Length
L
0.40
–
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.17
–
0.25
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
DS22018E-page 34
© 2009 Microchip Technology Inc.
MCP2021/2
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© 2009 Microchip Technology Inc.
DS22018E-page 35
MCP2021/2
14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
b1
b
e
eB
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
14
Pitch
e
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.735
.750
.775
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
b1
.045
.060
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-005B
DS22018E-page 36
© 2009 Microchip Technology Inc.
MCP2021/2
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
3
e
h
b
α
h
A
A2
c
φ
L
A1
β
L1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
14
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
1.25
–
–
Standoff §
A1
0.10
–
0.25
Overall Width
E
Molded Package Width
E1
3.90 BSC
Overall Length
D
8.65 BSC
1.75
6.00 BSC
Chamfer (optional)
h
0.25
–
0.50
Foot Length
L
0.40
–
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.17
–
0.25
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-065B
© 2009 Microchip Technology Inc.
DS22018E-page 37
MCP2021/2
%
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DS22018E-page 38
© 2009 Microchip Technology Inc.
MCP2021/2
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1 2
e
b
c
φ
A2
A
A1
Units
Dimension Limits
Number of Pins
L
L1
MILLIMETERS
MIN
N
NOM
MAX
14
Pitch
e
Overall Height
A
–
0.65 BSC
–
Molded Package Thickness
A2
0.80
1.00
1.05
Standoff
A1
0.05
–
0.15
1.20
Overall Width
E
Molded Package Width
E1
4.30
6.40 BSC
4.40
Molded Package Length
D
4.90
5.00
5.10
Foot Length
L
0.45
0.60
0.75
Footprint
L1
4.50
1.00 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.19
–
0.30
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-087B
© 2009 Microchip Technology Inc.
DS22018E-page 39
MCP2021/2
NOTES:
DS22018E-page 40
© 2009 Microchip Technology Inc.
MCP2021/2
APPENDIX A:
REVISION HISTORY
Revision E (February 2009)
Revision B (August 2007)
The following is the list of modifications:
The following is the list of modifications.
1.
2.
1.
2.
3.
3.
4.
4.
5.
6.
7.
Added Example 1-2 and Example 1-3.
Updated Section 1.5.9 “RESET”.
Updated Section 1.7 “ICSP™ Considerations”.
Updated Section 2.1 “Absolute Maximum
Ratings†”.
Updated Section 2.2 “DC Specifications” and
Section 2.3 “AC Specification”.
Added FIGURE 2-3: “ESR Curves For Load
Capacitor Selection”.
Updated the Product Identification System
section.
Revision D (July 2008)
5.
6.
Modified Block Diagram on page 2.
Section 1.3.5 “Transmitter OFF Mode”:
Deleted text in 1st paragraph.
Example 1-1: Removed +5V notation.
Section 1.5 “Pin Descriptions”: Removed 10pin DFN, MSOP column from table.
Section 1.5.8 “Fault/TXE”: Deleted text from
2nd paragraph.
Section 3.0 “Packaging Information”: Added
8-lead 4x4 and 6x5 DFN and 14-lead TSSOP
packages. Updated package outline drawings
and added drawings for 8-lead DFN and 14-lead
TSSOP drawings.
Revision A (November 2005)
• Original Release of this Document.
The following is the list of modifications.
1.
2.
3.
Updated ESD specs under ‘Absolute DC’.
Updated notes in Example 1-1.
Updated Package Outline Drawings.
Revision C (April 2008)
The following is the list of modifications.
1.
2.
3.
4.
5.
Added LIN2.1 and J2602 compliance statement
to Features section.
Added recommended RC network for CS/
LWAKE in Example 1-1.
Updated 2.1 Absolute Maximum Ratings to
reflect current test results.
Updated 2.2 DC Specifications and 2.3 AC
Specifications to reflect current production
device.
Added 8-Lead SOIC Landing Pattern Outline
drawing.
© 2009 Microchip Technology Inc.
DS22018E-page 41
MCP2021/2
NOTES:
DS22018E-page 42
© 2009 Microchip Technology Inc.
MCP2021/2
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
–X
/XX
Temperature
Range
Device:
Package
MCP2021: LIN Transceiver with Voltage Regulator
MCP2021T: LIN Transceiver with Voltage Regulator
(Tape and Reel) (SOIC only)
MCP2022: LIN Transceiver with Voltage Regulator
MCP2022T: LIN Transceiver with Voltage Regulator
(Tape and Reel) (SOIC only)
Temperature Range:
E
= -40°C to +125°C
Package:
MD
MF
P
SN
SL
ST
=
=
=
=
=
=
Plastic Micro Small Outline (4x4), 8-lead
Plastic Micro Small Outline (6x5), 8-lead
Plastic DIP (300 mil Body), 8-lead, 14-lead
Plastic SOIC, (150 mil Body), 8-lead
Plastic SOIC, (150 mil Body), 14-lead
Plastic Thin Shrink Small Outline, 14-lead
Examples:
a)
b)
c)
d)
e)
f)
g)
h)
i)
a)
b)
c)
d)
e)
f)
g)
© 2009 Microchip Technology Inc.
MCP2021-330E/SN:
MCP2021-330E/P:
MCP2021-500E/MF:
MCP2021-500E/SN:
MCP2021-500E/MD:
MCP2021-330E/P:
MCP2021T-330E/SN:
3.3V, 8L-SOIC pkg.
3.3V, 8L-PDIP pkg.
5.0V, 8L-DFN-S pkg.
5.0V, 8L-SOIC pkg.
5.0V, 8L-DFN pkg.
5.0V, 8L-PDIP pkg.
Tape and Reel,
3.3V, 8L-SOIC pkg.
MCP2021T-500E/MD: Tape and Reel,
5.0V, 8L-DFN pkg.
MCP2021T-500E/SN: Tape and Reel,
5.0V, 8L-SOIC pkg.
MCP2022-330E/SL:
MCP2022-330E/P:
MCP2022-500E/SL:
MCP2022-500E/P:
MCP2022T-330E/SL:
3.3V, 14L-SOIC pkg.
3.3V, 14L-PDIP pkg.
5.0V, 14L-SOIC pkg.
5.0V, 14L-PDIP pkg.
Tape and Reel,
3.3V, 14L-SOIC pkg.
MCP2022T-500E/SL: Tape and Reel,
5.0V, 14L-SOIC pkg.
MCP2022T-500E/ST: Tape and Reel,
5.0V, 14L-TSSOP pkg.
DS22018E-page 43
MCP2021/2
NOTES:
DS22018E-page 44
© 2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2009 Microchip Technology Inc.
DS22018E-page 45
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4080
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
02/04/09
DS22018E-page 46
© 2009 Microchip Technology Inc.