Freescale Semiconductor Technical Data Document Number: MPC8533EEC Rev. 3, 11/2009 MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications 1 MPC8533E Overview This section provides a high-level overview of MPC8533E features. Figure 1 shows the major functional units within the device. 1.1 Key Features The following list provides an overview of the device feature set: • High-performance 32-bit Book E–enhanced core built on Power Architecture™ technology: — 32-Kbyte L1 instruction cache and 32-Kbyte L1 data cache with parity protection. Caches can be locked entirely or on a per-line basis, with separate locking for instructions and data. — Signal-processing engine (SPE) APU (auxiliary processing unit). Provides an extensive instruction set for vector (64-bit) integer and fractional operations. These instructions use both the upper and lower words of the 64-bit GPRs as they are defined by the SPE APU. © Freescale Semiconductor, Inc., 2008, 2009. All rights reserved. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. Contents MPC8533E Overview . . . . . . . . . . . . . . . . . . . . . . . . . 1 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 8 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 13 Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 16 DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 17 DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Enhanced Three-Speed Ethernet (eTSEC), MII Management . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Ethernet Management Interface Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Programmable Interrupt Controller . . . . . . . . . . . . . 51 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 60 PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 78 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 System Design Information . . . . . . . . . . . . . . . . . . 102 Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . 111 Document Revision History . . . . . . . . . . . . . . . . . . 114 MPC8533E Overview — Double-precision floating-point APU. Provides an instruction set for double-precision (64-bit) floating-point instructions that use the 64-bit GPRs. — 36-bit real addressing — Embedded vector and scalar single-precision floating-point APUs. Provide an instruction set for single-precision (32-bit) floating-point instructions. — Memory management unit (MMU). Especially designed for embedded applications. Supports 4-Kbyte–4-Gbyte page sizes. — Enhanced hardware and software debug support — Performance monitor facility that is similar to, but separate from, the device performance monitor The e500 defines features that are not implemented on this device. It also generally defines some features that this device implements more specifically. An understanding of these differences can be critical to ensure proper operations. • 256-Kbyte L2 cache/SRAM — Flexible configuration — Full ECC support on 64-bit boundary in both cache and SRAM modes — Cache mode supports instruction caching, data caching, or both. — External masters can force data to be allocated into the cache through programmed memory ranges or special transaction types (stashing). – 1, 2, or 4 ways can be configured for stashing only. — Eight-way set-associative cache organization (32-byte cache lines) — Supports locking entire cache or selected lines. Individual line locks are set and cleared through Book E instructions or by externally mastered transactions. — Global locking and flash clearing done through writes to L2 configuration registers — Instruction and data locks can be flash cleared separately. — SRAM features include the following: – I/O devices access SRAM regions by marking transactions as snoopable (global). – Regions can reside at any aligned location in the memory map. – Byte-accessible ECC is protected using read-modify-write transaction accesses for smaller-than-cache-line accesses. • Address translation and mapping unit (ATMU) — Eight local access windows define mapping within local 36-bit address space. — Inbound and outbound ATMUs map to larger external address spaces. – Three inbound windows plus a configuration window on PCI and PCI Express – Four outbound windows plus default translation for PCI and PCI Express • DDR/DDR2 memory controller — Programmable timing supporting DDR and DDR2 SDRAM — 64-bit data interface MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 2 Freescale Semiconductor MPC8533E Overview — — — — • • Four banks of memory supported, each up to 4 Gbytes, to a maximum of 16 Gbytes DRAM chip configurations from 64 Mbits to 4 Gbits with x8/x16 data ports Full ECC support Page mode support – Up to 16 simultaneous open pages for DDR – Up to 32 simultaneous open pages for DDR2 — Contiguous or discontiguous memory mapping — Sleep mode support for self-refresh SDRAM — On-die termination support when using DDR2 — Supports auto refreshing — On-the-fly power management using CKE signal — Registered DIMM support — Fast memory access via JTAG port — 2.5-V SSTL_2 compatible I/O (1.8-V SSTL_1.8 for DDR2) Programmable interrupt controller (PIC) — Programming model is compliant with the OpenPIC architecture. — Supports 16 programmable interrupt and processor task priority levels — Supports 12 discrete external interrupts — Supports 4 message interrupts with 32-bit messages — Supports connection of an external interrupt controller such as the 8259 programmable interrupt controller — Four global high resolution timers/counters that can generate interrupts — Supports a variety of other internal interrupt sources — Supports fully nested interrupt delivery — Interrupts can be routed to external pin for external processing. — Interrupts can be routed to the e500 core’s standard or critical interrupt inputs. — Interrupt summary registers allow fast identification of interrupt source. Integrated security engine (SEC) optimized to process all the algorithms associated with IPSec, IKE, WTLS/WAP, SSL/TLS, and 3GPP — Four crypto-channels, each supporting multi-command descriptor chains – Dynamic assignment of crypto-execution units via an integrated controller – Buffer size of 256 bytes for each execution unit, with flow control for large data sizes — PKEU—public key execution unit – RSA and Diffie-Hellman; programmable field size up to 2048 bits – Elliptic curve cryptography with F2m and F(p) modes and programmable field size up to 511 bits — DEU—Data Encryption Standard execution unit – DES, 3DES MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 3 MPC8533E Overview • • • • – Two key (K1, K2, K1) or three key (K1, K2, K3) – ECB and CBC modes for both DES and 3DES — AESU—Advanced Encryption Standard unit – Implements the Rijndael symmetric key cipher – ECB, CBC, CTR, and CCM modes – 128-, 192-, and 256-bit key lengths — AFEU—ARC four execution unit – Implements a stream cipher compatible with the RC4 algorithm – 40- to 128-bit programmable key — MDEU—message digest execution unit – SHA with 160- or 256-bit message digest – MD5 with 128-bit message digest – HMAC with either algorithm — KEU—Kasumi execution unit – Implements F8 algorithm for encryption and F9 algorithm for integrity checking – Also supports A5/3 and GEA-3 algorithms — RNG—random number generator — XOR engine for parity checking in RAID storage applications Dual I2C controllers — Two-wire interface — Multiple master support — Master or slave I2C mode support — On-chip digital filtering rejects spikes on the bus Boot sequencer — Optionally loads configuration data from serial ROM at reset via the I2C interface — Can be used to initialize configuration registers and/or memory — Supports extended I2C addressing mode — Data integrity checked with preamble signature and CRC DUART — Two 4-wire interfaces (SIN, SOUT, RTS, CTS) — Programming model compatible with the original 16450 UART and the PC16550D Local bus controller (LBC) — Multiplexed 32-bit address and data bus operating at up to 166 MHz — Eight chip selects support eight external slaves — Up to eight-beat burst transfers — The 32-, 16-, and 8-bit port sizes are controlled by an on-chip memory controller. — Two protocol engines available on a per chip select basis: MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 4 Freescale Semiconductor MPC8533E Overview • – General-purpose chip select machine (GPCM) – Three user programmable machines (UPMs) — Parity support — Default boot ROM chip select with configurable bus width (8, 16, or 32 bits) Two enhanced three-speed Ethernet controllers (eTSECs) — Three-speed support (10/100/1000 Mbps) — Two IEEE Std 802.3®, IEEE 802.3u, IEEE 802.3x, IEEE 802.3z, IEEE 802.3ac, and IEEE 802.3ab-compliant controllers — Support for various Ethernet physical interfaces: – 1000 Mbps full-duplex IEEE 802.3 GMII, IEEE 802.3z TBI, RTBI, and RGMII. – 10/100 Mbps full- and half-duplex IEEE 802.3 MII, IEEE 802.3 RGMII, and RMII. — Flexible configuration for multiple PHY interface configurations. — TCP/IP acceleration and QoS features available – IP v4 and IP v6 header recognition on receive – IP v4 header checksum verification and generation – TCP and UDP checksum verification and generation – Per-packet configurable acceleration – Recognition of VLAN, stacked (queue in queue) VLAN, 802.2, PPPoE session, MPLS stacks, and ESP/AH IP-security headers – Supported in all FIFO modes — Quality of service support: – Transmission from up to eight physical queues – Reception to up to eight physical queues — Full- and half-duplex Ethernet support (1000 Mbps supports only full duplex): – IEEE 802.3 full-duplex flow control (automatic PAUSE frame generation or software-programmed PAUSE frame generation and recognition) — Programmable maximum frame length supports jumbo frames (up to 9.6 Kbytes) and IEEE Std 802.1™ virtual local area network (VLAN) tags and priority — VLAN insertion and deletion – Per-frame VLAN control word or default VLAN for each eTSEC – Extracted VLAN control word passed to software separately — Retransmission following a collision — CRC generation and verification of inbound/outbound frames — Programmable Ethernet preamble insertion and extraction of up to 7 bytes — MAC address recognition: – Exact match on primary and virtual 48-bit unicast addresses – VRRP and HSRP support for seamless router fail-over – Up to 16 exact-match MAC addresses supported MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 5 MPC8533E Overview • • • – Broadcast address (accept/reject) – Hash table match on up to 512 multicast addresses – Promiscuous mode — Buffer descriptors backward compatible with MPC8260 and MPC860T 10/100 Ethernet programming models — RMON statistics support — 10-Kbyte internal transmit and 2-Kbyte receive FIFOs — MII management interface for control and status — Ability to force allocation of header information and buffer descriptors into L2 cache OCeaN switch fabric — Full crossbar packet switch — Reorders packets from a source based on priorities — Reorders packets to bypass blocked packets — Implements starvation avoidance algorithms — Supports packets with payloads of up to 256 bytes Integrated DMA controller — Four-channel controller — All channels accessible by both the local and remote masters — Extended DMA functions (advanced chaining and striding capability) — Support for scatter and gather transfers — Misaligned transfer capability — Interrupt on completed segment, link, list, and error — Supports transfers to or from any local memory or I/O port — Selectable hardware-enforced coherency (snoop/no snoop) — Ability to start and flow control each DMA channel from external 3-pin interface — Ability to launch DMA from single write transaction PCI controller — PCI 2.2 compatible — One 32-bit PCI port with support for speeds from 16 to 66 MHz — Host and agent mode support — 64-bit dual address cycle (DAC) support — Supports PCI-to-memory and memory-to-PCI streaming — Memory prefetching of PCI read accesses — Supports posting of processor-to-PCI and PCI-to-memory writes — PCI 3.3-V compatible — Selectable hardware-enforced coherency MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 6 Freescale Semiconductor MPC8533E Overview • • • • • • Three PCI Express interfaces — Two ×4 link width interfaces and one ×1 link width interface — PCI Express 1.0a compatible — Auto-detection of number of connected lanes — Selectable operation as root complex or endpoint — Both 32- and 64-bit addressing — 256-byte maximum payload size — Virtual channel 0 only — Traffic class 0 only — Full 64-bit decode with 32-bit wide windows Power management — Supports power saving modes: doze, nap, and sleep — Employs dynamic power management, which automatically minimizes power consumption of blocks when they are idle System performance monitor — Supports eight 32-bit counters that count the occurrence of selected events — Ability to count up to 512 counter-specific events — Supports 64 reference events that can be counted on any of the 8 counters — Supports duration and quantity threshold counting — Burstiness feature that permits counting of burst events with a programmable time between bursts — Triggering and chaining capability — Ability to generate an interrupt on overflow System access port — Uses JTAG interface and a TAP controller to access entire system memory map — Supports 32-bit accesses to configuration registers — Supports cache-line burst accesses to main memory — Supports large block (4-Kbyte) uploads and downloads — Supports continuous bit streaming of entire block for fast upload and download IEEE Std 1149.1™-compliant, JTAG boundary scan 783 FC-PBGA package MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 7 Electrical Characteristics MPC8533E e500 Core 32-Kbyte I-Cache XOR Acceleration Local Bus Security Acceleration Performance Monitor DUART 2x I2C 32-Kbyte D-Cache e500 Coherency Module OpenPIC Gigabit Ethernet 256-Kbyte L2 Cache 64-Bit DDR/DDR2 SDRAM Controller 32-Bit PCI PCI Express x4/x2/x1 PCI Express x1 PCI Express x4/x2/x1 DMA Figure 1. MPC8533E Block Diagram 2 Electrical Characteristics This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8533E. This device is currently targeted to these specifications. Some of these specifications are independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer design specifications. 2.1 Overall DC Electrical Characteristics This section covers the ratings, conditions, and other characteristics. 2.1.1 Absolute Maximum Ratings Table 1 provides the absolute maximum ratings. Table 1. Absolute Maximum Ratings1 Characteristic Symbol Max Value Unit Notes Core supply voltage VDD –0.3 to 1.1 V — PLL supply voltage AVDD –0.3 to 1.1 V — Core power supply for SerDes transceivers SVDD –0.3 to 1.1 V — Pad power supply for SerDes transceivers XVDD –0.3 to 1.1 V — MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 8 Freescale Semiconductor Electrical Characteristics Table 1. Absolute Maximum Ratings1 (continued) Characteristic Symbol Max Value Unit Notes GVDD –0.3 to 2.75 –0.3 to 1.98 V — LVDD (eTSEC1) –0.3 to 3.63 –0.3 to 2.75 V — TVDD (eTSEC3) –0.3 to 3.63 –0.3 to 2.75 V — PCI, DUART, system control and power management, I2C, and JTAG I/O voltage OV DD –0.3 to 3.63 V — Local bus I/O voltage BVDD –0.3 to 3.63 –0.3 to 2.75 –0.3 to 1.98 V — Input voltage MVIN –0.3 to (GV DD + 0.3) V 2 DDR/DDR2 DRAM reference MVREF –0.3 to (GV DD + 0.3) V 2 Three-speed Ethernet signals LVIN TVIN –0.3 to (LVDD + 0.3) –0.3 to (TVDD + 0.3) V 2 Local bus signals BVIN –0.3 to (BVDD + 0.3) V — DUART, SYSCLK, system control and power management, I2C, and JTAG signals OVIN –0.3 to (OV DD + 0.3) V 2 PCI OVIN –0.3 to (OV DD + 0.3) V 2 TSTG –55 to 150 °C — DDR and DDR2 DRAM I/O voltage Three-speed Ethernet I/O, MII management voltage DDR/DDR2 DRAM signals Storage temperature range Notes: 1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause. 2. (M,L,O)VIN, and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2. 2.1.2 Recommended Operating Conditions Table 2 provides the recommended operating conditions for this device. Note that the values in Table 2 are the recommended and tested operating conditions. Proper device operation outside these conditions is not guaranteed. Table 2. Recommended Operating Conditions Symbol Recommended Value Unit Notes Core supply voltage VDD 1.0 ± 50 mV V — PLL supply voltage AVDD 1.0 ± 50 mV V 1 Core power supply for SerDes transceivers SVDD 1.0 ± 50 mV V — Pad power supply for SerDes transceivers XVDD 1.0 ± 50 mV V — DDR and DDR2 DRAM I/O voltage GVDD 2.5 V ± 125 mV 1.8 V ± 90 mV V 2 Characteristic MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 9 Electrical Characteristics Table 2. Recommended Operating Conditions (continued) Symbol Recommended Value LVDD (eTSEC1) 3.3 V ± 165 mV 2.5 V ± 125 mV TVDD (eTSEC3) 3.3 V ± 165 mV 2.5 V ± 125 mV PCI, DUART, PCI Express, system control and power management, I2C, and JTAG I/O voltage OV DD Local bus I/O voltage Input voltage Unit Notes V 4 3.3 V ± 165 mV V 3 BVDD 3.3 V ± 165 mV 2.5 V ± 125 mV 1.8 V ± 90 mV V 5 MVIN GND to GVDD V 2 MVREF GND to GVDD/2 V 2 Three-speed Ethernet signals LVIN TVIN GND to LVDD GND to TVDD V 4 Local bus signals BVIN GND to BVDD V 5 PCI, Local bus, DUART, SYSCLK, system control and power management, I2C, and JTAG signals OVIN GND to OVDD V 3 Tj 0 to 90 °C — Characteristic Three-speed Ethernet I/O voltage DDR and DDR2 DRAM signals DDR and DDR2 DRAM reference Junction temperature range Notes: 1. This voltage is the input to the filter discussed in Section 21.2, “PLL Power Supply Filtering,” and not necessarily the voltage at the AVDD pin, which may be reduced from V DD by the filter. 2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 3. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 4. Caution: T/LVIN must not exceed T/ LVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 5. Caution: BVIN must not exceed BV DD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 10 Freescale Semiconductor Electrical Characteristics Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8533E. B/G/L/OV DD + 20% B/G/L/OV DD + 5% B/G/L/OVDD VIH GND GND – 0.3 V VIL GND – 0.7 V Not to Exceed 10% of t CLOCK1 Notes: 1. tCLOCK refers to the clock period associated with the respective interface: For I2C and JTAG, tCLOCK references SYSCLK. For DDR, tCLOCK references MCLK. For eTSEC, tCLOCK references EC_GTX_CLK125. For LBIU, tCLOCK references LCLK. For PCI, tCLOCK references PCI_CLK or SYSCLK. 2. Please note that with the PCI overshoot allowed (as specified above), the device does not fully comply with the maximum AC ratings and device protection guideline outlined in Section 4.2.2.3 of the PCI 2.2 Local Bus Specifications. Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD/LVDD/BVDD/TVDD The core voltage must always be provided at nominal 1.0 V (see Table 2 for actual recommended core voltage). Voltage to the processor interface I/Os are provided through separate sets of supply pins and must be provided at the voltages shown in Table 2. The input voltage threshold scales with respect to the associated I/O supply voltage. OVDD and LVDD based receivers are simple CMOS I/O circuits and satisfy appropriate LVCMOS type specifications. The DDR2 SDRAM interface uses a single-ended differential receiver referenced the externally supplied MVREF signal (nominally set to GVDD/2) as is appropriate for the SSTL2 electrical signaling standard. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 11 Electrical Characteristics 2.1.3 Output Driver Characteristics Table 3 provides information on the characteristics of the output driver strengths. Table 3. Output Drive Capability Driver Type Local bus interface utilities signals PCI signals Programmable Output Impedance (Ω) Supply Voltage 25 35 BVDD = 3.3 V BVDD = 2.5 V 45 (default) 45 (default) 125 BVDD = 3.3 V BVDD = 2.5 V BVDD = 1.8 V 25 OVDD = 3.3 V 2 Notes 1 42 (default) DDR signal 20 GVDD = 2.5 V — DDR2 signal 16 32 (half strength mode) GVDD = 1.8 V — TSEC signals 42 LVDD = 2.5/3.3 V — DUART, system control, JTAG 42 OVDD = 3.3 V — 150 OVDD = 3.3 V — I 2C Notes: 1. The drive strength of the local bus interface is determined by the configuration of the appropriate bits in PORIMPSCR. 2. The drive strength of the PCI interface is determined by the setting of the PCI_GNT1 signal at reset. 2.2 Power Sequencing The device requires its power rails to be applied in specific sequence in order to ensure proper device operation. These requirements are as follows for power up: 1. VDD, AVDD_n, BVDD, LVDD, SVDD, OVDD, TVDD, XVDD 2. GVDD Note that all supplies must be at their stable values within 50 ms. Items on the same line have no ordering requirement with respect to one another. Items on separate lines must be ordered sequentially such that voltage rails on a previous step must reach 90% of their value before the voltage rails on the current step reach 10% of theirs. In order to guarantee MCKE low during power-up, the above sequencing for GVDD is required. If there is no concern about any of the DDR signals being in an indeterminate state during power up, then the sequencing for GVDD is not required. From a system standpoint, if any of the I/O power supplies ramp prior to the VDD core supply, the I/Os associated with that I/O supply may drive a logic one or zero during power-up, and extra current may be drawn by the device. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 12 Freescale Semiconductor Power Characteristics 3 Power Characteristics The estimated typical core power dissipation for the core complex bus (CCB) versus the core frequency for this family of PowerQUICC III devices is shown in Table 4. Table 4. MPC8533E Core Power Dissipation Power Mode Core Frequency (MHz) Platform Frequency (MHz) VDD (V) Junction Temperature (°C) Power (W) Notes 667 333 1.0 65 2.6 1, 2 90 3.75 1, 3 5.85 1, 4 65 2.9 1, 2 90 4.0 1, 3 6.0 1, 4 65 3.6 1, 2 90 4.4 1, 3 6.2 1, 4 65 3.9 1, 2 90 5.0 1, 3 6.5 1, 4 Typical Thermal Maximum Typical 800 400 1.0 Thermal Maximum Typical 1000 400 1.0 Thermal Maximum Typical 1067 Thermal Maximum 533 1.0 Notes: 1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and configurations. The values do not include power dissipation for I/O supplies. 2. Typical power is an average value measured at the nominal recommended core voltage (V DD) and 65°C junction temperature (see Table 2) while running the Dhrystone 2.1 benchmark. 