Rohm BA2902YFV-ME2 Automotive ground sense operational amplifier Datasheet

Operational Amplifier Series
Automotive Ground Sense
Operational Amplifiers
BA2904Yxxx-M, BA2902Yxx-M
●Key Specifications
 Wide operating supply voltage
single supply :
dual supply :
●General Description
Automotive series BA2904Yxxx-M/BA2902Yxx-M
integrate two or four independent Op-Amps and
ground sense input Amplifier on a single chip and
have some features of high-gain, low power
consumption, and operating voltage range of 3V to
32V (single power supply ). BA2904Yxxx-M,
BA2902Yxx-M are manufactured for automotive
requirements of car navigation system, car audio, and
so on.
 low supply current
BA2904Yxxx-M BA2902Yxx-M
 input bias current :
 input offset current :
 Operating temperature range :
●Features
 Operable with a single power supply
 Wide operating supply voltage
 Standard Op-Amp Pin-assignments
 Input and output are operable GND sense
 Low supply current
 High open loop voltage gain
 Internal ESD protection circuit
 Wide temperature range
●Packages
SOP8
SOP14
SSOP-B8
SSOP-B14
MSOP8
+3.0V to +32V
±1.5V to ±16V
0.7mA(Typ.)
20nA(Typ.)
2nA(Typ.)
-40℃ to +125℃
W(Typ.) x D(Typ.) x H(Max.)
5.00mm x 6.20mm x 1.71mm
8.70mm x 6.20mm x 1.71mm
3.00mm x 6.40mm x 1.35mm
5.00mm x 6.40mm x 1.35mm
2.90mm x 4.00mm x 0.90mm
●Selection Guide
Maximum operating temperature
Output current
Source/Sink
Automotive(-Ｍ)
supply current
+125°C
Dual
30mA / 20mA
0.7mA
BA2904YF-M
BA2904YFV-M
BA2904YFVM-M
Quad
30mA / 20mA
0.7mA
BA2902YF-M
BA2902YFV-M
○Product structure：Silicon monolithic integrated circuit
○This product is not designed protection against radioactive rays.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Block Diagram
VCC
－IN
VOUT
＋IN
VEE
Fig.1 Simplified schematic (one channel only)
●Pin Configuration
OUT1 1
OUT1 1
-IN1
+IN1
VEE
8 VCC
2
7 OUT2
CH1
- +
3
-IN1 2
CH2
+ -
4
6 -IN2
CH4
+ -
13 -IN4
12 +IN4
VCC 4
11 VEE
5
-IN2 6
10 +IN3
+ CH3
- +
CH2
OUT2 7
9 -IN3
8 OUT3
SSOP-B14
SOP14
SSOP-B8
SOP8
CH1
- +
+IN1 3
+IN2
5 +IN2
14 OUT4
MSOP8
Package
SOP8
SSOP-B8
MSOP8
SOP14
SSOP-B14
BA2904YF-M
BA2904YFV-M
BA2904YFVM-M
BA2902YF-M
BA2902YFV-M
●Ordering Information
B
A
2
9
0
x
Y
x
x
x
-
Packaging and forming specification
E2: Embossed tape and reel
Package
F
: SOP8
SOP14
FV : SSOP-B8
SSOP-B14
FVM : MSOP8
Parts Number.
BA2904Yxxx
BA2902Yxx
Mxx
(SOP8/SOP14/SSOP-B8/SSOP-B14)
TR: Embossed tape and reel
(MSOP8)
M: Automotive
●Line-up
Topr
Supply voltage
2channel
/4channel
Dual
-40°C to +125°C
+3 to +32V
Quad
SOP8
Reel of 2500
BA2904YF-ME2
SSOP-B8
Reel of 2500
BA2904YFV-ME2
MSOP8
Reel of 3000
BA2904YFVM-MTR
SOP14
Reel of 2500
BA2902YF-ME2
SSOP-B14
Reel of 2500
BA2902YFV-ME2
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Number
Package
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Supply Voltage
Power Dissipation
VCC-VEE
SOP8
Unit
+36
V
*1*6
780
SSOP-B8
690*2*6
MSOP8
590*3*6
SOP14
*4*6
Pd
SSOP-B14
Differential Input Voltage *7
Ratings
mW
610
870*5*6
Vid
+36
V
Input Common-mode Voltage Range
Vicm
V
Operating Supply Voltage
Vopr
Operating Temperature Range
Topr
(VEE-0.3) to (VEE+36)
+3.0 to +32
(±1.5 to ±16)
-40 to +125
℃
Storage Temperature Range
Tstg
-55 to +150
℃
Tjmax
+150
℃
Maximum Junction Temperature
V
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature
environment may cause deterioration of characteristics.
