LM9076Q www.ti.com SNVS713B – APRIL 2011 – REVISED MARCH 2013 LM9076Q 150mA Ultra-Low Quiescent Current LDO Regulator with Delayed Reset Output Check for Samples: LM9076Q FEATURES DESCRIPTION • • • The LM9076Q is a ±3%, 150 mA logic controlled voltage regulator. The regulator features an active low delayed reset output flag which can be used to reset a microprocessor system at turn-ON and in the event that the regulator output voltage falls below a minimum value. An external capacitor programs a delay time interval before the reset output pin can return high. 1 2 • • • • • • • AEC-Q100 Grade1 Qualified (-40°C to +125°C) Available with 5.0V or 3.3V Output Voltage Ultra Low Ground Pin Current, 25 μA Typical for 100 μA Load VOUT Initial Accuracy of ±1.5% VOUT Accurate to ±3% Over Load and Temperature Conditions Low Dropout Voltage, 200 mV Typical with 150 mA Load Low Off State Ground Pin Current for LM9076QBMA Delayed RESET Output Pin for Low VOUT Detection +70V/-50V Voltage Transients Operational VIN up to +40V Designed for automotive and industrial applications, the LM9076Q contains a variety of protection features such as thermal shutdown, input transient protection and a wide operating temperature range. The LM9076Q uses an PNP pass transistor which allows low drop-out voltage operation. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2013, Texas Instruments Incorporated LM9076Q SNVS713B – APRIL 2011 – REVISED MARCH 2013 www.ti.com Typical Applications Unregulated Voltage Input VIN Regulated Voltage Output VOUT LM9076S-x.x 100 k: Delayed Reset Output RESET CDELAY CIN GND 0.1 PF COUT 1.0 nF 10 PF 10 PF Figure 1. LM9076QS-x.x In 5 lead SFM package Unregulated Voltage Input VIN Regulated Voltage Output VOUT LM9076BMA-x.x Shutdown Control Input ON 100 k: Delayed Reset Output RESET SHUTDOWN OFF CDELAY CIN 0.1 PF GND COUT 1.0 nF 10 PF 10 PF Figure 2. LM9076QBMA-x.x in 8 lead SOIC package Connection Diagram Figure 3. Top View See SFM Package Number KTT0005B Figure 4. Top View See SOIC Package Number D0008A These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q LM9076Q www.ti.com SNVS713B – APRIL 2011 – REVISED MARCH 2013 Absolute Maximum Ratings (1) (2) VIN(DC) -15V to +55V VIN(+Transient) t< 10ms, Duty Cycle <1% +70V VIN(-Transient) t< 1ms, Duty Cycle <1% -50V SHUTDOWN Pin -15V to +52V RESET Pin -0.3V to 20V CDELAY Pin -0.3V to VOUT +0.3V Storage Temperature -65°C to +150°C Junction Temperature (TJ ) +175C ESD, HBM, per AEC - Q100 - 002 +/-2 kV ESD, MM, per AEC - Q100 - 003 +/-250V (1) (2) Absolute Maximum Ratings indicate the limits beyond which the device may cease to function, and/or damage to the device may occur. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Operating Ratings (1) VIN Pin 5.35V to 40V VSHUTDOWN Pin 0V to 40V −40°C < TJ < +125°C Junction Temperature Thermal Resistance KTT0005B (2) Thermal Resistance D0008A (1) (2) (2) θja 75°C/W θjc 2.9°C/W θja 156°C/W θjc 59°C/W Absolute Maximum Ratings indicate the limits beyond which the device may cease to function, and/or damage to the device may occur. Worst case (FREE AIR) per EIA/JESD51–3. Electrical Characteristics for LM9076Q–3.3 The following specifications apply for VIN = 14V; ILOAD = 10 mA; TJ = +25C; COUT = 10 μF, 0.5Ω < ESR < 4.0Ω; unless otherwise specified. Bold values indicate −40°C ≤ TJ ≤ +125°C. (1) (2) Minimum and Maximum limits are specified through test, design or statistical correlation. Symbol Parameter Conditions Min Typ Max Units LM9076Q–3.3 REGULATOR CHARACTERISTICS Output Voltage VOUT Output Voltage Off LM9076Q BMA only Reverse Battery ΔVOUT Line Regulation Load Regulation (1) (2) 3.251 3.30 3.349 V −20°C ≤ TJ ≤ 85°C 1 mA ≤ ILOAD ≤ 150 mA 3.234 3.30 3.366 V 1mA ≤ ILOAD ≤ 150 mA 3.201 3.30 3.399 V VIN = 60V, RLOAD = 1 kΩ, t ≤ 40ms 2.970 3.30 3.630 V – 0 250 mV −300 0 – mV 9.0V ≤ VIN ≤ 16V, ILOAD = 10 mA – 4 25 mV 16V ≤ VIN ≤ 40V, ILOAD = 10 mA – 17 35 mV 1 mA ≤ ILOAD ≤ 150 mA – 42 60 mV VSHUTDOWN ≥ 2V, RLOAD = 1 kΩ VIN = -15V, RLOAD = 1 kΩ The regulated output voltage specification is not ensured for the entire range of VIN and output loads. Device operational range is limited by the maximum junction temperature (T J ). The junction temperature is influenced by the ambient temperature (T A ), package selection, input voltage (VIN ), and the output load current. When operating with maximum load currents the input voltage and/or ambient temperature will be limited. When operating with maximum input voltage the load current and/or the ambient temperature will be limited. Pulse testing used maintain constant junction temperature (TJ ). Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q 3 LM9076Q SNVS713B – APRIL 2011 – REVISED MARCH 2013 www.ti.com Electrical Characteristics for LM9076Q–3.3 (continued) The following specifications apply for VIN = 14V; ILOAD = 10 mA; TJ = +25C; COUT = 10 μF, 0.5Ω < ESR < 4.0Ω; unless otherwise specified. Bold values indicate −40°C ≤ TJ ≤ +125°C.(1) (2) Minimum and Maximum limits are specified through test, design or statistical correlation. Symbol Parameter VDO Conditions Dropout Voltage IGND Ground Pin Current ISC VOUT Short Circuit Current PSRR Ripple Rejection Min Typ Max Units ILOAD = 10 mA – 30 50 mV ILOAD = 50 mA – 80 – mV ILOAD = 150 mA – 150 250 mV 9V ≤ VIN ≤ 16V, ILOAD = 100 uA – 25 45 μA 9V ≤ VIN ≤ 40V, ILOAD = 10 mA – 125 160 μA 9V ≤ VIN ≤ 40V, ILOAD = 50 mA – 0.6 – mA 9V ≤ VIN ≤ 16V, ILOAD = 150 mA – 3.6 4.5 mA VIN = 14V, RLOAD = 1Ω 200 400 750 mA VIN = (14VDC) + (1VRMS @ 120Hz) ILOAD = 50 mA 50 60 – dB (3) – 1.3 2.0 V 0.83 0.89 0.94 X VOUT (Nom) VOUT X 0.90 VOUT X 0.99 VOUT V – 0.2 0.3 V RESET PIN CHARACTERISTICS VOR Minimum VIN for valid RESET Status VTHR VOUT Threshold for RESET Low VOH RESET pin high voltage External pull-up resistor to VOUT = 100 kΩ VOL RESET pin low voltage CDELAY < 4.0V, ISINK = 250 µA (3) CDELAY PIN CHARACTERISTICS IDELAY CDELAY Charging Current VIN = 14V, VDELAY = 0V -0.70 -0.42 -0.25 uA VOL CDELAY pin low voltage VOUT < 4.0V, ISINK = IDELAY – 0.100 – V 4.7 7.8 13.2 ms tDELAY (3) 4 Reset Delay Time VIN = 14V, CDELAY = 0.001 uF VOUT rising from 0V, Δt from VOUT > VOR to RESET pin HIGH Not Production tested, Specified by Design. Minimum, Typical, and/or Maximum values are provided for informational purposes only. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q LM9076Q www.ti.com SNVS713B – APRIL 2011 – REVISED MARCH 2013 Electrical Characteristics for LM9076Q–5.0 The following specifications apply for VIN= 14V; VSHUTDOWN = Open; ILOAD = 10 mA; TJ = +25°C; COUT = 10 µF, 0.5Ω < ESR < 4.0Ω; unless otherwise specified. Bold Values indicate −40°C ≤ TJ ≤ 125°C. (1), (2) Minimum and Maximum limits are specified through test, design, or statistical correlation. Symbol Parameter Conditions Min Typ Max Units 4.925 5.00 5.075 V −20°C ≤ TJ ≤ 85°C 1 mA ≤ ILOAD ≤ 150 mA 4.900 5.00 5.100 V 1 mA ≤ ILOAD ≤ 150 mA 4.850 5.00 5.150 V VIN = 60V, RLOAD = 1 kΩ, t ≤ 40ms 4.500 5.00 5.500 V – 0 250 mV −300 0 – mV 9.0V ≤ VIN ≤ 16V, ILOAD = 10 mA – 4 25 mV 16V ≤ VIN ≤ 40V, ILOAD = 10 mA – 17 35 mV 1 mA ≤ ILOAD ≤ 150 mA – 42 60 mV ILOAD = 10 mA – 30 50 mV ILOAD = 50 mA – 80 – mV ILOAD = 150 mA – 150 250 mV 9V ≤ VIN ≤ 16V, ILOAD = 100 uA – 25 45 μA 9V ≤ VIN ≤ 40V, ILOAD = 10 mA – 125 160 μA 9V ≤ VIN ≤ 40V, ILOAD = 50 mA – 0.6 – mA 9V ≤ VIN ≤ 16V, ILOAD = 150 mA – 3.6 4.5 mA 9V ≤ VIN ≤ 40V, VSHUTDOWN = 2V – 15 25 μA VIN = 14V, RLOAD = 1Ω 200 400 750 mA VIN = (14VDC) + (1VRMS @ 120Hz) ILOAD = 50 mA 50 60 – dB (3) – 1.3 2.0 V 0.83 0.89 0.94 X VOUT (Nom) VOUT X 0.90 VOUT X 0.99 VOUT V – 0.2 0.3 V -0.70 -0.42 -0.25 uA LM9076Q–5.0 REGULATOR CHARACTERISTICS Output Voltage VOUT VSHUTDOWN ≥ 2V, RLOAD = 1 kΩ Output Voltage Off LM9076Q BMA only VIN = -15V, RLOAD = 1 kΩ Reverse Battery Line Regulation ΔVOUT Load Regulation VDO Dropout Voltage Ground Pin Current IGND Ground Pin Current in Shutdown Mode ISC VOUT Short Circuit Current PSRR Ripple Rejection RESET PIN CHARACTERISTICS VOR Minimum VIN for valid RESET Status VTHR VOUT Threshold for RESET Low VOH RESET pin high voltage External