3. Thermal power is the average power measured at nominal core voltage (V DD) and maximum operating junction temperature (see Table 2) while running the Dhrystone 2.1 benchmark. 4. Maximum power is the maximum power measured at nominal core voltage (VDD) and maximum operating junction temperature (see Table 2) while running a smoke test which includes an entirely L1-cache-resident, contrived sequence of instructions which keep the execution unit maximally busy. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 13 Input Clocks 4 4.1 Input Clocks System Clock Timing Table 5 provides the system clock (SYSCLK) AC timing specifications for the MPC8533E. Table 5. SYSCLK AC Timing Specifications At recommended operating conditions (see Table 2) with OVDD = 3.3 V ± 165 mV. Parameter/Condition Symbol Min Typical Max Unit Notes SYSCLK frequency fSYSCLK 33 — 133 MHz 1 SYSCLK cycle time tSYSCLK 7.5 — 30.3 ns — SYSCLK rise and fall time tKH, tKL 0.6 1.0 2.1 ns 2 tKHK/tSYSCLK 40 — 60 % — — — — ±150 ps 3, 4 SYSCLK duty cycle SYSCLK jitter Notes: 1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum operating frequencies. Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” and Section 19.3, “e500 Core PLL Ratio,” for ratio settings. 2. Rise and fall times for SYSCLK are measured at 0.6 and 2.7 V. 3. This represents the total input jitter—short- and long-term. 4. The SYSCLK driver’s closed loop jitter bandwidth should be <500 kHz at –20 dB. The bandwidth must be set low to allow cascade-connected PLL-based devices to track SYSCLK drivers with the specified jitter. 4.1.1 SYSCLK and Spread Spectrum Sources Spread spectrum clock sources are an increasingly popular way to control electromagnetic interference emissions (EMI) by spreading the emitted noise to a wider spectrum and reducing the peak noise magnitude in order to meet industry and government requirements. These clock sources intentionally add long-term jitter in order to diffuse the EMI spectral content. The jitter specification given in Table 5 considers short-term (cycle-to-cycle) jitter only and the clock generator’s cycle-to-cycle output jitter should meet the MPC8533E input cycle-to-cycle jitter requirement. Frequency modulation and spread are separate concerns, and the MPC8533E is compatible with spread spectrum sources if the recommendations listed in Table 6 are observed. Table 6. Spread Spectrum Clock Source Recommendations At recommended operating conditions. See Table 2. Parameter Frequency modulation Frequency spread Min Max Unit Notes 20 60 kHz — 0 1.0 % 1 Note: 1. SYSCLK frequencies resulting from frequency spreading, and the resulting core and VCO frequencies, must meet the minimum and maximum specifications given in Table 5. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 14 Freescale Semiconductor Input Clocks It is imperative to note that the processor’s minimum and maximum SYSCLK, core, and VCO frequencies must not be exceeded regardless of the type of clock source. Therefore, systems in which the processor is operated at its maximum rated e500 core frequency should avoid violating the stated limits by using down-spreading only. 4.2 Real-Time Clock Timing The RTC input is sampled by the platform clock (CCB clock). The output of the sampling latch is then used as an input to the counters of the PIC and the TimeBase unit of the e500. There is no jitter specification. The minimum pulse width of the RTC signal should be greater than 2 × the period of the CCB clock. That is, minimum clock high time is 2 × tCCB, and minimum clock low time is 2 × tCCB. There is no minimum RTC frequency; RTC may be grounded if not needed. 4.3 eTSEC Gigabit Reference Clock Timing Table 7 provides the eTSEC gigabit reference clocks (EC_GTX_CLK125) AC timing specifications for the MPC8533E. Table 7. EC_GTX_CLK125 AC Timing Specifications Parameter/Condition Symbol Min Typ Max Unit Notes EC_GTX_CLK125 frequency fG125 — 125 — MHz — EC_GTX_CLK125 cycle time tG125 — 8 — ns — EC_GTX_CLK rise and fall time LVDD, TVDD = 2.5 V LVDD, TVDD = 3.3 V tG125R/tG125F — — ns 1 EC_GTX_CLK125 duty cycle tG125H/tG125 % 2 0.75 1.0 GMII, TBI 1000Base-T for RGMII, RTBI — 45 47 55 53 Notes: 1. Rise and fall times for EC_GTX_CLK125 are measured from 0.5 and 2.0 V for L/TVDD = 2.5 V, and from 0.6 and 2.7 V for L/TVDD = 3.3 V. 2. EC_GTX_CLK125 is used to generate the GTX clock for the eTSEC transmitter with 2% degradation. EC_GTX_CLK125 duty cycle can be loosened from 47%/53% as long as the PHY device can tolerate the duty cycle generated by the eTSEC GTX_CLK. See Section 8.5.4, “RGMII and RTBI AC Timing Specifications,” for duty cycle for 10Base-T and 100Base-T reference clock. 4.4 Platform to FIFO Restrictions Please note the following FIFO maximum speed restrictions based on platform speed. For FIFO GMII mode: FIFO TX/RX clock frequency ≤ platform clock frequency ÷ 4.2 For example, if the platform frequency is 533 MHz, the FIFO Tx/Rx clock frequency should be no more than 127 MHz. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 15 RESET Initialization For FIFO encoded mode: FIFO TX/RX clock frequency ≤ platform clock frequency ÷ 3.2 For example, if the platform frequency is 533 MHz, the FIFO Tx/Rx clock frequency should be no more than 167 MHz. 4.5 Other Input Clocks For information on the input clocks of other functional blocks of the platform such as SerDes, and eTSEC, see the specific section of this document. 5 RESET Initialization This section describes the AC electrical specifications for the RESET initialization timing requirements of the MPC8533E. Table 8 provides the RESET initialization AC timing specifications for the DDR SDRAM component(s). Table 8. RESET Initialization Timing Specifications1 Parameter/Condition Min Max Unit Notes 100 — μs — 3 — SYSCLKs 1 100 — μs — Input setup time for POR configs (other than PLL config) with respect to negation of HRESET 4 — SYSCLKs 1 Input hold time for all POR configs (including PLL config) with respect to negation of HRESET 2 — SYSCLKs 1 Maximum valid-to-high impedance time for actively driven POR configs with respect to negation of HRESET — 5 SYSCLKs 1 Required assertion time of HREST Minimum assertion time for SRESET PLL input setup time with stable SYSCLK before HRESET negation Note: 1. SYSCLK is the primary clock input for the MPC8533E. Table 9 provides the PLL lock times. Table 9. PLL Lock Times Parameter/Condition Min Max Unit Notes Core and platform PLL lock times — 100 μs — Local bus PLL — 50 μs — PCI bus lock time — 50 μs — MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 16 Freescale Semiconductor DDR and DDR2 SDRAM 6 DDR and DDR2 SDRAM This section describes the DC and AC electrical specifications for the DDR SDRAM interface of the MPC8533E. Note that DDR SDRAM is GVDD(typ) = 2.5 V and DDR2 SDRAM is GVDD(typ) = 1.8 V. 6.1 DDR SDRAM DC Electrical Characteristics Table 10 provides the recommended operating conditions for the DDR SDRAM component(s) of the MPC8533E when GVDD(typ) = 1.8 V. Table 10. DDR2 SDRAM DC Electrical Characteristics for GVDD(typ) = 1.8 V Parameter/Condition Symbol Min Max Unit Notes I/O supply voltage GVDD 1.71 1.89 V 1 I/O reference voltage MVREF 0.49 × GVDD 0.51 × GVDD V 2 I/O termination voltage VTT MVREF – 0.04 MVREF + 0.04 V 3 Input high voltage VIH MVREF + 0.26 GVDD + 0.3 V — Input low voltage VIL –0.3 MVREF – 0.24 V — Output leakage current IOZ –50 50 μA 4 Output high current (VOUT = 1.26 V) IOH –13.4 — mA — Output low current (VOUT = 0.33 V) IOL 13.4 — mA — Notes: 1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times. 2. MV REF is expected to be equal to 0.5 × GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak noise on MV REF may not exceed ±2% of the DC value. 3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be equal to MVREF. This rail should track variations in the DC level of MVREF. 4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD. Table 11 provides the DDR2 I/O capacitance when GVDD(typ) = 1.8 V. Table 11. DDR2 SDRAM Capacitance for GVDD(typ) = 1.8 V Parameter/Condition Symbol Min Max Unit Notes Input/output capacitance: DQ, DQS, DQS CIO 6 8 pF 1 Delta input/output capacitance: DQ, DQS, DQS CDIO — 0.5 pF 1 Note: 1. This parameter is sampled. GVDD = 1.8 V ± 0.090 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 17 DDR and DDR2 SDRAM Table 12 provides the recommended operating conditions for the DDR SDRAM component(s) when GVDD(typ) = 2.5 V. Table 12. DDR SDRAM DC Electrical Characteristics for GVDD(typ) = 2.5 V Parameter/Condition Symbol Min Max Unit Notes I/O supply voltage GVDD 2.375 2.625 V 1 I/O reference voltage MVREF 0.49 × GVDD 0.51 × GVDD V 2 I/O termination voltage VTT MVREF – 0.04 MVREF + 0.04 V 3 Input high voltage VIH MVREF + 0.31 GVDD + 0.3 V — Input low voltage VIL –0.3 MVREF – 0.3 V — Output leakage current IOZ –50 50 μA 4 Output high current (VOUT = 1.8 V) IOH –16.2 — mA — Output low current (VOUT = 0.42 V) IOL 16.2 — mA — Notes: 1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times. 2. MV REF is expected to be equal to 0.5 × GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak noise on MV REF may not exceed ±2% of the DC value. 3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be equal to MVREF. This rail should track variations in the DC level of MVREF. 4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD. Table 13 provides the DDR I/O capacitance when GVDD(typ) = 2.5 V. Table 13. DDR SDRAM Capacitance for GVDD(typ) = 2.5 V Parameter/Condition Symbol Min Max Unit Notes Input/output capacitance: DQ, DQS CIO 6 8 pF 1 Delta input/output capacitance: DQ, DQS CDIO — 0.5 pF 1 Note: 1. This parameter is sampled. GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V. Table 14 provides the current draw characteristics for MVREF. Table 14. Current Draw Characteristics for MVREF Parameter/Condition Current draw for MVREF Symbol Min Max Unit Notes IMVREF — 500 μA 1 Note: 1. The voltage regulator for MVREF must be able to supply up to 500 μA current. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 18 Freescale Semiconductor DDR and DDR2 SDRAM 6.2 DDR SDRAM AC Electrical Characteristics This section provides the AC electrical characteristics for the DDR SDRAM interface. 6.2.1 DDR SDRAM Input AC Timing Specifications Table 15 provides the input AC timing specifications for the DDR SDRAM when GVDD(typ) = 1.8 V. Table 15. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface At recommended operating conditions. Parameter Symbol Min Max Unit Notes AC input low voltage VIL — MVREF – 0.25 V — AC input high voltage VIH MVREF + 0.25 — V — Table 16 provides the input AC timing specifications for the DDR SDRAM when GVDD(typ) = 2.5 V. Table 16. DDR SDRAM Input AC Timing Specifications for 2.5-V Interface At recommended operating conditions. Parameter Symbol Min Max Unit Notes AC input low voltage VIL — MVREF – 0.31 V — AC input high voltage VIH MVREF + 0.31 — V — Unit Notes ps 1, 2 Table 17 provides the input AC timing specifications for the DDR SDRAM interface. Table 17. DDR SDRAM Input AC Timing Specifications At recommended operating conditions. Parameter Symbol Controller skew for MDQS—MDQ/MECC/MDM Min Max tCISKEW 533 MHz –300 300 3 400 MHz –365 365 — 333 MHz –390 390 — Notes: 1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that will be captured with MDQS[n]. This should be subtracted from the total timing budget. 2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW. This can be determined by the following equation: tDISKEW = ± (T/4 – abs(tCISKEW)), where T is the clock period and abs(tCISKEW) is the absolute value of tCISKEW. See Figure 3. 3. Maximum DDR1 frequency is 400 MHz. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 19 DDR and DDR2 SDRAM Figure 3 shows the DDR SDRAM input timing diagram. MCK[n] MCK[n] tMCK MDQS[n] MDQ[x] D0 D1 tDISKEW tDISKEW Figure 3. DDR SDRAM Input Timing Diagram (tDISKEW) 6.2.2 DDR SDRAM Output AC Timing Specifications Table 18 provides the output AC timing specifications for the DDR SDRAM interface. Table 18. DDR SDRAM Output AC Timing Specifications At recommended operating conditions. Parameter MCK[n] cycle time, MCK[n]/MCK[n] crossing ADDR/CMD output setup with respect to MCK Symbol1 Min Max Unit Notes tMCK 3.75 6 ns 2 ns 3 tDDKHAS 1.48 1.95 2.40 533 MHz 400 MHz 333 MHz ADDR/CMD output hold with respect to MCK tDDKHAX — — — tDDKHMH ns 1.48 1.95 2.40 — — — –0.6 0.6 3 7 — — tDDKHCX 533 MHz 400 MHz 333 MHz MCK to MDQS Skew ns 1.48 1.95 2.40 3 7 — — — — — tDDKHCS 533 MHz 400 MHz 333 MHz MCS[n] output hold with respect to MCK ns 1.48 1.95 2.40 533 MHz 400 MHz 333 MHz MCS[n] output setup with respect to MCK 7 — — — 3 7 — — ns 4 MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 20 Freescale Semiconductor DDR and DDR2 SDRAM Table 18. DDR SDRAM Output AC Timing Specifications (continued) At recommended operating conditions. Parameter Symbol1 MDQ/MECC/MDM output setup with respect to MDQS tDDKHDS, tDDKLDS 538 700 900 533 MHz 400 MHz 333 MHz MDQ/MECC/MDM output hold with respect to MDQS Min Max Notes ps 5 7 — — — — — tDDKHDX, tDDKLDX 533 MHz 400 MHz 333 MHz Unit ps 538 700 900 — — — 5 7 — — MDQS preamble tDDKHMP 0.75 x tMCK — ns 6 MDQS postamble tDDKHME 0.4 x tMCK 0.6 x tMCK ns 6 Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing (DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example, tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs (A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes low (L) until data outputs (D) are invalid (X) or data output hold time. 2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V. 3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS. 4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD) from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control of the DQSS override bits in the TIMING_CFG_2 register. This will typically be set to the same delay as the clock adjust in the CLK_CNTL register. The timing parameters listed in the table assume that these two parameters have been set to the same adjustment value. See the MPC8533E PowerQUICC III Integrated Communications Processor Reference Manual, for a description and understanding of the timing modifications enabled by use of these bits. 5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC (MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor. 6. All outputs are referenced to the rising edge of MCK[n] at the pins of the microprocessor. Note that tDDKHMP follows the symbol conventions described in note 1. 7. Maximum DDR1 frequency is 400 MHz. NOTE For the ADDR/CMD setup and hold specifications in Table 18, it is assumed that the clock control register is set to adjust the memory clocks by ½ applied cycle. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 21 DDR and DDR2 SDRAM Figure 4 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH). MCK[n] MCK[n] tMCK tDDKHMH(max) = 0.6 ns MDQS tDDKHMH(min) = –0.6 ns MDQS Figure 4. Timing Diagram for tDDKHMH Figure 5 shows the DDR SDRAM output timing diagram. MCK MCK tMCK tDDKHAS, tDDKHCS tDDKHAX, tDDKHCX ADDR/CMD Write A0 NOOP tDDKHMP tDDKHMH MDQS[n] tDDKHME tDDKHDS tDDKLDS MDQ[x] D0 D1 tDDKLDX tDDKHDX Figure 5. DDR and DDR2 SDRAM Output Timing Diagram Figure 6 provides the AC test load for the DDR bus. Output Z0 = 50 Ω RL = 50 Ω GVDD/2 Figure 6. DDR AC Test Load MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 22 Freescale Semiconductor DUART 7 DUART This section describes the DC and AC electrical specifications for the DUART interface of the MPC8533E. 7.1 DUART DC Electrical Characteristics Table 19 provides the DC electrical characteristics for the DUART interface. Table 19. DUART DC Electrical Characteristics Parameter Symbol Min Max Unit Notes High-level input voltage VIH 2 OVDD + 0.3 V — Low-level input voltage VIL –0.3 0.8 V — Input current (V IN = 0 V or VIN = VDD) IIN — ±5 μA 1 High-level output voltage (OVDD = min, IOH = –2 mA) VOH 2.4 — V — Low-level output voltage (OVDD = min, IOL = 2 mA) VOL — 0.4 V — Value Unit Notes Minimum baud rate CCB clock/1,048,576 baud 1 Maximum baud rate CCB clock/16 baud 2 16 — 3 Note: 1. Note that the symbol VIN, in this case, represents the OV IN symbol referenced in Table 1 and Table 2. 7.2 DUART AC Electrical Specifications Table 20 provides the AC timing parameters for the DUART interface. Table 20. DUART AC Timing Specifications Parameter Oversample rate Notes: 1. CCB clock refers to the platform clock. 2. Actual attainable baud rate will be limited by the latency of interrupt processing. 3. The middle of a start bit is detected as the eighth sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are sampled each sixteenth sample. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 23 Enhanced Three-Speed Ethernet (eTSEC), MII Management 8 Enhanced Three-Speed Ethernet (eTSEC), MII Management This section provides the AC and DC electrical characteristics for enhanced three-speed and MII management. 8.1 Enhanced Three-Speed Ethernet Controller (eTSEC) (10/100/1000 Mbps)—GMII/MII/TBI/RGMII/RTBI/RMII/FIFO Electrical Characteristics The electrical characteristics specified here apply to all gigabit media independent interface (GMII), 8-bit FIFO interface (FIFO), media independent interface (MII), ten-bit interface (TBI), reduced gigabit media independent interface (RGMII), reduced ten-bit interface (RTBI), and reduced media independent interface (RMII) signals except management data input/output (MDIO) and management data clock (MDC). The 8-bit FIFO interface can operate at 3.3 or 2.5 V. The RGMII and RTBI interfaces are defined for 2.5 V, while the MII, GMII, TBI, and RMII interfaces can be operated at 3.3 or 2.5 V. Whether the GMII, MII, or TBI interface is operated at 3.3 or 2.5 V, the timing is compliant with IEEE 802.3. The RGMII and RTBI interfaces follow the Reduced Gigabit Media-Independent Interface (RGMII) Specification Version 1.3 (12/10/2000). The RMII interface follows the RMII Consortium RMII Specification Version 1.2 (3/20/1998). The electrical characteristics for MDIO and MDC are specified in Section 9, “Ethernet Management Interface Electrical Characteristics.” 8.2 eTSEC DC Electrical Characteristics All GMII, MII, TBI, RGMII, RTBI, RMII, and FIFO drivers and receivers comply with the DC parametric attributes specified in Table 21 and Table 22. The potential applied to the input of a GMII, MII, TBI, RTBI, RMII, and FIFO receiver may exceed the potential of the receiver’s power supply (that is, a GMII driver powered from a 3.6-V supply driving VOH into a GMII receiver powered from a 2.5-V supply). Tolerance for dissimilar GMII driver and receiver supply potentials is implicit in these specifications. The RGMII and RTBI signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5. Table 21. GMII, MII, TBI, RMII and FIFO DC Electrical Characteristics Parameter Symbol Min Max Unit Notes LVDD TVDD 3.135 3.465 V 1, 2 Output high voltage (LVDD/TVDD = Min, IOH = –4.0 mA) VOH 2.4 — V — Output low voltage (LV DD/TVDD = Min, IOL = 4.0 mA) VOL — 0.5 V — Input high voltage VIH 1.95 — V — Input low voltage VIL — 0.90 V — Input high current (VIN = LVDD, VIN = TVDD) IIH — 40 μA 1, 2, 3 Supply voltage 3.3 V MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 24 Freescale Semiconductor Enhanced Three-Speed Ethernet (eTSEC), MII Management Table 21. GMII, MII, TBI, RMII and FIFO DC Electrical Characteristics (continued) Parameter Input low current (V IN = GND) Symbol Min Max Unit Notes IIL –600 — μA 3 Notes: 1. LVDD supports eTSEC1. 2. TVDD supports eTSEC3. 3. The symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2. Table 22. GMII, MII, RMII, RGMII, RTBI, TBI, and FIFO DC Electrical Characteristics Parameters Symbol Min Max Unit Notes LVDD/TVDD 2.375 2.625 V 1, 2 Output high voltage (LVDD/TVDD = Min, IOH = –1.0 mA) VOH 2.0 — V — Output low voltage (LV DD/TVDD = Min, IOL = 1.0 mA) VOL — 0.4 V — Input high voltage VIH 1.70 — V — Input low voltage VIL — 0.7 V — Input current (V IN = 0, VIN = LVDD, VIN = TVDD) IIN — ±15 μA 1, 2, 3 Supply voltage 2.5 V Notes: 1. LVDD supports eTSEC1. 2. TVDD supports eTSEC3. 3. The symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2. 8.3 FIFO, GMII,MII, TBI, RGMII, RMII, and RTBI AC Timing Specifications The AC timing specifications for FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI are presented in this section. 8.3.1 FIFO AC Specifications The basis for the AC specifications for the eTSEC FIFO modes is the double data rate RGMII and RTBI specifications, since they have similar performance and are described in a source-synchronous fashion like FIFO modes. However, the FIFO interface provides deliberate skew between the transmitted data and source clock in GMII fashion. When the eTSEC is configured for FIFO modes, all clocks are supplied from external sources to the relevant eTSEC interface. That is, the transmit clock must be applied to the eTSECn TSECn_TX_CLK, while the receive clock must be applied to pin TSECn_RX_CLK. The eTSEC internally uses the transmit clock to synchronously generate transmit data and outputs an echoed copy of the transmit clock back out onto the TSECn_GTX_CLK pin (while transmit data appears on TSECn_TXD[7:0], for example). It is intended that external receivers capture eTSEC transmit data using the clock on TSECn_GTX_CLK as a source-synchronous timing reference. Typically, the clock edge that launched the data can be used, since the clock is delayed by the eTSEC to allow acceptable set-up margin at the receiver. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 25 Enhanced Three-Speed Ethernet (eTSEC), MII Management A summary of the FIFO AC specifications appears in Table 23 and Table 24. Table 23. FIFO Mode Transmit AC Timing Specification At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5% Parameter/Condition Symbol Min Typ Max Unit Notes TX_CLK, GTX_CLK clock period tFIT — 8.0 — ns — TX_CLK, GTX_CLK duty cycle tFITH 45 50 55 % — TX_CLK, GTX_CLK peak-to-peak jitter tFITJ — — 250 ps — Rise time TX_CLK (20%–80%) tFITR — — 0.75 ns — Fall time TX_CLK (80%–20%) tFITF — — 0.75 ns — GTX_CLK to FIFO data TXD[7:0], TX_ER, TX_EN hold time tFITDX 0.5 — 3.0 ns 1 Note: 1. Data valid tFITDV to GTX_CLK Min setup time is a function of clock period and max hold time. (Min setup = Cycle time – Max hold). Table 24. FIFO Mode Receive AC Timing Specification At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5% Parameter/Condition Symbol Min Typ Max Unit Notes tFIR — 8.0 — ns — tFIRH/tFIRH 45 50 55 % — RX_CLK peak-to-peak jitter tFIRJ — — 250 ps — Rise time RX_CLK (20%–80%) tFIRR — — 0.75 ns — Fall time RX_CLK (80%–20%) tFIRF — — 0.75 ns — RXD[7:0], RX_DV, RX_ER setup time to RX_CLK tFIRDV 1.5 — — ns — RX_CLK to RXD[7:0], RX_DV, RX_ER hold time tFIRDX 0.5 — — ns — RX_CLK clock period RX_CLK duty cycle Timing diagrams for FIFO appear in Figure 7 and Figure 8. tFITF tFIT tFITR GTX_CLK tFITH tFITDV tFITDX TXD[7:0] TX_EN TX_ER Figure 7. FIFO Transmit AC Timing Diagram MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 26 Freescale Semiconductor Enhanced Three-Speed Ethernet (eTSEC), MII Management tFIRR tFIR RX_CLK tFIRH tFIRF RXD[7:0] RX_DV RX_ER Valid Data tFIRDX tFIRDV Figure 8. FIFO Receive AC Timing Diagram 8.3.2 GMII AC Timing Specifications This section describes the GMII transmit and receive AC timing specifications. 