*1
To use at temperature above Ta＝25℃ reduce 6.2mW/℃.
*2
To use at temperature above Ta＝25℃ reduce 5.5mW/℃.
*3
To use at temperature above Ta＝25℃ reduce 4.8mW/℃.
*4
To use at temperature above Ta＝25℃ reduce 7.0mW/℃.
*5
To use at temperature above Ta＝25℃ reduce 4.9mW/℃.
*6
Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
*7
The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Electrical Characteristics
○BA2904Yxxx-M (Unless otherwise specified VCC=+5V, VEE=0V)
Limits
Temperature
Parameter
Symbol
Range
Min.
Typ.
25℃
2
Input Offset Voltage*8
Vio
Full range
Input Offset Voltage drift
Input Offset Current*8
Input Offset Current drift
Input Bias Current*8
△Vio/△T
Iio
ΔIio/ΔT
Ib
Supply Current
ICC
High Level Output Voltage
VOH
Low Level Output Voltage
VOL
Large Signal Voltage Gain
AV
Vicm
-
-
±7
Max.
7
10
-
25℃
-
2
50
Full range
-
-
200
-
-
±10
-
25℃
-
20
250
Full range
-
-
250
Unit
Conditions
VOUT=1.4V
mV
VCC=5 to 30V, VOUT=1.4V
μV/℃ VOUT=1.4V
nA
VOUT=1.4V
pA/℃ VOUT=1.4V
nA
VOUT=1.4V
mA
RL=∞, All Op-Amps
25℃
-
0.7
1.2
Full range
-
-
2
25℃
3.5
-
-
Full range
27
28
-
Full range
-
5
20
mV
25℃
25
100
25℃
0
-
dB
VCC=5 to 30V
mA
VIN+=1V, VIN-=0V
VOUT=0V, 1CH is short circuit
mA
VIN+=0V,VIN-=1V
VOUT=5V, 1CH is short circuit
RL=2kΩ
V
VCC=30V, RL=10kΩ
RL=∞, All Op-Amps
RL≧2kΩ, VCC=15V
V/mV
VOUT=1.4 to 11.4V
(VCC-VEE)=5V
VCC-1.5
V
VOUT=VEE+1.4V
dB VOUT=1.4V
-
Input Common-mode
Voltage range
Common-mode Rejection Ratio
CMRR
25℃
50
80
Power Supply Rejection Ratio
PSRR
25℃
65
100
-
25℃
20
30
-
Full range
10
-
-
25℃
10
20
-
Full range
2
-
-
Isink
25℃
12
40
-
μA
Channel Separation
CS
25℃
-
120
-
dB
Slew Rate
SR
25℃
-
0.2
-
V/μs
GBW
25℃
-
0.5
-
MHz
Vn
25℃
-
40
-
nV/ Hz
Output Source Current*9
*9
IOH
IOL
Output Sink Current
Gain bandwidth product
Input Referred Noise Voltage
*8
*9
VIN+=0V, VIN-=1V
VOUT=200mV
f=1kHz, input referred
VCC=15V, AV=0dB
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
CL=100pF
VCC=15V, VEE=-15V
RS=100Ω, Vi=0V, f=1kHz
Absolute value
Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Electrical Characteristics
○BA2902Yxx-M (Unless otherwise specified VCC=+5V, VEE=0V)
Temperature
Parameter
Symbol
Range
Min.
25℃
Input Offset Voltage*10
Vio
Full range
Input Offset Voltage drift
Input Offset Current*10
Input Offset Current drift
Input Bias Current*10
△Vio/△T
Iio
ΔIio/ΔT
Ib
Supply Current
ICC
High Level Output Voltage
VOH
Low Level Output Voltage
VOL
Large Signal Voltage Gain
AV
Vicm
-
Limits
Typ.
2
Max.
