HLMP-Cxxx T-13/4 (5 mm) Extra Bright Precision Optical Performance InGaN LED Lamps Data Sheet HLMP-CB11, HLMP-CB12, HLMP-CM11, HLMP-CM12, HLMP-CE11, HLMP-CE12, HLMP-CB26, HLMP-CB27, HLMP-CM26, HLMP-CM27, HLMP-CE26, HLMP-CE27, HLMP-CB36, HLMP-CB37, HLMP-CM36, HLMP-CM37, HLMP-CE36, HLMP-CE37 Description Features These high intensity blue, green, and cyan LEDs are based on the most efficient and cost effective InGaN material technology. The 470 nm typical dominant wave–length for blue and 525 nm typical wavelength for green is well suited to color mixing in full color signs. The 505 nm typical dominant wavelength for cyan is suitable for traffic signal application. • • • • • • These LED lamps are untinted, non-diffused, T-13/4 packages incorporating second generation optics which produce well-defined spatial radiation patterns at specific viewing cone angles. Applications These lamps are made with an advanced optical grade epoxy, offering superior temperature and moisture resistance in outdoor signal and sign applications. The high maximum LED junction temperature limit of +110° C enables high temperature operation in bright sunlight conditions. • • • • Well defined spatial radiation pattern High luminous output Available in blue, green, and cyan color Viewing angle: 15°, 23° and 30° Standoff or non-standoff leads Superior resistance to moisture Traffic signals Commercial outdoor advertising Front panel backlighting Front panel indicator CAUTION: Devices are Class I ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions Package A 2.35 (0.093) MAX. 1.14 ± 0.20 (0.045 ± 0.008) ∅ 5.80 ± 0.20 (0.228 ± 0.008) 0.70 (0.028) MAX. 4.90 ± 0.20 (0.193 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) CATHODE LEAD 8.61 ± 0.20 (0.339 ± 0.008) CATHODE FLAT 31.60 MIN. (1.244) Package B ∅ 5.80 ± 0.20 (0.228 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 1.50 ± 0.15 (0.059 ± 0.006) 0.70 (0.028) MAX. 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 4.90 ± 0.20 NOTE 1 (0.192 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) CATHODE LEAD 8.61 ± 0.20 (0.339 ± 0.008) 1.00 MIN. (0.039) DIMENSION H 31.60 MIN. (1.244) DIMENSION H: 15° = 10.80 ± 0.25 mm (0.425 ± 0.01 INCH) 23° = 10.00 ± 0.25 mm (0.394 ± 0.01 INCH) 30° = 11.27 ± 0.25 mm (0.444 ± 0.01 INCH) NOTES: 1. MEASURED JUST ABOVE FLANGE. 2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 3. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. 4. IF HEAT SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE. 2 CATHODE FLAT Device Selection Guide Part Number Color Typical Viewing Angle, 2q1/2 (Degree) HLMP-CB11-TW0xx Blue 15 2.5 7.2 No A Clear HLMP-CB11-UVAxx Blue 15 3.2 5.5 No A Clear HLMP-CB12-TW0xx Blue 15 2.5 7.2 Yes B Clear HLMP-CM11-Y20xx Green 15 9.3 27.0 No A Clear HLMP-CM11-Z1Cxx Green 15 12.0 21.0 No A Clear HLMP-CM12-Y20xx Green 15 9.3 27.0 Yes B Clear HLMP-CE11-X10xx Cyan 15 7.2 21.0 No A Clear HLMP-CE12-X10xx Cyan 15 7.2 21.0 Yes B Clear HLMP-CB26-SV0xx Blue 23 1.9 5.5 No A Clear HLMP-CB26-TUDxx Blue 23 2.5 4.2 No A Clear HLMP-CB27-SV0xx Blue 23 1.9 5.5 Yes