pull-up resistor to VOUT = 100 kΩ VOL RESET pin low voltage CDELAY < 4.0V, ISINK = 250 µA (3) CDELAY PIN CHARACTERISTICS IDELAY (1) (2) (3) CDELAY Charging Current VIN = 14V, VDELAY = 0V Pulse testing used maintain constant junction temperature (TJ ). The regulated output voltage specification is not ensured for the entire range of VIN and output loads. Device operational range is limited by the maximum junction temperature (T J ). The junction temperature is influenced by the ambient temperature (T A ), package selection, input voltage (VIN ), and the output load current. When operating with maximum load currents the input voltage and/or ambient temperature will be limited. When operating with maximum input voltage the load current and/or the ambient temperature will be limited. Not Production tested, Specified by Design. Minimum, Typical, and/or Maximum values are provided for informational purposes only. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q 5 LM9076Q SNVS713B – APRIL 2011 – REVISED MARCH 2013 www.ti.com Electrical Characteristics for LM9076Q–5.0 (continued) The following specifications apply for VIN= 14V; VSHUTDOWN = Open; ILOAD = 10 mA; TJ = +25°C; COUT = 10 µF, 0.5Ω < ESR < 4.0Ω; unless otherwise specified. Bold Values indicate −40°C ≤ TJ ≤ 125°C. (1), (2) Minimum and Maximum limits are specified through test, design, or statistical correlation. Symbol VOL tDELAY Parameter Conditions CDELAY pin low voltage VOUT < 4.0V, ISINK = IDELAY VIN = 14V, CDELAY = 0.001 uF VOUT rising from 0V, Δt from VOUT > VOR to RESET pin HIGH Reset Delay Time Min Typ Max Units – 0.100 – V 7.1 11.9 20.0 ms SHUTDOWN CONTROL LOGIC — LM9076QBMA-5.0 Only VIL(SD) SHUTDOWN Pin Low Threshold Voltage VSHUTDOWN pin falling from 5.0V until VOUT >4.5V (VOUT = On) 1 1.5 – V VIH(SD) SHUTDOWN Pin High Threshold Voltage VSHUTDOWN pin rising from 0V until VOUT < 0.5V (VOUT = Off) – 1.5 2 V VSHUTDOWN = 40V – 35 – μA IIH(SD) SHUTDOWN Pin High Bias Current VSHUTDOWN = 5V – 15 35 μA VSHUTDOWN = 2V – 6 10 μA VSHUTDOWN = 0V – 0 – μA IIL(SD) 6 SHUTDOWN Pin Low Bias Current Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q LM9076Q www.ti.com SNVS713B – APRIL 2011 – REVISED MARCH 2013 Typical Performance Characteristics Output Capacitor ESR Output Capacitor ESR Figure 5. Figure 6. Output Voltage vs Low Input Voltage Output Voltage vs Low Input Voltage Figure 7. Figure 8. Ground Pin Current vs Low Input Voltage Ground Pin Current vs Low Input Voltage Figure 9. Figure 10. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q 7 LM9076Q SNVS713B – APRIL 2011 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) 8 Ground Pin Current vs Load Current Ground Pin Current vs Load Current Figure 11. Figure 12. Output Voltage vs Input Voltage Output Voltage vs Input Voltage Figure 13. Figure 14. Output Voltage vs Junction Temperature Output Voltage vs Junction Temperature Figure 15. Figure 16. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q LM9076Q www.ti.com SNVS713B – APRIL 2011 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Dropout Voltage vs Load Current Load Transient Response Figure 17. Figure 18. Load Transient Response Line Transient Response Figure 19. Figure 20. Line Transient Response Delayed Reset Time vs Vin Normalized to VIN = 14V Figure 21. Figure 22. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q 9 LM9076Q SNVS713B – APRIL 2011 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Ripple Rejection Figure 23. 