FPF1103 / FPF1104 Advance Load Management Switch Features Description The FPF1103/04 are low RDS P-channel MOSFET load switches of the IntelliMAX™ family. Integrated slew-rate control prevents inrush current from glitch supply rails with capacitive loads common in power applications. 1.2V to 4V Input Voltage Operating Range Typical RDS(ON): - 35mΩ at VIN=3.3V - 55mΩ at VIN=1.8V - 85mΩ at VIN=1.2V The input voltage range operates from 1.2V to 4V to fulfill today's lowest ultra-portable device supply requirements. Switch control is by a logic input (ON-pin) capable of interfacing directly with low-voltage CMOS control signals and GPIOs in embedded processors. Slew Rate Control with tR: 65µs Output Discharge Function on FPF1104 Low <1µA Quiescent Current at VON=VIN ESD Protected: Above 4000V HBM, 2000V CDM GPIO/CMOS-Compatible Enable Circuitry Applications Mobile Devices and Smart Phones Portable Media Devices Digital Cameras Advanced Notebook, UMPC, MID Portable Medical Devices GPS and Navigation Equipment Ordering Information Part Number Switch Input Output ON Pin Part (Typical) Buffer Discharge Activity Marking At 1.8VIN tR Eco Status Package 4-Ball, Wafer-Level ChipScale Package (WLCSP), 1.0 x 1.0mm, 0.5mm Pitch FPF1103 Q9 55mΩ CMOS NA Active HIGH 65µs Green FPF1104 QA 55mΩ CMOS 65Ω Active HIGH 65µs Green For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html. © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 www.fairchildsemi.com FPF1103 / FPF1104 — Advance Load Management Switch November 2009 VIN CIN VOUT FPF1103/FPF1104 OFF ON ON To Load COUT GND Figure 1. Typical Application Notes: 1. CIN=1μF, X5R, 0603, for example Murata GRM185R60J105KE26 2. COUT=1μF, X5R, 0805, for example Murata GRM216R61A105KA01 Block Diagram FPF1103/4 Figure 2. Block Diagram (Output Discharge for FPF1104 Only) © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 www.fairchildsemi.com 2 FPF1103 / FPF1104 — Advance Load Management Switch Application Diagram Figure 3. 1 x 1mm WLCSP Bumps Facing Down VOUT A1 A2 VIN GND B1 B2 ON Figure 4. 1 x 1mm WLCSP Bumps Facing Up Figure 5. Pin Assignments (Top View) VIN A2 A1 VOUT ON B2 B1 GND Figure 6. Pin Assignments (Bottom View) Pin Definitions Pin # Name Description A1 VOUT Switch Output A2 VIN B1 GND B2 ON Supply Input: Input to the Power Switch Ground ON/OFF Control, Active High © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 www.fairchildsemi.com 3 FPF1103 / FPF1104 — Advance Load Management Switch Pin Configurations Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit -0.3 4.2 V VIN VIN, VOUT, VON to GND ISW Maximum Continuous Switch Current 1.2 A PD Power Dissipation at TA=25°C 1.0 W TSTG Storage Junction Temperature -65 +150 °C TA Operating Temperature Range -40 +85 °C ΘJA ESD Thermal Resistance, Junction-to-Ambient Electrostatic Discharge Capability 1S2P with 1 Thermal Via 95 1S2P without Thermal Via 187 Human Body Model, JESD22-A114 4 Charged Device Model, JESD22-C101 2 °C/W kV Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VIN Supply Voltage 1.2 4.0 V TA Ambient Operating