8.3.2.1 GMII Transmit AC Timing Specifications Table 25 provides the GMII transmit AC timing specifications. Table 25. GMII Transmit AC Timing Specifications At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5% Symbol1 Min Typ Max Unit Notes tGTX — 8.0 — ns — tGTKHDX 0.2 — 5.0 ns 2 GTX_CLK data clock rise time (20%-80%) tGTXR — — 1.0 ns — GTX_CLK data clock fall time (80%-20%) tGTXF — — 1.0 ns — Parameter/Condition GTX_CLK clock period GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay Notes: 1. The symbols used for timing specifications follow the pattern t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV symbolizes GMII transmit timing (GT) with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) reaching the valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII transmit timing (GT) with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) going invalid (X) or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tGTX represents the GMII(G) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. Data valid tGTKHDV to GTX_CLK Min setup time is a function of clock period and max hold time (Min setup = cycle time – Max delay). MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 27 Enhanced Three-Speed Ethernet (eTSEC), MII Management Figure 9 shows the GMII transmit AC timing diagram. tGTXR tGTX GTX_CLK tGTXH tGTXF TXD[7:0] TX_EN TX_ER tGTKHDX tGTKHDV Figure 9. GMII Transmit AC Timing Diagram 8.3.2.2 GMII Receive AC Timing Specifications Table 26 provides the GMII receive AC timing specifications. Table 26. GMII Receive AC Timing Specifications At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5% Symbol1 Min Typ Max Unit Notes tGRX — 8.0 — ns — tGRXH/tGRX 35 — 65 % — RXD[7:0], RX_DV, RX_ER setup time to RX_CLK tGRDVKH 2.0 — — ns — RX_CLK to RXD[7:0], RX_DV, RX_ER hold time tGRDXKH 0.5 — — ns — RX_CLK clock rise (20%–80%) tGRXR — — 1.0 ns — RX_CLK clock fall time (80%–20%) tGRXF — — 1.0 ns — Parameter/Condition RX_CLK clock period RX_CLK duty cycle Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock reference (K) going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tGRX represents the GMII (G) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 10 provides the AC test load for eTSEC. Output Z0 = 50 Ω RL = 50 Ω LVDD/2 Figure 10. eTSEC AC Test Load MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 28 Freescale Semiconductor Enhanced Three-Speed Ethernet (eTSEC), MII Management Figure 11 shows the GMII receive AC timing diagram. tGRX tGRXR RX_CLK tGRXF tGRXH RXD[7:0] RX_DV RX_ER tGRDXKH tGRDVKH Figure 11. GMII Receive AC Timing Diagram 8.4 MII AC Timing Specifications This section describes the MII transmit and receive AC timing specifications. 8.4.1 MII Transmit AC Timing Specifications Table 27 provides the MII transmit AC timing specifications. Table 27. MII Transmit AC Timing Specifications At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5% Symbol1 Min Typ Max Unit Notes TX_CLK clock period 10 Mbps tMTX — 400 — ns — TX_CLK clock period 100 Mbps tMTX — 40 — ns — tMTXH/tMTX 35 — 65 % — tMTKHDX 1 5 15 ns — TX_CLK data clock rise (20%–80%) tMTXR 1.0 — 4.0 ns — TX_CLK data clock fall (80%–20%) tMTXF 1.0 — 4.0 ns — Parameter/Condition TX_CLK duty cycle TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 29 Enhanced Three-Speed Ethernet (eTSEC), MII Management Figure 12 shows the MII transmit AC timing diagram. tMTX tMTXR TX_CLK tMTXF tMTXH TXD[3:0] TX_EN TX_ER tMTKHDX Figure 12. MII Transmit AC Timing Diagram 8.4.2 MII Receive AC Timing Specifications Table 28 provides the MII receive AC timing specifications. Table 28. MII Receive AC Timing Specifications At recommended operating conditions with L/TVDD of 3.3 V ± 5%.or 2.5 V ± 5%. Symbol1 Min Typ Max Unit Notes RX_CLK clock period 10 Mbps tMRX — 400 — ns — RX_CLK clock period 100 Mbps tMRX — 40 — ns — tMRXH/tMRX 35 — 65 % — RXD[3:0], RX_DV, RX_ER setup time to RX_CLK tMRDVKH 10.0 — — ns — RXD[3:0], RX_DV, RX_ER hold time to RX_CLK tMRDXKH 10.0 — — ns — RX_CLK clock rise (20%–80%) tMRXR 1.0 — 4.0 ns — RX_CLK clock fall time (80%–20%) tMRXF 1.0 — 4.0 ns — Parameter/Condition RX_CLK duty cycle Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 13 provides the AC test load for eTSEC. Output Z0 = 50 Ω RL = 50 Ω LVDD/2 Figure 13. eTSEC AC Test Load MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 30 Freescale Semiconductor Enhanced Three-Speed Ethernet (eTSEC), MII Management Figure 14 shows the MII receive AC timing diagram. tMRX tMRXR RX_CLK tMRXF tMRXH RXD[3:0] RX_DV RX_ER Valid Data tMRDVKH tMRDXKL Figure 14. MII Receive AC Timing Diagram 8.5 TBI AC Timing Specifications This section describes the TBI transmit and receive AC timing specifications. 8.5.1 TBI Transmit AC Timing Specifications Table 29 provides the TBI transmit AC timing specifications. Table 29. TBI Transmit AC Timing Specifications At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5%.. Symbol1 Min Typ Max Unit Notes tGTX — 8.0 — ns — tTTKHDX 0.2 — 5.0 ns 2 GTX_CLK rise (20%–80%) tTTXR — — 1.0 ns — GTX_CLK fall time (80%–20%) tTTXF — — 1.0 ns — Parameter/Condition GTX_CLK clock period GTX_CLK to TCG[9:0] delay time Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state )(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTTKHDV symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the valid state (V) or setup time. Also, tTTKHDX symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the invalid state (X) or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tTTX represents the TBI (T) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. Data valid tTTKHDV to GTX_CLK Min setup time is a function of clock period and max hold time (Min setup = cycle time – Max delay). MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 31 Enhanced Three-Speed Ethernet (eTSEC), MII Management Figure 15 shows the TBI transmit AC timing diagram. tTTXR tTTX GTX_CLK tTTXH tTTXF TCG[9:0] tTTKHDV tTTKHDX Figure 15. TBI Transmit AC Timing Diagram 8.5.2 TBI Receive AC Timing Specifications Table 30 provides the TBI receive AC timing specifications. Table 30. TBI Receive AC Timing Specifications At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5%. Symbol1 Min Typ Max Unit Notes tTRX — 16.0 — ns — tSKTRX 7.5 — 8.5 ns — tTRXH/tTRX 40 — 60 % — RCG[9:0] setup time to rising PMA_RX_CLK tTRDVKH 2.5 — — ns — PMA_RX_CLK to RCG[9:0] hold time tTRDXKH 1.5 — — ns — PMA_RX_CLK[0:1] clock rise time (20%-80%) tTRXR 0.7 — 2.4 ns — PMA_RX_CLK[0:1] clock fall time (80%-20%) tTRXF 0.7 — 2.4 ns — Parameter/Condition PMA_RX_CLK[0:1] clock period PMA_RX_CLK[0:1] skew PMA_RX_CLK[0:1] duty cycle Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTRDVKH symbolizes TBI receive timing (TR) with respect to the time data input signals (D) reach the valid state (V) relative to the tTRX clock reference (K) going to the high (H) state or setup time. Also, tTRDXKH symbolizes TBI receive timing (TR) with respect to the time data input signals (D) went invalid (X) relative to the tTRX clock reference (K) going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tTRX represents the TBI (T) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). For symbols representing skews, the subscript is skew (SK) followed by the clock that is being skewed (TRX). MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 32 Freescale Semiconductor Enhanced Three-Speed Ethernet (eTSEC), MII Management Figure 16 shows the TBI receive AC timing diagram. tTRX tTRXR PMA_RX_CLK1 tTRXH tTRXF Valid Data RCG[9:0] Valid Data tTRDVKH tSKTRX tTRDXKH PMA_RX_CLK0 tTRXH tTRDXKH tTRDVKH Figure 16. TBI Receive AC Timing Diagram 8.5.3 TBI Single-Clock Mode AC Specifications When the eTSEC is configured for TBI modes, all clocks are supplied from external sources to the relevant eTSEC interface. In single-clock TBI mode, when TBICON[CLKSEL] = 1, a 125-MHz TBI receive clock is supplied on the TSECn_RX_CLK pin (no receive clock is used on TSECn_TX_CLK in this mode, whereas for the dual-clock mode this is the PMA1 receive clock). The 125-MHz transmit clock is applied on the TSEC_GTX_CLK125 pin in all TBI modes. A summary of the single-clock TBI mode AC specifications for receive appears in Table 31. Table 31. TBI Single-Clock Mode Receive AC Timing Specification Parameter/Condition Symbol Min Typ Max Unit Notes RX_CLK clock period tTRR 7.5 8.0 8.5 ns — RX_CLK duty cycle tTRRH 40 50 60 % — RX_CLK peak-to-peak jitter tTRRJ — — 250 ps — Rise time RX_CLK (20%–80%) tTRRR — — 1.0 ns — Fall time RX_CLK (80%–20%) tTRRF — — 1.0 ns — RCG[9:0] setup time to RX_CLK rising edge tTRRDV 2.0 — — ns — RCG[9:0] hold time to RX_CLK rising edge tTRRDX 1.0 — — ns — MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 33 Enhanced Three-Speed Ethernet (eTSEC), MII Management A timing diagram for TBI receive appears in Figure 17. . tTRR tTRRR RX_CLK tTRRF tTRRH RCG[9:0] Valid Data tTRRDV tTRRDX Figure 17. TBI Single-Clock Mode Receive AC Timing Diagram 8.5.4 RGMII and RTBI AC Timing Specifications Table 32 presents the RGMII and RTBI AC timing specifications. Table 32. RGMII and RTBI AC Timing Specifications At recommended operating conditions with L/TVDD of 2.5 V ± 5%. Symbol1 Min Typ Max Unit Notes Data to clock output skew (at transmitter) tSKRGT_TX –500 0 500 ps 5 Data to clock input skew (at receiver) tSKRGT_RX 1.0 — 2.8 ns 2 tRGT 7.2 8.0 8.8 ns 3 tRGTH/tRGT 40 50 60 % 3, 4 Rise time (20%–80%) tRGTR — — 0.75 ns Fall time (20%–80%) tRGTF — — 0.75 ns Parameter/Condition Clock period duration Duty cycle for 10BASE-T and 100BASE-TX Notes: 1. In general, the clock reference symbol representation for this section is based on the symbols RGT to represent RGMII and RTBI timing. For example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Note also that the notation for rise (R) and fall (F) times follows the clock symbol that is being represented. For symbols representing skews, the subscript is skew (SK) followed by the clock that is being skewed (RGT). 2. This implies that PC board design will require clocks to be routed such that an additional trace delay of greater than 1.5 ns will be added to the associated clock signal. 3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively. 4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned between. 5. Guaranteed by design. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 34 Freescale Semiconductor Enhanced Three-Speed Ethernet (eTSEC), MII Management Figure 18 shows the RGMII and RTBI AC timing and multiplexing diagrams. tRGT tRGTH GTX_CLK (At Transmitter) tSKRGT_TX TXD[8:5][3:0] TXD[7:4][3:0] TXD[8:5] TXD[3:0] TXD[7:4] TXD[4] TXEN TX_CTL TXD[9] TXERR tSKRGT_RX TX_CLK (At PHY) tRGT tRGTH GTX_CLK (At Receiver) RXD[8:5][3:0] RXD[7:4][3:0] RXD[8:5] RXD[3:0] RXD[7:4] tSKRGT_TX RXD[4] RXDV RX_CTL RXD[9] RXERR tSKRGT_RX RX_CLK (At PHY) Figure 18. RGMII and RTBI AC Timing and Multiplexing Diagrams 8.5.5 RMII AC Timing Specifications This section describes the RMII transmit and receive AC timing specifications. 8.5.5.1 RMII Transmit AC Timing Specifications The RMII transmit AC timing specifications are in Table 33. Table 33. RMII Transmit AC Timing Specifications At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5%. Symbol1 Min Typ Max Unit Notes REF_CLK clock period tRMT 15.0 20.0 25.0 ns — REF_CLK duty cycle tRMTH 35 50 65 % — REF_CLK peak-to-peak jitter tRMTJ — — 250 ps — Rise time REF_CLK (20%–80%) tRMTR 1.0 — 2.0 ns — Fall time REF_CLK (80%–20%) tRMTF 1.0 — 2.0 ns — Parameter/Condition MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 35 Enhanced Three-Speed Ethernet (eTSEC), MII Management Table 33. RMII Transmit AC Timing Specifications (continued) At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5%. Parameter/Condition REF_CLK to RMII data TXD[1:0], TX_EN delay Symbol1 Min Typ Max Unit Notes tRMTDX 1.0 — 10.0 ns — Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 19 shows the RMII transmit AC timing diagram. tRMTR tRMT REF_CLK tRMTF tRMTH TXD[1:0] TX_EN TX_ER tRMTDX Figure 19. RMII Transmit AC Timing Diagram 8.5.5.2 RMII Receive AC Timing Specifications Table 34 shows the RMII receive AC timing specifications. Table 34. RMII Receive AC Timing Specifications At recommended operating conditions with L/TVDD of 3.3 V ± 5%.or 2.5 V ± 5%. Symbol1 Min Typ Max Unit Notes tRMR 15.0 20.0 25.0 ns — REF_CLK duty cycle tRMRH 35 50 65 % — REF_CLK peak-to-peak jitter tRMRJ — — 250 ps — Rise time REF_CLK (20%–80%) tRMRR 1.0 — 2.0 ns — Fall time REF_CLK (80%–20%) tRMRF 1.0 — 2.0 ns — RXD[1:0], CRS_DV, RX_ER setup time to REF_CLK rising edge tRMRDV 4.0 — — ns — Parameter/Condition REF_CLK clock period MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 36 Freescale Semiconductor Enhanced Three-Speed Ethernet (eTSEC), MII Management Table 34. RMII Receive AC Timing Specifications (continued) At recommended operating conditions with L/TVDD of 3.3 V ± 5%.or 2.5 V ± 5%. Parameter/Condition Symbol1 Min Typ Max Unit Notes RXD[1:0], CRS_DV, RX_ER hold time to REF_CLK rising edge tRMRDX 2.0 — — ns — Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Figure 20 provides the AC test load for eTSEC. Z0 = 50 Ω Output RL = 50 Ω LVDD/2 Figure 20. eTSEC AC Test Load Figure 21 shows the RMII receive AC timing diagram. tRMR tRMRR REF_CLK tRMRH RXD[1:0] CRS_DV RX_ER tRMRF Valid Data tRMRDV tRMRDX Figure 21. RMII Receive AC Timing Diagram MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 37 Ethernet Management Interface Electrical Characteristics 9 Ethernet Management Interface Electrical Characteristics The electrical characteristics specified here apply to MII management interface signals MDIO (management data input/output) and MDC (management data clock). The electrical characteristics for GMII, RGMII, RMII, TBI, and RTBI are specified in “Section 8, “Enhanced Three-Speed Ethernet (eTSEC), MII Management.” 9.1 MII Management DC Electrical Characteristics The MDC and MDIO are defined to operate at a supply voltage of 3.3 V. The DC electrical characteristics for MDIO and MDC are provided in Table 35. Table 35. MII Management DC Electrical Characteristics Parameter Symbol Min Max Unit Notes OVDD 3.135 3.465 V — Output high voltage (OVDD = Min, IOH = –1.0 mA) VOH 2.10 3.60 V — Output low voltage (OVDD = Min, IOL = 1.0 mA) VOL GND 0.50 V — Input high voltage VIH 1.95 — V — Input low voltage VIL — 0.90 V — Input high current (OVDD = Max, VIN = 2.1 V) IIH — 40 μA 1 Input low current (OVDD = Max, VIN = 0.5 V) IIL –600 — μA — Supply voltage (3.3 V) Note: 1. The symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2. 9.2 MII Management AC Electrical Specifications Table 36 provides the MII management AC timing specifications. Table 36. MII Management AC Timing Specifications At recommended operating conditions with OVDD is 3.3 V ± 5%. Symbol1 Min Typ Max Unit Notes MDC frequency fMDC — 2.5 — MHz 2 MDC period tMDC — 400 — ns — MDC clock pulse width high tMDCH 32 — — ns — MDC to MDIO delay tMDKHDX (16 × tplb_clk) – 3 — (16 × tplb_clk) + 3 ns 3, 4 MDIO to MDC setup time tMDDVKH 5 — — ns — MDIO to MDC hold time tMDDXKH 0 — — ns — tMDCR — — 10 ns — Parameter/Condition MDC rise time MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 38 Freescale Semiconductor Ethernet Management Interface Electrical Characteristics Table 36. MII Management AC Timing Specifications (continued) At recommended operating conditions with OVDD is 3.3 V ± 5%. Parameter/Condition Symbol1 Min Typ Max Unit Notes tMDHF — — 10 ns — MDC fall time Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX symbolizes management data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are invalid (X) or data hold time. Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data input signals (D) reach the valid state (V) relative to the tMDC clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. This parameter is dependent on the platform clock frequency (MIIMCFG [MgmtClk] field determines the clock frequency of the MgmtClk Clock EC_MDC). 3. This parameter is dependent on the platform clock frequency. The delay is equal to 16 platform clock periods ±3 ns. For example, with a platform clock of 333 MHz, the min/max delay is 48 ns ± 3 ns. Similarly, if the platform clock is 400 MHz, the min/max delay is 40 ns ± 3 ns). 4. tplb_clk is the platform (CCB) clock. Figure 22 shows the MII management AC timing diagram. tMDC tMDCR MDC tMDCF tMDCH MDIO (Input) tMDDVKH tMDDXKH MDIO (Output) tMDKHDX Figure 22. MII Management Interface Timing Diagram MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 39 Local Bus 10 Local Bus This section describes the DC and AC electrical specifications for the local bus interface of the MPC8533E. 10.1 Local Bus DC Electrical Characteristics Table 37 provides the DC electrical characteristics for the local bus interface operating at BVDD = 3.3 V DC. Table 37. Local Bus DC Electrical Characteristics (3.3 V DC) Parameter Symbol Min Max Unit Notes High-level input voltage VIH 2 BVDD + 0.3 V — Low-level input voltage VIL –0.3 0.8 V — Input current (BV IN = 0 V or BVIN = BOVDD) IIN — ±5 μA 1 High-level output voltage (BVDD = min, IOH = –2 mA) VOH 2.4 — V — Low-level output voltage (BV DD = min, IOL = 2 mA) VOL — 0.4 V — Note: 1. The symbol BVIN, in this case, represents the BVIN symbol referenced in Table 1 and Table 2. Table 38 provides the DC electrical characteristics for the local bus interface operating at BVDD = 2.5 V DC. Table 38. Local Bus DC Electrical Characteristics (2.5 V DC) Parameter Symbol Min Max Unit Notes High-level input voltage VIH 1.70 BVDD + 0.3 V — Low-level input voltage VIL –0.3 0.7 V — Input current (BV IN = 0 V or BVIN = BVDD) IIN — ±15 μA 1 High-level output voltage (BVDD = min, IOH = –1 mA) VOH 2.0 — V — Low-level output voltage (BV DD = min, IOL = 1 mA) VOL — 0.4 V — Note: 1. The symbol BVIN, in this case, represents the BVIN symbol referenced in Table 1 and Table 2. Table 39 provides the DC electrical characteristics for the local bus interface operating at BVDD = 1.8 V DC. Table 39. Local Bus DC Electrical Characteristics (1.8 V DC) Parameter Symbol Min Max Unit Notes High-level input voltage VIH 1.3 BVDD + 0.3 V — Low-level input voltage VIL –0.3 0.6 V — Input current (BV IN = 0 V or BVIN = BVDD) IIN — ±15 μA 1 MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 40 Freescale Semiconductor Local Bus Table 39. Local Bus DC Electrical Characteristics (1.8 V DC) (continued) Parameter Symbol Min Max Unit Notes High-level output voltage (BVDD = min, IOH = –2 mA) VOH 1.35 — V — Low-level output voltage (BVDD = min, IOL = 2 mA) VOL — 0.45 V — 10.2 Local Bus AC Electrical Specifications Table 40 describes the general timing parameters of the local bus interface at BVDD = 3.3 V. For information about the frequency range of local bus see Section 19.1, “Clock Ranges.” Table 40. Local Bus General Timing Parameters (BVDD = 3.3 V)—PLL Enabled Symbol1 Min Max Unit Notes Local bus cycle time tLBK 7.5 12 ns 2 Local bus duty cycle tLBKH/tLBK 43 57 % — LCLK[n] skew to LCLK[m] or LSYNC_OUT tLBKSKEW — 150 ps 7, 8 Input setup to local bus clock (except LUPWAIT) tLBIVKH1 2.5 — ns 3, 4 LUPWAIT input setup to local bus clock tLBIVKH2 1.85 — ns 3, 4 Input hold from local bus clock (except LUPWAIT) tLBIXKH1 1.0 — ns 3, 4 LUPWAIT input hold from local bus clock tLBIXKH2 1.0 — ns 3, 4 LALE output transition to LAD/LDP output transition (LATCH setup and hold time) tLBOTOT 1.5 — ns 6 Local bus clock to output valid (except LAD/LDP and LALE) tLBKHOV1 — 2.9 ns — Local bus clock to data valid for LAD/LDP tLBKHOV2 — 2.8 ns — Local bus clock to address valid for LAD tLBKHOV3 — 2.7 ns 3 Local bus clock to LALE assertion tLBKHOV4 — 2.7 ns 3 Output hold from local bus clock (except LAD/LDP and LALE) tLBKHOX1 0.7 — ns 3 Output hold from local bus clock for LAD/LDP tLBKHOX2 0.7 — ns 3 Local bus clock to output high Impedance (except LAD/LDP and LALE) tLBKHOZ1 — 2.5 ns 5 Parameter MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 41 Local Bus Table 40. Local Bus General Timing Parameters (BVDD = 3.3 V)—PLL Enabled (continued) Parameter Local bus clock to output high impedance for LAD/LDP Symbol1 Min Max Unit Notes tLBKHOZ2 — 2.5 ns 5 Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the t LBK clock reference (K) goes high (H), in this case for clock one (1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time. 2. All timings are in reference to LSYNC_IN for PLL enabled and internal local bus clock for PLL bypass mode. 3. All signals are measured from BVDD/2 of the rising edge of LSYNC_IN for PLL enabled or internal local bus clock for PLL bypass mode to 0.4 × BVDD of the signal in question for 3.3-V signaling levels. 4. Input timings are measured at the pin. 5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any change in LAD. tLBOTOT is programmed with the LBCR[AHD] parameter. 