NL17SZ126 Non−Inverting 3−State Buffer The NL17SZ126 is a high performance single noninverting buffer operating from a 1.65 V to 5.5 V supply. http://onsemi.com Features • • • • • • • • OE 1 IN A 2 SC−88A (SOT−353) DF SUFFIX CASE 419A M2 M G G M2 MG G SOT−553 XV5 SUFFIX CASE 463B M2 = Specific Device Code D = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. VCC 5 MARKING DIAGRAM M • • • Extremely High Speed: tPD 2.6 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible − Interface Capability With 5.0 V TTL Logic with VCC = 3.0 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements 3−State OE Input is Active HIGH Replacement for NC7SZ126 Chip Complexity = 36 Feet Pb−Free Packages are Available PIN ASSIGNMENT GND 4 3 OUT Y Figure 1. Pinout (Top View) 1 OE 2 IN A 3 GND 4 OUT Y 5 VCC FUNCTION TABLE OE OUT Y IN A Figure 2. Logic Symbol OE Input A Input Y Output H H L L H X L H Z X = Don’t Care ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 5 1 Publication Order Number: NL17SZ126/D NL17SZ126 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage *0.5 to )7.0 V VIN DC Input Voltage *0.5 to )7.0 V DC Output Voltage *0.5 to )7.0 V VOUT IIK DC Input Diode Current *50 mA IOK DC Output Diode Current *50 mA IOUT DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA *65 to )150 °C 260 °C TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias )150 °C qJA Thermal Resistance SC−70/SC−88A 350 °C/W PD Power Dissipation in Still Air at 85°C SC−70/SC−88A 150 mW MSL Moisture Sensitivity FR Flammability Rating VESD Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in u2000 u200 N/A Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) V Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC DC Supply Voltage VIN DC Input Voltage 0 5.5 V DC Output Voltage 0 5.5 V *40 )85 °C 0 0 0 0 20 20 10 5.0 ns/V VCC = 1.8 V $0.15 V VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 80°C Junction Temperature °C NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES TJ = 90°C Input Rise and Fall Time TJ = 100°C tr, tf TJ = 110°C Operating Temperature Range TJ = 120°C TA TJ = 130°C VOUT 1 1 10 100 1000 TIME, YEARS Figure 3. Failure Rate versus Time Junction Temperature http://onsemi.com 2 NL17SZ126 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Min 0.75 VCC 0.7 VCC VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIH VOL Low−Level Output Voltage VIN = VIL IIN Input Leakage Current IOZ 3−State Output Leakage IOFF Power Off Leakage Current ICC Quiescent Supply Current *405C v TA v 855C TA = 255C VCC (V) Typ Max Min Max 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC Unit Condition V 0.25 VCC 0.3 VCC V 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 V IOH = −100 mA 1.65 2.3 3.0 3.0 4.5 1.29 1.9 2.4 2.3 3.8 1.52 2.15 2.80 2.68 4.20 1.29 1.9 2.4 2.3 3.8 V IOH = −4 mA IOH = −8 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 1.8 2.3 3.0 4.5 0.0 0.0 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V IOL = 100 mA 1.65 2.3 3.0 3.0 4.5 0.08 0.10 0.15 0.22 0.22 0.24 0.30 0.40 0.55 0.55 0.24 0.30 0.40 0.55 0.55 V IOL = 4 mA IOL = 8 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 