NL17SZ14 Single Inverter with Schmitt Trigger The NL17SZ14 is a single inverter with Schmitt trigger in three tiny footprint packages. The device performs much as LCX multi−gate products in speed and drive. http://onsemi.com Features • Tiny SOT−353, SOT−553 and SOT−953 Packages Source/Sink 24 mA at 3.0 V Over−Voltage Tolerant Inputs and Outputs Pin For Pin with NC7SZ14 Designed for 1.65 V to 5.5 V VCC Operation Chip Complexity: FET = 20 NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant VCC NC 1 1 IN A GND 2 2 OUT Y GND 4 3 SC−88A (SC−70−5/SOT−353) DF SUFFIX CASE 419A LA M G 5 *Date Code orientation and/or position may vary depending upon manufacturing location. NC OUT Y 3 4 2 M Figure 1. Pinout 1 OUT Y 1 = Specific Device Code = Month Code ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Figure 2. Logic Symbol PIN ASSIGNMENT (SOT−953) (SOT−353/SC70−5/SC−88A/SOT−553) 2M SOT−953 CASE 527AE SOT−953 PIN ASSIGNMENT = Device Code = Date Code* = Pb−Free Package (*Note: Microdot may be in either location) SOT−353/SC70−5/ SC−88A/SOT−553 IN A LA M G G LA MG G SOT−553 XV5 SUFFIX CASE 463B VCC IN A 5 MARKING DIAGRAMS M • • • • • • • Pin FUNCTION TABLE Function Input Output Pin Function 1 IN A A Y 1 NC 2 GND L H 2 IN A 3 NC H L 3 GND 4 OUT Y 4 OUT Y 5 VCC 5 VCC © Semiconductor Components Industries, LLC, 2013 June, 2013 − Rev. 13 1 Publication Order Number: NL17SZ14/D NL17SZ14 MAXIMUM RATINGS Symbol VCC Characteristics DC Supply Voltage Value Units −0.5 to +7.0 V −0.5 ≤ VI ≤ +7.0 V VI DC Input Voltage VO DC Output Voltage Output in High or LOW State (Note 1) (SOT−353/SC70−5/SC−88A/SOT−553 Packages) −0.5 to VCC + 0.5 V VO DC Output Voltage (SOT−953 Package) −0.5 to VCC + 0.5 −0.5 to + 0.5 V IIK DC Input Diode Current VI < GND −50 mA IOK DC Output Diode Current (SOT−353/SC70−5/SC−88A/SOT−553 Packages) VO < GND, VO > VCC ±50 mA IOK DC Output Diode Current (SOT−953 Package) VO < GND −50 mA IO DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C PD Power Dissipation in Still Air SOT−353 SOT−553 186 135 mW qJA Thermal Resistance SOT−353 SOT−553 350 496 °C/W TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature under Bias +150 °C MSL Moisture Sensitivity FR Flammability Rating ESD ESD Classification ILATCHUP Output in High or LOW State (Note 1) Power−Down Mode (VCC = 0 V) Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Class 2 Class C N/A Latchup Performance Above VCC and Below GND at 125°C (Note 5) mA ±100 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage Operating Data Retention Only VI Input Voltage VO Output Voltage (SOT−353/SC70−5/SC−88A/SOT−553 Packages) (High or LOW State) VO Output Voltage (SOT−953 Package) (High or LOW State) TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V http://onsemi.com 2 Min Max Units 1.65 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V 0 VCC V −55 +125 °C 0 0 0 No Limit No Limit No Limit ns/V NL17SZ14 DC ELECTRICAL CHARACTERISTICS Symbol VT) VT* VH VOH VOL IIN Parameter Condition Positive Input Threshold Voltage Negative Input Threshold Voltage Input Hysteresis Voltage High−Level Output Voltage VIN = VIH or VIL Low−Level Output Voltage VIN = VIH or VIL TA = 25°C −555C 3 TA 3 1255C VCC (V) Min Typ Max Min Max Units 1.65 0.6 1.0 1.4 0.6 1.4 V 2.3 1.0 1.5 1.8 1.0 1.8 2.7 1.2 1.7 2.0 1.2 2.0 3.0 1.3 1.9 2.2 1.3 2.2 4.5 1.9 2.7 3.1 1.9 3.1 5.5 2.2 3.3 3.6 2.2 3.6 1.65 0.2 0.5 0.8 0.2 0.8 2.3 0.4 0.75 1.15 0.4 1.15 2.7 0.5 0.87 1.4 0.5 1.4 3.0 0.6 1.0 1.5 0.6 1.5 4.5 1.0 1.5 2.0 1.0 2.0 5.5 1.2 1.9 2.3 1.2 2.3 1.65 0.1 0.48 0.9 0.1 0.9 2.3 0.25 0.75 1.1 0.25 1.1 2.7 0.3 0.83 1.15 0.3 1.15 3.0 0.4 0.93 1.2 0.4 1.2 4.5 0.6 1.2 1.5 0.6 1.5 1.7 0.7 1.7 5.5 0.7 1.4 1.65 to 5.5 VCC − 0.1 VCC VCC − 0.1 IOH = −3 mA 1.65 1.29 1.52 1.29 IOH = *8 mA 2.3 1.9 2.1 1.9 IOH = *12 mA 2.7 2.2 2.4 2.2 IOH = *16 mA 3.0 2.4 2.7 2.4 IOH = *24 mA 3.0 2.3 2.5 2.3 IOH = *32 mA 4.5 3.8 4.0 3.8 IOH = −100 mA V V V V 1.65 to 5.5 0.0 0.1 0.1 IOL = 3 mA 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.2 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 0 to 5.5 ±0.1 ±1.0 mA 0 1 10 mA 5.5 1 10 mA IOL = 100 mA Input Leakage Current VIN = 5.5 V or GND IOFF Power Off Leakage Current (SOT−353/ SC70−5/SC−88A/ SOT−553 Packages) VIN = 5.5 V or VOUT = 5.5 V ICC Quiescent Supply Current VIN = 5.5 V or GND http://onsemi.com 3 NL17SZ14 AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns tPLH tPHL Typ Max Min Max Units RL = 1 MW, CL = 15 pF 1.65 1.8 2.5 ± 0.2 3.3 ± 0.3 5.0 ± 0.5 2.0 2.0 1.0 1.0 0.5 9.1 7.6 5.0 3.7 3.1 15 12.5 9.0 6.3 5.2 2.0 2.0 1.0 1.0 0.5 15.6 13 9.5 6.5 5.5 ns RL = 500 W, CL = 50 pF 3.3 ± 0.3 5.0 ± 0.5 1.5 0.8 4.4 3.7 7.2 5.9 1.5 0.8 7.5 6.2 Condition Propagation Delay (Figure 3 and 4) −555C v TA v 1255C Min Parameter Symbol TA = 255C VCC (V) CAPACITIVE CHARACTERISTICS Symbol Parameter Condition CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC Typical Units u4.0 pF 25 30 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. A or B VCC 50% GND tPLH Y OUTPUT tPHL RL CL INPUT 50% VCC A 1−MHz square input wave is recommended for propagation delay tests. Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Order Number Package Type Tape and Reel Size† NL17SZ14DFT2G SC−88A/SC−70−5/SOT−353 (Pb−Free) 3000 / Tape & Reel NLV17SZ14DFT2G* SC−88A/SC−70−5/SOT−353 (Pb−Free) 3000 / Tape & Reel NL17SZ14XV5T2G SOT−553 (Pb−Free) 4000 / Tape & Reel NL17SZ14P5T5G SOT−953 (Pb−Free) 8000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 4 NL17SZ14 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDER FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ14 PACKAGE DIMENSIONS SOT−553 XV5 SUFFIX CASE 463B ISSUE B D −X− 5 A 4 1 e 2 E −Y− 3 b NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L DIM A b c D E e L HE HE c 5 PL 0.08 (0.003) M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 MIN 0.50 0.17 0.08 1.50 1.10 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.059 0.063 MIN 0.020 0.007 0.003 0.059 0.043 MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 NL17SZ14 PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E X D Y PIN ONE INDICATOR 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A 4 HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 SOLDERING FOOTPRINT* 5X 0.35 5X 0.20 5X L2 5X BOTTOM VIEW b PACKAGE OUTLINE 0.08 X Y 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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