7
-
10
-
±7
-
25℃
-
2
50
Full range
-
-
200
-
-
±10
-
25℃
-
20
250
Full range
-
-
250
Unit
Conditions
VOUT=1.4V
mV
VCC=5 to 30V, VOUT=1.4V
μV/℃ VOUT=1.4V
nA
VOUT=1.4V
pA/℃ VOUT=1.4V
nA
VOUT=1.4V
mA
RL=∞, All Op-Amps
25℃
-
0.7
2
Full range
-
-
3
25℃
3.5
-
-
Full range
27
28
-
Full range
-
5
20
mV
25℃
25
100
25℃
0
-
dB
VCC=5 to 30V
mA
VIN+=1V, VIN-=0V
VOUT=0V, 1CH is short circuit
mA
VIN+=0V,VIN-=1V
VOUT=5V, 1CH is short circuit
RL=2kΩ
V
VCC=30V, RL=10kΩ
RL=∞, All Op-Amps
RL≧2kΩ, VCC=15V
V/mV
VOUT=1.4 to 11.4V
(VCC-VEE)=5V
VCC-1.5
V
VOUT=VEE+1.4V
dB VOUT=1.4V
-
Input Common-mode
Voltage range
Common-mode Rejection Ratio
CMRR
25℃
50
80
Power Supply Rejection Ratio
PSRR
25℃
65
100
-
25℃
20
30
-
Full range
10
-
-
25℃
10
20
-
Full range
2
-
-
Isink
25℃
12
40
-
μA
Channel Separation
CS
25℃
-
120
-
dB
Slew Rate
SR
25℃
-
0.2
-
V/μs
GBW
25℃
-
0.5
-
MHz
Vn
25℃
-
40
-
nV/ Hz
Output Source Current*11
*11
IOH
IOL
Output Sink Current
Gain bandwidth product
Input Referred Noise Voltage
*10
*11
VIN+=0V, VIN-=1V
VOUT=200mV
f=1kHz, input referred
VCC=15V, AV=0dB
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
CL=100pF
VCC=15V, VEE=-15V
RS=100Ω, Vi=0V, f=1kHz
Absolute value
Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms
Please note that item names, symbols and their meanings may differ from those on another manufacturer’s documents.
1. Absolute maximum ratings
The absolute maximum ratings are values that should never be exceeded, since doing so may result in deterioration of
electrical characteristics or damage to the part itself as well as peripheral components.
1.1 Power supply voltage (VCC-VEE)
Expresses the maximum voltage that can be supplied between the positive and negative supply terminals without
causing deterioration of the electrical characteristics or destruction of the internal circuitry.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without
damaging the IC.
1.3 Input common-mode voltage range (Vicm)
Signifies the maximum voltage that can be supplied to non-inverting and inverting terminals without causing
deterioration of the characteristics or damage to the IC itself. Normal operation is not guaranteed within the
common-mode voltage range of the maximum ratings - use within the input common-mode voltage range of the
electric characteristics instead.
1.4 Operating and storage temperature ranges (Topr,Tstg)
The operating temperature range indicates the temperature range within which the IC can operate. The higher the
ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range
of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics.
1.5 Power dissipation (Pd)
Indicates the power that can be consumed by a particular mounted board at ambient temperature (25℃). For
packaged products, Pd is determined by the maximum junction temperature and the thermal resistance.
2. Electrical characteristics
2.1 Input offset voltage (Vio)
Indicates the voltage difference between the non-inverting and inverting terminals. It can be thought of as the input
voltage difference required for setting the output voltage to 0 V.
2.2 Input offset voltage drift (△Vio/△T)
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.
2.3 Input offset current (Iio)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
2.4 Input offset current drift (△Iio/△T)
Signifies the ratio of the input offset current fluctuation to the ambient temperature fluctuation.
2.5 Input bias current (Ib)
Indicates the current that flows into or out of the input terminal, it is defined by the average of the input bias current
at the non-inverting terminal and the input bias current at the inverting terminal.
2.6 Circuit current (ICC)
Indicates the current of the IC itself that flows under specified conditions and during no-load steady state.
2.7 High level output voltage/low level output voltage (VOH/VOL)
Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into
high-level output voltage and low-level output voltage. High-level output voltage indicates the upper limit of output
voltage. Low-level output voltage indicates the lower limit.
2.8 Large signal voltage gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage fluctuation) / (Input offset fluctuation)
2.9 Input common-mode voltage range (Vicm)
Indicates the input voltage range under which the IC operates normally.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
2.10 Common-mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the
fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.11 Power supply rejection ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of
DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation)
2.12 Output source current/ output sink current (IOH/IOL)
The maximum current that can be output under specific output conditions, it is divided into output source current and
output sink current. The output source current indicates the current flowing out of the IC, and the output sink current
the current flowing into the IC.
2.13 Channel separation (CS)
Indicates the fluctuation of output voltage with reference to the change of output voltage of driven channel.
2.14 Slew rate (SR)
SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variable output voltage
as unit time.
2.15 Gain Band Width (GBW)
Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave.