7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between complementary signals at BV DD/2. Table 41 describes the general timing parameters of the local bus interface at BVDD = 2.5 V. Table 41. Local Bus General Timing Parameters (BVDD = 2.5 V)—PLL Enabled Symbol1 Min Max Unit Notes Local bus cycle time tLBK 7.5 12 ns 2 Local bus duty cycle tLBKH/tLBK 43 57 % — LCLK[n] skew to LCLK[m] or LSYNC_OUT tLBKSKEW — 150 ps 7 Input setup to local bus clock (except LUPWAIT) tLBIVKH1 2.4 — ns 3, 4 LUPWAIT input setup to local bus clock tLBIVKH2 1.8 — ns 3, 4 Input hold from local bus clock (except LUPWAIT) tLBIXKH1 1.1 — ns 3, 4 LUPWAIT input hold from local bus clock tLBIXKH2 1.1 — ns 3, 4 LALE output transition to LAD/LDP output transition (LATCH setup and hold time) tLBOTOT 1.5 — ns 6 Local bus clock to output valid (except LAD/LDP and LALE) tLBKHOV1 — 2.8 ns — Local bus clock to data valid for LAD/LDP tLBKHOV2 — 2.8 ns 3 Local bus clock to address valid for LAD tLBKHOV3 — 2.8 ns 3 Local bus clock to LALE assertion tLBKHOV4 — 2.8 ns 3 Output hold from local bus clock (except LAD/LDP and LALE) tLBKHOX1 0.8 — ns 3 Output hold from local bus clock for LAD/LDP tLBKHOX2 0.8 — ns 3 Local bus clock to output high Impedance (except LAD/LDP and LALE) tLBKHOZ1 — 2.6 ns 5 Parameter MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 42 Freescale Semiconductor Local Bus Table 41. Local Bus General Timing Parameters (BVDD = 2.5 V)—PLL Enabled (continued) Parameter Local bus clock to output high impedance for LAD/LDP Symbol1 Min Max Unit Notes tLBKHOZ2 — 2.6 ns 5 Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for clock one (1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time. 2. All timings are in reference to LSYNC_IN for PLL enabled and internal local bus clock for PLL bypass mode. 3. All signals are measured from BVDD/2 of the rising edge of LSYNC_IN for PLL enabled or internal local bus clock for PLL bypass mode to 0.4 × BVDD of the signal in question for 2.5-V signaling levels. 4. Input timings are measured at the pin. 5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any change in LAD. tLBOTOT is programmed with the LBCR[AHD] parameter. 7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between complementary signals at BV DD/2. Table 42 describes the general timing parameters of the local bus interface at BVDD = 1.8 V DC. Table 42. Local Bus General Timing Parameters (BVDD = 1.8 V DC) Symbol1 Min Max Unit Notes Local bus cycle time tLBK 7.5 12 ns 2 Local bus duty cycle tLBKH/tLBK 43 57 % — LCLK[n] skew to LCLK[m] or LSYNC_OUT tLBKSKEW — 150 ps 7 Input setup to local bus clock (except LUPWAIT) tLBIVKH1 2.6 — ns 3, 4 LUPWAIT input setup to local bus clock tLBIVKH2 1.9 — ns 3, 4 Input hold from local bus clock (except LUPWAIT) tLBIXKH1 1.1 — ns 3, 4 LUPWAIT input hold from local bus clock tLBIXKH2 1.1 — ns 3, 4 LALE output transition to LAD/LDP output transition (LATCH setup and hold time) tLBOTOT 1.2 — ns 6 Local bus clock to output valid (except LAD/LDP and LALE) tLBKHOV1 — 3.2 ns — Local bus clock to data valid for LAD/LDP tLBKHOV2 — 3.2 ns 3 Local bus clock to address valid for LAD tLBKHOV3 — 3.2 ns 3 Local bus clock to LALE assertion tLBKHOV4 — 3.2 ns 3 Output hold from local bus clock (except LAD/LDP and LALE) tLBKHOX1 0.9 — ns 3 Output hold from local bus clock for LAD/LDP tLBKHOX2 0.9 — ns 3 Local bus clock to output high Impedance (except LAD/LDP and LALE) tLBKHOZ1 — 2.6 ns 5 Parameter MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 43 Local Bus Table 42. Local Bus General Timing Parameters (BVDD = 1.8 V DC) (continued) Parameter Local bus clock to output high impedance for LAD/LDP Symbol1 Min Max Unit Notes tLBKHOZ2 — 2.6 ns 5 Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the t LBK clock reference (K) goes high (H), in this case for clock one (1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time. 2. All timings are in reference to LSYNC_IN for PLL enabled and internal local bus clock for PLL bypass mode. 3. All signals are measured from BVDD/2 of the rising edge of LSYNC_IN for PLL enabled or internal local bus clock for PLL bypass mode to 0.4 × BVDD of the signal in question for 1.8-V signaling levels. 4. Input timings are measured at the pin. 5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any change in LAD. tLBOTOT is programmed with the LBCR[AHD] parameter. 7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between complementary signals at BV DD/2. Figure 23 provides the AC test load for the local bus. Output Z0 = 50 Ω RL = 50 Ω BVDD/2 Figure 23. Local Bus AC Test Load MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 44 Freescale Semiconductor Local Bus Figure 24 through Figure 29 show the local bus signals. LSYNC_IN tLBIXKH1 tLBIVKH1 Input Signals: LAD[0:31]/LDP[0:3] tLBIXKH2 tLBIVKH2 Input Signal: LGTA LUPWAIT Output Signals: LA[27:31]/LBCTL/LBCKE/LOE/ LSDA10/LSDWE/LSDRAS/ LSDCAS/LSDDQM[0:3] tLBKHOV1 tLBKHOZ1 tLBKHOX1 tLBKHOV2 tLBKHOZ2 tLBKHOX2 Output (Data) Signals: LAD[0:31]/LDP[0:3] tLBKHOV3 tLBKHOZ2 tLBKHOX2 Output (Address) Signal: LAD[0:31] tLBOTOT tLBKHOV4 LALE Figure 24. Local Bus Signals (PLL Enabled) Table 43 describes the general timing parameters of the local bus interface at VDD = 3.3 V DC with PLL disabled. Table 43. Local Bus General Timing Parameters—PLL Bypassed Symbol1 Min Max Unit Notes Local bus cycle time tLBK 12 — ns 2 Local bus duty cycle tLBKH/tLBK 43 57 % — Internal launch/capture clock to LCLK delay tLBKHKT 1.2 4.9 ns — Input setup to local bus clock (except LUPWAIT) tLBIVKH1 7.4 — ns 4, 5 LUPWAIT input setup to local bus clock tLBIVKL2 6.75 — ns 4, 5 Input hold from local bus clock (except LUPWAIT) tLBIXKH1 –0.2 — ns 4, 5 LUPWAIT input hold from local bus clock tLBIXKL2 –0.2 — ns 4, 5 LALE output transition to LAD/LDP output transition (LATCH hold time) tLBOTOT 1.5 — ns 6 Local bus clock to output valid (except LAD/LDP and LALE) tLBKLOV1 — 1.6 ns — Parameter MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 45 Local Bus Table 43. Local Bus General Timing Parameters—PLL Bypassed (continued) Symbol1 Min Max Unit Notes Local bus clock to data valid for LAD/LDP tLBKLOV2 — 1.6 ns 4 Local bus clock to address valid for LAD, and LALE tLBKLOV3 — 1.6 ns 4 Output hold from local bus clock (except LAD/LDP and LALE) tLBKLOX1 –4.1 — ns 4 Output hold from local bus clock for LAD/LDP tLBKLOX2 –4.1 — ns 4 Local bus clock to output high Impedance (except LAD/LDP and LALE) tLBKLOZ1 — 1.4 ns 7 Local bus clock to output high impedance for LAD/LDP tLBKLOZ2 — 1.4 ns 7 Parameter Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for clock one (1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold time. 2. All timings are in reference to local bus clock for PLL bypass mode. Timings may be negative with respect to the local bus clock because the actual launch and capture of signals is done with the internal launch/capture clock, which proceeds LCLK by tLBKHKT. 3. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between complementary signals at BV DD/2. 4. All signals are measured from BVDD/2 of the rising edge of local bus clock for PLL bypass mode to 0.4 × BVDD of the signal in question for 3.3-V signaling levels. 5. Input timings are measured at the pin. 6. The value of tLBOTOT is the measurement of the minimum time between the negation of LALE and any change in LAD. 7. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 46 Freescale Semiconductor Local Bus Internal Launch/Capture Clock tLBKHKT LCLK[n] tLBIVKH1 tLBIXKH1 Input Signals: LAD[0:31]/LDP[0:3] tLBIVKL2 Input Signal: LGTA tLBIXKL2 LUPWAIT tLBKLOV1 tLBKLOX1 Output Signals: LA[27:31]/LBCTL/LBCKE/LOE/ LSDA10/LSDWE/LSDRAS/ LSDCAS/LSDDQM[0:3] tLBKLOZ1 tLBKLOZ2 tLBKLOV2 Output (Data) Signals: LAD[0:31]/LDP[0:3] tLBKLOX2 tLBKLOV3 Output (Address) Signal: LAD[0:31] tLBOTOT LALE Figure 25. Local Bus Signals (PLL Bypass Mode) NOTE In PLL bypass mode, LCLK[n] is the inverted version of the internal clock with the delay of tLBKHKT. In this mode, signals are launched at the rising edge of the internal clock and are captured at falling edge of the internal clock withe the exception of LGTA/LUPWAIT (which is captured on the rising edge of the internal clock). MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 47 Local Bus LSYNC_IN T1 T3 GPCM Mode Output Signals: LCS[0:7]/LWE tLBKHOV1 tLBKHOZ1 GPCM Mode Input Signal: LGTA tLBIVKH2 tLBIXKH2 UPM Mode Input Signal: LUPWAIT tLBIVKH1 Input Signals: LAD[0:31]/LDP[0:3] tLBIXKH1 tLBKHOV1 tLBKHOZ1 UPM Mode Output Signals: LCS[0:7]/LBS[0:3]/LGPL[0:5] Figure 26. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (PLL Enabled) MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 48 Freescale Semiconductor Local Bus Internal Launch/Capture Clock T1 T3 LCLK tLBKLOX1 tLBKLOV1 GPCM Mode Output Signals: LCS[0:7]/LWE tLBKLOZ1 GPCM Mode Input Signal: LGTA tLBIVKL2 tLBIXKL2 UPM Mode Input Signal: LUPWAIT tLBIVKH1 Input Signals: LAD[0:31]/LDP[0:3] tLBIXKH1 UPM Mode Output Signals: LCS[0:7]/LBS[0:3]/LGPL[0:5] Figure 27. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (PLL Bypass Mode) MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 49 Local Bus LSYNC_IN T1 T2 T3 T4 tLBKHOV1 tLBKHOZ1 GPCM Mode Output Signals: LCS[0:7]/LWE GPCM Mode Input Signal: LGTA tLBIVKH2 tLBIXKH2 UPM Mode Input Signal: LUPWAIT tLBIVKH1 Input Signals: LAD[0:31]/LDP[0:3] tLBIXKH1 tLBKHOV1 tLBKHOZ1 UPM Mode Output Signals: LCS[0:7]/LBS[0:3]/LGPL[0:5] Figure 28. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 8 or 16 (PLL Enabled) MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 50 Freescale Semiconductor Programmable Interrupt Controller Internal Launch/Capture Clock T1 T2 T3 T4 LCLK tLBKLOX1 tLBKLOV1 GPCM Mode Output Signals: LCS[0:7]/LWE tLBKLOZ1 GPCM Mode Input Signal: LGTA tLBIVKL2 tLBIXKL2 UPM Mode Input Signal: LUPWAIT tLBIVKH1 Input Signals: LAD[0:31]/LDP[0:3] tLBIXKH1 UPM Mode Output Signals: LCS[0:7]/LBS[0:3]/LGPL[0:5] Figure 29. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 8 or 16 (PLL Bypass Mode) 11 Programmable Interrupt Controller In IRQ edge trigger mode, when an external interrupt signal is asserted (according to the programmed polarity), it must remain the assertion for at least 3 system clocks (SYSCLK periods). MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 51 JTAG 12 JTAG This section describes the AC electrical specifications for the IEEE 1149.1 (JTAG) interface of the MPC8533E. 12.1 JTAG DC Electrical Characteristics Table 44 provides the DC electrical characteristics for the JTAG interface. Table 44. JTAG DC Electrical Characteristics Parameter Symbol Min Max Unit Notes High-level input voltage VIH 2 OVDD + 0.3 V — Low-level input voltage VIL –0.3 0.8 V — Input current (OVIN = 0 V or OVIN = OVDD) IIN — ±5 μA 1 High-level output voltage (OVDD = min, IOH = –2 mA) VOH 2.4 — V — Low-level output voltage (OVDD = min, IOL = 2 mA) VOL — 0.4 V — Note: 1. Note that the symbol VIN, in this case, represents the OV IN. 12.2 JTAG AC Electrical Specifications Table 45 provides the JTAG AC timing specifications as defined in Figure 30 through Figure 33. Table 45. JTAG AC Timing Specifications (Independent of SYSCLK)1 At recommended operating conditions (see Table 3). Symbol2 Min Max Unit Notes JTAG external clock frequency of operation fJTG 0 33.3 MHz — JTAG external clock cycle time tJTG 30 — ns — tJTKHKL 15 — ns — tJTGR & tJTGF 0 2 ns — tTRST 25 — ns 3 ns 4 Boundary-scan data TMS, TDI tJTDVKH tJTIVKH 4 0 — — ns 4 Boundary-scan data TMS, TDI tJTDXKH tJTIXKH 20 25 — — ns 5 Boundary-scan data TDO tJTKLDV tJTKLOV 4 4 20 25 Parameter JTAG external clock pulse width measured at 1.4 V JTAG external clock rise and fall times TRST assert time Input setup times: Input hold times: Valid times: MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 52 Freescale Semiconductor JTAG Table 45. JTAG AC Timing Specifications (Independent of SYSCLK)1 (continued) At recommended operating conditions (see Table 3). Symbol2 Min Max Boundary-scan data TDO tJTKLDX tJTKLOX 4 4 — — JTAG external clock to output high impedance: Boundary-scan data TDO tJTKLDZ tJTKLOZ 3 3 19 9 Parameter Output hold times: Unit Notes ns 5 ns 5 Notes: 1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load (see Figure 30). Time-of-flight delays must be added for trace lengths, vias, and connectors in the system. 2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals (D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only. 4. Non-JTAG signal input timing with respect to tTCLK. 5. Non-JTAG signal output timing with respect to tTCLK. Figure 30 provides the AC test load for TDO and the boundary-scan outputs. Z0 = 50 Ω Output RL = 50 Ω OVDD/2 Figure 30. AC Test Load for the JTAG Interface Figure 31 provides the JTAG clock input timing diagram. JTAG External Clock VM VM VM tJTKHKL tJTGR tJTG tJTGF VM = Midpoint Voltage (OVDD/2) Figure 31. JTAG Clock Input Timing Diagram MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 53 I2C Figure 32 provides the TRST timing diagram. TRST VM VM tTRST VM = Midpoint Voltage (OVDD/2) Figure 32. TRST Timing Diagram Figure 33 provides the boundary-scan timing diagram. JTAG External Clock VM VM tJTDVKH tJTDXKH Boundary Data Inputs Input Data Valid tJTKLDV tJTKLDX Boundary Data Outputs Output Data Valid tJTKLDZ Boundary Data Outputs Output Data Valid VM = Midpoint Voltage (OVDD/2) Figure 33. Boundary-Scan Timing Diagram 13 I2C This section describes the DC and AC electrical characteristics for the I2C interfaces of the MPC8533E. 13.1 I2C DC Electrical Characteristics Table 46 provides the DC electrical characteristics for the I2C interfaces. Table 46. I2C DC Electrical Characteristics At recommended operating conditions with OVDD of 3.3 V ± 5%. Parameter Symbol Min Max Unit Notes Input high voltage level VIH 0.7 × OV DD OVDD + 0.3 V — Input low voltage level VIL –0.3 0.3 × OV DD V — Low level output voltage VOL 0 0.2 × OV DD V 1 tI2KHKL 0 50 ns 2 Pulse width of spikes which must be suppressed by the input filter MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 54 Freescale Semiconductor I2C Table 46. I2C DC Electrical Characteristics (continued) At recommended operating conditions with OVDD of 3.3 V ± 5%. Parameter Symbol Min Max Unit Notes Input current each I/O pin (input voltage is between 0.1 × OVDD and 0.9 × OVDD(max) II –10 10 μA 3 Capacitance for each I/O pin CI — 10 pF — Notes: 1. Output voltage (open drain or open collector) condition = 3 mA sink current. 2. Refer to the MPC8533E PowerQUICC III Integrated Communications Host Processor Reference Manual for information on the digital filter used. 3. I/O pins will obstruct the SDA and SCL lines if OVDD is switched off. 13.2 I2C AC Electrical Specifications Table 47 provides the AC timing parameters for the I2C interfaces. Table 47. I2C AC Electrical Specifications All values refer to VIH (min) and VIL (max) levels (see Table 46). Symbol1 Min Max Unit Notes SCL clock frequency fI2C 0 400 kHz — Low period of the SCL clock tI2CL 1.3 — μs — High period of the SCL clock tI2CH 0.6 — μs — Setup time for a repeated START condition tI2SVKH 0.6 — μs — Hold time (repeated) START condition (after this period, the first clock pulse is generated) tI2SXKL 0.6 — μs — Data setup time tI2DVKH 100 — ns — μs 2 — 0 — — Parameter tI2DXKL Data hold time: CBUS compatible masters I2C bus devices Data output delay time tI2OVKL — 0.9 Set-up time for STOP condition tI2PVKH 0.6 — μs — Rise time of both SDA and SCL signals tI2CR 20 + 0.1 C b 300 ns 4 Fall time of both SDA and SCL signals tI2CF 20 + 0.1 C b 300 ns 4 tI2KHDX 1.3 — μs — VNL 0.1 × OV DD — V — Bus free time between a STOP and START condition Noise margin at the LOW level for each connected device (including hysteresis) 3 MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 55 I2C Table 47. I2C AC Electrical Specifications (continued) All values refer to VIH (min) and VIL (max) levels (see Table 46). Parameter Noise margin at the HIGH level for each connected device (including hysteresis) Symbol1 Min Max Unit Notes VNH 0.2 × OV DD — V — Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2) with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start condition (S) went invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C timing (I2) for the time that the data with respect to the stop condition (P) reaching the valid state (V) relative to the tI2C clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). 2. The MPC8533E provides a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the falling edge of SCL. 3. The maximum tI2DXKL has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal. 4. CB = capacitance of one bus line in pF. Figure 34 provides the AC test load for the I2C. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 34. I2C AC Test Load Figure 35 shows the AC timing diagram for the I2C bus. SDA tI2CF tI2DVKH tI2CL tI2KHKL tI2SXKL tI2CF tI2CR SCL tI2SXKL S tI2CH tI2DXKL,tI2OXKL tI2SVKH Sr tI2PVKH P S Figure 35. I2C Bus AC Timing Diagram MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 56 Freescale Semiconductor GPIO 14 GPIO This section describes the DC and AC electrical specifications for the GPIO interface of the MPC8533E. 14.1 GPIO DC Electrical Characteristics Table 48 provides the DC electrical characteristics for the GPIO interface. Table 48. GPIO DC Electrical Characteristics Parameter Symbol Min Max Unit Notes High-level input voltage VIH 2 OVDD + 0.3 V — Low-level input voltage VIL – 0.3 0.8 V — Input current (V IN = 0 V or VIN = VDD) IIN — ±5 μA 1 High-level output voltage (OVDD = mn, IOH = –2 mA) VOH 2.4 — V — Low-level output voltage (OVDD = min, IOL = 2 mA) VOL — 0.4 V — Note: 1. Note that the symbol VIN, in this case, represents the OV IN symbol referenced in Table 1 and Table 2. 14.2 GPIO AC Electrical Specifications Table 49 provides the GPIO input and output AC timing specifications. Table 49. GPIO Input AC Timing Specifications Parameter Symbol Typ Unit Notes tPIWID 20 ns 1 GPIO inputs—minimum pulse width Note: 1. GPIO inputs and outputs are asynchronous to any visible clock. GPIO outputs should be synchronized before use by any external synchronous logic. GPIO inputs are required to be valid for at least tPIWID ns to ensure proper operation. Figure 36 provides the AC test load for the GPIO. Output Z0 = 50 Ω RL = 50 Ω OVDD/2 Figure 36. GPIO AC Test Load MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 57 PCI 15 PCI This section describes the DC and AC electrical specifications for the PCI bus of the MPC8533E. 15.1 PCI DC Electrical Characteristics Table 50 provides the DC electrical characteristics for the PCI interface. Table 50. PCI DC Electrical Characteristics 1 Parameter Symbol Min Max Unit Notes High-level input voltage VIH 2 OVDD + 0.3 V — Low-level input voltage VIL –0.3 0.8 V — Input current (V IN = 0 V or VIN = VDD) IIN — ±5 μA 2 High-level output voltage (OVDD = min, IOH = –2mA) VOH 2.4 — V — Low-level output voltage (OVDD = min, IOL = 2 mA) VOL — 0.4 V — Notes: 1. Ranges listed do not meet the full range of the DC specifications of the PCI 2.2 Local Bus Specifications. 2. Note that the symbol VIN, in this case, represents the OV IN symbol referenced in Table 1 and Table 2. 15.2 PCI AC Electrical Specifications This section describes the general AC timing parameters of the PCI bus. Note that the SYSCLK signal is used as the PCI input clock. Table 51 provides the PCI AC timing specifications at 66 MHz. Table 51. PCI AC Timing Specifications at 66 MHz Symbol1 Min Max Unit Notes SYSCLK to output valid tPCKHOV — 7.4 ns 2, 3 Output hold from SYSCLK tPCKHOX 2.0 — ns 2 SYSCLK to output high impedance tPCKHOZ — 14 ns 2, 4 Input setup to SYSCLK tPCIVKH 3.7 — ns 2, 5 Input hold from SYSCLK tPCIXKH 0.5 — ns 2, 5 REQ64 to HRESET9 setup time tPCRVRH 10 × tSYS — clocks 6, 7 HRESET to REQ64 hold time tPCRHRX 0 50 ns 7 HRESET high to first FRAME assertion tPCRHFV 10 — clocks 8 Rise time (20%–80%) tPCICLK 0.6 2.1 ns — Parameter MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 58 Freescale Semiconductor PCI Table 51. PCI AC Timing Specifications at 66 MHz (continued) Parameter Symbol1 Min Max Unit Notes tPCICLK 0.6 2.1 ns — Fall time (20%–80%) Notes: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V) relative to the SYSCLK clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the valid (V) state. 2. See the timing measurement conditions in the PCI 2.2 Local Bus Specifications. 3. All PCI signals are measured from OVDD/2 of the rising edge of PCI_SYNC_IN to 0.4 × OVDD of the signal in question for 3.3-V PCI signaling levels. 4. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through the component pin is less than or equal to the leakage current specification. 5. Input timings are measured at the pin. 6. The timing parameter tSYS indicates the minimum and maximum CLK cycle times for the various specified frequencies. The system clock period must be kept within the minimum and maximum defined ranges. For values see Section 19, “Clocking.” 7. The setup and hold time is with respect to the rising edge of HRESET. 8. The timing parameter tPCRHFV is a minimum of 10 clocks rather than the minimum of 5 clocks in the PCI 2.2 Local Bus Specifications. 9. The reset assertion timing requirement for HRESET is 100 μs. Figure 37 provides the AC test load for PCI. Output Z0 = 1 KΩ RL = 50 Ω OVDD/2 Figure 37. PCI AC Test Load Figure 38 shows the PCI input AC timing conditions. CLK tPCIVKH tPCIXKH Input Figure 38. PCI Input AC Timing Measurement Conditions MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 59 High-Speed Serial Interfaces (HSSI) Figure 39 shows the PCI output AC timing conditions. CLK tPCKHOV Output Delay tPCKHOZ High-Impedance Output Figure 39. PCI Output AC Timing Measurement Condition 16 High-Speed Serial Interfaces (HSSI) The MPC8533E features two Serializer/Deserializer (SerDes) interfaces to be used for high-speed serial interconnect applications.Both SerDes1 and SerDes2 can be used for PCI Express data transfers application.This section describes the common portion of SerDes DC electrical specifications, which is the DC requirement for SerDes Reference Clocks. The SerDes data lane’s transmitter and receiver reference circuits are also shown. 16.1 Signal Terms Definition The SerDes utilizes differential signaling to transfer data across the serial link. This section defines terms used in the description and specification of differential signals. Figure 40 shows how the signals are defined. For illustration purpose, only one SerDes lane is used for description. The figure shows waveform for either a transmitter output (SDn_TX and SDn_TX) or a receiver input (SDn_RX and SDn_RX). Each signal swings between A Volts and B Volts where A > B. Using this waveform, the definitions are as follows. To simplify illustration, the following definitions assume that the SerDes transmitter and receiver operate in a fully symmetrical differential signaling environment. 1. Single-Ended Swing The transmitter output signals and the receiver input signals SDn_TX, SDn_TX, SDn_RX and SDn_RX each have a peak-to-peak swing of A - B Volts. This is also referred as each signal wire’s Single-Ended Swing. 