10 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q LM9076Q www.ti.com SNVS713B – APRIL 2011 – REVISED MARCH 2013 APPLICATION INFORMATION REGULATOR BASICS The LM9076Q regulator is suitable for Automotive and Industrial applications where continuous connection to a battery supply is required (refer to the Typical Application circuit). The pass element of the regulator is a PNP device which requires an output bypass capacitor for stability. The minimum bypass capacitance for the output is 10 μF (refer to ESR limitations). A 22 μF, or larger, output bypass capacitor is recommended for typical applications INPUT CAPACITOR The LM9076Q requires a low source impedance to maintain regulator stability because critical portions of the internal bias circuitry are connected to directly to VIN. In general, a 10 μF electrolytic capacitor, located within two inches of the LM9076Q, is adequate for a majority of applications. Additionally, and at a minimum, a 0.1 μF ceramic capacitor should be located between the LM9076Q VIN and Ground pin, and as close as is physically possible to the LM9076Q itself . OUTPUT CAPACITOR An output bypass capacitor is required for stability. This capacitance must be placed between the LM9076Q VOUT pin and Ground pin, as close as is physically possible, using traces that are not part of the load current path. The output capacitor must meet the requirements for minimum capacitance and also maintain the appropriate ESR value across the entire operating ambient temperature range. There is no limit to the maximum output capacitance as long as ESR is maintained. The minimum bypass capacitance for the output is 10 μF (refer to ESR limitations). A 22 μF, or larger, output bypass capacitor is recommended for typical applications. Solid tantalums capacitors are recommended as they generally maintain capacitance and ESR ratings over a wide temperature range. Ceramic capacitor types XR7 and XR5 may be used if a series resistor is added to simulate the minimum ESR requirement. See Figure 24. Aluminum electrolytic capacitors are not recommended as they are subject to wide changes in capacitance and ESR across temperature. Figure 24. Using Low ESR Capacitors DELAY CAPACITOR The capacitor on the Delay pin must be a low leakage type since the charge current is minimal (420 nA typical) and the pin must fully charge to VOUT. Ceramic, Mylar, and polystyrene capacitor types are generally recommended, although changes in capacitance values across temperature changes will have some effect on the delay timing. Any leakage of the IDELAY current, be it through the delay capacitor or any other path, will extend the delay time, possibly to the point that the Reset pin output does not go high. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q 11 LM9076Q SNVS713B – APRIL 2011 – REVISED MARCH 2013 www.ti.com SHUTDOWN PIN - LM9076QBMA ONLY The basic On/Off control of the regulator is accomplished with the SHUTDOWN pin. By pulling the SHUTDOWN pin high the regulator output is switched Off. When the regulator is switched Off the load on the battery will be primarily due to the SHUTDOWN pin current. When the SHUTDOWN pin is low, or left open, the regulator is switched On. When an unregulated supply, such as V BATTERY , is used to pull the SHUTDOWN pin high a series resistor in the range of 10KΩ to 50KΩ is recommended to provide reverse voltage transient protection of the SHUTDOWN pin. Adding a small capacitor (0.001uF typical) from the SHUTDOWN pin to Ground will add noise immunity to prevent accidental turn on due to noise on the supply line. RESET FLAG The RESET pin is an open collector output which requires an external pull-up resistor to develop the reset signal. The external pull-up resistor should be in the range of 10 kΩ to 200 kΩ. At VIN values of less than typically 2V the RESET pin voltage will be high. For VIN values between typically 2V and approximately VOUT + VBE the RESET pin voltage will be low. For VIN values greater than approximately VOUT + VBE the RESET pin voltage will be dependent on the status of the VOUT pin voltage and the Delayed Reset circuitry. The value of VBE is typically 600 mV at 25°C and will decrease approximately 2 mV for every 1°C increase in the junction temperature. During normal operation the RESET pin voltage will be high . Any load condition that causes the VOUT pin voltage to drop below typically 89% of normal will activate the Delayed Reset circuit and the RESET pin will go low for the duration of the delay time. Any line condition that causes VIN pin voltage to drop below typically