Temperature -40 +85 °C © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 www.fairchildsemi.com 4 FPF1103 / FPF1104 — Advance Load Management Switch Absolute Maximum Ratings Unless otherwise noted, VIN=1.2 to 4.0V, TA=-40 to +85°C; typical values are at VIN=3.3V and TA=25°C. Symbol Parameter Conditions Min. Typ. Max. Units 4.0 V Basic Operation VIN Supply Voltage 1.2 IQ(OFF) Off Supply Current VON=GND, VOUT=Open, VIN=4V 1 μA ISD(OFF) Off Switch Current VON=GND, VOUT=GND 1 μA IOUT=0mA, VON=VIN 1 IOUT=0mA, VON < VIN 3 IQ Quiescent Current RON On-Resistance VIN=3.3V, IOUT=200mA, TA=25°C 35 50 VIN=1.8V, IOUT=200mA, TA=25°C 55 70 VIN=1.5V, IOUT=200mA, TA=25°C 70 VIN=1.2V, IOUT=200mA, TA=25°C mΩ 85 150 VIN=1.8V, IOUT=200mA, TA=85°C 65 100 65 110 (3) RPD Output Discharge RPULL DOWN VIN=3.3V, VON=0V, IFORCE=20mA, TA=25°C, FPF1104 VIH ON Input Logic High Voltage VIN=1.2V to 4.0V VIL ON Input Logic Low Voltage VIN=1.2V to 4.0V ION ON Input Leakage VON=VIN or GND μA 1.1 Ω V -1 0.35 V 1 μA Dynamic Characteristics (4) tDON Turn-On Delay tR VOUT Rise Time tON Turn-On Time (4) (4,6) VIN=3.3V, RL=10Ω, CL=0.1µF, TA=25°C (4) tDON Turn-On Delay tR VOUT Rise Time tON Turn-On Time (4) (4,6) VIN=3.3V, RL=500Ω, CL=0.1µF, TA=25°C 35 μs 65 μs 100 μs 30 50 μs 40 55 μs 70 105 μs 2.0 2.5 μs FPF1103 (4) tDOFF Turn-Off Delay tF VOUT Fall Time (4) (4,7) tOFF Turn-Off tDOFF Turn-Off Delay tF VOUT Fall Time (4) tOFF FPF1104 tDOFF tF tOFF Turn-Off (4) (4,7) VIN=3.3V, RL=500Ω, CL=0.1µF, TA=25°C 2.2 μs 4.2 μs 7.0 μs 110 μs 117 μs (5) (4) Turn-Off Delay VOUT Fall Time Turn-Off (4) (4,7) VIN=3.3V, RL=10Ω, CL=0.1µF, RPD=65Ω, TA=25°C (4) tDOFF Turn-Off Delay tF VOUT Fall Time tOFF VIN=3.3V, RL=10Ω, CL=0.1µF, TA=25°C Turn-Off (4) (4,7) VIN=3.3V, RL=500Ω, CL=0.1µF, RPD=65Ω, TA=25°C 2.0 2.5 μs 1.9 μs 3.9 μs 2.5 μs 10.6 μs 13.1 μs Notes: 3. This parameter is guaranteed by design and characterization; not production tested. 4. tDON/tDOFF/tR/tF are defined in Figure 7. 5. Output discharge path is enabled during off. © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 www.fairchildsemi.com 5 FPF1103 / FPF1104 — Advance Load Management Switch Electrical Characteristics FPF1103 / FPF1104 — Advance Load Management Switch Timing Diagram 90% VOUT 90% 10% 10% tR tF 3.3V 50% 50% VON 90% 10% VOUT tDON tDOFF Notes: 6. tON=tR + tDON. 7. tOFF=tF + tDOFF. Figure 7. Timing Diagram © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 www.fairchildsemi.com 6 0.25 VON = VOUT = 0V SHUTDOWN CURRENT ( μA) V IN SH UTDOW N C UR REN T ( μA ) 0.30 0.25 0.20 VIN = 4.0V 0.15 VIN = 3.3V 0.10 VIN = 1.2V 0.05 IN VON=V 0.15 0.10 85°C 0.05 V 25°C -40°C 0.00 -40 -15 10 35 60 0.00 1.0 85 1.5 2.0 TJ, JUNCTION TEMPERATURE (°C) 3.0 3.5 4.0 Figure 9. Shutdown Current vs. Supply Voltage 0.07 0.10 O FF SUPPLY CU RRENT ( μA) VON = 0V 0.09 O F F SU P PL Y CU R R EN T ( μA ) 2.5 SUPPLY VOLTAGE (V) Figure 8. Shutdown Current vs. Temperature 0.08 0.07 0.06 0.05 VIN = 4.0V 0.04 VIN = 3.3V 0.03 VIN = 1.2V 0.02 0.01 0.00 -40 -15 10 35 60 VON = 0V 0.06 0.05 0.04 0.03 85°C 0.02 -40°C 0.01 25°C 0.00 