2.16 Input referred noise voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Typical Performance Curves
○BA2904Yxxx-M
1.0
800
SUPPLY CURRENT [mA]
POWER DISSIPATION [mW]
1000
BA2904YF-M
BA2904YFV-M
600
BA2904YFVM-M
400
200
0.8
0.6
25℃
－40℃
0.4
125℃
0.2
0.0
0
0
25
50
75
100
125
0
150
10
20
30
40
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.3
Supply Current – Supply Voltage
.
Fig.2
Derating Curve
MAXIMUM OUTPUT VOLTAGE [V]
SUPPLY CURRENT [mA]
1.0
0.8
0.6
32V
0.4
5V
3V
0.2
0.0
-50 -25
0
25
50
75
40
30
-40℃
20
125℃
25℃
10
0
100 125 150
AMBIENT TEMPERATURE [℃]
20
30
40
Fig.5
Maximum Output Voltage – Supply Voltage
(RL=10kΩ)
typical sample, it is not guaranteed.
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SUPPLY VOLTAGE [V]
Fig.4
Supply Current – Ambient Temperature
(*)The above data is measurement value of
0
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
5
OUTPUT SOURCE CURRENT [mA]
MAXIMUM OUTPUT VOLTAGE [V]
.
○BA2904Yxxx-M
4
3
2
1
0
-50 -25
0
25
50
50
-40℃
40
25℃
30
20
125℃
10
0
75 100 125 150
0
AMBIENT TEMPERATURE [℃]
2
3
4
5
OUTPUT VOLTAGE [V]
Fig.6
Maximum Output Voltage – Ambient Temperature
(VCC=5V, RL=2kΩ)
Fig.7
Output Source Current – Output Voltage
(VCC=5V)
100
50
OUTPUT SINK CURRENT [mA]
OUTPUT SOURCE CURRENT [mA]
1
40
3V
5V
30
15V
20
10
10
125℃
1
-40℃
0.1
25℃
0.01
0.001
0
-50 -25
0
25
50
75
0
100 125 150
1.2
1.6
2
Fig.9
Output Sink Current – Output Voltage
(VCC=5V)
Fig.8
Output Source Current – Ambient Temperature
(VOUT=0V)
typical sample, it is not guaranteed.
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TSZ22111･15･001
0.8
OUTPUT VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
0.4
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2904Yxxx-M
LOW-LEVEL SINK CURRENT [μA]
OUTPUT SINK CURRENT [mA]
30
15V
20
5V
3V
10
0
-50 -25
0
25
50
75
80
70
-40℃
25℃
60
50
40
125℃
30
20
10
0
100 125 150
0
5
AMBIENT TEMPERATURE [℃]
15
20
25
30
35
SUPPLY VOLTAGE [V]
Fig.11
Low Level Sink Current – Supply Voltage
(VOUT=0.2V)
Fig.10
Output Sink Current – Ambient Temperature
(VOUT=VCC)
8
80
70
INPUT OFFSET VOLTAGE [mV]
LOW-LEVEL SINK CURRENT [μA]
10
32V
60
5V
50
40
3V
30
20
10
6
4
-40℃
25℃
2
0
125℃
-2
-4
-6
-8
0
-50 -25
0
25
50
75
0
100 125 150
Fig.12
Low Level Sink Current – Ambient Temperature
(VOUT=0.2V)
15
20
25
30
35
Fig.13
Input Offset Voltage – Supply Voltage
(Vicm=0V, VOUT=1.4V)
typical sample, it is not guaranteed.
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TSZ22111･15･001
10
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
5
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2904Yxxx-M
50
6
INPUT BIAS CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
8
4
2
3V
0
5V
32V
-2
-4
-6
40
30
25℃
-40℃
20
10
125℃
0
-8
-50 -25
0
25
50
75
0
100 125 150
5
15
20
25
30
35
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.15
Input Bias Current – Supply Voltage
(Vicm=0V, VOUT=1.4V)
Fig.14
Input Offset Voltage – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
50
INPUT BIAS CURRENT [nA]
50
INPUT BIAS CURRENT [nA]
10
40
30
32V
20
3V
5V
10
40
30
20
10
0
-10
0
-50 -25
0
25
50
75
100 125 150
25
50
75
100 125 150
Fig.17
Input Bias Current – Ambient Temperature
(VCC=30V, Vicm=28V, VOUT=1.4V)
Fig.16
Input Bias Current – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
typical sample, it is not guaranteed.