VOUT + VBE will cause the RESET pin to go low without activating the Delayed Reset circuitry. Excessive thermal dissipation will raise the junction temperature and could activate the Thermal Shutdown circuitry which, in turn, will cause the RESET pin to go low. For the LM9076QBMA devices, pulling the SHUTDOWN pin high will turn off the output which, in turn, will cause the RESET pin to go low once the VOUT voltage has decayed to a value that is less than typically 89% of normal. See Figure 25. RESET DELAY TIME When the regulator output is switched On, or after recovery from brief VOUT fault condition, the RESET flag can be can be programmed to remain low for an additional delay time. This will give time for any system reference voltages, clock signals, etc., to stabilize before the micro-controller resumes normal operation. This delay time is controlled by the capacitor value on the CDELAY pin. During normal operation the CDELAY capacitor is charged to near VOUT . When a VOUT fault causes the RESET pin to go low, the CDELAY capacitor is quickly discharged to ground. When the VOUT fault is removed, and VOUT returns to the normal operating value, the CDELAY capacitor begins charging at a typical constant 0.420 uA rate. When the voltage on the CDELAY capacitor reaches the same potential as the VOUT pin the RESET pin will be allowed to return high. The typical RESET delay time can be calculated with the following formula: tDELAY = VOUT X (CDELAY / IDELAY ) (1) For the LM9076Q–3.3 with a CDELAY value of 0.001 uF and a IDELAY value of 0.420 uA the typical RESET delay time is: tDELAY =3.3V × (0.001 uF / 0.420 uA) = 7.8 ms (2) For the LM9076Q–5.0 with a CDELAY value of 0.001 uF and a IDELAY value of 0.420 uA the typical RESET delay time is: tDELAY = 5.0V X (0.001uF / 0.420uA) = 11.9 ms (3) THERMAL PROTECTION Device operational range is limited by the maximum junction temperature (TJ). The junction temperature is influenced by the ambient temperature (TA), package selection, input voltage (VIN), and the output load current. When operating with maximum load currents the input voltage and/or ambient temperature will be limited. When operating with maximum input voltage the load current and/or the ambient temperature will be limited. 12 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q LM9076Q www.ti.com SNVS713B – APRIL 2011 – REVISED MARCH 2013 Even though the LM9076Q is equipped with circuitry to protect itself from excessive thermal dissipation, it is not recommended that the LM9076Q be operated at, or near, the maximum recommended die junction temperature (TJ) as this may impair long term device reliability. The thermal protection circuity monitors the temperature at the die level. When the die temperature exceeds typically 160°C the voltage regulator output will be switched off. Figure 25. Typical Reset Pin Operational Waveforms Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q 13 LM9076Q SNVS713B – APRIL 2011 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision A (March 2013) to Revision B • 14 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 13 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM9076Q PACKAGE OPTION ADDENDUM www.ti.com 13-Sep-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM9076QBMA-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 9076B QMA3.3 LM9076QBMA-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 9076B QMA5.0 LM9076QBMAX-3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 9076B QMA3.3 LM9076QBMAX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 9076B QMA5.0 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 13-Sep-2014 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM9076QBMAX-3.3/NOP B SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM9076QBMAX-5.0/NOP B SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM9076QBMAX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM9076QBMAX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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