B Clear HLMP-CM26-X10xx Green 23 7.2 21.0 No A Clear HLMP-CM26-YZCxx Green 23 9.3 16.0 No A Clear HLMP-CM27-X10xx Green 23 7.2 21.0 Yes B Clear HLMP-CE26-WZ0xx Cyan 23 5.5 16.0 No A Clear HLMP-CE27-WZ0xx Cyan 23 5.5 16.0 Yes B Clear HLMP-CB36-QT0xx Blue 30 1.15 3.2 No A Clear HLMP-CB36-RSAxx Blue 30 1.5 2.5 No A Clear HLMP-CB36-RSBxx Blue 30 1.5 2.5 No A Clear HLMP-CB37-RU0xx Blue 30 1.5 4.2 Yes B Clear HLMP-CB37-RSDxx Blue 30 1.5 2.5 Yes B Clear HLMP-CM36-X10xx Green 30 7.2 21.0 No A Clear HLMP-CM36-XYCxx Green 30 7.2 12.0 No A Clear HLMP-CM37-X10xx Green 30 7.2 21.0 Yes B Clear HLMP-CM37-XYCxx Green 30 7.2 12.0 Yes B Clear HLMP-CM37-XYDxx Green 30 7.2 12.0 Yes B Clear HLMP-CE36-WZ0xx Cyan 30 5.5 16.0 No A Clear HLMP-CE37-WZ0xx Cyan 30 5.5 16.0 Yes B Clear Intensity (cd) at 20 mA Min. Max. Standoff Package Dimension Lens Notes: 1. Tolerance for luminous intensity measurement is ±15%. 2. The luminous intensity is measured on the mechanical axis of the lamp package. 3. The optical axis is closely aligned with the package mechanical axis. 4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper safety equipment. 5. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity. 3 Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk DD: Ammo Pack Color Bin Options 0: Full Color Bin Distribution A: Color Bin 1 and 2 B: Color Bin 2 and 3 C: Color Bin 3 and 4 D: Color Bin 4 and 5 Maximum Intensity Bin 0: No Maximum Intensity Bin Limitation Others: Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Intensity Bin 11: 15° Without Standoff 12: 15° With Standoff 26: 23° Without Standoff 27: 23° With Standoff 36: 30° Without standoff 37: 30° With Standoff Color B: Blue 470 nm M: Green 525 nm E: Cyan 505 nm Package C: T-13/4 (5 mm) Round Lamp 4 Absolute Maximum Rating at TA = 25°C Parameters Value Unit DC Forward Current [1] 30 mA Peak Pulsed Forward Current[2] 100 mA Power Dissipation 116 mW LED Junction Temperature 130 °C Operating Temperature Range –40 to +85 °C Storage Temperature Range –40 to +100 °C Notes: 1. Derate linearly as shown in Figure 2. 2. Duty factor 10%, frequency 1 KHz. Electrical/Optical Characteristics TA = 25oC Blue Parameters Symbol Min. Typ. Max. Forward Voltage VF Reverse Voltage[1] VR Thermal Resistance RqJ-PIN Dominant Wavelength[2] ld Peak Wavelength lPEAK 464 Spectral Half Width Dl1/2 Luminous Efficacy[3] hv Green Min. Typ. Max. Units Test Condition V IF = 20 mA V IR = 10 µA oC/W LED Junction to Anode Lead 490 505 508 nm IF = 20 mA 516 501 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA 23 32 30 nm Wavelength Width at Spectral Distribution Power Point at IF = 20 mA 74 484 319 lm/W Emitted Luminous Power/Emitted Radiant Power 3.2 3.85 5.0 470 480 Min. Typ. Max. 3.3 3.85 5.0 240 460 Cyan 240 520 3.2 3.85 5.0 525 540 240 Notes: 1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA. 2. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp. 3. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 5 CYAN RELATIVE INTENSITY 0.8 GREEN BLUE 0.6 0.4 0.2 0 380 430 480 530 580 630 680 IF MAX. – MAXIMUM FORWARD CURRENT – mA 1.0 35 30 25 RθJ-A = 780 °C/W 20 15 10 5 0 0 10 1.035 30 1.030 RELATIVE DOMINANT WAVELENGTH FORWARD CURRENT – mA 35 25 20 15 10 5 1.0 FORWARD VOLTAGE – V RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 5 10 15 20 25 30 DC FORWARD CURRENT – mA Figure 5. Relative intensity vs. DC forward current. 6 60 70 80 90 CYAN 1.020 GREEN 1.015 1.010 1.005 BLUE 1.000 0.995 0 5 10 15 20 25 30 DC FORWARD CURRENT – mA Figure 3. Forward current vs. forward voltage. 0 50 1.025 0.990 4.0 3.0 2.0 40 Figure 2. Forward current vs. ambient temperature. Figure 1. Relative intensity vs. wavelength. 0 30 TA – AMBIENT TEMPERATURE – °C WAVELENGTH – nm 0 20 Figure 4. Relative dominant wavelength vs. DC forward current. NORMALIZED INTENSITY 1 0.5 0 -90 -60 -30 0 30 60 90 60 90 60 90 ANGULAR DISPLACEMENT – DEGREES Figure 6. Spatial radiation pattern for Cx11 and Cx12. NORMALIZED INTENSITY 1 0.5 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT – DEGREES Figure 7. Spatial radiation pattern for Cx26 and Cx27. NORMALIZED INTENSITY 1 0.5 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT – DEGREES Figure 8. Spatial radiation pattern for Cx36 and Cx37. 7 Intensity Bin Limit Table Blue Color Bin Table Intensity (mcd) at 20 mA Bin Min Dom Max Dom Xmin Ymin Xmax Ymax Bin Min Max 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 N 680 880 0.1818 0.0904 0.1374 0.0374 P 880 1150 0.1374 0.0374 0.1699 0.1062 Q 1150 1500 0.1766 0.0966 0.1291 0.0495 R 1500 1900 0.1291 0.0495 0.1616 0.1209 S 1900 2500 0.1699 0.1062 0.1187 0.0671 T 2500 3200 0.1187 0.0671 0.1517 0.1423 U 3200 4200 0.1616 0.1209 0.1063 0.0945 V 4200 5500 0.1063 0.0945 0.1397 0.1728 W 5500 7200 0.1517 0.1423 0.0913 0.1327 X 7200 9300 Y 9300 12000 Z 12000 16000 1 16000 21000 Tolerance for each bin limit is ±15%. 2 3 4 5 464.0 468.0 472.0 476.0 468.0 472.0 476.0 480.0 Tolerance for each bin limit is ±0.5 nm. Green Color Bin Table Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 2 3 4 5 524.0 528.0 532.0 536.0 528.0 532.0 536.0 540.0 Tolerance for each bin limit is ±0.5 nm. Cyan Color Bin Table Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 490.0 495.0 0.0454 0.2945 0.1164 0.3889 0.1318 0.306 0.0235 0.4127 0.0345 0.4127 0.1057 0.4769 0.1164 0.3889 0.0082 0.5384 0.0082 0.5384 0.1027 0.5584 0.1057 0.4769 0.0039 0.6548 2 3 4 7 8 495.0 500.0 505.0 498.0 503.0 500.0 505.0 510.0 503.0 508.0 Tolerance for each bin limit is ±0.5 nm. 8 0.0039 0.6548 0.1097 0.6251 0.1027 0.5584 0.0139 0.7502 0.0132 0.4882 0.1028 0.5273 0.1092 0.4417 0.0040 0.6104 0.0040 0.6104 0.1056 0.6007 0.1028 0.5273 0.0080 0.7153 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE TEMPERATURE – °C 250 BOTTOM SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA 150 FLUXING 100 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME – SECONDS Figure 9. Recommended wave soldering profile. 90 100 Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. TOP SIDE OF PC BOARD 50 30 9 Manual Solder Dipping – – 260 °C Max. 5 sec Max. Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3337EN 5989-4115EN June 26, 2006