0 to 5.5 $1.0 $1.0 mA 0 V v VIN v 5.5 V 1.65 to 5.5 $0.5 $5.0 mA VIN = VIH or VIL 0 V v VOUT v 5.5 V 0.0 1.0 10 mA VIN or VOUT = 5.5 V 1.65 to 5.5 1.0 10 mA VIN = 5.5 V, GND AC ELECTRICAL CHARACTERISTICS (tR = tF = 3.0 ns) Symbol tPLH tPHL tPZH tPZL tPHZ tPLZ Parameter Propagation Delay AN to YN (Figures 4, and 5, Table 1) Output Enable Time (Figures 6, 7 and 8, Table 1) Output Disable Time (Figures 6, 7 and 8, Table 1) Condition *405C v TA v 855C TA = 255C VCC (V) Min Typ Max Min Max Unit ns RL = 1 MW CL = 15 pF 1.8 $ 0.15 2.0 9.5 12 2.0 12.5 RL = 1 MW CL = 15 pF 2.5 $ 0.2 1.0 3.4 7.5 1.0 8.0 RL = 1 MW RL = 500 W CL = 15 pF CL = 50 pF 3.3 $ 0.3 0.8 1.2 5.2 5.7 0.8 1.2 5.5 6.0 RL = 1 MW RL = 500 W CL = 15 pF CL = 50 pF 5.0 $ 0.5 0.5 0.8 4.5 5.0 0.5 0.8 4.8 5.3 RL = 250 W CL = 50 pF 1.8 $ 0.15 2.0 10.5 2.0 12.5 2.5 $ 0.2 1.8 8.5 1.8 9.0 3.3 $ 0.3 1.2 6.2 1.2 6.5 5.0 $ 0.5 0.8 5.5 0.8 5.8 2.5 $ 0.2 1.5 8.0 1.5 8.5 2.5 $ 0.2 1.5 8.0 1.5 8.5 3.3 $ 0.3 0.8 5.7 0.8 6.0 5.0 $ 0.5 0.3 4.7 0.3 5.0 RL and R1= 500 W CL = 50 pF http://onsemi.com 3 9.0 ns ns NL17SZ126 CAPACITIVE CHARACTERISTICS Symbol Condition Typical Unit Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 5) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9 11 pF CIN Parameter 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. tf = 3 ns tf = 3 ns 90% OE = VCC VCC 90% INPUT INPUT A and B Vmi OUTPUT Vmi 10% 10% tPHL CL * GND RL tPLH VOH OUTPUT Y Vmo *Includes all probe and jig capacitance. A 1−MHz square input wave is recommended for propagation delay tests. Vmo VOL Figure 4. Switching Waveform 2 INPUT Figure 5. TPLH or TPHL VCC INPUT R1 = 500 W VCC OUTPUT CL = 50 pF OUTPUT RL = 500 W CL = 50 pF RL = 250 W A 1−MHz square input wave is recommended for propagation delay tests. A 1−MHz square input wave is recommended for propagation delay tests. Figure 6. TPZL or TPLZ Figure 7. TPZH or TPHZ 2.7 V Vmi Vmi OE 0V tPHZ tPZH VOH − 0.3 V Vmo On VCC ≈0V tPZL On tPLZ Vmo ≈ 3.0 V VOL + 0.3 V GND Figure 8. AC Output Enable and Disable Waveform http://onsemi.com 4 NL17SZ126 Table 1. Output Enable and Disable Times tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VCC Symbol 3.3 V $ 0.3 V 2.7 V 2.5 V $ 0.2 V Vmi 1.5 V 1.5 V VCC/2 Vmo 1.5 V 1.5 V VCC/2 DEVICE ORDERING INFORMATION Package Type Shipping† NL17SZ126DFT2 SC70−5/SC−88A/SOT−353 3000 / Tape & Reel NL17SZ126DFT2G SC70−5/SC−88A/SOT−353 (Pb−Free) 3000 / Tape & Reel NL17SZ126XV5T2G SOT−553 (Pb−Free) 4000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NL17SZ126 PACKAGE DIMENSIONS SC−88A, SOT−353, SC−70 CASE 419A−02 ISSUE J A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ126 PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B−01 ISSUE B D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 1 2 E −Y− 3 b e HE c 5 PL 0.08 (0.003) M MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 DIM A b c D E e L HE X Y MIN 0.50 0.17 0.08 1.50 1.10 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.059 0.063 MIN 0.020 0.007 0.003 0.059 0.043 MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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