2. Differential Output Voltage, VOD (or Differential Output Swing): The Differential Output Voltage (or Swing) of the transmitter, VOD, is defined as the difference of the two complimentary output voltages: VSDn_TX – VSDn_TX. The VOD value can be either positive or negative. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 60 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) 3. Differential Input Voltage, VID (or Differential Input Swing): The Differential Input Voltage (or Swing) of the receiver, VID, is defined as the difference of the two complimentary input voltages: VSDn_RX – VSDn_RX. The VID value can be either positive or negative. 4. Differential Peak Voltage, VDIFFp The peak value of the differential transmitter output signal or the differential receiver input signal is defined as Differential Peak Voltage, VDIFFp = |A – B| Volts. 5. Differential Peak-to-Peak, VDIFFp-p Since the differential output signal of the transmitter and the differential input signal of the receiver each range from A – B to –(A – B) Volts, the peak-to-peak value of the differential transmitter output signal or the differential receiver input signal is defined as Differential Peak-to-Peak Voltage, VDIFFp-p = 2*VDIFFp = 2 * |(A – B)| Volts, which is twice of differential swing in amplitude, or twice of the differential peak. For example, the output differential peak-peak voltage can also be calculated as VTX-DIFFp-p = 2*|VOD|. 6. Differential Waveform The differential waveform is constructed by subtracting the inverting signal (SDn_TX, for example) from the non-inverting signal (SDn_TX, for example) within a differential pair. There is only one signal trace curve in a differential waveform. The voltage represented in the differential waveform is not referenced to ground. Refer to Figure 40 as an example for differential waveform. 7. Common Mode Voltage, Vcm The Common Mode Voltage is equal to one half of the sum of the voltages between each conductor of a balanced interchange circuit and ground. In this example, for SerDes output, Vcm_out = VSDn_TX + VSDn_TX = (A + B) / 2, which is the arithmetic mean of the two complimentary output voltages within a differential pair. In a system, the common mode voltage may often differ from one component’s output to the other’s input. Sometimes, it may be even different between the receiver input and driver output circuits within the same component. It is also referred as the DC offset in some occasions. SDn_TX or SDn_RX A Volts Vcm = (A + B) / 2 SDn_TX or SDn_RX B Volts Differential Swing, VID or VOD = A – B Differential Peak Voltage, VDIFFp = |A – B| Differential Peak-Peak Voltage, VDIFFpp = 2*VDIFFp (not shown) Figure 40. Differential Voltage Definitions for Transmitter or Receiver MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 61 High-Speed Serial Interfaces (HSSI) To illustrate these definitions using real values, consider the case of a CML (Current Mode Logic) transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing that goes between 2.5 V and 2.0 V. Using these values, the peak-to-peak voltage swing of each signal (TD or TD) is 500 mV p-p, which is referred as the single-ended swing for each signal. In this example, since the differential signaling environment is fully symmetrical, the transmitter output’s differential swing (VOD) has the same amplitude as each signal’s single-ended swing. The differential output signal ranges between 500 mV and –500 mV, in other words, VOD is 500 mV in one phase and –500 mV in the other phase. The peak differential voltage (VDIFFp) is 500 mV. The peak-to-peak differential voltage (VDIFFp-p) is 1000 mV p-p. 16.2 SerDes Reference Clocks The SerDes reference clock inputs are applied to an internal PLL whose output creates the clock used by the corresponding SerDes lanes. The SerDes reference clocks inputs are SD1_REF_CLK and SD1_REF_CLK for PCI Express1 PCI Express2. SD2_REF_CLK and SD2_REF_CLK for the PCI Express3. The following sections describe the SerDes reference clock requirements and some application information. 16.2.1 SerDes Reference Clock Receiver Characteristics Figure 41 shows a receiver reference diagram of the SerDes reference clocks. • The supply voltage requirements for XVDD_SRDS2 are specified in Table 1 and Table 2. • SerDes reference clock receiver reference circuit structure — The SDn_REF_CLK and SDn_REF_CLK are internally AC-coupled differential inputs as shown in Figure 41. Each differential clock input (SDn_REF_CLK or SDn_REF_CLK) has a 50-Ω termination to SGND_SRDSn (xcorevss) followed by on-chip AC-coupling. — The external reference clock driver must be able to drive this termination. — The SerDes reference clock input can be either differential or single-ended. Refer to the differential mode and single-ended mode description below for further detailed requirements. • The maximum average current requirement that also determines the common mode voltage range: — When the SerDes reference clock differential inputs are DC coupled externally with the clock driver chip, the maximum average current allowed for each input pin is 8 mA. In this case, the exact common mode input voltage is not critical as long as it is within the range allowed by the maximum average current of 8 mA (refer to the following bullet for more detail), since the input is AC-coupled on-chip. — This current limitation sets the maximum common mode input voltage to be less than 0.4 V (0.4 V/50 = 8 mA) while the minimum common mode input level is 0.1 V above SGND_SRDSn (xcorevss). For example, a clock with a 50/50 duty cycle can be produced by a clock driver with output driven by its current source from 0mA to 16mA (0–0.8 V), such that each phase of the differential input has a single-ended swing from 0 V to 800 mV with the common mode voltage at 400 mV. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 62 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) • — If the device driving the SDn_REF_CLK and SDn_REF_CLK inputs cannot drive 50 Ω to SGND_SRDSn (xcorevss) DC, or it exceeds the maximum input current limitations, then it must be AC-coupled off-chip. The input amplitude requirement — This requirement is described in detail in the following sections. 50 Ω SDn_REF_CLK Input Amp SDn_REF_CLK 50 Ω Figure 41. Receiver of SerDes Reference Clocks 16.2.2 DC Level Requirement for SerDes Reference Clocks The DC level requirement for the MPC8533E SerDes reference clock inputs is different depending on the signaling mode used to connect the clock driver chip and SerDes reference clock inputs as described below. • Differential Mode — The input amplitude of the differential clock must be between 400 and 1600 mV differential peak-peak (or between 200 and 800 mV differential peak). In other words, each signal wire of the differential pair must have a single-ended swing less than 800 mV and greater than 200 mV. This requirement is the same for both external DC-coupled or AC-coupled connection. — For external DC-coupled connection, as described in Section 16.2.1, “SerDes Reference Clock Receiver Characteristics,” the maximum average current requirements sets the requirement for average voltage (common mode voltage) to be between 100 and 400 mV. Figure 42 shows the SerDes reference clock input requirement for DC-coupled connection scheme. — For external AC-coupled connection, there is no common mode voltage requirement for the clock driver. Since the external AC-coupling capacitor blocks the DC level, the clock driver and the SerDes reference clock receiver operate in different command mode voltages. The SerDes reference clock receiver in this connection scheme has its common mode voltage set to SGND_SRDSn. Each signal wire of the differential inputs is allowed to swing below and above the command mode voltage (SGND_SRDSn). Figure 43 shows the SerDes reference clock input requirement for AC-coupled connection scheme. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 63 High-Speed Serial Interfaces (HSSI) • Single-ended Mode — The reference clock can also be single-ended. The SDn_REF_CLK input amplitude (single-ended swing) must be between 400 and 800 mV peak-peak (from Vmin to Vmax) with SDn_REF_CLK either left unconnected or tied to ground. — The SDn_REF_CLK input average voltage must be between 200 and 400 mV. Figure 44 shows the SerDes reference clock input requirement for single-ended signaling mode. — To meet the input amplitude requirement, the reference clock inputs might need to be DC or AC-coupled externally. For the best noise performance, the reference of the clock could be DC or AC-coupled into the unused phase (SDn_REF_CLK) through the same source impedance as the clock input (SDn_REF_CLK) in use. SDn_REF_CLK 200 mV < Input Amplitude or Differential Peak < 800 mV Vmax < 800 mV 100 mV < Vcm < 400 mV Vmin > 0 V SDn_REF_CLK Figure 42. Differential Reference Clock Input DC Requirements (External DC-Coupled) 200 mV < Input Amplitude or Differential Peak < 800 mV SDn_REF_CLK Vmax < Vcm + 400 mV Vcm Vmin > Vcm - 400 mV SDn_REF_CLK Figure 43. Differential Reference Clock Input DC Requirements (External AC-Coupled) 400 mV < SDn_REF_CLK Input Amplitude < 800 mV SDn_REF_CLK 0V SDn_REF_CLK Figure 44. Single-Ended Reference Clock Input DC Requirements MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 64 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) 16.2.3 Interfacing With Other Differential Signaling Levels With on-chip termination to SGND_SRDSn (xcorevss), the differential reference clocks inputs are HCSL (high-speed current steering logic) compatible DC-coupled. Many other low voltage differential type outputs like LVDS (low voltage differential signaling) can be used but may need to be AC-coupled due to the limited common mode input range allowed (100 to 400 mV) for DC-coupled connection. LVPECL outputs can produce signal with too large amplitude and may need to be DC-biased at clock driver output first, then followed with series attenuation resistor to reduce the amplitude, in addition to AC-coupling. NOTE Figure 45 through Figure 48 are for conceptual reference only. Due to the fact that clock driver chip's internal structure, output impedance and termination requirements are different between various clock driver chip manufacturers, it is very possible that the clock circuit reference designs provided by clock driver chip vendor are different from what is shown below. They might also vary from one vendor to the other. Therefore, Freescale Semiconductor can neither provide the optimal clock driver reference circuits, nor guarantee the correctness of the following clock driver connection reference circuits. The system designer is recommended to contact the selected clock driver chip vendor for the optimal reference circuits with the MPC8533E SerDes reference clock receiver requirement provided in this document. Figure 45 shows the SerDes reference clock connection reference circuits for HCSL type clock driver. It assumes that the DC levels of the clock driver chip is compatible with MPC8533E SerDes reference clock input’s DC requirement. MPC8533EMP HCSL CLK Driver Chip CLK_Out 33 Ω SDn_REF_CLK 50 Ω SerDes Refer. CLK Receiver 100 Ω differential PWB trace Clock Driver 33 Ω CLK_Out Total 50 Ω. Assume clock driver’s output impedance is about 16 Ω. SDn_REF_CLK 50 Ω Clock driver vendor dependent source termination resistor Figure 45. DC-Coupled Differential Connection with HCSL Clock Driver (Reference Only) MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 65 High-Speed Serial Interfaces (HSSI) Figure 46 shows the SerDes reference clock connection reference circuits for LVDS type clock driver. Since LVDS clock driver’s common mode voltage is higher than the MPC8533E SerDes reference clock input’s allowed range (100 to 400mV), AC-coupled connection scheme must be used. It assumes the LVDS output driver features 50-Ω termination resistor. It also assumes that the LVDS transmitter establishes its own common mode level without relying on the receiver or other external component. MPC8533E LVDS CLK Driver Chip CLK_Out 10 nF 50 Ω SerDes Refer. CLK Receiver 100 Ω differential PWB trace Clock Driver CLK_Out SDn_REF_CLK 10 nF SDn_REF_CLK 50 Ω Figure 46. AC-Coupled Differential Connection with LVDS Clock Driver (Reference Only) Figure 47 shows the SerDes reference clock connection reference circuits for LVPECL type clock driver. Since LVPECL driver’s DC levels (both common mode voltages and output swing) are incompatible with MPC8533E SerDes reference clock input’s DC requirement, AC-coupling has to be used. Figure 47 assumes that the LVPECL clock driver’s output impedance is 50 Ω. R1 is used to DC-bias the LVPECL outputs prior to AC-coupling. Its value could be ranged from 140 to 240 Ω depending on clock driver vendor’s requirement. R2 is used together with the SerDes reference clock receiver’s 50-Ω termination resistor to attenuate the LVPECL output’s differential peak level such that it meets the MPC8533E SerDes reference clock’s differential input amplitude requirement (between 200 and 800 mV differential peak). For example, if the LVPECL output’s differential peak is 900 mV and the desired SerDes reference clock input amplitude is selected as 600 mV, the attenuation factor is 0.67, which requires R2 = 25 Ω. Please MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 66 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) consult clock driver chip manufacturer to verify whether this connection scheme is compatible with a particular clock driver chip. MPC8533E LVPECL CLK Driver Chip CLK_Out Clock Driver 10nF R2 R1 50 Ω SDn_REF_CLK SerDes Refer. CLK Receiver 100 Ω differential PWB trace 10nF R2 SDn_REF_CLK CLK_Out R1 50 Ω Figure 47. AC-Coupled Differential Connection with LVPECL Clock Driver (Reference Only) Figure 48 shows the SerDes reference clock connection reference circuits for a single-ended clock driver. It assumes the DC levels of the clock driver are compatible with MPC8533E SerDes reference clock input’s DC requirement. MPC8533E Single-Ended CLK Driver Chip Total 50 Ω. Assume clock driver’s output impedance is about 16 Ω. Clock Driver CLK_Out 50 Ω SDn_REF_CLK 33 Ω SerDes Refer. CLK Receiver 100 Ω differential PWB trace 50 Ω SDn_REF_CLK 50 Ω Figure 48. Single-Ended Connection (Reference Only) 16.2.4 AC Requirements for SerDes Reference Clocks The clock driver selected should provide a high quality reference clock with low phase noise and cycle-to-cycle jitter. Phase noise less than 100 kHz can be tracked by the PLL and data recovery loops and is less of a problem. Phase noise above 15 MHz is filtered by the PLL. The most problematic phase noise MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 67 High-Speed Serial Interfaces (HSSI) occurs in the 1–15 MHz range. The source impedance of the clock driver should be 50 Ω to match the transmission line and reduce reflections which are a source of noise to the system. Table 52 describes some AC parameters common to SGMII, and PCI Express protocols. Table 52. SerDes Reference Clock Common AC Parameters Parameter Symbol Min Max Unit Notes Rising Edge Rate Rise Edge Rate 1.0 4.0 V/ns 2, 3 Falling Edge Rate Fall Edge Rate 1.0 4.0 V/ns 2, 3 Differential Input High Voltage VIH +200 — mV 2 Differential Input Low Voltage VIL — –200 mV 2 Rise-Fall Matching — 20 % 1, 4 Rising edge rate (SD n_REF_CLK) to falling edge rate (SDn_REF_CLK) matching Notes: 1. Measurment taken from single ended waveform. 2. Measurment taken from differential waveform. 3. Measured from –200 mV to +200 mV on the differential waveform (derived from SD n_REF_CLK minus SDn_REF_CLK). The signal must be monotonic through the measurement region for rise and fall time. The 400 mV measurement window is centered on the differential zero crossing. See Figure 49. 4. Matching applies to rising edge rate for SDn_REF_CLK and falling edge rate for SDn_REF_CLK. It is measured using a 200 mV window centered on the median cross point where SDn_REF_CLK rising meets SDn_REF_CLK falling. The median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. The rise edge rate of SDn_REF_CLK should be compared to the fall edge rate of SDn_REF_CLK, the maximum allowed difference should not exceed 20% of the slowest edge rate. See Figure 50. Rise Edge Rage Fall Edge Rate VIH = +200 mV 0.0 V VIL = –200 mV SDn_REF_CLK minus SDn_REF_CLK Figure 49. Differential Measurement Points for Rise and Fall Time MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 68 Freescale Semiconductor High-Speed Serial Interfaces (HSSI) SDn_REF_CLK SDn_REF_CLK TFALL TRISE VCROSS MEDIAN + 100 mV VCROSS MEDIAN VCROSS MEDIAN VCROSS MEDIAN – 100 mV SDn_REF_CLK SDn_REF_CLK Figure 50. Single-Ended Measurement Points for Rise and Fall Time Matching The other detailed AC requirements of the SerDes reference clocks is defined by each interface protocol based on application usage. Refer to the following sections for detailed information: • Section 17.2, “AC Requirements for PCI Express SerDes Clocks” 16.2.4.1 Spread Spectrum Clock SD1_REF_CLK/SD1_REF_CLK were designed to work with a spread spectrum clock (+0 to –0.5% spreading at 30–33 kHz rate is allowed), assuming both ends have same reference clock. For better results, a source without significant unintended modulation should be used. SD2_REF_CLK/SD2_REF_CLK are not intended to be used with, and should not be clocked by, a spread spectrum clock source. 16.3 SerDes Transmitter and Receiver Reference Circuits Figure 51 shows the reference circuits for SerDes data lane’s transmitter and receiver. SD1_TXn or 50 Ω SD2_TXn SD1_RXn or SD2_RXn 50 Ω Transmitter Receiver 50 Ω SD1_TXn or SD2_TXn SD1_RXn or SD2_RXn 50 Ω Figure 51. SerDes Transmitter and Receiver Reference Circuits The DC and AC specification of SerDes data lanes are defined in the section below (PCI Express) in this document based on the application usage: • Section 17, “PCI Express” Please note that external AC Coupling capacitor is required for the above serial transmission protocols with the capacitor value defined in specification of each protocol section. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 69 PCI Express 17 PCI Express This section describes the DC and AC electrical specifications for the PCI Express bus of the MPC8533E. 17.1 DC Requirements for PCI Express SD_REF_CLK and SD_REF_CLK For more information, see Section 16.2, “SerDes Reference Clocks.” 17.2 AC Requirements for PCI Express SerDes Clocks Table 53 provides the AC requirements for the PCI Express SerDes clocks. Table 53. SD_REF_CLK and SD_REF_CLK AC Requirements Symbol2 Min Typ Max Units Notes REFCLK cycle time — 10 — ns 1 tREFCJ REFCLK cycle-to-cycle jitter. Difference in the period of any two adjacent REFCLK cycles — — 100 ps — tREFPJ Phase jitter. Deviation in edge location with respect to mean edge location –50 — 50 ps — tREF Parameter Description Notes: 1. Typical based on PCI Express Specification 2.0. 2. Guaranteed by characterization. 17.3 Clocking Dependencies The ports on the two ends of a link must transmit data at a rate that is within 600 parts per million (ppm) of each other at all times. This is specified to allow bit rate clock sources with a ±300 ppm tolerance. 17.4 Physical Layer Specifications The following is a summary of the specifications for the physical layer of PCI Express on this device. For further details as well as the specifications of the transport and data link layer please refer to the PCI Express Base Specification. Rev. 1.0a. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 70 Freescale Semiconductor PCI Express 17.4.1 Differential Transmitter (TX) Output Table 54 defines the specifications for the differential output at all transmitters (TXs). The parameters are specified at the component pins. Table 54. Differential Transmitter (TX) Output Specifications Symbol Parameter Min Nom Max Unit Comments 399.88 400 400.12 ps Each UI is 400 ps ± 300 ppm. UI does not account for Spread Spectrum Clock dictated variations. See Note 1. UI Unit interval VTX-DIFFp-p Differential peak-topeak output voltage 0.8 — 1.2 V VTX-DIFFp-p = 2*|VTX-D+ – VTX-D–|. See Note 2. VTX-DE-RATIO De- emphasized differential output voltage (ratio) –3.0 –3.5 –4.0 dB Ratio of the VTX-DIFFp-p of the second and following bits after a transition divided by the VTX-DIFFp-p of the first bit after a transition. See Note 2. TTX-EYE Minimum TX eye width 0.70 — — UI The maximum transmitter jitter can be derived as TTX-MAX-JITTER = 1 – TTX-EYE = 0.3 UI. See Notes 2 and 3. TTX-EYE-MEDIAN-to- Maximum time between the jitter median and maximum deviation from the median. — — 0.15 UI Jitter is defined as the measurement variation of the crossing points (VTX-DIFFp-p = 0 V) in relation to a recovered TX UI. A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. Jitter is measured using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX UI. See Notes 2 and 3. 