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0
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
-50 -25
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Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2904Yxxx-M
10
INPUT OFFSET CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
8
6
-40℃
4
125℃
25℃
2
0
-2
-4
-6
-8
5
-40℃
0
125℃
-5
-10
-1
0
1
2
3
4
5
0
5
10
20
25
30
35
Fig.19
Input Offset Current – Supply Voltage
(Vicm=0V, VOUT=1.4V)
Fig.18
Input Offset Voltage – Input Voltage
(VCC=5V)
LARGE SIGNAL VOLTAGE GAIN
[dB]
10
5
3V
0
5V
15
SUPPLY VOLTAGE [V]
INPUT VOLTAGE [V]
INPUT OFFSET CURRENT [nA]
25℃
32V
-5
140
130
-40℃
120
25℃
110
100
125℃
90
80
70
60
-10
-50 -25
0
25
50
75
100 125 150
8
10
12
14
16
Fig.21
Large Signal Voltage Gain – Supply Voltage
(RL=2kΩ)
Fig.20
Input Offset Current – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
typical sample, it is not guaranteed.
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TSZ22111･15･001
6
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
4
12/26
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2904Yxxx-M
140
COMMON MODE REJECTION RATIO
[dB]
LARGE SIGNAL VOLTAGE GAIN
[dB]
140
130
120
15V
120
110
-40℃
100
5V
100
90
80
70
60
-50 -25
0
25
50
75 100 125 150
125℃
80
60
40
0
10
AMBIENT TEMPERATURE [℃]
100
5V
3V
60
40
-50 -25
0
25
50
75
100 125 150
POWER SUPPLY REJECTION RATIO
[dB]
32V
80
AMBIENT TEMPERATURE [℃]
140
130
120
110
100
90
80
70
60
-50 -25
0
25
50
75
100 125 150
Fig.25
Power Supply Rejection Ratio
– Ambient Temperature
typical sample, it is not guaranteed.
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TSZ22111･15･001
40
AMBIENT TEMPERATURE [℃]
Fig.24
Common Mode Rejection Ratio
– Ambient Temperature
(*)The above data is measurement value of
30
Fig.23
Common Mode Rejection Ratio
– Supply Voltage
140
120
20
SUPPLY VOLTAGE [V]
Fig.22
Large Signal Voltage Gain – Ambient Temperature
(RL=2kΩ)
COMMON MODE REJECTION RATIO
[dB]
25℃
13/26
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2902Yxxx-M
2.0
SUPPLY CURRENT [mA]
POWER DISSIPATION [mW]
1000
800
BA2902YF-M
BA2902YFV-M
600
400
200
1.6
1.2
25℃
－40℃
0.8
125℃
0.4
0.0
0
0
25
50
75
100
125
150
0
10
20
30
40
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.27
Supply Current – Supply Voltage
.
Fig.26
Derating Curve
MAXIMUM OUTPUT VOLTAGE [V]
SUPPLY CURRENT [mA]
2.0
1.6
1.2
32V
0.8
5V
3V
0.4
0.0
-50
0
50
100
40
30
-40℃
20
125℃
25℃
10
150
Fig.28
Supply Current – Ambient Temperature
10
20
30
40
Fig.29
Maximum Output Voltage – Supply Voltage
(RL=10kΩ)
typical sample, it is not guaranteed.
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TSZ22111･15･001
0
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
0
14/26
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
5
OUTPUT SOURCE CURRENT [mA]
MAXIMUM OUTPUT VOLTAGE [V]
.
○BA2902Yxxx-M
4
3
2
1
0
-50 -25
0
25
50
50
-40℃
40
25℃
30
20
125℃
10
0
75 100 125 150
0
AMBIENT TEMPERATURE [℃]
2
3
4
5
OUTPUT VOLTAGE [V]
Fig.30
Maximum Output Voltage – Ambient Temperature
(VCC=5V, RL=2kΩ)
Fig.31
Output Source Current – Output Voltage
(VCC=5V)
100
50
OUTPUT SINK CURRENT [mA]
OUTPUT SOURCE CURRENT [mA]
1
40
3V
5V
30
15V
20
10
10
125℃
1
-40℃
0.1
25℃
0.01
0.001
0
-50 -25
0
25
50
75
0
100 125 150
1.2
1.6
2
Fig.33
Output Sink Current – Output Voltage
(VCC=5V)
Fig.32
Output Source Current – Ambient Temperature
(VOUT=0V)
typical sample, it is not guaranteed.
