3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT5470B-UY 5.2×4.6mm OVAL LED LAMP ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES 5.2×4.6mm OVAL LED LAMP MT5470B-UY Description This yellow lamp is made with AlGaInP/GaP chip and yellow diffused epoxy resin. 5.2 24.0 MIN. 1.5 TYP. 7.8 0.5 MAX. 4.6 2.54±0.1 A K Notes: 1. All dimensions are in mm. 2. Tolerance is ± 0.25mm unless otherwise noted. Description LED Chip Part No. MT5470B-UY Material Emitting Color AlGaInP/GaP Yellow VER.: 01 Lens Color Yellow diffused Date: 2007/07/06 Page: 1/5 5.2×4.6mm OVAL LED LAMP MT5470B-UY Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 130 mW Reverse Voltage VR 5 V D.C. Forward Current If 50 mA Reverse (Leakage) Current Ir 100 μA If(Peak) 200 mA Operating Temperature Range Topr -40 to +95 ℃ Storage Temperature Range Tstg -40 to +100 ℃ Soldering Temperature(1.6mm from body) Tsol Electrostatic discharge ESD Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering : 260℃ for 5 sec. Hand Soldering : 350℃ for 3 sec. 6000 V Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Luminous Intensity IV If=20mA 770 1300 Forward Voltage Vf If=20mA 2.1 Peak Wavelength λp If=20mA 591 Dominant Wavelength λd If=20mA Reverse (Leakage) Current Ir Vr=5V VERTICAL 2θ1/2 If=20mA HORIZONTAL 2θ1/2 If=20mA 70 ∆λ If=20mA 15 584 589 Max. Unit mcd 2.6 V nm 596 nm 100 µA 40 ViewingAngle deg Spectrum Line Halfwidth nm Notes:1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2007/07/06 Page: 2/5 5.2×4.6mm OVAL LED LAMP MT5470B-UY Typical Electrical / Optical Characteristics Curves : Relative Luminous Intensity(mcd) Forward Current IF(mA) 50 40 30 20 10 1.2 1.6 2.0 2.4 2.8 2000 1600 1200 800 400 3.2 0.0 Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE 30.0 FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 100 Forward Current IF(mA) 20.0 10.0 Forward Current (mA) 20° 10° 30° 80 VERTICAL HORIZONTAL R j-pin=240℃/W 40° 60 1.0 40 50° 0.9 60° 0.8 20 70° 80° 90° R j-a=500 ℃/W 0 20 40 60 Temperature (℃) 80 100 0.7 0.5 FORWARD CURRENT VS. AMBIENT TEMPERATURE 0.3 0.1 0.2 0.4 0.6 RADIATION DIAGRAM VER.: 01 Date: 2007/07/06 Page: 3/5 MT5470B-UY 5.2×4.6mm OVAL LED LAMP Specifications for Bin Grading: Iv(mcd) BIN MIN. MAX. S 770 1100 T 1100 1520 U 1520 2130 Specifications for Vf Group: Vf(V) Group MIN. MAX. V1 1.6 1.8 V2 1.8 2.0 V3 2.0 2.2 V4 2.2 2.4 V5 2.4 2.6 *Majority VF bins are highlighted in Yellow. Specifications for Wavelength Group: λD(nm) @20mA Group MIN. MAX. X2 584 587 X3 587 590 X4 590 593 X5 593 596 VER.: 01 Date: 2007/07/06 Page: 4/5 MT5470B-UY 5.2×4.6mm OVAL LED LAMP Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip soldering : Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) Hand soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds. 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same. 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/07/06 Page: 5/5