0.125 — — UI See Notes 2 and 5. MAX-JITTER TTX-RISE, TTX-FALL D+/D– TX output rise/fall time VTX-CM-ACp RMS AC peak common mode output voltage — — 20 mV VTX-CM-ACp = RMS(|VTXD+ – VTXD–|/2 – VTX-CM-DC) VTX-CM-DC = DC(avg) of |VTX-D+ – VTX-D–|/2 See Note 2. VTX-CM-DC-ACTIVE- Absolute delta of DC common mode voltage during LO and electrical idle 0 — 100 mV |VTX-CM-DC (during LO) – VTX-CM-Idle-DC (During Electrical Idle)|<= 100 mV VTX-CM-DC = DC(avg) of |VTX-D+ – VTX-D–|/2 [LO] VTX-CM-Idle-DC = DC(avg) of |V TX-D+ – VTX-D–|/2 [Electrical Idle] See Note 2. Absolute delta of DC common mode between D+ and D– 0 — 25 mV |VTX-CM-DC-D+ – VTX-CM-DC-D–| <= 25 mV VTX-CM-DC-D+ = DC(avg) of |V TX-D+| VTX-CM-DC-D– = DC(avg) of |V TX-D–| See Note 2. IDLE-DELTA VTX-CM-DC-LINE-DELTA MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 71 PCI Express Table 54. Differential Transmitter (TX) Output Specifications (continued) Symbol Parameter Min Nom Max Unit Comments VTX-IDLE-DIFFp Electrical idle differential peak output voltage 0 — 20 mV VTX-IDLE-DIFFp = |VTX-IDLE-D+ – VTX-IDLE-D–| <= 20 mV See Note 2. VTX-RCV-DETECT Amount of voltage change allowed during receiver detection — — 600 mV The total amount of voltage change that a transmitter can apply to sense whether a low impedance receiver is present. See Note 6. VTX-DC-CM TX DC common mode voltage 0 — 3.6 V ITX-SHORT TX short circuit current limit — — 90 mA The total current the transmitter can provide when shorted to its ground. TTX-IDLE-MIN Minimum time spent in electrical idle 50 — — UI Minimum time a transmitter must be in electrical idle utilized by the receiver to start looking for an electrical idle exit after successfully receiving an electrical idle ordered set. TTX-IDLE-SET-TO-IDLE Maximum time to transition to a valid electrical idle after sending an electrical Idle ordered set — — 20 UI After sending an electrical idle ordered set, the transmitter must meet all electrical idle specifications within this time. This is considered a debounce time for the transmitter to meet electrical idle after transitioning from LO. TTX-IDLE-TO-DIFF-DATA Maximum time to transition to valid TX specifications after leaving an electrical idle condition — — 20 UI Maximum time to meet all TX specifications when transitioning from electrical idle to sending differential data. This is considered a debounce time for the TX to meet all TX specifications after leaving electrical idle. RLTX-DIFF Differential return loss 12 — — dB Measured over 50 MHz to 1.25 GHz. See Note 4. RLTX-CM Common mode return loss 6 — — dB Measured over 50 MHz to 1.25 GHz. See Note 4. ZTX-DIFF-DC DC differential TX impedance 80 100 120 Ω TX DC differential mode low impedance. ZTX-DC Transmitter DC impedance 40 — — Ω Required TX D+ as well as D– DC Impedance during all states. LTX-SKEW Lane-to-lane output skew — — 500 + 2 UI ps Static skew between any two transmitter lanes within a single link. CTX AC coupling capacitor 75 — 200 nF All transmitters shall be AC coupled. The AC coupling is required either within the media or within the transmitting component itself. The allowed DC common mode voltage under any conditions. See Note 6. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 72 Freescale Semiconductor PCI Express Table 54. Differential Transmitter (TX) Output Specifications (continued) Symbol Tcrosslink Parameter Crosslink random timeout Min Nom Max Unit 0 — 1 ms Comments This random timeout helps resolve conflicts in crosslink configuration by eventually resulting in only one downstream and one upstream port. See Note 7. Notes: 1. No test load is necessarily associated with this value. 2. Specified at the measurement point into a timing and voltage compliance test load as shown in Figure 54 and measured over any 250 consecutive TX UIs. (Also refer to the transmitter compliance eye diagram shown in Figure 52.) 3. A TTX-EYE = 0.70 UI provides for a total sum of deterministic and random jitter budget of TTX-JITTER-MAX = 0.30 UI for the transmitter collected over any 250 consecutive TX UIs. The TTX-EYE-MEDIAN-to-MAX-JITTER median is less than half of the total TX jitter budget collected over any 250 consecutive TX UIs. It should be noted that the median is not the same as the mean. The jitter median describes the point in time where the number of jitter points on either side is approximately equal as opposed to the averaged time value. 4. The transmitter input impedance shall result in a differential return loss greater than or equal to 12 dB and a common mode return loss greater than or equal to 6 dB over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The reference impedance for return loss measurements is 50 Ω to ground for both the D+ and D– line (that is, as measured by a vector network analyzer with 50-Ω probes—see Figure 54.) Note that the series capacitors CTX is optional for the return loss measurement. 5. Measured between 20%–80% at transmitter package pins into a test load as shown in Figure 54 for both V TX-D+ and VTX-D– . 6. See Section 4.3.1.8 of the PCI Express Base Specifications, Rev 1.0a. 7. See Section 4.2.6.3 of the PCI Express Base Specifications, Rev 1.0a. 17.4.2 Transmitter Compliance Eye Diagrams The TX eye diagram in Figure 52 is specified using the passive compliance/test measurement load (see Figure 54) in place of any real PCI Express interconnect +RX component. There are two eye diagrams that must be met for the transmitter. Both eye diagrams must be aligned in time using the jitter median to locate the center of the eye diagram. The different eye diagrams will differ in voltage depending whether it is a transition bit or a de-emphasized bit. The exact reduced voltage level of the de-emphasized bit will always be relative to the transition bit. The eye diagram must be valid for any 250 consecutive UIs. A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX UI. NOTE It is recommended that the recovered TX UI is calculated using all edges in the 3500 consecutive UI interval with a fit algorithm using a minimization merit function (that is, least squares and median deviation fits). MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 73 PCI Express VRX-DIFF = 0 mV (D+ D– Crossing Point) [Transition Bit] VTX-DIFFp-p-MIN = 800 mV VTX-DIFF = 0 mV (D+ D– Crossing Point) [De-Emphasized Bit] 566 mV (3 dB ) >= VTX-DIFFp-p-MIN >= 505 mV (4 dB ) 0.07 UI = UI – 0.3 UI (JTX-TOTAL-MAX) [Transition Bit] VTX-DIFFp-p-MIN = 800 mV Figure 52. Minimum Transmitter Timing and Voltage Output Compliance Specifications 17.4.3 Differential Receiver (RX) Input Specifications Table 55 defines the specifications for the differential input at all receivers (RXs). The parameters are specified at the component pins. Table 55. Differential Receiver (RX) Input Specifications Symbol Parameter Min Nom Max Units Comments UI Unit interval 399.88 400 400.12 ps Each UI is 400 ps ± 300 ppm. UI does not account for spread spectrum clock dictated variations. See Note 1. VRX-DIFFp-p Differential peak-topeak input voltage 0.175 — 1.200 V VRX-DIFFp-p = 2*|VRX-D+ – VRX-D–| See Note 2. TRX-EYE Minimum receiver eye width 0.4 — — UI The maximum interconnect media and transmitter jitter that can be tolerated by the receiver can be derived as TRX-MAX-JITTER = 1 – TRX-EYE = 0.6 UI. See Notes 2 and 3. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 74 Freescale Semiconductor PCI Express Table 55. Differential Receiver (RX) Input Specifications (continued) Symbol Parameter Min Nom Max Units Comments TRX-EYE-MEDIAN-to-MAX Maximum time between the jitter median and maximum deviation from the median — — 0.3 UI Jitter is defined as the measurement variation of the crossing points (V RX-DIFFp-p = 0 V) in relation to a recovered TX UI. A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. Jitter is measured using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX UI. See Notes 2, 3, and 7. VRX-CM-ACp AC peak common mode input voltage — — 150 mV VRX-CM-ACp = |VRXD+ – VRXD–|/2 – VRX-CM-DC VRX-CM-DC = DC(avg) of |VRX-D+ – VRX-D–|/2 See Note 2. RLRX-DIFF Differential return loss 15 — — dB Measured over 50 MHz to 1.25 GHz with the D+ and D– lines biased at +300 and –300 mV, respectively. See Note 4. RLRX-CM Common mode return loss 6 — — dB Measured over 50 MHz to 1.25 GHz with the D+ and D– lines biased at 0 V. See Note 4. ZRX-DIFF-DC DC differential input impedance 80 100 120 Ω RX DC differential mode impedance. See Note 5. ZRX-DC DC input impedance 40 50 60 Ω Required RX D+ as well as D– DC impedance (50 ± 20% tolerance). See Notes 2 and 5. ZRX-HIGH-IMP-DC Powered down DC input impedance 200 k — — Ω Required RX D+ as well as D– DC impedance when the receiver terminations do not have power. See Note 6. VRX-IDLE-DET-DIFFp-p Electrical idle detect threshold 65 — 175 mV VRX-IDLE-DET-DIFFp-p = 2 × |VRX-D+ – VRX-D–| Measured at the package pins of the receiver. TRX-IDLE-DET-DIFF- Unexpected electrical idle enter detect threshold integration time — — 10 ms An unexpected electrical idle (VRX-DIFFp-p < V RX-IDLE-DET-DIFFp-p) must be recognized no longer than TRX-IDLE-DET-DIFF-ENTERING to signal an unexpected idle condition. -JITTER ENTERTIME MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 75 PCI Express Table 55. Differential Receiver (RX) Input Specifications (continued) Symbol LTX-SKEW Parameter Total skew Min Nom Max Units Comments — — 20 ns Skew across all lanes on a link. This includes variation in the length of SKP ordered set (for example, COM and one to five symbols) at the RX as well as any delay differences arising from the interconnect itself. Notes: 1. No test load is necessarily associated with this value. 2. Specified at the measurement point and measured over any 250 consecutive UIs. The test load in Figure 54 should be used as the RX device when taking measurements (also refer to the receiver compliance eye diagram shown in Figure 53). If the clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI must be used as a reference for the eye diagram. 3. A TRX-EYE = 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the transmitter and interconnect collected any 250 consecutive UIs. The TRX-EYE-MEDIAN-to-MAX-JITTER specification ensures a jitter distribution in which the median and the maximum deviation from the median is less than half of the total. UI jitter budget collected over any 250 consecutive TX UIs. It should be noted that the median is not the same as the mean. The jitter median describes the point in time where the number of jitter points on either side is approximately equal as opposed to the averaged time value. If the clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI must be used as the reference for the eye diagram. 4. The receiver input impedance shall result in a differential return loss greater than or equal to 15 dB with the D+ line biased to 300 mV and the D– line biased to –300 mV and a common mode return loss greater than or equal to 6 dB (no bias required) over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The reference impedance for return loss measurements for is 50 Ω to ground for both the D+ and D– line (that is, as measured by a vector network analyzer with 50-Ω probes, see Figure 54). Note that the series capacitors CTX is optional for the return loss measurement. 5. Impedance during all LTSSM states. When transitioning from a fundamental reset to detect (the initial state of the LTSSM) there is a 5-ms transition time before receiver termination values must be met on all unconfigured lanes of a port. 6. The RX DC common mode impedance that exists when no power is present or fundamental reset is asserted. This helps ensure that the receiver detect circuit will not falsely assume a receiver is powered on when it is not. This term must be measured at 300 mV above the RX ground. 7. It is recommended that the recovered TX UI is calculated using all edges in the 3500 consecutive UI interval with a fit algorithm using a minimization merit function. Least squares and median deviation fits have worked well with experimental and simulated data. 17.5 Receiver Compliance Eye Diagrams The RX eye diagram in Figure 53 is specified using the passive compliance/test measurement load (see Figure 54) in place of any real PCI Express RX component. In general, the minimum receiver eye diagram measured with the compliance/test measurement load (see Figure 54) will be larger than the minimum receiver eye diagram measured over a range of systems at the input receiver of any real PCI Express component. The degraded eye diagram at the input receiver is due to traces internal to the package as well as silicon parasitic characteristics which cause the real PCI Express component to vary in impedance from the compliance/test measurement load. The input receiver eye diagram is implementation specific and is not specified. RX component designer should provide additional margin to adequately compensate for the degraded minimum receiver eye diagram (shown in Figure 53) expected at the input receiver based on some adequate combination of system simulations and the return loss measured looking into the RX package and silicon. The RX eye diagram must be aligned in time using the jitter median to locate the center of the eye diagram. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 76 Freescale Semiconductor PCI Express The eye diagram must be valid for any 250 consecutive UIs. A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX UI. NOTE The reference impedance for return loss measurements is 50 Ω to ground for both the D+ and D– line (that is, as measured by a vector network analyzer with 50-Ω probes, see Figure 53). Note that the series capacitors, CTX, are optional for the return loss measurement. VRX-DIFF = 0 mV (D+ D– Crossing Point) VRX-DIFF = 0 mV (D+ D– Crossing Point) VRX-DIFFp-p-MIN > 175 mV 0.4 UI = TRX-EYE-MIN Figure 53. Minimum Receiver Eye Timing and Voltage Compliance Specification 17.5.1 Compliance Test and Measurement Load The AC timing and voltage parameters must be verified at the measurement point, as specified within 0.2 inches of the package pins, into a test/measurement load shown in Figure 54. NOTE The allowance of the measurement point to be within 0.2 inches of the package pins is meant to acknowledge that package/board routing may benefit from D+ and D– not being exactly matched in length at the package pin boundary. D+ Package Pin C = CTX TX Silicon + Package D– Package Pin C = CTX R = 50 Ω R = 50 Ω Figure 54. Compliance Test/Measurement Load MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 77 Package Description 18 Package Description This section details package parameters, pin assignments, and dimensions. 18.1 Package Parameters for the MPC8533E FC-PBGA The package parameters for flip chip plastic ball grid array (FC-PBGA) are provided in Table 56. Table 56. Package Parameters Parameter Package outline Interconnects Ball pitch Ball diameter (typical) Solder ball (Pb-free) PBGA1 29 mm × 29 mm 783 1 mm 0.6 mm 96.5% Sn 3.5% Ag Note: 1. (FC-PBGA) without a lid. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 78 Freescale Semiconductor Package Description 18.2 Mechanical Dimensions of the MPC8533E FC-PBGA Figure 55 shows the mechanical dimensions and bottom surface nomenclature of the MPC8533E, 783 FC-PBGA package without a lid. Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. 6. Capacitors may not be present on all parts. Care must be taken not to short exposed metal capacitor pads. 7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise. Figure 55. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8533E FC-PBGA without a Lid MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 79 Package Description 18.3 Pinout Listings NOTE The naming convention of TSEC1 and TSEC3 is used to allow the splitting voltage rails for the eTSEC blocks and to ease the port of existing PowerQUICC III software. NOTE The DMA_DACK[0:1] and TEST_SEL pins must be set to a proper state during POR configuration. Please refer to Table 57 for more details. Table 57 provides the pinout listing for the MPC8533E 783 FC-PBGA package. Table 57. MPC8533E Pinout Listing Signal Package Pin Number Pin Type Power Supply Notes PCI PCI1_AD[31:0] AE8, AD8, AF8, AH12, AG12, AB9, AC9, AE9, AD10, AE10, AC11, AB11, AB12, AC12, AF12, AE11, Y14, AE15, AC15, AB15, AA15, AD16, Y15, AB16, AF18, AE18, AC17, AE19, AD19, AB17, AB18, AA16 I/O OV DD — PCI1_C_BE[3:0] AC10, AE12, AA14, AD17 I/O OV DD — PCI1_GNT[4:1] AE7, AG11,AH11, AC8 O OV DD 4, 8, 24 PCI1_GNT0 AE6 I/O OV DD — PCI1_IRDY AF13 I/O OV DD 2 PCI1_PAR AB14 I/O OV DD — PCI1_PERR AE14 I/O OV DD 2 PCI1_SERR AC14 I/O OV DD 2 PCI1_STOP AA13 I/O OV DD 2 PCI1_TRDY AD13 I/O OV DD 2 PCI1_REQ[4:1] AF9, AG10, AH10, AD6 I OV DD — PCI1_REQ0 AB8 I/O OV DD — PCI1_CLK AH26 I OV DD — PCI1_DEVSEL AC13 I/O OV DD 2 PCI1_FRAME AD12 I/O OV DD 2 PCI1_IDSEL AG6 I OV DD — MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 80 Freescale Semiconductor Package Description Table 57. MPC8533E Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Notes DDR SDRAM Memory Interface MDQ[0:63] A26, B26, C22, D21, D25, B25, D22, E21, A24, A23, B20, A20, A25, B24, B21, A21, E19, D19, E16, C16, F19, F18, F17, D16, B18, A18, A15, B14, B19, A19, A16, B15, D1, F3, G1, H2, E4, G5, H3, J4, B2, C3, F2, G2, A2, B3, E1, F1, L5, L4,N3, P3, J3, K4, N4, P4, J1, K1, P1, R1, J2, K2, N1, R2 I/O GVDD — MECC[0:7] G12, D14, F11, C11, G14, F14,C13, D12 I/O GVDD — MDM[0:8] C25, B23, D18, B17, G4, C2, L3, L2, F13 O GVDD 21 MDQS[0:8] D24, B22, C18, A17, J5, C1, M4, M2, E13 I/O GVDD — MDQS[0:8] C23, A22, E17, B16, K5, D2, M3, P2, D13 I/O GVDD — MA[0:15] B7, G8, C8, A10, D9, C10, A11, F9, E9, B12, A5, A12, D11, F7, E10, F10 O GVDD — MBA[0:2] A4, B5, B13 O GVDD — MWE B4 O GVDD — MCAS E7 O GVDD — MRAS C5 O GVDD — MCKE[0:3] H10, K10, G10, H9 O GVDD 10 MCS[0:3] D3, H6, C4, G6 O GVDD — MCK[0:5] A9, J11, J6, A8, J13, H8 O GVDD — MCK[0:5] B9, H11, K6, B8, H13, J8 O GVDD — MODT[0:3] E5, H7, E6, F6 O GVDD — MDIC[0:1] H15, K15 I/O GVDD 25 TEST_IN A13 I — 27 TEST_OUT A6 O — 17 23 Local Bus Controller Interface LAD[0:31] K22, L21, L22, K23, K24, L24, L25, K25, L28, L27, K28, K27, J28, H28, H27, G27, G26, F28, F26, F25, E28, E27, E26, F24, E24, C26, G24, E23, G23, F22, G22, G21 I/O BVDD LDP[0:3] K26, G28, B27, E25 I/O BVDD LA[27] L19 O BVDD 4, 8 LA[28:31] K16, K17, H17,G17 O BVDD 4, 6, 8 LCS[0:4] K18, G19, H19, H20, G16 O BVDD — LCS5/DMA_DREQ2 H16 I/O BVDD 1 MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 81 Package Description Table 57. MPC8533E Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Notes LCS6/DMA_DACK2 J16 O BVDD 1 LCS7/DMA_DDONE2 L18 O BVDD 1 LWE0/LBS0/LSDDQM[0] J22 O BVDD 4, 8 LWE1/LBS1/LSDDQM[1] H22 O BVDD 4, 8 LWE2/LBS2/LSDDQM[2] H23 O BVDD 4, 8 LWE3/LBS3/LSDDQM[3] H21 O BVDD 4, 8 LALE J26 O BVDD 4, 7, 8 LBCTL J25 O BVDD 4, 7, 8 LGPL0/LSDA10 J20 O BVDD 4, 8 LGPL1/LSDWE K20 O BVDD 4, 8 LGPL2/LOE/LSDRAS G20 O BVDD 4, 7, 8 LGPL3/LSDCAS H18 O BVDD 4, 8 LGPL4/LGTA/LUPWAIT/ LPBSE L20 I/O BVDD — LGPL5 K19 O BVDD 4, 8 LCKE L17 O BVDD — LCLK[0:2] H24, J24, H25 O BVDD — LSYNC_IN D27 I BVDD — LSYNC_OUT D28 O BVDD — DMA DMA_DACK[0:1] Y13, Y12 O OV DD 4, 8, 9 DMA_DREQ[0:1] AA10, AA11 I OV DD — DMA_DDONE[0:1] AA7, Y11 O OV DD — Programmable Interrupt Controller UDE AH15 I OV DD — MCP AG18 I OV DD — IRQ[0:7] AG22, AF17, AD21, AF19, AG17, AF16, AC23, AC22 I OV DD — IRQ[8] AC19 I OV DD — IRQ[9]/DMA_DREQ3 AG20 I OV DD 1 IRQ[10]/DMA_DACK3 AE27 I/O OV DD 1 IRQ[11]/DMA_DDONE3 AE24 I/O OV DD 1 IRQ_OUT AD14 O OV DD 2 MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 82 Freescale Semiconductor Package Description Table 57. MPC8533E Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Notes Ethernet Management Interface EC_MDC AC7 O OV DD 4, 8, 14 EC_MDIO Y9 I/O OV DD — I LVDD — Gigabit Reference Clock EC_GTX_CLK125 T2 Three-Speed Ethernet Controller (Gigabit Ethernet 1) TSEC1_RXD[7:0] U10, U9, T10, T9, U8, T8, T7, T6 I LVDD — TSEC1_TXD[7:0] T5, U5, V5, V3, V2, V1, U2, U1 O LVDD 4, 8, 14 TSEC1_COL R5 I LVDD — TSEC1_CRS T4 I/O LVDD 16 TSEC1_GTX_CLK T1 O LVDD — TSEC1_RX_CLK V7 I LVDD — TSEC1_RX_DV U7 I LVDD — TSEC1_RX_ER R9 I LVDD 4, 8 TSEC1_TX_CLK V6 I LVDD — TSEC1_TX_EN U4 O LVDD 22 TSEC1_TX_ER T3 O LVDD — Three-Speed Ethernet Controller (Gigabit Ethernet 3) TSEC3_RXD[7:0] P11, N11, M11, L11, R8, N10, N9, P10 I LVDD — TSEC3_TXD[7:0] M7, N7, P7, M8, L7, R6, P6, M6 O LVDD 4, 8, 14 TSEC3_COL M9 I LVDD — TSEC3_CRS L9 I/O LVDD 16 TSEC3_GTX_CLK R7 O LVDD — TSEC3_RX_CLK P9 I LVDD — TSEC3_RX_DV P8 I LVDD — TSEC3_RX_ER R11 I LVDD — TSEC3_TX_CLK L10 I LVDD — TSEC3_TX_EN N6 O LVDD 22 TSEC3_TX_ER L8 O LVDD 4, 8 DUART UART_CTS[0:1] AH8, AF6 I OV DD — UART_RTS[0:1] AG8, AG9 O OV DD — MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 83 Package Description Table 57. MPC8533E Pinout Listing (continued) Signal Package Pin Number UART_SIN[0:1] AG7, AH6 UART_SOUT[0:1] AH7, AF7 I2 Pin Type Power Supply Notes I OV DD — O OV DD — C interface IIC1_SCL AG21 I/O OV DD 20 IIC1_SDA AH21 I/O OV DD 20 IIC2_SCL AG13 I/O OV DD 20 IIC2_SDA AG14 I/O OV DD 20 SerDes 1 SD1_RX[0:7] N28, P26, R28, T26, Y26, AA28, AB26, AC28 I XVDD — SD1_RX[0:7] N27, P25, R27, T25, Y25, AA27, AB25, AC27 I XVDD — SD1_TX[0:7] M23, N21, P23, R21, U21, V23, W21, Y23 O XVDD — SD1_TX[0:7] M22, N20, P22, R20, U20, V22, W20, Y22 O XVDD — SD1_PLL_TPD V28 O XVDD 17 SD1_REF_CLK U28 I XVDD — SD1_REF_CLK U27 I XVDD — SD1_TST_CLK T22 — — SD1_TST_CLK T23 — — SerDes 2 SD2_RX[0] AD25 I XVDD — SD2_RX[2] AD1 I XVDD 26 SD2_RX[3] AB2 I XVDD 26 SD2_RX[0] AD26 I XVDD — SD2_RX[2] AC1 I XVDD 26 SD2_RX[3] AA2 I XVDD 26 SD2_TX[0] AA21 O XVDD — SD2_TX[2] AC4 O XVDD 17 SD2_TX[3] AA5 O XVDD 17 SD2_TX[0] AA20 O XVDD — SD2_TX[2] AB4 O XVDD 17 SD2_TX[3] Y5 O XVDD 17 SD2_PLL_TPD AG3 O XVDD 17 SD2_REF_CLK AE2 I XVDD — MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 84 Freescale Semiconductor Package Description Table 57. MPC8533E Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Notes SD2_REF_CLK AF2 I XVDD — SD2_TST_CLK AG4 — — — SD2_TST_CLK AF4 — — — O OV DD — I OV DD — General-Purpose Output GPOUT[0:7] AF22, AH23, AG27, AH25, AF21, AF25, AG26, AF26 General-Purpose Input GPIN[0:7] AH24, AG24, AD23, AE21, AD22, AF23, AG25, AE20 System Control HRESET AG16 I OV DD — HRESET_REQ AG15 O OV DD 21 SRESET AG19 I OV DD — CKSTP_IN AH5 I OV DD — CKSTP_OUT AA12 O OV DD 2, 4 Debug TRIG_IN AC5 I OV DD — TRIG_OUT/READY/ QUIESCE AB5 O OV DD 5, 8, 15, 21 MSRCID[0:1] Y7, W9 O OV DD 4, 5, 8 MSRCID[2:4] AA9, AB6, AD5 O OV DD 5, 15, 21 MDVAL Y8 O OV DD 5 CLK_OUT AE16 O OV DD 10 Clock RTC AF15 I OV DD — SYSCLK AH16 I OV DD — JTAG TCK AG28 I OV DD — TDI AH28 I OV DD 11 TDO AF28 O OV DD 10 TMS AH27 I OV DD 11 TRST AH22 I OV DD 11 MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 85 Package Description Table 57. MPC8533E Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Notes DFT L1_TSTCLK AC20 I OV DD 18 L2_TSTCLK AE17 I OV DD 18 LSSD_MODE AH19 I OV DD 18 TEST_SEL AH13 I OV DD 3 Thermal Management TEMP_ANODE Y3 — — 13 TEMP_CATHODE AA3 — — 13 O OV DD 8, 15, 21 Power Management ASLEEP AH17 Power and Ground Signals GND D5, M10, F4, D26, D23, C12, C15, E20, D8, B10, E3, J14, K21, F8, A3, F16, E12, E15, D17, L1, F21, H1, G13, G15, G18, C6, A14, A7, G25, H4, C20, J12, J15, J17, F27, M5, J27, K11, L26, K7, K8, L12, L15, M14, M16, M18, N13, N15, N17, N2, P5, P14, P16, P18, R13, R15, R17, T14, T16, T18, U13, U15, U17, AA8, U6, Y10, AC21, AA17, AC16, V4, AD7, AD18, AE23, AF11, AF14, AG23, AH9, A27, B28, C27 — — — OVDD[1:17] Y16, AB7, AB10, AB13, AC6, AC18, AD9, AD11, AE13, AD15, AD20, AE5, AE22, AF10, AF20, AF24, AF27 Power for PCI and other standards (3.3 V) OV DD — LVDD[1:2] R4, U3 Power for TSEC1 interfaces (2.5 V, 3.3 V) LVDD — TVDD[1:2] N8, R10 Power for TSEC3 interfaces (2.5 V, 3.3 V) TVDD — GV DD B1, B11, C7, C9, C14, C17, D4, D6, R3, D15, E2, E8,C24, E18, F5, E14, C21, G3, G7, G9, G11, H5, H12, E22, F15, J10, K3, K12, K14, H14, D20, E11, M1, N5 Power for DDR1 and DDR2 DRAM I/O voltage (1.8 V, 2.5 V) GVDD — BVDD L23, J18, J19, F20, F23, H26, J21, J23 Power for local bus (1.8 V, 2.5 V, 3.3 V) BVDD — MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 86 Freescale Semiconductor Package Description Table 57. MPC8533E Pinout Listing (continued) Power Supply Notes Power for core (1.0 V) VDD — M27, N25, P28, R24, R26, T24, T27, U25, W24, W26, Y24, Y27, AA25, AB28, AD27 Core power for SerDes 1 transceivers (1.0 V) SVDD — SVDD_SRDS2 AB1, AC26, AD2, AE26, AG2 Core power for SerDes 2 transceivers (1.0 V) SVDD — XVDD_SRDS M21, N23, P20, R22, T20, U23, V21, W22, Y20 Pad power for SerDes 1 transceivers (1.0 V) XVDD — XVDD_SRDS2 Y6, AA6, AA23, AF5, AG5 Pad power for SerDes 2 transceivers (1.0 V) XVDD — XGND_SRDS M20, M24, N22, P21, R23, T21, U22, V20, W23, Y21 — — — XGND_SRDS2 Y4, AA4, AA22, AD4, AE4, AH4 — — — SGND_SRDS M28, N26, P24, P27, R25, T28, U24, U26, V24, W25, Y28, AA24, AA26, AB24, AB27, AC24, AD28 — — — AGND_SRDS V27 SerDes PLL GND — — SGND_SRDS2 Y2, AA1, AB3, AC2, AC3, AC25, AD3, AD24, AE3, AE1, AE25, AF3, AH2 — — — AGND_SRDS2 AF1 SerDes PLL GND — — AVDD_LBIU C28 Power for local bus PLL (1.0 V) — 19 AVDD_PCI1 AH20 Power for PCI PLL (1.0 V) — 19 AVDD_CORE AH14 Power for e500 PLL (1.0 V) — 19 AVDD_PLAT AH18 Power for CCB PLL (1.0 V) — 19 Signal Package Pin Number Pin Type VDD L16, L14, M13, M15, M17, N12, N14, N16, N18, P13, P15, P17, R12, R14, R16, R18, T13, T15, T17, U12, U14, U16, U18, SVDD_SRDS MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 87 Package Description Table 57. MPC8533E Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Notes AVDD_SRDS W28 Power for SRDSPLL (1.0 V) — 19 AVDD_SRDS2 AG1 Power for SRDSPLL (1.0 V) — 19 SENSEVDD W11 O VDD 12 SENSEVSS W10 — — 12 Analog Signals MVREF A28 Reference voltage signal for DDR MVREF — SD1_IMP_CAL_RX M26 — 200Ω to GND — SD1_IMP_CAL_TX AE28 — 100Ω to GND — SD1_PLL_TPA V26 — AVDD_SRDS ANALOG 17 SD2_IMP_CAL_RX AH3 I 200 Ω to GND — SD2_IMP_CAL_TX Y1 I 100 Ω to GND — SD2_PLL_TPA AH1 O AVDD_SRDS2 ANALOG 17 — — — No Connect Pins NC C19, D7, D10, K13, L6, K9, B6, F12, J7, M19, M25, N19, N24, P19, R19, AB19, T12, W3, M12, W5, P12, T19, W1, W7, L13, U19, W4, V8, V9, V10, V11, V12, V13, V14, V15, V16, V17, V18, V19, W2, W6, W8, T11, U11, W12, W13, W14, W15, W16, W17, W18, W19, W27, V25, Y17, Y18, Y19, AA18, AA19, AB20, AB21, AB22, AB23, J9 Notes: 1. All multiplexed signals are listed only once and do not re-occur. For example, LCS5/DMA_REQ2 is listed only once in the Local Bus Controller Interface section, and is not mentioned in the DMA section even though the pin also functions as DMA_REQ2. 