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TSZ22111･15･001
0.8
OUTPUT VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
0.4
15/26
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2902Yxxx-M
LOW-LEVEL SINK CURRENT [μA]
OUTPUT SINK CURRENT [mA]
30
15V
20
5V
3V
10
0
-50 -25
0
25
50
75
80
70
-40℃
25℃
60
50
40
125℃
30
20
10
0
100 125 150
0
5
AMBIENT TEMPERATURE [℃]
15
20
25
30
35
SUPPLY VOLTAGE [V]
Fig.35
Low Level Sink Current – Supply Voltage
(VOUT=0.2V)
Fig.34
Output Sink Current – Ambient Temperature
(VOUT=VCC)
8
80
70
INPUT OFFSET VOLTAGE [mV]
LOW-LEVEL SINK CURRENT [μA]
10
32V
60
5V
50
40
3V
30
20
10
6
4
-40℃
25℃
2
0
125℃
-2
-4
-6
-8
0
-50 -25
0
25
50
75
0
100 125 150
Fig.36
Low Level Sink Current – Ambient Temperature
(VOUT=0.2V)
15
20
25
30
35
Fig.37
Input Offset Voltage – Supply Voltage
(Vicm=0V, VOUT=1.4V)
typical sample, it is not guaranteed.
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TSZ22111･15･001
10
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
5
16/26
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2902Yxxx-M
50
6
INPUT BIAS CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
8
4
2
3V
0
5V
32V
-2
-4
-6
40
30
25℃
-40℃
20
10
125℃
0
-8
-50 -25
0
25
50
75
0
100 125 150
5
15
20
25
30
35
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.39
Input Bias Current – Supply Voltage
(Vicm=0V, VOUT=1.4V)
Fig.38
Input Offset Voltage – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
50
INPUT BIAS CURRENT [nA]
50
INPUT BIAS CURRENT [nA]
10
40
30
32V
20
3V
5V
10
40
30
20
10
0
-10
0
-50 -25
0
25
50
75
100 125 150
25
50
75
100 125 150
Fig.41
Input Bias Current – Ambient Temperature
(VCC=30V, Vicm=28V, VOUT=1.4V)
Fig.40
Input Bias Current – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
typical sample, it is not guaranteed.
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TSZ22111･15･001
0
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
-50 -25
17/26
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2902Yxxx-M
10
INPUT OFFSET CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
8
6
-40℃
4
125℃
25℃
2
0
-2
-4
-6
-8
5
-40℃
0
125℃
-5
-10
-1
0
1
2
3
4
5
0
5
10
INPUT VOLTAGE [V]
20
25
30
35
Fig.43
Input Offset Current – Supply Voltage
(Vicm=0V, VOUT=1.4V)
LARGE SIGNAL VOLTAGE GAIN
[dB]
10
5
3V
0
5V
15
SUPPLY VOLTAGE [V]
Fig.42
Input Offset Voltage – Input Voltage
(VCC=5V)
INPUT OFFSET CURRENT [nA]
25℃
32V
-5
140
130
-40℃
120
25℃
110
100
125℃
90
80
70
60
-10
-50 -25
0
25
50
75
100 125 150
8
10
12
14
16
Fig.45
Large Signal Voltage Gain – Supply Voltage
(RL=2kΩ)
Fig.44
Input Offset Current – Ambient Temperature
(Vicm=0V, VOUT=1.4V)
typical sample, it is not guaranteed.
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TSZ22111･15･001
6
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
4
18/26
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
○BA2902Yxxx-M
140
COMMON MODE REJECTION RATIO
[dB]
LARGE SIGNAL VOLTAGE GAIN
[dB]
140
130
120
15V
120
110
-40℃
100
5V
100
90
80
70
60
-50 -25
0
25
50
75 100 125 150
125℃
80
60
40
0
10
AMBIENT TEMPERATURE [℃]
100
5V
3V
60
40
-50 -25
0
25
50
75
100 125 150
POWER SUPPLY REJECTION RATIO
[dB]
32V
80
AMBIENT TEMPERATURE [℃]
140
130
120
110
100
90
80
70
60
-50 -25
0
25
50
75
100 125 150
Fig.49
Power Supply Rejection Ratio
– Ambient Temperature
typical sample, it is not guaranteed.
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TSZ22111･15･001
40
AMBIENT TEMPERATURE [℃]
Fig.48
Common Mode Rejection Ratio
– Ambient Temperature
(*)The above data is measurement value of
30
Fig.47
Common Mode Rejection Ratio
– Supply Voltage
140
120
20
SUPPLY VOLTAGE [V]
Fig.46
Large Signal Voltage Gain – Ambient Temperature
(RL=2kΩ)
COMMON MODE REJECTION RATIO
[dB]
25℃
19/26
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicatesthis heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja℃/W.The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.50(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:
θja = (Tjmax -Ta) / Pd
℃/W
・・・・・ (Ⅰ)
Derating curve in Fig.50(b) indicates power that can be consumed by IC with reference to ambient temperature.Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package,ambient temperature, package
condition, wind velocity, etc even when the same of package is used.