85 1.0 TJ, JUNCTION TEMPERATURE (°C) 1.5 2.0 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) Figure 10. Off Supply Current vs. Temperature (FPF1103, VOUT is floating) Figure 11. Off Supply Current vs. Supply Voltage (FPF1103, VOUT is Floating) 0.40 0.050 VON = VIN 0.045 0.35 0.040 SU PPLY CUR REN T ( μA) SUPPLY CU RRENT ( μA) OUT=0V 0.20 FPF1103 / FPF1104 — Advance Load Management Switch Typical Performance Characteristics 0.035 0.030 0.025 VIN = 4.0V 0.020 0.015 VIN = 3.3V VIN = 1.2V 0.010 0.30 0.25 0.15 0.10 25°C 0.05 0.000 0.00 -15 10 35 60 85 85°C 1.0 TJ, JUNCTION TEMPERATURE (°C) 1.5 2.0 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) Figure 12. Quiescent Current vs. Temperature (VON=VIN) © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 -40°C 0.20 0.005 -40 VON = VIN Figure 13. Quiescent Current vs. Supply Voltage www.fairchildsemi.com 7 3.00 2.50 VON = 0.75 x VIN 2.00 VIN = 4.0V 2.00 S U P P LY C U R R E N T (µA) SUPPLY CU RRENT ( μA) 2.50 1.50 VIN = 3.3V 1.00 0.50 +25°C 1.50 +85°C 1.00 -40°C 0.50 VIN = 1.2V 0.00 0.00 -40 -15 10 35 60 1.0 85 1.5 2.0 TJ, JUNCTION TEMPERATURE (°C) Figure 14. Quiescent Current vs. Temperature (VON=0.75 x VIN) 4.0 VON = V IN IO U T = 200mA ) 250 ON R E SISTA N CE (m O N R E S IS T A N C E (m Ω ) 300 VON = VIN IOUT = 200mA VIN = 1.2V 3.5 Figure 15. Quiescent Current vs. Supply Voltage at VON=1.2V 120 100 2.5 3.0 S U P P LY V O LTA G E (V ) 80 60 VIN = 3.3V 40 VIN = 4.0V 20 200 150 FPF1103 / FPF1104 — Advance Load Management Switch Typical Performance Characteristics 100 25°C 85°C 50 0 -40°C 0 -40 -15 10 35 60 85 1.0 TJ, JUNCTION TEMPERATURE (°C) 1.5 2.0 2.5 3.0 3.5 4.0 SUP PLY VOLTAGE (V) Figure 16. RON vs. Temperature Figure 17. RON vs. Supply Voltage V O N INPUT LO GIC VOL TAG E (V) 1.00 0.90 0.80 V IH 0.70 0.60 0.50 V IL 0.40 0.30 0.20 1.0 1.5 2.0 2.5 3.0 3.5 4.0 SUP PLY VO LTAG E (V) Figure 18. ON-Pin Threshold vs. VIN © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 www.fairchildsemi.com 8 10 100 O N /O FF D ELAY TIM E (µs) R IS E /FA LL TIM E (µ s) VIN = 3.3 CL= 0.1 µ RL= 10 1 tF 1 - -15 1 3 6 t DOFF -40 10 35 60 85 Figure 20. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=10Ω 60 60 50 50 O N /O F F D ELAY T IM E (µs) tR 40 30 VIN =3.3 C L =0.1 µF R =50 0 -15 TJ JU N C T IO N T E M P E R A T U R E (°C ) Figure 19. VOUT Rise and Fall Time vs. Temperature at RL=10Ω R IS E /FA LL TIM E (µs) 10 1 8 TJ JU N C TIO N TE M P E R A TU R E (°C ) 20 VIN= 3.3 CL= 0.1 µF RL= 10 t DON tR tF 10 0 VIN= 3.3 C L= 0.1 µF R L= 50 0 40 t DON 30 FPF1103 / FPF1104 — Advance Load Management Switch Typical Performance Characteristics 20 10 t DOFF 0 -40 -15 10 35 60 85 -40 TJ JU N C TIO N T E M P E R A T U R E (°C ) -50 10 35 60 85 TJ JU N C TIO N TE M P E R A TU R E (°C ) Figure 21. VOUT Rise and Fall Time vs. Temperature at RL=500Ω Figure 22. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=500Ω 90 R ISE /D E L AY T IM E ( μ s ) 80 70 60 tR 50 40 t DON 30 20 10 0 10 R LOA D 10 0 O U T P U T L O AD ( Ω ) 100 0 Figure 23. tR/tDON vs. Output Load at VIN=3.3V © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 www.fairchildsemi.com 9 Figure 24. Turn-On Response (VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=10Ω) Figure 25. Turn-Off Response (VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=10Ω) Figure 26. Turn-On Response (VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=500Ω) Figure 27. Turn-Off Response (VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=500Ω) © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 FPF1103 / FPF1104 — Advance Load Management Switch Typical Performance Characteristics www.fairchildsemi.com 10 Input Capacitor Fall Time TM An IntelliMAX switch doesn’t require an input capacitor. To reduce device inrush current effect, a 0.1µF ceramic capacitor, CIN, is recommended close to the VIN pin. A higher value of CIN can be used to further reduce the voltage drop experienced as the switch is turned on into a large capacitive load. Device output fall time can be calculated based on RC constant of the external components as follows: t F = R L × C L × 2 .2 (1) where tF is 90% to 10% fall time, RL is output load, and CL is output capacitor. Output Capacitor The same equation works for a device with a pull-down output resistor. RL is replaced by a parallel connected pull-down and an external output resistor combination, as follows: TM An IntelliMAX switch works without an output capacitor. However, if parasitic board inductance forces VOUT below GND when switching off, a 0.1µF capacitor, COUT, should be placed between VOUT and GND. tF = R L × R PD × C L × 2 .2 R L + R PD (2) where tF is 90% to 10% fall time, RL is output load, RPD=65Ω.is output pull-down resistor, and CL is the output capacitor. Resistive Output Load TM If resistive output load is missing, the IntelliMAX switch without a pull-down output resistor is not discharging the output voltage. Output voltage drop depends, in that case, mainly on external device leaks. © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 FPF1103 / FPF1104 — Advance Load Management Switch Application Information www.fairchildsemi.com 11 as close to the device as possible. Below is a recommended layout for this device to achieve optimum performance. For best thermal performance and minimal inductance and parasitic effects, it is recommended to keep input and output traces short and capacitors FPF1103 / FPF1104 — Advance Load Management Switch Recommended Land Pattern and Layout Figure 28. Recommended Land Pattern and Layout © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 www.fairchildsemi.com 12 FPF1103 / FPF1104 — Advance Load Management Switch Physical Dimensions Figure 29. 4 Ball, 1.0 x 1.0mm Wafer-Level Chip-Scale Packaging (WLCSP) Product-Specific Dimensions Product D E X Y FPF1103 960µm ± 30µm 960µm ± 30µm 0.230mm 0.230mm FPF1104 960um ± 30µm 960um ± 30µm 0.230mm 0.230mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 www.fairchildsemi.com 13 FPF1103 / FPF1104 — Advance Load Management Switch © 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 • Rev. 1.0.1 www.fairchildsemi.com 14