2. Recommend a weak pull-up resistor (2–10 KΩ) be placed on this pin to OVDD. 3. This pin must always be pulled high. 4. This pin is a reset configuration pin. It has a weak internal pull-up P-FET which is enabled only when the processor is in the reset state. This pull-up is designed such that it can be overpowered by an external 4.7-kΩ pull-down resistor. However, if the signal is intended to be high after reset, and if there is any device on the net which might pull down the value of the net at reset, then a pull-up or active driver is needed. 5. Treat these pins as no connects (NC) unless using debug address functionality. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 88 Freescale Semiconductor Package Description Table 57. MPC8533E Pinout Listing (continued) Signal Package Pin Number Pin Type Power Supply Notes 6. The value of LA[28:31] during reset sets the CCB clock to SYSCLK PLL ratio. These pins require 4.7-kΩ pull-up or pull-down resistors. See Section 19.2, “CCB/SYSCLK PLL Ratio.” 7. The value of LALE, LGPL2, and LBCTL at reset set the e500 core clock to CCB clock PLL ratio. These pins require 4.7-kΩ pull-up or pull-down resistors. See Section 19.3, “e500 Core PLL Ratio.” 8. Functionally, this pin is an output, but structurally it is an I/O because it either samples configuration input during reset or because it has other manufacturing test functions. Therefore, this pin will be described as an I/O for boundary scan. 9. For proper state of these signals during reset, these pins can be left without any pull downs, thus relying on the internal pullup to get the values to the require 2'b11. However, if there is any device on the net which might pull down the value of the net at reset, then a pullup is needed. 10. This output is actively driven during reset rather than being three-stated during reset. 11. These JTAG pins have weak internal pull-up P-FETs that are always enabled. 12. These pins are connected to the V DD/GND planes internally and may be used by the core power supply to improve tracking and regulation. 13. Anode and cathode of internal thermal diode. 14. Treat pins AC7, T5, V2, and M7 as spare configuration pins cfg_spare[0:3]. The spare pins are unused POR config pins. It is highly recommended that the customer provide the capability of setting these pins low (that is, pull-down resistor which is not currently stuffed) in order to support new config options should they arise between revisions. 15. If this pin is connected to a device that pulls down during reset, an external pull-up is required to drive this pin to a safe state during reset. 16. This pin is only an output in FIFO mode when used as Rx flow control. 17. Do not connect. 18. These are test signals for factory use only and must be pulled up (100 Ω to 1 kΩ) to OVDD for normal machine operation. 19. Independent supplies derived from board VDD. 20. Recommend a pull-up resistor (1 K~) be placed on this pin to OVDD. 21. The following pins must not be pulled down during power-on reset: HRESET_REQ, TRIG_OUT/READY/QUIESCE, MSRCID[2:4], and ASLEEP. 22. This pin requires an external 4.7-kΩ pull-down resistor to prevent PHY from seeing a valid transmit enable before it is actively driven. 23. General-purpose POR configuration of user system. 24. When a PCI block is disabled, either the POR config pin that selects between internal and external arbiter must be pulled down to select external arbiter if there is any other PCI device connected on the PCI bus, or leave the address pins as No Connect or terminated through 2–10 kΩ pull-up resistors with the default of internal arbiter if the address pins are not connected to any other PCI device. The PCI block will drive the address pins if it is configured to be the PCI arbiter—through POR config pins—irrespective of whether it is disabled via the DEVDISR register or not. It may cause contention if there is any other PCI device connected on the bus. 25. MDIC0 is grounded through an 18.2-Ω precision 1% resistor and MDIC1 is connected GVDD through an 18.2-Ω precision 1% resistor. These pins are used for automatic calibration of the DDR IOs. 26. Connect to GND. 27.Connect to GND. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 89 Clocking 19 Clocking This section describes the PLL configuration of the MPC8533E . Note that the platform clock is identical to the core complex bus (CCB) clock. 19.1 Clock Ranges Table 58 provides the clocking specifications for the processor cores and Table 59 provides the clocking specifications for the memory bus. Table 58. Processor Core Clocking Specifications Maximum Processor Core Frequency Characteristic 667 MHz e500 core processor frequency 800 MHz 1000 MHz 1067 MHz Min Max Min Max Min Max Min Max 667 667 667 800 667 1000 667 1067 Unit Notes MHz 1, 2 Notes: 1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating frequencies. Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” and Section 19.3, “e500 Core PLL Ratio,” for ratio settings. 2. The minimum e500 core frequency is based on the minimum platform frequency of 333 MHz. Table 59. Memory Bus Clocking Specifications Maximum Processor Core Frequency Characteristic Memory bus clock speed 667, 800, 1000, 1067 MHz Min Max 166 266 Unit Notes MHz 1, 2 Notes: 1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the resulting SYSCLK frequency, e500 (core) frequency, and CCB clock frequency do not exceed their respective maximum or minimum operating frequencies. Refer to Section 19.2, “CCB/SYSCLK PLL Ratio,” and Section 19.3, “e500 Core PLL Ratio,” for ratio settings. 2. The memory bus speed is half of the DDR/DDR2 data rate, hence, half of the platform clock frequency. 19.2 CCB/SYSCLK PLL Ratio The CCB clock is the clock that drives the e500 core complex bus (CCB), and is also called the platform clock. The frequency of the CCB is set using the following reset signals (see Table 60): • SYSCLK input signal • Binary value on LA[28:31] at power up Note that there is no default for this PLL ratio; these signals must be pulled to the desired values. Also note that the DDR data rate is the determining factor in selecting the CCB bus frequency, since the CCB frequency must equal the DDR data rate. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 90 Freescale Semiconductor Clocking Table 60. CCB Clock Ratio 19.3 Binary Value of LA[28:31] Signals CCB:SYSCLK Ratio Binary Value of LA[28:31] Signals CCB:SYSCLK Ratio 0000 16:1 1000 8:1 0001 Reserved 1001 9:1 0010 Reserved 1010 10:1 0011 3:1 1011 Reserved 0100 4:1 1100 12:1 0101 5:1 1101 Reserved 0110 6:1 1110 Reserved 0111 Reserved 1111 Reserved e500 Core PLL Ratio Table 61 describes the clock ratio between the e500 core complex bus (CCB) and the e500 core clock. This ratio is determined by the binary value of LBCTL, LALE, and LGPL2 at power up, as shown in Table 61. Table 61. e500 Core to CCB Clock Ratio 19.4 Binary Value of LBCTL, LALE, LGPL2 Signals e500 core:CCB Clock Ratio Binary Value of LBCTL, LALE, LGPL2 Signals e500 core:CCB Clock Ratio 000 4:1 100 2:1 001 Reserved 101 5:2 010 Reserved 110 3:1 011 3:2 111 7:2 PCI Clocks For specifications on the PCI_CLK, refer to the PCI 2.2 Local Bus Specifications. The use of PCI_CLK is optional if SYSCLK is in the range of 33–66 MHz. If SYSCLK is outside this range then use of PCI_CLK is required as a separate PCI clock source, asynchronous with respect to SYSCLK. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 91 Clocking 19.5 Security Controller PLL Ratio Table 62 shows the SEC frequency ratio. Table 62. SEC Frequency Ratio Signal Name Value (Binary) CCB CLK:SEC CLK LWE_B 0 2:11 1 3:12 Notes: 1. In 2:1 mode the CCB frequency must be operating <= 400 MHz. 2. In 3:1 mode any valid CCB can be used. The 3:1 mode is the default ratio for security block. 19.6 19.6.1 Frequency Options SYSCLK to Platform Frequency Options Table 63 shows the expected frequency values for the platform frequency when using a CCB clock to SYSCLK ratio in comparison to the memory bus clock speed. Table 63. Frequency Options of SYSCLK with Respect to Memory Bus Speeds CCB to SYSCLK Ratio SYSCLK (MHz) 33.33 41.66 66.66 83 100 111 133.33 Platform /CCB Frequency (MHz) 2 — 3 — 333 400 445 533 4 — 333 400 5 333 415 500 6 400 500 8 333 9 375 10 333 417 12 400 500 16 533 533 MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 92 Freescale Semiconductor Thermal 19.6.2 Platform to FIFO Restrictions Please note the following FIFO maximum speed restrictions based on platform speed. Refer to Section 4.4, “Platform to FIFO Restrictions,” for additional information. Table 64. FIFO Maximum Speed Restrictions Platform Speed (MHz) Maximum FIFO Speed for Reference Clocks TSECn_TX_CLK, TSECn_RX_CLK (MHz)1 533 126 400 94 Note: 1. FIFO speed should be less than 24% of the platform speed. 20 Thermal This section describes the thermal specifications of the MPC8533E. 20.1 Thermal Characteristics Table 65 provides the package thermal characteristics. Table 65. Package Thermal Characteristics Characteristic JEDEC Board Symbol Value Unit Notes Junction-to-ambient natural convection Single layer board (1s) RθJA 26 °C/W 1, 2 Junction-to-ambient natural convection Four layer board (2s2p) RθJA 21 °C/W 1, 2 Junction-to-ambient (@200 ft/min) Single layer board (1s) RθJA 21 °C/W 1, 2 Junction-to-ambient (@200 ft/min) Four layer board (2s2p) RθJA 17 °C/W 1, 2 Junction-to-board thermal — RθJB 12 °C/W 3 Junction-to-case thermal — RθJC <0.1 °C/W 4 Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance. 2. Per JEDEC JESD51-2 and JESD51-6 with the board (JESD51-9) horizontal. 3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 4. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL SPEC-883 Method 1012.1) with the calculated case temperature. Actual thermal resistance is less than 0.1°C/W. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 93 Thermal Table 66 provides the thermal resistance with heat sink in open flow. Table 66. Thermal Resistance with Heat Sink in Open Flow Heat Sink with Thermal Grease Air Flow Thermal Resistance (°C/W) Wakefield 53 × 53 × 25 mm pin fin Natural convection 6.1 Wakefield 53 × 53 × 25 mm pin fin 1 m/s 3.0 Aavid 35 × 31 × 23 mm pin fin Natural convection 8.1 Aavid 35 × 31 × 23 mm pin fin 1 m/s 4.3 Aavid 30 × 30 × 9.4 mm pin fin Natural convection 11.6 Aavid 30 × 30 × 9.4 mm pin fin 1 m/s 6.7 Aavid 43 × 41 × 16.5 mm pin fin Natural convection 8.3 Aavid 43 × 41 × 16.5 mm pin fin 1 m/s 4.3 Simulations with heat sinks were done with the package mounted on the 2s2p thermal test board. The thermal interface material was a typical thermal grease such as Dow Corning 340 or Wakefield 120 grease. For system thermal modeling, the MPC8533E thermal model without a lid is shown in Figure 56. The substrate is modeled as a block 29 × 29 × 1.18 mm with an in-plane conductivity of 18.0 W/m•K and a through-plane conductivity of 1.0 W/m•K. The solder balls and air are modeled as a single block 29 × 29 × 0.58 mm with an in-plane conductivity of 0.034 W/m•K and a through plane conductivity of 12.1 W/m•K. The die is modeled as 7.6 × 8.4 mm with a thickness of 0.75 mm. The bump/underfill layer is modeled as a collapsed thermal resistance between the die and substrate assuming a conductivity of 6.5 W/m•K in the thickness dimension of 0.07 mm. The die is centered on the substrate. The thermal model uses approximate dimensions to reduce grid. Please refer to Figure 55 for actual dimensions. 20.2 Recommended Thermal Model Table 67 shows the MPC8533E thermal model. Table 67. MPC8533EThermal Model Conductivity Value Units Die (7.6 × 8.4 × 0.75mm) Silicon Temperature dependent — Bump/Underfill (7.6 × 8.4 × 0.070 mm) Collapsed Thermal Resistance Kz 6.5 W/m•K Substrate (29 × 29 × 1.18 mm) Kx 18 Ky 18 Kz 1.0 W/m•K MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 94 Freescale Semiconductor Thermal Table 67. MPC8533EThermal Model (continued) Conductivity Value Units Solder and Air (29 × 29 × 0.58 mm) Kx 0.034 Ky 0.034 Kz 12.1 Bump Underfill W/m•K Die Substrate Section A-A Solder/Air A A Top View Figure 56. System Level Thermal Model for MPC8533E (Not to Scale) The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer for flow over the part in standard JEDEC environments, as well as the heat spreading in the board under the package. In a real system, however, the part will require a heat sink to be mounted on it. In this case, the predominant heat flow path will be from the die to the heat sink. Grid density lower than currently in the package library file will suffice for these simulations. The user will need to determine the optimal grid for their specific case. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 95 Thermal 20.3 Thermal Management Information This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow, and thermal interface material. The MPC8533E implements several features designed to assist with thermal management, including the temperature diode. The temperature diode allows an external device to monitor the die temperature in order to detect excessive temperature conditions and alert the system; see Section 20.3.4, “Temperature Diode,” for more information. The recommended attachment method to the heat sink is illustrated in Figure 57. The heat sink should be attached to the printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force (45 Newton). FC-PBGA Package Heat Sink Heat Sink Clip Adhesive or Thermal Interface Material Die Printed-Circuit Board Figure 57. Package Exploded Cross-Sectional View with Several Heat Sink Options The system board designer can choose between several types of heat sinks to place on the device. There are several commercially-available heat sinks from the following vendors: Aavid Thermalloy 603-224-9988 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Advanced Thermal Solutions 781-769-2800 89 Access Road #27. Norwood, MA02062 Internet: www.qats.com Alpha Novatech 408-567-8082 473 Sapena Ct. #12 Santa Clara, CA 95054 Internet: www.alphanovatech.com MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 96 Freescale Semiconductor Thermal International Electronic Research Corporation (IERC) 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Millennium Electronics (MEI) Loroco Sites 671 East Brokaw Road San Jose, CA 95112 Internet: www.mei-thermal.com Tyco Electronics Chip Coolers™ P.O. Box 3668 Harrisburg, PA 17105-3668 Internet: www.chipcoolers.com Wakefield Engineering 33 Bridge St. Pelham, NH 03076 Internet: www.wakefield.com 818-842-7277 408-436-8770 800-522-6752 603-635-2800 Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, that will allow the MPC8533E to function in various environments. 20.3.1 Internal Package Conduction Resistance For the packaging technology, shown in Table 65, the intrinsic internal conduction thermal resistance paths are as follows: • The die junction-to-case thermal resistance • The die junction-to-board thermal resistance MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 97 Thermal Figure 58 depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board. Radiation External Resistance Convection Heat Sink Thermal Interface Material Die/Package Die Junction Package/Leads Internal Resistance Printed-Circuit Board External Resistance Radiation Convection (Note the internal versus external package resistance.) Figure 58. Package with Heat Sink Mounted to a Printed-Circuit Board The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is conducted through the silicon and through the heat sink attach material (or thermal interface material), and finally to the heat sink. The junction-to-case thermal resistance is low enough that the heat sink attach material and heat sink thermal resistance are the dominant terms. 20.3.2 Thermal Interface Materials A thermal interface material is required at the package-to-heat sink interface to minimize the thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism, Figure 59 shows the thermal performance of three thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure. As shown, the performance of these thermal interface materials improves with increasing contact pressure. The use of thermal grease significantly reduces the interface thermal resistance. The bare joint results in a thermal resistance approximately six times greater than the thermal grease joint. Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see Figure 57). Therefore, the synthetic grease offers the best thermal performance, especially at the low interface pressure. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 98 Freescale Semiconductor Thermal Silicone Sheet (0.006 in.) Bare Joint Floroether Oil Sheet (0.007 in.) Graphite/Oil Sheet (0.005 in.) Synthetic Grease Specific Thermal Resistance (K-in.2/W) 2 1.5 1 0.5 0 0 10 20 30 40 50 60 70 80 Contact Pressure (psi) Figure 59. Thermal Performance of Select Thermal Interface Materials The system board designer can choose between several types of thermal interface. There are several commercially-available thermal interfaces provided by the following vendors: Chomerics, Inc. 781-935-4850 77 Dragon Ct. Woburn, MA 01801 Internet: www.chomerics.com Dow-Corning Corporation 800-248-2481 Corporate Center P.O.Box 999 Midland, MI 48686-0997 Internet: www.dow.com Shin-Etsu MicroSi, Inc. 888-642-7674 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com The Bergquist Company 800-347-4572 18930 West 78th St. Chanhassen, MN 55317 Internet: www.bergquistcompany.com MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 99 Thermal Thermagon Inc. 4707 Detroit Ave. Cleveland, OH 44102 Internet: www.thermagon.com 20.3.3 888-246-9050 Heat Sink Selection Examples The following section provides a heat sink selection example using one of the commercially available heat sinks. For preliminary heat sink sizing, the die-junction temperature can be expressed as follows: TJ = TI + TR + (θJC + θINT + θSA) × PD where TJ is the die-junction temperature TI is the inlet cabinet ambient temperature TR is the air temperature rise within the computer cabinet θJC is the junction-to-case thermal resistance θINT is the adhesive or interface material thermal resistance θSA is the heat sink base-to-ambient thermal resistance PD is the power dissipated by the device During operation the die-junction temperatures (TJ) should be maintained within the range specified in Table 2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (TI) may range from 30° to 40°C. The air temperature rise within a cabinet (TR) may be in the range of 5° to 10°C. The thermal resistance of the thermal interface material (θINT) may be about 1°C/W. Assuming a TI of 30°C, a TR of 5°C, a FC-PBGA package θJC = 0.1, and a power consumption (PD) of 5, the following expression for TJ is obtained: Die-junction temperature: TJ = 30°C + 5°C + (0.1°C/W + 1.0°C/W + θSA) × PD The heat sink-to-ambient thermal resistance (θSA) versus airflow velocity for a Thermalloy heat sink #2328B is shown in Figure 60. Assuming an air velocity of 1 m/s, we have an effective θSA+ of about 5°C/W, thus TJ = 30° + 5°C + (0.1°C/W + 1.0°C/W + 5°C/W) × 5 resulting in a die-junction temperature of approximately 66, which is well within the maximum operating temperature of the component. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 100 Freescale Semiconductor Thermal 8 Thermalloy #2328B Pin-fin Heat Sink (25 × 28 × 15 mm) Heat Sink Thermal Resistance (°C/W) 7 6 5 4 3 2 1 0 0.5 1 1.5 2 2.5 3 3.5 Figure 60. Approach Air Velocity (m/s) 20.3.4 Temperature Diode The MPC8533E has a temperature diode on the microprocessor that can be used in conjunction with other system temperature monitoring devices (such as Analog Devices, ADT7461™). These devices use the negative temperature coefficient of a diode operated at a constant current to determine the temperature of the microprocessor and its environment. It is recommended that each device be individually calibrated. The following are voltage forward biased range of the on-board temperature diode: Vf > 0.40 V Vf < 0.90 V An approximate value of the ideality may be obtained by calibrating the device near the expected operating temperature. The ideality factor is defined as the deviation from the ideal diode equation: qVf nKT Ifw = Is e –1 Another useful equation is: KT I VH – VL = n q ln IH L where: Ifw = Forward current MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 101 System Design Information Is = Saturation current Vd = Voltage at diode Vf = Voltage forward biased VH = Diode voltage while IH is flowing VL = Diode voltage while IL is flowing IH = Larger diode bias current IL = Smaller diode bias current q = Charge of electron (1.6 × 10 –19 C) n = Ideality factor (normally 1.0) K = Boltzman’s constant (1.38 × 10–23 Joules/K) T = Temperature (Kelvins) The ratio of IH to IL is usually selected to be 10:1. The above simplifies to the following: VH – VL = 1.986 × 10–4 × nT Solving for T, the equation becomes: nT = VH – VL 1.986 × 10–4 21 System Design Information This section provides electrical and thermal design recommendations for successful application of the MPC8533E. 21.1 System Clocking This device includes six PLLs: • The platform PLL generates the platform clock from the externally supplied SYSCLK input. The frequency ratio between the platform and SYSCLK is selected using the platform PLL ratio configuration bits as described in Section 19.2, “CCB/SYSCLK PLL Ratio.” • The e500 core PLL generates the core clock as a slave to the platform clock. The frequency ratio between the e500 core clock and the platform clock is selected using the e500 PLL ratio configuration bits as described in Section 19.3, “e500 Core PLL Ratio.” • The PCI PLL generates the clocking for the PCI bus. • The local bus PLL generates the clock for the local bus. • There are two PLLs for the SerDes block. 21.2 PLL Power Supply Filtering Each of the PLLs listed above is provided with power through independent power supply pins (AVDD_PLAT, AVDD_CORE, AVDD_PCI, AVDD_LBIU, and AVDD_SRDS, respectively). The AVDD MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 102 Freescale Semiconductor System Design Information level should always be equivalent to VDD, and preferably these voltages will be derived directly from VDD through a low frequency filter scheme such as the following. There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to provide independent filter circuits per PLL power supply as illustrated in Figure 61, one to each of the AVDD pins. By providing independent filters to each PLL the opportunity to cause noise injection from one PLL to the other is reduced. This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz range. It should be built with surface mount capacitors with minimum Effective Series Inductance (ESL). Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a single large value capacitor. Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AV DD pin, which is on the periphery of 783 FC-PBGA the footprint, without the inductance of vias. Figure 61 shows the PLL power supply filter circuit. V DD 10 Ω AVDD 2.2 µF 2.2 µF Low ESL Surface Mount Capacitors GND Figure 61. MPC8533E PLL Power Supply Filter Circuit The AVDD_SRDSn signals provide power for the analog portions of the SerDes PLL. To ensure stability of the internal clock, the power supplied to the PLL is filtered using a circuit similar to the one shown in Figure 62. For maximum effectiveness, the filter circuit is placed as closely as possible to the AVDD_SRDSn balls to ensure it filters out as much noise as possible. The ground connection should be near the AVDD_SRDSn balls. The 0.003-µF capacitor is closest to the balls, followed by the 1-µF capacitor, and finally the 1-Ω resistor to the board supply plane. The capacitors are connected from AVDD_SRDSn to the ground plane. Use ceramic chip capacitors with the highest possible self-resonant frequency. All traces should be kept short, wide, and direct. 1.0 Ω SVDD AV DD_SRDS 2.2 µF1 2.2 µF1 0.003 µF GND Note: 1. An 0805 sized capacitor is recommended for system initial bring-up. Figure 62. SerDes PLL Power Supply Filter Circuit Note the following: • AVDD_SRDS should be a filtered version of SVDD. • Signals on the SerDes interface are fed from the XVDD power plane. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 103 System Design Information 21.3 Decoupling Recommendations Due to large address and data buses, and high operating frequencies, the device can generate transient power surges and high frequency noise in its power supply, especially while driving large capacitive loads. This noise must be prevented from reaching other components in the MPC8533E system, and the device itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system designer place at least one decoupling capacitor at each VDD, TVDD, BVDD, OVDD, GVDD, and LVDD pin of the device. These decoupling capacitors should receive their power from separate VDD, TVDD, BVDD, OVDD, GVDD, and LVDD; and GND power planes in the PCB, utilizing short low impedance traces to minimize inductance. Capacitors may be placed directly under the device using a standard escape pattern. Others may surround the part. These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology) capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes. In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB, feeding the VDD, TVDD, BVDD, OVDD, GVDD, and LVDD planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the quick response time necessary. They should also be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk capacitors—100–330 µF (AVX TPS tantalum or Sanyo OSCON). However, customers should work directly with their power regulator vendor for best values and types and quantity of bulk capacitors. 21.4 SerDes Block Power Supply Decoupling Recommendations The SerDes block requires a clean, tightly regulated source of power (SVDD and XVDD) to ensure low jitter on transmit and reliable recovery of data in the receiver. An appropriate decoupling scheme is outlined below. Only surface mount technology (SMT) capacitors should be used to minimize inductance. Connections from all capacitors to power and ground should be done with multiple vias to further reduce inductance. • First, the board should have at least 10 × 10-nF SMT ceramic chip capacitors as close as possible to the supply balls of the device. Where the board has blind vias, these capacitors should be placed directly below the chip supply and ground connections. Where the board does not have blind vias, these capacitors should be placed in a ring around the device as close to the supply and ground connections as possible. • Second, there should be a 1-µF ceramic chip capacitor on each side of the device. This should be done for all SerDes supplies. • Third, between the device and any SerDes voltage regulator there should be a 10-µF, low equivalent series resistance (ESR) SMT tantalum chip capacitor and a 100-µF, low ESR SMT tantalum chip capacitor. This should be done for all SerDes supplies. 21.5 Connection Recommendations To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal level. All unused active low inputs should be tied to VDD, TVDD, BVDD, OVDD, GVDD, and LVDD as required. All unused active high inputs should be connected to GND. All NC (no connect) signals must MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 104 Freescale Semiconductor System Design Information remain unconnected. Power and ground connections must be made to all external VDD, TVDD, BVDD, OVDD, GVDD, and LVDD, and GND pins of the device. 21.6 Pull-Up and Pull-Down Resistor Requirements The MPC8533E requires weak pull-up resistors (2–10 kΩ is recommended) on open drain type pins including I2C pins and MPIC interrupt pins. Correct operation of the JTAG interface requires configuration of a group of system control pins as demonstrated in Figure 65. Care must be taken to ensure that these pins are maintained at a valid deasserted state under normal operating conditions as most have asynchronous behavior and spurious assertion will give unpredictable results. The following pins must NOT be pulled down during power-on reset: TSEC3_TXD[3], HRESET_REQ, TRIG_OUT/READY/QUIESCE, MSRCID[2:4], ASLEEP. The DMA_DACK[0:1] and TEST_SEL pins must be set to a proper state during POR configuration. Refer to the pinout listing table (Table 57) for more details. Refer to the PCI 2.2 Local Bus Specifications, for all pullups required for PCI. 21.7 Output Buffer DC Impedance The MPC8533E drivers are characterized over process, voltage, and temperature. For all buses, the driver is a push-pull single-ended driver type (open drain for I2C). To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 63). The output impedance is the average of two components, the resistances of the pull-up and pull-down devices. When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each other in value. Then, Z0 = (RP + RN)/2. OV DD RN SW2 Data Pad SW1 RP OGND Figure 63. Driver Impedance Measurement MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 105 System Design Information Table 68 summarizes the signal impedance targets. The driver impedances are targeted at minimum VDD, nominal OVDD, 90°C. Table 68. Impedance Characteristics Impedance Local Bus, Ethernet, DUART, Control, Configuration, Power Management PCI DDR DRAM Symbol Unit RN 43 Target 25 Target 20 Target Z0 W RP 43 Target 25 Target 20 Target Z0 W Note: Nominal supply voltages. See Table 1. 21.8 Configuration Pin Muxing The MPC8533E provides the user with power-on configuration options which can be set through the use of external pull-up or pull-down resistors of 4.7 kΩ on certain output pins (see customer visible configuration pins). These pins are generally used as output only pins in normal operation. While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins while HRESET is asserted, is latched when HRESET deasserts, at which time the input receiver is disabled and the I/O circuit takes on its normal function. Most of these sampled configuration pins are equipped with an on-chip gated resistor of approximately 20 kΩ. This value should permit the 4.7-kΩ resistor to pull the configuration pin to a valid logic low level. The pull-up resistor is enabled only during HRESET (and for platform /system clocks after HRESET deassertion to ensure capture of the reset value). When the input receiver is disabled the pull-up is also, thus allowing functional operation of the pin as an output with minimal signal quality or delay disruption. The default value for all configuration bits treated this way has been encoded such that a high voltage level puts the device into the default state and external resistors are needed only when non-default settings are required by the user. Careful board layout with stubless connections to these pull-down resistors coupled with the large value of the pull-down resistor should minimize the disruption of signal quality or speed for output pins thus configured. The platform PLL ratio and e500 PLL ratio configuration pins are not equipped with these default pull-up devices. 21.9 JTAG Configuration Signals Correct operation of the JTAG interface requires configuration of a group of system control pins as demonstrated in Figure 65. Care must be taken to ensure that these pins are maintained at a valid deasserted state under normal operating conditions as most have asynchronous behavior and spurious assertion will give unpredictable results. Boundary-scan testing is enabled through the JTAG interface signals. The TRST signal is optional in the IEEE 1149.1 specification, but is provided on all processors built on Power Architecture™ technology. The device requires TRST to be asserted during reset conditions to ensure the JTAG boundary logic does not interfere with normal chip operation. While it is possible to force the TAP controller to the reset state MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 106 Freescale Semiconductor System Design Information using only the TCK and TMS signals, generally systems will assert TRST during the power-on reset flow. Simply tying TRST to HRESET is not practical because the JTAG interface is also used for accessing the common on-chip processor (COP) function. The COP function of these processors allow a remote computer system (typically, a PC with dedicated hardware and debugging software) to access and control the internal operations of the processor. The COP interface connects primarily through the JTAG port of the processor, with some additional status monitoring signals. The COP port requires the ability to independently assert HRESET or TRST in order to fully control the processor. If the target system has independent reset sources, such as voltage monitors, watchdog timers, power supply failures, or push-button switches, then the COP reset signals must be merged into these signals with logic. The arrangement shown in Figure 65 allows the COP port to independently assert HRESET or TRST, while ensuring that the target can drive HRESET as well. The COP interface has a standard header, shown in Figure 64, for connection to the target system, and is based on the 0.025" square-post, 0.100" centered header assembly (often called a Berg header). The connector typically has pin 14 removed as a connector key. The COP header adds many benefits such as breakpoints, watchpoints, register and memory examination/modification, and other standard debugger features. An inexpensive option can be to leave the COP header unpopulated until needed. There is no standardized way to number the COP header; consequently, many different pin numbers have been observed from emulator vendors. Some are numbered top-to-bottom then left-to-right, while others use left-to-right then top-to-bottom, while still others number the pins counter clockwise from pin 1 (as with an IC). Regardless of the numbering, the signal placement recommended in Figure 64 is common to all known emulators. 21.9.1 Termination of Unused Signals If the JTAG interface and COP header will not be used, Freescale recommends the following connections: • TRST should be tied to HRESET through a 0-kΩ isolation resistor so that it is asserted when the system reset signal (HRESET) is asserted, ensuring that the JTAG scan chain is initialized during the power-on reset flow. Freescale recommends that the COP header be designed into the system as shown in Figure 65. If this is not possible, the isolation resistor will allow future access to TRST in case a JTAG interface may need to be wired onto the system in future debug situations. • No pull-up/pull-down is required for TDI, TMS, or TDO. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 107 System Design Information COP_TDO 1 2 NC COP_TDI 3 4 COP_TRST COP_RUN/STOP 5 6 COP_VDD_SENSE COP_TCK 7 8 COP_CHKSTP_IN COP_TMS 9 10 NC COP_SRESET 11 12 NC COP_HRESET 13 KEY No pin COP_CHKSTP_OUT 15 16 GND Figure 64. COP Connector Physical Pinout MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 108 Freescale Semiconductor System Design Information OV DD From Target Board Sources (if any) SRESET HRESET 13 11 10 kΩ SRESET 6 10 kΩ HRESET1 COP_HRESET 10 kΩ COP_SRESET B 10 kΩ A 5 10 kΩ 10 kΩ 4 1 2 3 4 5 6 7 8 9 10 11 12 6 COP Header 5 15 15 COP_VDD_SENSE2 10 Ω NC COP_CHKSTP_OUT 14 3 CKSTP_OUT 10 kΩ COP_CHKSTP_IN CKSTP_IN 8 COP_TMS 16 9 COP Connector Physical Pinout TRST1 10 kΩ KEY 13 No pin COP_TRST 1 3 TMS COP_TDO TDO COP_TDI TDI COP_TCK 7 2 10 kΩ TCK NC 10 NC 12 4 16 Notes: 1. The COP port and target board should be able to independently assert HRESET and TRST to the processor in order to fully control the processor as shown here. 2. Populate this with a 10-Ω resistor for short-circuit/current-limiting protection. 3. The KEY location (pin 14) is not physically present on the COP header. 4. Although pin 12 is defined as a No Connect, some debug tools may use pin 12 as an additional GND pin for improved signal integrity. 5. This switch is included as a precaution for BSDL testing. The switch should be closed to position A during BSDL testing to avoid accidentally asserting the TRST line. If BSDL testing is not being performed, this switch should be closed to position B. 6. Asserting SRESET causes a machine check interrupt to the e500 core. Figure 65. JTAG Interface Connection MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 109 System Design Information 21.10 Guidelines for High-Speed Interface Termination 21.10.1 SerDes Interface Entirely Unused If the high-speed SerDes interface is not used at all, the unused pin should be terminated as described in this section. However, the SerDes must always have power applied to its supply pins. The following pins must be left unconnected (float): • SD_TX[0:7] • SD_TX[0:7] The following pins must be connected to GND: • SD_RX[0:7] • SD_RX[0:7] • SD_REF_CLK • SD_REF_CLK 21.10.2 SerDes Interface Partly Unused If only part of the high speed SerDes interface pins are used, the remaining high-speed serial I/O pins should be terminated as described in this section. The following pins must be left unconnected (float) if not used: • SD_TX[0:7] • SD_TX[0:7] The following pins must be connected to GND if not used: • SD_RX[0:7] • SD_RX[0:7] • SD_REF_CLK • SD_REF_CLK 21.11 Guideline for PCI Interface Termination PCI termination if not used at all is done as follows. Option 1 • If PCI arbiter is enabled during POR, • All AD pins will be driven to the stable states after POR. Therefore, all ADs pins can be floating. • All PCI control pins can be grouped together and tied to OVDD through a single 10-kΩ resistor. • It is optional to disable PCI block through DEVDISR register after POR reset. Option 2 • If PCI arbiter is disabled during POR, MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 110 Freescale Semiconductor Device Nomenclature • • All AD pins will be in the input state. Therefore, all ADs pins need to be grouped together and tied to OVDD through a single (or multiple) 10-kΩ resistor(s). All PCI control pins can be grouped together and tied to OVDD through a single 10-kΩ resistor. 21.12 Guideline for LBIU Termination If the LBIU parity pins are not used, the following list shows the termination recommendation: • For LDP[0:3]: tie them to ground or the power supply rail via a 4.7-kΩ resistor. • For LPBSE: tie it to the power supply rail via a 4.7-kΩ resistor (pull-up resistor). 22 Device Nomenclature Ordering information for the parts fully covered by this hardware specifications document is provided in Section 22.3, “Part Marking.” Contact your local Freescale sales office or regional marketing team for order information. 22.1 Industrial and Commercial Tier Qualification The MPC8533E device has been tested to meet the commercial tier qualification. Table 69 provides a description for commercial and industrial qualifications. Table 69. Commercial and Industrial Description Tier1 Typical Application Use Time Commercial 5 years Part-time/ Full-Time PC's, consumer electronics, office automation, SOHO networking, portable telecom products, PDA's, etc. Industrial 10 years Typically Full-Time Power-On Hours Example of Typical Applications Installed telecom equipment, work stations, servers, warehouse equipment, etc. Note: 1. Refer to Table 2 for operating temperature ranges. Temperature is independent of tier and varies per product. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 111 Device Nomenclature 22.2 Nomenclature of Parts Fully Addressed by this Document Table 70 provides the Freescale part numbering nomenclature for the MPC8533E. Table 70. Device Nomenclature MPC nnnn E C Product Part Encryption Temperature Range Code Identifier Acceleration MPC 8533 Blank = not included E = included Blank = 0° to 90°C HX AA X B Package1 Processor Frequency2 Platform Frequency Revision Level VT = FC-PBGA (lead free) F = 333 MHz AL = 667 MHz AN = 800 MHz G = 400 MHz AQ = 1000 MHz J = 533 MHz AR = 1067 MHz Contact local Freescale sales office Notes: 1. See Section 18, “Package Description,” for more information on available package types. 2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification support all core frequencies. Additionally, parts addressed by part number specifications may support other maximum core frequencies. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 112 Freescale Semiconductor Device Nomenclature 22.3 Part Marking Parts are marked as in the example shown in Figure 66. MPCnnnnCHXAAXB MMMMM CCCCC ATWLYYWW FC-PBGA Notes: MMMMM is the 5-digit mask number. ATWLYYWW is the traceability code. CCCCC is the country of assembly. This space is left blank if parts are assembled in the United States. Figure 66. Part Marking for FC-PBGA Device MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 113 Document Revision History 23 Document Revision History Table 71 provides a revision history for the MPC8533E hardware specification. Table 71. MPC8533E Document Revision History Revision Date Substantive Change(s) 3 11/2009 • Update Section 20.3.4, “Temperature Diode,” • Update Table 56 Package Parameters from 95.5%sn to 96.5%sn 2 01/2009 • • Update power number table to include 1067 MHz/533 MHz power numbers. • Remove Part number tables from Hardware spec. The part numbers are available on Freescale web site product page. • Removed I/O power numbers from the Hardware spec. and added the table to bring-up guide applacation note • Updated RX_CLK duty cycle min, and max value to meet the industry standard GMII duty cycle. • In Table 35, removed note 1 and renumbered remaining note. • Update paragraph Section 21.3, “Decoupling Recommendations • Update tDDKHMP, tDDKHME in Table 18 • Update Figure 5 DDR Output Timing Diagram 1 06/2008 Correction in Table 18 DDR SDRAM Output AC Timing Specifications tMCK Max value Improvement to Section 16, “High-Speed Serial Interfaces (HSSI) Update Figure 55 Mechanical Dimensions Correction in Table 43 Local Bus General Timing Parameters—PLL Bypassed 0 04/2008 Initial release. MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 114 Freescale Semiconductor Document Revision History THIS PAGE INTENTIONALLY LEFT BLANK MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 115 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. 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