Thermal reduction curve indicates a reference value measured at a specified condition. Fig.50(c) show a derating curve for
an example of BA2904Yxxx-M and BA2902xxY-M.
LSIの 消 費
力 [W]
Power dissipation
of電LSI
Pd (max)
θja = ( Tjmax - Ta) / Pd
Ambient temperature
[ ℃ /W]
θja2 < θja1
P2
Ta [℃]
θ' ja2
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
Chip surface temperature Tj [℃ ]
0
25
50
θ ja1
75
100
125
150
周 囲 温 度 Ta [℃ ]
Ambient temperature
Power dissipation Pd[W]
(b) Derating curve
(a) Thermal resistance
Fig. 50 Thermal resistance and derating
1000
BA2902YFV-M(15)
BA2904YF-M(12)
800
POWER DISSIPATION [mW]
POWER DISSIPATION [mW] .
.
1000
BA2904YFV-M(13)
600
BA2904YFVM-M(14)
400
200
800
600
BA2902YF-M(16)
400
200
0
0
0
25
50
75
100
125
0
150
25
50
75
100
125
150
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
(d) BA2902Yxx-M
(c) BA2904Yxxx-M
(12)
(13)
(14)
(15)
(16)
単位
6.2
5.5
4.8
7.0
4.9
mW/℃
When using the unit above Ta=25℃, subtract the value above per Celsius degree .
Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm(cooper foil area below 3%) is mounted.
Fig. 51 Derating curve
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TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Application Information
Test Circuit1 NULL method
VCC, VEE, EK, Vicm Unit V
Parameter
VF
S1
S2
Input Offset Voltage
VF1
ON
ON
Input Offset Current
VF2
OFF
OFF
VF3
OFF
ON
VF4
ON
OFF
ON
ON
ON
ON
ON
OFF
ON
ON
OFF
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
VF7
Common-mode Rejection Ratio
(Input common-mode Voltage Range)
VF8
VF9
Power Supply Rejection Ratio
VF10
S3
Vcc
VEE
EK
Vicm
calculation
OFF 5 to 30
0
-1.4
0
1
OFF
5
0
-1.4
0
2
OFF
5
0
-1.4
0
3
15
0
-1.4
0
15
0
-11.4
0
5
0
-1.4
0
5
0
-1.4
3.5
5
0
-1.4
0
30
0
-1.4
0
4
5
6
- Calculation 1. Input Offset Voltage (Vio)
| VF1 |
[V]
Vio =
1 + Rf / Rs
0.1μF
2. Input Offset Current (Iio)
| VF2－VF1 |
Rf=50kΩ
[A]
Iio =
Ri ×(1 + Rf / Rs)
500kΩ
3. Input Bias Current (Ib)
SW1
| VF4－VF3 |
[A]
Ib =
ΔEK×(1+Rf /Rs)
|VF5-VF6|
[dB]
ΔVicm×(1+Rf /Rs)
500kΩ
DUT
NULL
SW3
Rs=50Ω
Vicm
1000pF
V
RL
SW2
50kΩ
5. Common-mode Rejection Ration (CMRR)
CMRR = 20×Log
+15V
Ri=10kΩ
Ri=10kΩ
4. Large Signal Voltage Gain (Av)
0.1μF
EK
Rs=50Ω
2×Ri× (1 + Rf / Rs)
Av = 20×Log
VCC
VF
VEE
-15V
[dB]
|VF8-VF7|
6. Power supply rejection ratio (PSRR)
PSRR = 20×Log
ΔVcc×(1+Rf /Rs)
Fig. 52 Test circuit1 (one channel only)
[dB]
|VF10-VF9|
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TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
Test Circuit 2 Switch Condition
SW
1
SW No.
SW
2
SW
3
SW
4
SW
5
SW
6
SW
7
SW
8
SW
9
SW
10
SW
11
SW
12
SW
13
SW
14
Supply Current
OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF
High Level Output Voltage
OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF
Low Level Output Voltage
OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF
Output Source Current
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
Output Sink Current
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
Slew Rate
OFF OFF OFF ON OFF OFF OFF ON
Gain Bandwidth Product
Equivalent Input Noise Voltage
ON
ON
ON OFF OFF OFF
OFF ON OFF OFF ON
ON OFF OFF ON
ON
ON OFF OFF OFF
ON OFF OFF OFF ON
ON OFF OFF OFF OFF ON OFF OFF OFF
Input voltage
VH
VL
Input wave
Output voltage
t
SR＝ΔV/Δt
90%
VH
ΔV
C
VL
10%
Δt
Output wave
t
Fig. 54 Slew Rate Input Waveform
Fig. 53 Test Circuit 2 (each Op-Amp)
Measurement Circuit 3 Amplifier To Amplifier Coupling
VCC
VCC
R1//R2
OTHER
CH
R1//R2
VEE
R1
R2
VIN
VEE
R1
V VOUT1
40dB amplifier
R2
V
=0.5[Vrms]
VOUT2
40dB amplifier
CS＝20×log
100×VOUT1
VOUT2
(R1=1kΩ, R=100kΩ)
Fig. 55 Test Circuit 3
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TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Operational Notes
1) Unused circuits
When there are unused circuits, it is recommended that they are
connected as in Fig.56, setting the non-inverting input terminal to a
potential within the in-phase input voltage range (Vicm).
2) Input voltage
Applying VEE+36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, irrespective of
the supply voltage. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage
is within the common mode input voltage range of the electric
characteristics.
VCC
+
Connect
to Vicm
Vicm
VEE
Fig. 56 The example of
application circuit for unused op-amp
3) Power supply (single / dual)
The op-amp operates when the voltage supplied is between VCC and VEE. Therefore, the single supply op-amp can be
used as a dual supply op-amp as well.
4) Power dissipation (Pd)
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to the rise
in chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation
(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating
curves for more information.
5) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign substances between the outputs, the output
and the power supply, or the output and GND may result in IC destruction.
6) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
7) Radiation
This IC is not designed to withstand radiation.
8) IC handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuation of the electrical
characteristics due to piezo resistance effects.
9) IC operation
The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected
to the middle potential of VCC and VEE, crossover distortion occurs at the changeover between discharging and
charging of the output current. Connecting a resistor between the output terminal and GND, and increasing the bias
current for Class A operation will suppress crossover distortion.
10) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the
power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly
process as well as during transportation and storage.
11) Output capacitor
Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE,
causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation
due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance
less than 0.1μF.
12) Oscillation by output capacitor
Please pay attention to oscillation by output capacitor, designing application of negative feed back loop circuit with these
ICs.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Physical Dimensions Tape and Reel Information
SOP8
<Tape and Reel information>
7
6
5
6.2±0.3
4.4±0.2
0.3MIN
8
+6°
4° −4°
1 2
3
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
S
0.11
0.1
1.27
1pin
0.42±0.1
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SOP14
<Tape and Reel information>
8.7 ± 0.2
(MAX 9.05 include BURR)
8
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
0.3MIN
4.4±0.2
6.2±0.3
14
1
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
7
1.5±0.1
0.15 ± 0.1
0.11
1.27
0.4 ± 0.1
0.1
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SSOP-B8
<Tape and Reel information>
3.0±0.2
(MAX 3.35 include BURR)
0.3MIN
4.4 ± 0.2
6.4 ± 0.3
876 5
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1.15 ± 0.1
1 23 4
0.15±0.1
0.1
S
0.1
0.22±0.10
(0.52)
0.08
M
0.65
1pin
Reel
(Unit : mm)
www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
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Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
SSOP-B14
<Tape and Reel information>
5.0 ± 0.2
8
1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
0.3Min.
4.4 ± 0.2
6.4 ± 0.3
14
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
7
0.10
1.15 ± 0.1
0.15 ± 0.1
0.1
0.65
0.22 ± 0.1
Direction of feed
1pin
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
MSOP8
<Tape and Reel information>
2.8±0.1
4.0±0.2
8 7 6 5
0.6±0.2
+6°
4° −4°
0.29±0.15
2.9±0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1 2 3 4
1PIN MARK
1pin
+0.05
0.145 −0.03
0.475
0.08±0.05
0.75±0.05
0.9MAX
S
+0.05
0.22 −0.04
0.08 S
Direction of feed
0.65
Reel
(Unit : mm)
www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
25/26
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
BA2904Yxxx-M, BA2902Yxx-M
●Marking Diagram
SOP8(TOP VIEW)
SOP14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SSOP-B8(TOP VIEW)
SSOP-B14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Product Name
BA2904Y
BA2902Y
F-M
FV-M
FVM-M
F-M
FV-M
Package Type
SOP8
SSOP-B8
MSOP8
SOP14
SSOP-B14
Marking
04YM
04YM
04YM
BA2902YFM
02YM
1PIN MARK
www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
26/26
TSZ02201-0RAR1G200510-1-2
26.SEP.2012 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001